To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. "Standard": 8. 9. 10. 11. 12. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. DATA SHEET MOS INTEGRATED CIRCUIT PD6323 LATCH and DRIVER for FIP COMOS LSI DESCRIPTION The PD6323 is a latch and driver CMOS IC for FIP (Fluorescent Indicator Panel). For multiplex wiring, the PD6323 is supplied with the serial interface circuit, 21 bit shift register, 21 bit data latch and 21 outputs. The serial data transfer from the data source to the PD6323 is accomplished with 3 signals. FEATURES * Direct Connection to Battery enable. * Wide Supply Voltage VDD = 8.0 to 14 (V) * Serial Input 21 bit Shift Register Incorporated. * Data Control by Transmission Clock (External) and Latch. * Suitable for Static Display by Buffer Register. * Brightness Control Enable: External Duty Control. * Output Characteristics Vout = 40 V, Iout = 5.0 mA. * Serial Interface Format: Compatible with NEC microcomputer. * Difference of PD6323C/BC PARAMETER SYMBOL Output Voltage VO0 to VO20 Low Supply Voltage VDD (L) PD6323C PD6323BC -25 V -40 V -- 4 VNote Notes 1. Function Operate ORDERING INFORMATION PART NUMBER PACKAGE PD6323C 28 pin Plastic DIP (400 mil) PD6323BC 28 pin Plastic DIP (400 mil) Document No. S11046EJ3V0DS00 (3rd edition) (Previous No. IC-2289) Date Published December 1995 P Printed in Japan (c) 1988 PD6323 BLOCK DIAGRAM O0 O20 21 BIT FIP DRIVER BI LH P0 P1 P2 P18 P19 P20 21 BIT BUFFER REGISTER SI S0 S1 S2 S18 S19 S20 21 BIT SHIFT REGISTER SCK PIN CONNECTION (Top View) 2 SCK 1 28 VDD BI 2 27 LH O0 3 26 SI O1 4 25 O11 O2 5 24 O12 O3 6 23 O13 O4 7 22 O14 O5 8 21 O15 O6 9 20 O16 O7 10 19 O17 O8 11 18 O18 O9 12 17 O19 O10 13 16 O20 VSS 14 15 SO F/F SO PD6323 FUNCTION PIN No. SYMBOL 1 SCK FUNCTION Serial Clock Input INPUT/OUTPUT INPUT EXPLANATION The SI data are read and stored in the 21 bit shift register at the rising edge of SCK. DATA output from SO at the dropping edge of SCK. BI 2 Blanking Input INPUT When "L" level signal is supplied to the B1, O0 to O20 are active. "H": O0 to O20 are disabled. Dimmer function is possible by external duty control. 3 O0 Segment and Driver for OUTPUT Outputs are, Pch MOS Open Drain. 4 O1 FIP These 11 Outputs are the Outputs of 11 bit output data 5 O2 (O0 to O10) latch, which can drive FIP directly. 6 O3 7 O4 8 O5 9 O6 10 O7 11 O8 12 O9 13 O10 14 VSS GND 15 SO Serial Data Output VDD O0 to O20 VSS Connection to GND. OUTPUT Serial data output at the dropping edge of SCK. In case "n" pieces of PD6323AC are serial connected, so it is possible to connect one to next SI. 16 O20 Segment and driver for 17 O19 FIP These 10 outputs are the Outputs of 10 bit output data 18 O18 (O11 to O20) latch, which can drive FIP directly. 19 O17 20 O16 21 O15 22 O14 23 O13 24 O12 25 O11 26 SI Serial data Input OUTPUT INPUT Outputs are, Pch MOS Open Drain. Serial Data Input. The SI data are read and stored in the 21 bit shift register at the rising edge of SCK. 27 LH Latch and Hold Input INPUT When "H" level signal is supplied to the LH, the data of 21 bit shift register are normally transferred to the 21 bit output data latch. At the time of the rising edge of LH; the data of 21 bit output data latch are held. "L": The data of 21 bit output data latch are protected. 28 VDD Supply Voltage at VDD VDD = 8.0 to 14 (V) terminal * To prevent latch up breakdown, the power should be turned ON in order VDD, logic input. It should be turned OFF in opposite order. This relationship should be followed during transition period as well. 3 PD6323 ABSOLUTE MAXIMUM RATINGS (TA = 25 C) PARAMETER SYMBOL RATINGS UNIT Supply Voltage at VDD terminal VDD 18 V Input Voltage VIN -0.3 to VDD V V Output Voltage (PD6323C) VO0 to VO20 -25Note 1 Output Voltage (PD6323AC/BC) VO0 to VO20 -40Note 1 V Output Current IO0 to IO20 -5.0 mA Operating Temperature TA -40 to +85 C Storage Temperature Tstg -55 to +125 C Notes 1. These Voltages are referenced to the VDD. RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL TA -40 Operating Supply Voltage VDD 8.0 Output Voltage (PD6323C)Note 2 VO0 to VO20 (PD6323AC/BC)Note 2 TYP. -19 MAX. UNIT +85 C 14 V -24 V VO0 to VO20 -19 -35 V Output Current IO0 to IO20 -2.0 -5.0 mA Input Voltage High VIH 3.5 VDD V Input Voltage Low VIL VSS 1.0 V SCK Frequency fSCK 500 KHz SCK Cycle TimeNote 3 tKCY 2.0 s WidthNote 3 tKHW 0.9 s SCK Low Level Pulse WidthNote 3 tKLW 0.9 s SI Setup Time to SCK Output Voltage SCK High Level Pulse tSIK 0.4 s SI Hold TimeNote 3 tKSI 0.4 s SCK LH Valid tCLL 1.8 s tLHW 1.89 s tBHW 0.4 s Note 3 TimeNote 4 LH High Level Pulse WidthNote 4 BI High Level Pulse WidthNote 5 Notes 2. These Voltages are referenced to the VDD. 3. See Fig. 1. 4. See Fig. 2. 5. See Fig. 3. 4 MIN. Operating Temperature PD6323 ELECTRICAL CHARACTERISTICS (Recommended operating conditions) PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS 10 A VDD V ISOH = -1.0 mA VSS 0.5 V ISOL = 1.0 mA VDD - 1.5 VDD V IO = -5.0 mA Input Leakage Current IIL SO Output Voltage High VSOH SO Output Voltage Low VSOL Output Voltage High VO Output Leakage Current IOLL 10 A VDD to VO = 40 V Supply Current at VDD Terminal IDD 2.0 mA All Input = [High] Supply Voltage at VDD Terminal to VDD(H) VDD - 1.0 VIN = VSS or VIN = VDD O0 to O20 Output O0 to O20 Output All Output = Open V 3.0 Keep DATA DATA (MIN.) Input Capacitance CIN 15 pF tKSO 0.5 s BI Qn Valid TimeNote 5 tBKO 1.8 s Low Supply Voltage (PD6323BC) VDD(L) SCK SO Valid Drop VDD on latch TimeNote 6 4.0 V f = 1.0 MHz Function Operate Notes 6. See Fig. 4. 5 PD6323 SWITCHING CHARACTERISTICS Fig. 1 tKCY tKLW VDD VIH MIN. SCK VIL MAX. VSS tKHW tSIK tKSI VDD SI VSS Fig. 2 VDD VIH MIN. SCK VSS tLHW VDD VIH MIN. LH VIL MAX. VSS tCLL Fig. 3 VDD VIH MIN. BI VIL MAX. VSS tBHW VDD VOH MIN. On (n = 0 to 20) VOL MAX. VSS tBKQ tBKQ Fig. 4 VDD SCK VIL MAX. VSS tKSO VDD VIH MIN. SO VIL MAX. VSS 6 TIMING CHART SCK SI 0 1 20 21 n tCLL tSIK tKSI LH tLHW tKCY 0 SO n - 21 tKSO Latch O0 to O20 Through PD6323 7 PD6323 APPLICATION CIRCUIT (1) AUTOMOTIVE DASHBOARD SYSTEM SYSTEM CONSTRUCTION MICRO COMPUTER 1 A/D CONVERTER 1 FAILSAFE IC 1 REGULATOR 1 DC-DC CONVERTER 2 to 3 4 PD6323 Temperature H ( PD6323) Engine speed SO 8 O20 BI 7 ( PD6323) 6 SO O20 O19 LH Speedmeter O0 BI O0 4 Mile/h LH O9 F 5 SCK SI km/h C O10 filter SO SCK BI 3 O20 SI 2 O0 - O4 O5 - O11 O12 - O18 O19 - O20 LH SI SO SCK LH SCK SI ( PD6323) E 1 O0 BI 0 ( PD6323) Fuel LH1 LH2 LH3 BI1 BI2 SCK PD7500 series SO Engine speed Temperature BI3 PD7001C A/D CONVERTER Speed 87AD series FAIL SAFE IC REGULATOR Each data of Engine speed, speed, temperature and fuel is divided to each group by LH control. Each data is transferred by SI and SCK control. FIP dimmer control is capable by BI's duty control. 8 x 1000 r.p.m. Fuel PD6323 (2) 12 V FIP DRIVER CIRCUIT 8.0 to 14 V BATTERY VOLTAGE RG C GRID SI RBI REGULATER 5V VDD SENSOR (A/D CONVERTER) 1 chip CPU S E G F U I M P E N T SO O0 BI LH SI SCK O20 RF VSS RL FILAMENT ( PD6323) (3) HIGH VOLTAGE (18 to 35 V) FIP DRIVER CIRCUIT VDD 12 V VDD GRID S E G F U I M P E N T O0 O20 FILAMENT VSS ( PD6323BC) -6.0 to -23 V -6.0 to -23 V 9 PD6323 (4) LED DRIVER CIRCUIT 8.0 to 14 V VDD 1SS53 2SA733 O20 390 4.3 k VSS LED (Cathode common) LED (Anode common) ( PD6323) 8.0 to 14 V VDD 4.3 k 390 O20 2SC945 51 k VSS ( PD6323) 10 PD6323 (5) EXAMPLE OF SOFTWARE Using of serial I/O of -COM 75 series START Subroutine of 24 bit data transfer SI OUT : ANP 6, 7 LHLI 05H HL- LOOP : LAM LH = 0 HL 05H TAMSIO Loop SIO SKI 2 JCP $-2 ACC (HL) HL HL - 1 DLS JCP LOOP ORP 6, 8 ANP 6, 7 RT RAM SIO7 - 4 ACC SIO3 - 0 (HL) START SIO TRANSFER BIT (ADD) 3 2 1 0 00H O3 O2 O1 O0 01H O7 O6 O5 O4 02H O11 O10 O9 O8 03H O15 O14 O13 O12 04H O19 O18 O17 O16 05H O23 O22 O21 O20 INTS RQF = 1 N Y LL-1 L = 0FH Y N Allot port P63 - LH LH = 1 LH = 0 RETURN 11 PD6323 PACKAGE DIMENSION PD6323C/BC 28PIN PLASTIC DIP (400 mil) 28 15 1 14 A K L P I J H F D G C N M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. M R B ITEM MILLIMETERS INCHES A B 35.56 MAX. 1.27 MAX. 1.400 MAX. 0.050 MAX. C 2.54 (T.P.) 0.100 (T.P.) D 0.500.10 0.020 +0.004 -0.005 F 1.1 MIN. 0.043 MIN. G H 3.50.3 0.51 MIN. 0.1380.012 0.020 MIN. I J 4.31 MAX. 5.72 MAX. 0.170 MAX. 0.226 MAX. K 10.16 (T.P.) 0.400 (T.P.) L 8.6 0.339 M 0.25 +0.10 -0.05 0.010 +0.004 -0.003 N 0.25 0.01 P 0.9 MIN. 0.035 MIN. R 0~15 0~15 P28C-100-400-1 12 PD6323 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF THROUGH HOLE MOUNT DEVICE PD6323C/BC Soldering process Wave soldering Soldering conditions Symbol Solder temperature: 260 C or below, Flow time: 10 seconds or below Reference "Quality Grades On NEC Semiconductor Devices" (IEI-1209) "NEC Semiconductor Device Reliability/Quality Controls" (IEI-1206) "Semiconductor Device Mounting Technology Manual" (IEI-1207) 13 PD6323 [MEMO] The application circuits and their parameters are for references only and are not intended for use in actual design-in's. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11