Datasheet Power Supply Selector Switch IC for SD Cards BD2204GUL General Description Key Specifications BD2204GUL is high side switch IC that has built-in 2 circuits of MOSFET. Switch has achieved 120m(Typ) on-resistance. 3.3V power supply and 1.8V power supply for memory card can be selected by SEL terminal. Moreover, it has built-in simultaneous-on prevention function at power switching, reverse-current protection function to prevent reverse-current from output terminal to input terminal at power-off, and discharge circuit to discharge electricity in output terminal. Input voltage range: ON resistance: Operating current: Standby current: Operating temperature range: Package VIN1=2.7 to 4.5V VIN2=1.2 to 2.4V 120m(Typ) 25A(Typ) 0.01A(Typ) -40 to +85 C W(Typ) x D(Typ) x H(Max) 1.50mm x 1.00mm x 0.55mm VCSP50L1 Features Dual channel of low on resistance (Typ = 120m) N-channel MOSFET built in. 3.3V and 1.8V are chosen and an output is possible. 0.5A Continuous Current load. Reverse-current protection when power switch off. Prevent VIN1 and VIN2 from simultaneous-on. Output Discharge Circuit Thermal Shutdown Active-High Control Logic VCSP50L1 package VCSP50L1 Applications Digital cameras Digital video camera SD cards slot Typical Application Circuit 3.3V VIN1 LOAD VOUT 0.1F CL 1.8V VIN2 EN GND SEL Figure 1. Typical application circuit Product structure : Silicon monolithic integrated circuit .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 This product has no designed protection against radioactive rays 1/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Block Diagram VIN1 EN LOGIC SEL VOUT Charge Pump EN VIN2 TSD GND + - Figure 2. Block Diagram Pin Configuration A B B A 1 2 3 1 Top View 2 3 Bottom View Figure 3. Pin Configuration Pin Description Pin No. Symbol I/O A1 VIN1 I Switch1 input and supply voltage for IC Pin function A2 VIN2 I Switch2 input A3 EN I Active-high enable input with pull-down resistance (Typ 700k) B1 VOUT O Switch output B2 GND - B3 SEL I Ground Output selector input with pull-down resistance (Typ 700k) As SEL=L, VOUT=3.3V output, as SEL=H, VOUT=1.8V output Absolute Maximum Ratings (Ta = 25C) Parameter Symbol Ratings Unit Switch1 input voltage VIN1 -0.3 to 6.0 V Switch2 input voltage VIN2 -0.3 to 6.0 V EN voltage VEN -0.3 to 6.0 V SEL voltage VSEL -0.3 to 6.0 V VOUT voltage VOUT -0.3 to 6.0 V Output current IOUT Storage temperature TSTG Power dissipation Pd 1.0 -55 to A 150 0.57 (Note 1) C W (Note 1) In the case of exceeding Ta > 25C, 4.6mW should be reduced per 1C (Mount on 50mm x 58mm x 1.75mm Glass Epoxy Board) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Recommended Operating Conditions (Ta= -40C to +85C) Parameter Symbol Ratings Typ 3.3 Max 4.5 Unit Switch1 input voltage VIN1 Min 2.7 Switch2 input voltage VIN2 1.2 1.8 2.4 V Output current IOUT - - 0.5 A V Electrical Characteristics (VIN1= 3.3V, VIN2= 1.8V, Ta= 25C, unless otherwise specified.) Limits Parameter Symbol Min Typ Max Unit Condition Operating current1 IDD1 - 30 45 A Operating current2 IDD2 - 35 52.5 A ISTB VENH VSELH VENL VSELL IENH ISELH IENL ISELL - 0.01 1 A VEN = 1.2V, VSEL = 0V VOUT = OPEN VEN = VSEL = 1.2V VOUT = OPEN VEN = 0V, VOUT = OPEN 1.2 - - V High input - - 0.4 V Low input 2.3 4.7 11.0 A VEN = VSEL = 3.3V with pull-down resistance -1.0 - 1.0 A VEN = VSEL = 0V Standby current EN, SEL input voltage EN, SEL input H current EN, SEL input L current Pull-down resistance Rpd 300 700 1400 k On-resistance1 RON1 - 120 200 *2 m EN and SEL PIN pull-down resistance IOUT = 500mA *2 m IOUT = 500mA VEN = 0V, VOUT = 0V SEL = L, RL = 10 VOUT : 10% 90% SEL = L, RL = 10 VOUT : 90% 10% EN = SEL = L, CL = 1F VOUT : 90% 10% SEL = H, RL = 10 VOUT : 10% 90% SEL = H, RL = 10 VOUT : 90% 10% EN = L, SEL = H, CL = 1F VOUT : 90% 10% IOUT = -1mA, VEN = 0V On-resistance2 RON2 - 120 200 Switch leakage current ILEAK - 0.01 1 A Output rise time1 TON1 - 60 300 s Output fall time1 TOFF1 - 0.1 1 s Output fall time1DISC TOFF1D - 300 1000 s Output rise time2 TON2 - 30 150 s Output fall time2 TOFF2 - 0.1 1 s Output fall time2DISC TOFF2D - 220 1000 s Discharge on-resistance RDISC - 80 150 Discharge current IDISC - 10 15 mA Voutdrop1 - - 0.4 V Voutdrop2 - - 0.4 V VOUT drop voltage*3 *2 VOUT = 3.3V, VEN = 0V CL = 15F, IOUT = 500mA VOUT = VIN1VIN2 CL = 15F, IOUT = 500mA VOUT = VIN2VIN1 Not 100% tested at the time of shipment. .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL *3 When the switch changes from VIN1 to VIN2 or from VIN2 to VIN1, it is possible that VOUT voltage drops. Dropped voltage of VOUT is specified as Voutdrop1 and Voutdrop2. That voltage drop is caused by the function which prevents VIN1 and VIN2 from turning on simultaneously. This function generates the period which both VIN1and VIN2 are turned off, and prevents the penetration current between VIN1 and VIN2. VOUT=VIN2VIN1 VOUT VOUT=VIN1VIN2 VIN(3.3V) VIN(3.3V) Min. 1.4V Min. 1.4V VIN2(1.8V) VIN2(1.8V) Voutdrop1 Voutdrop2 OUT1 (Internal Signal) OUT2 (Internal Signal) TD2 TD1 TCOMP Figure 4. VOUTIdrop voltage *TD1 and TD2 + TCOMP are period of Simultaneous-Off. *TCOMP is period of VOUT becoming same voltage as VIN2. *The value of Min. is in condition of IOUT=500mA and CL=15uF. Measurement Circuit VIN1 VIN1 A VIN2 VIN1 VIN1 VOUT VOUT CIN VIN2 RL A VEN VIN2 GND EN SEL VEN Operating current, Standby current EN SEL VSEL VIN1 VIN1 VEN GND EN, SEL input voltage, Output rise, fall time VIN1 VIN2 VIN2 CL VOUT VIN1 CIN VIN2 CL VIN2 GND EN SEL VSEL VEN On-resistance, VOUT drop voltage VOUT CIN 1mA VIN2 GND EN SEL Discharge resistance Figure 5. Measurement circuit .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 4/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Performance Curves 100 100 VIN1=3.3V VIN2=1.8V OPERATING CURENT : IDD1[A] OPERATING CURRENT : IDD1[A] Ta=25C 80 60 40 20 3 4 60 40 20 0 -50 0 2 80 5 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 7. Operating current1 EN Enable SUPPLY VOLTAGE : VIN1[V] Figure 6. Operating current1 EN Enable 100 100 VIN1=3.3V VIN2=1.8V OPERATING CURENT : IDD2[A] Ta=25C OPERATING CURRENT : IDD2[A] 0 80 60 40 20 3 4 5 40 20 0 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 9. Operating current2 EN Enable SUPPLY VOLTAGE : VIN1[V] Figure 8. Operating current2 EN Enable .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 60 0 -50 0 2 80 5/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Performance Curves - continued 1.0 1.0 VIN1=3.3V VIN2=1.8V STANDBY CURENT : ISTB[A] STANDBY CURRENT : ISTB[A] Ta=25C 0.8 0.6 0.4 0.2 0.0 0.8 0.6 0.4 0.2 0.0 2 3 4 5 -50 SUPPLY VOLTAGE : VIN1[V] Figure 10. Standby current 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 11. Standby current 1.0 1.0 Ta=25C Low to High Low to High 0.8 ENABLE INPUT VOLTAGE : VEN, VSEL[V] ENABLE INPUT VOLTAGE : VEN, VSEL[V] 0 High to Low 0.6 0.4 0.2 0.8 High to Low 0.6 0.4 0.2 VIN1=3.3V VIN2=1.8V 0.0 0.0 2 3 4 -50 5 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 13. EN, SEL input voltage SUPPLY VOLTAGE : VIN1[V] Figure 12. EN, SEL input voltage .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 0 6/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Performance Curves - continued 200 200 VIN1=3.3V VIN2=1.8V ON RESISTANCE : RON1[m] ON RESISTANCE : RON1[m] Ta=25C 150 100 50 0 150 100 50 0 2 3 4 5 -50 SUPPLY VOLTAGE : VIN1[V] Figure 14. On-resistance1 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 15. On-resistance1 200 200 Ta=25C VIN1=3.3V VIN2=1.8V ON RESISTANCE : RON2[m] ON RESISTANCE : RON2[m] 0 150 100 50 150 100 50 0 0 2 3 4 -50 5 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 17. On-resistance2 SUPPLY VOLTAGE : VIN1[V] Figure 16. On-resistance2 .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 0 7/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Performance Curves - continued 100 100 RL=10 80 60 40 20 0 2 3 4 80 60 40 20 0 -50 5 SUPPLY VOLTAGE : VIN1[V] Figure 18. Output rise time1 0 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 19. Output rise time1 300 300 RL=10 250 200 150 100 50 3 4 5 200 150 100 50 0 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 21. Output fall time1 SUPPLY VOLTAGE : VIN1[V] Figure 20. Output fall time1 .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 250 0 -50 0 2 RL=10 VIN1=3.3V Vin2=1.8V OUTPUT FALL TIME : TOFF1[ns] Ta=25C OUTPUT FALL TIME : TOFF1[ns] RL=10 VIN1=3.3V VIN2=1.8V OUTPUT RISE TIME : TON1[s] OUTPUT RISE TIME : TON1[s] Ta=25C 8/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Performance Curves - continued 500 500 400 300 200 100 2 3 4 400 300 200 100 0 -50 0 5 0 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 23. Output fall time1 DISC SUPPLY VOLTAGE : VIN1[V] Figure 22. Output fall time1DISC 100 100 RL=10 OUTPUT RISE TIME : TON2[s] 80 60 40 20 0 2 3 4 80 60 40 20 0 -50 5 SUPPLY VOLTAGE : VIN1[V] Figure 24. Output rise time2 .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 RL=10 VIN1=3.3V VIN2=1.8V Ta=25C OUTPUT RISE TIME : TON2[s] CL=1F VIN1=3.3V VIN2=1.8V CL=1F OUTPUT FALL TIME : TOFF1D[s] OUTPUT FALL TIME : TOFF1D[s] Ta=25C 0 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 25. Output rise time2 9/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Performance Curves - continued 300 300 RL=10 250 200 150 100 50 3 4 250 200 150 100 50 0 -50 0 2 5 OUTPUT FALL TIME : TOFF2D[s] OUTPUT FALL TIME : TOFF2D[s] Ta=25C 400 300 200 100 0 3 4 100 CL=1F VIN1=3.3V VIN2=1.8V 400 300 200 100 0 -50 5 SUPPLY VOLTAGE : VIN1[V] Figure 28. Output fall time2 DISC .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 50 500 CL=1F 2 0 AMBIENT TEMPERATURE : Ta[C] Figure 27. Output fall time2 SUPPLY VOLTAGE : VIN1[V] Figure 26. Output fall time2 500 RL=10 VIN1=3.3V VIN2=1.8V OUTPUT FALL TIME : TOFF2[ns] OUTPUT FALL TIME : TOFF2[ns] Ta=25C 0 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 29. Output fall time2 DISC 10/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Performance Curves - continued 200 200 VIN1=3.3V VIN2=1.8V DISC ON RESISTANCE : RDISC[] DISC ON RESISTANCE : RDISC[] Ta=25C 160 120 80 40 160 120 3 4 40 0 -50 0 2 80 5 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 31. Discharge resistance SUPPLY VOLTAGE : VIN1[V] Figure 30. Discharge resistance 30 30 VIN1=3.3V VIN2=1.8V OUTPUT DISCHARGE CURRENT : IDISC[mA] Ta=25C OUTPUT DISCHARGE CURRENT : IDISC[mA] 0 25 20 15 10 5 0 2 3 4 20 15 10 5 0 -50 5 SUPPLY VOLTAGE : VIN1[V] Figure 32. Discharge current .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 25 0 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 33. Discharge current 11/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Performance Curves - continued 1.0 1.0 IOUT=500mA CL=15uF Ta=25C 0.8 VOUTDROP VOLTAGE : Voutdrop1[V] VOUTDROP VOLTAGE : Voutdrop1[V] 0.8 0.6 0.4 0.6 0.4 0.2 0.2 0.0 0.0 2 3 4 -50 5 0 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 35. VOUT drop voltage1 SUPPLY VOLTAGE : VIN1[V] Figure 34. VOUT drop voltage1 1.0 1.0 IOUT=500mA CL=15uF Ta=25C IOUT=500mA CL=15uF VIN1=3.3V VIN2=1.8V 0.8 VOUTDROP VOLTAGE : Voutdrop2[V] 0.8 VOUTDROP VOLTAGE : Voutdrop2[V] IOUT=500mA CL=15uF VIN1=3.3V VIN2=1.8V 0.6 0.4 0.6 0.4 0.2 0.2 0.0 0.0 2 3 4 -50 5 SUPPLY VOLTAGE : VIN1[V] Figure 36. VOUT drop voltage2 .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 0 50 100 AMBIENT TEMPERATURE : Ta[C] Figure 37. VOUT drop voltage2 12/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Performance Curves - continued 2.0 From above CL=14.7F CL=10F CL=4.7F CL=1.0F CL=0.1F 1.8 VOUTDROP VOLTAGE : Voutdrop2[V] 1.8 VOUTDROP VOLTAGE : Voutdrop1[V] 2.0 From above CL=14.7F CL=10F CL=4.7F CL=1.0F CL=0.1F 1.6 1.4 1.6 1.4 1.2 1.2 1.0 1.0 0 100 200 300 400 0 500 200 300 400 500 OUTPUT CRRENT : IOUT[mA] OUTPUT CRRENT : IOUT[mA] Figure 38. VOUT voltage drop Switch over from VIN1 to VIN2 .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 100 Figure 39. VOUT voltage drop Switch over from VIN2 to VIN1 13/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Wave Forms VEN (2V/div.) VEN (2V/div.) VOUT VOUT VOUT (1V/div.) VOUT (1V/div.) VIN1=3.3V VIN2=1.8V RL=10 VOUT VIN1=3.3V VIN2=1.8V RL=10 VOUT TIME(50s/div.) TIME(50s/div.) Figure 40. Output rise characteristic SEL=L Figure 41. Output rise characteristic SEL=H VIN1=3.3V VIN2=1.8V RL=10 VEN (2V/div.) VOUT VIN1=3.3V VIN2=1.8V RL=10 VEN (2V/div.) VOUT VOUT (1V/div.) VOUT (1V/div.) VOUT VOUT TIME (200ns/div.) TIME (200ns/div.) Figure 42. Output fall characteristic SEL=L Figure 43. Output fall characteristic SEL=H .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 14/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Typical Wave Forms - continued IOUT=500mA CL=15F VSEL (2V/div.) IOUT=500mA CL=15F VSEL (2V/div.) VOUT VOUT (1V/div.) VOUT VOUT (1V/div.) IOUT VOUT (0.5A/div.) IOUT VOUT (0.5A/div.) TIME (50s/div.) TIME (50s/div.) VOUT VOUT Figure 44. Power switch over characteristic from VIN1 to VIN2 Figure 45. Power switch over characteristic from VIN2 to VIN1 CL=1F CL=1F VSEL (2V/div.) VSEL (2V/div.) IOUT=100mA IOUT=100mA IOUT=300mA VOUT VOUT (1V/div.) VOUT VOUT (1V/div.) IOUT=500mA VOUT VOUT IOUT=500mA TIME (5s/div.) TIME (10/div.) Figure 46. Power switch over characteristic from VIN1 to VIN2 Figure 47. Power switch over characteristic from VIN2 to VIN1 .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 15/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Application Example LDO 3.3V VIN1 CIN LDO 1.8V LOAD VOUT CL VIN2 GND EN SEL CONTROLLER Figure 48. Application circuit example Application Information When ringing occurs power source line to IC, and may cause bad influences upon IC actions. In order to avoid this case, connect a low ESR bypath capacitor which than 0.1F, nearby VIN1 terminal and GND terminal of IC. When SEL pin worked, the load current (IOUT) and the load capacity (CL) of output give a change in VOUT drop voltage and change over time. Decide load capacity (CL) suited to load current (IOUT). The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. Functional Description 1. Switch operation VIN1 terminal, VIN2 terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VIN1 terminal is used also as power source input to internal control circuit. When the switch is turned on from EN control input at SEL=L (SEL=H) input, VIN1 (VIN2) terminal and VOUT terminal are connected by a 120m switch. In ON status, the switch is bi-directional. Therefore, when the potential of VOUT terminal is higher than that of VIN1 (VIN2) terminal, current flows from VOUT terminal to VIN1 (VIN2) terminal. Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the OFF status, it is possible to prevent current from flowing reversely from VOUT to VIN1 (VIN2). 2. Change over operation When H is input to SEL terminal while VIN1 voltage has been output to VOUT terminal, VIN2 voltage is output to VOUT terminal after detecting that VOUT terminal becomes lower than VIN2 voltage in order to prevent current from flowing reversely. In this case, the load current (IOUT) and the load capacity (CL) of output give a change in VOUT drop voltage and change over time. When L is input to SEL terminal while VIN2 voltage has been output to VOUT terminal, VIN1 voltage is output to VOUT terminal immediately. 3. Thermal shutdown circuit (TSD) If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were beyond 135C (Typ), thermal shutdown circuit operates and makes power switch turn off. Then, when the junction temperature decreases lower than 115C (Typ), power switch is turned on. Unless the fact of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. The thermal shutdown circuit operates when the switch is on (EN signal is active). 4. Discharge Circuit Discharge circuit operates when switch off. When discharge circuit operates, 80(Typ) resistor is connected between VOUT pin and GND pin. This discharges the electrical charge quickly. .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 16/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Timing Chart 1) Stand-by Switch1 ON Stand-by 3.3V VIN1 1.8V VIN2 3.3V EN SEL 0V 0V 3.3V VOUT 0V 60 s 0.1 s 2) Stand-by VIN1 Output (Switch1 ON) VIN2 Output (Switch2 ON) Stand-by 3.3V VIN1 1.8V VIN2 3.3V EN 0V 3.3V SEL 0V 0V 3.3V 1.8V VOUT 0V 60 s 0.1 s 3) Stand-by VIN2 Output (Switch2 ON) VIN1 Output (Switch1 ON) Stand-by 3.3V VIN1 1.8V VIN2 3.3V EN 0V 3.3V SEL 0V 0V 3.3V VOUT 1.8V 0V 30 s 0.1 s Figure 49. Timing Chart .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 17/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Power Dissipation (VCSP50L1 package) 700 POWER DISSIPATION : Pd [mW] 600 500 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE : Ta [] * 50mm x 58mm x 1.75mm Glass Epoxy Board Figure 50. Power dissipation curve (Pd-Ta Curve) I/O Equivalence Circuit Symbol Pin No VIN1 A1 VIN2 A2 EN, SEL A3, B3 Equivalent circuit internal circuit to VOUT to VOUT to internal VOUT .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 B1 18/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 19/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Operational Notes - continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 51. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 20/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Ordering Information B D 2 2 0 4 Part Number G U L Package GUL:VCSP50L1 - E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams VCSP50L1 (TOP VIEW) 1PIN MARK Part Number Marking ACN LOT Number .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 21/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Physical Dimension, Tape and Reel Information Package Name VCSP50L1(BD2204GUL) ( UNIT : mm ) < Tape and Reel Information > Tape Embossed carrier tape Quantity Direction of feed 3000pcs E2 The direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 1234 1234 Reel .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 1234 1234 1pin 22/23 1234 1234 Direction of feed TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 BD2204GUL Revision History Date Revision Changes 07.Aug.2012 001 New Release 20.Feb.2015 002 25.Sep.2015 003 Revised pull-down resistance value of Pin Description and Operational Notes. Add Top View of Pin Configuration Revised Figure 38, 39 .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 23/23 TSZ02201-0GDG0H300050-1-2 25.Sep.2015 Rev.003 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGB-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods are fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, the permission based on the act is necessary in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGB-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd2204gul - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd2204gul VCSP50L1 3000 3000 Taping inquiry Yes