Data Sheet
September 2001
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
The FW250H1 and FW300H1 Power Modules use advanced,
surface-mount technology and deliver high-quality, compact,
dc-dc conversion at an economical price.
Applications
Redundant and dis tributed power archi tectures
Computer Equipment
Communications equipment
Options
Heat sink available for extended operation
Features
Size: 61.0 mm x 116.8 mm x 13.5 mm
(2.40 in. x 4.60 in. x 0.53 in.)
Wide input voltage range
High efficiency: 89% typical
Parallel operation with load sharing
Output voltage set-point adjustment (trim)
Thermal protection
Synchronization
Power good signal
Current monito r
Output overvoltage and overcurrent protection
Constant frequency
Case ground pin
Input-to- out put isol atio n
Remote sense
Remote on/off
ISO*
9001 Certified manufacturing facilities
UL
60950 Recognized,
CSA
C22.2 No. 60950-00
Certified, and
VDE
§ 0805 (EN60950) Licensed
CE mark meets 73/23/EEC and 93/68/EEC
directives**
Description
The FW250H1 and FW300H1 Power Modules are dc-dc converters that operate over an input voltage range of
36 Vdc to 75 Vdc and provide a precisely regulated dc output. The outputs are fully isolated from the inputs,
allowing versatile polarity configurations and grounding connections. The modules have maximum power rat-
ings from 250 W to 300 W at a typical full-load efficiency of 89%.
Two or more modules may be paralleled with f orced load sharing for redundant or enhanced power applications.
The package, which mounts on a printed-circuit board, accommodates a heat sink for high-temperature
applications.
*
ISO
is a registered trademark of the International Organization for Standardization.
UL
is a registered trademark of Underwriters Laboratories, Inc.
CSA
is a registered trademark of Canadian Standards Assn.
§
VDE
is a trademark of Verband Deutscher Elektrotechniker e.V.
**This product is intended for integration into end-use equipment. all the required procedures for CE marking of end-use equipment should be followed. (The CE mark is placed on
selected products.)
2Tyco Electronics Corp.
Data Sheet
September 2001
36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Table 1. Input Specifications
Fusing Considerations
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone
operation to an integrated part of a sophisticated power architecture. To preserv e maximum flexibility, internal fus-
ing is not included; howe ver, to achie ve maximum safety and system protection, always use an input line fuse. The
safety agencies require a normal-blow, dc fuse with a maximum rating of 20 A (see Safety Considerations section).
Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same
type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data for further information.
Parameter Symbol Min Max Unit
Input Voltage:
Continuous
Transient (100 ms) VI
VI, trans
80
100 Vdc
Vdc
I/O Isolation Voltage 1500 V
Operating Case Temperature
(See Thermal Considerations section and
Figure 20.)
TC–40 100 °C
Storage Temperature Tstg –55 125 °C
Parameter Symbol Min Typ Max Unit
Operating Input Voltage VI36 48 75 Vdc
Maximum Input Current (VI = 0 V to 75 V):
FW250H1
FW300H1 II, max
II, max
12
12 A
A
Maximum Input Current (VI = 0 V to 75 V):
FW250H1
FW300H1 II, max
II, max
12
12 A
A
Inru sh Transient i2t—2.0A
2s
Input Reflected- ripple Current, Peak-to-peak
(5 Hz to 20 MHz, 12 µH source impedance;
see Figure 12.)
II—10—mAp-p
Input Ripple Rejection (120 Hz) 60 dB
Tyco Electronics Corp. 3
Data Sheet
September 2001 36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Electrical Specifications (continued)
Table 2. Output Specifications
* Consult your sales representativ e or the factory.
These are manufacturing test limits. In some situations, results may differ.
Parameter Symbol Min Typ Max Unit
Output Voltage
(Over all operating input voltage, resistive load,
and temperature conditions until end of life; see
Figure 14 and Feature Descriptions.)
VO23.15 24.85 Vdc
Output Voltage Set Poi nt
(VI = 48 V; IO = IO, max; TC = 25 °C) VO, set 23.45 24.55 Vdc
Output Regu la tion :
Line (VI = 36 V to 75 V)
Load (IO = I O, min to IO, max)
Temperature (TC = –40 °C to +100 °C)
0.01
0.05
100
0.1
0.2
300
%VO
%VO
mV
Output Ripple and Noise Voltage
(See Figures 7, 8, and 13.):
RMS
Peak-to-peak (5 Hz to 20 MHz)
100
250 mVrms
mVp-p
External Load Capacitance:
FW250H1
FW300H1
330
330
*
*µF
µF
Output Curr ent
(At I O < IO, min, the modules may exceed output
ripple specifications.):
FW250H1
FW300H1 IO
IO0.1
0.1
10.4
12.5 A
A
Output C urr ent -lim it In ceptio n
(VO = 90% of V O, set; see Feature Descriptions.) IO , cli 103 130% IO, max
Output Sh ort-circuit Curre nt
(VO = 1.0 V; indefinite duration, no hiccup mode;
see Figures 3 and 4.)
———150% I
O, max
Efficiency (VI = 48 V; IO = IO, max; TC = 25 °C;
see Figures 5, 6, and 14.):
FW250H1
FW300H1 η
η
89
89
%
%
Switching Frequency 475 kHz
Dyn ami c Res ponse
(IO/t = 1 A/10 µs, VI = 48 V, TC = 25 °C; see
Figures 9 and 10.):
Load Change from IO = 50% to 75% of IO, max:
Peak Deviation
Settling Time (VO < 10% of peak deviation)
Load Change from IO = 50% to 25% of IO, max:
Peak Deviation
Settling Time (VO < 10% of peak deviation)
2
200
2
200
%VO, set
µs
%VO, set
µs
4Tyco Electronics Corp.
Data Sheet
September 2001
36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Electrical specifications (continued)
Table 3. Isolation Specifications
General Specifications
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for further information.
Table 4. Feature Specifications
* These are manufacturing test limits. In some situations, results may differ.
Parameter Min Typ Max Unit
Isolation Capacitance 1700 pF
Isolation Resistance 10 M
Parameter Min Typ Max Unit
Calculated MTBF (IO = 80% of IO, max; TC = 40 °C) 1,350,000 hours
Weight 200 (7) g (oz.)
Parameter Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VI = 0 V to 75 V; open collector or equivalent
compatible; signal referenced to VI(–) terminal; see
Figure 15 and Feature Descriptions.):
Logic Low—Module On
Logic High—Module Off
Logic Low:
At Ion/off = 1.0 mA
At Von/off = 0.0 V
Logic High:
At Ion/off = 0.0 µA
Leakage Current
Turn-on Time
(IO = 80% of I O, max; VO within ±1% of steady state)
Output Voltage Overshoot
Von/off
Ion/off
Von/off
Ion/off
0
30
0
1.2
1.0
15
50
50
5
V
mA
V
µA
ms
%VO, set
Output Voltage Adjustment (See Feature Descriptions.):
Output Voltage Remote-sense Range
Output Voltage Set-point Adjustment Range (trim)
60
0.5
110 V
%VO, nom
Output Overvoltage Protection 29.5* 34.0* V
Output Current Monitor (IO = IO, max, TC = 70 °C) IO, mon —0.25 V/A
Tyco Electronics Corp. 5
Data Sheet
September 2001 36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Electrical Specifications (continued)
Table 4. Feature Specifications (continued)
Solder, Cleaning, and Drying Considerations
P ost solder cleaning is usually the final circuit-board assemb ly process prior to electrical testing. The result of inad-
equate circuit-board cleaning and drying can affect both the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures, refer to
the Board-Mounted Po wer Modules Soldering and Cleaning Application Note (AP01-056EPS)
Parameter Symbol Min Typ Max Unit
Synchronization:
Clock Amplitude
Clock Pulse Width
Fan-out
Capture Frequency Range
4.00
0.4
425
5.00
1
575
V
µs
kHz
Overtemperature Shutdown (See Figure 20.) TC—105— °C
Forced Load Share Accuracy 10 %IO, rated
Power Good Signal Interface
(See Feature Descr ip tions.):
Low Impedance—Module Operating
High Impedance—Module Off
Rpwr/good
Ipwr/good
Rpwr/good
Vpwr/good
1
100
1
40
mA
M
V
66 Tyco Electronics Corp.
Data Sheet
September 200136 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Characteristic Curves
The following figures provide typical characteristics for the power modules.
8-1698
Figure 1. T ypical FW250H1 Input Characteristics at
Room Temperature
8-1699
Figure 2. T ypical FW300H1 Input Characteristics at
Room Temperature
8-1700
Figure 3. Typical FW250H1 Output Characteristics
at Room Temperature
8-1701
Figure 4. Typical FW300H1 Output Characteristics
at Room Temperature
10
0
INPUT VOLTAGE, VI (V)
INPUT CURRENT, II (A)
5 1015202530354045 50
9
8
7
6
5
4
3
2
1
055 60 65 70 75
IO = 10.4 A
IO = 5.2 A
IO = 1.0 A
TURN-OFF TURN-ON
12
0
INPUT VOLTAGE, VI (V)
INPUT CURRENT, II (A)
10 20 30 40 50 60 70 80
10
8
6
4
2
0
IO = 12.5 A
IO = 6.25 A
IO = 1.25 A
0
OUTPUT CURRENT, IO (A)
OUTPUT VOLTAGE, VO (V)
246810 12 14
26
16
24
22
20
18
16
14
12
10
8
6
4
2
013579111315
VI = 75 V
VI = 55 V
VI = 36 V
0
OUTPUT CURRENT, IO (A)
OUTPUT VOLTAGE, VO (V)
246810 12 14
25
20
15
10
5
016 18
VI = 36 V
VI = 55 V
VI = 75 V
Tyco Electronics Corp. 7
Data Sheet
September 2001 36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Characteristic Curves (continued)
8-1702
Figure 5. Typical FW250H1 Efficiency vs. Output
Current at Room Temperature
8-1703
Figure 6. Typical FW300H1 Efficiency vs. Output
Current at Room Temperature
0
OUTPUT CURRENT, IO (A)
EFFICIENCY, η (%)
12345678910
90
89
88
87
86
85
84
83
82
81
80
VI = 36 V
VI = 55 V
VI = 75 V
90
0
OUTPUT CURRENT, IO (A)
EFFICIENCY, η (%)
246810 12
89
88
87
86
85
84
83
82
81
80
VI = 36 V
VI = 55 V
VI = 75 V
8-1704
Note: S ee F igure 14 for test conditions.
Figure 7. Typical FW250H1 Output Ripple Voltage
at Room Temperat ure and 50 A Output
8-1705
Note: S ee F igure 14 for test conditions.
Figure 8. Typical FW300H1 Output Ripple Voltage
at Room Temperat ure and 60 A Output
OUTPUT VO LTAGE, V
O
(V)
(10 mV/div)
TIME, t (500 ns/div)
VI = 48 V
OUTPUT VOLTAGE, VO (V)
(10 mV/div)
TIME, t (500 ns/div)
VI = 48 V
88 Tyco Electronics Corp.
Data Sheet
September 200136 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Characteristic Curves (contin ued )
8-1706
Note: Tested with a 330 µF aluminum and a 1.0 µF ceramic capacitor
across the load.
Figure 9. Typical FW250H1 Transient Response to
Step Decrease in Load from 50% to 25%
of Full Load at Room Temperature and
48 V Input (Waveform Averaged to
Eliminate Ripple Component.)
8-1707
Note: Tested with a 330 µF aluminum and a 1.0 µF ceramic capacitor
across the load.
Figure 10. Typical FW250H1 Transient Response to
Step Increase in Load from 50% to 75%
of Full Load at Room Temperature and
48 V Input (Waveform Averaged to
Eliminate Ripple Component.)
8-1709 (C)
Figure 11. Typical FW250H1 Start-Up Transient at
Room Temperature, 48 V Input, and Full
Load
OUTPUT VOLT AGE, VO (V)
(200 mV/div)
TIME, t (50 µs/div)
24
OUTPUT CURRENT, IO (V)
(2 A/div)
5.2
2.6
OUTPUT VOLTAGE, VO (V)
(200 mV/div)
TIME, t (50 µs/div)
24
OUTPUT CURRENT, IO (V)
(2 A/div)
8
5.2
OUT P U T VOLT AGE, VO (V)
(5 V/div)
TIME, t (10 ms/div)
REMOTE ON/OFF,
0
24
0
VON/OFF (V)
Tyco Electronics Corp. 9
Data Sheet
September 2001 36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Test Configurations
8-203
Note: Measure input reflected-ripple current with a simulated source
inductance (LTEST) of 12 µH. Capacitor CS offsets possible bat-
tery impedance. Measure current as shown above.
Figure 12. Input Reflected-Ripple Test Setup
8-513
Note: Use a 0.1 µF ceramic capacitor and a 330 µF aluminum or
tantalum capacitor. The 330 µF capacitor is needed for stabil-
ity, Scope measurement should be made using a BNC socket.
Position the load between 50 mm and 76 mm (2 in. and 3 in.)
from the module.
Figure 13. Peak-to-Peak Output Noise
Measurement Test Setup
8-683
Note: All measurements are taken at the module terminals. When
socketing, place Kelvin connec tions at module term inals to
avoid measurement errors due to socket contact resistance
Figure 14. Output Voltage and Efficiency
Measurement Test Setup
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance input source. Highly inductive source
impedances can affect the stability of the power mod-
ule. For the test configuration in Figure 12, a 100 µF
electrolytic capacitor (ESR < 0.3 at 100 kHz)
mounted close to the power module helps ensure sta-
bility of the unit. For other highly inductive source
impedances, consult the factory f or further application
guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requir eme nts of the end-u se sa fety agency stan dard,
i.e.,
UL
60950,
CSA
22.2 No. 60950-00, and
VDE
0805
(EN60950).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75 Vdc), for the module’s output to be considered
meeting the requirements of safety extra-low voltage
(SELV), one of the following must be true:
The input source is to be provided with reinforced
insulation from any hazardous voltages, including the
ac mains.
One VI pin and one VO pin are to be grounded, or
both the input and output pins are to be kept floating.
The input pins of the module are not operator acces-
sible.
Another SELV reliability test is conducted on the
whole system, as required b y the safety agencies, on
the combination of supply source and the subject
module to verify that under a single fault, hazardous
voltages do not appear at the module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output pins.
this may allow a non-SELV voltage to appear
between the output pin and ground.
The power module has e xtr a-low voltage (ELV) outputs
when all inputs are ELV.
The input to these units is to be provided with a maxi-
mum 20 A normal-blow fuse in the ungrounded lead.
TO OSCILLOSCOPE
CURRENT
PROBE
BATTERY
L
TEST
12
µ
H
C
S
220
µ
F
ESR < 0. 1
@ 20
°
C, 100 kHz 33
µ
F
ESR < 0.3
@ 100 kHz
V
I
(+)
V
I
(–)
VO (+)
VO (–)
RESISTIVE
LOAD
SCOPE330 µF
COPPER STRIP
1.0 µF
LOAD
CONTACT AND
SUPPLY II
CONTACT
VI(+)
VI(–)
SENSE(+)
SENSE(–)
VO(+)
VO(–)
DISTRIBUTION LOSSESRESISTANCE
IO
ηVO+()–V
O()[]IO
VI+()–V
I()[]II
--------------------------------------------------


x 100=
1010 Tyco Electronics Corp.
Data Sheet
September 200136 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Feature Descriptions
Overcurrent Protection
To provide protection in a f ault (output overload) condi-
tion, the unit is equipped with internal current-limiting
circuitry and can endure current limiting for an unlim-
ited duration. At the point of current-limit inception, the
unit shifts from voltage control to current control. If the
output voltage is pulled very low during a severe fault,
the current-limit cir cuit can exhibit either foldback or
tailout characteristics (output-current decrease or
increase). The unit operates normally once the output
current is brought back into its specified range.
Remote On/Off
To tu rn the p o w er m odu le on an d o ff, the us er m u st
supply a sw itch to contr ol the v oltag e betw een th e on/off
terminal and the VI(–) terminal (V on/off). The s witch can be
an ope n collect or or equivalent (see F ig ure 15). A logic
low is Von/off = 0 V to 1 .2 V, during whi ch the modul e is on.
The maximum Ion/off during a logic low is 1 mA. The s witch
should m ain tai n a lo gic- lo w voltage while sin king 1 mA.
During a logic high, the maximum Von/off generated by
the power module is 15 V. The maximum allowable
leakage cu rren t of the switch at Von/off = 15 V is 50 µA.
If not using the remote on/off feature, short the
ON/OFF pin to VI(–).
8-580
Figure 15. Remot e On/Off Implement ation
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections. The voltage between the remote-sense
pins and the output terminals must not exceed the out-
put voltage sense range given in the Feature Specifica-
tions table, i.e.:
[VO(+) – VO(–)] [SENSE(+) – SENSE(–)] 0.5 V
The voltage between the VO(+) and VO(–) termi na l s
must not exceed the minimum value indicated in the
output overvoltage shutdown section of the Feature
Specifications table. This limit includes any incr ease in
v oltage due to remote-sense compensation and output
voltage set-point adjustment (trim), see Figure 16.
If not using the remote-sense feature to regulate the
output at the point of load, connect SENSE(+) to VO(+)
and SENSE(–) to VO(–) at the module.
Although the output voltage can be increased by both
the remote sense and b y the trim, the maximum
increase f or the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. consult the factory if you
need to increase the output voltage more than the
above limitati on.
The amount of power delivered by the module is
defined as the v oltage at the output terminals multiplied
by the output current. When using remote sense and
trim, the output voltage of the module can be
increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power.
8-651e
Figure 16. Effective Circ uit Configuration for
Single-Module Remote-Sense Operation
+
ION/OFF
VON/OFF
CASE
ON/OFF
VI (+)
VI (–)
SENSE(+)
SENSE(–)
VO (+)
VO (–)
LOAD
CONTACT AND
SUPPLY II
CONTACT
VI(–)
VI(+)
SENSE(+)
SENSE(–)
VO(–)
VO(+)
DISTRIBUTION LOSSESRESISTANCE
IO
Tyco Electronics Corp. 11
Data Sheet
September 2001 36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Feature Descriptions (continued)
Output Voltage Set-Point Adjustment
(Trim)
Output voltage trim allows the user to increase or
decrease the output voltage set point of a module. This
is accomplished by connecting an external resistor
between the TRIM pin and either the SENSE(+) or
SENSE(–) pins. The trim resistor should be positioned
close to the module.
If not using the trim feature, leave the TRIM pin open.
With an external resistor between the TRIM and
SENSE(–) pins (Radj-down), the output voltage set point
(VO, adj) decreases (see Figure 17). The following equa-
ti on determines the required external-resistor value to
obtain a percentage output voltage change of %.
With an external resistor connected between the TRIM
and SENSE(+) pins (Radj-up), the output voltage set
point (VO, adj) increas es (see Figure 18).
The following equation determines the required exter-
nal-resistor value to obtain a percentage output v oltage
change of %.
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum value of the output over-
voltage protection as indicated in the Feature Specifi-
cations table. This limit includes any increase in v oltage
due to remote-sense compensation and output voltage
set-point adjustment (trim). See Figure 16.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. Consult the factory if you
need to increase the output voltage more than the
above limitation.
The amount of power delivered by the moudle is
defined as the voltage at the output terminals multiplied
by the output current. When using remote sense and
trim, the output voltage of the module can be
increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power.
8-748
Figure 17. Circuit Configuration to Decrease
Output Voltage
8-715
Figure 18. Circuit Configuration to Increase
Output Voltage
Output Overvoltage Protection
The output voltage is monitored at the VO(+) and V O(–)
pins of the module. If the voltage at these pins exceeds
the value indicated in the Feature Specifications table,
the m o du l e will shut down and la t ch of f. Re covery fr om
latched shutdown is accomplished by cycling the dc
input power off for at least 1.0 second or toggling the
primary referenced on/off signal for at least 1.0 second.
Radj-down 205
%
----------2.255


k=
Radj-up VO, nom 1%
100
----------
+()
1.225
()
1.225%
()
------------------------------------------------------------------------- 205 2.255




k=
RLOAD
Radj-down
VI(+)
ON/OFF
CASE
SENSE (+)
VI(–)
VO(+)
TRIM
SENSE (–)
VO(–)
RLOAD
Radj-up
VI(+)
ON/OFF
CASE
SENSE (+)
VI(–)
VO(+)
TRIM
SENSE (–)
VO(–)
1212 Tyco Electronics Corp.
Data Sheet
September 200136 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Feature Descriptions (continued)
Output Current Monitor
The CURRENT MON pin provides a dc voltage propor-
tional to the dc output current of the module given in
the Feature Specifications table. For exampl e, on the
FW250H1, the V/A ratio is set at 250 mV/A ± 10% @
70 °C case. At a full load current of 12.5 A, the voltage
on the CURRENT MON pin is 3.13 V. The current mon-
itor signal is referenced to the SENSE(–) pin on the
secondary and is supplied from a source impedance of
approximately 2 k. It is recommended that the CUR-
RENT MON pin be left open when not in use, although
no damage will result if the CURRENT MON pin is
shorted to secondary ground. Directly driving the CUR-
RENT MON pin with an external source will detrimen-
tally affect operation of the module and should be
avoided.
Synchronization
Any module can be synchronized to any other module
or to an external clock using the SYNC IN or SYNC
OUT pins. The modules are not designed to operate in
a master/slav e configuration; that is, if one module fails,
the other modules will continue to operate.
SYNC IN Pin
This pin can be connected either to an e xternal clock or
directly to the SYNC OUT pin of another FW250x or
FW300x module.
If an external clock signal is applied to the SYNC IN
pin, the signal must be a 500 kHz (±50 kHz) square
wave with a 4 Vp-p amplitude. Operation outside this
frequency band will detrimentally affect the perfor-
mance of the module and must be avoided.
If the SYNC IN pin is connected to the SYNC OUT pin
of another module, the connection should be as direct
as possible , and the VI(–) pins of the modules must be
shorted together.
Unused SYNC IN pins should be tied to VI(–). If the
SYNC IN pin is unused, the module will operate from
its own internal clock.
SYNC OUT Pin
This pin contains a clock signal referenced to the VI(–)
pin. The frequency of this signal will equal either the
module’ s internal clock frequency or the frequency estab-
lished by an external clock applied to the SYNC IN pin.
When synchronizing several modules together, the
modules can be connected in a daisy-chain fashion
where the SYNC OUT pin of one module is connected
to the SYNC IN pin of another module. Each module in
the chain will synchronize to the frequency of the first
module in the chain.
To avoid loading effects, ensure that the SYNC OUT
pin of any one module is connected to the SYNC IN pin
of only one module. Any number of modules can be
synchronized in this daisy-chain fashion.
Overtemperature Protection
To provide protection in a fault condition, the unit is
equipped with an overtemperature shutdown circuit.
The shutdown circuit will not engage unless the unit is
operated above the maximum case temperature.
Recovery from overtemperature shutdown is
accomplished by cycling the dc input power off for at
least 1.0 second or toggling the primary referenced on/
off signal for at least 1.0 second.
Forced Load Sharing (Parallel Operation)
For either redundant operation or additional power
requirements, the power modules can be configured for
parallel operation with forced load sharing (see
Figure 19). For a typical redundant configuration,
Schottky diodes or an equivalent should be used to
protect against short-circuit conditions. Because of the
remote sense, the forw ard-voltage drops across the
Schottky diodes do not affect the set point of the
voltage applied to the load. For additional power
requirements, where multiple units are used to dev elop
combined power in excess of the rated maximum, the
Schottky diodes are not needed.
Good layout techniques should be observed for noise
immunity. To implement forced load sharing, the follow-
ing connections must be made:
Tyco Electronics Corp. 13
Data Sheet
September 2001 36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Feature Descriptions (continued)
Forced Load Sharing (Parallel Operation)
(continued)
The parallel pins of all units must be connected
together. The paths of these connections should be
as direct as poss ible.
All remote-sense pins should be connected to the
power bus at the same point, i.e., connect all
SENSE(+) pins to the (+) side of the power bus at the
same point and all SENSE(–) pins to the (–) side of
the power b us at the same point. Close pro ximity and
directness are necessary for good noise immunity.
When not using the parallel feature, leave the
PARALLEL pin open.
8-581
Figure 19. Wiring Configura tion for Redundant
Parallel Operation
Power Good Signal
The PWR GOOD pin provides an open-drain signal
(referenced to the SENSE(–) pin) that indicates the
operating state of the module. A low impedance
(<100 ) between PWR GOOD and SENSE(–) indi-
cates that the module is operating. A high impedance
(>1 M) between PWR GOOD and SENSE(–) indi-
cates that the module is off or has failed. The PWR
GOOD pin can be pulled up through a resistor to an
external voltage to facilitate sensing. This external volt-
age lev el must not exceed 40 V, and the current into the
PWR GOOD pin during the low-impedance state
should be limited to 1 mA maximum.
Thermal Considerations
Introduction
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation of the unit.
Heat-dissipating components inside the unit are ther-
mally coupled to the case. Heat is removed by conduc-
tion, convection, and radiation to the surrounding
environment. Proper cooling can be verified by mea-
suring the case temperature. Peak temperature occurs
at the position indicated in Figure 20.
8-1303
Note: Top view, measurements shown in millimeters and (inches).
Pin locations are for reference only.
Figure 20. Case Temperature Measurement
Location
VO(+)
PARALLEL
SENSE(+)
SENSE()
VO()
CASE
VI(+)
ON/OFF
VI()
VO(+)
PARALLEL
SENSE(+)
SENSE()
VO()
CASE
VI(+)
ON/OFF
VI()
CASE
SYNC IN
SYNC OUT
MEASURE CASE
TEMPERATURE HERE
ON/OFF
82.6
(3.25)
30.5
(1.20)
V
I
(+)
V
I
()V
O
(+)
V
O
()
Tyco Electronics Corp. 14
Data Sheet
September 2001 36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Thermal Considerations (continued)
Introduction (continued)
The t emp er a t ure at t hi s lo ca ti on sh ou ld no t exceed
100 °C. The maximum case temperature can be limited
to a lower value for extremely high reliability. The output
po w e r of the mo du le shou ld no t exceed the ra t ed power
for the module as listed in the Ordering Information table.
F or additional inf ormation about these modules, ref er to
the
Thermal Management for FC- and FW-Series 250
W300 W Board-Mounted Power Modu les
Technica l
Note (TN96-009EPS).
Heat Transfer Without Heat Sinks
Derating curves for forced-air cooling without a heat
sink are shown in Figures 21 and 22. These curv es can
be used to determine the appropriate airflow f or a given
set of operating conditions. F or example, if the unit with
airflow along its length dissipates 20 W of heat, the
correct airflow in a 40 °C environment is 1.0 m/s
(200 ft./min.).
8-1315
Figure 21. Con vection P ower Derating with No Heat
Sink; Airflow Along Width (Transverse)
8-1314
Figure 22. Con vection P ower Dera ting with No Heat
Sink; Airflow Along Length
(Longitudinal)
Heat Tran sfer with Hea t Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to be attached to the module. The mounting torque
must not exceed 0.56 N-m (5 in.-lb.). For the screw
attachment from the pin side, the recommended hole
size on the customers PWB around the mounting
holes is 0.130 ± 0.005 inches. If a larger hole is used,
the mounting torque from the pin side must not exceed
0.25 N-m (2.2 in.-lbs.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (θca) is defined as the max-
imum case temperature rise (TC, max) divided by the
module power dissipation (PD):
The location to measure case temperature (TC) is
shown in Figure 20. Case-to-ambient thermal resis-
tance vs. airflow for various heat sink configurations is
shown in Figure 23 and Figure 24. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
010203040 100
0
70
50
40
20
9080706050
10
30
60
LOCAL AMBIEN T TEMPERATURE, TA (°C)
POWER DISSIPATION, PD (W)
4.0 m/s (800 ft./min.)
3.5 m/s (700 ft./min.)
3.0 m/s (600 ft./min.)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.5 m/s (300 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
0.1 m/s (20 ft./min.) NAT. CONV.
010203040 100
0
70
50
40
20
9080706050
10
30
60
LOCAL AMBIENT TEMPERATURE, TA (°C)
POWER DISSIPATION, PD (W)
4.0 m/s (800 ft./min.)
3.5 m/s (700 ft./min.)
3.0 m/s (600 ft./min.)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.5 m/s (300 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
0.1 m/s (20 ft./min.) NAT. CONV.
θca TCmax,
PD
---------------------TCTA
()
PD
------------------------
==
1515 Tyco Electronics Corp.
Data Sheet
September 2001
36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Thermal Considerations (continued )
Heat Transfer with Heat Sinks (continued)
8-1321
Figure 23. Case-to-Ambient Thermal Resistance
Curves; Transverse Orientation
8-1320
Figure 24. Case-to-Ambient Thermal Resistance
Curves; Longitudinal Orientation
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figures 23 and
24 had a thermal-conductive dry pad between the case
and the heat sink to minimize contact resistance.
To choose a heat sink, determine the power dissipated
as heat by the unit for the particular application.
Figures 25 and 26 show typical heat dissipation for a
range of output currents and three voltages for the
FW250H1 and FW300H1.
8-1711
Figure 25. FW250H1 Power Dissipation vs. Output
Current
8-1712
Figure 26. FW300H1 Power Dissipation vs. Output
Current
00.5
(100) 1.0
(200) 1.5
(300) 2.0
(400) 2.5
(500) 3.0
(600)
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
CASE-TO-AMBIENT THERMAL
1.5
AIR VELOCITY, m/s (ft./min.)
RESISTANCE, θCA (°C/W)
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
00.5
(100) 1.0
(200) 1.5
(300) 2.0
(400) 2.5
(500) 3.0
(600)
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
CASE-TO-AMBIENT THERMAL
1.5
AIR VELOCITY, m/s (ft./min.)
RESISTANCE, θCA (°C/W)
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
0
OUTPUT CURRENT, IO (A)
POWER DISSIPATION, PD (W)
1234567
35
30
25
20
15
10
5
08910
VI = 75 V
VI = 55 V
VI = 36 V
50
0
OUTPUT CURRENT, IO (A)
POWER DISSIPATION, PD (W)
246810 12
45
40
35
30
25
20
15
10
5
0
VI = 75 V
VI = 55 V
VI = 36 V
Tyco Electronics Corp. 16
Data Sheet
September 2001 36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
Example
If an 85 °C case temperature is desired, what is the
minimum airflow necessary? Assume the FW250H1
module is operating at nominal line and an output cur-
rent of 10 A, maximum ambient air temperature of
40 °C, and the heat sink is 1/2 inch.
Solution
Given: VI = 55 V
IO = 10 A
TA = 40 °C
TC = 85 °C
Heat sink = 1/2 inch.
Determine PD by using Figure 25:
PD = 28 W
Then solve the following equation:
Use Figures 23 and 24 to determine air velocity for the
1/2 inch heat sink. The minimum airflow necessary for
the FW250H1 module depends on heat sink fin orienta-
tion and is shown below:
1.25 m/s (250 ft./min.) (oriented along width)
1.5 m/s (300 ft./min. ) (or ien ted alo ng len gth )
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (θcs) and
sink-to-ambient (θsa) as shown in Figure 27.
8-1304
Figure 27. Resistance from Case-to-Sink and Sink-
to-Ambient
For a managed interface using thermal grease or foils,
a value of θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solut ion for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(FDS01-043EPS)
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the FLTR100V10 data sheet
(FDS01-043EPS)
θca TCTA()
PD
------------------------
=
θca 85 40()
28
------------------------
=
θca 1.61 °C/W=
PDTCTSTA
θcs θsa
θsa TCTA()
PD
-------------------------θcs=
17 Tyco Electronics Corp.
Data Sheet
September 2001
36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Outline Diagram
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.),
x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)
8-1650c
* Side label includes Tyco name, product designation, safety agency markings, input/output voltage and current ratings, and bar code.
CASE
SYNC IN
ON/OFF
VI -
VI+
2.54 (0.100) TYP
VO-
VO+
SYNC OUT
5.1 (0.20)
10.16
(0.400)
MOUNTING INSERTS
M3 x 0.5 THROUGH,
4 PLACES
5.1 (0.20)
2.54 (0.100) TYP
SENSE-
SENSE+
TRIM
PARALLEL
CURRENT MON
PWR GOOD
50.8
(2.00)
30.48
(1.200)
22.86
(0.900)
12.7
(0.50)
5.08
(0.200)
15.24
(0.600)
20.32
(0.800)
25.40
(1.000)
30.48
(1.200)
35.56
(1.400)
66.04 (2.600)
106.7 (4.20)
7.62
(0.300)
17.78
(0.700)
12.70
(0.500)
13.5
(0.53)
5.1 (0.20) MIN 1.57 (0.062) DIA
SOLDER-PLATED,
11 PLACES
SIDE LABEL*
1.02 (0.040) DIA
SOLDER-PLATED,
9 PLACES
116.8 (4.60)
61.0
(2.40)
Top View
Side View
Bottom View
Tyco Electronics Corp. 18
Data Sheet
September 2001 36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Recommended Hole Pattern
Component-side footprint.
Dimensions are in millimeters and (inches).
8-1650c
Ordering Information
Please contact your Tyco Electronics Account Manager or Field Application engineer for pricing and availabilty.
Input Voltage Output Voltage Output Power Device Code Comcode
48 V 24 V 250 W FW250H1 108026840
48 V 24 V 300 W FW300H1 107430324
5.1 (0.20)
MOUNTING INSERTS
5.1 (0.20)
2.54 (0.100) TYP
2.54 (0.100) TYP
5.08
(0.200)
15.24
(0.600)
20.32
(0.800)
25.40
(1.000)
30.48
(1.200)
35.56
(1.400)
106.68 (4.200)
66.04 (2.600)
50.8
(2.00)
30.48
(1.200)
22.86
(0.900)
17.78
(0.700)
12.70
(0.500)
12.7
(0.50)
7.62
(0.300)
CASE
SYNC IN
ON/OFF
V
I
-
V
I
+
V
O
-
V
O
+
SENSE-
SENSE+
TRIM
PARALLEL
CURRENT MON
PWR GOOD
SYNC OUT
7.62
(0.300) 7.62
(0.300)
10.16
(0.400)
19 Tyco Electronics Corp.
Data Sheet
September 2001
36 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Ordering Information (continued)
Table 6. Device Accessories
Dimension are in millimeters and (inches).
Accessory Comcode
1/4 in. transverse kit (heat sink, thermal pad, and screws) 847308335
1/4 in. longitudinal kit (heat sink, thermal pad, and screws) 847308327
1/2 in. transverse kit (heat sink, thermal pad, and screws) 847308350
1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 847308343
1 in. transverse kit (heat sink, thermal pad, and screws) 847308376
1 in. longitudinal kit (heat sink, thermal pad, and screws) 847308368
1 1/2 in. transverse kit (heat sink, thermal pad, and screws) 847308392
1 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 847308384
8-2830
Figure 28. Longitudinal Heat Sink
8-2831
Figure 29. Transverse Heat Sink
1/4 IN.
1/2 IN.
1 IN.
1 1/2 IN.
60.45
115.82
(4.56)
(2.38)
1/4 IN.
1/2 IN.
1 IN.
1 1/2 IN.
115.82
(4.56)
59.94
(2.36)
Data Sheet
September 200136 Vdc to 75 Vdc Input, 24 Vdc Output; 250 W to 300 W
FW250H1 and FW300H1 Power Modules; dc-dc Converters:
Printed on
Recycled Paper
Tyco Electroni cs Power Systems, Inc.
3000 Skyline Drive, Mesquite, TX 75149, USA
+1-800-526-7819 FAX: + 1-888 -315-5182
(Outs ide U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900
http://power.tycoeleectronics.com
Tyco Electronics Corportation reserv es the right to make changes to the pro duct(s) or inf ormation cont ained her ei n without notice. No liability is assumed as a result of their use or application.
No rights under any patent accompany the sale of any such product(s) or information.
© 2001 Tyco Electronics Power Systems, Inc., (Mesquite, Texas) All International Rights Reserved.
Printed in U.S.A.
September 2001
DS00-158EPS