CC109143203 - GE CRITICAL POWER

GE Data Sheet

EVW010A0B Series (Eighth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Features

 Compliant to RoHS EU Directive 2011/65/EU (Z

versions)

 Compliant to RoHS EU Directive 2011/65/EU under

exemption 7b (Lead solder exemption). Exemption

7b will expire after June 1, 2016 at which time this

produc twill no longer be RoHS compliant (non-Z

versions)

 Compatible in a Pb-free or SnPb reflow

environment

 High efficiency – 93.5% at 12V full load

 Industry standard, DOSA compliant, Eighth brick

footprint

57.9mm x 22.9mm x 7.8mm

(2.28in x 0.90in x 0.31in)

 Wide Input voltage range: 36-75 Vdc

 Tightly regulated output

 Constant switching frequency

 Positive Remote On/Off logic

 Input under/over voltage protection

 Output overcurrent/voltage protection

 Over-temperature protection

 Remote sense

 No minimum load required

 No reverse current during output shutdown

 Output Voltage adjust: 80% to 110% of Vo,nom

 Operating temperature range (-40°C to 85°C)

 UL* 60950-1Recognized, CSA† C22.2 No. 60950-1-

03 Certified, and VDE‡ 0805:2001-12 (EN60950-1)

Licensed

 CE mark meets 73/23/EEC and 96/68/EEC

directives§

 Meets the voltage and current requirements for

ETSI 300-132-2 and complies with and licensed for

Basic insulation rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE

802.3¤ PoE standards

 ISO**9001 and ISO 14001 certified manufacturing

facilities

Applications

 Distributed Power Architectures

 Wireless Networks

 Access and Optical Network Equipment

 Enterprise Networks including Power over Ethernet

(PoE)

Options

 Negative Remote On/Off logic

 Over current/Over temperature/Over voltage

protections (Auto-restart)

 Heat plate versions (-H)

 Surface Mount version (-S)

Description

The EVW010A0B, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 10A of output

current and provide a precisely regulated output voltage of 12V over a wide range of input voltages (VIN = 36 - 75Vdc). The

modules achieve typical full load efficiency of 93.5%. The open frame modules construction, available in both surface-

mount and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features

include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature

protection.

RoHS Compliant

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute

stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those

given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can

adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All VIN -0.3 80 Vdc

Transient (≤100 ms) All VIN,trans -0.3 100 Vdc

Operating Ambient Temperature All TA -40 85 °C

(see Thermal Considerations section)

Storage Temperature All Tstg -55 125 °C

I/O Isolation voltage (100% factory Hi-Pot tested) All   2250 Vdc

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 36 48 75 Vdc

Maximum Input Current All IIN,max 3.4 3.7 Adc

(VIN= VIN, min to VIN, max, IO=IO, max)

Input No Load Current All IIN,No load

75 mA

(VIN = VIN, nom, IO = 0, module enabled)

Input Stand-by Current

All IIN,stand-by

20 mA

(VIN = VIN, nom, module disabled)

Inrush Transient All I2t 0.5 A2s

Input Reflected Ripple Current, peak-to-peak

(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN,

max, IO= IOmax ; See Test configuration section)

All 20 mAp-p

Input Ripple Rejection (120Hz) All 50 dB

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an

integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,

however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a

time-delay fuse with a maximum rating of 8 A (see Safety Considerations section). Based on the information provided in

this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used.

Refer to the fuse manufacturer’s data sheet for further information.

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Nominal Output Voltage Set-point All VO, set 11.76 12.0 12.24 Vdc

VIN=VIN, min, IO=IO, max, TA=25°C)

Output Voltage

All VO -3.0  +3.0 % VO, set

(Over all operating input voltage, resistive load, and

temperature conditions until end of life)

Output Regulation

Line (VIN=VIN, min to VIN, max) All

  0.2 % VO, set

Load (IO=IO, min to IO, max) All 

 0.2 % VO, set

Temperature (Tref=TA, min to TA, max) All

  1.0 % VO, set

Output Ripple and Noise on nominal output

(VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max)

RMS (5Hz to 20MHz bandwidth) All   30 mVrms

Peak-to-Peak (5Hz to 20MHz bandwidth) All   100 mVpk-pk

External Capacitance All CO 100  2,000 μF

Output Current All Io 0  10 Adc

Output Current Limit Inception (Hiccup Mode ) All IO, lim

105 115 130 % Io

(VO= 90% of VO, set)

Output Short-Circuit Current All IO, s/c  3 5 Arms

(VO≤250mV) ( Hiccup Mode )

Efficiency All η 93.5 %

VIN= VIN, nom, TA=25°C

IO=IO, max , VO= VO,set

Switching Frequency (Input ripple is ½ fsw) All fsw 370 kHz

Dynamic Load Response

(dIo/dt=0.1A/s; VIN = VIN, nom; TA=25°C)

Load Change from Io= 50% to 75% or 25% to 50%

of Io,max;

Peak Deviation All Vpk  3  % VO, set

Settling Time (Vo<10% peak deviation) All ts  200  s

(dIo/dt=1A/s; VIN = VIN, nom; TA=25°C)

Load Change from Io= 50% to 75% or 25% to 50%

of Io,max;

Peak Deviation All Vpk  5  % VO, set

Settling Time (Vo<10% peak deviation) All ts  200  s

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitance All Ciso  1000  pF

Isolation Resistance All Riso 10   MΩ

I/O Isolation Voltage (100% factory Hi-pot tested) All All   2250 Vdc

General Specifications

Parameter Device Symbol Min Typ Max Unit

Calculated Reliability based upon Telcordia SR-332

Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,

airflow = 200 lfm, 90% confidence)

All FIT 323.4 109/Hours

All MTBF 3,092,530 Hours

Weight (Open Frame) All  19

(0.67)  g

(oz.)

Weight (with Heatplate) All  32

(1.13)  g

(oz.)

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

See Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=VIN, min to VIN, max ; open collector or equivalent,

Signal referenced to VIN- terminal)

Negative Logic: device code suffix “1”

Logic Low = module On, Logic High = module Off

Positive Logic: No device code suffix required

Logic Low = module Off, Logic High = module On

Logic Low - Remote On/Off Current All Ion/off   1.0 mA

Logic Low - On/Off Voltage All Von/off -0.7  1.0 Vdc

Logic High Voltage – (Typ = Open Collector) All Von/off 2.0 5.0 Vdc

Logic High maximum allowable leakage current All Ion/off   10 μA

Turn-On Delay1 and Rise Times

(IO=IO, max , VIN=VIN, nom, TA = 25 oC)

Case 1: On/Off input is set to Logic Low (Module

ON) and then input power is applied (Tdelay from

instant at which VIN = VIN, min until VO = 10% of VO,set)

All Tdelay — 25 30 msec

Case 2: Input power is applied for at least 1 second

and then the On/Off input is set from OFF to ON (Tdelay from

instant Von/off toggles until VO = 10% of VO, set).

All Tdelay — 12 20 msec

Output voltage Rise time (time for Vo to rise from 10%

of Vo,set to 90% of Vo, set) All Trise — 10 15 msec

Output voltage overshoot – Startup All

— 3 % VO, set

IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC

Remote Sense Range All VSENSE 10 % VO, set

(Max voltage drop is 0.5V)

Output Voltage Adjustment Range2 All 80 110 % VO, set

Output Overvoltage Protection All VO, limit 13.8  16.5 Vdc

Input Undervoltage Lockout All VUVLO

Turn-on Threshold 30 34.5 36 Vdc

Turn-off Threshold 30 32.5  Vdc

Hysterisis 1.5 2.0

 Vdc

Input Overvoltage Lockout All VOVLO

Turn-off Threshold  80 83 Vdc

Turn-on Threshold 75 78  Vdc

Hysterisis 1 2

 Vdc

Notes:

1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 4 seconds. The extended Tdelay will occur when the module restarts following either:

1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal; or 2)

toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, Tdelay, will occur whenever a

module restarts with input voltage removed from the module for the preceding 1 second.

2. Maximum trim up possible only for Vin>40V.

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Characteristic Curves

The following figures provide typical characteristics for the EVW010A0B (12V, 10A) at 25oC. The figures are identical for

either positive or negative remote On/Off logic.

EFFICIENCY,  (%)

0246810

Vin = 48

Vin = 36

Vin = 75

OUTPUT VOLTAGE OUTPUT CURRENT

VO (V) (200mV/div) Io(A) (2A/div)

OUTPUT CURRENT, IO (A) TIME, t (100µs/div)

Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic Load

Change from 50% to 75% to 50% of full load (VIN = VIN,NOM).

OUTPUT VOLTAGE

VO (V) (50mV/div)

On/Off VOLTAGE OUTPUT VOLTAGE

VO (V) (2V/div) VOn/Off (V) (2V/div)

TIME, t (2s/div) TIME, t (5ms/div)

Figure 2. Typical output ripple and noise (VIN

= VIN,NOM, Io

Io,max).

Figure 5. Typical Start-up Using Remote On/Off, negative

logic version shown (VIN = VIN,NOM, Io = Io,max).

OUTPUT VOLTAGE OUTPUT CURRENT

VO (V) (200mV/div) Io(A) (2A/div)

INPUT VOLTAGE OUTPUT VOLTAGE

VIN (V) (20V/div) VO (V) (2V/div)

TIME, t (100µs/div) TIME, t (10ms/div)

Figure 3. Transient Response to 0.1A/µS Dynamic Load

Change from 50% to 75% to 50% of full load (VIN = VIN,NOM).

Figure 6. Typical Start-up Using Input Voltage (VIN

= VIN,NOM,

Io = Io,max).

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Test Configurations

TO OSCILLOSCOPE CURRENT PROBE

LTES T

12μH

BATTER Y

CS 220μF

E.S .R .<0 .1



@ 20 °C 100kHz

33-100μF

Vi n+

Vin-

NOTE: Measure input reflected ripple current with a simulated

source inductance (LTES T) of 12μH. Capacitor CS o ffsets

possible battery impedance . Measure current as shown

above.

Figure 7. Input Reflected Ripple Current Test Setup.

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are requ ired at the module terminals

to avoid measurement errors due to socket contact

resistance.

VO(+)

VO(–)

RESISTIVE

LOAD

SCOPE

COPPER STRIP

GROUND PLANE

10uF

1uF

Figure 8. Output Ripple and Noise Test Setup.

Vout+

Vout-

Vin+

Vin-

RLOAD

Rcontact Rdistribution

Rcontact

Rdistribution

VIN VO

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

Figure 9. Output Voltage and Efficiency Test Setup.



VO.I

VIN.I

x 100 %

Efficiency

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Design Considerations

Input Filtering

The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the

stability of the power module. For the test configuration in Figure 7 a 33-100μF electrolytic capacitor (ESR<0.1 at 100kHz),

mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application

guidelines.

Safety Considerations

For safety-agency approval of the system in which the power module is used, the power module must be installed in

compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 60950-1-3, CSA

C22.2 No. 60950-00, and VDE 0805:2001-12 (IEC60950-1).

If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the

module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must

be true:

 The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac

mains.

 One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating.

 The input pins of the module are not operator accessible.

 Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as

required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s

output.

Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a

non-SELV voltage to appear between the output pins and ground.

The power module has extra-low voltage (ELV) outputs when all inputs are ELV.

All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for

reduced thickness.

For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the

applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in

Europe) and unearthed SELV outputs.

The input to these units is to be provided with a maximum 8 A time-delay fuse in the ungrounded lead.

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Feature Description

Remote On/Off

Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin,

and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and

on during a logic low.

ON/OFF

Vin+

Vin-

Ion/off

Von/off

Vout+

TRIM

Vout-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage

(Von/off) between the ON/OFF terminal and the VIN(-) terminal (see Figure 10). Logic low is 0V ≤ Von/off ≤ 1.0V. The maximum

Ion/off during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current.

During a logic high, the typical maximum Von/off generated by the module is 5V, and the maximum allowable leakage

current at Von/off = 5V is 1μA.

If not using the remote on/off feature:

For positive logic, leave the ON/OFF pin open.

For negative logic, short the ON/OFF pin to VIN(-).

Remote Sense

Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See

Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense

range given in the Feature Specifications table:

[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V

Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the

output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim.

The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output

current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output

current would increase the power output of the module. Care should be taken to ensure that the maximum output power of

the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max).

VO(+)

SENSE(+)

SENSE(–)

VO(–)

VI(+)

VI(-)

IOLOAD

CONTACT AND

DISTRIBUTION LOSS

SUPPLY II

CONTACT

RESISTANCE

Figure 11. Circuit Configuration for remote sense .

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin

to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON.

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off

threshold, VUV/OFF.

Overtemperature Protection

To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will

shutdown if the thermal reference point Tref (Figure 13), exceeds 150oC (typical), but the thermal shutdown is not intended

as a guarantee that the unit will survive temperatures beyond its rating. The module can be restarted by cycling the dc

input power for at least one second or by toggling the remote on/off signal for at least one second. If the auto-restart

option (4) is ordered, the module will automatically restart upon cool-down to a safe temperature.

Output Overvoltage Protection

The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of

failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage

resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an

internally programmed time elapsing.

Overcurrent Protection

To provide protection in a fault (output overload) condition, the unit is equipped with internal

current-limiting circuitry and can endure current

limiting continuously. At the point of current-limit

inception, the unit enters hiccup mode. If the unit is

not configured with auto–restart, then it will latch off

following the over current condition. The module can be restarted by cycling the dc input power for at least one second or

by toggling the remote on/off signal for at least one second. If the unit is configured with the auto-restart option (4), it will

remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is

brought back into its specified range. The average output current during hiccup is 10% IO, max.

Output Voltage Programming

Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external

resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin.

VO(+)

VOTRIM

VO(-)

Rtrim-down

LOAD

VIN(+)

ON/OFF

VIN(-)

Rtrim-up

Figure 12. Circuit Configuration to Trim Output Voltage.

Connecting an external resistor (Rtrim-down) between the TRIM pin and the Vo(-) (or Sense(-)) pin decreases the output voltage

set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%.

The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%



















22.10

511

downtrim

Where 100% ,

,















seto

desiredseto V

For example, to trim-down the output voltage of the module by 8% to 11.04V, Rtrim-down is calculated as follows:



















22.10

511

downtrim



655.53

downtrim

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage

set point. The following equations determine the required external resistor value to obtain a percentage output voltage

change of ∆%:

























22.10

511

%225.1

%)100(11.5 ,seto

uptrim V

Where 100% ,

,















seto

setodesired

For example, to trim-up the output voltage of the module by 5% to 12.6V, Rtrim-up is calculated is as follows:

























22.10

511

5225.1 )5100(0.1211.5

uptrim

R

8.938

uptrim

The voltage between the Vo(+) and Vo(–) terminals must not exceed the minimum output overvoltage protection value

shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation

and output voltage set-point adjustment trim.

Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the

output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The

amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current.

When using remote sense and trim, the output voltage of the module can be increased, which at the same output current

would increase the power output of the module. Care should be taken to ensure that the maximum output power of the

module remains at or below the maximum rated power (Maximum rated power = VO,set x IO,max).

Thermal Considerations

The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help

ensure reliable operation.

Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A

reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented

here is based on physical measurements taken in a wind tunnel.

The thermal reference point, Tref used in the specifications for open frame modules is shown in Figure 13. For reliable

operation this temperature should not exceed 122oC.

Figure 13. Tref Temperature Measurement Location for open Frame Module.

The thermal reference point, Tref used in the specifications for modules with heat plates (–H) is shown in Figure 14. For

reliable operation this temperature should not exceed 114oC.

AIRFLOW

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Thermal Considerations (continued)

Figure 14. Tref Temperature Measurement Location for Heat plate Module.

Heat Transfer via Convection

Increased airflow over the module enhances the heat

transfer via convection. Derating curves showing the

maximum output current that can be delivered by the open frame module versus local ambient temperature (TA) for natural

convection and up to 3m/s (600 ft./min) forced airflow are shown in Figure 15.

OUTPUT CURRENT, IO (A)

20 30 40 50 60 70 80 90

3.0 m/s

(600LFM)

2.0 m/s

(400LFM)

1.0 m/s

(200LFM)

0.5 m/s

(100LFM)

AMBIENT TEMEPERATURE, TA (oC)

Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to

Vout(-); Vin =48V.

For additional power, the module is available with an optional heatplate (-H), that allows for the use of heatsinks to improve

the thermal derating. Derating curves showing the maximum output current that can be delivered by the heatplate module

with different heatsink heights versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min)

forced airflow are shown in Figures 16 -19.

OUTPUT CURRENT, IO (A)

20 30 40 50 60 70 80 90

3.0 m/s

(600LFM)

2.0 m/s

(400LFM)

1.0 m/s

(200LFM) 0.5 m/s

(100LFM)NC

AMBIENT TEMEPERATURE, TA (oC)

Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to

Vout(-); Vin =48V.

AIRFLOW

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

OUTPUT CURRENT, IO (A)

20 30 40 50 60 70 80 90

2.0 m/s

(400LFM)

1.0 m/s

(200LFM)

0.5 m/s

(100LFM)

AMBIENT TEMEPERATURE, TA (oC)

Figure 17. Output Current Derating for the Module with Heatplate and 0.25 in. heatsink; Airflow in the Transverse

Direction from Vout(+) to Vout(-); Vin =48V.

OUTPUT CURRENT, IO (A)

20 30 40 50 60 70 80 90

2.0 m/s

(400LFM)

1.0 m/s

(200LFM)

0.5 m/s

(100LFM)

AMBIENT TEMEPERATURE, TA (oC)

Figure 18. Output Current Derating for the Module with Heatplate and 0.5 in. heatsink; Airflow in the Transverse

Direction from Vout(+) to Vout(-); Vin =48V.

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Thermal Considerations (continued)

OUTPUT CURRENT, IO (A)

20 30 40 50 60 70 80 90

1.0 m/s

(200LFM)

0.5 m/s

(100LFM)

AMBIENT TEMEPERATURE, TA (oC)

Figure 19. Output Current Derating for the Module with Heatplate and 1.0 in. heatsink; Airflow in the Transverse

Direction from Vout(+) to Vout(-); Vin =48V.

Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board-Mounted Power Modules”

for a detailed discussion of thermal aspects including maximum device temperatures.

Through-Hole Soldering Information

The RoHS-compliant (Z codes) through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant

components. The RoHS-compliant with lead solder exemption (non-Z codes) through-hole products use Sn/Pb solder and

RoHS-compliant components. Both non-Z and Z codes are designed to be processed through single or dual wave soldering

machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A

maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power

module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot

is 270C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free

reflow process. If additional information is needed, please consult with your GE representative for more details.

Surface Mount Information

Pick and Place

The EVW010A0B modules use an open frame construction and are designed for a fully automated assembly process. The

modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all

the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures

of up to 300oC. The label also carries product information such as product code, serial number and the location of

manufacture.

Figure 20. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a

relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum

pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable

component spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available.

Reflow Soldering Information

The surface mountable modules in the EVW family use our newest SMT technology called “Column Pin” (CP) connectors.

Figure 21 shows the new CP connector before and after reflow soldering onto the end-board assembly.

EVW Board

Insulator

Solder Ball

End assembly PCB

Figure 21. Column Pin Connector Before and After Reflow Soldering.

The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb)

solder for non-Z codes, or Sn/Ag/Cu (SAC) solder for –Z codes. The CP connector design is able to compensate for large

amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183oC (Sn/Pb

solder) or 217-218 oC (SAC solder), wets the land, and subsequently wicks the device connection. Sufficient time must be

allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow

technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural

forced convection, IR (radiant infrared), or a combination of convection/IR.

The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may

result in the failure of or cause damage to the modules, and can adversely affect long-term reliability.

Tin Lead Soldering

The recommended linear reflow profile using Sn/Pb solder is shown in Figure 22 and 23. For reliable soldering the solder

reflow profile should be established by accurately measuring the modules CP connector temperatures.

REFLOW TEMP (C)

10 0

15 0

200

250

300

Preheat zone

max 4oCs-1

Soak zone

30-240s

Heat zone

max 4oCs-1

Peak Temp 235oC

Co oling

zo ne

1- 4 oCs-1

lim

above

205

REFLOW TIME (S)

Figure 22. Recommended Reflow Profile for Tin/Lead (Sn/Pb) process

Lead Free Soldering

The –Z version of the EVW010A0B modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward

compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of

or cause damage to the modules and can adversely affect long-term reliability.

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

MAX TEMP SOLDER (C)

200

205

210

215

220

225

230

235

240

0 102030405060

Figure 23. Time Limit, Tlim, Curve Above 205oC for Tin/Lead (Sn/Pb) process

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State

Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a

recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The

suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in

Fig. 24.

Per J-STD-020 Rev. C

100

150

200

250

300

Reflow Time (Seconds)

Reflow Temp (°C)

Heating Zone

1°C/Second

Pe ak Temp 260°C

* Min. Time Above 235°C

15 Seconds

*Time Above 217°C

60 Sec o nds

Cooling

Zone

Figure 24. Recommended linear reflow profile using Sn/Ag/Cu solder

MSL Rating

The EVW010A0B modules have a MSL rating of 2A.

Storage and Handling

The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is

detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices).

Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not

be broken until time of use. Once the original package is broken, the floor life of the product at conditions of  30°C and

60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will

be a minimum of 12 months from the bag seal date, when stored at the following conditions: <40°C, < 90% relative

humidity.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of

inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished

circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted

Power Modules: Soldering and Cleaning Application Note (AN04-001).

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

EMC Considerations

The circuit and plots in Figure 25 shows a suggested configuration to meet the conducted emission limits of EN55022 Class

Level [dBµV]

150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M

Frequency [Hz]

x xMES CE0615090841_fin QP

MES CE0615090841_pre PK

Level [dBµV]

150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M

Frequency [Hz]

+ +MES CE0615090841_fin AV

MES CE0615090841_pre AV

Figure 25. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Mechanical Outline for Surface Mount Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Top

View#

#Top side label includes GE name, product designation and date code.

Side

View

Bottom

View

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Top

View#

#Top side label includes GE name, product designation and date code.

Side

View

* For optional pin lengths, see Table 2 Device Options and Coding Scheme

Bottom

View

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Mechanical Outline for Through-Hole Module with Heat Plate (-H)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Top

View

Side

View

* For optional pin lengths, see Table 2 Device Options and Coding Scheme

Bottom

View#

# Bottom side label includes GE name, product designation and date code.

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Recommended Pad Layout

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

SMT Recommended Pad Layout (Component Side View)

TH Recommended Pad Layout (Component Side View)

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

Packaging Details

The surface mount versions of the EVW surface mount

modules (suffix –S) are supplied as standard in the

plastic tray shown in Figure 26. The tray has external

dimensions of 135.1mm (W) x 321.8mm (L) x 12.42mm (H)

or 5.319in (W) x 12.669in (L) x 0..489in (H).

Tray Specification

Material Antistatic coated PVC

Max surface resistivity 1012/sq

Color Clear

Capacity 12 power modules

Min order quantity 48 pcs (1 box of 4 full trays)

Each tray contains a total of 12 power modules. The

trays are self-stacking and each shipping box will

contain 4 full trays plus one empty hold down tray giving

a total number of 48 power modules.

Figure 26. Surface Mount Packaging Tray.

GE Data Sheet

EVW010A0B Series (Ei

hth-Brick) DC-DC Power Modules

36–75Vdc Input; 12.0Vdc Output; 10A Output Current

For more information, call us at

USA/Canada:

+1 888 546 3243, or +1 972 244 9288

Asia-Pacific:

+86.021.54279977*808

Europe, Middle-East and Africa:

+49.89.878067-280

www.gecriticalpower.com

GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no

liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such

product(s) or information.

Ordering Information

Please contact your GE Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes Input Voltage Output

Voltage

Output

Current On/Off Logic Connector

Type Comcodes

EVW010A0B41Z 48V (36-75Vdc) 12V 10A Negative Through hole CC109143203

EVW010A0B64Z 48V (36-75Vdc) 12V 10A Positive Through hole CC109156015

EVW010A0B641Z 48V (36-75Vdc) 12V 10A Negative Through hole CC109158473

EVW010A0B41-HZ 48V (36-75Vdc) 12V 10A Negative Through hole CC109152781

EVW010A0B41-SZ 48V (36-75Vdc) 12V 10A Negative Surface mount CC109153516

Table 2. Device Options and Coding Scheme

Characteristic Character and Position

Definition

Ratings

Form Factor E

E = Eighth Brick

Family Designator V

Input Voltage W

W = Wide Input Voltage Range, 36V -75V

Output Current 010A0

010A0 = 010.0 Amps Rated Output Current

Output Voltage B

B = 12.0 Vout Nominal

Options

Pin Length

Omit = No Pin Trim

6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)

8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)

Action following

Omit = Latching Mode

Protective Shutdown

4 = Auto-restart following shutdown (Overcurrent/Overvoltage)

On/Off logic

Omit = Positive Logic

1 = Negative Logic

Customer Specific

XY = Customer Specific Modified Code, Omit for Standard Code

Mechanical Features

Omit = Standard open Frame Module

H = Heat plate (not available with –S option)

S = Surface mount connections

RoHS

Omit = RoHS 5/6, Lead Based Solder Used

Z = RoHS 6/6 Compliant, Lead free