AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Publication # 43374 Revision: 3.19 Issue Date: June 2010 Advanced Micro Devices (c) 2009, 2010 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. The information contained herein may be of a preliminary or advance nature and is subject to change without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. 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PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table of Contents Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1 Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1.1 Ordering Part Number Description Section Overview . . . . . . . . . . . . . . . . . . 8 1.1.2 Thermal and Power Table Guide Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1.3 Thermal and Power Table Section Overview . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.1.4 Power Supply Specification Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . 9 1.1.5 Power Limit Encoding Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.2 Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.3 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2 AMD OpteronTM Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.1 AMD OpteronTM Processor Ordering Part Number Description . . . . . . . . . . . . . . . . 12 2.2 AMD Opteron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 28 2.3 AMD Opteron Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . . 30 2.3.1 OS mmmm PA pnc GC (79 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 2.3.2 OS mmmm PA pnc GD (79 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 2.3.3 OS mmmm PA pnc GE (79 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2.3.4 OS mmmm WA pnc GC (115 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 2.3.5 OE mmmm FM pnc GD (79 W Embedded Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 2.3.6 OS mmmm WE pnc GD (95 W Server, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 2.3.7 OS mmmm WA pnc GE (115 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 2.3.8 OS mmmm WA pnc GD (115 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 2.3.9 OS mmmm WB pnc GD (115 W Server, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 2.3.10 OS mmmm YA pnc GD (137 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 2.3.11 OS mmmm WA pnc GH (115 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 2.3.12 OS mmmm PA pnc GH (79 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 2.3.13 OS mmmm YA pnc GH (137 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 2.3.14 OS mmmm WB pnc GH (115 W Server, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 2.3.15 OE mmmm FM pnc GH (79 W Embedded Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 2.3.16 OS mmmm WA pnc GI (115 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Contents 3 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet 2.3.17 OS mmmm PA pnc GI (79 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 2.3.18 OS mmmm YA pnc GI (137 W Server, Fr2 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 2.3.19 OS mmmm WH pnc GI (115 W Server, Fr5 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 2.3.20 OS mmmm PC pnc GI (79 W Server, Fr5 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 2.3.21 OS mmmm YC pnc GI (137 W Server, Fr5 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 2.3.22 OS mmmm WG pnc GI (115 W Server, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 2.3.23 OS mmmm NA pnc GI (60 W Server, Fr5 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 2.3.24 OS mmmm WJ pnc GN (115 W Server, Fr6 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 2.3.25 OS mmmm PD pnc GN (79 W Server, Fr6 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 2.3.26 OS mmmm NB pnc GN (60 W Server, Fr6 (1207)) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 2.3.27 OS mmmm WK pnc GO (115 W Server, G34r1) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 2.3.28 OS mmmm VA pnc GO (85 W Server, G34r1) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 2.3.29 OS mmmm YE pnc GO (140 W Server, G34r1) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 2.3.30 OS mmmm WL pnc GO (95 W Server, C32) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 2.3.31 OS mmmm WL pnc GN (95 W Server, C32) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 2.3.32 OS mmmm OF pnc GO (65 W Server, C32) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 2.3.33 OS mmmm HJ pnc GO (35 W Server, C32) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 3 Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 3.1 bsmmmmrr L ncdd - Fr2 (1207) Power Supply Operating Conditions . . . . . . . . . . 81 3.2 bsmmmmrr P ncdd - Fr5 (1207) Power Supply Operating Conditions . . . . . . . . . . . 84 3.3 bsmmmmrr J ncdd - AM2r2 Power Supply Operating Conditions . . . . . . . . . . . . . . 87 3.4 bsmmmmrr K ncdd - AM3 Power Supply Operating Conditions . . . . . . . . . . . . . . . 90 3.5 bsmmmmrr S ncdd - Fr6 (1207) Power Supply Operating Conditions . . . . . . . . . . 93 4 Power Limit Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 5 MTOPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 6 APP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Contents 4 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet List of Figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. AMD OpteronTM Processor Ordering Part Number Diagram . . . . . . . . . . . . . . 12 AMD Opteron Processor Ordering Part Number Example . . . . . . . . . . . . . . . 12 Socket Fr2 (1207) AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . 82 Socket Fr5 (1207) AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . 85 Socket AM2 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Socket AM3 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Socket Fr6 (1207) AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . 94 List of Figures 5 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet List of Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. AMD OpteronTM Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . 13 AMD Opteron Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . 13 AMD Opteron Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AMD Opteron Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 AMD Opteron Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . 14 AMD Opteron Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . . 15 AMD Opteron Processor Segment Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 AMD Opteron Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 AMD Opteron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . 28 bsmmmmrr L ncdd DC Operating Conditions for VDD Power Supply . . . . . . 81 bsmmmmrr L ncdd AC Operating Conditions for VDD Power Supply . . . . . . 81 bsmmmmrr L ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 bsmmmmrr L ncdd AC and DC Operating Conditions for non-VDD Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 bsmmmmrr P ncdd DC Operating Conditions for VDD Power Supply . . . . . 84 bsmmmmrr P ncdd AC Operating Conditions for VDD Power Supply . . . . . 84 bsmmmmrr P ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 bsmmmmrr P ncdd AC and DC Operating Conditions for non-VDD Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply . . . . . 87 bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply . . . . . 87 bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply . . . . . 90 bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply . . . . . 90 bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 bsmmmmrr S ncdd DC Operating Conditions for VDD Power Supply . . . . . 93 bsmmmmrr S ncdd AC Operating Conditions for VDD Power Supply . . . . . 93 bsmmmmrr S ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 bsmmmmrr S ncdd AC and DC Operating Conditions for non-VDD Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Composite Theoretical Performance (CTP) Calculation . . . . . . . . . . . . . . . . . 97 Adjusted Peak Performance (APP) Calculation . . . . . . . . . . . . . . . . . . . . . . . 98 List of Tables 6 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Revision History Date Revision Description June 2010 3.19 Fifth public release. * Added new OPNs. * Added new definitions to Section 1.3 on page 10. * Modified Table 5 on page 14 to differentiate G34 and C32 infrastructures from F and AM infrastructures. * Added Max DDR Speed and Max HT Link Speed to Table 6 on page 15. * Changed IDD Max to TDC and corrected values in the thermal and power specification tables for all Socket G34 and Socket C32 OPNs (existing Section 2.3.27 through Section 2.3.29 and new Section 2.3.30 through Section 2.3.33). March 2010 3.15 Fourth public release. * Added new OPNs. September 2009 3.07 Third public release. * Added OPN. * Updated the Thermal and Power Specifications tables for 115-W and 79-W Fr6 (1207) Server Processors in Section 2.3.24 and Section 2.3.25. * Modified ILDT specs in the Power Supply Specifications section. June 2009 3.04 Second public release. April 2009 3.00 Initial Public release. Revision History 7 PID: 43374 Rev 3.19 - June 2010 1 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Overview This document contains processor thermal specifications and power specifications. The specifications in this document supersede those found in the power roadmaps. For all other electrical specifications, refer to the appropriate product data sheet and the AMD Family 10h Processor Electrical Data Sheet, order# 40014. 1.1 Organization This document is organized into the following sections: * Document overview (Section 1) * One section for each brand represented in the server/workstation segment, containing the following subsections: * Ordering Part Number (OPN) description (content overview in Section 1.1.1) * Thermal and power specification tables (content overview in Section 1.1.3 on page 9) * Power supply specifications (content overview in Section 1.1.4 on page 9) * Power Limit Encoding information (content overview in Section 1.1.5) * MTOPS section in Table 30 on page 97 * APP section in Table 31 on page 98 1.1.1 Ordering Part Number Description Section Overview The Ordering Part Number (OPN) Description section contains a depiction and description of a valid OPN for the brand contained in that chapter. Each character or group of characters within an OPN has a specific meaning (for example, model number, socket compatibility). The meaning of each OPN character is detailed in the OPN description section. Each OPN identifies a processor with a unique thermal and power specification table entry. The OPN description section also contains a full description of the Subsection Ordering Part Number (SOPN) abstraction characters for the brand contained in that chapter. SOPNs are used to group and organize OPNs into subsections for the thermal and power tables and power supply specifications. A definition of SOPNs is contained in Section 1.3 on page 10. 1.1.2 Thermal and Power Table Guide Overview The thermal and power table guide section contains a table mapping SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers. This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN. Overview 8 PID: 43374 Rev 3.19 - June 2010 1.1.3 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Thermal and Power Table Section Overview The thermal and power specification tables contain the thermal and power requirements for each OPN. This includes the information necessary for thermal management (for example, heat sink requirements, ambient temperature assumptions) and power delivery (for example, voltage and current, and power dissipation for each P-state). The thermal and power specification tables are organized into subsections that correspond to Subsection Ordering Part Numbers (SOPNs). SOPNs for the thermal and power tables have the brand, power limit, and part definition characters defined. They are of the form AB mmmmrrpnc GH. Each chapter provides a guide table that maps the SOPNs in the thermal and power tables within that chapter to the appropriate subsection number and page number. Within each subsection the OPNs are sorted by model number, socket compatibility, voltage, temperature, and cache size, respectively. 1.1.4 Power Supply Specification Chapter Overview The power supply specification chapter contains the operating conditions and requirements for all voltage planes required by the processor. Power supply requirements are organized into subsections that correspond to socket infrastructure. The socket infrastructure of a particular OPN can be found in Table 5 on page 14. 1.1.5 Power Limit Encoding Chapter Overview The power limit encoding section defines power encodings and their interpretation. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116, for details. 1.2 Conventions Following are conventions used with numbers. * Binary numbers. Binary numbers are indicated by appending a "b" at the end, for example: 0110b. * Decimal numbers. Unless specified otherwise, all numbers are decimal. * Hexadecimal numbers. Hexadecimal numbers are indicated by appending an "h" to the end, for example: 45F8h. * Underscores in numbers. Underscores are used to break up numbers to make them more readable, for example: 0110_1100b. They do not imply any operation. Overview 9 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet 1.3 Definitions Following are some key definitions. * CPU COF. CPU Current Operating Frequency. * CTP. Composite Theoretical Performance. * Dual-plane. Platforms in which the VDD and VDDNB (Northbridge) planes are isolated on the platform and controlled as separate voltages. * DP. Dual Processor. Each link on DP models supports connections to I/O devices, and any one link or any sub-link can connect to another MP or DP processor. * Max Power. The maximum sustained power dissipated by the processor at nominal voltage and maximum specified case or die temperature. * MP. Multiprocessor. Each link on MP models supports connections to I/O devices or an MP or DP processor. Systems are limited to the number of nodes supported by all the processors. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116, for more details. * MTOPS. Millions Of Theoretical Operations Per Second. * NB COF. Northbridge Current Operating Frequency. * OPN. Ordering Part Number. An OPN uniquely identifies a processor and its associated specifications in the thermal and power tables and power supply specifications section. * P-state. Processor Performance State. P-states are valid combinations of CPU voltage, CPU COF, Northbridge voltage, and NB COF. * Single-plane. Platforms in which all the VDD and VDDNB power planes are connected together on the platform and controlled as a single power plane. * SOPN. Subsection Ordering Part Number. An SOPN is an OPN with a subset of defined characters. All defined characters in an SOPN are bolded and capitalized. All abstracted characters in an SOPN are in non-bolded lowercase. Information for any OPN that matches all of the defined characters in an SOPN is contained in that subsection. For example, OPN AB1234CDE5FGH appears under the subsection for SOPN AB mmmmrrpnc GH. The abstracted (lowercase) character definitions for SOPNs are contained in the OPN description section of each chapter. * State. Indicates the ACPI defined sleep state, power state, and performance state for the related specifications. 'x' indicates the related specifications are independent of the associated ACPI state. For example, S0.C0.P0 indicates sleep state 0, power state 0, and performance state 0. S3.Cx.Px indicates sleep state 3 entered from any power and performance state combination. * TDC. Thermal Design Current. The maximum sustained current that the voltage regulator must support. TDC is defined at nominal voltage and maximum specified case or die temperature. * TDP. Thermal Design Power. The thermal design power is the maximum power a processor can draw for a thermally significant period while running commercially useful software. The constraining conditions for TDP are specified in the notes in the thermal and power tables. * UP. Uniprocessor. Each link on UP models supports connections to I/O devices. Overview 10 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet * VID_VDD. The VID_VDD voltage is the VID-requested VDD supply level. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116, for VID to voltage translation specifications. * VID_VDDNB. The VID_VDDNB voltage is the VID-requested VDD Northbridge supply level. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116, for VID to voltage translation specifications. Overview 11 PID: 43374 Rev 3.19 - June 2010 2 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet AMD OpteronTM Processor The following sections contain the OPN description and thermal and power specifications for the AMD OpteronTM processor. Each column in the thermal and power tables represents a specific Ordering Part Number (OPN). Section 2.1 provides an example of the OPN structure for this processor family. 2.1 AMD OpteronTM Processor Ordering Part Number Description b s mmmm rr p n c dd Part Definition Cache Size Number of Cores Package Roadmap Model Segment Brand Figure 1. AMD OpteronTM Processor Ordering Part Number Diagram O S 8347 PA L 4 BGC Part Definition: GC (see Table 1) Cache Size: B (see Table 2) Number of Cores: 4 (see Table 3) Package: L (see Table 4) Roadmap: PA (see Table 5) Model Number: 8347 (see Table 6) Segment: S = Server (see Table 7) Brand: O = AMD OpteronTM Processor Figure 2. AMD OpteronTM Processor Ordering Part Number Example AMD OpteronTM Processor 12 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 1. AMD OpteronTM Processor Part Definition Options Part Definition Revision CPUID 8000_0001h EAX [31:0] (CPUID) GC Rev B1 00100F21h GE Rev BA 00100F2Ah GD Rev B2 00100F22h GH Rev B3 00100F23h GI Rev C2 00100F42h GN Rev D0 00100F80h GO Rev D1 00100F81h Table 2. AMD OpteronTM Processor Cache Size Options OPN Character L2 Cache Size L3 Cache Size B 512 KB 2048 KB D 512 KB 6144 KB E 512 KB 12288 KB Table 3. AMD OpteronTM Processor Number of Cores OPN Character Number of Cores 4 4 6 6 8 8 C 12 AMD OpteronTM Processor 13 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 4. AMD OpteronTM Processor Package Options OPN Character Package L Fr2 (1207) J AM2r2 K AM3 P Fr5 (1207) S Fr6 (1207) T G34r1 U C32 Table 5. AMD OpteronTM Processor Roadmap Options OPN Character Max TDP Socket Infrastructure IDD Max IDD Max IDD TDC IDD TDC HS Class (VDD) (NB) (VDD) (NB) FM 79 W Fr2 (1207) 60 A 20 A - - HS57 PA 79 W Fr2 (1207) 60 A 20 A - - HS54 WA 115 W Fr2 (1207) 80 A 20 A - - HS65 WB 115 W AM2r2 80 A 20 A - - HS65 WE 95 W AM2r2 80 A 20 A - - HS65 YA 137 W Fr2 (1207) 95 A 20 A - - HS72 WH 115 W Fr5 (1207) 80 A 20 A - - HS65 WG 115 W AM3 95 A 20 A - - HS65 PC 79 W Fr5 (1207) 60 A 20 A - - HS54 YC 137 W Fr5 (1207) 95 A 20 A - - HS72 NA 60 W Fr5 (1207) 50 A 20 A - - HS54 WJ 115 W Fr6 (1207) 80 A 20 A - - HS65 PD 79 W Fr6 (1207) 60 A 20 A - - HS54 NB 60 W Fr6 (1207) 50 A 20 A - - HS54 WK 115 W G34r1 - - 110 A 25 A HS70, HS65 VA 85 W G34r1 - - 80 A 25 A HS65,HS63 YE 140 W G34r1 - - 115 A 25 A HS75,HS72 WL 95 W C32 - - 95 A 20 A HS73,HS65 OF 65 W C32 - - 70 A 20 A HS75,HS72 HJ 35 W C32 - - 44 A 12 A HS63,HS55 AMD OpteronTM Processor 14 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 6. AMD OpteronTM Processor Model Number Options Core Frequency Max HT Single-Plane Dual-Plane UniDualMultiMax DDR Link NB Frequency NB Frequency Processor Processor Processor Speed Speed 1700 MHz 1200 MHz 1400 MHz - 2344 - 800 MT/s 1000 MT/s 1700 MHz 1400 MHz 1600 MHz - 2344 - 800 MT/s 1000 MT/s 1700 MHz 1400 MHz 1600 MHz - 23GF - 800 MT/s 2000 MT/s 1700 MHz N/A 1800 MHz - - 6164 1333 MT/s 6400 MT/s 1700 MHz N/A 1800 MHz - 4162 - 1333 MT/s 6400 MT/s 1800 MHz 1400 MHz 1600 MHz 13HF 23HF 83HF 800 MT/s 2000 MT/s 1800 MHz 1400 MHz 1600 MHz - 2346 8346 800 MT/s 1000 MT/s 1800 MHz N/A 2000 MHz - 2419 - 800 MT/s 4800 MT/s 1800 MHz N/A 1800 MHz - - 6124 1333 MT/s 6400 MT/s 1800 MHz N/A 1800 MHz - 4164 - 1333 MT/s 6400 MT/s 1900 MHz 1400 MHz 1600 MHz - 2347 8347 800 MT/s 1000 MT/s 1900 MHz N/A 1800 MHz - - 6168 1333 MT/s 6400 MT/s 2000 MHz 1400 MHz 1800 MHz - 2350 8350 800 MT/s 1000 MT/s 2000 MHz 1600 MHz 1800 MHz - 2350 8350 800 MT/s 1000 MT/s 2000 MHz N/A 2200 MHz - 2423 - 800 MT/s 4800 MT/s 2000 MHz N/A 1800 MHz - - 1333 MT/s 6400 MT/s 2000 MHz N/A 1800 MHz - - 1333 MT/s 6400 MT/s 2000 MHz N/A 1800 MHz - - 1333 MT/s 6400 MT/s 2100 MHz 1600 MHz 1800 MHz - 2352 - 800 MT/s 2000 MT/s 2100 MHz 1600 MHz 1800 MHz 1352 - - 800 MT/s 3600 MT/s 2100 MHz 1600 MHz 2000 MHz - 2372 800 MT/s 2000 MT/s 2100 MHz 1600 MHz 2000 MHz - 2373 8373 800 MT/s 4000 MT/s 2100 MHz N/A 2200 MHz - 2425 8425 800 MT/s 4800 MT/s 2100 MHz N/A 1800 MHz - - 6172 1333 MT/s 6400 MT/s 2100 MHz N/A 2200 MHz - 4170 - 1333 MT/s 6400 MT/s 2200 MHz 1600 MHz 1800 MHz - 2354 8354 800 MT/s 2000 MT/s 2200 MHz 1600 MHz 1800 MHz 1354 - - 800 MT/s 3600 MT/s 2200 MHz 1600 MHz 2000 MHz - 2374 8374 800 MT/s 2000 MT/s 2200 MHz N/A 2200 MHz - 2427 - 800 MT/s 4800 MT/s 2200 MHz N/A 1800 MHz - - 6174 1333 MT/s 6400 MT/s AMD OpteronTM Processor 6128 15 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 6. AMD OpteronTM Processor Model Number Options (Continued) Core Frequency Max HT Single-Plane Dual-Plane UniDualMultiMax DDR Link NB Frequency NB Frequency Processor Processor Processor Speed Speed 2200 MHz N/A 2200 MHz - 4122 - 1333 MT/s 6400 MT/s 2300 MHz 1600 MHz 2000 MHz - 2376 8376 800 MT/s 2000 MT/s 2300 MHz 1600 MHz 2000 MHz - 2377 - 800 MT/s 4000 MT/s 2300 MHz 1600 MHz 2000 MHz - 2356 8356 800 MT/s 2000 MT/s 2300 MHz 1600 MHz 2000 MHz 1356 - - 800 MT/s 4000 MT/s 2300 MHz N/A 1800 MHz - - 6134 1333 MT/s 6400 MT/s 2300 MHz N/A 1800 MHz - - 6176 1333 MT/s 6400 MT/s 2300 MHz N/A 1800 MHz - - 1333 MT/s 6400 MT/s 2300 MHz N/A 2200 MHz - 4174 - 1333 MT/s 6400 MT/s 2400 MHz 1600 MHz 2000 MHz - 2358 8358 800 MT/s 1000 MT/s 2400 MHz 1600 MHz 2000 MHz - 2378 8378 800 MT/s 2000 MT/s 2400 MHz 1600 MHz 2000 MHz - 2379 8379 800 MT/s 4000 MT/s 2400 MHz N/A 2200 MHz - 2431 8431 800 MT/s 4800 MT/s 2400 MHz N/A 1800 MHz - - 6136 1333 MT/s 6400 MT/s 2400 MHz N/A 2200 MHz - 4176 - 1333 MT/s 6400 MT/s 2500 MHz 1600 MHz 2000 MHz - 2360 8360 800 MT/s 1000 MT/s 2500 MHz 1600 MHz 2000 MHz - 2380 8380 800 MT/s 2000 MT/s 2500 MHz 1600 MHz 2000 MHz - 2381 8381 800 MT/s 4000 Mt/s 2500 MHz 1600 MHz 2200 MHz 1381 - - 1333 MT/s 4400 MT/s 2600 MHz 1600 MHz 2200 MHz - 2382 8382 800 MT/s 2000 MT/s 2600 MHz N/A 2200 MHz - 2435 8435 800 MT/s 4800 MT/s 2600 MHz N/A 2200 MHz - 4130 - 1333 MT/s 6400 MT/s 2600 MHz N/A 2200 MHz - 4180 - 1333 MT/s 6400 MT/s 2700 MHz 1600 MHz 2200 MHz - 2384 8384 800 MT/s 2000 MT/s 2700 MHz 1600 MHz 2200 MHz 1385 - - 1333 MT/s 4400 MT/s 2800 MHz 1600 MHz 2200 MHz - 2386 8386 800 MT/s 2000 MT/s 2800 MHz 1600 MHz 2200 MHz - 2387 8387 800 MT/s 4400 MT/s 2800 MHz 1600 MHz 2200 MHz - 800 MT/s 4400 MT/s 2800 MHz N/A 2200 MHz - 4184 - 1333 MT/s 6400 MT/s 2900 MHz 1600 MHz 2200 MHz - 2389 8389 800 MT/s 4400 MT/s 2900 MHz 1600 MHz 2200 MHz 1389 - - 1333 MT/s 4400 MT/s 3100 MHz 1600 MHz 2200 MHz - 2393 8393 800 MT/s 4400 MT/s AMD OpteronTM Processor 16 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 7. AMD OpteronTM Processor Segment Options OPN Character Segment E Embedded Server S Server AMD OpteronTM Processor 17 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 8. AMD OpteronTM Processor Thermal Profiles Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W A 0.29C/W 42C 0.232C/W 48C HS65 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 56.1C 57.3C 58.4C 59.6C 60.8C 61.9C 63.1C 64.2C 65.4C 66.6C 67.7C 68.9C 70.0C Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 68.0 W B 0.42C/W 42C 0.338C/W 48C HS54 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 56.5C 58.1C 59.8C 61.5C 63.2C 64.9C 66.6C 68.3C 70.0C 71.0C Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part specific power and part specific Tcase Max. AMD OpteronTM Processor 18 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 8: AMD OpteronTM Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W 100.0 W 105.0 W 110.0 W 115.0 W 120.0 W 125.0 W 130.0 W 135.0 W 137.0 W C 0.24C/W 38C 0.197C/W 44C HS72 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.8C 56.8C 57.8C 58.8C 59.8C 60.7C 61.7C 62.7C 63.7C 64.7C 65.7C 66.7C 67.6C 68.6C 69.6C 70.6C 71.0C Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W 100.0 W 105.0 W 110.0 W 115.0 W D 0.29C/W 42C 0.243C/W 48C HS65 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.3C 56.5C 57.7C 58.9C 60.2C 61.4C 62.6C 63.8C 65.0C 66.2C 67.4C 68.7C 69.9C 71.1C 72.3C 73.5C 74.7C 76.0C Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part specific power and part specific Tcase Max. AMD OpteronTM Processor 19 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 8: AMD OpteronTM Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 79.0 W E 0.42C/W 42C 0.354C/W 48C HS54 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.1C 56.9C 58.6C 60.4C 62.2C 63.9C 65.7C 67.5C 69.2C 71.0C 72.8C 74.6C 76.0C Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 79.0 W F 0.39C/W 55C 0.316C/W 61C HS57 Tcase Max 61.0C 62.6C 64.2C 65.7C 67.3C 68.9C 70.5C 72.1C 73.6C 75.2C 76.8C 78.4C 80.0C 81.5C 83.1C 84.7C 86.0C Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part specific power and part specific Tcase Max. AMD OpteronTM Processor 20 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 8: AMD OpteronTM Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W 100.0 W 105.0 W 110.0 W 115.0 W G 0.30C/W 42C 0.252C/W 48C HS65 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.6C 56.8C 58.1C 59.3C 60.6C 61.9C 63.1C 64.4C 65.6C 66.9C 68.2C 69.4C 70.7C 71.9C 73.2C 74.5C 75.7C 77.0C Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 79.0 W H 0.43C/W 42C 0.354C/W 48C HS54 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.1C 56.9C 58.6C 60.4C 62.2C 63.9C 65.7C 67.5C 69.2C 71.0C 72.8C 74.6C 76.0C Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part specific power and part specific Tcase Max. AMD OpteronTM Processor 21 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 8: AMD OpteronTM Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W 100.0 W 105.0 W 110.0 W 115.0 W 120.0 W 125.0 W 130.0 W 135.0 W 137.0 W I 0.25C/W 38C 0.212C/W 44C HS72 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.7C 56.7C 57.8C 58.8C 59.9C 61.0C 62.0C 63.1C 64.1C 65.2C 66.3C 67.3C 68.4C 69.4C 70.5C 71.6C 72.6C 73.0C Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W J 0.43C/W 42C 0.333C/W 48C HS54 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 56.3C 58.0C 59.7C 61.3C 63.0C 64.7C 66.3C 68.0C Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part specific power and part specific Tcase Max. AMD OpteronTM Processor 22 PID: 43374 Rev 3.19 - June 2010 . AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 8: AMD OpteronTM Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W 100.0 W 105.0 W 110.0 W 115.0 W K 0.29C/W 42C 0.243C/W 48C HS65 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.3C 56.5C 57.7C 59.0C 60.2C 61.4C 62.6C 63.8C 65.0C 66.3C 67.5C 68.7C 69.9C 71.1C 72.3C 73.6C 74.8C 76.0C Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W P 0.43C/W 42C 0.333C/W 48C HS54 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 56.3C 58.0C 59.7C 61.3C 63.0C 64.7C 66.3C 68.0C Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part specific power and part specific Tcase Max. AMD OpteronTM Processor 23 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 8: AMD OpteronTM Processor Thermal Profiles (Continued) Q Thermal Profile Profile 1 Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class Max Power 0W 10 W 20 W 30 W 40 W 50 W 60 W 70 W 80 W 90 W 100 W 110 W 120 W 130 W 135 W R Thermal Profile Profile 2 0.20C/W 0.23C/W 42.0C 42.0C 0.156C/W 48.0C HS70 HS65 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 55.8C 57.4C 58.9C 60.5C 62.0C 63.6C 65.2C 66.7C 68.3C 69.0C Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class Max Power 0W 10 W 20 W 30 W 40 W 50 W 60 W 70 W 80 W 90 W 100 W 110 W 120 W 130 W 135 W Profile 1 Profile 2 0.20C/W 0.24C/W 42.0C 42.0C 0.163C/W 48.0C HS70 HS65 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 56.2C 57.8C 59.4C 61.0C 62.7C 64.3C 65.9C 67.6C 69.2C 70.0C Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part specific power and part specific Tcase Max. AMD OpteronTM Processor 24 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 8: AMD OpteronTM Processor Thermal Profiles (Continued) S Thermal Profile Profile 1 Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class Max Power 0W 5W 10 W 15 W 20 W 25 W 30 W 35 W 40 W 45 W 50 W 55 W 60 W 65 W 70 W 75 W 80 W 85 W 90 W 95 W 100 W T Thermal Profile Profile 2 0.23C/W 0.27C/W 42.0C 42.0C 0.170C/W 48.0C HS65 HS63 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.7C 56.5C 57.4C 58.2C 59.1C 59.9C 60.8C 61.6C 62.5C 63.3C 64.2C 65.0C Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class Max Power 0W 5W 10 W 15 W 20 W 25 W 30 W 35 W 40 W 45 W 50 W 55 W 60 W 65 W 70 W 75 W 80 W 85 W 90 W 95 W 100 W Profile 1 Profile 2 0.24C/W 0.28C/W 42.0C 42.0C 0.180C/W 48.0C HS65 HS63 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.2C 56.1C 57.0C 57.9C 58.8C 59.7C 60.6C 61.5C 62.4C 63.3C 64.2C 65.1C 66.0C Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part specific power and part specific Tcase Max. AMD OpteronTM Processor 25 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 8: AMD OpteronTM Processor Thermal Profiles (Continued) V Thermal Profile Profile 1 Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class Max Power 0W 10 W 20 W 30 W 40 W 50 W 60 W 70 W 80 W 90 W 100 W 110 W 120 W 130 W 135 W 140 W 145 W 150 W 155 W 160 W 165 W W Thermal Profile Profile 2 0.15C/W 0.18C/W 38.0C 38.0C 0.121C/W 44.0C HS75 HS72 Tcase Max 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 55.0C 56.1C 57.3C 58.5C 59.7C 60.3C 60.9C 61.5C 62.2C 62.8C 63.4C 64.0C Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class Max Power 0W 10 W 20 W 30 W 40 W 50 W 60 W 70 W 80 W Profile 1 Profile 2 0.34C/W 0.42C/W 42.0C 42.0C 0.275C/W 48.0C HS63 HS55 Tcase Max 55.0C 55.0C 55.0C 56.3C 59.0C 61.8C 64.5C 67.3C 70.0C Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part specific power and part specific Tcase Max. AMD OpteronTM Processor 26 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 8: AMD OpteronTM Processor Thermal Profiles (Continued) Y Thermal Profile Profile 1 Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class Max Power 0W 10 W 20 W 30 W 40 W 50 W 60 W 70 W 80 W 90 W 95 W 100 W 110 W 115 W Z Thermal Profile Profile 2 0.24C/W 0.29C/W 42.0C 42.0C 0.232C/W 48.0C HS73 HS65 Tcase Max 55.0C 55.0C 55.0C 55.0C 57.3C 59.6C 61.9C 64.2C 66.6C 68.9C 70.0C 71.2C 73.5C 75.0C Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient Heatsink Class Max Power 0W 10 W 20 W 30 W 35 W 40 W 43 W Profile 1 Profile 2 0.34C/W 0.42C/W 50.0C 50.0C 0.257C/W 56.0C HS63 HS55 Tcase Max 56.0C 58.6C 61.1C 63.7C 65.0C 66.3C 68.0C Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part specific power and part specific Tcase Max. AMD OpteronTM Processor 27 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet 2.2 AMD OpteronTM Processor Thermal and Power Table Guide The thermal and power table guide shown in Table 9 maps SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers. This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN. Table 9. AMD OpteronTM Processor Thermal and Power Table Guide SOPN Power Revision Thermal/Power Tables OS mmmm PA pnc GC 79 W Rev B1 Section 2.3.1 on page 31 OS mmmm PA pnc GD 79 W Rev B2 Section 2.3.2 on page 33 OS mmmm PA pnc GE 79 W Rev BA Section 2.3.3 on page 34 OS mmmm WA pnc GC 115 W Rev B1 Section 2.3.4 on page 36 OE mmmm FM pnc GD 79 W Rev B2 Section 2.3.5 on page 37 OS mmmm WE pnc GD 95 W Rev B2 Section 2.3.6 on page 38 OS mmmm WA pnc GE 95 W Rev BA Section 2.3.7 on page 39 OS mmmm WA pnc GD 115 W Rev B2 Section 2.3.8 on page 40 OS mmmm WB pnc GD 115 W Rev B2 Section 2.3.9 on page 42 OS mmmm YA pnc GD 137 W Rev B2 Section 2.3.10 on page 43 OS mmmm WA pnc GH 115 W Rev B3 Section 2.3.11 on page 44 OS mmmm PA pnc GH 79 W Rev B3 Section 2.3.12 on page 46 OS mmmm YA pnc GH 137 W Rev B3 Section 2.3.13 on page 48 OS mmmm WB pnc GH 115 W Rev B3 Section 2.3.14 on page 49 OE mmmm FM pnc GH 79 W Rev B3 Section 2.3.15 on page 51 OS mmmm WA pnc GI 115 W Rev C2 Section 2.3.16 on page 52 OS mmmm PA pnc GI 79 W Rev C2 Section 2.3.17 on page 55 OS mmmm YA pnc GI 137 W Rev C2 Section 2.3.18 on page 57 OS mmmm WH pnc GI 115 W Rev C2 Section 2.3.19 on page 58 OS mmmm PC pnc GI 79 W Rev C2 Section 2.3.20 on page 59 OS mmmm YC pnc GI 137 W Rev C2 Section 2.3.21 on page 60 OS mmmm WG pnc GI 115 W Rev C2 Section 2.3.22 on page 61 OS mmmm NA pnc GI 60 W Rev C2 Section 2.3.23 on page 63 OS mmmm WJ pnc GN 115 W Rev D0 Section 2.3.24 on page 64 OS mmmm PD pnc GN 79 W Rev D0 Section 2.3.25 on page 66 OS mmmm NB pnc GN 60 W Rev D0 Section 2.3.26 on page 67 OS mmmm WK pnc GO 115 W Rev D1 Section 2.3.27 on page 68 AMD OpteronTM Processor 28 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 9. AMD OpteronTM Processor Thermal and Power Table Guide (Continued) SOPN Power Revision Thermal/Power Tables OS mmmm VA pnc GO 85 W Rev D1 Section 2.3.28 on page 72 OS mmmm YE pnc GO 140 W Rev D1 Section 2.3.29 on page 74 OS mmmm WL pnc GO 95 W Rev D1 Section 2.3.30 on page 75 OS mmmm WL pnc GN 95 W Rev D0 Section 2.3.31 on page 76 OS mmmm OF pnc GO 65 W Rev D1 Section 2.3.32 on page 77 OS mmmm HJ pnc GO 35 W Rev D1 Section 2.3.33 on page 79 AMD OpteronTM Processor 29 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet 2.3 AMD OpteronTM Processor Thermal and Power Specifications The thermal and power specification tables contain the thermal and power requirements for each OPN. This includes the information necessary for thermal management (for example, heat sink requirements, temperature assumptions) and power delivery (for example, voltage, current, and power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet, order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management BIOS requirements. Section 2.1 on page 12 provides an example of the OPN structure for processors documented in this chapter and Table 9 on page 28 provides a guide to OPN organization in the following subsections. Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and terminology definitions used in these tables. AMD OpteronTM Processor 30 PID: 43374 Rev 3.19 - June 2010 2.3.1 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm PA pnc GC (79 W Server, Fr2 (1207)) Thermal and Power Specifications OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Notes Single Plane Dual Plane o 1 o 55 C to 71 C OS2346PAL4BGC OS8346PAL4BGC Single Plane 2 Thermal Profile Dual Plane o 55 C to 71 oC o Tambient Min 70 C 70 oC 5 oC 5 oC B B Startup P-state 5 S0.C0.P4 S0.C0.P4 HTC P-state 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1200 MHz 1400 MHz 1400 MHz 1600 MHz VID_VDDNB 11 N/A 1.150 V N/A 1.150 V IDDNB Max 12 N/A 9.4 A N/A 9.4 A CPU COF 6 TDP 3,7 66.1 W 68.0 W 66.1 W 68.0 W VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.150 V 54.2 A 47.1 A 54.3 A 47.1 A 1700 MHz 1800 MHz IDD Max 3,10 CPU COF 6 TDP 3,7 63.6 W 65.7 W 61.1 W 63.5 W VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V VID_VDD Max 9 1.150 V 1.125 V 1.150 V 1.125 V IDD Max 3,10 52.1 A 45.0 A 50.2 A 43.0 A CPU COF 6 TDP 3,7 58.5 W 58.3 W 56.1 W 56.3 W VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V VID_VDD Max 9 1.150 V 1.100 V 1.150 V 1.100 V IDD Max 3,10 48.0 A 39.2 A 46.0 A 37.3 A 1600 MHz 1400 MHz 1600 MHz 1400 MHz CPU COF 6 TDP 3,7 53.5 W 54.0 W 51.1 W 52.0 W VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V VID_VDD Max 9 1.150 V 1.075 V 1.150 V 1.075 V 43.9 A 35.2 A 41.9 A 33.3 A 1200 MHz 1200 MHz IDD Max 3,10 CPU COF 6 TDP 3,7 48.7 W 47.5 W 46.6 W 45.6 W VID_VDD Min 9 1.100 V 1.050 V 1.100 V 1.050 V VID_VDD Max 9 1.150 V 1.050 V 1.150 V 1.050 V IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 OS2344PAL4BGC I/O Power 1000 MHz 1000 MHz 3,10 39.8 A 29.8 A 37.8 A 28.0 A 3,10,14 21.5 A 10.1 A 19.1 A 8.1 A 13 6.5 W 6.5 W 6.5 W 6.5 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 31 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS2347PAL4BGC OS8347PAL4BGC OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Specification 8 Notes Single Plane Dual Plane o Tcase Max 1 55 C to 71 oC Tctl Max 2 70 oC 5 oC Tambient Min B Thermal Profile Startup P-state 5 S0.C0.P4 HTC P-state 4 S0.C0.P4 NB COF 6,15 1400 MHz 1600 MHz VID_VDDNB 11 N/A 1.150 V IDDNB Max 12 N/A 8.8 A CPU COF 6 TDP 3,7 66.2 W 68.0 W VID_VDD Min 9 1.100 V 1.100 V VID_VDD Max 9 1.150 V 1.150 V 54.5 A 47.6 A IDD Max 3,10 CPU COF 6 1900 MHz 1700 MHz TDP 3,7 61.2 W 63.5 W VID_VDD Min 9 1.100 V 1.100 V VID_VDD Max 9 1.150 V 1.125 V IDD Max 3,10 50.3 A 43.5 A CPU COF 6 1400 MHz TDP 3,7 53.7 W 54.2 W VID_VDD Min 9 1.100 V 1.075 V VID_VDD Max 9 1.150 V 1.100 V IDD Max 3,10 44.2 A 35.9 A CPU COF 6 TDP 3,7 49.1 W 49.9 W VID_VDD Min 9 1.100 V 1.075 V VID_VDD Max 9 1.150 V 1.075 V 40.1 A 31.9 A IDD Max 3,10 CPU COF 6 1200 MHz 1000 MHz TDP 3,7 44.5 W 43.7 W VID_VDD Min 9 1.100 V 1.050 V VID_VDD Max 9 1.150 V 1.050 V 3,10 36.0 A 26.8 A 3,10,14 16.9 A 6.8 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power 13 6.5 W 6.5 W S3 I/O Power 13 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 32 PID: 43374 Rev 3.19 - June 2010 2.3.2 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm PA pnc GD (79 W Server, Fr2 (1207)) Thermal and Power Specifications OS2346PAL4BGD OS8346PAL4BGD OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Specification 8 Dual-Plane Single-Plane Dual-Plane Tcase Max 1 55 oC to 76 oC 55 oC to 76 oC Tctl Max 2 70 oC 70 oC o 5 C 5 oC E E Tambient Min Thermal Profile Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1400 MHz 1600 MHz 1400 MHz 1600 MHz VID_VDDNB 11,15 N/A 1.125 V N/A 1.125 V IDDNB Max 12 N/A 9.3 A N/A CPU COF 6 1800 MHz 8.9 A 1900 MHz TDP 3,7 76.9 W 77.6 W 77.1 W 77.8 W VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V IDD Max 3,10 63.8 A 56.1 A 64.0 A 56.7 A CPU COF 6 1600 MHz 1700 MHz TDP 3,7 71.8 W 72.4 W 72.0 W 72.7 W VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V IDD Max 3,10 59.2 A 51.5 A 59.4 A 52.1 A CPU COF 6 TDP 3,7 66.6 W 63.3 W 64.2 W 61.2 W VID_VDD Min 9 1.075 V 1.050 V 1.075 V 1.050 V VID_VDD Max 9 1.125 V 1.075 V 1.125 V 1.075 V IDD Max 3,10 54.9 A 44.9 A 52.9 A 43.4 A CPU COF 6 TDP 3,7 61.5 W 55.4 W 59.1 W 53.8 W VID_VDD Min 9 1.075 V 1.025 V 1.075 V 1.025 V VID_VDD Max 9 1.125 V 1.050 V 1.125 V 1.050 V IDD Max 3,10 50.6 A 38.7 A 48.6 A 37.4 A CPU COF 6 1400 MHz 1200 MHz 1000 MHz 1400 MHz 1200 MHz 1000 MHz TDP 3,7 56.3 W 48.7 W 53.9 W 46.9 W VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V VID_VDD Max 9 1.125 V 1.000 V 1.125 V 1.000 V 3,10 46.3 A 33.0 A 44.3 A 31.7 A 3,10,14 25.6 A 10.3 A 23.3 A 9.1 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 Notes Single-Plane OS2347PAL4BGD OS8347PAL4BGD I/O Power 13 7.20 W 7.20 W 7.20 W 7.20 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 33 PID: 43374 Rev 3.19 - June 2010 2.3.3 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm PA pnc GE (79 W Server, Fr2 (1207)) Thermal and Power Specifications OS2344PAL4BGE OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Dual-Plane o o 55 C to 71 C 1 Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 71 oC o Tambient Min 70 C 70 oC 5 oC 5 oC B B Startup P-state 5 S0.C0.P4 S0.C0.P4 HTC P-state 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1200 MHz 1400 MHz 1400 MHz 1600 MHz VID_VDDNB 11 N/A 1.150 V N/A 1.150 V IDDNB Max 12 N/A 9.4 A N/A 9.4 A CPU COF 6 TDP 3,7 66.1 W 68.0 W 66.1 W 68.0 W VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.150 V IDD Max 3,10 54.2 A 47.1 A 54.3 A 47.1 A CPU COF 6 1700 MHz 1600 MHz 1800 MHz 1600 MHz TDP 3,7 63.6 W 65.7 W 61.1 W 63.5 W VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V VID_VDD Max 9 1.150 V 1.125 V 1.150 V 1.125 V IDD Max 3,10 52.1 A 45.0 A 50.2 A 43.0 A CPU COF 6 1400 MHz 1400 MHz TDP 3,7 58.5 W 58.3 W 56.1 W 56.3 W VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V VID_VDD Max 9 1.150 V 1.100 V 1.150 V 1.100 V IDD Max 3,10 48.0 A 39.2 A 46.0 A 37.3 A CPU COF 6 TDP 3,7 53.5 W 54.0 W 51.1 W 52.0 W VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V VID_VDD Max 9 1.150 V 1.075 V 1.150 V 1.075 V IDD Max 3,10 43.9 A 35.2 A 41.9 A 33.3 A CPU COF 6 1200 MHz 1000 MHz 1200 MHz 1000 MHz TDP 3,7 48.7 W 47.5 W 46.6 W 45.6 W VID_VDD Min 9 1.100 V 1.050 V 1.100 V 1.050 V VID_VDD Max 9 1.150 V 1.050 V 1.150 V 1.050 V 3,10 39.8 A 29.8 A 37.8 A 28.0 A 3,10,14 21.5 A 10.1 A 19.1 A 8.1 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 Notes Single-Plane OS2346PAL4BGE OS8346PAL4BGE I/O Power 13 6.5 W 6.5 W 6.5 W 6.5 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 34 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS2347PAL4BGE OS8347PAL4BGE OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Specification 8 Dual-Plane Tcase Max 1 55 C to 71 oC Tctl Max 2 70 oC o 5 oC Tambient Min Thermal Profile B Startup P-state 5 S0.C0.P4 HTC P-state 4 S0.C0.P4 NB COF 6,15 1400 MHz 1600 MHz VID_VDDNB 11 N/A 1.150 V IDDNB Max 12 N/A 8.8 A CPU COF 6 TDP 3,7 66.2 W 68.0 W VID_VDD Min 9 1.100 V 1.100 V VID_VDD Max 9 1.150 V 1.150 V 54.5 A 47.6 A 1900 MHz IDD Max 3,10 CPU COF 6 TDP 3,7 61.2 W 63.5 W VID_VDD Min 9 1.100 V 1.100 V VID_VDD Max 9 1.150 V 1.125 V IDD Max 3,10 50.3 A 43.5 A CPU COF 6 TDP 3,7 53.7 W 54.2 W VID_VDD Min 9 1.100 V 1.075 V VID_VDD Max 9 1.150 V 1.100 V IDD Max 3,10 44.2 A 35.9 A CPU COF 6 TDP 3,7 49.1 W 49.9 W VID_VDD Min 9 1.100 V 1.075 V VID_VDD Max 9 1.150 V 1.075 V 40.1 A 31.9 A 1700 MHz 1400 MHz 1200 MHz IDD Max 3,10 CPU COF 6 TDP 3,7 44.5 W 43.7 W VID_VDD Min 9 1.100 V 1.050 V VID_VDD Max 9 1.150 V 1.050 V 3,10 36.0 A 26.8 A 3,10,14 16.9 A 6.8 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 Notes Single-Plane I/O Power 1000 MHz 13 6.5 W 6.5 W 13 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 35 PID: 43374 Rev 3.19 - June 2010 2.3.4 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WA pnc GC (115 W Server, Fr2 (1207)) Thermal and Power Specifications OS2347WAL4BGC OS8347WAL4BGC OPN State Specification8 Tcase Max Tctl Max S0.C0.Px Notes Single-Plane Dual-Plane o o 55 C to 70 C 1 OS2350WAL4BGC OS8350WAL4BGC Single-Plane 55 C to 70 oC o 2 Tambient Min Thermal Profile Dual-Plane o 70 C 70 oC 5 oC 5 oC A A Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF S0.Cx.Px VID_VDDNB 1400 MHz 1600 MHz 1600 MHz 1800 MHz 11 6,15 N/A 1.200 V N/A 1.200 V IDDNB Max 12 N/A 15.2 A N/A 15.2 A CPU COF 6 TDP 3,7 94.1 W 95.0 W 94.1 W 95.0 W S0.C0.P0 VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V VID_VDD Max 9 1.200 V 1.200 V 1.200 V 1.200 V IDD Max 3,10 76.7 A 65.3 A 76.9 A 65.3 A CPU COF 6 1900 MHz 1700 MHz 2000 MHz 1700 MHz TDP S0.C0.P1 VID_VDD Min 3,7 88.6 W 90.5 W 85.8 W 88.2 W 9 1.100 V 1.100 V 1.100 V 1.100 V VID_VDD Max 9 1.200 V 1.175 V 1.200 V 1.175 V IDD Max 3,10 72.6 A 61.2 A 70.7 A 59.1 A CPU COF 6 1400 MHz 1400 MHz TDP S0.C0.P2 VID_VDD Min 3,7 80.2 W 79.3 W 77.5 W 77.2 W 9 1.100 V 1.075 V 1.100 V 1.075 V VID_VDD Max 9 1.200 V 1.125 V 1.200 V 1.125 V IDD Max 3,10 66.5 A 52.2 A 64.5 A 50.3 A CPU COF 6 TDP 3,7 74.7 W 75.0 W 72.0 W 72.9 W S0.C0.P3 VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V VID_VDD Max 9 1.200 V 1.075 V 1.200 V 1.075 V IDD Max 3,10 62.4 A 48.2 A 60.4 A 46.3 A CPU COF 6 1200 MHz 1000 MHz 1200 MHz 1000 MHz TDP S0.C0.P4 VID_VDD Min 3,7 69.5 W 67.0 W 67.0 W 65.2 W 9 1.100 V 1.050 V 1.100 V 1.050 V VID_VDD Max 9 1.200 V 1.050 V 1.200 V 1.050 V IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 I/O Power 3,10 58.2 A 41.7 A 56.3 A 40.0 A 3,10,14 43.4 A 23.4 A 41.0 A 21.5 A 13 6.5 W 6.5 W 6.5 W 6.5 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 36 PID: 43374 Rev 3.19 - June 2010 2.3.5 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OE mmmm FM pnc GD (79 W Embedded Server, Fr2 (1207)) Thermal and Power Specifications OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Specification 8 Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 86 oC Tctl Max 2 70 oC 5 oC Tambient Min F Thermal Profile Startup P-State 5 S0.C0.P4 HTC P-State 4 S0.C0.P4 NB COF 6,15 1400 MHz 1600 MHz VID_VDDNB 11,15 N/A 1.125 V IDDNB Max 12 N/A CPU COF 6 9.8 A 1700 MHz TDP 3,7 76.7 W 77.4 W VID_VDD Min 9 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V IDD Max 3,10 63.6 A 55.5 A CPU COF 6 1600 MHz TDP 3,7 74.1 W 74.8 W VID_VDD Min 9 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V IDD Max 3,10 61.3 A 53.2 A CPU COF 6 TDP 3,7 69.0 W 66.1 W VID_VDD Min 9 1.075 V 1.050 V VID_VDD Max 9 1.125 V 1.100 V IDD Max 3,10 56.9 A 46.5 A CPU COF 6 TDP 3,7 63.8 W 57.6 W VID_VDD Min 9 1.075 V 1.025 V VID_VDD Max 9 1.125 V 1.050 V IDD Max 3,10 52.6 A 40.1 A CPU COF 6 1400 MHz 1200 MHz 1000 MHz TDP 3,7 58.7 W 50.4 W VID_VDD Min 9 1.075 V 1.000 V VID_VDD Max 9 1.125 V 1.000 V IDD Max 3,10 48.3 A 34.2 A S0.C1.Pmin IDD Max S0 I/O Power S3 OE23GFFML4BGD I/O Power 3,10,14 27.8 A 11.4 A 13 7.2 W 7.2 W 13 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 37 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet 2.3.6 OS mmmm WE pnc GD (95 W Server, AM2r2) Thermal and Power Specifications OP N S ta te S 0.C0.P x S 0.Cx .P x S 0.C0.P 0 S 0.C0.P 1 S 0.C0.P 2 S 0.C0.P 3 S 0.C0.P 4 OS 1354W EJ4BGD S pe cifica tion 8 Note s S ingle -P la ne Tcas e M ax 1 55 C to 70 o C Tctl M ax 2 70 o C 5 oC Tam bient m in A Therm al P rofile S tartup P -S tate 5 S 0.C0.P 4 HTC P -S tate 4 S 0.C0.P 4 NB COF 6,15 1600 M Hz 1800 M Hz V ID_V DDNB 11,15 N/A 1.200 V IDDNB M ax 12 N/A 12.5 A 2200 M Hz CP U COF 6 TDP 3,7 94.3 W 95.0 W V ID_V DD M in 9 1.100 V 1.100 V V ID_V DD M ax 9 1.200 V 1.200 V IDD M ax 3,10 78.1 A 68.6 A CP U COF 6 2000 M Hz TDP 3,7 88.6 W 90.4 W V ID_V DD M in 9 1.100 V 1.100 V V ID_V DD M ax 9 1.200 V 1.150 V IDD M ax 3,10 73.9 A 64.4 A CP U COF 6 1700 M Hz TDP 3,7 79.9 W 78.9 W V ID_V DD M in 9 1.100 V 1.075 V V ID_V DD M ax 9 1.200 V 1.100 V IDD M ax 3,10 67.5 A 55.2 A CP U COF 6 TDP 3,7 72.0 W 68.4 W V ID_V DD M in 9 1.100 V 1.050 V V ID_V DD M ax 9 1.200 V 1.050 V IDD M ax 3,10 61.2 A 46.6 A CP U COF 6 1400 M Hz 1100 M Hz TDP 3,7 64.9 W 62.2 W V ID_V DD M in 9 1.100 V 1.050 V V ID_V DD M ax 9 1.200 V 1.050 V IDD M ax S 0.C1.P m in IDD M ax S0 I/O P ower S3 Dua l-P la ne o I/O P ower 3,10 54.9 A 40.7 A 3,10,14 36.7 A 19.9 A 13 6.50 W 6.50 W 13 350 m W 350 m W The notes for this table are on page 80. AMD OpteronTM Processor 38 PID: 43374 Rev 3.19 - June 2010 2.3.7 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WA pnc GE (115 W Server, Fr2 (1207)) Thermal and Power Specifications OS2347W AL4BGE OS8347W AL4BGE OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Dual-Plane o o 55 C to 70 C 1 Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 70 oC o Tambient Min 70 C 70 oC 5 oC 5 oC A A Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1400 MHz 1600 MHz 1600 MHz 1800 MHz VID_VDDNB 11 N/A 1.200 V N/A 1.200 V IDDNB Max 12 N/A 15.2 A N/A 15.2 A CPU COF 6 TDP 3,7 94.1 W 95.0 W 94.1 W 95.0 W VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V VID_VDD Max 9 1.200 V 1.200 V 1.200 V 1.200 V IDD Max 3,10 76.7 A 65.3 A 76.9 A 65.3 A CPU COF 6 1900 MHz 1700 MHz 2000 MHz 1700 MHz TDP 3,7 88.6 W 90.5 W 85.8 W 88.2 W VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V VID_VDD Max 9 1.200 V 1.175 V 1.200 V 1.175 V IDD Max 3,10 72.6 A 61.2 A 70.7 A 59.1 A CPU COF 6 1400 MHz 1400 MHz TDP 3,7 80.2 W 79.3 W 77.5 W 77.2 W VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V VID_VDD Max 9 1.200 V 1.125 V 1.200 V 1.125 V IDD Max 3,10 66.5 A 52.2 A 64.5 A 50.3 A CPU COF 6 TDP 3,7 74.7 W 75.0 W 72.0 W 72.9 W VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V VID_VDD Max 9 1.200 V 1.075 V 1.200 V 1.075 V IDD Max 3,10 62.4 A 48.2 A 60.4 A 46.3 A CPU COF 6 1200 MHz 1000 MHz 1200 MHz 1000 MHz TDP 3,7 69.5 W 67.0 W 67.0 W 65.2 W VID_VDD Min 9 1.100 V 1.050 V 1.100 V 1.050 V VID_VDD Max 9 1.200 V 1.050 V 1.200 V 1.050 V 3,10 58.2 A 41.7 A 56.3 A 40.0 A 3,10,14 43.4 A 23.4 A 41.0 A 21.5 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 Notes Single-Plane OS2350W AL4BGE OS8350W AL4BGE I/O Power 13 6.5 W 6.5 W 6.5 W 6.5 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 39 PID: 43374 Rev 3.19 - June 2010 2.3.8 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WA pnc GD (115 W Server, Fr2 (1207)) Thermal and Power Specifications OS2350W AL4BGD OS8350W AL4BGD OPN Sta te Spe cifica tion 8 Tcase Max Tctl Max S0.C0.Px S0.Cx .Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Dua l-Pla ne o o 55 C to 76 C 1 Single -Pla ne 2 Thermal Profile Dua l-Pla ne o 55 C to 76 oC o Tambient Min 70 C 70 oC 5 oC 5 oC D D Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 1800 MHz VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 14.4 A N/A CPU COF 6 TDP 3,7 114.1 W 115 W 114.1 W 115 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V 88.6 A 77.9 A 89.0A 78.7 2000 MHz IDD Max 3,10 CPU COF 6 1700 MHz 13.9 A 2100 MHz 1800 MHz TDP 3,7 103.5 W 94.6 W 103.5 W 94.8 W VID_VDD Min 9 1.150 V 1.100 V 1.150 V 1.100 V VID_VDD Max 9 1.250 V 1.200 V 1.250 V 1.200 V IDD Max 3,10 80.5 A 63.2 A 80.9 A 64.1 A CPU COF 6 TDP 3,7 92.8 W 80.5 W 96.4 W 83.4 W VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.100 V 1.250 V 1.150 V IDD Max 3,10 72.9 A 53.3 A 75.8 A 56.6 A CPU COF 6 1400 MHz 1200 MHz 1600 MHz 1300 MHz TDP 3,7 85.7 W 71.7 W 86.2 W 72.1 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 67.8 A 46.2 A 68.2 A 47.2 A CPU COF 6 TDP 3,7 79.2 W 67.0 W 78.1 W 66.2 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V 3,10 62.7 A 41.7 A 61.8 A 41.6 A 3,10,14 43.5 A 18.8 A 40.8 A 17.4 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 Note s Single -Pla ne OS2352W AL4BGD I/O Power 1000 MHz 1050 MHz 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 40 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS2354W AL4BGD OS8354W AL4BGD OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Dual-Plane o o 55 C to 76 C 1 Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 76 oC o Tambient Min 70 C 70 oC 5 oC 5 oC D D Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 2000 MHz VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 13.3 A N/A 13.4 A CPU COF 6 TDP 3,7 114.1 W 115 W 113.3 W 115 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 89.3 A 79.4 A 89.3 A 79.5 A CPU COF 6 2200 MHz 2000 MHz 2300 MHz 2000 MHz TDP 3,7 107.0 W 101.1 W 102.6 W 99.5 W VID_VDD Min 9 1.150 V 1.125 V 1.150 V 1.125 V VID_VDD Max 9 1.250 V 1.175 V 1.250 V 1.150 V IDD Max 3,10 83.9 A 70.5 A 81.6 A 68.9 A CPU COF 6 1700 MHz 1700 MHz TDP 3,7 96.4 W 83.7 W 92.3 W 82.4 W VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.100 V 1.250 V 1.100 V IDD Max 3,10 76.2 A 57.6 A 74.0 A 56.2 A CPU COF 6 TDP 3,7 86.5 W 72.5 W 82.6 W 71.4 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 68.6 A 48.2 A 66.4 A 47.0 A CPU COF 6 1400 MHz 1100 MHz 1400 MHz 1150 MHz TDP 3,7 76.8 W 65.4 W 74.5 W 65.4 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V 3,10 60.9 A 41.5 A 60.0 A 41.4 A 3,10,14 38.0 A 16.0 A 36.0 A 14.6 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 Notes Single-Plane OS2356W AL4BGD OS8356W AL4BGD I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 41 PID: 43374 Rev 3.19 - June 2010 2.3.9 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WB pnc GD (115 W Server, AM2r2) Thermal and Power Specifications OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Notes Single-Plane Dual-Plane o o 55 C to 76 C 1 OS1354W BJ4BGD Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 76 oC o Tambient Min 70 C 70 oC 5 oC 5 oC D D Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 1800 MHz VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 14.0 A N/A 13.4 A CPU COF 6 TDP 3,7 114.1 W 115.0 W 114.1 W 115.0 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 89.8 A 79.5 A 89.8 A 80.0 A CPU COF 6 2100 MHz 1800 MHz 2200 MHz 2000 MHz TDP 3,7 102.8 W 104.8 W 106.6 W 107.9 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 81.4 A 71.0 A 84.5 A 74.3 A CPU COF 6 1600 MHz 1700 MHz TDP 3,7 95.3 W 88.4 W 95.3 W 88.3 W VID_VDD Min 9 1.150 V 1.100 V 1.150 V 1.100 V VID_VDD Max 9 1.250 V 1.200 V 1.250 V 1.175 V IDD Max 3,10 76.1 A 59.8 A 76.5 A 60.5 A CPU COF 6 TDP 3,7 85.0 W 75.2 W 84.9 W 75.5 W VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.125 V 1.250 V 1.125 V IDD Max 3,10 68.1 A 49.5 A 68.5 A 50.5 A CPU COF 6 1300 MHz 1050 MHz 1400 MHz 1100 MHz TDP 3,7 76.5 W 65.3 W 74.7 W 64.4 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V 3,10 61.5 A 41.2 A 60.6 A 41.1 A 3,10,14 39.7 A 17.4 A 37.0 A 19.9 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 OS1352W BJ4BGD I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 42 PID: 43374 Rev 3.19 - June 2010 2.3.10 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm YA pnc GD (137 W Server, Fr2 (1207)) Thermal and Power Specifications OS2358YAL4BGD OS8358YAL4BGD OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Dual-Plane o o 55 C to 71 C 1 Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 71 oC o Tambient Min 70 C 70 oC 5 oC 5 oC C C Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 14.6 A N/A CPU COF 6 TDP 3,7 135.3 W 137 W 135.3 W 137 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 105.0 A 93.5 A 105.0 A 94.3 A CPU COF 6 2400 MHz 2100 MHz 14.1 A 2500 MHz 2200 MHz TDP 3,7 124.6 W 113.3 W 124.6 W 126.3 W VID_VDD Min 9 1.200 V 1.150 V 1.200 V 1.200 V VID_VDD Max 9 1.250 V 1.175 V 1.250 V 1.200 V IDD Max 3,10 97.2 A 78.1 A 97.6 A 86.2 A 1800 MHz CPU COF 6 TDP 3,7 VID_VDD Min 1900 MHz 114 W 94.6 W 114 W 94.7 W 9 1.200 V 1.100 V 1.200 V 1.100 V VID_VDD Max 9 1.250 V 1.100 V 1.250 V 1.100 V IDD Max 3,10 89.2 A 64.3 A 89.6 A 65.3 A 1500 MHz 1600 MHz CPU COF 6 TDP 3,7 103.3 W 77.9 W 103.3 W 78.5 W VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V 81.1 A 51.8 A 81.5 A 53 A IDD Max 3,10 CPU COF 6 1200 MHz 1250 MHz TDP 3,7 92.8 W 70.8 W 91.7 A 70.2 A VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V 3,10 73.0 A 45.1 A 72.1 A 45.1 A 3,10,14 44.1 A 17.5 A 41.5 A 16.3 A IDD Max S0.C1. Pmin IDD Max S0 I/O Power S3 Notes Single-Plane OS2360YAL4BGD OS8360YAL4BGD I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 43 PID: 43374 Rev 3.19 - June 2010 2.3.11 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WA pnc GH (115 W Server, Fr2 (1207)) Thermal and Power Specifications OS2350W AL4BGH OS8350W AL4BGH OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Dual-Plane o o 55 C to 76 C 1 Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 76 oC o Tambient Min 70 C 70 oC 5 oC 5 oC D D Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 1800 MHz VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V IDDNB 12 N/A 14.9 A N/A 14.3 A CPU COF 6 TDP 3,7 114.1 W 115.0 W 114.1 W 115.0 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 88.8 A 77.5 A 89.2 A 78.5 A CPU COF 6 2100 MHz 2000 MHz 1700 MHz 1800 MHz TDP 3,7 102.8 W 104.4 W 102.8 W 104.8 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 80.3 A 69.0 A 80.7 A 70.0 A CPU COF 6 1600 MHz 1400 MHz TDP 3,7 91.5 W 85.0 W 95.3 W 88.6 W VID_VDD Min 9 1.150 V 1.100 V 1.150 V 1.100 V VID_VDD Max 9 1.250 V 1.175 V 1.250 V 1.200 V IDD Max 3,10 72.3 A 55.2 A 75.3 A 58.9 A CPU COF 6 TDP 3,7 84.5 W 74.9 W 85.1 W 75.2 W VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.125 V 1.250 V 1.125 V IDD Max 3,10 66.9 A 47.5 A 67.3 A 48.5 A CPU COF 6 1200 MHz 1300 MHz 1050 MHz 1000 MHz TDP 3,7 77.7 W 66.4 W 76.6 W 65.5 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V 3,10 61.6 A 40.5 A 60.7 A 40.4 A 3,10,14 25.2 A 7.1 A 23.5 A 6.4 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 Notes Single-Plane OS2352W AL4BGH I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 44 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS2354W AL4BGH OS8354W AL4BGH OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Dual-Plane o o 55 C to 76 C 1 Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 76 oC o Tambient Min 70 C 70 oC 5 oC 5 oC D D Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 2000 MHz VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V IDDNB 12 N/A 13.7 A N/A 13.8 A 2200 MHz 2300 MHz CPU COF 6 TDP 3,7 114.1 W 115.0 W 113.2 W 115.0 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 89.3 A 79.1 A 89.5 A 79.2 A CPU COF 6 2000 MHz 2000 MHz TDP 3,7 106.6 W 108.2 W 101.9 W 104.8 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 83.7 A 73.5 A 81.5 A 71.2 A CPU COF 6 1700 MHz 1700 MHz TDP 3,7 95.4 W 88.8 W 91.3 W 86.1 W VID_VDD Min 9 1.150 V 1.100 V 1.150 V 1.100 V VID_VDD Max 9 1.250 V 1.175 V 1.250 V 1.175 V IDD Max 3,10 75.7 A 59.8 A 73.5 A 57.9 A 1400 MHz 1400 MHz CPU COF 6 TDP 3,7 85.2 W 75.6 W 81.1 W 74.2 W VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.125 V 1.250 V 1.100 V IDD Max 3,10 67.8 A 49.5 A 65.5 A 48.1 A CPU COF 6 1100 MHz 1150 MHz TDP 3,7 75.0 W 64.6 W 72.9 W 64.6 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V 3,10 59.8 A 40.3 A 58.8 A 40.1 A 3,10,14 21.9 A 5.7 A 21.0 A 5.0 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 Notes Single-Plane OS2356W AL4BGH OS8356W AL4BGH I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 45 PID: 43374 Rev 3.19 - June 2010 2.3.12 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm PA pnc GH (79 W Server, Fr2 (1207)) Thermal and Power Specifications OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Notes Single-Plane Dual-Plane o o 55 C to 76 C 1 OS2346PAL4BGH OS8346PAL4BGH Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 76 oC o Tambient Min 70 C 70 oC 5 oC 5 oC E E Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1400 MHz 1600 MHz 1400 MHz 1600 MHz VID_VDDNB 11,15 N/A 1.125 V N/A 1.125 V IDDNB Max 12 N/A 10.4 A N/A 9.9 A 1700 MHz CPU COF 6 TDP 3,7 76.8 W 77.5 W 77.0 W 77.7 W VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V IDD Max 3,10 63.6 A 55.0 A 63.8 A 55.7 A CPU COF 6 1800 MHz 1600 MHz 1600 MHz TDP 3,7 74.1 W 74.8 W 71.6 W 72.3 W VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V IDD Max 3,10 61.2 A 52.6 A 59.1 A 50.9 A CPU COF 6 1400 MHz 1400 MHz TDP 3,7 68.7 W 65.9 W 66.2 W 63.1 W VID_VDD Min 9 1.075 V 1.050 V 1.075 V 1.050 V VID_VDD Max 9 1.125 V 1.100 V 1.125 V 1.075 V IDD Max 3,10 56.7 A 45.8 A 54.6 A 44.1 A 1200 MHz CPU COF 6 TDP 3,7 63.3 W 57.4 W 60.9 W 55.1 W VID_VDD Min 9 1.075 V 1.025 V 1.075 V 1.025 V VID_VDD Max 9 1.125 V 1.050 V 1.125 V 1.050 V IDD Max 3,10 52.2 A 39.2 A 50.1 A 37.8 A CPU COF 6 1200 MHz 1000 MHz 1000 MHz TDP 3,7 57.9 W 50.1 W 55.5 W 48.3 W VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V VID_VDD Max 9 1.125 V 1.000 V 1.125 V 1.000 V 3,10 47.7 A 33.2 A 45.7 A 32.0 A 3,10,14 17.0 A 5.1 A 15.7 A 4.5 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 OS2344PAL4BGH I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 46 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS2347PAL4BGH OS8347PAL4BGH OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Dual-Plane o o 55 C to 76 C 1 Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 76 oC o Tambient Min 70 C 70 oC 5 oC 5 oC E E Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1400 MHz 1600 MHz 1400 MHz 1800 MHz VID_VDDNB 11,15 N/A 1.125 V N/A 1.125 V IDDNB Max 12 N/A 9.4 A N/A 9.6 A CPU COF 6 TDP 3,7 77.2 W 78.0 W 77.5 W 78.9 W VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V IDD Max 3,10 64.0 A 56.3 A 64.3 A 57.0 A CPU COF 6 2000 MHz 1900 MHz 1700 MHz 1700 MHz TDP 3,7 71.9 W 72.6 W 69.4 W 70.8 W VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V IDD Max 3,10 59.3 A 51.5 A 57.3 A 49.8 A CPU COF 6 1400 MHz 1400 MHz TDP 3,7 63.8 W 60.9 W 61.3 W 59.4 W VID_VDD Min 9 1.075 V 1.050 V 1.075 V 1.050 V VID_VDD Max 9 1.125 V 1.075 V 1.125 V 1.075 V IDD Max 3,10 52.6 A 42.5 A 50.5 A 41.0 A 1200 MHz CPU COF 6 TDP 3,7 58.4 W 53.4 W 56.0 W 52.1 W VID_VDD Min 9 1.075 V 1.025 V 1.075 V 1.025 V VID_VDD Max 9 1.125 V 1.050 V 1.125 V 1.050 V IDD Max 3,10 48.1 A 36.4 A 46.1 A 35.1 A CPU COF 6 1200 MHz 1000 MHz 1000 MHz TDP 3,7 53.0 W 46.5 W 50.6 W 45.5 W VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V VID_VDD Max 9 1.125 V 1.000 V 1.125 V 1.000 V 3,10 43.6 A 30.7 A 41.6 A 29.5 A 3,10,14 14.3 A 3.8 A 13.6 A 3.1 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 Notes Single-Plane OS2350PAL4BGH OS8350PAL4BGH I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 47 PID: 43374 Rev 3.19 - June 2010 2.3.13 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm YA pnc GH (137 W Server, Fr2 (1207)) Thermal and Power Specifications OS2358YAL4BGH OS8358YAL4BGH OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Dual-Plane o o 55 C to 71 C 1 Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 71 oC o Tambient Min 70 C 70 oC 5 oC 5 oC C C Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 15.0 A N/A 14.5 A 2400 MHz 2500 MHz CPU COF 6 TDP 3,7 135.2 W 137.0 W 135.2 W 137.0 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 105.5 A 93.2 A 106.0 A 94.1 A CPU COF 6 2100 MHz 2200 MHz TDP 3,7 123.9 W 125.7 W 123.9 W 126.1 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 97.0 A 84.7 A 97.5 A 85.6 A CPU COF 6 1800 MHz 1900 MHz TDP 3,7 112.6 W 104.0 W 112.6 W 104.5 W VID_VDD Min 9 1.200 V 1.150 V 1.200 V 1.150 V VID_VDD Max 9 1.250 V 1.175 V 1.250 V 1.175 V IDD Max 3,10 88.5 A 69.6 A 89.0 A 70.6 A 1500 MHz 1600 MHz CPU COF 6 TDP 3,7 101.3 W 85.6 W 101.7 W 86.1 W VID_VDD Min 9 1.200 V 1.125 V 1.200 V 1.100 V VID_VDD Max 9 1.250 V 1.125 V 1.250 V 1.125 V IDD Max 3,10 80.0 A 54.7 A 80.4 A 57.1 A CPU COF 6 1200 MHz 1250 MHz TDP 3,7 91.0 W 70.1 W 89.8 W 69.4 W VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V 3,10 71.5 A 43.9 A 70.5 A 43.9 A 3,10,14 26.1 A 6.4 A 24.5 A 5.8 A IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 Notes Single-Plane OS2360YAL4BGH OS8360YAL4BGH I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 48 PID: 43374 Rev 3.19 - June 2010 2.3.14 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WB pnc GH (115 W Server, AM2r2) Thermal and Power Specifications OPN State Specification 8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Notes Single-Plane Dual-Plane o o 55 C to 76 C 1 OS1354W BJ4BGH Single-Plane 2 Thermal Profile Dual-Plane o 55 C to 76 oC o Tambient Min 70 C 70 oC 5 oC 5 oC D D Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 1800 MHz VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 14.0 A N/A 13.4 A 2100 MHz 2200 MHz CPU COF 6 TDP 3,7 114.1 W 115.0 W 114.1 W 115.0 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V 89.8 A 79.5 A 89.8 A 80.0 A IDD Max 3,10 CPU COF 6 TDP 3,7 102.8 W 104.8 W 106.6 W 107.9 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 81.4 A 71.0 A 84.5 A 74.3 A CPU COF 6 TDP 3,7 95.3 W 88.4 W 95.3 W 88.3 W VID_VDD Min 9 1.150 V 1.100 V 1.150 V 1.100 V VID_VDD Max 9 1.250 V 1.200 V 1.250 V 1.175 V IDD Max 3,10 76.1 A 59.8 A 76.5 A 60.5 A 1800 MHz 1600 MHz 1300 MHz 2000 MHz 1700 MHz CPU COF 6 TDP 3,7 85.0 W 75.2 W 84.9 W 75.5 W VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.125 V 1.250 V 1.125 V 1400 MHz 68.1 A 49.5 A 68.5 A 50.5 A IDD Max 3,10 CPU COF 6 TDP 3,7 76.5 W 65.3 W 74.7 W 64.4 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 OS1352W BJ4BGH I/O Power 1050 MHz 1100 MHz 3,10 61.5 A 41.2 A 60.6 A 41.1 A 3,10,14 39.7 A 17.4 A 37.0 A 29.4 A 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 49 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OPN State S0.C0.Px Specification8 OS1356WBJ4BGH Notes Single-Plane Dual-Plane o Tcase Max 1 55 C to 76 oC Tctl Max 2 70 oC 5 oC Tambient Min D Thermal Profile Startup P-State 5 S0.C0.P4 HTC P-State 4 S0.C0.P4 NB COF S0.Cx.Px VID_VDDNB 6,15 1600 MHz 2000 MHz 11,15 N/A 1.250 V IDDNB Max 12 N/A 13.3 A CPU COF 6 TDP 3,7 113.2 W 115.0 W S0.C0.P0 VID_VDD Min 9 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 89.7 A 80.0 A CPU COF 6 2300 MHz 2000 MHz TDP S0.C0.P1 VID_VDD Min 3,7 101.9 W 104.4 W 9 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 81.7 A 72.0 A CPU COF 6 1700 MHz TDP S0.C0.P2 VID_VDD Min 3,7 90.9 W 85.5 W 9 1.150 V 1.100 V VID_VDD Max 9 1.250 V 1.175 V IDD Max 3,10 73.7 A 58.5 A CPU COF 6 TDP 3,7 80.7 W 73.5 W S0.C0.P3 VID_VDD Min 9 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.100 V IDD Max 3,10 65.7 A 48.7 A CPU COF 6 1400 MHz 1150 MHz TDP S0.C0.P4 VID_VDD Min 3,7 72.4 W 63.8 W 9 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V IDD Max S0.C1.Pmin IDD Max S0 I/O Power S3 I/O Power 3,10 59.0 A 40.7 A 3,10,14 34.2 A 14.2 A 13 7.2 W 7.2 W 13 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 50 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet 2.3.15 OE mmmm FM pnc GH (79 W Embedded Server, Fr2 (1207)) Thermal and Power Specifications OE23GFFML4BGH16 OPN Sta te S0.C0.Px S0.Cx .Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Spe cifica tion 8 Dua l-Pla ne Single -Pla ne Dua l-Pla ne Tcase Max 1 61 oC to 86 o C 61 oC to 86 o C Tctl Max 2 70 oC 70 oC o 5 oC 5 C Tambient Min Thermal Profile F F S0.C0.P4 S0.C0.P4 Startup P-State 5 HTC P-State 4 NB COF 6,15 1400 MHz 1600 MHz 1400 MHz 1600 MHz VID_VDDNB 11,15 N/A 1.125 V N/A 1.125 V IDDNB Max 12 N/A 11.9 A N/A 11.4 A S0.C0.P4 S0.C0.P4 CPU COF 6 TDP 3,7 78.3 W 79.0 W 78.3 W 79.0 W VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V IDD Max 3,10 66.3 A 56.2 A 66.4 A 56.7 A CPU COF 6 1700 MHz 1800 MHz 1600 MHz 1600 MHz TDP 3,7 75.8 W 76.8 W 73.4 W 74.6 W VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V IDD Max 3,10 64.3 A 54.2 A 62.4 A 52.6 A CPU COF 6 TDP 3,7 70.9 W 68.4 W 68.5 W 66.4 W VID_VDD Min 9 1.075 V 1.050 V 1.075 V 1.050 V VID_VDD Max 9 1.125 V 1.100 V 1.125 V 1.075 V IDD Max 3,10 60.2 A 47.5 A 58.3 A 46.1 A CPU COF 6 1400 MHz 1400 MHz 1200 MHz 1200 MHz TDP 3,7 66.0 W 60.8 W 63.6 W 59.0 W VID_VDD Min 9 1.075 V 1.025 V 1.075 V 1.025 V VID_VDD Max 9 1.125 V 1.050 V 1.125 V 1.050 V IDD Max 3,10 56.1 A 41.2 A 54.2 A 39.9 A CPU COF 6 TDP 3,7 61.2 W 53.9 W 59.1 W 52.2 W VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V VID_VDD Max 9 1.125 V 1.000 V 1.125 V 1.000 V 34.1 A IDD Max S0.C1.Pm in IDD Max S0 I/O Power S3 Note s Single -Pla ne OE13HFFML4BGH16 OE23HFFML4BGH OE83HFFML4BGH I/O Power 1000 MHz 1000 MHz 3,10 52.1 A 35.3 A 50.1 A 3,10,14 21.3 A 7.1 A 20.0 A 6.5 A 13 7.2 W 7.2 W 7.2 W 7.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 51 PID: 43374 Rev 3.19 - June 2010 2.3.16 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WA pnc GI (115 W Server, Fr2 (1207)) Thermal and Power Specifications OS2384WAL4DGI OS8384WAL4DGI OPN State Specification8 Tcase Max S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin 1 Single-Plane Dual-Plane o o 55 C to 77 C Single-Plane Dual-Plane o 55 C to 77 oC 70 C 70 oC Tambient Min 5 oC 5 oC Thermal Profile G G Tctl Max S0.C0.Px Notes OS2382WAL4DGI OS8382WAL4DGI o 2 Startup P-State 5 S0.C0.P3 S0.C0.P3 HTC P-State 4 S0.C0.P3 S0.C0.P3 NB COF 6,15 1600 MHz 2200 MHz 1600 MHz 2200 MHz VID_VDDNB Min 11,15 N/A 1.150 V N/A 1.150 V VID_VDDNB Max 11,15 N/A 1.300 V N/A 1.300 V IDDNB Max 12 N/A 20.0 A N/A 20.0 A CPU COF 6 TDP 3,7 115.0 W 115.0 W 115.0 W 115.0 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V IDD Max 3,10 90.0 A 72.7 A 90.0 A 72.2 A CPU COF 6 2600 MHz 2700 MHz 1900 MHz 2000 MHz TDP 3,7 100.4 W 84.8 W 100.4 W 84.7 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V IDD Max 3,10 79.9 A 50.1 A 79.9 A 49.6 A 1400 MHz CPU COF 6 TDP 3,7 92.1 W 66.1 W 92.1 W 65.8 W VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V VID_VDD Max 9 1.150 V 1.125 V 1.150 V 1.125 V IDD Max 3,10 72.7 A 35.1 A 72.7 A 34.5 A CPU COF 6 TDP 3,7 80.5 W 51.1 W 82.2 W 53.1 W VID_VDD Min 9 1.150 V 0.850 V 1.150 V 0.875 V VID_VDD Max 9 1.150 V 1.025 V 1.150 V 1.050 V IDD Max 3,10 62.6 A 21.4 A 64.1 A 23.2 A IDD Max (Pre-Flush) 3,10,17 33.7 A 6.4 A 34.0 A 7.0 A IDD Max (Post-Flush) 3,10,17 31.1 A 4.6 A 31.5 A 5.2 A 1500 MHz 800 MHz 800 MHz S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80 AMD OpteronTM Processor 52 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS2380WAL4DGI OS8380WAL4DGI OPN State Specification8 Tcase Max S0.Cx.Px 1 Dual-Plane o o 55 C to 77 C Single-Plane Dual-Plane o 55 C to 77 oC 70 C 70 oC Tambient Min 5 oC 5 oC Thermal Profile G G Tctl Max S0.C0.Px Notes Single-Plane OS2378WAL4DGI OS8378WAL4DGI o 2 Startup P-State 5 S0.C0.P3 S0.C0.P3 HTC P-State 4 S0.C0.P3 S0.C0.P3 NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,15 N/A 1.150 V N/A 1.150 V VID_VDDNB Max 11,15 N/A 1.300 V N/A 1.300 V IDDNB Max 12 N/A 20.0 A N/A 20.0 A CPU COF 6 2500 MHz 2400 MHz TDP S0.C0.P0 VID_VDD Min 3,7 115.0 W 115.0 W 115.0 W 115.0 W 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V IDD Max 3,10 90.0 A 71.8 A 90.0 A 71.4 A CPU COF 6 1800 MHz 1700 MHz TDP S0.C0.P1 VID_VDD Min 3,7 100.4 W 84.4 W 100.4 W 83.8 W 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V IDD Max 3,10 79.9 A 49.0 A 79.9 A 48.5 A 1300 MHz 1200 MHz CPU COF 6 TDP 3,7 92.1 W 65.5 W 92.1 W 64.6 W S0.C0.P2 VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V VID_VDD Max 9 1.150 V 1.125 V 1.150 V 1.125 V IDD Max 3,10 72.7 A 33.9 A 72.7 A 33.3 A CPU COF 6 TDP 3,7 83.8 W 53.9 W 85.5 W 57.6 W S0.C0.P3 VID_VDD Min 9 1.150 V 0.875 V 1.150 V 0.900 V VID_VDD Max 9 1.150 V 1.050 V 1.150 V 1.075 V IDD Max 3,10 65.5 A 23.7 A 67.0 A 25.6 A IDD Max (Pre-Flush) 3,10,17 34.4 A 7.2 A 35.2 A 8.2 A IDD Max (Post-Flush) 3,10,17 31.8 A 5.4 A 32.7 A 6.1 A S0.C1.Pmin 800 MHz 800 MHz S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 53 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OPN State S0.C0.Px S0.Cx.Px Specification8 OS2376WAL4DGI Notes Single-Plane Dual-Plane o Tcase Max 1 55 C to 77 oC Tctl Max 2 70 oC 5 oC Tambient Min G Thermal Profile Startup P-State 5 S0.C0.P3 HTC P-State 4 S0.C0.P3 NB COF 6,15 1600 MHz 2000 MHz VID_VDDNB Min 11,15 N/A 1.150 V VID_VDDNB Max 11,15 N/A 1.300 V IDDNB Max 12 N/A 20.0 A CPU COF 6 2300 MHz TDP S0.C0.P0 VID_VDD Min 3,7 115.0 W 115.0 W 9 1.150 V 1.150 V VID_VDD Max 9 1.325 V 1.325 V IDD Max 3,10 90.0 A 71.0 A CPU COF 6 1600 MHz TDP S0.C0.P1 VID_VDD Min 3,7 99.7 W 83.5 W 9 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 79.3 A 47.9 A 1100 MHz CPU COF 6 TDP 3,7 91.4 W 64.2 W S0.C0.P2 VID_VDD Min 9 1.150 V 1.000 V VID_VDD Max 9 1.175 V 1.175 V IDD Max 3,10 72.1 A 32.7 A CPU COF 6 TDP 3,7 86.4 W 58.4 W S0.C0.P3 VID_VDD Min 9 1.150 V 0.900 V VID_VDD Max 9 1.150 V 1.075 V IDD Max 3,10 67.8 A 27.5 A IDD Max (Pre-Flush) 3,10,17 35.7 A 8.9 A IDD Max (Post-Flush) 3,10,17 33.1 A 6.8 A S0.C1.Pmin 800 MHz S0 I/O Power 13 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 54 PID: 43374 Rev 3.19 - June 2010 2.3.17 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm PA pnc GI (79 W Server, Fr2 (1207)) Thermal and Power Specifications OS2372PAL4DGI OPN State Specification8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px Notes Single-Plane Dual-Plane o o 55 C to 76 C 1 OS2374PAL4DGI OS8374PAL4DGI Single-Plane 55 C to 76 oC o 2 Tambient Min Thermal Profile Dual-Plane o 70 C 70 oC 5 oC 5 oC H H Startup P-State 5 S0.C0.P3 S0.C0.P3 HTC P-State 4 S0.C0.P3 S0.C0.P3 NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,15 N/A 1.150 V N/A 1.150 V VID_VDDNB Max 11,15 N/A 1.200 V N/A 1.200 V IDDNB Max 12 N/A 13.4 A N/A 12.9 A CPU COF 6 2100 MHz 2200 MHz TDP S0.C0.P0 VID_VDD Min 3,7 79.0 W 79.0 W 79.0 W 79.0 W 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V IDD Max 3,10 60.3 A 48.8 A 60.0 A 49.1 A CPU COF 6 1600 MHz 1700 MHz TDP S0.C0.P1 VID_VDD Min 3,7 69.6 W 61.8 W 69.2 W 61.9 W 9 1.150 V 1.075 V 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 53.1 A 35.9 A 52.8 A 36.2 A 1400 MHz 1300 MHz CPU COF 6 TDP 3,7 64.6 W 51.1 W 64.2 W 51.2 W S0.C0.P2 VID_VDD Min 9 1.150 V 1.000 V 1.150 V 1.000 V VID_VDD Max 9 1.175 V 1.175 V 1.175 V 1.175 V IDD Max 3,10 48.8 A 27.5 A 48.5 A 27.9 A CPU COF 6 TDP 3,7 56.3 W 40.9 W 54.3 W 39.9 W S0.C0.P3 VID_VDD Min 9 1.150 V 0.925 V 1.150 V 0.925 V VID_VDD Max 9 1.150 V 1.100 V 1.150 V 1.100 V IDD Max 3,10 41.6 A 18.4 A 39.8 A 17.7 A IDD Max (Pre-Flush) 3,10,17 21.0 A 5.3 A 20.2 A 5.1 A IDD Max (Post-Flush) 3,10,17 18.4 A 3.3 A 17.6 A 3.0 A S0.C1.Pmin 800 MHz 800 MHz S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 55 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS2376PAL4DGI OS8376PAL4DGI OPN State S0.C0.Px S0.Cx.Px Specification8 Notes Single-Plane Dual-Plane o Tcase Max 1 55 C to 76 oC Tctl Max 2 70 oC 5 oC Tambient Min H Thermal Profile Startup P-State 5 S0.C0.P3 HTC P-State 4 S0.C0.P3 NB COF 6,15 1600 MHz 2000 MHz VID_VDDNB Min 11,15 N/A 1.150 V VID_VDDNB Max 11,15 N/A 1.200 V IDDNB Max 12 N/A 12.5 A CPU COF 6 2300 MHz TDP S0.C0.P0 VID_VDD Min 3,7 79.0 W 79.0 W 9 1.150 V 1.150 V VID_VDD Max 9 1.325 V 1.325 V IDD Max 3,10 60.3 A 49.7 A CPU COF 6 1800 MHz TDP S0.C0.P1 VID_VDD Min 3,7 69.6 W 62.0 W 9 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 53.1 A 36.9 A CPU COF 6 TDP 3,7 64.6 W 51.2 W S0.C0.P2 VID_VDD Min 9 1.150 V 1.000 V VID_VDD Max 9 1.175 V 1.175 V IDD Max 3,10 48.8 A 28.6 A CPU COF 6 TDP 3,7 53.0 W 37.7 W S0.C0.P3 VID_VDD Min 9 1.150 V 0.900 V VID_VDD Max 9 1.150 V 1.075 V IDD Max 3,10 38.7 A 16.4 A IDD Max (Pre-Flush) 3,10,17 19.4 A 4.6 A IDD Max (Post-Flush) 3,10,17 16.7 A 2.6 A S0.C1.Pmin 1500 MHz 800 MHz S0 I/O Power 13 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 56 PID: 43374 Rev 3.19 - June 2010 2.3.18 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm YA pnc GI (137 W Server, Fr2 (1207)) Thermal and Power Specifications OS2386YAL4DGI OS8386YAL4DGI OPN State S0.C0.Px S0.Cx.Px Specification8 Notes Single-Plane Dual-Plane o Tcase Max 1 55 C to 73 oC Tctl Max 2 70 oC 5 oC Tambient Min I Thermal Profile Startup P-State 5 S0.C0.P3 HTC P-State 4 S0.C0.P3 NB COF 6,15 1600 MHz 2200 MHz VID_VDDNB Min 11,15 N/A 1.150 V VID_VDDNB Max 11,15 N/A 1.300 V IDDNB Max 12 N/A 20.0 A CPU COF 6 TDP S0.C0.P0 VID_VDD Min VID_VDD Max 2800 MHz 3,7 137 W 137 W 9 1.225 V 1.225 V 9 1.325 V 1.325 V IDD Max 3,10 102.8 A 82.9 A CPU COF 6 2100 MHz TDP S0.C0.P1 VID_VDD Min 3,7 96.4 W 99.5 W 9 1.150 V 1.125 V VID_VDD Max 9 1.225 V 1.225 V IDD Max 3,10 76.4 A 57.4 A CPU COF 6 TDP 3,7 88.1 W 76.0 W S0.C0.P2 VID_VDD Min 9 1.150 V 1.025 V VID_VDD Max 9 1.150 V 1.125 V IDD Max 3,10 69.2 A 40.4 A CPU COF 6 TDP 3,7 74.9 W 56.0 W S0.C0.P3 VID_VDD Min 9 1.150 V 0.925 V VID_VDD Max 9 1.150 V 1.025 V IDD Max 3,10 57.7 A 24.0 A IDD Max (Pre-Flush) 3,10,17 36.2 A 7.5 A IDD Max (Post-Flush) 3,10,17 33.6 A 5.5 A S0.C1.Pmin 1600 MHz 800 MHz S0 I/O Power 13 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 57 PID: 43374 Rev 3.19 - June 2010 2.3.19 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WH pnc GI (115 W Server, Fr5 (1207)) Thermal and Power Specifications OS2387WHP4DGI OS8387WHP4DGI OPN State Specification8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px Notes Single-Plane Dual-Plane o o 55 C to 77 C 1 OS2389WHP4DGI OS8389WHP4DGI Single-Plane 55 C to 77 oC o 2 Tambient Min Thermal Profile Dual-Plane o 70 C 70 oC 5 oC 5 oC G G Startup P-State 5 S0.C0.P3 S0.C0.P3 HTC P-State 4 S0.C0.P3 S0.C0.P3 NB COF 6,15 1600 MHz 2200 MHz 1600 MHz 2200 MHz VID_VDDNB Min 11,15 N/A 1.150 V N/A 1.150 V VID_VDDNB Max 11,15 N/A 1.200 V N/A 1.200 V IDDNB Max 12 N/A 20.0 A N/A 20.0 A CPU COF 6 2800 MHz 2900 MHz TDP S0.C0.P0 VID_VDD Min 3,7 115.0 W 115.0 W 115.0 W 115.0 W 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V IDD Max 3,10 90.0 A 73.1 A 90.0 A 73.5 A CPU COF 6 2100 MHz 2300 MHz TDP S0.C0.P1 VID_VDD Min 3,7 100.4 W 84.5 W 102.1 W 86.2 W 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V IDD Max 3,10 79.9 A 50.7 A 81.4 A 52.5 A 1600 MHz 1700 MHz CPU COF 6 TDP 3,7 92.1 W 65.3 W 92.1 W 66.0 W S0.C0.P2 VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V VID_VDD Max 9 1.150 V 1.125 V 1.150 V 1.125 V IDD Max 3,10 72.7 A 35.7 A 72.7 A 36.3 A CPU COF 6 TDP 3,7 78.9 W 49.4 W 77.2 W 48.1 W S0.C0.P3 VID_VDD Min 9 1.150 V 0.850 V 1.150 V 0.825 V VID_VDD Max 9 1.150 V 1.025 V 1.150 V 1.000 V IDD Max 3,10 61.2 A 21.0 A 59.8 A 19.6 A IDD Max (Pre-Flush) 3,10,17 33.2 A 6.2 A 32.4 A 5.6 A IDD Max (Post-Flush) 3,10,17 30.6 A 4.5 A 29.8 A 3.9 A S0.C1.Pmin 800 MHz 800 MHz S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 58 PID: 43374 Rev 3.19 - June 2010 2.3.20 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm PC pnc GI (79 W Server, Fr5 (1207)) Thermal and Power Specifications OS2379PCP4DGI OS8379PCP4DGI OPN State Specification8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px Notes Single-Plane Dual-Plane o o 55 C to 76 C 1 OS2381PCP4DGI OS8381PCP4DGI Single-Plane 55 C to 76 oC o 2 Tambient Min Thermal Profile Dual-Plane o 70 C 70 oC 5 oC 5 oC H H Startup P-State 5 S0.C0.P3 S0.C0.P3 HTC P-State 4 S0.C0.P3 S0.C0.P3 NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,15 N/A 1.100 V N/A 1.100 V VID_VDDNB Max 11,15 N/A 1.150 V N/A 1.150 V IDDNB Max 12 N/A 11.2 A N/A 10.8 A CPU COF 6 2500 MHz 2400 MHz TDP S0.C0.P0 VID_VDD Min 3,7 79.0 W 79.0 W 79.0 W 79.0 W 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V IDD Max 3,10 61.3 A 50.8 A 61.3 A 51.2 A CPU COF 6 2100 MHz 1900 MHz TDP S0.C0.P1 VID_VDD Min 3,7 70.7 W 61.6 W 72.4 W 63.1 W 9 1.150 V 1.075 V 1.150 V 1.075 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 54.1 A 37.9 A 55.5 A 39.8 A 1700 MHz 1500 MHz CPU COF 6 TDP 3,7 64.1 W 49.4 W 65.7 W 50.6 W S0.C0.P2 VID_VDD Min 9 1.150 V 1.000 V 1.150 V 1.000 V VID_VDD Max 9 1.175 V 1.175 V 1.175 V 1.175 V IDD Max 3,10 48.3 A 28.4 A 49.8 A 30.2 A CPU COF 6 TDP 3,7 52.5 W 34.6 W 50.8 W 32.7 W S0.C0.P3 VID_VDD Min 9 1.150 V 0.875 V 1.150 V 0.850 V VID_VDD Max 9 1.150 V 1.050 V 1.150 V 1.025 V IDD Max 3,10 38.3 A 20.4 A 36.8 A 18.8 A IDD Max (Pre-Flush) 3,10,17 18.4 A 4.2 A 17.6 A 3.8 A IDD Max (Post-Flush) 3,10,17 15.8 A 2.3 A 15.0 A 2.0 A S0.C1.Pmin 800 MHz 800 MHz S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 59 PID: 43374 Rev 3.19 - June 2010 2.3.21 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm YC pnc GI (137 W Server, Fr5 (1207)) Thermal and Power Specifications OS2393YCP4DGI OS8393YCP4DGI OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Specification8 Notes Single-Plane Dual-Plane o Tcase Max 1 55 C to 73 oC Tctl Max 2 70 oC 5 oC Tambient Min Thermal Profile I Startup P-State 5 S0.C0.P3 HTC P-State 4 S0.C0.P3 NB COF 6,15 1600 MHz 2200 MHz VID_VDDNB Min 11,15 N/A 1.150 V VID_VDDNB Max 11,15 N/A 1.200 V IDDNB Max 12 N/A 19.6 A CPU COF 6 TDP 3,7 137.0 W 137.0 W VID_VDD Min 9 1.225 V 1.225 V VID_VDD Max 9 1.325 V 1.325 V IDD Max 3,10 104.9 A 85.5 A CPU COF 6 TDP 3,7 99.4 W 99.7 W VID_VDD Min 9 1.150 V 1.125 V VID_VDD Max 9 1.225 V 1.225 V IDD Max 3,10 79.0 A 60.2 A CPU COF 6 TDP 3,7 91.1 W 76.2 W VID_VDD Min 9 1.150 V 1.025 V VID_VDD Max 9 1.150 V 1.125 V IDD Max 3,10 71.8 A 43.1 A CPU COF 6 TDP 3,7 72.9 W 48.6 W VID_VDD Min 9 1.150 V 0.850 V VID_VDD Max 9 1.150 V 0.950 V IDD Max 3,10 56.0 A 19.6 A IDD Max (Pre-Flush) 3,10,17 36.2 A 7.5 A IDD Max (Post-Flush) 3,10,17 33.6 A 5.5 A 3100 MHz 2400 MHz 1900 MHz 800 MHz S0 I/O Power 13 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 60 PID: 43374 Rev 3.19 - June 2010 2.3.22 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WG pnc GI (115 W Server, AM3) Thermal and Power Specifications OPN State Specification8 Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin OS1381WGK4DGI Notes Single-Plane 1 Dual-Plane o o 55 C to 77 C OS1385WGK4DGI Single-Plane 55 C to 77 oC o 2 Tambient Min Thermal Profile Dual-Plane o 70 C 70 oC 5 oC 5 oC G G Startup P-State 5 S0.C0.P3 S0.C0.P3 HTC P-State 4 S0.C0.P3 S0.C0.P3 NB COF 6,15 1600 MHz 2200 MHz 1600 MHz 2200 MHz VID_VDDNB Min 11,15 N/A 1.150 V N/A 1.150 V VID_VDDNB Max 11,15 N/A 1.200 V N/A 1.200 V IDDNB Max 12 N/A 20.0 A N/A 20.0 A CPU COF 6 TDP 3,7 VID_VDD Min VID_VDD Max IDD Max 3,10 CPU COF 6 2500 MHz 2700 MHz 115 W 115 W 115 W 115 W 9 1.150 V 1.150 V 1.150V 1.150V 9 1.325 V 1.325 V 1.325V 1.325V 92.2 A 73.4 A 92.7 A 74.4 A 2000 MHz 1800 MHz TDP 3,7 76.0 W 83.1 W 76.8 W 83.8 W VID_VDD Min 9 1.050 V 1.050 V 1.050V 1.050V VID_VDD Max 9 1.225 V 1.225 V 1.225V 1.225V IDD Max 3,10 64.2 A 50.1 A 65.2 A 51.4 A CPU COF 6 TDP 3,7 66.4 W 63.4 W 68.5 W 64.4 W VID_VDD Min 9 1.050V 0.950V 1.050V 0.950V VID_VDD Max 9 1.125V 1.125V 1.125V 1.125V IDD Max 3,10 56.8 A 34.7 A 58.8 A 36.1 A CPU COF 6 TDP 3,7 59.7 W 51.4 W 59.1 W 48.9 W VID_VDD Min 9 1.050V 0.875V 1.050V 0.850V VID_VDD Max 9 1.050V 1.050V 1.050V 1.025V IDD Max 3,10 50.4 A 24.1 A 49.9 A 22.2 A IDD Max (Pre-Flush) 3,10,17 29.9 A 7.4 A 29.6 A 6.6 A IDD Max (Post-Flush) 3,10,17 27.6 A 5.5 A 27.3 A 4.9 A 1300 MHz 1500 MHz 800 MHz 800 MHz S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 61 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin OS1389WGK4DGI Specification8 Notes Single-Plane Dual-Plane o Tcase Max 1 55 C to 77 oC Tctl Max 2 70 oC 5 oC Tambient Min G Thermal Profile Startup P-State 5 S0.C0.P3 HTC P-State 4 S0.C0.P3 NB COF 6,15 1600 MHz 2200 MHz VID_VDDNB Min 11,15 N/A 1.150 V VID_VDDNB Max 11,15 N/A 1.200 V IDDNB Max 12 N/A 20.0 A CPU COF 6 TDP 3,7 VID_VDD Min VID_VDD Max IDD Max 3,10 CPU COF 6 TDP 3,7 80.0 W 85.5 W VID_VDD Min 9 1.050 V 1.050 V VID_VDD Max 9 1.225 V 1.225 V IDD Max 3,10 67.0 A 53.8 A CPU COF 6 TDP 3,7 69.0 W 64.7 W VID_VDD Min 9 1.050V 0.950V VID_VDD Max 9 1.125V 1.125V IDD Max 3,10 59.3 A 37.2 A CPU COF 6 TDP 3,7 57.0 W 46.3 W VID_VDD Min 9 1.050V 0.825V VID_VDD Max 9 1.050V 1.000V IDD Max 3,10 47.9 A 20.3 A IDD Max (Pre-Flush) 3,10,17 28.6 A 5.8 A IDD Max (Post-Flush) 3,10,17 26.3 A 4.2 A 2900 MHz 115 W 115 W 9 1.150 V 1.150 V 9 1.325 V 1.325 V 92.7 A 75.2 A 2300 MHz 1700 MHz 800 MHz S0 I/O Power 13 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 62 PID: 43374 Rev 3.19 - June 2010 2.3.23 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm NA pnc GI (60 W Server, Fr5 (1207)) Thermal and Power Specifications OS2373NAP4DGI OS8373NAP4DGI OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 S0.C1.Pmin Specification8 Notes Single-Plane Dual-Plane OS2377NAP4DGI Single-Plane Dual-Plane Tcase Max 1 55 oC to 68 oC 55 oC to 68 oC Tctl Max 2 70 oC 70 oC 5 oC 5 oC Tambient Min Thermal Profile J J S0.C0.P4 S0.C0.P4 Startup P-State 5 HTC P-State 4 NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,15 N/A 1.075 V N/A 1.075 V VID_VDDNB Max 11,15 N/A 1.075 V N/A 1.075 V IDDNB Max 12 N/A 7.7 A N/A 7.7 A CPU COF 6 TDP 3,7 57.2 W 60.0 W 59.6 W 60.0 W VID_VDD Min 9 1.075 V 1.050 V 1.075 V 1.050 V VID_VDD Max 9 1.100 V 1.100 V 1.100 V 1.100 V IDD Max 3,10 44.3 A 37.1 A 46.4 A 39.4 A CPU COF 6 TDP 3,7 51.4 W 52.3 W 54.2 W 54.6 W VID_VDD Min 9 1.075 V 1.025 V 1.075 V 1.025 V VID_VDD Max 9 1.075 V 1.075 V 1.075 V 1.075 V IDD Max 3,10 39.9 A 33.0 A 42.5 A 35.3 A CPU COF 6 S0.C0.P4 S0.C0.P4 2300 MHz 2100 MHz 1900 MHz 2100 MHz 1700 MHz 1900 MHz TDP 3,7 48.5 W 47.4 W 51.4 W 49.6 W VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V VID_VDD Max 9 1.075 V 1.050 V 1.075 V 1.050 V IDD Max 3,10 37.2 A 29.2 A 39.9 A 31.4 A CPU COF 6 1500 MHz 1700 MHz TDP 3,7 45.7 W 43.0 W 48.5 W 45.0 W VID_VDD Min 9 1.075 V 0.975 V 1.075 V 0.975 V VID_VDD Max 9 1.075 V 1.025 V 1.075 V 1.025 V IDD Max 3,10 34.6 A 25.6 A 37.2 A 27.7 A CPU COF 6 800 MHz 800 MHz TDP 3,7 35.8 W 28.9 W 35.8 W 28.5 W VID_VDD Min 9 1.075 V 0.850 V 1.075 V 0.850 V VID_VDD Max 9 1.075 V 0.900 V 1.075 V 0.900 V IDD Max 3,10 25.4 A 13.4 A 25.4 A 13.2 A IDD Max (Pre-Flush) 3,10,17 11.9 A 3.5 A 11.9 A 3.4 A 9.4 A 1.5 A 9.4 A 1.4 A IDD Max (Post-Flush) 3,10,17 S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 63 PID: 43374 Rev 3.19 - June 2010 2.3.24 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WJ pnc GN (115 W Server, Fr6 (1207)) Thermal and Power Specifications State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Specification8 Notes OS2427WJS6DGN OS2431WJS6DGN OS8431WJS6DGN Tcase Max 1 55 oC to 76 oC 55 oC to 76 oC Tctl Max 2 70 oC 70 oC o 5 oC Tambient Min 5 C Thermal Profile K K Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 2200 MHz 2200 MHz VID_VDDNB Min 15 1.175 V 1.175 V VID_VDDNB Max 15 1.200 V 1.200 V IDDNB Max 12 20.0 A 20.0 A CPU COF 6 2200 MHz 2400 MHz TDP 3,7 115.0 W 115.0 W VID_VDD Min 9 1.025 V 1.025 V VID_VDD Max 9 1.300 V 1.300 V IDD Max 3,10 78.3 A 79.7 A CPU COF 6 1700 MHz 1900 MHz TDP 3,7 93.0 W 93.8 W VID_VDD Min 9 0.975 V 0.975 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 CPU COF 6 TDP 60.5 A 62.2 A 1300 MHz 1500 MHz 3,7 80.5 W 81.8 W VID_VDD Min 9 0.950 V 0.950 V VID_VDD Max 9 1.225 V 1.225 V IDD Max 3,10 CPU COF 6 49.4 A 51.4 A 1000 MHz 1200 MHz TDP 3,7 71.1 W 69.4 W VID_VDD Min 9 0.925 V 0.900 V VID_VDD Max 9 1.200 V 1.175 V IDD Max 3,10 CPU COF 6 41.1 A 40.6 A 800 MHz 800 MHz TDP 3,7 59.2 W 57.8 W VID_VDD Min 9 0.850 V 0.850 V VID_VDD Max 9 1.125 V 1.125 V IDD Max 3,10 30.9 A 29.5 A IDD Max (Pre-Flush) 3,10,17 10.5 A 10.0 A IDD Max (Post-Flush) 3,10,17 8.2 A 7.7 A S0 I/O Power 13 9.8 W 9.8 W S3 I/O Power 13 350 mW 350 mW S0.C1.Pmin The notes for this table are on page 80. AMD OpteronTM Processor 64 PID: 43374 Rev 3.19 - June 2010 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 S0.C1.Pmin AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Specification8 Notes OS2435WJS6DGN OS8435WJS6DGN Tcase Max 1 55 oC to 76 oC Tctl Max 2 70 oC 5 oC Tambient Min Thermal Profile K Startup P-State 5 S0.C0.P4 HTC P-State 4 S0.C0.P4 NB COF 6,15 2200 MHz VID_VDDNB Min 15 1.175 V VID_VDDNB Max 15 1.200 V IDDNB Max 12 17.4 A CPU COF 6 2600 MHz TDP 3,7 115.0 W VID_VDD Min 9 1.075 V VID_VDD Max 9 1.300 V IDD Max 3,10 CPU COF 6 TDP 3,7 93.2 W VID_VDD Min 9 1.025 V VID_VDD Max 9 1.250 V IDD Max 3,10 CPU COF 6 80.0 A 2100 MHz 62.8 A 1700 MHz TDP 3,7 80.8 W VID_VDD Min 9 1.000 V VID_VDD Max 9 1.225 V IDD Max 3,10 CPU COF 6 TDP 3,7 71.5 W VID_VDD Min 9 0.975 V VID_VDD Max 9 1.200 V IDD Max 3,10 CPU COF 6 TDP 3,7 53.2 W VID_VDD Min 9 0.900 V VID_VDD Max 9 1.125 V IDD Max 3,10 27.1 A IDD Max (Pre-Flush) 3,10,17 8.6 A IDD Max (Post-Flush) 3,10,17 6.4 A 52.0 A 1400 MHz 43.8 A 800 MHz S0 I/O Power 13 9.8 W S3 I/O Power 13 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 65 PID: 43374 Rev 3.19 - June 2010 2.3.25 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm PD pnc GN (79 W Server, Fr6 (1207)) Thermal and Power Specifications State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 Specification8 Notes OS2423PDS6DGN OS2425PDS6DGN OS8425PDS6DGN Tcase Max 1 55 oC to 76 oC 55 oC to 76 oC Tctl Max 2 70 oC 70 oC o 5 oC Tambient Min 5 C Thermal Profile E E Startup P-State 5 S0.C0.P4 S0.C0.P4 HTC P-State 4 S0.C0.P4 S0.C0.P4 NB COF 6,15 2200 MHz 2200 MHz VID_VDDNB Min 15 1.175 V 1.175 V VID_VDDNB Max 15 1.200 V 1.200 V IDDNB Max 12 17.5 A 16.7 A CPU COF 6 2000 MHz 2100 MHz TDP 3,7 79.0 W 79.0 W VID_VDD Min 9 0.950 V 0.950 V VID_VDD Max 9 1.150 V 1.150 V IDD Max 3,10 54.6 A 55.3 A CPU COF 6 1500 MHz 1600 MHz TDP 3,7 67.1 W 67.1 W VID_VDD Min 9 0.925 V 0.925 V VID_VDD Max 9 1.125 V 1.125 V IDD Max 3,10 CPU COF 6 TDP 42.4 A 43.3 A 1300 MHz 1400 MHz 3,7 61.1 W 61.1 W VID_VDD Min 9 0.900 V 0.900 V VID_VDD Max 9 1.100 V 1.100 V IDD Max 3,10 CPU COF 6 36.7 A 37.6 A 1000 MHz 1100 MHz TDP 3,7 54.2 W 54.1 W VID_VDD Min 9 0.875 V 0.875 V VID_VDD Max 9 1.075 V 1.075 V IDD Max 3,10 CPU COF 6 29.7 A 30.6 A 800 MHz 800 MHz TDP 3,7 49.4 W 48.0 W VID_VDD Min 9 0.850 V 0.850 V VID_VDD Max 9 1.050 V 1.050 V IDD Max 3,10 24.8 A 24.1 A IDD Max (Pre-Flush) 3,10,17 7.8 A 7.5 A IDD Max (Post-Flush) 3,10,17 5.7 A 5.4 A S0 I/O Power 13 9.8 W 9.8 W S3 I/O Power 13 350 mW 350 mW S0.C1.Pmin The notes for this table are on page 80. AMD OpteronTM Processor 66 PID: 43374 Rev 3.19 - June 2010 2.3.26 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm NB pnc GN (60 W Server, Fr6 (1207)) Thermal and Power Specifications State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C0.P4 S0.C1.Pmin Specification 8 Notes OS2419NBS6DGN Tcase Max 1 55 oC to 68 oC Tctl Max 2 70 oC 5 oC Tambient Min Thermal Profile P Startup P-State 5 S0.C0.P4 HTC P-State 4 S0.C0.P4 NB COF 6,15 2000 MHz VID_VDDNB 15 1.125 V IDDNB Max 12 11.2 A CPU COF 6 1800 MHz TDP 3,7 60.0 W VID_VDD Min 9 0.900 V VID_VDD Max 9 1.125 V IDD Max 3,10 42.7 A CPU COF 6 TDP 3,7 51.0 W VID_VDD Min 9 0.875 V VID_VDD Max 9 1.100 V IDD Max 3,10 CPU COF 6 TDP 3,7 47.9 W VID_VDD Min 9 0.875 V VID_VDD Max 9 1.100 V IDD Max 3,10 30.3 A 1400 MHz 33.7 A 1200 MHz CPU COF 6 TDP 3,7 1000 MHz 42.9 W VID_VDD Min 9 0.850 V VID_VDD Max 9 1.075 V IDD Max 3,10 25.4 A CPU COF 6 TDP 3,7 800 MHz 40.0 W VID_VDD Min 9 0.850 V VID_VDD Max 9 1.075 V IDD Max 3,10 22.1 A IDD Max (Pre-Flush) 3,10,17 6.6 A IDD Max (Post-Flush) 3,10,17 4.5 A S0 I/O Power 13 9.8 W S3 I/O Power 13 350 mW The notes for this table are on page 80. AMD OpteronTM Processor 67 PID: 43374 Rev 3.19 - June 2010 2.3.27 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WK pnc GO (115 W Server, G34r1) Thermal and Power Specifications Specification 8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS6168WKTCEGO 55 oC to 69 oC 70 oC 5 oC Q S0.C0.P4 S0.C0.P4 1800 MHz 1.0250 V 1.1000 V 19.6 A 1900 MHz 115.0 W 135.0 W 1.0000 V 1.1875 V 93.4 A 1500 MHz 99.4 W 113.7 W 0.9500 V 1.1375 V 75.2 A 1300 MHz 93.7 W 102.6 W 0.9250 V 1.1125 V 66.5 A 1000 MHz 83.5 W 90.7 W 0.9000 V 1.0875 V 55.0 A 800 MHz 78.0 W 83.8 W 0.8750 V 1.0625 V 46.8 A 22.0 A 16.1 A 15.2 W 8.7 W 23.8 W 600 mW OS6172W KTCEGO 55 oC to 69 oC 70 oC 5 oC Q S0.C0.P4 S0.C0.P4 1800 MHz 1.0250 V 1.1000 V 18.4 A 2100 MHz 115.0 W 135.0 W 1.0000 V 1.1875 V 96.6 A 1700 MHz 101.2 W 114.9 W 0.9500 V 1.1375 V 78.5 A 1400 MHz 90.4 W 100.4 W 0.9125 V 1.1125 V 66.9 A 1100 MHz 81.8 W 89.6 W 0.9000 V 1.0875 V 55.4 A 800 MHz 73.7 W 79.7 W 0.8750 V 1.0625 V 44.3 A 18.4 A 12.5 A 12.0 W 8.7 W 23.3 W 600 mW The notes for this table are on page 80. AMD OpteronTM Processor 68 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Specification 8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS6174W KTCEGO 55 oC to 69 oC 70 oC 5 oC Q S0.C0.P4 S0.C0.P4 1800 MHz 1.0250 V 1.1000 V 17.2 A 2200 MHz 115.0 W 135.0 W 1.0000 V 1.1875 V 98.3 A 1800 MHz 99.2 W 113.5 W 0.9500 V 1.1375 V 80.1 A 1400 MHz 88.1 W 98.6 W 0.9250 V 1.1125 V 65.6 A 1100 MHz 79.4 W 87.8 W 0.9000 V 1.0875 V 54.2 A 800 MHz 71.1 W 77.5 W 0.8750 V 1.0625 V 43.1 A 17.5 A 11.6 A 11.2 W 8.7 W 23.2 W 600 mW The notes for this table are on page 80. AMD OpteronTM Processor 69 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Specification 8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS6128W KT8EGO 55 oC to 70 oC 70 oC 5 oC R S0.C0.P4 S0.C0.P4 1800 MHz 1.0250 V 1.1000 V 21.1 A 2000 MHz 115.0 W 135.0 W 1.0000 V 1.3000 V 84.8 A 1500 MHz 99.7 W 109.1 W 0.9500 V 1.2375 V 66.5 A 1200 MHz 90.3 W 96.2 W 0.9125 V 1.2000 V 56.2 A 1000 MHz 83.2 W 88.4 W 0.8750 V 1.1625 V 48.5 A 800 MHz 77.0 W 81.1 W 0.8375 V 1.1250 V 41.0 A 21.3 A 17.7 A 17.0 W 8.7 W 24.4 W 600 mW OS6134WKT8EGO 55 oC to 70 oC 70 oC 5 oC R S0.C0.P4 S0.C0.P4 1800 MHz 1.0250 V 1.1000 V 19.4 A 2300 MHz 115.0 W 135.0 W 1.0375 V 1.3000 V 87.9 A 1800 MHz 97.9 W 111.3 W 0.9750 V 1.2375 V 69.8 A 1400 MHz 87.2 W 94.8 W 0.9375 V 1.2000 V 57.6 A 1100 MHz 78.8 W 84.9 W 0.9000 V 1.1625 V 47.9 A 800 MHz 71.2 W 75.7 W 0.8625 V 1.1250 V 38.6 A 18.7 A 15.1 A 14.5 W 8.7 W 23.9 W 600 mW The notes for this table are on page 80. AMD OpteronTM Processor 70 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Specification 8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS6136WKT8EGO 55 oC to 70 oC 70 oC 5 oC R S0.C0.P4 S0.C0.P4 1800 MHz 1.0250 V 1.1000 V 19.0 A 2400 MHz 115.0 W 135.0 W 1.0375 V 1.3000 V 89.0 A 1900 MHz 98.0 W 111.4 W 0.9750 V 1.2375 V 70.9 A 1500 MHz 87.4 W 95.3 W 0.9375 V 1.2000 V 58.7 A 1100 MHz 77.6 W 83.7 W 0.9000 V 1.1625 V 47.1 A 800 MHz 70.0 W 74.5 W 0.8625 V 1.1250 V 37.8 A 18.2 A 14.5 A 14.0 W 8.7 W 23.8 W 600 mW The notes for this table are on page 80. AMD OpteronTM Processor 71 PID: 43374 Rev 3.19 - June 2010 2.3.28 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm VA pnc GO (85 W Server, G34r1) Thermal and Power Specifications Specification8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS6164VATCEGO 55 oC to 65 oC 70 oC 5 oC S S0.C0.P4 S0.C0.P4 1800 MHz 1.0250 V 1.1000 V 16.9 A 1700 MHz 85.0 W 100.0 W 0.8500 V 1.0750 V 68.8 A 1500 MHz 79.1 W 91.1 W 0.8250 V 1.0625 V 60.2 A 1200 MHz 71.8 W 79.5 W 0.8000 V 1.0250 V 49.3 A 1000 MHz 66.4 W 72.8 W 0.7750 V 1.0000 V 42.0 A 800 MHz 61.5 W 66.8 W 0.7500 V 0.9750 V 35.0 A 13.5 A 8.4 A 8.6 W 8.7 W 23.1 W 600 mW The notes for this table are on page 80. AMD OpteronTM Processor 72 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Specification 8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS6124VAT8EGO 55 oC to 66 oC 70 oC 5 oC T S0.C0.P4 S0.C0.P4 1800 MHz 1.0250 V 1.1000 V 17.9 A 1800 MHz 85.0 W 100.0 W 0.9000 V 1.2000 V 61.0 A 1600 MHz 79.6 W 91.3 W 0.8750 V 1.1750 V 54.4 A 1300 MHz 72.4 W 79.0 W 0.8375 V 1.1375 V 46.1 A 1100 MHz 69.0 W 74.3 W 0.8250 V 1.1125 V 40.3 A 800 MHz 63.7 W 67.7 W 0.8000 V 1.0875 V 32.9 A 14.9 A 11.5 A 11.2 W 8.7 W 23.6 W 600 mW OS6128VAT8EGO 55 oC to 66 oC 70 oC 5 oC T S0.C0.P4 S0.C0.P4 1800 MHz 1.0250 V 1.1000 V 17.1 A 2000 MHz 85.0 W 100.0 W 0.8875 V 1.2000 V 63.2 A 1700 MHz 78.5 W 89.2 W 0.8625 V 1.1750 V 54.5 A 1400 MHz 71.3 W 77.8 W 0.8250 V 1.1375 V 46.4 A 1100 MHz 66.5 W 71.8 W 0.8125 V 1.1125 V 38.8 A 800 MHz 61.5 W 65.6 W 0.7875 V 1.0875 V 31.4 A 13.9 A 10.4 A 10.3 W 8.7 W 23.3 W 600 mW The notes for this table are on page 80. AMD OpteronTM Processor 73 PID: 43374 Rev 3.19 - June 2010 2.3.29 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm YE pnc GO (140 W Server, G34r1) Thermal and Power Specifications Specification8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS6176YETCEGO 55 oC to 64 oC 70 oC 5 oC V S0.C0.P4 S0.C0.P4 1800 MHz 1.0250 V 1.1000 V 22.5 A 2300 MHz 140.0 W 165.0 W 1.0375 V 1.2500 V 113.5 A 2000 MHz 126.6 W 145.0 W 1.0000 V 1.2125 V 99.1 A 1600 MHz 110.3 W 121.5 W 0.9500 V 1.1625 V 80.8 A 1200 MHz 93.9 W 102.2 W 0.8875 V 1.1000 V 62.1 A 800 MHz 77.6 W 82.9 W 0.8000 V 0.8375 V 42.9 A 20.2 A 15.1 A 14.5 W 8.7 W 24.2 W 600 mW The notes for this table are on page 80. AMD OpteronTM Processor 74 PID: 43374 Rev 3.19 - June 2010 2.3.30 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WL pnc GO (95 W Server, C32) Thermal and Power Specifications Specification 8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS4184WLU6DGO 55 oC to 70 oC 70 oC 5 oC Y S0.C0.P4 S0.C0.P4 2200 MHz 1.0750 V 1.2000 V 14.0 A 2800 MHz 95.0 W 115.0 W 1.1250 V 1.3500 V 79.0 A 2500 MHz 85.1 W 100.9 W 1.0875 V 1.3125 V 69.6 A 1900 MHz 69.0 W 77.8 W 1.0250 V 1.2500 V 53.3 A 1400 MHz 57.6 W 64.4 W 0.9750 V 1.1875 V 40.9 A 800 MHz 40.9 W 45.0 W 0.8250 V 0.8500 V 22.9 A 9.6 A 7.0 A 7.9 W 4.2 W 10.9 W 200 mW OS4180WLU6DGO 55 oC to 70 oC 70 oC 5 oC Y S0.C0.P4 S0.C0.P4 2200 MHz 1.0750 V 1.2000 V 14.8 A 2600 MHz 95.0 W 113.9 W 1.1250 V 1.3500 V 77.4 A 2300 MHz 85.0 W 99.8 W 1.0875 V 1.3125 V 67.9 A 1800 MHz 70.2 W 78.6 W 1.0250 V 1.2500 V 53.3 A 1300 MHz 58.7 W 65.1 W 0.9750 V 1.1875 V 40.8 A 800 MHz 42.8 W 46.9 W 0.8250 V 0.8500 V 24.0 A 10.4 A 7.7 A 8.8 W 4.2 W 11.1 W 200 mW The notes for this table are on page 80. AMD OpteronTM Processor 75 PID: 43374 Rev 3.19 - June 2010 2.3.31 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm WL pnc GN (95 W Server, C32) Thermal and Power Specifications Specification 8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS4130W LU4DGN 55 oC to 70 oC 70 oC 5 oC Y S0.C0.P4 S0.C0.P4 2200 MHz 1.1000 V 1.2500 V 17.2 A 2600 MHz 95.0 W 107.9 W 1.1625 V 1.3125 V 70.3 A 2300 MHz 86.0 W 96.4 W 1.1250 V 1.2750 V 62.3 A 1800 MHz 74.2 W 81.0 W 1.0750 V 1.2250 V 50.9 A 1300 MHz 63.9 W 69.2 W 1.0250 V 1.1750 V 40.4 A 800 MHz 49.7 W 53.3 W 0.8875 V 0.9000 V 26.1 A 13.3 A 11.4 A 12.9 W 4.2 W 11.3 W 200 mW OS4122WLU4DGN 55 oC to 70 oC 70 oC 5 oC Y S0.C0.P4 S0.C0.P4 2200 MHz 1.1000 V 1.2500 V 18.3 A 2200 MHz 95.0 W 106.7 W 1.1625 V 1.3125 V 68.1 A 1900 MHz 85.9 W 94.7 W 1.1250 V 1.2750 V 59.9 A 1600 MHz 76.0 W 82.6 W 1.0750 V 1.2250 V 50.9 A 1200 MHz 66.4 W 71.5 W 1.0250 V 1.1750 V 41.4 A 800 MHz 52.5 W 56.1 W 0.8875 V 0.9000 V 27.7 A 14.5 A 12.6 A 14.2 W 4.2 W 11.5 W 200 mW The notes for this table are on page 80. AMD OpteronTM Processor 76 PID: 43374 Rev 3.19 - June 2010 2.3.32 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm OF pnc GO (65 W Server, C32) Thermal and Power Specifications Specification 8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS4170OFU6DGO 55 oC to 70 oC 70 oC 5 oC W S0.C0.P4 S0.C0.P4 2200 MHz 1.0750 V 1.2000 V 16.0 A 2100 MHz 65.0 W 78.0 W 0.9125 V 1.1875 V 52.8 A 1800 MHz 59.6 W 68.4 W 0.8875 V 1.1625 V 45.7 A 1400 MHz 51.8 W 57.3 W 0.8375 V 1.1000 V 36.0 A 1100 MHz 46.8 W 51.3 W 0.8000 V 1.0625 V 29.5 A 800 MHz 43.5 W 47.4 W 0.7875 V 0.8250 V 24.7 A 11.1 A 8.6 A 9.3 W 4.2 W 11.4 W 200 mW OS4174OFU6DGO 55 oC to 70 oC 70 oC 5 oC W S0.C0.P4 S0.C0.P4 2200 MHz 1.0750 V 1.2000 V 15.2 A 2300 MHz 65.0 W 79.0 W 0.9125 V 1.1875 V 54.4 A 2000 MHz 59.6 W 69.5 W 0.8875 V 1.1625 V 47.4 A 1600 MHz 51.8 W 57.7 W 0.8375 V 1.1000 V 37.7 A 1200 MHz 45.8 W 50.6 W 0.8000 V 1.0625 V 29.8 A 800 MHz 41.7 W 45.6 W 0.7875 V 0.8250 V 23.6 A 10.4 A 7.9 A 8.5 W 4.2 W 11.3 W 200 mW The notes for this table are on page 80. AMD OpteronTM Processor 77 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Specification 8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS4176OFU6DGO 55 oC to 70 oC 70 oC 5 oC W S0.C0.P4 S0.C0.P4 2200 MHz 1.0750 V 1.2000 V 14.8 A 2400 MHz 65.0 W 79.6 W 0.9125 V 1.1875 V 55.3 A 2100 MHz 59.6 W 70.1 W 0.8875 V 1.1625 V 48.3 A 1600 MHz 50.9 W 56.8 W 0.8375 V 1.1000 V 37.1 A 1200 MHz 44.9 W 49.7 W 0.8000 V 1.0625 V 29.3 A 800 MHz 40.8 W 44.7 W 0.7875 V 0.8250 V 23.1 A 10.1 A 7.5 A 8.1 W 4.2 W 11.2 W 200 mW The notes for this table are on page 80. AMD OpteronTM Processor 78 PID: 43374 Rev 3.19 - June 2010 2.3.33 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet OS mmmm HJ pnc GO (35 W Server, C32) Thermal and Power Specifications Specification 8 Tcase Max Tctl Max Tambient Min S0.C0.Px Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF TDP Max Power S0.C0.P0 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P1 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P2 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P3 VID_VDD Min VID_VDD Max IDD TDC CPU COF TDP Max Power S0.C0.P4 VID_VDD Min VID_VDD Max IDD TDC IDD Max (Pre-Flush) S0.C1.Pmin IDD Max (Post-Flush) TDP S0.C1e.Pmin I/O Power I/O Power S0 I/O Power S3 State Notes 1 2 5 4 6,15 15 15 12 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 6 3,7 18 9 9 3,10,17 3,10,17 19 21 20 OS4164HJU6DGO 55 oC to 65 oC 70 oC 5 oC Z S0.C0.P4 S0.C0.P4 1800 MHz 0.9750 V 1.1250 V 10.2 A 1800 MHz 35.0 W 43.0 W 0.7625 V 0.9625 V 34.8 A 1600 MHz 33.0 W 39.6 W 0.7500 V 0.9500 V 31.0 A 1400 MHz 31.4 W 37.2 W 0.7375 V 0.9250 V 27.9 A 1100 MHz 29.0 W 33.4 W 0.7375 V 0.9125 V 23.1 A 800 MHz 26.5 W 30.1 W 0.7250 V 0.8250 V 18.7 A 7.7 A 5.4 A 4.9 W 4.2 W 7.9 W 200 mW OS4162HJU6DGO 55 oC to 65 oC 70 oC 5 oC Z S0.C0.P4 S0.C0.P4 1800 MHz 0.9750 V 1.1250 V 10.5 A 1700 MHz 35.0 W 43.0 W 0.7625 V 0.9625 V 33.8 A 1500 MHz 33.0 W 39.5 W 0.7500 V 0.9500 V 30.0 A 1300 MHz 31.3 W 36.8 W 0.7375 V 0.9250 V 26.8 A 1100 MHz 29.6 W 34.1 W 0.7375 V 0.9125 V 23.4 A 800 MHz 27.1 W 30.7 W 0.7250 V 0.8250 V 18.9 A 8.1 A 5.7 A 5.2 W 4.2 W 7.9 W 200 mW The notes for this table are on page 80. AMD OpteronTM Processor 79 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet AMD OpteronTM Processor Thermal and Power Specification Table Notes: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. Tc as e Max is the m axim um c as e tem perature spec ification, whic h is a physical value in degrees Celsius. Tc as e Max can b e any valid Tcase Max value in the range s pecified for the corres ponding OP N. Tc tl Max (m axim um c ontrol tem perature) is a non-phys ic al tem perature on an arb itrary sc ale that c an b e us ed for s ystem therm al m anagem ent polic ies. Refer to the B IOS and K ernel Developer's Guide (BK DG) For AM D Fam ily 10h P roc es sors, order #31116. TDP is m eas ured under the c onditions of all cores operating at CP U COF, Tcase Max, and VDD at the voltage reques ted b y the process or. TDP inc ludes all power dis sipated on-die from V DD, V DDNB, V DDIO, VLDT, V TT and V DDA. P -State lim it when HTC is active. Refer to the B IOS and Kernel Developer's Guide (B KDG) for A MD Fam ily 10h P roc es sors, order# 31116 for m ore inform ation. Hardware trans itions the part to Startup P-S tate at c old b oot. During initializ ation, the startup NB COF and VID_V DDNB values m ay differ from those of the s tartup P -State. P leas e s ee the BIOS and Kernel Developer's Guide (BK DG) for AMD Fam ily 10h P roc es sors, order# 31116 for detailed power sequenc ing inform ation. Frequenc y reported to the OS is rounded to the nearest 100-MHz b oundary. The process or therm al solution s hould b e designed to acc om m odate therm al design power (TDP) at Tc as e,m ax.TDP is not the m axim um power of the process or. S pecifications for m ulti-c ore process ors as sum e equivalent P-S tates (voltage and frequency) and equivalent Tcase conditions for all c ores. Refer to the B IOS and Kernel Developer's Guide (B KDG) for AMD Fam ily 10h Process ors , order# 31116, for details on P-S tate operation for m ulti-core proc ess ors . V ariab le voltage, any valid voltage b etween VDD m in and V DD m ax is allowed. TDP IDD conditions: s ingle plane platform s supply IDD and IDDNB tied together and use the IDD Max specific ation. S ingle-plane platform s have VID_V DD and V ID_VDDNB tied together, and us e the V ID_VDD s pecification. TDP IDDNB conditions: s ingle-plane platform s supply IDD and IDDNB tied together and use the IDD Max s pecific ation. Therm al Des ign P ower diss ipated b y the proc es sor VDDIO and VTT power planes only. A ss um es V DDIO = 1.8 V and V TT = VDDIO / 2. Refer to erratum 308 in the Revis ion Guide for A M D Fam ily 10h Process ors , Order# 41322 for the appropriate cloc k divis or s etting. During initialization, the s tartup NB COF and V ID_VDDNB values m ay differ from thos e of the s tartup P-S tate. See the B IOS and Kernel Developer's Guide (B KDG) for A MD Fam ily 10h P roc ess ors , order# 31116, for spec ific power sequencing inform ation. This produc t is intended for dual-plane platform s only. IDDMax (P re-Flus h) and (Post-Flus h) refer to the Cache Flus h On Halt feature des crib ed in the B IOS and Kernel Developer's Guide (B KDG) for AM D Fam ily 10h P roc es sors, order# 31116. IDDMax pre-flus h and post-flus h values are b as ed on the rec om m ended BK DG s ettings. A ctual C1 idle c urrent varies with sys tem us age acc ording to the following equation: C1 idle current = F3xDC[Cas hFlus hOnHaltTm r]/OS tim er tic k interval * Idd Max (P re-Flus h) + (1 - F3xDC[CachFlushOnHaltTm r]/OS tim er tick interval * Idd Max (Post-Flus h)) The default Microsoft (R) W indows V is ta (R) tim er tick interval is 15.6 m s. This interval varies b etween operating s ystem s and within an operating sys tem depending on usage. Maxim um S us tained P ower diss ipated b y the proc es sor at nom inal voltage and m axim um spec ified c as e or die tem perature. A ss um es 35 o C, m in P-S tate VID_V DD, core c lock divider set to S tpClk and NB cloc k divider s et to 16.Power saving c om es from as serting LDTS TOP to plac e HyperTransport TM phys into LS 2. Rec om m ended s ettings are in the B IOS and Kernel Developer's Guide (B KDG) for A MD Fam ily 10h P roc ess ors , order# 31116. Therm al Des ign P ower diss ipated b y the proc es sor (VDDIO power plane only). As sum e VDDIO = 1.5 V Therm al Des ign P ower diss ipated b y the proc es sor VDDIO, V DDR, V LDT and V DDA power planes . AMD OpteronTM Processor 80 PID: 43374 Rev 3.19 - June 2010 3 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Power Supply Specifications For socket infrastructures not covered by this document refer to the AMD Infrastructure Roadmap, order# 41842. 3.1 bsmmmmrr L ncdd - Fr2 (1207) Power Supply Operating Conditions Table 10. bsmmmmrr L ncdd DC Operating Conditions for VDD Power Supply Symbol Parameter Units VID_VDD VID-Requested VDD Supply Level V VDD_dc DC Tolerance - VDD Supply Voltage V VDD_PON Metal Mask VID_VDD V VDDNB_dc VDDNB Supply voltage V VID_VDDNB VDDNB Supply voltage V Min Typ Max Notes Refer to the thermal/power tables under the appropriate SOPN section for this OPNspecific parameter. VID_VDD VID_VDD VID_VDD -50 mV + 50 mV 0.95 1.00 MaxVID_VDD 1,2 VID_VDDNB VID_VDDNB VID_VDDNB -50 mV + 50 mV Refer to the thermal/power tables under the appropriate SOPN section for this OPNspecific parameter. 0.95 1.00 1.30 2 VDDNB_PON Metal Mask VDDNB V Notes: 1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device manufacturing. 2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS). Table 11. bsmmmmrr L ncdd AC Operating Conditions for VDD Power Supply Symbol Parameter Units VDD_ac VDD Supply Voltage V VDDNB_ac VDDNB Supply Voltage V Min Typ VID_VDD VID_VDD -100 mV VID_VDDNB VID_VDDNB -100 mV Max Notes VID_VDD + 1 100 mV VID_VDDNB 1 + 100 mV Notes: 1) The voltage set-point must be contained within the DC specification in order to ensure proper operation. Voltage ripple and transient events outside the DC specification must remain within the AC specification at all times. Transients above dc max must return to within the DC specification within 15 S and must stay under a triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 3 on page 82. Power Supply Specifications 81 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 12. bsmmmmrr L ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies Symbol VDDIO VDDIO VLDT VDDA VDD, VDDNB Parameter VDDIO Supply Voltage for DDR2 electricals VDDIO Supply Voltage for DDR3 electricals VLDT Supply Voltage VDDA Supply Voltage VDD, VDDNB Supply Voltage Units Max V 2.05 V 1.65 V V 1.32 2.70 Max AC Voltage V VID + 1 00 mV VID + 50 mV VID VID - 50 mV VID - 100 mV 15 S Figure 3. Socket Fr2 (1207) AC and DC Transient Limits Power Supply Specifications 82 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 13. bsmmmmrr L ncdd AC and DC Operating Conditions for non-VDD Power Supplies Symbol VDDIO_dc Parameter VDDIO Supply Voltage for DDR2 electricals Units Min Typ Max Notes V 1.70 1.80 1.90 1 VDDIO_ac VDDIO Supply voltage V VLDT VLDT Supply Voltage VTT Supply Voltage for DDR2 electricals V VDDIO_dc -150 mV 1.14 V 0.85 VTT_dc VTT_ac VTT Supply Voltage V VDDA VDDA Supply Voltage VDDIO Power Supply Current VTT Power Supply Current VLDT Power Supply Current VDDA Power Supply Current V IDDIO1 ITT1 ILDT IDDA VTT_dc -75mV 2.40 1.20 VDDIO_dc +150 mV 1.26 0.90 0.95 VDDIO_dc VTT_dc 2.50 VTT_dc + 75mV 2.60 2, 3 10 4 2, 3 A 3.60 7, 9 A 1.75 6, 8, 9 mA 600/ link 5, 9 mA 250 9 Notes: 1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid violating the VDDIO_dc minimum spec of 1.70 V. 2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits switching. 3) Power supply A/C measurements use a 20-MHz scope bandwidth limit. 4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level measured at the processor VTT_SENSE pin track s 0.5*VDDIO_DC and stays within the specified maximum and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage regulator setting must be set 20 mV higher so that VTT still track s 0.5*VDDIO_dc and stays within the range of 0.85 V and 0.95 V. 5) ILDT is specified for each unconnected HyperTransportTM link or for each 16x16 bit Gen1 HyperTransport link operating at max 2.0 GT/s or less. Please refer to erratum 396. 6) VTT must both sink and source current. 7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 9) This specification reflects the values published in the appropriate power roadmap document. 10) Tolerances apply to both VLDT_dc and VLDT_ac conditions. Power Supply Specifications 83 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet 3.2 bsmmmmrr P ncdd - Fr5 (1207) Power Supply Operating Conditions Table 14. bsmmmmrr P ncdd DC Operating Conditions for VDD Power Supply Symbol Parameter Units VID_VDD VID-Requested VDD Supply Level V VDD_dc DC Tolerance - VDD Supply Voltage V VDD_PON Metal Mask VID_VDD V VDDNB_dc VDDNB Supply voltage V VID_VDDNB VDDNB Supply voltage V Min Typ Max Notes Refer to the thermal/power tables under the appropriate SOPN section for this OPNspecific parameter. VID_VDD VID_VDD VID_VDD -50 mV + 50 mV 0.95 1.00 MaxVID_VDD 1,2 VID_VDDNB VID_VDDNB VID_VDDNB -50 mV + 50 mV Refer to the thermal/power tables under the appropriate SOPN section for this OPNspecific parameter. 0.95 1.00 1.30 2 VDDNB_PON Metal Mask VDDNB V Notes: 1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device manufacturing. 2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS). Table 15. bsmmmmrr P ncdd AC Operating Conditions for VDD Power Supply Symbol Parameter Units VDD_ac VDD Supply Voltage V VDDNB_ac VDDNB Supply Voltage V Min Typ VID_VDD VID_VDD -100 mV VID_VDDNB VID_VDDNB -100 mV Max Notes VID_VDD + 1 100 mV VID_VDDNB 1 + 100 mV Notes: 1) The voltage set-point must be contained within the DC specification in order to ensure proper operation. Voltage ripple and transient events outside the DC specification must remain within the AC specification at all times. Transients above dc max must return to within the DC specification within 15 S and must stay under a triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 4 on page 85. Power Supply Specifications 84 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 16. bsmmmmrr P ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies Symbol VDDIO VDDIO VLDT VDDA VDD, VDDNB Parameter VDDIO Supply Voltage for DDR2 electricals VDDIO Supply Voltage for DDR3 electricals VLDT Supply Voltage VDDA Supply Voltage VDD, VDDNB Supply Voltage Units Max V 2.05 V 1.65 V V 1.32 2.70 Max AC Voltage V VID + 1 00 mV VID + 50 mV VID VID - 50 mV VID - 100 mV 15 S Figure 4. Socket Fr5 (1207) AC and DC Transient Limits Power Supply Specifications 85 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 17. bsmmmmrr P ncdd AC and DC Operating Conditions for non-VDD Power Supplies Symbol VDDIO_dc Parameter VDDIO Supply Voltage for DDR2 electricals Units Min Typ Max Notes V 1.70 1.80 1.90 1 VDDIO_ac VDDIO Supply voltage V VLDT VLDT Supply Voltage VTT Supply Voltage for DDR2 electricals V VDDIO_dc -150 mV 1.14 V 0.85 VTT_dc VTT_ac VTT Supply Voltage V VDDA VDDA Supply Voltage VDDIO Power Supply Current VTT Power Supply Current VLDT Power Supply Current VDDA Power Supply Current V IDDIO1 ITT1 ILDT IDDA VTT_dc -75mV 2.40 1.20 VDDIO_dc +150 mV 1.26 0.90 0.95 VDDIO_dc VTT_dc 2.50 VTT_dc + 75mV 2.60 2, 3 12 4 2, 3 A 3.60 7, 9 A 1.75 6, 8, 9 A 1.40/ link 0.60/ link 5, 9 9,10,11 mA 250 9 Notes: 1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid violating the VDDIO_dc minimum spec of 1.70 V. 2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits switching. 3) Power supply A/C measurements use a 20-MHz scope bandwidth limit. 4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_DC and stays within the specified maximum and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage regulator setting must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range of 0.85 V and 0.95 V. 5) ILDT is specified for each Gen3 16x16-bit HyperTransportTM link operating between 2.4GT/s and 4.8 GT/s. 6) VTT must both sink and source current. 7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 9) This specification reflects the values published in the appropriate power roadmap document. 10) ILDT is specified for each unconnected HyperTransport link or for each 16x16 bit Gen1 HyperTransport link operating at max 2.0 GT/s or less. 11) The maximum value is listed as a per link value to allow for a mix of Gen1 and Gen3 links. All links must be powered on a processor. Please refer to erratum 396. 12) Tolerances apply to both VLDT_dc and VLDT_ac conditions. Power Supply Specifications 86 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet 3.3 bsmmmmrr J ncdd - AM2r2 Power Supply Operating Conditions Table 18. bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply Symbol Parameter Units VID_VDD VID-Requested VDD Supply Level V VDD_PON DC Tolerance - VDD Supply Voltage Metal Mask VID V VDDNB_dc VDDNB Supply voltage V VID_VDDNB VDDNB Supply voltage V VDD_dc V Min Typ Max Notes Refer to the thermal/power tables under the appropriate SOPN section for this OPN-specific parameter. VID_VDD VID_VDD VID_VDD - 50 mV + 50 mV 0.95 1.00 MaxVID_VDD 1,2 VID_VDDNB VID_VDDNB VID_VDDNB - 50 mV + 50 mV Refer to the thermal/power tables under the appropriate SOPN section for this OPN-specific parameter. 0.95 1.00 MaxVID_VDDNB 1,2 VDDNB_PON Metal Mask VDDNB V Notes: 1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device manufacturing. 2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS). Table 19. bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply Symbol Parameter Units VDD_ac VDD Supply Voltage V VDDNB_ac VDDNB Supply Voltage V Min Typ VID_VDD - VID_VDD 140 mV VID_VDDNB VID_VDDNB - 140 mV Max VID_VDD + 150 mV VID_VDDNB + 150 mV Notes 1 1 Notes: 1) The voltage set-point must be contained within the DC specification in order to ensure proper operation. Voltage ripple and transient events outside the DC specification must remain within the AC specification at all times. Transients above dc max must return to within the DC specification within 30 S and must stay under a triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 5 on page 88. Power Supply Specifications 87 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 20. bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies Symbol VDDIO VDDIO VLDT VDDA VDD, VDDNB Parameter VDDIO Supply Voltage for DDR2 electricals VDDIO Supply Voltage for DDR3 electricals VLDT Supply Voltage VDDA Supply Voltage VDD, VDDNB Supply Voltage Units Max V 2.05 V 1.65 V V 1.32 2.70 Max AC Voltage V VID + 1 50 mV VID + 50 mV VID VID - 50 mV VID - 140 mV 30 s Figure 5. Socket AM2 AC and DC Transient Limits Power Supply Specifications 88 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 21. bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD Power Supplies Symbol VDDIO_dc Parameter Units VDDIO Supply Voltage for V DDR2 electricals Min Typ Max Notes 1.70 1.80 1.90 1 VDDIO_ac VDDIO Supply voltage V VLDT VLDT Supply Voltage VTT Supply Voltage for DDR2 electricals V VDDIO_dc - 150 mV 1.14 V 0.85 VTT_dc VTT_ac VTT Supply Voltage V VDDA VDDA Supply Voltage VDDIO Power Supply Current V IDDIO1 ITT1 ILDT IDDA VTT_dc - 75mV 2.40 1.20 VDDIO_dc + 150 2, 3 mV 1.26 10 0.90 0.95 VTT_dc VTT_dc + 75mV 2, 3 2.50 2.60 VDDIO_dc 4 A 3.60 7, 9 VTT Power Supply Current A 1.75 6, 8, 9 mA 500/ link 5, 9 mA 250 9 VLDT Power Supply Current VDDA Power Supply Current Notes: 1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid violating the VDDIO_dc minimum spec of 1.70 V. 2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits switching. 3) Power supply A/C measurements use a 20-MHz scope bandwidth limit. 4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_dc and stays within the specified maximum and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage regulator setting must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range of 0.85 V and 0.95 V. 5) ILDT is specified for each 16x16-bit HyperTransportTM link operating at 2.0 GT/s. 6) VTT must both sink and source current. 7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 9) This specification reflects the values published in the appropriate power roadmap document. 10) Tolerances apply to both VLDT_dc and VLDT_ac conditions. Power Supply Specifications 89 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet 3.4 bsmmmmrr K ncdd - AM3 Power Supply Operating Conditions Table 22. bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply Symbol Parameter Units VID_VDD VID-Requested VDD Supply Level V VDD_dc DC Tolerance - VDD Supply Voltage V VDD_PON Metal Mask VID V VDDNB_dc VDDNB Supply voltage V VID_VDDNB VDDNB Supply voltage V Min Typ Max Refer to the thermal/power tables under the appropriate SOPN section for this OPNspecific parameter. VID_VDD VID_VDD VID_VDD -50 mV + 50 mV 0.95 1.00 Notes MaxVID_VDD 1,2 VID_VDDNB VID_VDDNB VID_VDDNB -50 mV + 50 mV Refer to the thermal/power tables under the appropriate SOPN section for this OPNspecific parameter. 0.95 1.00 MaxVID_VDD 1,2 VDDNB_PON Metal Mask VDDNB V Notes: 1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device manufacturing. 2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS). Table 23. bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply Symbol Parameter Units VDD_ac VDD Supply Voltage V VDDNB_ac VDDNB Supply Voltage V Min Typ VID_VDD VID_VDD -140 mV VID_VDDNB VID_VDDNB -140 mV Max VID_VDD + 150 mV VID_VDDNB + 150 mV Notes 1 1 Notes: 1) The voltage set-point must be contained within the DC specification in order to ensure proper operation. Voltage ripple and transient events outside the DC specification must remain within the AC specification at all. times. Transients above dc max must return to within the DC specification within 30 S and must stay under a triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 6 on page 91. Power Supply Specifications 90 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 24. bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies Symbol VDDIO VDDIO VLDT VDDA VDD, VDDNB Parameter VDDIO Supply Voltage for DDR2 electricals VDDIO Supply Voltage for DDR3 electricals VLDT Supply Voltage VDDA Supply Voltage VDD, VDDNB Supply Voltage Units Max V 2.05 V 1.65 V V 1.32 2.70 Max AC Voltage V VID + 1 50 mV VID + 50 mV VID VID - 50 mV VID - 140 mV 30 s Figure 6. Socket AM3 AC and DC Transient Limits Power Supply Specifications 91 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 25. bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD Power Supplies Symbol VDDIO_dc Parameter Units VDDIO Supply Voltage for V DDR3 electricals VDDIO_ac VDDIO Supply voltage VLDT VLDT Supply Voltage V VDDR Supply Voltage for V DDR3 electricals VDDR_dc V VDDR_ac VDDR Supply Voltage V VDDA VDDA Supply Voltage VDDIO Power Supply Current VDDR Power Supply Current VLDT Power Supply Current VDDA Power Supply Current V IDDIO1 IDDR ILDT IDDA Min Typ Max Notes 1.375 1.500 1.625 1 VDDIO_dc - VDDIO_dc 125 mV 1.14 1.20 VDDIO_dc + 125 mV 1.26 1.14 1.26 VDDR_dc -60mV 2.40 1.20 VDDR_dc 2.50 VDDR_dc + 60mV 2.60 2, 3 12 4 2, 3 A 3.60 7, 9 A 1.75 6, 8, 9 A 1.40/ link 0.60/ link 5, 9 9,10,11 mA 9 Notes: 1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.475 V to avoid violating the VDDIO_dc minimum spec of 1.375 V. 2) VDDIO_ac and VDDR_ac parameters are measured over 60 seconds time frame with all data bus bits switching. 3) Power supply A/C measurements use a 20-MHz scope bandwidth limit. 4) All voltages are referenced to VSS. Voltage regulator for VDDR must be set accordingly so that VDDR_dc level measured at the processor with VDDR_SENSE pin stay within the specified maximum and minimum DC tolerance limits. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for to ensure the VDDR stays within the specified DC tolerance limits. 5) ILDT is specified for one 16x16-bit Gen3 link. 6) VDDR must both sink and source current. 7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 8) VDDR current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 9) This specification reflects the values published in the appropriate power roadmap document. 10) ILDT is specified for one 16x16-bit HyperTransportTM link operating at 2.0 GT/s. 11) Please refer to erratum 396. 12) Tolerances apply to both VLDT_dc and VLDT_ac conditions. Power Supply Specifications 92 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet 3.5 bsmmmmrr S ncdd - Fr6 (1207) Power Supply Operating Conditions Table 26. bsmmmmrr S ncdd DC Operating Conditions for VDD Power Supply Symbol Parameter Units VID_VDD VID-Requested VDD Supply Level V VDD_dc DC Tolerance - VDD Supply Voltage V VDD_PON Metal Mask VID_VDD V VDDNB_dc VDDNB Supply voltage V VID_VDDNB VDDNB Supply voltage V Min Typ Max Notes Refer to the thermal/power tables under the appropriate SOPN section for this OPNspecific parameter. VID_VDD VID_VDD VID_VDD -50 mV + 50 mV 0.95 1.00 MaxVID_VDD 1,2 VID_VDDNB VID_VDDNB VID_VDDNB -50 mV + 50 mV Refer to the thermal/power tables under the appropriate SOPN section for this OPNspecific parameter. 0.95 1.00 1.30 2 VDDNB_PON Metal Mask VDDNB V Notes: 1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device manufacturing. 2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS). Table 27. bsmmmmrr S ncdd AC Operating Conditions for VDD Power Supply Symbol Parameter Units VDD_ac VDD Supply Voltage V VDDNB_ac VDDNB Supply Voltage V Min Typ VID_VDD VID_VDD -100 mV VID_VDDNB VID_VDDNB -100 mV Max Notes VID_VDD + 1 100 mV VID_VDDNB 1 + 100 mV Notes: 1) The voltage set-point must be contained within the DC specification in order to ensure proper operation. Voltage ripple and transient events outside the DC specification must remain within the AC specification at all times. Transients above dc max must return to within the DC specification within 15 S and must stay under a triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 7 on page 94. Power Supply Specifications 93 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 28. bsmmmmrr S ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies Symbol VDDIO VDDIO VLDT VDDA VDD, VDDNB Parameter VDDIO Supply Voltage for DDR2 electricals VDDIO Supply Voltage for DDR3 electricals VLDT Supply Voltage VDDA Supply Voltage VDD, VDDNB Supply Voltage Units Max V 2.05 V 1.65 V V 1.32 2.70 Max AC Voltage V VID + 100 mV VID + 50 mV VID VID - 50 mV VID - 1 00 mV 15 S Figure 7. Socket Fr6 (1207) AC and DC Transient Limits Power Supply Specifications 94 PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Table 29. bsmmmmrr S ncdd AC and DC Operating Conditions for non-VDD Power Supplies Symbol VDDIO_dc Parameter VDDIO Supply Voltage for DDR2 electricals Units Min Typ Max Notes V 1.70 1.80 1.90 1 VDDIO_ac VDDIO Supply voltage V VLDT VLDT Supply Voltage VTT Supply Voltage for DDR2 electricals V VDDIO_dc -150 mV 1.14 V 0.85 VTT_dc VTT_ac VTT Supply Voltage V VDDA VDDA Supply Voltage VDDIO Power Supply Current VTT Power Supply Current VLDT Power Supply Current VDDA Power Supply Current V IDDIO1 ITT1 ILDT IDDA VTT_dc -75mV 2.40 1.20 VDDIO_dc +150 mV 1.26 0.90 0.95 VDDIO_dc VTT_dc 2.50 VTT_dc + 75mV 2.60 2, 3 12 4 2, 3 A 3.60 7, 9 A 1.75 6, 8, 9 A 1.50/ link 0.60/ link 5, 9,11 9,10,11 mA 250 9 Notes: 1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid violating the VDDIO_dc minimum spec of 1.70 V. 2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits switching. 3) Power supply A/C measurements use a 20-MHz scope bandwidth limit. 4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_DC and stays within the specified maximum and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage regulator setting must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range of 0.85 V and 0.95 V. 5) ILDT is specified for each Gen3 16x16-bit HyperTransportTM link operating between 2.4 GT/s and 4.8 GT/s. 6) VTT must both sink and source current. 7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 9) This specification reflects the values published in the appropriate power roadmap document. 10) ILDT is specified for each unconnected HyperTransport link or for each 16x16-bit Gen1 HyperTransport link operating at max 2.0 GT/s or less. 11) The maximum value is listed as a per link value to allow for a mix of Gen1 and Gen3 links. All links must be powered on a processor. Please refer to errata 396-397. 12) Tolerances apply to both VLDT_dc and VLDT_ac conditions. Power Supply Specifications 95 PID: 43374 Rev 3.19 - June 2010 4 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet Power Limit Encoding IddValue and IddDiv are available for each P-state in P-state registers MSRC001_00[68:64]. For more details, refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116. Power Limit Encoding 96 PID: 43374 Rev 3.19 - June 2010 5 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet MTOPS Table 30 shows Composite Theoretical Performance (CTP) calculations. The calculations are stated in Millions of Theoretical Operations per Second (MTOPS) and are based upon a formula in the United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4). All calculations contained herein are subject to change without notice. AMD makes no representation or warranty as to the accuracy or reliability of such calculations. THESE CALCULATIONS ARE PROVIDED "AS IS" AND AMD MAKES NO WARRANTIES WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS. Furthermore, AMD shall have no liability for any losses or damages including direct, indirect, special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or other economic loss occurring in connection with use of the calculations, even if AMD has been advised in advance of the possibility of such damages. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein. Table 30. Composite Theoretical Performance (CTP) Calculation Frequency 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000 3100 3200 3300 3400 MTOPS MTOPS MTOPS MTOPS S ingle-Core Dual-Core Triple-Core Quad-Core 8,667 16,267 23,867 31,467 9,209 17,284 25,359 33,434 9,750 18,300 26,850 35,400 10,292 19,317 28,342 37,367 10,834 20,334 29,834 39,334 11,375 21,350 31,325 41,300 11,917 22,367 32,817 43,267 12,459 23,384 34,309 45,234 13,000 24,400 35,800 47,200 13,542 25,417 37,292 49,167 14,084 26,434 38,784 51,134 14,625 27,450 40,275 53,100 15,167 28,467 41,767 55,067 15,709 29,484 43,259 57,034 16,250 30,500 44,750 59,000 16,792 31,517 46,242 60,967 17,334 32,534 47,734 62,934 17,875 33,550 49,225 64,900 18,417 34,567 50,717 66,867 MTOPS S ix-Core 46,667 49,584 52,500 55,417 58,334 61,250 64,167 67,084 70,000 72,917 75,834 78,750 81,667 84,584 87,500 90,417 93,334 96,250 99,167 MTOPS MTOPS MTOPS Eight-Core Twelve-Core 61,867 92,267 65,734 98,034 69,600 103,800 73,467 109,567 77,334 115,334 81,200 121,100 85,067 126,867 88,934 132,634 92,800 138,400 96,667 144,167 100,534 149,934 104,400 155,700 108,267 161,467 112,134 167,234 116,000 173,000 119,867 178,767 123,734 184,534 127,600 190,300 131,467 196,067 97 PID: 43374 Rev 3.19 - June 2010 6 AMD Family 10h Server and Workstation Processor Power and Thermal Data Sheet APP Table 31 shows the Adjusted Peak Performance (APP) calculations for the AMD OpteronTM processor. The calculations are stated in millions of Weighted Teraflops (WT) and are based upon a formula in the United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4). All calculations contained herein are subject to change without notice. AMD makes no representation or warranty as to the accuracy or reliability of such calculations. THESE CALCULATIONS ARE PROVIDED "AS IS" AND AMD MAKES NO WARRANTIES WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS. Furthermore, AMD shall have no liability for any losses or damages including direct, indirect, special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or other economic loss occurring in connection with use of the Calculations, even if AMD has been advised in advance of the possibility of such damages. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein. Table 31. Adjusted Peak Performance (APP) Calculation Frequency APP S ingle-Core APP Dual-Core APP Triple-Core APP Quad-Core APP S ix-Core APP Eight-Core APP Twelve-Core 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000 3100 3200 3300 3400 0.0019 0.0020 0.0022 0.0023 0.0024 0.0025 0.0026 0.0028 0.0029 0.0030 0.0031 0.0032 0.0034 0.0035 0.0036 0.0037 0.0038 0.0040 0.0041 0.0038 0.0041 0.0043 0.0046 0.0048 0.0050 0.0053 0.0055 0.0058 0.0060 0.0062 0.0065 0.0067 0.0070 0.0072 0.0074 0.0077 0.0079 0.0082 0.0058 0.0061 0.0065 0.0068 0.0072 0.0076 0.0079 0.0083 0.0086 0.0090 0.0094 0.0097 0.0101 0.0104 0.0108 0.0112 0.0115 0.0119 0.0122 0.0077 0.0082 0.0086 0.0091 0.0096 0.0101 0.0106 0.0110 0.0115 0.0120 0.0125 0.0130 0.0134 0.0139 0.0144 0.0149 0.0154 0.0158 0.0163 0.0115 0.0122 0.0130 0.0137 0.0144 0.0151 0.0158 0.0166 0.0173 0.0180 0.0187 0.0194 0.0202 0.0209 0.0216 0.0223 0.0230 0.0238 0.0245 0.0154 0.0163 0.0173 0.0182 0.0192 0.0202 0.0211 0.0221 0.0230 0.0240 0.0250 0.0259 0.0269 0.0278 0.0288 0.0298 0.0307 0.0317 0.0326 0.0230 0.0245 0.0259 0.0274 0.0288 0.0302 0.0317 0.0331 0.0346 0.0360 0.0374 0.0389 0.0403 0.0418 0.0432 0.0446 0.0461 0.0475 0.0490 APP 98