Advanced Micro Devices
AMD Family 10h
Server and Workstation Processor
Power and Thermal Data Sheet
Publication # 43374
Revision: 3.19
Issue Date: June 2010
Trademarks
AMD, the AMD Arrow logo, AMD Opteron, and combinations thereof are trademarks of Advanced Micro Devices, Inc.
Microsoft and Windows Vista are registered trademarks of the Microsoft Corporation.
HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
© 2009, 2010 Advanced Micro Devices, Inc. All rights reserved.
The contents of this document are provided in connection with Advanced Micro Devices,
Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the
accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. The informa-
tion contained herein may be of a preliminary or advance nature and is subject to change
without notice. No license, whether express, implied, arising by estoppel or otherwise, to
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claims any express or implied warranty, relating to its products including, but not limited
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AMD’s products are not designed, intended, authorized or warranted for use as compo-
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environmental damage may occur. AMD reserves the right to discontinue or make changes
to its products at any time without notice.
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Table of Contents
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1 Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
1.1.1 Ordering Part Number Description Section Overview . . . . . . . . . . . . . . . . . . 8
1.1.2 Thermal and Power Table Guide Overview . . . . . . . . . . . . . . . . . . . . . . . . . .8
1.1.3 Thermal and Power Table Section Overview . . . . . . . . . . . . . . . . . . . . . . . . .9
1.1.4 Power Supply Specification Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . 9
1.1.5 Power Limit Encoding Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.2 Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
1.3 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
2 AMD Opteron™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.1 AMD Opteron™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . . 12
2.2 AMD Opteron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 28
2.3 AMD Opteron Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . . 30
2.3.1 OS mmmm PA pnc GC (79 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.3.2 OS mmmm PA pnc GD (79 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2.3.3 OS mmmm PA pnc GE (79 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
2.3.4 OS mmmm WA pnc GC (115 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.3.5 OE mmmm FM pnc GD (79 W Embedded Server, Fr2 (1207)) Thermal
and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
2.3.6 OS mmmm WE pnc GD (95 W Server, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
2.3.7 OS mmmm WA pnc GE (115 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.3.8 OS mmmm WA pnc GD (115 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
2.3.9 OS mmmm WB pnc GD (115 W Server, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.3.10 OS mmmm YA pnc GD (137 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
2.3.11 OS mmmm WA pnc GH (115 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
2.3.12 OS mmmm PA pnc GH (79 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.3.13 OS mmmm YA pnc GH (137 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.3.14 OS mmmm WB pnc GH (115 W Server, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2.3.15 OE mmmm FM pnc GH (79 W Embedded Server, Fr2 (1207)) Thermal
and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
2.3.16 OS mmmm WA pnc GI (115 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
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2.3.17 OS mmmm PA pnc GI (79 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
2.3.18 OS mmmm YA pnc GI (137 W Server, Fr2 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
2.3.19 OS mmmm WH pnc GI (115 W Server, Fr5 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
2.3.20 OS mmmm PC pnc GI (79 W Server, Fr5 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
2.3.21 OS mmmm YC pnc GI (137 W Server, Fr5 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
2.3.22 OS mmmm WG pnc GI (115 W Server, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
2.3.23 OS mmmm NA pnc GI (60 W Server, Fr5 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
2.3.24 OS mmmm WJ pnc GN (115 W Server, Fr6 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
2.3.25 OS mmmm PD pnc GN (79 W Server, Fr6 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
2.3.26 OS mmmm NB pnc GN (60 W Server, Fr6 (1207)) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
2.3.27 OS mmmm WK pnc GO (115 W Server, G34r1) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
2.3.28 OS mmmm VA pnc GO (85 W Server, G34r1) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
2.3.29 OS mmmm YE pnc GO (140 W Server, G34r1) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
2.3.30 OS mmmm WL pnc GO (95 W Server, C32) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
2.3.31 OS mmmm WL pnc GN (95 W Server, C32) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
2.3.32 OS mmmm OF pnc GO (65 W Server, C32) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
2.3.33 OS mmmm HJ pnc GO (35 W Server, C32) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
3 Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
3.1 bsmmmmrr L ncdd – Fr2 (1207) Power Supply Operating Conditions . . . . . . . . . . 81
3.2 bsmmmmrr P ncdd – Fr5 (1207) Power Supply Operating Conditions . . . . . . . . . . . 84
3.3 bsmmmmrr J ncdd – AM2r2 Power Supply Operating Conditions . . . . . . . . . . . . . .87
3.4 bsmmmmrr K ncdd – AM3 Power Supply Operating Conditions . . . . . . . . . . . . . . .90
3.5 bsmmmmrr S ncdd – Fr6 (1207) Power Supply Operating Conditions . . . . . . . . . .93
4 Power Limit Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
5 MTOPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
6 APP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
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List of Figures
Figure 1. AMD Opteron™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . . 12
Figure 2. AMD Opteron Processor Ordering Part Number Example . . . . . . . . . . . . . . . 12
Figure 3. Socket Fr2 (1207) AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . 82
Figure 4. Socket Fr5 (1207) AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . 85
Figure 5. Socket AM2 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Figure 6. Socket AM3 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Figure 7. Socket Fr6 (1207) AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . 94
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List of Tables
List of Tables
Table 1. AMD Opteron™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . 13
Table 2. AMD Opteron Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3. AMD Opteron Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 4. AMD Opteron Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 5. AMD Opteron Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 6. AMD Opteron Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . . 15
Table 7. AMD Opteron Processor Segment Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 8. AMD Opteron Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 9. AMD Opteron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . 28
Table 10. bsmmmmrr L ncdd DC Operating Conditions for VDD Power Supply . . . . . . 81
Table 11. bsmmmmrr L ncdd AC Operating Conditions for VDD Power Supply . . . . . . 81
Table 12. bsmmmmrr L ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 13. bsmmmmrr L ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 14. bsmmmmrr P ncdd DC Operating Conditions for VDD Power Supply . . . . . 84
Table 15. bsmmmmrr P ncdd AC Operating Conditions for VDD Power Supply . . . . . 84
Table 16. bsmmmmrr P ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Table 17. bsmmmmrr P ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Table 18. bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply . . . . . 87
Table 19. bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply . . . . . 87
Table 20. bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 21. bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 22. bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply . . . . . 90
Table 23. bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply . . . . . 90
Table 24. bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 25. bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Table 26. bsmmmmrr S ncdd DC Operating Conditions for VDD Power Supply . . . . . 93
Table 27. bsmmmmrr S ncdd AC Operating Conditions for VDD Power Supply . . . . . 93
Table 28. bsmmmmrr S ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Table 29. bsmmmmrr S ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table 30. Composite Theoretical Performance (CTP) Calculation . . . . . . . . . . . . . . . . . 97
Table 31. Adjusted Peak Performance (APP) Calculation . . . . . . . . . . . . . . . . . . . . . . . 98
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Revision History
Revision History
Date Revision Description
June 2010 3.19 Fifth public release.
• Added new OPNs.
• Added new definitions to Section 1.3 on page 10.
• Modified Table 5 on page 14 to differentiate G34 and C32 infra-
structures from F and AM infrastructures.
• Added Max DDR Speed and Max HT Link Speed to Table 6 on
page 15.
• Changed IDD Max to TDC and corrected values in the thermal and
power specification tables for all Socket G34 and Socket C32 OPNs
(existing Section 2.3.27 through Section 2.3.29 and new
Section 2.3.30 through Section 2.3.33).
March 2010 3.15 Fourth public release.
• Added new OPNs.
September 2009 3.07 Third public release.
• Added OPN.
• Updated the Thermal and Power Specifications tables for 115-W
and 79-W Fr6 (1207) Server Processors in Section 2.3.24 and
Section 2.3.25.
• Modified ILDT specs in the Power Supply Specifications section.
June 2009 3.04 Second public release.
April 2009 3.00 Initial Public release.
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8Overview
1 Overview
This document contains processor thermal specifications and power specifications. The specifications
in this document supersede those found in the power roadmaps. For all other electrical specifications,
refer to the appropriate product data sheet and the AMD Family 10h Processor Electrical Data Sheet,
order# 40014.
1.1 Organization
This document is organized into the following sections:
• Document overview (Section 1)
• One section for each brand represented in the server/workstation segment, containing the following
subsections:
• Ordering Part Number (OPN) description (content overview in Section 1.1.1)
• Thermal and power specification tables (content overview in Section 1.1.3 on page 9)
• Power supply specifications (content overview in Section 1.1.4 on page 9)
• Power Limit Encoding information (content overview in Section 1.1.5)
•MTOPS section in Table 30 on page 97
•APP section in Table 31 on page 98
1.1.1 Ordering Part Number Description Section Overview
The Ordering Part Number (OPN) Description section contains a depiction and description of a valid
OPN for the brand contained in that chapter. Each character or group of characters within an OPN has
a specific meaning (for example, model number, socket compatibility). The meaning of each OPN
character is detailed in the OPN description section. Each OPN identifies a processor with a unique
thermal and power specification table entry.
The OPN description section also contains a full description of the Subsection Ordering Part Number
(SOPN) abstraction characters for the brand contained in that chapter. SOPNs are used to group and
organize OPNs into subsections for the thermal and power tables and power supply specifications. A
definition of SOPNs is contained in Section 1.3 on page 10.
1.1.2 Thermal and Power Table Guide Overview
The thermal and power table guide section contains a table mapping SOPNs and the properties
associated with their defined characters to the proper thermal and power table subsections and page
numbers. This table is designed to be used as a quick reference for finding the appropriate subsection
for the thermal and power tables corresponding to an SOPN.
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1.1.3 Thermal and Power Table Section Overview
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, ambient temperature assumptions) and power delivery (for example, voltage and
current, and power dissipation for each P-state).
The thermal and power specification tables are organized into subsections that correspond to
Subsection Ordering Part Numbers (SOPNs). SOPNs for the thermal and power tables have the
brand, power limit, and part definition characters defined. They are of the form AB mmmmrrpnc GH.
Each chapter provides a guide table that maps the SOPNs in the thermal and power tables within that
chapter to the appropriate subsection number and page number. Within each subsection the OPNs are
sorted by model number, socket compatibility, voltage, temperature, and cache size, respectively.
1.1.4 Power Supply Specification Chapter Overview
The power supply specification chapter contains the operating conditions and requirements for all
voltage planes required by the processor. Power supply requirements are organized into subsections
that correspond to socket infrastructure. The socket infrastructure of a particular OPN can be found in
Table 5 on page 14.
1.1.5 Power Limit Encoding Chapter Overview
The power limit encoding section defines power encodings and their interpretation. Refer to the BIOS
and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for details.
1.2 Conventions
Following are conventions used with numbers.
• Binary numbers. Binary numbers are indicated by appending a “b” at the end, for example: 0110b.
• Decimal numbers. Unless specified otherwise, all numbers are decimal.
• Hexadecimal numbers. Hexadecimal numbers are indicated by appending an “h” to the end, for
example: 45F8h.
• Underscores in numbers. Underscores are used to break up numbers to make them more readable,
for example: 0110_1100b. They do not imply any operation.
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10Overview
1.3 Definitions
Following are some key definitions.
•CPU COF. CPU Current Operating Frequency.
•CTP. Composite Theoretical Performance.
• Dual-plane. Platforms in which the VDD and VDDNB (Northbridge) planes are isolated on the
platform and controlled as separate voltages.
•DP. Dual Processor. Each link on DP models supports connections to I/O devices, and any one link
or any sub-link can connect to another MP or DP processor.
•Max Power. The maximum sustained power dissipated by the processor at nominal voltage and
maximum specified case or die temperature.
•MP. Multiprocessor. Each link on MP models supports connections to I/O devices or an MP or DP
processor. Systems are limited to the number of nodes supported by all the processors. Refer to the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for
more details.
•MTOPS. Millions Of Theoretical Operations Per Second.
•NB COF. Northbridge Current Operating Frequency.
•OPN. Ordering Part Number. An OPN uniquely identifies a processor and its associated
specifications in the thermal and power tables and power supply specifications section.
• P-state. Processor Performance State. P-states are valid combinations of CPU voltage, CPU COF,
Northbridge voltage, and NB COF.
• Single-plane. Platforms in which all the VDD and VDDNB power planes are connected together
on the platform and controlled as a single power plane.
•SOPN. Subsection Ordering Part Number. An SOPN is an OPN with a subset of defined characters.
All defined characters in an SOPN are bolded and capitalized. All abstracted characters in an SOPN
are in non-bolded lowercase. Information for any OPN that matches all of the defined characters in
an SOPN is contained in that subsection. For example, OPN AB1234CDE5FGH appears under the
subsection for SOPN AB mmmmrrpnc GH. The abstracted (lowercase) character definitions for
SOPNs are contained in the OPN description section of each chapter.
•State. Indicates the ACPI defined sleep state, power state, and performance state for the related
specifications. 'x' indicates the related specifications are independent of the associated ACPI state.
For example, S0.C0.P0 indicates sleep state 0, power state 0, and performance state 0. S3.Cx.Px
indicates sleep state 3 entered from any power and performance state combination.
•TDC. Thermal Design Current. The maximum sustained current that the voltage regulator must
support. TDC is defined at nominal voltage and maximum specified case or die temperature.
•TDP. Thermal Design Power. The thermal design power is the maximum power a processor can
draw for a thermally significant period while running commercially useful software. The
constraining conditions for TDP are specified in the notes in the thermal and power tables.
•UP. Uniprocessor. Each link on UP models supports connections to I/O devices.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
11Overview
•VID_VDD. The VID_VDD voltage is the VID-requested VDD supply level. Refer to the BIOS and
Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for VID to
voltage translation specifications.
•VID_VDDNB. The VID_VDDNB voltage is the VID-requested VDD Northbridge supply level.
Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors,
order# 31116, for VID to voltage translation specifications.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
12AMD Opteron™ Processor
2 AMD Opteron™ Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Opteron™ processor. Each column in the thermal and power tables represents a specific
Ordering Part Number (OPN). Section 2.1 provides an example of the OPN structure for this
processor family.
2.1 AMD Opteron™ Processor Ordering Part Number Description
Figure 1. AMD Opteron™ Processor Ordering Part Number Diagram
Figure 2. AMD Opteron™ Processor Ordering Part Number Example
b s mmmm rr p n c dd
Part Definition
C
ache Size
N
umber of Cores
P
ackage
R
oadmap
S
egment
M
odel
B
rand
Part Definition: GC (see Table 1)
Cache Size: B (see Table 2)
Number of Cores: 4 (see Table 3)
Package: L (see Table 4)
Roadmap: PA (see Table 5)
Model Number: 8347 (see Table 6)
Brand: O = AMD Opteron™ Processor
Segment: S = Server (see Table 7)
O S 834
7
PA L 4 BGC
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
13AMD Opteron™ Processor
Table 1. AMD Opteron™ Processor Part Definition Options
Part
Definition Revision CPUID 8000_0001h EAX [31:0]
(CPUID)
GC Rev B1 00100F21h
GE Rev BA 00100F2Ah
GD Rev B2 00100F22h
GH Rev B3 00100F23h
GI Rev C2 00100F42h
GN Rev D0 00100F80h
GO Rev D1 00100F81h
Table 2. AMD Opteron™ Processor Cache Size Options
OPN
Character L2 Cache Size L3 Cache Size
B 512 KB 2048 KB
D 512 KB 6144 KB
E 512 KB 12288 KB
Table 3. AMD Opteron™ Processor Number of Cores
OPN
Character
Number of
Cores
44
66
88
C12
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
14AMD Opteron™ Processor
Table 4. AMD Opteron™ Processor Package Options
OPN
Character Package
L Fr2 (1207)
JAM2r2
KAM3
P Fr5 (1207)
S Fr6 (1207)
TG34r1
UC32
Table 5. AMD Opteron™ Processor Roadmap Options
OPN
Character Max TDP Socket
Infrastructure
IDD Max
(VDD)
IDD Max
(NB)
IDD TDC
(VDD)
IDD TDC
(NB) HS Class
FM 79 W Fr2 (1207) 60 A 20 A --HS57
PA 79 W Fr2 (1207) 60 A 20 A --HS54
WA 115 W Fr2 (1207) 80 A 20 A --HS65
WB 115 W AM2r2 80 A 20 A --HS65
WE 95 W AM2r2 80 A 20 A --HS65
YA 137 W Fr2 (1207) 95 A 20 A --HS72
WH 115 W Fr5 (1207) 80 A 20 A --HS65
WG 115 W AM3 95 A 20 A --HS65
PC 79 W Fr5 (1207) 60 A 20 A --HS54
YC 137 W Fr5 (1207) 95 A 20 A --HS72
NA 60 W Fr5 (1207) 50 A 20 A --HS54
WJ 115 W Fr6 (1207) 80 A 20 A --HS65
PD 79 W Fr6 (1207) 60 A 20 A --HS54
NB 60 W Fr6 (1207) 50 A 20 A --HS54
WK 115 W G34r1 - - 110 A 25 A HS70, HS65
VA 85 W G34r1 - - 80 A 25 A HS65,HS63
YE 140 W G34r1 - - 115 A 25 A HS75,HS72
WL 95 W C32 - - 95 A 20 A HS73,HS65
OF 65 W C32 - - 70 A 20 A HS75,HS72
HJ 35 W C32 - - 44 A 12 A HS63,HS55
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
15AMD Opteron™ Processor
Table 6. AMD Opteron™ Processor Model Number Options
Core
Frequency
Single-Plane
NB Frequency
Dual-Plane
NB Frequency
Uni-
Processor
Dual-
Processor
Multi-
Processor
Max DDR
Speed
Max HT
Link
Speed
1700 MHz 1200 MHz 1400 MHz – 2344 – 800 MT/s 1000 MT/s
1700 MHz 1400 MHz 1600 MHz – 2344 – 800 MT/s 1000 MT/s
1700 MHz 1400 MHz 1600 MHz – 23GF – 800 MT/s 2000 MT/s
1700 MHz N/A 1800 MHz – – 6164 1333 MT/s 6400 MT/s
1700 MHz N/A 1800 MHz – 4162 – 1333 MT/s 6400 MT/s
1800 MHz 1400 MHz 1600 MHz 13HF 23HF 83HF 800 MT/s 2000 MT/s
1800 MHz 1400 MHz 1600 MHz – 2346 8346 800 MT/s 1000 MT/s
1800 MHz N/A 2000 MHz – 2419 - 800 MT/s 4800 MT/s
1800 MHz N/A 1800 MHz – – 6124 1333 MT/s 6400 MT/s
1800 MHz N/A 1800 MHz – 4164 – 1333 MT/s 6400 MT/s
1900 MHz 1400 MHz 1600 MHz – 2347 8347 800 MT/s 1000 MT/s
1900 MHz N/A 1800 MHz – – 6168 1333 MT/s 6400 MT/s
2000 MHz 1400 MHz 1800 MHz – 2350 8350 800 MT/s 1000 MT/s
2000 MHz 1600 MHz 1800 MHz – 2350 8350 800 MT/s 1000 MT/s
2000 MHz N/A 2200 MHz – 2423 – 800 MT/s 4800 MT/s
2000 MHz N/A 1800 MHz – – 1333 MT/s 6400 MT/s
2000 MHz N/A 1800 MHz – – 6128 1333 MT/s 6400 MT/s
2000 MHz N/A 1800 MHz – – 1333 MT/s 6400 MT/s
2100 MHz 1600 MHz 1800 MHz – 2352 – 800 MT/s 2000 MT/s
2100 MHz 1600 MHz 1800 MHz 1352 – – 800 MT/s 3600 MT/s
2100 MHz 1600 MHz 2000 MHz – 2372 800 MT/s 2000 MT/s
2100 MHz 1600 MHz 2000 MHz – 2373 8373 800 MT/s 4000 MT/s
2100 MHz N/A 2200 MHz – 2425 8425 800 MT/s 4800 MT/s
2100 MHz N/A 1800 MHz – – 6172 1333 MT/s 6400 MT/s
2100 MHz N/A 2200 MHz – 4170 – 1333 MT/s 6400 MT/s
2200 MHz 1600 MHz 1800 MHz – 2354 8354 800 MT/s 2000 MT/s
2200 MHz 1600 MHz 1800 MHz 1354 – – 800 MT/s 3600 MT/s
2200 MHz 1600 MHz 2000 MHz – 2374 8374 800 MT/s 2000 MT/s
2200 MHz N/A 2200 MHz – 2427 – 800 MT/s 4800 MT/s
2200 MHz N/A 1800 MHz – – 6174 1333 MT/s 6400 MT/s
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
16AMD Opteron™ Processor
2200 MHz N/A 2200 MHz – 4122 – 1333 MT/s 6400 MT/s
2300 MHz 1600 MHz 2000 MHz – 2376 8376 800 MT/s 2000 MT/s
2300 MHz 1600 MHz 2000 MHz – 2377 – 800 MT/s 4000 MT/s
2300 MHz 1600 MHz 2000 MHz – 2356 8356 800 MT/s 2000 MT/s
2300 MHz 1600 MHz 2000 MHz 1356 – – 800 MT/s 4000 MT/s
2300 MHz N/A 1800 MHz – – 6134 1333 MT/s 6400 MT/s
2300 MHz N/A 1800 MHz – – 6176 1333 MT/s 6400 MT/s
2300 MHz N/A 1800 MHz – – 1333 MT/s 6400 MT/s
2300 MHz N/A 2200 MHz – 4174 – 1333 MT/s 6400 MT/s
2400 MHz 1600 MHz 2000 MHz – 2358 8358 800 MT/s 1000 MT/s
2400 MHz 1600 MHz 2000 MHz – 2378 8378 800 MT/s 2000 MT/s
2400 MHz 1600 MHz 2000 MHz – 2379 8379 800 MT/s 4000 MT/s
2400 MHz N/A 2200 MHz – 2431 8431 800 MT/s 4800 MT/s
2400 MHz N/A 1800 MHz – – 6136 1333 MT/s 6400 MT/s
2400 MHz N/A 2200 MHz – 4176 – 1333 MT/s 6400 MT/s
2500 MHz 1600 MHz 2000 MHz – 2360 8360 800 MT/s 1000 MT/s
2500 MHz 1600 MHz 2000 MHz – 2380 8380 800 MT/s 2000 MT/s
2500 MHz 1600 MHz 2000 MHz – 2381 8381 800 MT/s 4000 Mt/s
2500 MHz 1600 MHz 2200 MHz 1381 – – 1333 MT/s 4400 MT/s
2600 MHz 1600 MHz 2200 MHz – 2382 8382 800 MT/s 2000 MT/s
2600 MHz N/A 2200 MHz – 2435 8435 800 MT/s 4800 MT/s
2600 MHz N/A 2200 MHz – 4130 – 1333 MT/s 6400 MT/s
2600 MHz N/A 2200 MHz – 4180 – 1333 MT/s 6400 MT/s
2700 MHz 1600 MHz 2200 MHz – 2384 8384 800 MT/s 2000 MT/s
2700 MHz 1600 MHz 2200 MHz 1385 – – 1333 MT/s 4400 MT/s
2800 MHz 1600 MHz 2200 MHz – 2386 8386 800 MT/s 2000 MT/s
2800 MHz 1600 MHz 2200 MHz – 2387 8387 800 MT/s 4400 MT/s
2800 MHz 1600 MHz 2200 MHz – 800 MT/s 4400 MT/s
2800 MHz N/A 2200 MHz – 4184 – 1333 MT/s 6400 MT/s
2900 MHz 1600 MHz 2200 MHz – 2389 8389 800 MT/s 4400 MT/s
2900 MHz 1600 MHz 2200 MHz 1389 – – 1333 MT/s 4400 MT/s
3100 MHz 1600 MHz 2200 MHz – 2393 8393 800 MT/s 4400 MT/s
Table 6. AMD Opteron™ Processor Model Number Options (Continued)
Core
Frequency
Single-Plane
NB Frequency
Dual-Plane
NB Frequency
Uni-
Processor
Dual-
Processor
Multi-
Processor
Max DDR
Speed
Max HT
Link
Speed
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
17AMD Opteron™ Processor
Table 7. AMD Opteron™ Processor Segment Options
OPN
Character Segment
E Embedded Server
SServer
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
18AMD Opteron™ Processor
Table 8. AMD Opteron™ Processor Thermal Profiles
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
Thermal Profile A
Heat S ink Thermal
Resistance 0.29°C/W
Heat S ink Local
Ambi e nt 42°C
Profile Thermal
Resistance 0.232°C/W
Profile Ambient 48°C
Heatsink Class HS65
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.0°C
35.0 W 56.1°C
40.0 W 57.3°C
45.0 W 58.4°C
50.0 W 59.6°C
55.0 W 60.8°C
60.0 W 61.9°C
65.0 W 63.1°C
70.0 W 64.2°C
75.0 W 65.4°C
80.0 W 66.6°C
85.0 W 67.7°C
90.0 W 68.9°C
95.0 W 70.0°C
Thermal Profile B
Heat Sink Thermal
Resistance 0.42°C/W
Heat Sink Local
Ambi e n t 42°C
Profile Thermal
Resistance 0.338°C/W
Profile Ambient 48°C
Heatsink Class HS54
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 56.5°C
30.0 W 58.1°C
35.0 W 59.8°C
40.0 W 61.5°C
45.0 W 63.2°C
50.0 W 64.9°C
55.0 W 66.6°C
60.0 W 68.3°C
65.0 W 70.0°C
68.0 W 71.0°C
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
19AMD Opteron™ Processor
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
Thermal Profile C
Heat S ink Thermal
Resistance 0.24°C/W
Heat S ink Local
Ambi e nt 38°C
Profile Thermal
Resistance 0.197°C/W
Profile Ambient 44°C
Heatsink Class HS72
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.0°C
35.0 W 55.0°C
40.0 W 55.0°C
45.0 W 55.0°C
50.0 W 55.0°C
55.0 W 55.0°C
60.0 W 55.8°C
65.0 W 56.8°C
70.0 W 57.8°C
75.0 W 58.8°C
80.0 W 59.8°C
85.0 W 60.7°C
90.0 W 61.7°C
95.0 W 62.7°C
100.0 W 63.7°C
105.0 W 64.7°C
110.0 W 65.7°C
115.0 W 66.7°C
120.0 W 67.6°C
125.0 W 68.6°C
130.0 W 69.6°C
135.0 W 70.6°C
137.0 W 71.0°C
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
20AMD Opteron™ Processor
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
Thermal Profile F
Heat Sink Thermal
Resistance 0.39°C/W
Heat Sink Local
Ambi e n t 55°C
Profile Thermal
Resistance 0.316°C/W
Profile Ambient 61°C
Heatsink Class HS57
TDP Tcase Max
0.0 W 61.0°C
5.0 W 62.6°C
10.0 W 64.2°C
15.0 W 65.7°C
20.0 W 67.3°C
25.0 W 68.9°C
30.0 W 70.5°C
35.0 W 72.1°C
40.0 W 73.6°C
45.0 W 75.2°C
50.0 W 76.8°C
55.0 W 78.4°C
60.0 W 80.0°C
65.0 W 81.5°C
70.0 W 83.1°C
75.0 W 84.7°C
79.0 W 86.0°C
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
21AMD Opteron™ Processor
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
Thermal Profile G
Heat S i nk Thermal
Re si s tance 0.30°C/W
Heat S ink Local
Ambi e nt 42°C
Profile Thermal
Re si s tance 0.252°C/W
Profile Ambient 48°C
Heatsink Class HS65
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.6°C
35.0 W 56.8°C
40.0 W 58.1°C
45.0 W 59.3°C
50.0 W 60.6°C
55.0 W 61.9°C
60.0 W 63.1°C
65.0 W 64.4°C
70.0 W 65.6°C
75.0 W 66.9°C
80.0 W 68.2°C
85.0 W 69.4°C
90.0 W 70.7°C
95.0 W 71.9°C
100.0 W 73.2°C
105.0 W 74.5°C
110.0 W 75.7°C
115.0 W 77.0°C
Thermal Profile H
Heat S ink Thermal
Re si s tance 0.43°C/W
Heat S ink Local
Ambi e nt 42°C
Profile Thermal
Re si s tance 0.354°C/W
Profile Ambient 48°C
Heatsink Class HS54
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.1°C
25.0 W 56.9°C
30.0 W 58.6°C
35.0 W 60.4°C
40.0 W 62.2°C
45.0 W 63.9°C
50.0 W 65.7°C
55.0 W 67.5°C
60.0 W 69.2°C
65.0 W 71.0°C
70.0 W 72.8°C
75.0 W 74.6°C
79.0 W 76.0°C
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
22AMD Opteron™ Processor
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
Thermal Profile I
Heat S ink Thermal
Re si s tance 0.25°C/W
Heat S ink Local
Ambi e nt 38°C
Profile Thermal
Re si s tance 0.212°C/W
Profile Ambient 44°C
Heatsink Class HS72
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.0°C
35.0 W 55.0°C
40.0 W 55.0°C
45.0 W 55.0°C
50.0 W 55.0°C
55.0 W 55.7°C
60.0 W 56.7°C
65.0 W 57.8°C
70.0 W 58.8°C
75.0 W 59.9°C
80.0 W 61.0°C
85.0 W 62.0°C
90.0 W 63.1°C
95.0 W 64.1°C
100.0 W 65.2°C
105.0 W 66.3°C
110.0 W 67.3°C
115.0 W 68.4°C
120.0 W 69.4°C
125.0 W 70.5°C
130.0 W 71.6°C
135.0 W 72.6°C
137.0 W 73.0°C
Thermal Profile J
Heat S ink Thermal
Re si s tance 0.43°C/W
Heat S ink Local
Ambi e nt 42°C
Profile Thermal
Re si s tance 0.333°C/W
Profile Ambient 48°C
Heatsink Class HS54
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 56.3°C
30.0 W 58.0°C
35.0 W 59.7°C
40.0 W 61.3°C
45.0 W 63.0°C
50.0 W 64.7°C
55.0 W 66.3°C
60.0 W 68.0°C
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
23AMD Opteron™ Processor
. Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
Thermal Profile K
Heat S ink Thermal
Resistance 0.29°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Resistance 0.243°C/W
Profile Ambient 48°C
Heatsink Class HS65
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.3°C
35.0 W 56.5°C
40.0 W 57.7°C
45.0 W 59.0°C
50.0 W 60.2°C
55.0 W 61.4°C
60.0 W 62.6°C
65.0 W 63.8°C
70.0 W 65.0°C
75.0 W 66.3°C
80.0 W 67.5°C
85.0 W 68.7°C
90.0 W 69.9°C
95.0 W 71.1°C
100.0 W 72.3°C
105.0 W 73.6°C
110.0 W 74.8°C
115.0 W 76.0°C
Thermal Profile P
Heat S ink Thermal
Re si s tance 0.43°C/W
Heat S ink Local
Ambi e nt 42°C
Profile Thermal
Re si s tance 0.333°C/W
Profile Ambient 48°C
Heatsink Class HS54
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 56.3°C
30.0 W 58.0°C
35.0 W 59.7°C
40.0 W 61.3°C
45.0 W 63.0°C
50.0 W 64.7°C
55.0 W 66.3°C
60.0 W 68.0°C
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
24AMD Opteron™ Processor
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
Thermal Profile
Profile 1 Profile 2
Heat Sink Thermal
Resistance 0.20°C/W 0.23°C/W
Heat Sink Local
Ambi e n t 42.0°C 42.0°C
Profile Thermal
Resistance
Profile Ambient
Heatsink Class HS70 HS65
Max Power
0 W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
90 W
100 W
110 W
120 W
130 W
135 W
55.8°C
57.4°C
55.0°C
55.0°C
58.9°C
60.5°C
62.0°C
63.6°C
65.2°C
66.7°C
Q
0.156°C/W
48.0°C
Tcase Max
55.0°C
68.3°C
69.0°C
55.0°C
55.0°C
Thermal Profile
Profile 1 Profile 2
Heat Sink Thermal
Resistance 0.20°C/W 0.24°C/W
Heat Sink Local
Ambi e n t 42.0°C 42.0°C
Profile Thermal
Resistance
Profile Ambient
Heatsink Class HS70 HS65
Max Power
0 W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
90 W
100 W
110 W
120 W
130 W
135 W
55.0°C
55.0°C
59.4°C
61.0°C
0.163°C/W
48.0°C
Tcase Max
R
70.0°C
55.0°C
55.0°C
55.0°C
56.2°C
57.8°C
62.7°C
64.3°C
65.9°C
67.6°C
69.2°C
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
25AMD Opteron™ Processor
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
Thermal Profile
Profile 1 Profile 2
Heat Sink Thermal
Resistance 0.23°C/W 0.27°C/W
Heat Sink Local
Ambi e n t 42.0°C 42.0°C
Profile Thermal
Resistance
Profile Ambient
Heatsink Class HS65 HS63
Max Power
0 W
5 W
10 W
15 W
20 W
25 W
30 W
35 W
40 W
45 W
50 W
55 W
60 W
65 W
70 W
75 W
80 W
85 W
90 W
95 W
100 W
59.1°C
59.9°C
60.8°C
61.6°C
62.5°C
57.4°C
58.2°C
63.3°C
64.2°C
65.0°C
S
55.0°C
55.0°C
55.0°C
55.0°C
0.170°C/W
48.0°C
Tcase Max
56.5°C
55.0°C
55.0°C
55.0°C
55.7°C
55.0°C
55.0°C
Thermal Profile
Profile 1 Profile 2
Heat Sink Thermal
Resistance 0.24°C/W 0.28°C/W
Heat Sink Local
Ambi e n t 42.0°C 42.0°C
Profile Thermal
Resistance
Profile Ambient
Heatsink Class HS65 HS63
Max Power
0 W
5 W
10 W
15 W
20 W
25 W
30 W
35 W
40 W
45 W
50 W
55 W
60 W
65 W
70 W
75 W
80 W
85 W
90 W
95 W
100 W
55.0°C
55.0°C
55.2°C
56.1°C
66.0°C
61.5°C
62.4°C
64.2°C
65.1°C
57.0°C
57.9°C
58.8°C
63.3°C
59.7°C
60.6°C
55.0°C
48.0°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
0.180°C/W
55.0°C
T
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
26AMD Opteron™ Processor
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
Thermal Profile
Profile 1 Profile 2
Heat S i nk Thermal
Re si s tance 0.15°C/W 0.18°C/W
Heat S ink Local
Ambi e nt 38.0°C 38.0°C
Profile Thermal
Re si s tance
Profile Ambient
Heatsink Class HS75 HS72
Max Power
0 W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
90 W
100 W
110 W
120 W
130 W
135 W
140 W
145 W
150 W
155 W
160 W
165 W
60.9°C
58.5°C
59.7°C
64.0°C
61.5°C
62.2°C
62.8°C
63.4°C
55.0°C
56.1°C
57.3°C
60.3°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
55.0°C
44.0°C
Tcase Max
55.0°C
55.0°C
0.121°C/W
55.0°C
V
Thermal Profile
Profile 1 Profile 2
Heat S ink Thermal
Re si s tance 0.34°C/W 0.42°C/W
Heat S ink Local
Ambi e nt 42.0°C 42.0°C
Profile Thermal
Re si s tance
Profile Ambient
Heatsink Class HS63 HS55
Max Power
0 W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
64.5°C
67.3°C
70.0°C
0.275°C/W
48.0°C
Tcase Max
56.3°C
55.0°C
55.0°C
59.0°C
61.8°C
55.0°C
W
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
27AMD Opteron™ Processor
Table 8: AMD Opteron™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device specific Thermal
Design Power for processors specified in this document. The heat sink thermal resistance and heat sink local
ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values
specify the relationship between part specific power and part specific Tcase Max.
Thermal Profile
Profile 1 Profile 2
Heat S ink Thermal
Re si s tance 0.24°C/W 0.29°C/W
Heat S ink Local
Ambi e nt 42.0°C 42.0°C
Profile Thermal
Re si s tance
Profile Ambient
Heatsink Class HS73 HS65
Max Power
0 W
10 W
20 W
30 W
40 W
50 W
60 W
70 W
80 W
90 W
95 W
100 W
110 W
115 W
71.2°C
73.5°C
75.0°C
Y
0.232°C/W
48.0°C
Tcase Max
55.0°C
55.0°C
55.0°C
55.0°C
66.6°C
68.9°C
70.0°C
57.3°C
59.6°C
61.9°C
64.2°C
Thermal Profile
Profile 1 Profile 2
Heat S ink Thermal
Re si s tance 0.34°C/W 0.42°C/W
Heat S ink Local
Ambi e nt 50.0°C 50.0°C
Profile Thermal
Re si s tance
Profile Ambient
Heatsink Class HS63 HS55
Max Power
0 W
10 W
20 W
30 W
35 W
40 W
43 W
Z
0.257°C/W
56.0°C
Tcase Max
68.0°C
65.0°C
66.3°C
56.0°C
58.6°C
61.1°C
63.7°C
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
28AMD Opteron™ Processor
2.2 AMD Opteron™ Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 9 maps SOPNs and the properties associated with
their defined characters to the proper thermal and power table subsections and page numbers. This
table is designed to be used as a quick reference for finding the appropriate subsection for the thermal
and power tables corresponding to an SOPN.
Table 9. AMD Opteron™ Processor Thermal and Power Table Guide
SOPN Power Revision Thermal/Power Tables
OS mmmm PA pnc GC 79 W Rev B1 Section 2.3.1 on page 31
OS mmmm PA pnc GD 79 W Rev B2 Section 2.3.2 on page 33
OS mmmm PA pnc GE 79 W Rev BA Section 2.3.3 on page 34
OS mmmm WA pnc GC 115 W Rev B1 Section 2.3.4 on page 36
OE mmmm FM pnc GD 79 W Rev B2 Section 2.3.5 on page 37
OS mmmm WE pnc GD 95 W Rev B2 Section 2.3.6 on page 38
OS mmmm WA pnc GE 95 W Rev BA Section 2.3.7 on page 39
OS mmmm WA pnc GD 115 W Rev B2 Section 2.3.8 on page 40
OS mmmm WB pnc GD 115 W Rev B2 Section 2.3.9 on page 42
OS mmmm YA pnc GD 137 W Rev B2 Section 2.3.10 on page 43
OS mmmm WA pnc GH 115 W Rev B3 Section 2.3.11 on page 44
OS mmmm PA pnc GH 79 W Rev B3 Section 2.3.12 on page 46
OS mmmm YA pnc GH 137 W Rev B3 Section 2.3.13 on page 48
OS mmmm WB pnc GH 115 W Rev B3 Section 2.3.14 on page 49
OE mmmm FM pnc GH 79 W Rev B3 Section 2.3.15 on page 51
OS mmmm WA pnc GI 115 W Rev C2 Section 2.3.16 on page 52
OS mmmm PA pnc GI 79 W Rev C2 Section 2.3.17 on page 55
OS mmmm YA pnc GI 137 W Rev C2 Section 2.3.18 on page 57
OS mmmm WH pnc GI 115 W Rev C2 Section 2.3.19 on page 58
OS mmmm PC pnc GI 79 W Rev C2 Section 2.3.20 on page 59
OS mmmm YC pnc GI 137 W Rev C2 Section 2.3.21 on page 60
OS mmmm WG pnc GI 115 W Rev C2 Section 2.3.22 on page 61
OS mmmm NA pnc GI 60 W Rev C2 Section 2.3.23 on page 63
OS mmmm WJ pnc GN 115 W Rev D0 Section 2.3.24 on page 64
OS mmmm PD pnc GN 79 W Rev D0 Section 2.3.25 on page 66
OS mmmm NB pnc GN 60 W Rev D0 Section 2.3.26 on page 67
OS mmmm WK pnc GO 115 W Rev D1 Section 2.3.27 on page 68
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
29AMD Opteron™ Processor
OS mmmm VA pnc GO 85 W Rev D1 Section 2.3.28 on page 72
OS mmmm YE pnc GO 140 W Rev D1 Section 2.3.29 on page 74
OS mmmm WL pnc GO 95 W Rev D1 Section 2.3.30 on page 75
OS mmmm WL pnc GN 95 W Rev D0 Section 2.3.31 on page 76
OS mmmm OF pnc GO 65 W Rev D1 Section 2.3.32 on page 77
OS mmmm HJ pnc GO 35 W Rev D1 Section 2.3.33 on page 79
Table 9. AMD Opteron™ Processor Thermal and Power Table Guide (Continued)
SOPN Power Revision Thermal/Power Tables
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
30AMD Opteron™ Processor
2.3 AMD Opteron™ Processor Thermal and Power Specifications
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, temperature assumptions) and power delivery (for example, voltage, current, and
power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet,
order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel
Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management
BIOS requirements.
Section 2.1 on page 12 provides an example of the OPN structure for processors documented in this
chapter and Table 9 on page 28 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and
terminology definitions used in these tables.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
31AMD Opteron™ Processor
2.3.1 OS mmmm PA pnc GC (79 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes Single Plane Dual Plane Single Plane Dual Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-state 5
HTC P-state 4
NB COF 6,15 1200 MHz 1400 MHz 1400 MHz 1600 MHz
VID_VDDNB 11 N/A 1.150 V N/A 1.150 V
IDDNB Max 12 N/A 9.4 A N/A 9.4 A
CPU COF 6
TDP 3,7 66.1 W 68.0 W 66.1 W 68.0 W
VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V
VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.150 V
IDD Max 3,10 54.2 A 47.1 A 54.3 A 47.1 A
CPU COF 6
TDP 3,7 63.6 W 65.7 W 61.1 W 63.5 W
VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V
VID_VDD Max 9 1.150 V 1.125 V 1.150 V 1.125 V
IDD Max 3,10 52.1 A 45.0 A 50.2 A 43.0 A
CPU COF 6
TDP 3,7 58.5 W 58.3 W 56.1 W 56.3 W
VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V
VID_VDD Max 9 1.150 V 1.100 V 1.150 V 1.100 V
IDD Max 3,10 48.0 A 39.2 A 46.0 A 37.3 A
CPU COF 6
TDP 3,7 53.5 W 54.0 W 51.1 W 52.0 W
VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V
VID_VDD Max 9 1.150 V 1.075 V 1.150 V 1.075 V
IDD Max 3,10 43.9 A 35.2 A 41.9 A 33.3 A
CPU COF 6
TDP 3,7 48.7 W 47.5 W 46.6 W 45.6 W
VID_VDD Min 9 1.100 V 1.050 V 1.100 V 1.050 V
VID_VDD Max 9 1.150 V 1.050 V 1.150 V 1.050 V
IDD Max 3,10 39.8 A 29.8 A 37.8 A 28.0 A
IDD Max 3,10,14 21.5 A 10.1 A 19.1 A 8.1 A
S0 I/O Power 13 6.5 W 6.5 W 6.5 W 6.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P4
S0.C0.P3
S0.C1.Pmin
1200 MHz
1000 MHz
1600 MHz
1200 MHz
1000 MHz
1600 MHz
1400 MHz
1800 MHz
OPN OS2344PAL4BGC
S0.C0.P1
1400 MHz
S0.C0.P0
1700 MHz
S0.C0.P2
S0.Cx.Px
S0.C0.Px
55 oC to 71 oC
S0.C0.P4
S0.C0.P4
OS2346PAL4BGC
OS8346PAL4BGC
70 oC
55 oC to 71 oC
S0.C0.P4
B
70 oC
5 oC
B
5 oC
S0.C0.P4
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
32AMD Opteron™ Processor
The notes for this table are on page 80.
State Spe cification8Notes Single Plane Dual Plane
Tcase Max 1
Tctl Max 2
Tam bient Min
Thermal Profile
Startup P-state 5
HTC P-state 4
NB COF 6,15 1400 MHz 1600 MHz
VID_VDDNB 11 N/A 1.150 V
IDDNB Max 12 N/A 8.8 A
CPU COF 6
TDP 3,7 66.2 W 68.0 W
VID_VDD Min 9 1.100 V 1.100 V
VID_VDD Max 9 1.150 V 1.150 V
IDD Max 3,10 54.5 A 47.6 A
CPU COF 6
TDP 3,7 61.2 W 63.5 W
VID_VDD Min 9 1.100 V 1.100 V
VID_VDD Max 9 1.150 V 1.125 V
IDD Max 3,10 50.3 A 43.5 A
CPU COF 6
TDP 3,7 53.7 W 54.2 W
VID_VDD Min 9 1.100 V 1.075 V
VID_VDD Max 9 1.150 V 1.100 V
IDD Max 3,10 44.2 A 35.9 A
CPU COF 6
TDP 3,7 49.1 W 49.9 W
VID_VDD Min 9 1.100 V 1.075 V
VID_VDD Max 9 1.150 V 1.075 V
IDD Max 3,10 40.1 A 31.9 A
CPU COF 6
TDP 3,7 44.5 W 43.7 W
VID_VDD Min 9 1.100 V 1.050 V
VID_VDD Max 9 1.150 V 1.050 V
IDD Max 3,10 36.0 A 26.8 A
IDD Max 3,10,14 16.9 A 6.8 A
S0 I/O Power 13 6.5 W 6.5 W
S3 I/O Power 13 350 mW 350 mW
S0.C1.Pmin
S0.C0.P1
S0.C0.P3
S0.C0.P4
S0.C0.P0
S0.C0.P2
OPN
5 oC
S0.C0.P4
S0.C0.P4
S0.Cx.Px
S0.C0.Px B
OS2347PAL4BGC
OS8347PAL4BGC
55 oC to 71 oC
70 oC
1400 MHz
1200 MHz
1900 MHz
1700 MHz
1000 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
33AMD Opteron™ Processor
2.3.2 OS mmmm PA pnc GD (79 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Spe cifica tion8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tam bient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1400 MHz 1600 MHz 1400 MHz 1600 MHz
VID_VDDNB 11,15 N/A 1.125 V N/A 1.125 V
IDDNB Max 12 N/A 9.3 A N/A 8.9 A
CPU COF 6
TDP 3,7 76.9 W 77.6 W 77.1 W 77.8 W
VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V
IDD Max 3,10 63.8 A 56.1 A 64.0 A 56.7 A
CPU COF 6
TDP 3,7 71.8 W 72.4 W 72.0 W 72.7 W
VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V
IDD Max 3,10 59.2 A 51.5 A 59.4 A 52.1 A
CPU COF 6
TDP 3,7 66.6 W 63.3 W 64.2 W 61.2 W
VID_VDD Min 9 1.075 V 1.050 V 1.075 V 1.050 V
VID_VDD Max 9 1.125 V 1.075 V 1.125 V 1.075 V
IDD Max 3,10 54.9 A 44.9 A 52.9 A 43.4 A
CPU COF 6
TDP 3,7 61.5 W 55.4 W 59.1 W 53.8 W
VID_VDD Min 9 1.075 V 1.025 V 1.075 V 1.025 V
VID_VDD Max 9 1.125 V 1.050 V 1.125 V 1.050 V
IDD Max 3,10 50.6 A 38.7 A 48.6 A 37.4 A
CPU COF 6
TDP 3,7 56.3 W 48.7 W 53.9 W 46.9 W
VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V
VID_VDD Max 9 1.125 V 1.000 V 1.125 V 1.000 V
IDD Max 3,10 46.3 A 33.0 A 44.3 A 31.7 A
S0.C1.Pmin IDD Max 3,10,14 25.6 A 10.3 A 23.3 A 9.1 A
S0 I/O Power 13 7.20 W 7.20 W 7.20 W 7.20 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
OS2347PAL4BGD
OS8347PAL4BGD
S0.C0.P4
70 oC
5 oC5
oC
55 oC to 76 oC
EE
S0.C0.P4 S0.C0.P4
OPN
OS2346PAL4BGD
OS8346PAL4BGD
70 oC
1400 MHz
S0.C0.Px
55 oC to 76 oC
S0.C0.P4
S0.C0.P1
1600 MHz 1700 MHz
S0.Cx.Px
1400 MHz
S0.C0.P0
1800 MHz 1900 MHz
S0.C0.P2
S0.C0.P4
1000 MHz 1000 MHz
S0.C0.P3
1200 MHz 1200 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
34AMD Opteron™ Processor
2.3.3 OS mmmm PA pnc GE (79 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Spe cifica tion8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tam bient Min
Thermal Profile
Startup P-state 5
HTC P-state 4
NB COF 6,15 1200 MHz 1400 MHz 1400 MHz 1600 MHz
VID_VDDNB 11 N/A 1.150 V N/A 1.150 V
IDDNB Max 12 N/A 9.4 A N/A 9.4 A
CPU COF 6
TDP 3,7 66.1 W 68.0 W 66.1 W 68.0 W
VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V
VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.150 V
IDD Max 3,10 54.2 A 47.1 A 54.3 A 47.1 A
CPU COF 6
TDP 3,7 63.6 W 65.7 W 61.1 W 63.5 W
VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V
VID_VDD Max 9 1.150 V 1.125 V 1.150 V 1.125 V
IDD Max 3,10 52.1 A 45.0 A 50.2 A 43.0 A
CPU COF 6
TDP 3,7 58.5 W 58.3 W 56.1 W 56.3 W
VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V
VID_VDD Max 9 1.150 V 1.100 V 1.150 V 1.100 V
IDD Max 3,10 48.0 A 39.2 A 46.0 A 37.3 A
CPU COF 6
TDP 3,7 53.5 W 54.0 W 51.1 W 52.0 W
VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V
VID_VDD Max 9 1.150 V 1.075 V 1.150 V 1.075 V
IDD Max 3,10 43.9 A 35.2 A 41.9 A 33.3 A
CPU COF 6
TDP 3,7 48.7 W 47.5 W 46.6 W 45.6 W
VID_VDD Min 9 1.100 V 1.050 V 1.100 V 1.050 V
VID_VDD Max 9 1.150 V 1.050 V 1.150 V 1.050 V
IDD Max 3,10 39.8 A 29.8 A 37.8 A 28.0 A
IDD Max 3,10,14 21.5 A 10.1 A 19.1 A 8.1 A
S0 I/O Power 13 6.5 W 6.5 W 6.5 W 6.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
OS2346PAL4BGE
OS8346PAL4BGE
S0.C0.Px
S0.C0.P4
55 oC to 71 oC
70 oC
S0.C0.P4
5 oC
B
55 oC to 71 oC
OS2344PAL4BGE
70 oC
5 oC
OPN
S0.C1.Pmin
1200 MHz
S0.C0.P2
1200 MHz
1400 MHz
S0.C0.P3
S0.C0.P4
B
S0.C0.P1
S0.Cx.Px
S0.C0.P0
1700 MHz
1600 MHz1600 MHz
1800 MHz
S0.C0.P4
1000 MHz
S0.C0.P4
1000 MHz
1400 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
35AMD Opteron™ Processor
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-state 5
HTC P-state 4
NB COF 6,15 1400 MHz 1600 MHz
VID_VDDNB 11 N/A 1.150 V
IDDNB Max 12 N/A 8.8 A
CPU COF 6
TDP 3,7 66.2 W 68.0 W
VID_VDD Min 9 1.100 V 1.100 V
VID_VDD Max 9 1.150 V 1.150 V
IDD Max 3,10 54.5 A 47.6 A
CPU COF 6
TDP 3,7 61.2 W 63.5 W
VID_VDD Min 9 1.100 V 1.100 V
VID_VDD Max 9 1.150 V 1.125 V
IDD Max 3,10 50.3 A 43.5 A
CPU COF 6
TDP 3,7 53.7 W 54.2 W
VID_VDD Min 9 1.100 V 1.075 V
VID_VDD Max 9 1.150 V 1.100 V
IDD Max 3,10 44.2 A 35.9 A
CPU COF 6
TDP 3,7 49.1 W 49.9 W
VID_VDD Min 9 1.100 V 1.075 V
VID_VDD Max 9 1.150 V 1.075 V
IDD Max 3,10 40.1 A 31.9 A
CPU COF 6
TDP 3,7 44.5 W 43.7 W
VID_VDD Min 9 1.100 V 1.050 V
VID_VDD Max 9 1.150 V 1.050 V
IDD Max 3,10 36.0 A 26.8 A
IDD Max 3,10,14 16.9 A 6.8 A
S0 I/O Power 13 6.5 W 6.5 W
S3 I/O Power 13 350 mW 350 mW
OS2347PAL4BGE
OS8347PAL4BGEOPN
70 oC
55 oC to 71 oC
5 oC
S0.C0.P4
B
S0.C0.P4
S0.C0.Px
S0.C0.P1
1700 MHz
1900 MHz
S0.Cx.Px
S0.C0.P0
S0.C1.Pmin
S0.C0.P4
1000 MHz
S0.C0.P3
S0.C0.P2
1200 MHz
1400 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
36AMD Opteron™ Processor
2.3.4 OS mmmm WA pnc GC (115 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1400 MHz 1600 MHz 1600 MHz 1800 MHz
VID_VDDNB 11 N/A 1.200 V N/A 1.200 V
IDDNB Max 12 N/A 15.2 A N/A 15.2 A
CPU COF 6
TDP 3,7 94.1 W 95.0 W 94.1 W 95.0 W
VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V
VID_VDD Max 9 1.200 V 1.200 V 1.200 V 1.200 V
IDD Max 3,10 76.7 A 65.3 A 76.9 A 65.3 A
CPU COF 6
TDP 3,7 88.6 W 90.5 W 85.8 W 88.2 W
VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V
VID_VDD Max 9 1.200 V 1.175 V 1.200 V 1.175 V
IDD Max 3,10 72.6 A 61.2 A 70.7 A 59.1 A
CPU COF 6
TDP 3,7 80.2 W 79.3 W 77.5 W 77.2 W
VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V
VID_VDD Max 9 1.200 V 1.125 V 1.200 V 1.125 V
IDD Max 3,10 66.5 A 52.2 A 64.5 A 50.3 A
CPU COF 6
TDP 3,7 74.7 W 75.0 W 72.0 W 72.9 W
VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V
VID_VDD Max 9 1.200 V 1.075 V 1.200 V 1.075 V
IDD Max 3,10 62.4 A 48.2 A 60.4 A 46.3 A
CPU COF 6
TDP 3,7 69.5 W 67.0 W 67.0 W 65.2 W
VID_VDD Min 9 1.100 V 1.050 V 1.100 V 1.050 V
VID_VDD Max 9 1.200 V 1.050 V 1.200 V 1.050 V
IDD Max 3,10 58.2 A 41.7 A 56.3 A 40.0 A
IDD Max 3,10,14 43.4 A 23.4 A 41.0 A 21.5 A
S0 I/O Power13 6.5 W6.5 W6.5 W6.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P2
S0.C0.P1
1700 MHz
A
55 oC to 70 oC
S0.C0.P0
S0.Cx.Px
S0.C0.P4
S0.C0.Px 5 oC
1900 MHz
S0.C0.P4
70 oC
S0.C1.Pmin
1000 MHz
1200 MHz
1000 MHz
S0.C0.P3
1200 MHz
S0.C0.P4
1400 MHz1400 MHz
1700 MHz
OPN
OS2347WAL4BGC
OS8347WAL4BGC
OS2350WAL4BGC
OS8350WAL4BGC
2000 MHz
70 oC
5 oC
A
55 oC to 70 oC
S0.C0.P4
S0.C0.P4
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
37AMD Opteron™ Processor
2.3.5 OE mmmm FM pnc GD (79 W Embedded Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Spe cification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tam bient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1400 MHz 1600 MHz
VID_VDDNB 11,15 N/A 1.125 V
IDDNB Max 12 N/A 9.8 A
CPU COF 6
TDP 3,7 76.7 W 77.4 W
VID_VDD Min 9 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V
IDD Max 3,10 63.6 A 55.5 A
CPU COF 6
TDP 3,7 74.1 W 74.8 W
VID_VDD Min 9 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V
IDD Max 3,10 61.3 A 53.2 A
CPU COF 6
TDP 3,7 69.0 W 66.1 W
VID_VDD Min 9 1.075 V 1.050 V
VID_VDD Max 9 1.125 V 1.100 V
IDD Max 3,10 56.9 A 46.5 A
CPU COF 6
TDP 3,7 63.8 W 57.6 W
VID_VDD Min 9 1.075 V 1.025 V
VID_VDD Max 9 1.125 V 1.050 V
IDD Max 3,10 52.6 A 40.1 A
CPU COF 6
TDP 3,7 58.7 W 50.4 W
VID_VDD Min 9 1.075 V 1.000 V
VID_VDD Max 9 1.125 V 1.000 V
IDD Max 3,10 48.3 A 34.2 A
S0.C1.Pmin IDD Max 3,10,14 27.8 A 11.4 A
S0 I/O Power 13 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW
S0.C0.P4
S0.C0.P4
1000 MHz
F
S0.C0.P2
1400 MHz
S0.C0.P3
1200 MHz
S0.C0.P0
1700 MHz
S0.Cx.Px
S0.C0.P1
1600 MHz
OPN OE23GFFML4BGD
S0.C0.Px
55 oC to 86 oC
70 oC
5 oC
S0.C0.P4
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
38AMD Opteron™ Processor
2.3.6 OS mmmm WE pnc GD (95 W Server, AM2r2) Thermal and Power Specifications
The notes for this table are on page 80.
S ta te S pe cifica tion8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 1800 MHz
VID_VDDNB 11,15 N/A 1.200 V
IDDNB Max 12 N/A 12.5 A
CPU COF 6
TDP 3,7 94.3 W 95.0 W
VID_VDD Min 9 1.100 V 1.100 V
VID_VDD Max 9 1.200 V 1.200 V
IDD Max 3,10 78.1 A 68.6 A
CPU COF 6
TDP 3,7 88.6 W 90.4 W
VID_VDD Min 9 1.100 V 1.100 V
VID_VDD Max 9 1.200 V 1.150 V
IDD Max 3,10 73.9 A 64.4 A
CPU COF 6
TDP 3,7 79.9 W 78.9 W
VID_VDD Min 9 1.100 V 1.075 V
VID_VDD Max 9 1.200 V 1.100 V
IDD Max 3,10 67.5 A 55.2 A
CPU COF 6
TDP 3,7 72.0 W 68.4 W
VID_VDD Min 9 1.100 V 1.050 V
VID_VDD Max 9 1.200 V 1.050 V
IDD Max 3,10 61.2 A 46.6 A
CPU COF 6
TDP 3,7 64.9 W 62.2 W
VID_VDD Min 9 1.100 V 1.050 V
VID_VDD Max 9 1.200 V 1.050 V
IDD Max 3,10 54.9 A 40.7 A
S0.C1.Pmin IDD Max 3,10,14 36.7 A 19.9 A
S0 I/O Power 13 6.50 W 6.50 W
S3 I/O Power 13 350 mW 350 mW
S0.C0.P1
2000 MHz
S0.Cx.Px
S0.C0.P0
2200 MHz
OPN OS1354W EJ4BGD
S0.C0.Px
55 oC to 70 oC
70 oC
5 oC
A
S0.C0.P4
S0.C0.P4
S0.C0.P4
1100 MHz
S0.C0.P2
1700 MHz
S0.C0.P3
1400 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
39AMD Opteron™ Processor
2.3.7 OS mmmm WA pnc GE (115 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Spe cification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tam bient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1400 MHz 1600 MHz 1600 MHz 1800 MHz
VID_VDDNB 11 N/A 1.200 V N/A 1.200 V
IDDNB Max 12 N/A 15.2 A N/A 15.2 A
CPU COF 6
TDP 3,7 94.1 W 95.0 W 94.1 W 95.0 W
VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V
VID_VDD Max 9 1.200 V 1.200 V 1.200 V 1.200 V
IDD Max 3,10 76.7 A 65.3 A 76.9 A 65.3 A
CPU COF 6
TDP 3,7 88.6 W 90.5 W 85.8 W 88.2 W
VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V
VID_VDD Max 9 1.200 V 1.175 V 1.200 V 1.175 V
IDD Max 3,10 72.6 A 61.2 A 70.7 A 59.1 A
CPU COF 6
TDP 3,7 80.2 W 79.3 W 77.5 W 77.2 W
VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V
VID_VDD Max 9 1.200 V 1.125 V 1.200 V 1.125 V
IDD Max 3,10 66.5 A 52.2 A 64.5 A 50.3 A
CPU COF 6
TDP 3,7 74.7 W 75.0 W 72.0 W 72.9 W
VID_VDD Min 9 1.100 V 1.075 V 1.100 V 1.075 V
VID_VDD Max 9 1.200 V 1.075 V 1.200 V 1.075 V
IDD Max 3,10 62.4 A 48.2 A 60.4 A 46.3 A
CPU COF 6
TDP 3,7 69.5 W 67.0 W 67.0 W 65.2 W
VID_VDD Min 9 1.100 V 1.050 V 1.100 V 1.050 V
VID_VDD Max 9 1.200 V 1.050 V 1.200 V 1.050 V
IDD Max 3,10 58.2 A 41.7 A 56.3 A 40.0 A
IDD Max 3,10,14 43.4 A 23.4 A 41.0 A 21.5 A
S0 I/O Power 13 6.5 W 6.5 W 6.5 W 6.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P1
S0.C1.Pmin
S0.C0.P2
S0.C0.P4
S0.C0.P3
OS2347W AL4BGE
OS8347W AL4BGEOPN
S0.C0.P0
S0.C0.P4
S0.C0.P4
S0.Cx.Px
1900 MHz
55 oC to 70 oC
S0.C0.Px
70 oC
5 oC
A
1700 MHz
1200 MHz
1400 MHz1400 MHz
1000 MHz 1000 MHz
1200 MHz
1700 MHz
2000 MHz
OS2350W AL4BGE
OS8350W AL4BGE
A
S0.C0.P4
S0.C0.P4
55 oC to 70 oC
70 oC
5 oC
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
40AMD Opteron™ Processor
2.3.8 OS mmmm WA pnc GD (115 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specifica tion8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient M in
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 1800 MHz
VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 14.4 A N/A 13.9 A
CPU COF 6
TDP 3,7 114.1 W 115 W 114.1 W 115 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 88.6 A 77.9 A 89.0A 78.7
CPU COF 6
TDP 3,7 103.5 W 94.6 W 103.5 W 94.8 W
VID_VDD Min 9 1.150 V 1.100 V 1.150 V 1.100 V
VID_VDD Max 9 1.250 V 1.200 V 1.250 V 1.200 V
IDD Max 3,10 80.5 A 63.2 A 80.9 A 64.1 A
CPU COF 6
TDP 3,7 92.8 W 80.5 W 96.4 W 83.4 W
VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.100 V 1.250 V 1.150 V
IDD Max 3,10 72.9 A 53.3 A 75.8 A 56.6 A
CPU COF 6
TDP 3,7 85.7 W 71.7 W 86.2 W 72.1 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 67.8 A 46.2 A 68.2 A 47.2 A
CPU COF 6
TDP 3,7 79.2 W 67.0 W 78.1 W 66.2 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 62.7 A 41.7 A 61.8 A 41.6 A
S0.C1.Pmin IDD Max 3,10,14 43.5 A 18.8 A 40.8 A 17.4 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
OPN
OS2350WAL4BGD
OS8350W AL4BGD OS2352WAL4BGD
S0.C0.P4 S0.C0.P4
5 oC5
oC
DD
S0.C0.P4 S0.C0.P4
S0.C0.P0
2000 MHz 2100 MHz
S0.C0.Px
55 oC to 76 oC55
oC to 76 oC
70 oC70
oC
S0.Cx.Px
S0.C0.P3
1200 MHz 1300 MHz
S0.C0.P2
1400 MHz 1600 MHz
S0.C0.P4
1000 MHz 1050 MHz
S0.C0.P1
1700 MHz 1800 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
41AMD Opteron™ Processor
The notes for this table are on page 80.
State Spe cification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient M in
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 2000 MHz
VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 13.3 A N/A 13.4 A
CPU COF 6
TDP 3,7 114.1 W 115 W 113.3 W 115 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 89.3 A 79.4 A 89.3 A 79.5 A
CPU COF 6
TDP 3,7 107.0 W 101.1 W 102.6 W 99.5 W
VID_VDD Min 9 1.150 V 1.125 V 1.150 V 1.125 V
VID_VDD Max 9 1.250 V 1.175 V 1.250 V 1.150 V
IDD Max 3,10 83.9 A 70.5 A 81.6 A 68.9 A
CPU COF 6
TDP 3,7 96.4 W 83.7 W 92.3 W 82.4 W
VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.100 V 1.250 V 1.100 V
IDD Max 3,10 76.2 A 57.6 A 74.0 A 56.2 A
CPU COF 6
TDP 3,7 86.5 W 72.5 W 82.6 W 71.4 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 68.6 A 48.2 A 66.4 A 47.0 A
CPU COF 6
TDP 3,7 76.8 W 65.4 W 74.5 W 65.4 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 60.9 A 41.5 A 60.0 A 41.4 A
S0.C1.Pmin IDD Max 3,10,14 38.0 A 16.0 A 36.0 A 14.6 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
70 oC70
oC
OPN
OS2354WAL4BGD
OS8354W AL4BGD
OS2356W AL4BGD
OS8356W AL4BGD
55 oC to 76 oC55
oC to 76 oC
S0.C0.P4
1100 MHz 1150 MHz
S0.C0.P1
2000 MHz 2000 MHz
S0.C0.P3
1400 MHz 1400 MHz
S0.Cx.Px
DD
S0.C0.Px
S0.C0.P4 S0.C0.P4
S0.C0.P4 S0.C0.P4
5 oC5
oC
S0.C0.P0
2200 MHz 2300 MHz
S0.C0.P2
1700 MHz 1700 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
42AMD Opteron™ Processor
2.3.9 OS mmmm WB pnc GD (115 W Server, AM2r2) Thermal and Power Specifications
The notes for this table are on page 80.
State Spe cification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient M in
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 1800 MHz
VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 14.0 A N/A 13.4 A
CPU COF 6
TDP 3,7 114.1 W 115.0 W 114.1 W 115.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 89.8 A 79.5 A 89.8 A 80.0 A
CPU COF 6
TDP 3,7 102.8 W 104.8 W 106.6 W 107.9 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 81.4 A 71.0 A 84.5 A 74.3 A
CPU COF 6
TDP 3,7 95.3 W 88.4 W 95.3 W 88.3 W
VID_VDD Min 9 1.150 V 1.100 V 1.150 V 1.100 V
VID_VDD Max 9 1.250 V 1.200 V 1.250 V 1.175 V
IDD Max 3,10 76.1 A 59.8 A 76.5 A 60.5 A
CPU COF 6
TDP 3,7 85.0 W 75.2 W 84.9 W 75.5 W
VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.125 V 1.250 V 1.125 V
IDD Max 3,10 68.1 A 49.5 A 68.5 A 50.5 A
CPU COF 6
TDP 3,7 76.5 W 65.3 W 74.7 W 64.4 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 61.5 A 41.2 A 60.6 A 41.1 A
S0.C1.Pmin IDD Max 3,10,14 39.7 A 17.4 A 37.0 A 19.9 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P4
1050 MHz 1100 MHz
S0.C0.P2
1600 MHz 1700 MHz
S0.C0.P3
1300 MHz 1400 MHz
S0.C0.P4 S0.C0.P4
S0.C0.P4 S0.C0.P4
1800 MHz 2000 MHz
2100 MHz 2200 MHz
OPN OS1352W BJ4BGD OS1354W BJ4BGD
S0.C0.Px
55 oC to 76 oC55
oC to 76 oC
70 oC
5 oC
DD
70 oC
5 oC
S0.Cx.Px
S0.C0.P0
S0.C0.P1
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
43AMD Opteron™ Processor
2.3.10 OS mmmm YA pnc GD (137 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Spe cification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tam bient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 14.6 A N/A 14.1 A
CPU COF 6
TDP 3,7 135.3 W 137 W 135.3 W 137 W
VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 105.0 A 93.5 A 105.0 A 94.3 A
CPU COF 6
TDP 3,7 124.6 W 113.3 W 124.6 W 126.3 W
VID_VDD Min 9 1.200 V 1.150 V 1.200 V 1.200 V
VID_VDD Max 9 1.250 V 1.175 V 1.250 V 1.200 V
IDD Max 3,10 97.2 A 78.1 A 97.6 A 86.2 A
CPU COF 6
TDP 3,7 114 W 94.6 W 114 W 94.7 W
VID_VDD Min 9 1.200 V 1.100 V 1.200 V 1.100 V
VID_VDD Max 9 1.250 V 1.100 V 1.250 V 1.100 V
IDD Max 3,10 89.2 A 64.3 A 89.6 A 65.3 A
CPU COF 6
TDP 3,7 103.3 W 77.9 W 103.3 W 78.5 W
VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 81.1 A 51.8 A 81.5 A 53 A
CPU COF 6
TDP 3,7 92.8 W 70.8 W 91.7 A 70.2 A
VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 73.0 A 45.1 A 72.1 A 45.1 A
S0.C1. Pmin
IDD Max 3,10,14 44.1 A 17.5 A 41.5 A 16.3 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P2
1800 MHz
S0.C0.P0
2400 MHz
S0.C0.P1
2100 MHz
1500 MHz
S0.C0.P4
OS2360YAL4BGD
OS8360YAL4BGD
55 oC to 71 oC
70 oC
5 oC
S0.C0.P4
C
2500 MHz
1250 MHz
S0.C0.P4
1200 MHz
C
2200 MHz
1900 MHz
S0.C0.P4
S0.C0.P3
S0.Cx.Px
1600 MHz
OPN
OS2358YAL4BGD
OS8358YAL4BGD
S0.C0.Px
55 oC to 71 oC
70 oC
5 oC
S0.C0.P4
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
44AMD Opteron™ Processor
2.3.11 OS mmmm WA pnc GH (115 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Spe cification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient M in
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 1800 MHz
VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V
IDDNB 12 N/A 14.9 A N/A 14.3 A
CPU COF 6
TDP 3,7 114.1 W 115.0 W 114.1 W 115.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 88.8 A 77.5 A 89.2 A 78.5 A
CPU COF 6
TDP 3,7 102.8 W 104.4 W 102.8 W 104.8 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 80.3 A 69.0 A 80.7 A 70.0 A
CPU COF 6
TDP 3,7 91.5 W 85.0 W 95.3 W 88.6 W
VID_VDD Min 9 1.150 V 1.100 V 1.150 V 1.100 V
VID_VDD Max 9 1.250 V 1.175 V 1.250 V 1.200 V
IDD Max 3,10 72.3 A 55.2 A 75.3 A 58.9 A
CPU COF 6
TDP 3,7 84.5 W 74.9 W 85.1 W 75.2 W
VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.125 V 1.250 V 1.125 V
IDD Max 3,10 66.9 A 47.5 A 67.3 A 48.5 A
CPU COF 6
TDP 3,7 77.7 W 66.4 W 76.6 W 65.5 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 61.6 A 40.5 A 60.7 A 40.4 A
S0.C1.Pmin IDD Max 3,10,14 25.2 A 7.1 A 23.5 A 6.4 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P4
1000 MHz
S0.C0.P0
S0.C0.P2
1400 MHz
S0.C0.P1
S0.C0.P3
2000 MHz
1700 MHz
1200 MHz
1050 MHz
1300 MHz
1800 MHz
1600 MHz
2100 MHz
OS2352W AL4BGH
55 oC to 76 oC
70 oC
5 oC
S0.Cx.Px
D
S0.C0.P4
D
S0.C0.P4 S0.C0.P4
S0.C0.P4
OPN
OS2350WAL4BGH
OS8350W AL4BGH
S0.C0.Px
55 oC to 76 oC
70 oC
5 oC
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
45AMD Opteron™ Processor
The notes for this table are on page 80.
State Spe cification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient M in
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 2000 MHz
VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V
IDDNB 12 N/A 13.7 A N/A 13.8 A
CPU COF 6
TDP 3,7 114.1 W 115.0 W 113.2 W 115.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 89.3 A 79.1 A 89.5 A 79.2 A
CPU COF 6
TDP 3,7 106.6 W 108.2 W 101.9 W 104.8 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 83.7 A 73.5 A 81.5 A 71.2 A
CPU COF 6
TDP 3,7 95.4 W 88.8 W 91.3 W 86.1 W
VID_VDD Min 9 1.150 V 1.100 V 1.150 V 1.100 V
VID_VDD Max 9 1.250 V 1.175 V 1.250 V 1.175 V
IDD Max 3,10 75.7 A 59.8 A 73.5 A 57.9 A
CPU COF 6
TDP 3,7 85.2 W 75.6 W 81.1 W 74.2 W
VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.125 V 1.250 V 1.100 V
IDD Max 3,10 67.8 A 49.5 A 65.5 A 48.1 A
CPU COF 6
TDP 3,7 75.0 W 64.6 W 72.9 W 64.6 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 59.8 A 40.3 A 58.8 A 40.1 A
S0.C1.Pmin IDD Max 3,10,14 21.9 A 5.7 A 21.0 A 5.0 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
OS2356W AL4BGH
OS8356W AL4BGH
S0.C0.Px
55 oC to 76 oC
70 oC
5 oC
S0.C0.P4
55 oC to 76 oC
S0.C0.P4
70 oC
OS2354WAL4BGH
OS8354W AL4BGH
S0.C0.P4
DD
S0.C0.P4
S0.C0.P3
2200 MHz
2000 MHz
1700 MHz
OPN
5 oC
S0.C0.P4
S0.Cx.Px
1150 MHz
2300 MHz
S0.C0.P1
2000 MHz
S0.C0.P2
1400 MHz
1700 MHz
1100 MHz
1400 MHz
S0.C0.P0
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
46AMD Opteron™ Processor
2.3.12 OS mmmm PA pnc GH (79 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Spe cification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient M in
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1400 MHz 1600 MHz 1400 MHz 1600 MHz
VID_VDDNB 11,15 N/A 1.125 V N/A 1.125 V
IDDNB Max 12 N/A 10.4 A N/A 9.9 A
CPU COF 6
TDP 3,7 76.8 W 77.5 W 77.0 W 77.7 W
VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V
IDD Max 3,10 63.6 A 55.0 A 63.8 A 55.7 A
CPU COF 6
TDP 3,7 74.1 W 74.8 W 71.6 W 72.3 W
VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V
IDD Max 3,10 61.2 A 52.6 A 59.1 A 50.9 A
CPU COF 6
TDP 3,7 68.7 W 65.9 W 66.2 W 63.1 W
VID_VDD Min 9 1.075 V 1.050 V 1.075 V 1.050 V
VID_VDD Max 9 1.125 V 1.100 V 1.125 V 1.075 V
IDD Max 3,10 56.7 A 45.8 A 54.6 A 44.1 A
CPU COF 6
TDP 3,7 63.3 W 57.4 W 60.9 W 55.1 W
VID_VDD Min 9 1.075 V 1.025 V 1.075 V 1.025 V
VID_VDD Max 9 1.125 V 1.050 V 1.125 V 1.050 V
IDD Max 3,10 52.2 A 39.2 A 50.1 A 37.8 A
CPU COF 6
TDP 3,7 57.9 W 50.1 W 55.5 W 48.3 W
VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V
VID_VDD Max 9 1.125 V 1.000 V 1.125 V 1.000 V
IDD Max 3,10 47.7 A 33.2 A 45.7 A 32.0 A
S0.C1.Pmin IDD Max 3,10,14 17.0 A 5.1 A 15.7 A 4.5 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
1400 MHz
S0.Cx.Px
S0.C0.P0
S0.C0.P1
1600 MHz
S0.C0.P4
1000 MHz1000 MHz
1400 MHz
S0.C0.P3
1200 MHz
S0.C0.P2
S0.C0.P4 S0.C0.P4
1800 MHz
1600 MHz
70 oC
55 oC to 76 oC
5 oC
E
S0.C0.P4
OPN
1200 MHz
OS2344PAL4BGH
55 oC to 76 oC
70 oC
5 oC
1700 MHz
S0.C0.Px E
S0.C0.P4
OS2346PAL4BGH
OS8346PAL4BGH
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
47AMD Opteron™ Processor
The notes for this table are on page 80.
State Spe cification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient M in
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1400 MHz 1600 MHz 1400 MHz 1800 MHz
VID_VDDNB 11,15 N/A 1.125 V N/A 1.125 V
IDDNB Max 12 N/A 9.4 A N/A 9.6 A
CPU COF 6
TDP 3,7 77.2 W 78.0 W 77.5 W 78.9 W
VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V
IDD Max 3,10 64.0 A 56.3 A 64.3 A 57.0 A
CPU COF 6
TDP 3,7 71.9 W 72.6 W 69.4 W 70.8 W
VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V
IDD Max 3,10 59.3 A 51.5 A 57.3 A 49.8 A
CPU COF 6
TDP 3,7 63.8 W 60.9 W 61.3 W 59.4 W
VID_VDD Min 9 1.075 V 1.050 V 1.075 V 1.050 V
VID_VDD Max 9 1.125 V 1.075 V 1.125 V 1.075 V
IDD Max 3,10 52.6 A 42.5 A 50.5 A 41.0 A
CPU COF 6
TDP 3,7 58.4 W 53.4 W 56.0 W 52.1 W
VID_VDD Min 9 1.075 V 1.025 V 1.075 V 1.025 V
VID_VDD Max 9 1.125 V 1.050 V 1.125 V 1.050 V
IDD Max 3,10 48.1 A 36.4 A 46.1 A 35.1 A
CPU COF 6
TDP 3,7 53.0 W 46.5 W 50.6 W 45.5 W
VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V
VID_VDD Max 9 1.125 V 1.000 V 1.125 V 1.000 V
IDD Max 3,10 43.6 A 30.7 A 41.6 A 29.5 A
S0.C1.Pmin IDD Max 3,10,14 14.3 A 3.8 A 13.6 A 3.1 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P3
1400 MHz
S0.C0.P1
S0.C0.P2
S0.Cx.Px
S0.C0.P0
1000 MHz
1200 MHz
S0.C0.P4
S0.C0.P4
1900 MHz
1700 MHz
55 oC to 76 oC
70 oC
5 oC
S0.C0.Px E
OS2347PAL4BGH
OS8347PAL4BGH
1200 MHz
1000 MHz
S0.C0.P4
OS2350PAL4BGH
OS8350PAL4BGH
55 oC to 76 oC
70 oC
5 oC
OPN
1700 MHz
1400 MHz
E
S0.C0.P4
S0.C0.P4
2000 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
48AMD Opteron™ Processor
2.3.13 OS mmmm YA pnc GH (137 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Spe cification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient M in
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 15.0 A N/A 14.5 A
CPU COF 6
TDP 3,7 135.2 W 137.0 W 135.2 W 137.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 105.5 A 93.2 A 106.0 A 94.1 A
CPU COF 6
TDP 3,7 123.9 W 125.7 W 123.9 W 126.1 W
VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 97.0 A 84.7 A 97.5 A 85.6 A
CPU COF 6
TDP 3,7 112.6 W 104.0 W 112.6 W 104.5 W
VID_VDD Min 9 1.200 V 1.150 V 1.200 V 1.150 V
VID_VDD Max 9 1.250 V 1.175 V 1.250 V 1.175 V
IDD Max 3,10 88.5 A 69.6 A 89.0 A 70.6 A
CPU COF 6
TDP 3,7 101.3 W 85.6 W 101.7 W 86.1 W
VID_VDD Min 9 1.200 V 1.125 V 1.200 V 1.100 V
VID_VDD Max 9 1.250 V 1.125 V 1.250 V 1.125 V
IDD Max 3,10 80.0 A 54.7 A 80.4 A 57.1 A
CPU COF 6
TDP 3,7 91.0 W 70.1 W 89.8 W 69.4 W
VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 71.5 A 43.9 A 70.5 A 43.9 A
S0.C1.Pmin IDD Max 3,10,14 26.1 A 6.4 A 24.5 A 5.8 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P4 S0.C0.P4
70 oC70
oC
5 oC5
oC
OPN
OS2358YAL4BGH
OS8358YAL4BGH
OS2360YAL4BGH
OS8360YAL4BGH
S0.C0.Px
55 oC to 71 oC55
oC to 71 oC
S0.C0.P4 S0.C0.P4
CC
S0.C0.P4
1200 MHz 1250 MHz
S0.C0.P2
1800 MHz 1900 MHz
S0.C0.P3
1500 MHz 1600 MHz
S0.C0.P1
2100 MHz 2200 MHz
S0.Cx.Px
S0.C0.P0
2400 MHz 2500 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
49AMD Opteron™ Processor
2.3.14 OS mmmm WB pnc GH (115 W Server, AM2r2) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 1800 MHz 1600 MHz 1800 MHz
VID_VDDNB 11,15 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 14.0 A N/A 13.4 A
CPU COF 6
TDP 3,7 114.1 W 115.0 W 114.1 W 115.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 89.8 A 79.5 A 89.8 A 80.0 A
CPU COF 6
TDP 3,7 102.8 W 104.8 W 106.6 W 107.9 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 81.4 A 71.0 A 84.5 A 74.3 A
CPU COF 6
TDP 3,7 95.3 W 88.4 W 95.3 W 88.3 W
VID_VDD Min 9 1.150 V 1.100 V 1.150 V 1.100 V
VID_VDD Max 9 1.250 V 1.200 V 1.250 V 1.175 V
IDD Max 3,10 76.1 A 59.8 A 76.5 A 60.5 A
CPU COF 6
TDP 3,7 85.0 W 75.2 W 84.9 W 75.5 W
VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.125 V 1.250 V 1.125 V
IDD Max 3,10 68.1 A 49.5 A 68.5 A 50.5 A
CPU COF 6
TDP 3,7 76.5 W 65.3 W 74.7 W 64.4 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 61.5 A 41.2 A 60.6 A 41.1 A
S0.C1.Pmin IDD Max 3,10,14 39.7 A 17.4 A 37.0 A 29.4 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P2
1600 MHz 1700 MHz
S0.C0.P3
1300 MHz 1400 MHz
S0.C0.P1
S0.C0.P4
1050 MHz 1100 MHz
1800 MHz
S0.C0.P0
70 oC 70 oC
DD
S0.C0.P4 S0.C0.P4
S0.C0.P4
2100 MHz 2200 MHz
5 oC5
oC
2000 MHz
S0.Cx.Px
S0.C0.P4
S0.C0.Px
55 oC to 76 oC 55 oC to 76 oC
OPN OS1352WBJ4BGH OS1354WBJ4BGH
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
50AMD Opteron™ Processor
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane
Tc ase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2000 MHz
VID_VDDNB 11,15 N/A 1.250 V
IDDNB Max 12 N/A 13.3 A
CPU COF 6
TDP 3,7 113.2 W 115.0 W
VID_VDD Min 9 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 89.7 A 80.0 A
CPU COF 6
TDP 3,7 101.9 W 104.4 W
VID_VDD Min 9 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 81.7 A 72.0 A
CPU COF 6
TDP 3,7 90.9 W 85.5 W
VID_VDD Min 9 1.150 V 1.100 V
VID_VDD Max 9 1.250 V 1.175 V
IDD Max 3,10 73.7 A 58.5 A
CPU COF 6
TDP 3,7 80.7 W 73.5 W
VID_VDD Min 9 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.100 V
IDD Max 3,10 65.7 A 48.7 A
CPU COF 6
TDP 3,7 72.4 W 63.8 W
VID_VDD Min 9 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V
IDD Max 3,10 59.0 A 40.7 A
S0.C1.Pmin IDD Max 3,10,14 34.2 A 14.2 A
S0 I/O Power 13 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW
S0.C0.P2
S0.C0.P3
1150 MHz
S0.C0.P4
1400 MHz
2000 MHz
1700 MHz
70 oC
5 oC
S0.C0.P1
2300 MHz
S0.C0.P0
S0.Cx.Px
D
S0.C0.P4
S0.C0.P4
OS1356WBJ4BGH
S0.C0.Px
55 oC to 76 oC
OPN
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
51AMD Opteron™ Processor
2.3.15 OE mmmm FM pnc GH (79 W Embedded Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specifica tion8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient M in
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1400 MHz 1600 MHz 1400 MHz 1600 MHz
VID_VDDNB 11,15 N/A 1.125 V N/A 1.125 V
IDDNB Max 12 N/A 11.9 A N/A 11.4 A
CPU COF 6
TDP 3,7 78.3 W 79.0 W 78.3 W 79.0 W
VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V
IDD Max 3,10 66.3 A 56.2 A 66.4 A 56.7 A
CPU COF 6
TDP 3,7 75.8 W 76.8 W 73.4 W 74.6 W
VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V
IDD Max 3,10 64.3 A 54.2 A 62.4 A 52.6 A
CPU COF 6
TDP 3,7 70.9 W 68.4 W 68.5 W 66.4 W
VID_VDD Min 9 1.075 V 1.050 V 1.075 V 1.050 V
VID_VDD Max 9 1.125 V 1.100 V 1.125 V 1.075 V
IDD Max 3,10 60.2 A 47.5 A 58.3 A 46.1 A
CPU COF 6
TDP 3,7 66.0 W 60.8 W 63.6 W 59.0 W
VID_VDD Min 9 1.075 V 1.025 V 1.075 V 1.025 V
VID_VDD Max 9 1.125 V 1.050 V 1.125 V 1.050 V
IDD Max 3,10 56.1 A 41.2 A 54.2 A 39.9 A
CPU COF 6
TDP 3,7 61.2 W 53.9 W 59.1 W 52.2 W
VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V
VID_VDD Max 9 1.125 V 1.000 V 1.125 V 1.000 V
IDD Max 3,10 52.1 A 35.3 A 50.1 A 34.1 A
S0.C1.Pmin IDD Max 3,10,14 21.3 A 7.1 A 20.0 A 6.5 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P4
OPN OE23GFFML4BGH16
S0.C0.Px
61 oC to 86 oC
70 oC
5 oC
F
S0.C0.P4
S0.C0.P4
1600 MHz
1400 MHz
S0.Cx.Px
S0.C0.P0
1700 MHz 1800 MHz
S0.C0.P2
1400 MHz
S0.C0.P1
1600 MHz
1000 MHz
S0.C0.P3
1200 MHz
S0.C0.P4
1000 MHz
1200 MHz
F
S0.C0.P4
OE13HFFML4BGH16
OE23HFFML4BGH
OE83HFFML4BGH
61 oC to 86 oC
70 oC
5 oC
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
52AMD Opteron™ Processor
2.3.16 OS mmmm WA pnc GI (115 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2200 MHz 1600 MHz 2200 MHz
VID_VDDNB Min 11,15 N/A 1.150 V N/A 1.150 V
VID_VDDNB Max 11,15 N/A 1.300 V N/A 1.300 V
IDDNB Max 12 N/A 20.0 A N/A 20.0 A
CPU COF 6
TDP 3,7 115.0 W 115.0 W 115.0 W 115.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V
IDD Max 3,10 90.0 A 72.7 A 90.0 A 72.2 A
CPU COF 6
TDP 3,7 100.4 W 84.8 W 100.4 W 84.7 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V
IDD Max 3,10 79.9 A 50.1 A 79.9 A 49.6 A
CPU COF 6
TDP 3,7 92.1 W 66.1 W 92.1 W 65.8 W
VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V
VID_VDD Max 9 1.150 V 1.125 V 1.150 V 1.125 V
IDD Max 3,10 72.7 A 35.1 A 72.7 A 34.5 A
CPU COF 6
TDP 3,7 80.5 W 51.1 W 82.2 W 53.1 W
VID_VDD Min 9 1.150 V 0.850 V 1.150 V 0.875 V
VID_VDD Max 9 1.150 V 1.025 V 1.150 V 1.050 V
IDD Max 3,10 62.6 A 21.4 A 64.1 A 23.2 A
IDD Max (Pre-Flush) 3,10,17 33.7 A 6.4 A 34.0 A 7.0 A
IDD Max (Post-Flush) 3,10,17 31.1 A 4.6 A 31.5 A 5.2 A
S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P3
S0.C0.P3
S0.C0.P3
800 MHz
2700 MHz
S0.C0.P1
2000 MHz
S0.C0.P2
1500 MHz
S0.C1.Pmin
OPN
OS2384WAL4DGI
OS8384WAL4DGI
S0.C0.Px
55 oC to 77 oC
70 oC
5 oC
G
S0.Cx.Px
S0.C0.P0
S0.C0.P3
2600 MHz
70 oC
G
S0.C0.P3
800 MHz
1900 MHz
1400 MHz
OS2382WAL4DGI
OS8382WAL4DGI
55 oC to 77 oC
5 oC
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
53AMD Opteron™ Processor
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,15 N/A 1.150 V N/A 1.150 V
VID_VDDNB Max 11,15 N/A 1.300 V N/A 1.300 V
IDDNB Max 12 N/A 20.0 A N/A 20.0 A
CPU COF 6
TDP 3,7 115.0 W 115.0 W 115.0 W 115.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V
IDD Max 3,10 90.0 A 71.8 A 90.0 A 71.4 A
CPU COF 6
TDP 3,7 100.4 W 84.4 W 100.4 W 83.8 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V
IDD Max 3,10 79.9 A 49.0 A 79.9 A 48.5 A
CPU COF 6
TDP 3,7 92.1 W 65.5 W 92.1 W 64.6 W
VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V
VID_VDD Max 9 1.150 V 1.125 V 1.150 V 1.125 V
IDD Max 3,10 72.7 A 33.9 A 72.7 A 33.3 A
CPU COF 6
TDP 3,7 83.8 W 53.9 W 85.5 W 57.6 W
VID_VDD Min 9 1.150 V 0.875 V 1.150 V 0.900 V
VID_VDD Max 9 1.150 V 1.050 V 1.150 V 1.075 V
IDD Max 3,10 65.5 A 23.7 A 67.0 A 25.6 A
IDD Max (Pre-Flush) 3,10,17 34.4 A 7.2 A 35.2 A 8.2 A
IDD Max (Post-Flush) 3,10,17 31.8 A 5.4 A 32.7 A 6.1 A
S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P0
S0.C0.Px
S0.Cx.Px
S0.C1.Pmin
S0.C0.P3
S0.C0.P1
S0.C0.P2
OPN
OS2378WAL4DGI
OS8378WAL4DGI
55 oC to 77 oC
70 oC
5 oC
1300 MHz
2500 MHz
5 oC
55 oC to 77 oC
70 oC
G
S0.C0.P3
S0.C0.P3
800 MHz
S0.C0.P3
OS2380WAL4DGI
OS8380WAL4DGI
800 MHz
1700 MHz
1200 MHz
1800 MHz
2400 MHz
G
S0.C0.P3
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
54AMD Opteron™ Processor
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2000 MHz
VID_VDDNB Min 11,15 N/A 1.150 V
VID_VDDNB Max 11,15 N/A 1.300 V
IDDNB Max 12 N/A 20.0 A
CPU COF 6
TDP 3,7 115.0 W 115.0 W
VID_VDD Min 9 1.150 V 1.150 V
VID_VDD Max 9 1.325 V 1.325 V
IDD Max 3,10 90.0 A 71.0 A
CPU COF 6
TDP 3,7 99.7 W 83.5 W
VID_VDD Min 9 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 79.3 A 47.9 A
CPU COF 6
TDP 3,7 91.4 W 64.2 W
VID_VDD Min 9 1.150 V 1.000 V
VID_VDD Max 9 1.175 V 1.175 V
IDD Max 3,10 72.1 A 32.7 A
CPU COF 6
TDP 3,7 86.4 W 58.4 W
VID_VDD Min 9 1.150 V 0.900 V
VID_VDD Max 9 1.150 V 1.075 V
IDD Max 3,10 67.8 A 27.5 A
IDD Max (Pre-Flush) 3,10,17 35.7 A 8.9 A
IDD Max (Post-Flush) 3,10,17 33.1 A 6.8 A
S0 I/O Power 13 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW
2300 MHz
S0.C0.P1
1600 MHz
55 oC to 77 oC
S0.C0.Px
S0.C0.P3
70 oC
5 oC
S0.C0.P3
OPN
G
OS2376WAL4DGI
S0.C1.Pmin
S0.C0.P3
800 MHz
S0.Cx.Px
S0.C0.P0
S0.C0.P2
1100 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
55AMD Opteron™ Processor
2.3.17 OS mmmm PA pnc GI (79 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,15 N/A 1.150 V N/A 1.150 V
VID_VDDNB Max 11,15 N/A 1.200 V N/A 1.200 V
IDDNB Max 12 N/A 13.4 A N/A 12.9 A
CPU COF 6
TDP 3,7 79.0 W 79.0 W 79.0 W 79.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V
IDD Max 3,10 60.3 A 48.8 A 60.0 A 49.1 A
CPU COF 6
TDP 3,7 69.6 W 61.8 W 69.2 W 61.9 W
VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 53.1 A 35.9 A 52.8 A 36.2 A
CPU COF 6
TDP 3,7 64.6 W 51.1 W 64.2 W 51.2 W
VID_VDD Min 9 1.150 V 1.000 V 1.150 V 1.000 V
VID_VDD Max 9 1.175 V 1.175 V 1.175 V 1.175 V
IDD Max 3,10 48.8 A 27.5 A 48.5 A 27.9 A
CPU COF 6
TDP 3,7 56.3 W 40.9 W 54.3 W 39.9 W
VID_VDD Min 9 1.150 V 0.925 V 1.150 V 0.925 V
VID_VDD Max 9 1.150 V 1.100 V 1.150 V 1.100 V
IDD Max 3,10 41.6 A 18.4 A 39.8 A 17.7 A
IDD Max (Pre-Flush) 3,10,17 21.0 A 5.3 A 20.2 A 5.1 A
IDD Max (Post-Flush) 3,10,17 18.4 A 3.3 A 17.6 A 3.0 A
S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
1700 MHz
2200 MHz
S0.C0.P3
S0.C0.P3
5 oC
H
55 oC to 76 oC
70 oC
5 oC
OS2374PAL4DGI
OS8374PAL4DGIOS2372PAL4DGI
55 oC to 76 oC
70 oC
S0.C1.Pmin
S0.C0.P2
1400 MHz
S0.C0.P3
800 MHz
1300 MHz
800 MHz
OPN
S0.C0.P1
2100 MHz
1600 MHz
S0.Cx.Px
S0.C0.P0
S0.C0.Px H
S0.C0.P3
S0.C0.P3
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
56AMD Opteron™ Processor
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2000 MHz
VID_VDDNB Min 11,15 N/A 1.150 V
VID_VDDNB Max 11,15 N/A 1.200 V
IDDNB Max 12 N/A 12.5 A
CPU COF 6
TDP 3,7 79.0 W 79.0 W
VID_VDD Min 9 1.150 V 1.150 V
VID_VDD Max 9 1.325 V 1.325 V
IDD Max 3,10 60.3 A 49.7 A
CPU COF 6
TDP 3,7 69.6 W 62.0 W
VID_VDD Min 9 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 53.1 A 36.9 A
CPU COF 6
TDP 3,7 64.6 W 51.2 W
VID_VDD Min 9 1.150 V 1.000 V
VID_VDD Max 9 1.175 V 1.175 V
IDD Max 3,10 48.8 A 28.6 A
CPU COF 6
TDP 3,7 53.0 W 37.7 W
VID_VDD Min 9 1.150 V 0.900 V
VID_VDD Max 9 1.150 V 1.075 V
IDD Max 3,10 38.7 A 16.4 A
IDD Max (Pre-Flush) 3,10,17 19.4 A 4.6 A
IDD Max (Post-Flush) 3,10,17 16.7 A 2.6 A
S0 I/O Power 13 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW
800 MHz
S0.C1.Pmin
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
1500 MHz
S0.C0.P3
1800 MHz
2300 MHz
S0.C0.P3
OS2376PAL4DGI
OS8376PAL4DGI
55 oC to 76 oC
OPN
S0.C0.Px H
70 oC
5 oC
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
57AMD Opteron™ Processor
2.3.18 OS mmmm YA pnc GI (137 W Server, Fr2 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2200 MHz
VID_VDDNB Min 11,15 N/A 1.150 V
VID_VDDNB Max 11,15 N/A 1.300 V
IDDNB Max 12 N/A 20.0 A
CPU COF 6
TDP 3,7 137 W 137 W
VID_VDD Min 9 1.225 V 1.225 V
VID_VDD Max 9 1.325 V 1.325 V
IDD Max 3,10 102.8 A 82.9 A
CPU COF 6
TDP 3,7 96.4 W 99.5 W
VID_VDD Min 9 1.150 V 1.125 V
VID_VDD Max 9 1.225 V 1.225 V
IDD Max 3,10 76.4 A 57.4 A
CPU COF 6
TDP 3,7 88.1 W 76.0 W
VID_VDD Min 9 1.150 V 1.025 V
VID_VDD Max 9 1.150 V 1.125 V
IDD Max 3,10 69.2 A 40.4 A
CPU COF 6
TDP 3,7 74.9 W 56.0 W
VID_VDD Min 9 1.150 V 0.925 V
VID_VDD Max 9 1.150 V 1.025 V
IDD Max 3,10 57.7 A 24.0 A
IDD Max (Pre-Flush) 3,10,17 36.2 A 7.5 A
IDD Max (Post-Flush) 3,10,17 33.6 A 5.5 A
S0 I/O Power 13 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW
S0.Cx.Px
S0.C0.P0
2800 MHz
S0.C0.P1
2100 MHz
S0.C1.Pmin
S0.C0.P2
1600 MHz
S0.C0.P3
800 MHz
OPN
OS2386YAL4DGI
OS8386YAL4DGI
S0.C0.Px
55 oC to 73 oC
70 oC
5 oC
I
S0.C0.P3
S0.C0.P3
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
58AMD Opteron™ Processor
2.3.19 OS mmmm WH pnc GI (115 W Server, Fr5 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2200 MHz 1600 MHz 2200 MHz
VID_VDDNB Min 11,15 N/A 1.150 V N/A 1.150 V
VID_VDDNB Max 11,15 N/A 1.200 V N/A 1.200 V
IDDNB Max 12 N/A 20.0 A N/A 20.0 A
CPU COF 6
TDP 3,7 115.0 W 115.0 W 115.0 W 115.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V
IDD Max 3,10 90.0 A 73.1 A 90.0 A 73.5 A
CPU COF 6
TDP 3,7 100.4 W 84.5 W 102.1 W 86.2 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V
IDD Max 3,10 79.9 A 50.7 A 81.4 A 52.5 A
CPU COF 6
TDP 3,7 92.1 W 65.3 W 92.1 W 66.0 W
VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V
VID_VDD Max 9 1.150 V 1.125 V 1.150 V 1.125 V
IDD Max 3,10 72.7 A 35.7 A 72.7 A 36.3 A
CPU COF 6
TDP 3,7 78.9 W 49.4 W 77.2 W 48.1 W
VID_VDD Min 9 1.150 V 0.850 V 1.150 V 0.825 V
VID_VDD Max 9 1.150 V 1.025 V 1.150 V 1.000 V
IDD Max 3,10 61.2 A 21.0 A 59.8 A 19.6 A
IDD Max (Pre-Flush) 3,10,17 33.2 A 6.2 A 32.4 A 5.6 A
IDD Max (Post-Flush) 3,10,17 30.6 A 4.5 A 29.8 A 3.9 A
S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.Cx.Px
S0.C0.P0
2800 MHz 2900 MHz
5 oC5
oC
S0.C0.P3 S0.C0.P3
GG
OPN
OS2387WHP4DGI
OS8387WHP4DGI
OS2389WHP4DGI
OS8389WHP4DGI
S0.C0.Px
55 oC to 77 oC55
oC to 77 oC
70 oC70
oC
S0.C0.P3 S0.C0.P3
S0.C1.Pmin
S0.C0.P1
2100 MHz 2300 MHz
S0.C0.P2
1600 MHz 1700 MHz
S0.C0.P3
800 MHz 800 MHz
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
59AMD Opteron™ Processor
2.3.20 OS mmmm PC pnc GI (79 W Server, Fr5 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,15 N/A 1.100 V N/A 1.100 V
VID_VDDNB Max 11,15 N/A 1.150 V N/A 1.150 V
IDDNB Max 12 N/A 11.2 A N/A 10.8 A
CPU COF 6
TDP 3,7 79.0 W 79.0 W 79.0 W 79.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V
IDD Max 3,10 61.3 A 50.8 A 61.3 A 51.2 A
CPU COF 6
TDP 3,7 70.7 W 61.6 W 72.4 W 63.1 W
VID_VDD Min 9 1.150 V 1.075 V 1.150 V 1.075 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 54.1 A 37.9 A 55.5 A 39.8 A
CPU COF 6
TDP 3,7 64.1 W 49.4 W 65.7 W 50.6 W
VID_VDD Min 9 1.150 V 1.000 V 1.150 V 1.000 V
VID_VDD Max 9 1.175 V 1.175 V 1.175 V 1.175 V
IDD Max 3,10 48.3 A 28.4 A 49.8 A 30.2 A
CPU COF 6
TDP 3,7 52.5 W 34.6 W 50.8 W 32.7 W
VID_VDD Min 9 1.150 V 0.875 V 1.150 V 0.850 V
VID_VDD Max 9 1.150 V 1.050 V 1.150 V 1.025 V
IDD Max 3,10 38.3 A 20.4 A 36.8 A 18.8 A
IDD Max (Pre-Flush) 3,10,17 18.4 A 4.2 A 17.6 A 3.8 A
IDD Max (Post-Flush) 3,10,17 15.8 A 2.3 A 15.0 A 2.0 A
S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C1.Pmin
OS2381PCP4DGI
OS8381PCP4DGI
55 oC to 76 oC
70 oC
5 oC
H
S0.C0.P3
S0.C0.P3
2500 MHz
2100 MHz
S0.Cx.Px
S0.C0.P0
1700 MHz
800 MHz
S0.C0.P3
800 MHz
2400 MHz
S0.C0.P1
1900 MHz
S0.C0.P2
1500 MHz
OPN
OS2379PCP4DGI
OS8379PCP4DGI
S0.C0.Px
55 oC to 76 oC
70 oC
5 oC
H
S0.C0.P3
S0.C0.P3
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
60AMD Opteron™ Processor
2.3.21 OS mmmm YC pnc GI (137 W Server, Fr5 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2200 MHz
VID_VDDNB Min 11,15 N/A 1.150 V
VID_VDDNB Max 11,15 N/A 1.200 V
IDDNB Max 12 N/A 19.6 A
CPU COF 6
TDP 3,7 137.0 W 137.0 W
VID_VDD Min 9 1.225 V 1.225 V
VID_VDD Max 9 1.325 V 1.325 V
IDD Max 3,10 104.9 A 85.5 A
CPU COF 6
TDP 3,7 99.4 W 99.7 W
VID_VDD Min 9 1.150 V 1.125 V
VID_VDD Max 9 1.225 V 1.225 V
IDD Max 3,10 79.0 A 60.2 A
CPU COF 6
TDP 3,7 91.1 W 76.2 W
VID_VDD Min 9 1.150 V 1.025 V
VID_VDD Max 9 1.150 V 1.125 V
IDD Max 3,10 71.8 A 43.1 A
CPU COF 6
TDP 3,7 72.9 W 48.6 W
VID_VDD Min 9 1.150 V 0.850 V
VID_VDD Max 9 1.150 V 0.950 V
IDD Max 3,10 56.0 A 19.6 A
IDD Max (Pre-Flush) 3,10,17 36.2 A 7.5 A
IDD Max (Post-Flush) 3,10,17 33.6 A 5.5 A
S0 I/O Power 13 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW
2400 MHz
1900 MHz
800 MHz
I
S0.C0.P3
S0.C0.P3
3100 MHz
OPN
S0.C0.Px
OS2393YCP4DGI
OS8393YCP4DGI
55 oC to 73 oC
70 oC
5 oC
S0.C1.Pmin
S0.C0.P2
S0.C0.P3
S0.Cx.Px
S0.C0.P0
S0.C0.P1
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
61AMD Opteron™ Processor
2.3.22 OS mmmm WG pnc GI (115 W Server, AM3) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2200 MHz 1600 MHz 2200 MHz
VID_VDDNB Min 11,15 N/A 1.150 V N/A 1.150 V
VID_VDDNB Max 11,15 N/A 1.200 V N/A 1.200 V
IDDNB Max 12 N/A 20.0 A N/A 20.0 A
CPU COF 6
TDP 3,7 115 W115 W115 W115 W
VID_VDD Min 9 1.150 V 1.150 V 1.150V 1.150V
VID_VDD Max 9 1.325 V 1.325 V 1.325V 1.325V
IDD Max 3,10 92.2 A 73.4 A 92.7 A 74.4 A
CPU COF 6
TDP 3,7 76.0 W 83.1 W 76.8 W 83.8 W
VID_VDD Min 9 1.050 V 1.050 V 1.050V 1.050V
VID_VDD Max 9 1.225 V 1.225 V 1.225V 1.225V
IDD Max 3,10 64.2 A 50.1 A 65.2 A 51.4 A
CPU COF 6
TDP 3,7 66.4 W 63.4 W 68.5 W 64.4 W
VID_VDD Min 9 1.050V 0.950V 1.050V 0.950V
VID_VDD Max 9 1.125V 1.125V 1.125V 1.125V
IDD Max 3,10 56.8 A 34.7 A 58.8 A 36.1 A
CPU COF 6
TDP 3,7 59.7 W 51.4 W 59.1 W 48.9 W
VID_VDD Min 9 1.050V 0.875V 1.050V 0.850V
VID_VDD Max 9 1.050V 1.050V 1.050V 1.025V
IDD Max 3,10 50.4 A 24.1 A 49.9 A 22.2 A
IDD Max (Pre-Flush) 3,10,17 29.9 A 7.4 A 29.6 A 6.6 A
IDD Max (Post-Flush) 3,10,17 27.6 A 5.5 A 27.3 A 4.9 A
S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
OS1385WGK4DGI
1800 MHz
S0.C0.P3S0.C0.P3
2500 MHz 2700 MHz
55 oC to 77 oC
70 oC
5 oC
S0.C1.Pmin
G
S0.C0.P3
800 MHz
S0.C0.P3
800 MHz
S0.Cx.Px
S0.C0.P1
2000 MHz
S0.C0.P2
1300 MHz 1500 MHz
S0.C0.P0
OPN OS1381WGK4DGI
S0.C0.Px
55 oC to 77 oC
70 oC
5 oC
G
S0.C0.P3
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
62AMD Opteron™ Processor
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2200 MHz
VID_VDDNB Min 11,15 N/A 1.150 V
VID_VDDNB Max 11,15 N/A 1.200 V
IDDNB Max 12 N/A 20.0 A
CPU COF 6
TDP 3,7 115 W 115 W
VID_VDD Min 9 1.150 V 1.150 V
VID_VDD Max 9 1.325 V 1.325 V
IDD Max 3,10 92.7 A 75.2 A
CPU COF 6
TDP 3,7 80.0 W 85.5 W
VID_VDD Min 9 1.050 V 1.050 V
VID_VDD Max 9 1.225 V 1.225 V
IDD Max 3,10 67.0 A 53.8 A
CPU COF 6
TDP 3,7 69.0 W 64.7 W
VID_VDD Min 9 1.050V 0.950V
VID_VDD Max 9 1.125V 1.125V
IDD Max 3,10 59.3 A 37.2 A
CPU COF 6
TDP 3,7 57.0 W 46.3 W
VID_VDD Min 9 1.050V 0.825V
VID_VDD Max 9 1.050V 1.000V
IDD Max 3,10 47.9 A 20.3 A
IDD Max (Pre-Flush) 3,10,17 28.6 A 5.8 A
IDD Max (Post-Flush) 3,10,17 26.3 A 4.2 A
S0 I/O Power 13 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW
1700 MHz
2900 MHz
S0.Cx.Px
S0.C0.P0
S0.C0.P1
OPN OS1389WGK4DGI
S0.C0.Px
55 oC to 77 oC
70 oC
5 oC
G
S0.C0.P3
S0.C0.P3
S0.C0.P3
800 MHz
S0.C1.Pmin
2300 MHz
S0.C0.P2
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
63AMD Opteron™ Processor
2.3.23 OS mmmm NA pnc GI (60 W Server, Fr5 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tc ase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,15 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,15 N/A 1.075 V N/A 1.075 V
VID_VDDNB Max 11,15 N/A 1.075 V N/A 1.075 V
IDDNB Max 12 N/A 7.7 A N/A 7.7 A
CPU COF 6
TDP 3,7 57.2 W 60.0 W 59.6 W 60.0 W
VID_VDD Min 9 1.075 V 1.050 V 1.075 V 1.050 V
VID_VDD Max 9 1.100 V 1.100 V 1.100 V 1.100 V
IDD Max 3,10 44.3 A 37.1 A 46.4 A 39.4 A
CPU COF 6
TDP 3,7 51.4 W 52.3 W 54.2 W 54.6 W
VID_VDD Min 9 1.075 V 1.025 V 1.075 V 1.025 V
VID_VDD Max 9 1.075 V 1.075 V 1.075 V 1.075 V
IDD Max 3,10 39.9 A 33.0 A 42.5 A 35.3 A
CPU COF 6
TDP 3,7 48.5 W 47.4 W 51.4 W 49.6 W
VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V
VID_VDD Max 9 1.075 V 1.050 V 1.075 V 1.050 V
IDD Max 3,10 37.2 A 29.2 A 39.9 A 31.4 A
CPU COF 6
TDP 3,7 45.7 W 43.0 W 48.5 W 45.0 W
VID_VDD Min 9 1.075 V 0.975 V 1.075 V 0.975 V
VID_VDD Max 9 1.075 V 1.025 V 1.075 V 1.025 V
IDD Max 3,10 34.6 A 25.6 A 37.2 A 27.7 A
CPU COF 6
TDP 3,7 35.8 W 28.9 W 35.8 W 28.5 W
VID_VDD Min 9 1.075 V 0.850 V 1.075 V 0.850 V
VID_VDD Max 9 1.075 V 0.900 V 1.075 V 0.900 V
IDD Max 3,10 25.4 A 13.4 A 25.4 A 13.2 A
IDD Max (Pre-Flush) 3,10,17 11.9 A 3.5 A 11.9 A 3.4 A
IDD Max (Post-Flush) 3,10,17 9.4 A 1.5 A 9.4 A 1.4 A
S0 I/O Power 13 8.5 W 8.5 W 8.5 W 8.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
OPN OS2377NAP4DGI
S0.C0.Px
55 oC to 68 oC
70 oC
5 oC
J
S0.C0.P4
S0.C0.P4
J
S0.Cx.Px
S0.C0.P0
2300 MHz
S0.C0.P1
2100 MHz1900 MHz
S0.C1.Pmin
S0.C0.P2
1900 MHz
S0.C0.P3
1700 MHz
1700 MHz
1500 MHz
S0.C0.P4
800 MHz 800 MHz
S0.C0.P4
S0.C0.P4
2100 MHz
OS2373NAP4DGI
OS8373NAP4DGI
55 oC to 68 oC
70 oC
5 oC
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
64AMD Opteron™ Processor
2.3.24 OS mmmm WJ pnc GN (115 W Server, Fr6 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes OS2427WJS6DGN
OS2431WJS6DGN
OS8431WJS6DGN
Tcase Max 1 55 oC to 76 oC55
oC to 76 oC
Tctl Max 2 70 oC 70 oC
Tambient Min 5 oC5
oC
Thermal Profile K K
Startup P-State 5 S0.C0.P4 S0.C0.P4
HTC P-State 4 S0.C0.P4 S0.C0.P4
NB COF 6,15 2200 MHz 2200 MHz
VID_VDDNB Min 15 1.175 V 1.175 V
VID_VDDNB Max 15 1.200 V 1.200 V
IDDNB Max 12 20.0 A 20.0 A
CPU COF 6 2200 MHz 2400 MHz
TDP 3,7 115.0 W 115.0 W
VID_VDD Min 9 1.025 V 1.025 V
VID_VDD Max 9 1.300 V 1.300 V
IDD Max 3,10 78.3 A 79.7 A
CPU COF 6 1700 MHz 1900 MHz
TDP 3,7 93.0 W 93.8 W
VID_VDD Min 9 0.975 V 0.975 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 60.5 A 62.2 A
CPU COF 6 1300 MHz 1500 MHz
TDP 3,7 80.5 W 81.8 W
VID_VDD Min 9 0.950 V 0.950 V
VID_VDD Max 9 1.225 V 1.225 V
IDD Max 3,10 49.4 A 51.4 A
CPU COF 6 1000 MHz 1200 MHz
TDP 3,7 71.1 W 69.4 W
VID_VDD Min 9 0.925 V 0.900 V
VID_VDD Max 9 1.200 V 1.175 V
IDD Max 3,10 41.1 A 40.6 A
CPU COF 6 800 MHz 800 MHz
TDP 3,7 59.2 W 57.8 W
VID_VDD Min 9 0.850 V 0.850 V
VID_VDD Max 9 1.125 V 1.125 V
IDD Max 3,10 30.9 A 29.5 A
IDD Max (Pre-Flush) 3,10,17 10.5 A 10.0 A
IDD Max (Post-Flush) 3,10,17 8.2 A 7.7 A
S0 I/O Power 13 9.8 W 9.8 W
S3 I/O Power 13 350 mW 350 mW
S0.C0.P4
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
65AMD Opteron™ Processor
The notes for this table are on page 80.
State Specification8Notes
OS2435WJS6DGN
OS8435WJS6DGN
Tcase Max 1 55 oC to 76 oC
Tctl Max 2 70 oC
Tambient Min 5 oC
Thermal Profile K
Startup P-State 5 S0.C0.P4
HTC P-State 4 S0.C0.P4
NB COF 6,15 2200 MHz
VID_VDDNB Min 15 1.175 V
VID_VDDNB Max 15 1.200 V
IDDNB Max 12 17.4 A
CPU COF 6 2600 MHz
TDP 3,7 115.0 W
VID_VDD Min 9 1.075 V
VID_VDD Max 9 1.300 V
IDD Max 3,10 80.0 A
CPU COF 6 2100 MHz
TDP 3,7 93.2 W
VID_VDD Min 9 1.025 V
VID_VDD Max 9 1.250 V
IDD Max 3,10 62.8 A
CPU COF 6 1700 MHz
TDP 3,7 80.8 W
VID_VDD Min 9 1.000 V
VID_VDD Max 9 1.225 V
IDD Max 3,10 52.0 A
CPU COF 6 1400 MHz
TDP 3,7 71.5 W
VID_VDD Min 9 0.975 V
VID_VDD Max 9 1.200 V
IDD Max 3,10 43.8 A
CPU COF 6 800 MHz
TDP 3,7 53.2 W
VID_VDD Min 9 0.900 V
VID_VDD Max 9 1.125 V
IDD Max 3,10 27.1 A
IDD Max (Pre-Flush) 3,10,17 8.6 A
IDD Max (Post-Flush) 3,10,17 6.4 A
S0 I/O Power 13 9.8 W
S3 I/O Power 13 350 mW
S0.C0.P4
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
66AMD Opteron™ Processor
2.3.25 OS mmmm PD pnc GN (79 W Server, Fr6 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes OS2423PDS6DGN
OS2425PDS6DGN
OS8425PDS6DGN
Tcase Max 1 55 oC to 76 oC 55 oC to 76 oC
Tctl Max 2 70 oC 70 oC
Tambient Min 5 oC5
oC
Thermal Profile E E
Startup P-State 5 S0.C0.P4 S0.C0.P4
HTC P-State 4 S0.C0.P4 S0.C0.P4
NB COF 6,15 2200 MHz 2200 MHz
VID_VDDNB Min 15 1.175 V 1.175 V
VID_VDDNB Max 15 1.200 V 1.200 V
IDDNB Max 12 17.5 A 16.7 A
CPU COF 6 2000 MHz 2100 MHz
TDP 3,7 79.0 W 79.0 W
VID_VDD Min 9 0.950 V 0.950 V
VID_VDD Max 9 1.150 V 1.150 V
IDD Max 3,10 54.6 A 55.3 A
CPU COF 6 1500 MHz 1600 MHz
TDP 3,7 67.1 W 67.1 W
VID_VDD Min 9 0.925 V 0.925 V
VID_VDD Max 9 1.125 V 1.125 V
IDD Max 3,10 42.4 A 43.3 A
CPU COF 6 1300 MHz 1400 MHz
TDP 3,7 61.1 W 61.1 W
VID_VDD Min 9 0.900 V 0.900 V
VID_VDD Max 9 1.100 V 1.100 V
IDD Max 3,10 36.7 A 37.6 A
CPU COF 6 1000 MHz 1100 MHz
TDP 3,7 54.2 W 54.1 W
VID_VDD Min 9 0.875 V 0.875 V
VID_VDD Max 9 1.075 V 1.075 V
IDD Max 3,10 29.7 A 30.6 A
CPU COF 6 800 MHz 800 MHz
TDP 3,7 49.4 W 48.0 W
VID_VDD Min 9 0.850 V 0.850 V
VID_VDD Max 9 1.050 V 1.050 V
IDD Max 3,10 24.8 A 24.1 A
IDD Max (Pre-Flush) 3,10,17 7.8 A 7.5 A
IDD Max (Post-Flush) 3,10,17 5.7 A 5.4 A
S0 I/O Power 13 9.8 W 9.8 W
S3 I/O Power 13 350 mW 350 mW
S0.C0.P4
S0.C1.Pmin
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
67AMD Opteron™ Processor
2.3.26 OS mmmm NB pnc GN (60 W Server, Fr6 (1207)) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes OS2419NBS6DGN
Tcase Max 1 55 oC to 68 oC
Tctl Max 2 70 oC
Tambient Min 5 oC
Thermal Profile P
Startup P-State 5 S0.C0.P4
HTC P-State 4 S0.C0.P4
NB COF 6,15 2000 MHz
VID_VDDNB 15 1.125 V
IDDNB Max 12 11.2 A
CPU COF 6 1800 MHz
TDP 3,7 60.0 W
VID_VDD Min 9 0.900 V
VID_VDD Max 9 1.125 V
IDD Max 3,10 42.7 A
CPU COF 6 1400 MHz
TDP 3,7 51.0 W
VID_VDD Min 9 0.875 V
VID_VDD Max 9 1.100 V
IDD Max 3,10 33.7 A
CPU COF 6 1200 MHz
TDP 3,7 47.9 W
VID_VDD Min 9 0.875 V
VID_VDD Max 9 1.100 V
IDD Max 3,10 30.3 A
CPU COF 6 1000 MHz
TDP 3,7 42.9 W
VID_VDD Min 9 0.850 V
VID_VDD Max 9 1.075 V
IDD Max 3,10 25.4 A
CPU COF 6 800 MHz
TDP 3,7 40.0 W
VID_VDD Min 9 0.850 V
VID_VDD Max 9 1.075 V
IDD Max 3,10 22.1 A
IDD Max (Pre-Flush) 3,10,17 6.6 A
IDD Max (Post-Flush) 3,10,17 4.5 A
S0 I/O Power 13 9.8 W
S3 I/O Power 13 350 mW
S0.C0.P4
S0.C1.Pmin
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
68AMD Opteron™ Processor
2.3.27 OS mmmm WK pnc GO (115 W Server, G34r1) Thermal and Power Specifications
The notes for this table are on page 80.
State Specifica tion8Notes OS6168WKTCEGO OS6172WKTCEGO
Tcase Max 1 55
o
C to 69
o
C55
o
C to 69
o
C
Tctl Max 2 70
o
C70
o
C
Tambient M in 5
o
C5
o
C
Thermal Profile Q Q
Startup P-State 5 S0.C0.P4 S0.C0.P4
HTC P-State 4 S0.C0.P4 S0.C0.P4
NB COF 6,15 1800 MHz 1800 MHz
VID_VDDNB Min 15 1.0250 V 1.0250 V
VID_VDDNB Max 15 1.1000 V 1.1000 V
IDDNB Max 12 19.6 A 18.4 A
CPU COF 6 1900 MHz 2100 MHz
TDP 3,7 115.0 W 115.0 W
Max Power 18 135.0 W 135.0 W
VID_VDD Min 9 1.0000 V 1.0000 V
VID_VDD Max 9 1.1875 V 1.1875 V
IDD TDC 93.4 A 96.6 A
CPU COF 6 1500 MHz 1700 MHz
TDP 3,7 99.4 W 101.2 W
Max Power 18 113.7 W 114.9 W
VID_VDD Min 9 0.9500 V 0.9500 V
VID_VDD Max 9 1.1375 V 1.1375 V
IDD TDC 75.2 A 78.5 A
CPU COF 6 1300 MHz 1400 MHz
TDP 3,7 93.7 W 90.4 W
Max Power 18 102.6 W 100.4 W
VID_VDD Min 9 0.9250 V 0.9125 V
VID_VDD Max 9 1.1125 V 1.1125 V
IDD TDC 66.5 A 66.9 A
CPU COF 6 1000 MHz 1100 MHz
TDP 3,7 83.5 W 81.8 W
Max Power 18 90.7 W 89.6 W
VID_VDD Min 9 0.9000 V 0.9000 V
VID_VDD Max 9 1.0875 V 1.0875 V
IDD TDC 55.0 A 55.4 A
CPU COF 6 800 MHz 800 MHz
TDP 3,7 78.0 W 73.7 W
Max Power 18 83.8 W 79.7 W
VID_VDD Min 9 0.8750 V 0.8750 V
VID_VDD Max 9 1.0625 V 1.0625 V
IDD TDC 46.8 A 44.3 A
IDD Max (Pre-Flush) 3,10,17 22.0 A 18.4 A
IDD Max (Post-Flush) 3,10,17 16.1 A 12.5 A
TDP 19 15.2 W 12.0 W
I/O Power 8.7 W 8.7 W
S0 I/O Power 21 23.8 W 23.3 W
S3 I/O Power 20 600 mW 600 mW
S0.C1e.Pmin
S0.C0.P2
S0.C1.Pmin
S0.C0.P1
S0.C0.P0
S0.C0.P3
S0.C0.P4
S0.C0.Px
S0.Cx.Px
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
69AMD Opteron™ Processor
The notes for this table are on page 80.
State Specifica tion8Notes OS6174WKTCEGO
Tcase Max 1 55
o
C to 69
o
C
Tctl Max 2 70
o
C
Tambient M in 5
o
C
Thermal Profile Q
Startup P-State 5 S0.C0.P4
HTC P-State 4 S0.C0.P4
NB COF 6,15 1800 MHz
VID_VDDNB Min 15 1.0250 V
VID_VDDNB Max 15 1.1000 V
IDDNB Max 12 17.2 A
CPU COF 6 2200 MHz
TDP 3,7 115.0 W
Max Power 18 135.0 W
VID_VDD Min 9 1.0000 V
VID_VDD Max 9 1.1875 V
IDD TDC 98.3 A
CPU COF 6 1800 MHz
TDP 3,7 99.2 W
Max Power 18 113.5 W
VID_VDD Min 9 0.9500 V
VID_VDD Max 9 1.1375 V
IDD TDC 80.1 A
CPU COF 6 1400 MHz
TDP 3,7 88.1 W
Max Power 18 98.6 W
VID_VDD Min 9 0.9250 V
VID_VDD Max 9 1.1125 V
IDD TDC 65.6 A
CPU COF 6 1100 MHz
TDP 3,7 79.4 W
Max Power 18 87.8 W
VID_VDD Min 9 0.9000 V
VID_VDD Max 9 1.0875 V
IDD TDC 54.2 A
CPU COF 6 800 MHz
TDP 3,7 71.1 W
Max Power 18 77.5 W
VID_VDD Min 9 0.8750 V
VID_VDD Max 9 1.0625 V
IDD TDC 43.1 A
IDD Max (Pre-Flush) 3,10,17 17.5 A
IDD Max (Post-Flush) 3,10,17 11.6 A
TDP 19 11.2 W
I/O Power 8.7 W
S0 I/O Power 21 23.2 W
S3 I/O Power 20 600 mW
S0.C1e.Pmin
S0.C1.Pmin
S0.C0.P2
S0.C0.P0
S0.C0.P1
S0.C0.P4
S0.C0.P3
S0.C0.Px
S0.Cx.Px
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
70AMD Opteron™ Processor
The notes for this table are on page 80.
State Specifica tion8Notes OS6128WKT8EGO OS6134W KT8EGO
Tcase Max 1 55
o
C to 70
o
C55
o
C to 70
o
C
Tctl Max 2 70
o
C70
o
C
Tambient M in 5
o
C5
o
C
Thermal Profile R R
Startup P-State 5 S0.C0.P4 S0.C0.P4
HTC P-State 4 S0.C0.P4 S0.C0.P4
NB COF 6,15 1800 MHz 1800 MHz
VID_VDDNB Min 15 1.0250 V 1.0250 V
VID_VDDNB Max 15 1.1000 V 1.1000 V
IDDNB Max 12 21.1 A 19.4 A
CPU COF 6 2000 MHz 2300 MHz
TDP 3,7 115.0 W 115.0 W
Max Power 18 135.0 W 135.0 W
VID_VDD Min 9 1.0000 V 1.0375 V
VID_VDD Max 9 1.3000 V 1.3000 V
IDD TDC 84.8 A 87.9 A
CPU COF 6 1500 MHz 1800 MHz
TDP 3,7 99.7 W 97.9 W
Max Power 18 109.1 W 111.3 W
VID_VDD Min 9 0.9500 V 0.9750 V
VID_VDD Max 9 1.2375 V 1.2375 V
IDD TDC 66.5 A 69.8 A
CPU COF 6 1200 MHz 1400 MHz
TDP 3,7 90.3 W 87.2 W
Max Power 18 96.2 W 94.8 W
VID_VDD Min 9 0.9125 V 0.9375 V
VID_VDD Max 9 1.2000 V 1.2000 V
IDD TDC 56.2 A 57.6 A
CPU COF 6 1000 MHz 1100 MHz
TDP 3,7 83.2 W 78.8 W
Max Power 18 88.4 W 84.9 W
VID_VDD Min 9 0.8750 V 0.9000 V
VID_VDD Max 9 1.1625 V 1.1625 V
IDD TDC 48.5 A 47.9 A
CPU COF 6 800 MHz 800 MHz
TDP 3,7 77.0 W 71.2 W
Max Power 18 81.1 W 75.7 W
VID_VDD Min 9 0.8375 V 0.8625 V
VID_VDD Max 9 1.1250 V 1.1250 V
IDD TDC 41.0 A 38.6 A
IDD Max (Pre-Flush) 3,10,17 21.3 A 18.7 A
IDD Max (Post-Flush) 3,10,17 17.7 A 15.1 A
TDP 19 17.0 W 14.5 W
I/O Power 8.7 W 8.7 W
S0 I/O Power 21 24.4 W 23.9 W
S3 I/O Power 20 600 mW 600 mW
S0.C0.P2
S0.C1e.Pmin
S0.C1.Pmin
S0.C0.P3
S0.C0.P4
S0.C0.Px
S0.C0.P0
S0.C0.P1
S0.Cx.Px
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
71AMD Opteron™ Processor
The notes for this table are on page 80.
State Specifica tion8Notes OS6136WKT8EGO
Tcase Max 1 55
o
C to 70
o
C
Tctl Max 2 70
o
C
Tambient M in 5
o
C
Thermal Profile R
Startup P-State 5 S0.C0.P4
HTC P-State 4 S0.C0.P4
NB COF 6,15 1800 MHz
VID_VDDNB Min 15 1.0250 V
VID_VDDNB Max 15 1.1000 V
IDDNB Max 12 19.0 A
CPU COF 6 2400 MHz
TDP 3,7 115.0 W
Max Power 18 135.0 W
VID_VDD Min 9 1.0375 V
VID_VDD Max 9 1.3000 V
IDD TDC 89.0 A
CPU COF 6 1900 MHz
TDP 3,7 98.0 W
Max Power 18 111.4 W
VID_VDD Min 9 0.9750 V
VID_VDD Max 9 1.2375 V
IDD TDC 70.9 A
CPU COF 6 1500 MHz
TDP 3,7 87.4 W
Max Power 18 95.3 W
VID_VDD Min 9 0.9375 V
VID_VDD Max 9 1.2000 V
IDD TDC 58.7 A
CPU COF 6 1100 MHz
TDP 3,7 77.6 W
Max Power 18 83.7 W
VID_VDD Min 9 0.9000 V
VID_VDD Max 9 1.1625 V
IDD TDC 47.1 A
CPU COF 6 800 MHz
TDP 3,7 70.0 W
Max Power 18 74.5 W
VID_VDD Min 9 0.8625 V
VID_VDD Max 9 1.1250 V
IDD TDC 37.8 A
IDD Max (Pre-Flush) 3,10,17 18.2 A
IDD Max (Post-Flush) 3,10,17 14.5 A
TDP 19 14.0 W
I/O Power 8.7 W
S0 I/O Power 21 23.8 W
S3 I/O Power 20 600 mW
S0.C1e.Pmin
S0.C0.P4
S0.C0.P1
S0.C0.P0
S0.C0.Px
S0.Cx.Px
S0.C1.Pmin
S0.C0.P3
S0.C0.P2
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
72AMD Opteron™ Processor
2.3.28 OS mmmm VA pnc GO (85 W Server, G34r1) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes OS6164VATCEGO
Tcase Max 1 55
o
C to 65
o
C
Tctl Max 2 70
o
C
Tambient Min 5
o
C
Thermal Profile S
Startup P-State 5 S0.C0.P4
HTC P-State 4 S0.C0.P4
NB COF 6,15 1800 MHz
VID_VDDNB Min 15 1.0250 V
VID_VDDNB Max 15 1.1000 V
IDDNB Max 12 16.9 A
CPU COF 6 1700 MHz
TDP 3,7 85.0 W
Max Power 18 100.0 W
VID_VDD Min 9 0.8500 V
VID_VDD Max 9 1.0750 V
IDD TDC 68.8 A
CPU COF 6 1500 MHz
TDP 3,7 79.1 W
Max Power 18 91.1 W
VID_VDD Min 9 0.8250 V
VID_VDD Max 9 1.0625 V
IDD TDC 60.2 A
CPU COF 6 1200 MHz
TDP 3,7 71.8 W
Max Power 18 79.5 W
VID_VDD Min 9 0.8000 V
VID_VDD Max 9 1.0250 V
IDD TDC 49.3 A
CPU COF 6 1000 MHz
TDP 3,7 66.4 W
Max Power 18 72.8 W
VID_VDD Min 9 0.7750 V
VID_VDD Max 9 1.0000 V
IDD TDC 42.0 A
CPU COF 6 800 MHz
TDP 3,7 61.5 W
Max Power 18 66.8 W
VID_VDD Min 9 0.7500 V
VID_VDD Max 9 0.9750 V
IDD TDC 35.0 A
IDD Max (Pre-Flush) 3,10,17 13.5 A
IDD Max (Post-Flush) 3,10,17 8.4 A
TDP 19 8.6 W
I/O Power 8.7 W
S0 I/O Power 21 23.1 W
S3 I/O Power 20 600 mW
S0.C1.Pmin
S0.C0.P0
S0.Cx.Px
S0.C0.Px
S0.C0.P4
S0.C0.P3
S0.C0.P2
S0.C0.P1
S0.C1e.Pmin
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
73AMD Opteron™ Processor
The notes for this table are on page 80.
State Specifica tion8Notes OS6124VAT8EGO OS6128VAT8EGO
Tcase Max 1 55
o
C to 66
o
C55
o
C to 66
o
C
Tctl Max 2 70
o
C70
o
C
Tambient M in 5
o
C5
o
C
Thermal Profile T T
Startup P-State 5 S0.C0.P4 S0.C0.P4
HTC P-State 4 S0.C0.P4 S0.C0.P4
NB COF 6,15 1800 MHz 1800 MHz
VID_VDDNB Min 15 1.0250 V 1.0250 V
VID_VDDNB Max 15 1.1000 V 1.1000 V
IDDNB Max 12 17.9 A 17.1 A
CPU COF 6 1800 MHz 2000 MHz
TDP 3,7 85.0 W 85.0 W
Max Power 18 100.0 W 100.0 W
VID_VDD Min 9 0.9000 V 0.8875 V
VID_VDD Max 9 1.2000 V 1.2000 V
IDD TDC 61.0 A 63.2 A
CPU COF 6 1600 MHz 1700 MHz
TDP 3,7 79.6 W 78.5 W
Max Power 18 91.3 W 89.2 W
VID_VDD Min 9 0.8750 V 0.8625 V
VID_VDD Max 9 1.1750 V 1.1750 V
IDD TDC 54.4 A 54.5 A
CPU COF 6 1300 MHz 1400 MHz
TDP 3,7 72.4 W 71.3 W
Max Power 18 79.0 W 77.8 W
VID_VDD Min 9 0.8375 V 0.8250 V
VID_VDD Max 9 1.1375 V 1.1375 V
IDD TDC 46.1 A 46.4 A
CPU COF 6 1100 MHz 1100 MHz
TDP 3,7 69.0 W 66.5 W
Max Power 18 74.3 W 71.8 W
VID_VDD Min 9 0.8250 V 0.8125 V
VID_VDD Max 9 1.1125 V 1.1125 V
IDD TDC 40.3 A 38.8 A
CPU COF 6 800 MHz 800 MHz
TDP 3,7 63.7 W 61.5 W
Max Power 18 67.7 W 65.6 W
VID_VDD Min 9 0.8000 V 0.7875 V
VID_VDD Max 9 1.0875 V 1.0875 V
IDD TDC 32.9 A 31.4 A
IDD Max (Pre-Flush) 3,10,17 14.9 A 13.9 A
IDD Max (Post-Flush) 3,10,17 11.5 A 10.4 A
TDP 19 11.2 W 10.3 W
I/O Power 8.7 W 8.7 W
S0 I/O Power 21 23.6 W 23.3 W
S3 I/O Power 20 600 mW 600 mW
S0.Cx.Px
S0.C0.P4
S0.C1.Pmin
S0.C0.P2
S0.C0.P3
S0.C0.P0
S0.C0.P1
S0.C1e.Pmin
S0.C0.Px
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
74AMD Opteron™ Processor
2.3.29 OS mmmm YE pnc GO (140 W Server, G34r1) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes OS6176YETCEGO
Tcase Max 1 55
o
C to 64
o
C
Tctl Max 2 70
o
C
Tambient Min 5
o
C
Thermal Profile V
Startup P-State 5 S0.C0.P4
HTC P-State 4 S0.C0.P4
NB COF 6,15 1800 MHz
VID_VDDNB Min 15 1.0250 V
VID_VDDNB Max 15 1.1000 V
IDDNB Max 12 22.5 A
CPU COF 6 2300 MHz
TDP 3,7 140.0 W
Max Power 18 165.0 W
VID_VDD Min 9 1.0375 V
VID_VDD Max 9 1.2500 V
IDD TDC 113.5 A
CPU COF 6 2000 MHz
TDP 3,7 126.6 W
Max Power 18 145.0 W
VID_VDD Min 9 1.0000 V
VID_VDD Max 9 1.2125 V
IDD TDC 99.1 A
CPU COF 6 1600 MHz
TDP 3,7 110.3 W
Max Power 18 121.5 W
VID_VDD Min 9 0.9500 V
VID_VDD Max 9 1.1625 V
IDD TDC 80.8 A
CPU COF 6 1200 MHz
TDP 3,7 93.9 W
Max Power 18 102.2 W
VID_VDD Min 9 0.8875 V
VID_VDD Max 9 1.1000 V
IDD TDC 62.1 A
CPU COF 6 800 MHz
TDP 3,7 77.6 W
Max Power 18 82.9 W
VID_VDD Min 9 0.8000 V
VID_VDD Max 9 0.8375 V
IDD TDC 42.9 A
IDD Max (Pre-Flush) 3,10,17 20.2 A
IDD Max (Post-Flush) 3,10,17 15.1 A
TDP 19 14.5 W
I/O Power 8.7 W
S0 I/O Power 21 24.2 W
S3 I/O Power 20 600 mW
S0.C1e.Pmin
S0.C0.P2
S0.C0.P3
S0.C0.P4
S0.C1.Pmin
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
75AMD Opteron™ Processor
2.3.30 OS mmmm WL pnc GO (95 W Server, C32) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes OS4184WLU6DGO OS4180WLU6DGO
Tcase Max 1 55
o
C to 70
o
C55
o
C to 70
o
C
Tctl Max 2 70
o
C70
o
C
Tambient M in 5
o
C5
o
C
Thermal Profile Y Y
Startup P-State 5 S0.C0.P4 S0.C0.P4
HTC P-State 4 S0.C0.P4 S0.C0.P4
NB COF 6,15 2200 MHz 2200 MHz
VID_VDDNB Min 15 1.0750 V 1.0750 V
VID_VDDNB Max 15 1.2000 V 1.2000 V
IDDNB Max 12 14.0 A 14.8 A
CPU COF 6 2800 MHz 2600 MHz
TDP 3,7 95.0 W 95.0 W
Max Power 18 115.0 W 113.9 W
VID_VDD Min 9 1.1250 V 1.1250 V
VID_VDD Max 9 1.3500 V 1.3500 V
IDD TDC 79.0 A 77.4 A
CPU COF 6 2500 MHz 2300 MHz
TDP 3,7 85.1 W 85.0 W
Max Power 18 100.9 W 99.8 W
VID_VDD Min 9 1.0875 V 1.0875 V
VID_VDD Max 9 1.3125 V 1.3125 V
IDD TDC 69.6 A 67.9 A
CPU COF 6 1900 MHz 1800 MHz
TDP 3,7 69.0 W 70.2 W
Max Power 18 77.8 W 78.6 W
VID_VDD Min 9 1.0250 V 1.0250 V
VID_VDD Max 9 1.2500 V 1.2500 V
IDD TDC 53.3 A 53.3 A
CPU COF 6 1400 MHz 1300 MHz
TDP 3,7 57.6 W 58.7 W
Max Power 18 64.4 W 65.1 W
VID_VDD Min 9 0.9750 V 0.9750 V
VID_VDD Max 9 1.1875 V 1.1875 V
IDD TDC 40.9 A 40.8 A
CPU COF 6 800 MHz 800 MHz
TDP 3,7 40.9 W 42.8 W
Max Power 18 45.0 W 46.9 W
VID_VDD Min 9 0.8250 V 0.8250 V
VID_VDD Max 9 0.8500 V 0.8500 V
IDD TDC 22.9 A 24.0 A
IDD Max (Pre-Flush) 3,10,17 9.6 A 10.4 A
IDD Max (Post-Flush) 3,10,17 7.0 A 7.7 A
TDP 19 7.9 W 8.8 W
I/O Power 4.2 W 4.2 W
S0 I/O Power 21 10.9 W 11.1 W
S3 I/O Power 20 200 mW 200 mW
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
S0.C0.P4
S0.C1.Pmin
S0.C1e.Pmin
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
76AMD Opteron™ Processor
2.3.31 OS mmmm WL pnc GN (95 W Server, C32) Thermal and Power Specifications
The notes for this table are on page 80.
State Specification8Notes OS4130WLU4DGN OS4122WLU4DGN
Tcase Max 1 55
o
C to 70
o
C55
o
C to 70
o
C
Tctl Max 2 70
o
C70
o
C
Tambient M in 5
o
C5
o
C
Thermal Profile Y Y
Startup P-State 5 S0.C0.P4 S0.C0.P4
HTC P-State 4 S0.C0.P4 S0.C0.P4
NB COF 6,15 2200 MHz 2200 MHz
VID_VDDNB Min 15 1.1000 V 1.1000 V
VID_VDDNB Max 15 1.2500 V 1.2500 V
IDDNB Max 12 17.2 A 18.3 A
CPU COF 6 2600 MHz 2200 MHz
TDP 3,7 95.0 W 95.0 W
Max Power 18 107.9 W 106.7 W
VID_VDD Min 9 1.1625 V 1.1625 V
VID_VDD Max 9 1.3125 V 1.3125 V
IDD TDC 70.3 A 68.1 A
CPU COF 6 2300 MHz 1900 MHz
TDP 3,7 86.0 W 85.9 W
Max Power 18 96.4 W 94.7 W
VID_VDD Min 9 1.1250 V 1.1250 V
VID_VDD Max 9 1.2750 V 1.2750 V
IDD TDC 62.3 A 59.9 A
CPU COF 6 1800 MHz 1600 MHz
TDP 3,7 74.2 W 76.0 W
Max Power 18 81.0 W 82.6 W
VID_VDD Min 9 1.0750 V 1.0750 V
VID_VDD Max 9 1.2250 V 1.2250 V
IDD TDC 50.9 A 50.9 A
CPU COF 6 1300 MHz 1200 MHz
TDP 3,7 63.9 W 66.4 W
Max Power 18 69.2 W 71.5 W
VID_VDD Min 9 1.0250 V 1.0250 V
VID_VDD Max 9 1.1750 V 1.1750 V
IDD TDC 40.4 A 41.4 A
CPU COF 6 800 MHz 800 MHz
TDP 3,7 49.7 W 52.5 W
Max Power 18 53.3 W 56.1 W
VID_VDD Min 9 0.8875 V 0.8875 V
VID_VDD Max 9 0.9000 V 0.9000 V
IDD TDC 26.1 A 27.7 A
IDD Max (Pre-Flush) 3,10,17 13.3 A 14.5 A
IDD Max (Post-Flush) 3,10,17 11.4 A 12.6 A
TDP 19 12.9 W 14.2 W
I/O Power 4.2 W 4.2 W
S0 I/O Power 21 11.3 W 11.5 W
S3 I/O Power 20 200 mW 200 mW
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C1e.Pmin
S0.C0.P2
S0.C0.P3
S0.C0.P4
S0.C1.Pmin
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
77AMD Opteron™ Processor
2.3.32 OS mmmm OF pnc GO (65 W Server, C32) Thermal and Power Specifications
The notes for this table are on page 80.
State Specifica tion8Notes OS4170OFU6DGO OS4174OFU6DGO
Tcase Max 1 55
o
C to 70
o
C55
o
C to 70
o
C
Tctl Max 2 70
o
C70
o
C
Tambient M in 5
o
C5
o
C
Thermal Profile W W
Startup P-State 5 S0.C0.P4 S0.C0.P4
HTC P-State 4 S0.C0.P4 S0.C0.P4
NB COF 6,15 2200 MHz 2200 MHz
VID_VDDNB Min 15 1.0750 V 1.0750 V
VID_VDDNB Max 15 1.2000 V 1.2000 V
IDDNB Max 12 16.0 A 15.2 A
CPU COF 6 2100 MHz 2300 MHz
TDP 3,7 65.0 W 65.0 W
Max Power 18 78.0 W 79.0 W
VID_VDD Min 9 0.9125 V 0.9125 V
VID_VDD Max 9 1.1875 V 1.1875 V
IDD TDC 52.8 A 54.4 A
CPU COF 6 1800 MHz 2000 MHz
TDP 3,7 59.6 W 59.6 W
Max Power 18 68.4 W 69.5 W
VID_VDD Min 9 0.8875 V 0.8875 V
VID_VDD Max 9 1.1625 V 1.1625 V
IDD TDC 45.7 A 47.4 A
CPU COF 6 1400 MHz 1600 MHz
TDP 3,7 51.8 W 51.8 W
Max Power 18 57.3 W 57.7 W
VID_VDD Min 9 0.8375 V 0.8375 V
VID_VDD Max 9 1.1000 V 1.1000 V
IDD TDC 36.0 A 37.7 A
CPU COF 6 1100 MHz 1200 MHz
TDP 3,7 46.8 W 45.8 W
Max Power 18 51.3 W 50.6 W
VID_VDD Min 9 0.8000 V 0.8000 V
VID_VDD Max 9 1.0625 V 1.0625 V
IDD TDC 29.5 A 29.8 A
CPU COF 6 800 MHz 800 MHz
TDP 3,7 43.5 W 41.7 W
Max Power 18 47.4 W 45.6 W
VID_VDD Min 9 0.7875 V 0.7875 V
VID_VDD Max 9 0.8250 V 0.8250 V
IDD TDC 24.7 A 23.6 A
IDD Max (Pre-Flush) 3,10,17 11.1 A 10.4 A
IDD Max (Post-Flush) 3,10,17 8.6 A 7.9 A
TDP 19 9.3 W 8.5 W
I/O Power 4.2 W 4.2 W
S0 I/O Power 21 11.4 W 11.3 W
S3 I/O Power 20 200 mW 200 mW
S0.C0.P4
S0.C1.Pmin
S0.C1e.Pmin
S0.C0.P2
S0.C0.P3
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
78AMD Opteron™ Processor
The notes for this table are on page 80.
State Specification8Notes OS4176OFU6DGO
Tcase Max 1 55
o
C to 70
o
C
Tctl Max 2 70
o
C
Tam bient M in 5
o
C
Thermal Profile W
Startup P-State 5 S0.C0.P4
HTC P-State 4 S0.C0.P4
NB COF 6,15 2200 MHz
VID_VDDNB Min 15 1.0750 V
VID_VDDNB Max 15 1.2000 V
IDDNB Max 12 14.8 A
CPU COF 6 2400 MHz
TDP 3,7 65.0 W
Max Power 18 79.6 W
VID_VDD Min 9 0.9125 V
VID_VDD Max 9 1.1875 V
IDD TDC 55.3 A
CPU COF 6 2100 MHz
TDP 3,7 59.6 W
Max Power 18 70.1 W
VID_VDD Min 9 0.8875 V
VID_VDD Max 9 1.1625 V
IDD TDC 48.3 A
CPU COF 6 1600 MHz
TDP 3,7 50.9 W
Max Power 18 56.8 W
VID_VDD Min 9 0.8375 V
VID_VDD Max 9 1.1000 V
IDD TDC 37.1 A
CPU COF 6 1200 MHz
TDP 3,7 44.9 W
Max Power 18 49.7 W
VID_VDD Min 9 0.8000 V
VID_VDD Max 9 1.0625 V
IDD TDC 29.3 A
CPU COF 6 800 MHz
TDP 3,7 40.8 W
Max Power 18 44.7 W
VID_VDD Min 9 0.7875 V
VID_VDD Max 9 0.8250 V
IDD TDC 23.1 A
IDD Max (Pre-Flush) 3,10,17 10.1 A
IDD Max (Post-Flush) 3,10,17 7.5 A
TDP 19 8.1 W
I/O Power 4.2 W
S0 I/O Power 21 11.2 W
S3 I/O Power 20 200 mW
S0.C1e.Pmin
S0.C1.Pmin
S0.C0.P2
S0.C0.P3
S0.C0.P4
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
79AMD Opteron™ Processor
2.3.33 OS mmmm HJ pnc GO (35 W Server, C32) Thermal and Power Specifications
The notes for this table are on page 80.
State Specifica tion8Notes OS4164HJU6DGO OS4162HJU6DGO
Tcase Max 1 55
o
C to 65
o
C55
o
C to 65
o
C
Tctl Max 2 70
o
C70
o
C
Tambient M in 5
o
C5
o
C
Thermal Profile Z Z
Startup P-State 5 S0.C0.P4 S0.C0.P4
HTC P-State 4 S0.C0.P4 S0.C0.P4
NB COF 6,15 1800 MHz 1800 MHz
VID_VDDNB Min 15 0.9750 V 0.9750 V
VID_VDDNB Max 15 1.1250 V 1.1250 V
IDDNB Max 12 10.2 A 10.5 A
CPU COF 6 1800 MHz 1700 MHz
TDP 3,7 35.0 W 35.0 W
Max Power 18 43.0 W 43.0 W
VID_VDD Min 9 0.7625 V 0.7625 V
VID_VDD Max 9 0.9625 V 0.9625 V
IDD TDC 34.8 A 33.8 A
CPU COF 6 1600 MHz 1500 MHz
TDP 3,7 33.0 W 33.0 W
Max Power 18 39.6 W 39.5 W
VID_VDD Min 9 0.7500 V 0.7500 V
VID_VDD Max 9 0.9500 V 0.9500 V
IDD TDC 31.0 A 30.0 A
CPU COF 6 1400 MHz 1300 MHz
TDP 3,7 31.4 W 31.3 W
Max Power 18 37.2 W 36.8 W
VID_VDD Min 9 0.7375 V 0.7375 V
VID_VDD Max 9 0.9250 V 0.9250 V
IDD TDC 27.9 A 26.8 A
CPU COF 6 1100 MHz 1100 MHz
TDP 3,7 29.0 W 29.6 W
Max Power 18 33.4 W 34.1 W
VID_VDD Min 9 0.7375 V 0.7375 V
VID_VDD Max 9 0.9125 V 0.9125 V
IDD TDC 23.1 A 23.4 A
CPU COF 6 800 MHz 800 MHz
TDP 3,7 26.5 W 27.1 W
Max Power 18 30.1 W 30.7 W
VID_VDD Min 9 0.7250 V 0.7250 V
VID_VDD Max 9 0.8250 V 0.8250 V
IDD TDC 18.7 A 18.9 A
IDD Max (Pre-Flush) 3,10,17 7.7 A 8.1 A
IDD Max (Post-Flush) 3,10,17 5.4 A 5.7 A
TDP 19 4.9 W 5.2 W
I/O Power 4.2 W 4.2 W
S0 I/O Power 21 7.9 W 7.9 W
S3 I/O Power 20 200 mW 200 mW
S0.C0.Px
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C1e.Pmin
S0.C0.P2
S0.C0.P3
S0.C0.P4
S0.C1.Pmin
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
80AMD Opteron™ Processor
AMD Opteron™ Processor Thermal and Power Specification Table Notes:
1. Tcase Max is the maximum case temperature specification, which is a physical value in degrees
Celsius. Tcase Max can be any valid Tcase Max value in the range specified for the corresponding
OPN.
2. Tctl Max (maximum control temperature) is a non-physical temperature on an arbitrary scale that
can be used for system thermal management policies. Refer to the BIOS and Kernel Developer’s
Guide (BKDG) For AMD Family 10h Processors, order #31116.
3. TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and VDD at
the voltage requested by the processor. TDP includes all power dissipated on-die from VDD,
VDDNB, VDDIO, VLDT, VTT and VDDA.
4. P-State limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 10h Processors, order# 31116 for more information.
5. Hardware transitions the part to Startup P-State at cold boot. During initialization, the startup NB
COF and VID_VDDNB values may differ from those of the startup P-State. Please see the BIOS
and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for detailed
power sequencing information.
6. Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
7. The processor thermal solution should be designed to accommodate thermal design power (TDP) at
Tcase,max.TDP is not the maximum power of the processor.
8. Specifications for multi-core processors assume equivalent P-States (voltage and frequency) and
equivalent Tcase conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG)
for AMD Family 10h Processors, order# 31116, for details on P-State operation for multi-core
processors.
9. Variable voltage, any valid voltage between VDD min and VDD max is allowed.
10. TDP IDD conditions: single plane platforms supply IDD and IDDNB tied together and use the IDD
Max specification.
11. Single-plane platforms have VID_VDD and VID_VDDNB tied together, and use the VID_VDD
specification.
12. TDP IDDNB conditions: single-plane platforms supply IDD and IDDNB tied together and use the
IDD Max specification.
13. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. Assumes
VDDIO = 1.8 V and VTT = VDDIO / 2.
14. Refer to erratum 308 in the Revision Guide for AMD Family 10h Processors, Order# 41322 for the
appropriate clock divisor setting.
15. During initialization, the startup NB COF and VID_VDDNB values may differ from those of the
startup P-State. See the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h
Processors, order# 31116, for specific power sequencing information.
16. This product is intended for dual-plane platforms only.
17. IDDMax (Pre-Flush) and (Post-Flush) refer to the Cache Flush On Halt feature described in the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116.
IDDMax pre-flush and post-flush values are based on the recommended BKDG settings. Actual C1
idle current varies with system usage according to the following equation:
C1 idle current = F3xDC[CashFlushOnHaltTmr]/OS timer tick interval * Idd Max (Pre-Flush) +
(1 - F3xDC[CachFlushOnHaltTmr]/OS timer tick interval * Idd Max (Post-Flush))
The default Microsoft ® W indows Vista ® timer tick interval is 15.6 ms. This interval varies between
operating systems and within an operating system depending on usage.
18. Maximum Sustained Power dissipated by the processor at nominal voltage and maximum specified
case or die temperature.
19. Assumes 35oC, min P-State VID_VDD, core clock divider set to StpClk and NB clock divider set
to 16.Power saving comes from asserting LDTSTOP to place HyperTransport TM phys into LS2.
Recommended settings are in the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h
Processors, order# 31116.
20. Thermal Design Power dissipated by the processor (VDDIO power plane only). Assume VDDIO =
1.5 V
21. Thermal Design Power dissipated by the processor VDDIO, VDDR, VLDT and VDDA power planes.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
81Power Supply Specifications
3 Power Supply Specifications
For socket infrastructures not covered by this document refer to the AMD Infrastructure Roadmap,
order# 41842.
3.1 bsmmmmrr L ncdd – Fr2 (1207) Power Supply Operating Conditions
Table 10. bsmmmmrr L ncdd DC Operating Conditions for VDD Power Supply
Table 11. bsmmmmrr L ncdd AC Operating Conditions for VDD Power Supply
Symbol Parameter Units Min Typ Max Notes
VID_ VDD VID-Requested VDD
Supply Level V
VDD_ d c DC Tolerance - VDD
Supply Voltage VVID_ VDD
–50 mV VID_ VDD VID_ VDD
+ 50 mV
VDD_PON Metal Mas k VID_VDD V 0.95 1.00 MaxVID_VDD 1,2
VDDNB_ d c VDDNB Su p p ly v o lt a g e V VID_ VDDNB
–
50 mV
VID_VDDNB VID_VDDNB
+ 50 mV
VID_VDDNB VDDNB Supply voltage V
VDDNB_PON Metal Mask VDDNB V 0.95 1.00 1.30 2
Notes:
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-
specific parameter.
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-
specific parameter.
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during
device manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Symbol Parameter Units Min Typ Max Notes
VDD_ a c VDD Su p p ly Vo lt a g e V VID_ VDD
–100 mV VID_ VDD VID_ VDD +
100 mV 1
VDDNB_ a c VDDNB Su p p ly Vo lt a g e V VID_ VDDNB
–100 mV VID_ VDDNB VID_ VDDNB
+ 100 mV 1
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all
times. Transients above dc max must return to within the DC specification within 15 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in
Figure 3 on page 82.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
82Power Supply Specifications
Table 12. bsmmmmrr L ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Figure 3. Socket Fr2 (1207) AC and DC Transient Limits
S ymbol Par ameter Uni ts Max
VDDIO VDDIO Su p p ly Vo lt a g e
for DDR2 electricals V2.05
VDDIO VDDIO Su p p ly Vo lt a g e
for DDR3 electricals V1.65
VLDT VLDT Su p p ly Vo lt a g e V 1.32
VDDA VDDA Su p p ly Vo lt a g e V 2.70
VDD, VDDNB VDD, VDDNB Su p p ly
Vo lt a g e VMax AC
Vo lt ag e
15 μS
VID + 1
00
mV
VID
+
50 mV
VID
VID
–
50
mV
VID
–
1
00
mV
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
83Power Supply Specifications
Table 13. bsmmmmrr L ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol Parameter Units Min Typ Max Notes
VDDIO_ d c VDDIO Su p p ly Vo lt a g e
for DDR2 electricals V 1.70 1.80 1.90 1
VDDIO_ a c VDDIO Su p p ly v o lt a g e V VDDIO_ d c
–150 mV VDDIO_ d c VDDIO_ d c
+150 mV 2, 3
VLDT VLDT Supply Voltage V 1.14 1.20 1.26 10
VTT_dc VTT Supply Voltage for
DDR2 electricals V 0.85 0.90 0.95 4
VTT_ac VTT Supply Voltage V VTT_dc
–75mV VTT_dc VTT_dc +
75mV 2, 3
VDDA VDDA Supply Voltage V 2.40 2.50 2.60
IDDIO1 VDDIO Power Supply
Current A3.607, 9
ITT1 VTT Power Supply
Current A 1.75 6, 8, 9
ILDT VLDT Power Supply
Current mA 600/ link 5, 9
IDDA VDDA Power Supply
Current mA 250 9
Notes:
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop
must be carefully considered and compensated for. For example, if the inaccuracy and IR drop
amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid
measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_DC and stays within the specified maximum
and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully
considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage
violating the VDDIO_dc minimum spec of 1.70 V.
2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits
switching.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
10) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
regulator setting must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range
of 0.85 V and 0.95 V.
5) ILDT is specified for each unconnected HyperTransport™ link or for each 16x16 bit Gen1 HyperTransport link
operating at max 2.0 GT/s or less. Please refer to erratum 396.
6) VTT must both sink and source current.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
84Power Supply Specifications
3.2 bsmmmmrr P ncdd – Fr5 (1207) Power Supply Operating Conditions
Table 14. bsmmmmrr P ncdd DC Operating Conditions for VDD Power Supply
Table 15. bsmmmmrr P ncdd AC Operating Conditions for VDD Power Supply
Symbol Parameter Units Min Typ Max Notes
VID_ VDD VID-Requested VDD
Supply Level V
VDD_ d c DC Tolerance - VDD
Supply Voltage VVID_ VDD
–50 mV VID_ VDD VID_ VDD
+ 50 mV
VDD_PON Metal Mas k VID_VDD V 0.95 1.00 MaxVID_VDD 1,2
VDDNB_ d c VDDNB Su p p ly v o lt a g e V VID_ VDDNB
–
50 mV
VID_VDDNB VID_VDDNB
+ 50 mV
VID_VDDNB VDDNB Supply voltage V
VDDNB_PON Metal Mask VDDNB V 0.95 1.00 1.30 2
Notes:
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-
specific parameter.
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-
specific parameter.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during
device manufacturing.
Symbol Parameter Units Min Typ Max Notes
VDD_ a c VDD Su p p ly Vo lt a g e V VID_ VDD
–100 mV VID_ VDD VID_ VDD +
100 mV 1
VDDNB_ a c VDDNB Su p p ly Vo lt a g e V VID_ VDDNB
–100 mV VID_ VDDNB VID_ VDDNB
+ 100 mV 1
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all
times. Transients above dc max must return to within the DC specification within 15 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in
Figure 4 on page 85.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
85Power Supply Specifications
Table 16. bsmmmmrr P ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Figure 4. Socket Fr5 (1207) AC and DC Transient Limits
S ymbol Par ameter Uni ts Max
VDDIO VDDIO Su p p ly Vo lt a g e
for DDR2 electricals V2.05
VDDIO VDDIO Su p p ly Vo lt a g e
for DDR3 electricals V1.65
VLDT VLDT Su p p ly Vo lt a g e V 1.32
VDDA VDDA Su p p ly Vo lt a g e V 2.70
VDD, VDDNB VDD, VDDNB Su p p ly
Vo lt a g e VMax AC
Vo lt ag e
15 μS
VID + 1
00
mV
VID
+
50 mV
VID
VID
–
50
mV
VID
–
1
00
mV
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
86Power Supply Specifications
Table 17. bsmmmmrr P ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol Parameter Units Min Typ Max Notes
VDDIO_ d c VDDIO Su p p ly Vo lt a g e
for DDR2 electricals V 1.70 1.80 1.90 1
VDDIO_ a c VDDIO Su p p ly v o lt a g e V VDDIO_ d c
–150 mV VDDIO_ d c VDDIO_ d c
+150 mV 2, 3
VLDT VLDT Supply Voltage V 1.14 1.20 1.26 12
VTT_dc VTT Supply Voltage for
DDR2 electricals V 0.85 0.90 0.95 4
VTT_ac VTT Supply Voltage V VTT_dc
–75mV VTT_dc VTT_dc +
75mV 2, 3
VDDA VDDA Supply Voltage V 2.40 2.50 2.60
IDDIO1 VDDIO Power Supply
Current A3.607, 9
ITT1 VTT Power Supply
Current A 1.75 6, 8, 9
1.40/ link 5, 9
0.60/ link 9,10,11
IDDA VDDA Power Supply
Current mA 250 9
Notes:
switching.
A
considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage
violating the VDDIO_dc minimum spec of 1.70 V.
ILDT VLDT Power Supply
Current
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop
must be carefully considered and compensated for. For example, if the inaccuracy and IR drop
amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid
2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
6) VTT must both sink and source current.
5) ILDT is specified for each Gen3 16x16-bit HyperTransport™ link operating between 2.4GT/s and 4.8 GT/s.
measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_DC and stays within the specified maximum
and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully
of 0.85 V and 0.95 V.
regulator setting must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
10) ILDT is specified for each unconnected HyperTransport link or for each 16x16 bit Gen1 HyperTransport link
operating at max 2.0 GT/s or less.
11) The maximum value is listed as a per link value to allow for a mix of Gen1 and Gen3 links. All links must be
powered on a processor. Please refer to erratum 396.
12) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
87Power Supply Specifications
3.3 bsmmmmrr J ncdd – AM2r2 Power Supply Operating Conditions
Table 18. bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply
Table 19. bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply
Symbol Parameter Units Min Typ Max Notes
VID_ VDD VID-Requested VDD
Supply Level V
VDD_ d c DC Tolerance - VDD
Supply Voltage VVID_ VDD
– 50 mV VID_ VDD VID_ VDD
+ 50 mV
VDD_PON Metal Mask VID V 0.95 1.00 MaxVID_VDD 1,2
VDDNB_ d c VDDNB Su p p ly v o lt a g e V VID_ VDDNB
– 50 mV
VID_VDDNB VID_VDDNB
+ 50 mV
VID_VDDNB VDDNB Supply voltage V
VDDNB_PON Metal Mask VDDNB V 0.95 1.00 MaxVID_VDDNB 1,2
Notes:
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-specific
parameter.
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-specific
parameter.
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device
manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Symbol Parameter Units Min Typ Max Notes
VDD_ a c VDD Su p p ly Vo lt a g e V VID_ VDD –
140 mV VID_ VDD VID_VDD + 150
mV 1
VDDNB_ a c VDDNB Su p p ly Vo lt a g e V VID_ VDDNB
– 140 mV VID_ VDDNB VID_ VDDNB
+ 150 mV 1
Notes:
times. Transients above dc max must return to within the DC specification within 30 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all
Figure 5 on page 88.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
88Power Supply Specifications
Table 20. bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Figure 5. Socket AM2 AC and DC Transient Limits
S ymbol Par ameter Units Max
VDDIO VDDIO Su p p ly Vo lt a g e fo r
DDR2 electricals V2.05
VDDIO VDDIO Su p p ly Vo lt a g e fo r
DDR3 electricals V1.65
VLDT VLDT Su p p ly Vo lt a g e V 1.32
VDDA VDDA Su p p ly Vo lt a g e V 2.70
VDD, VDDNB VDD, VDDNB Su p p ly
Vo lt a g e VMax AC
Vo lt ag e
30 μs
VID
VID + 50 mV
VID + 150 mV
VID – 50 mV
VID
–
140 mV
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
89Power Supply Specifications
Table 21. bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol Parameter Units Min Typ Max Notes
VDDIO_ d c VDDIO Su p p ly Vo lt a g e fo r
DDR2 electricals V 1.70 1.80 1.90 1
VDDIO_ a c VDDIO Su p p ly v o lt a g e V VDDIO_dc –
150 mV VDDIO_ d c VDDIO_dc + 150
mV 2, 3
VLDT VLDT Supply Voltage V 1.14 1.20 1.26 10
VTT_dc VTT Supply Voltage for
DDR2 electricals V 0.85 0.90 0.95 4
VTT_ac VTT Supply Voltage V VTT_dc –
75mV VTT_dc VTT_dc + 75mV 2, 3
VDDA VDDA Supply Voltage V 2.40 2.50 2.60
IDDIO1 VDDIO Power Supply
Current A 3.60 7, 9
ITT1 VTT Power Supply Current A 1.75 6, 8, 9
ILDT VLDT Power Supply
Current mA 500/ link 5, 9
IDDA VDDA Power Supply
Current mA 250 9
Notes:
the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid violating the VDDIO_dc
minimum spec of 1.70 V.
2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all
data bus bits switching.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_dc and stays within the specified maximum and
of 0.85 V and 0.95 V.
6) VTT must both sink and source current.
5) ILDT is specified for each 16x16-bit HyperTransport™ link operating at 2.0 GT/s.
minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and
compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage regulator setting
must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
10) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
90Power Supply Specifications
3.4 bsmmmmrr K ncdd – AM3 Power Supply Operating Conditions
Table 22. bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply
Table 23. bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply
Symbol Parameter Units Min Typ Max Notes
VID_ VDD VID-Requested VDD
Supply Level V
VDD_ d c DC Tolerance - VDD
Supply Voltage VVID_ VDD
–50 mV VID_ VDD VID_ VDD
+ 50 mV
VDD_PON Metal Mask VID V 0.95 1.00 MaxVID_VDD 1,2
VDDNB_ d c VDDNB Su p p ly v o lt a g e V VID_ VDDNB
–50 mV
VID_VDDNB VID_VDDNB
+ 50 mV
VID_VDDNB VDDNB Supply voltage V
VDDNB_PON Metal Mask VDDNB V 0.95 1.00 MaxVID_VDD 1,2
Notes:
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during
device manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-
specific parameter.
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-
specific parameter.
S ymbol Par ameter Uni ts Mi n Typ Max Notes
VDD_ a c VDD Su p p ly Vo lt a g e V VID_ VDD
–140 mV VID_ VDD VID_ VDD +
150 mV 1
VDDNB_ a c VDDNB Su p p ly Vo lt a g e V VID_ VDDNB
–140 mV VID_ VDDNB VID_ VDDNB
+ 150 mV 1
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all.
times. Transients above dc max must return to within the DC specification within 30 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in
Figure 6 on page 91.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
91Power Supply Specifications
Table 24. bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Figure 6. Socket AM3 AC and DC Transient Limits
S ymbol Par ameter Uni ts Max
VDDIO VDDIO Su p p ly Vo lt a g e fo r
DDR2 electricals V2.05
VDDIO VDDIO Su p p ly Vo lt a g e fo r
DDR3 electricals V1.65
VLDT VLDT Su p p ly Vo lt a g e V 1.32
VDDA VDDA Su p p ly Vo lt a g e V 2.70
VDD, VDDNB VDD, VDDNB Su p p ly
Vo lt a g e VMax AC
Vo lt ag e
30 μs
VID
VID + 50 mV
VID + 150 mV
VID – 50 mV
VID
–
140 mV
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
92Power Supply Specifications
Table 25. bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol Parameter Units Min Typ Max Notes
VDDIO_ d c VDDIO Su p p ly Vo lt a g e fo r
DDR3 electricals V 1.375 1.500 1.625 1
VDDIO_ a c VDDIO Su p p ly v o lt a g e V VDDIO_dc –
125 mV VDDIO_ d c VDDIO_ d c +
125 mV 2, 3
VLDT VLDT Supply Voltage V 1.14 1.20 1.26 12
VDDR_ d c VDDR Su p p ly Vo lt a g e fo r
DDR3 electricals V 1.14 1.20 1.26 4
VDDR_ a c VDDR Su p p ly Vo lt a g e V VDDR_ d c
–60mV VDDR_ d c VDDR_ d c +
60mV 2, 3
VDDA VDDA Supply Voltage V 2.40 2.50 2.60
IDDIO1 VDDIO Power Supply
Current A3.607, 9
IDDR VDDR Power Supply
Current A 1.75 6, 8, 9
1.40/ link 5, 9
0.60/ link 9,10,11
IDDA VDDA Power Supply
Current mA 9
Notes:
limits. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated
ILDT VLDT Power Supply
Current A
12) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
9) This specification reflects the values published in the appropriate power roadmap document.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must
be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then
minimum spec of 1.375 V.
4) All voltages are referenced to VSS. Voltage regulator for VDDR must be set accordingly so that VDDR_dc level
measured at the processor with VDDR_SENSE pin stay within the specified maximum and minimum DC tolerance
the voltage regulator setting for VDDIO should not be lower than 1.475 V to avoid violating the VDDIO_dc
f
or to ensure the VDDR stays within the specified DC tolerance limits.
2) VDDIO_ac and VDDR_ac parameters are measured over 60 seconds time frame with all data bus bits switching.
11) Please refer to erratum 396.
5) ILDT is specified for one 16x16-bit Gen3 link.
6) VDDR must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VDDR current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
10) ILDT is specified for one 16x16-bit HyperTransport™ link operating at 2.0 GT/s.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
93Power Supply Specifications
3.5 bsmmmmrr S ncdd – Fr6 (1207) Power Supply Operating Conditions
Table 26. bsmmmmrr S ncdd DC Operating Conditions for VDD Power Supply
Table 27. bsmmmmrr S ncdd AC Operating Conditions for VDD Power Supply
Symbol Parameter Units Min Typ Max Notes
VID_ VDD VID-Requested VDD
Supply Level V
VDD_ d c DC Tolerance - VDD
Supply Voltage VVID_ VDD
–50 mV VID_ VDD VID_ VDD
+ 50 mV
VDD_PON Metal Mas k VID_VDD V 0.95 1.00 MaxVID_VDD 1,2
VDDNB_ d c VDDNB Su p p ly v o lt a g e V VID_ VDDNB
–
50 mV
VID_VDDNB VID_VDDNB
+ 50 mV
VID_VDDNB VDDNB Supply voltage V
VDDNB_PON Metal Mask VDDNB V 0.95 1.00 1.30 2
Notes:
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-
specific parameter.
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-
specific parameter.
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during
device manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Symbol Parameter Units Min Typ Max Notes
VDD_ a c VDD Su p p ly Vo lt a g e V VID_ VDD
–100 mV VID_ VDD VID_ VDD +
100 mV 1
VDDNB_ a c VDDNB Su p p ly Vo lt a g e V VID_ VDDNB
–100 mV VID_ VDDNB VID_ VDDNB
+ 100 mV 1
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all
times. Transients above dc max must return to within the DC specification within 15 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in
Figure 7 on page 94.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
94Power Supply Specifications
Table 28. bsmmmmrr S ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Figure 7. Socket Fr6 (1207) AC and DC Transient Limits
S ymbol Par ameter Uni ts Max
VDDIO VDDIO Su p p ly Vo lt a g e
for DDR2 electricals V2.05
VDDIO VDDIO Su p p ly Vo lt a g e
for DDR3 electricals V1.65
VLDT VLDT Su p p ly Vo lt a g e V 1.32
VDDA VDDA Su p p ly Vo lt a g e V 2.70
VDD, VDDNB VDD, VDDNB Su p p ly
Vo lt a g e VMax AC
Vo lt ag e
15 μS
VID + 1
00
mV
VID +
50
mV
VID
VID
–
50 mV
VID
–
1
00
mV
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
95Power Supply Specifications
Table 29. bsmmmmrr S ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol Parameter Units Min Typ Max Notes
VDDIO_ d c VDDIO Su p p ly Vo lt a g e
for DDR2 electricals V 1.70 1.80 1.90 1
VDDIO_ a c VDDIO Su p p ly v o lt a g e V VDDIO_ d c
–150 mV VDDIO_ d c VDDIO_ d c
+150 mV 2, 3
VLDT VLDT Supply Voltage V 1.14 1.20 1.26 12
VTT_dc VTT Supply Voltage for
DDR2 electricals V 0.85 0.90 0.95 4
VTT_ac VTT Supply Voltage V VTT_dc
–75mV VTT_dc VTT_dc +
75mV 2, 3
VDDA VDDA Supply Voltage V 2.40 2.50 2.60
IDDIO1 VDDIO Power Supply
Current A3.607, 9
ITT1 VTT Power Supply
Current A 1.75 6, 8, 9
1.50/ link 5, 9,11
0.60/ link 9,10,11
IDDA VDDA Power Supply
Current mA 250 9
Notes:
amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid
violating the VDDIO_dc minimum spec of 1.70 V.
A
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
ILDT VLDT Power Supply
Current
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop
of 0.85 V and 0.95 V.
5) ILDT is specified for each Gen3 16x16-bit HyperTransport™ link operating between 2.4 GT/s and 4.8 GT/s.
6) VTT must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
10) ILDT is specified for each unconnected HyperTransport link or for each 16x16-bit Gen1 HyperTransport link
operating at max 2.0 GT/s or less.
11) The maximum value is listed as a per link value to allow for a mix of Gen1 and Gen3 links. All links must be
powered on a processor. Please refer to errata 396-397.
12) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
must be carefully considered and compensated for. For example, if the inaccuracy and IR drop
considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage
regulator setting must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range
9) This specification reflects the values published in the appropriate power roadmap document.
2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits
switching.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_DC and stays within the specified maximum
and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
96Power Limit Encoding
4 Power Limit Encoding
IddValue and IddDiv are available for each P-state in P-state registers MSRC001_00[68:64]. For
more details, refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h
Processors, order# 31116.
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
97MTOPS
5MTOPS
Table 30 shows Composite Theoretical Performance (CTP) calculations. The calculations are stated
in Millions of Theoretical Operations per Second (MTOPS) and are based upon a formula in the
United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory
Note 4 for Category 4).
All calculations contained herein are subject to change without notice. AMD makes no representation
or warranty as to the accuracy or reliability of such calculations.
THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES
WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY
PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD
PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.
Furthermore, AMD shall have no liability for any losses or damages including direct, indirect,
special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or
other economic loss occurring in connection with use of the calculations, even if AMD has been
advised in advance of the possibility of such damages. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted herein.
Table 30. Composite Theoretical Performance (CTP) Calculation
1600 8,667 16,267 23,867 31,467 46,667 61,867 92,267
1700 9,209 17,284 25,359 33,434 49,584 65,734 98,034
1800 9,750 18,300 26,850 35,400 52,500 69,600 103,800
1900 10,292 19,317 28,342 37,367 55,417 73,467 109,567
2000 10,834 20,334 29,834 39,334 58,334 77,334 115,334
2100 11,375 21,350 31,325 41,300 61,250 81,200 121,100
2200 11,917 22,367 32,817 43,267 64,167 85,067 126,867
2300 12,459 23,384 34,309 45,234 67,084 88,934 132,634
2400 13,000 24,400 35,800 47,200 70,000 92,800 138,400
2500 13,542 25,417 37,292 49,167 72,917 96,667 144,167
2600 14,084 26,434 38,784 51,134 75,834 100,534 149,934
2700 14,625 27,450 40,275 53,100 78,750 104,400 155,700
2800 15,167 28,467 41,767 55,067 81,667 108,267 161,467
2900 15,709 29,484 43,259 57,034 84,584 112,134 167,234
3000 16,250 30,500 44,750 59,000 87,500 116,000 173,000
3100 16,792 31,517 46,242 60,967 90,417 119,867 178,767
3200 17,334 32,534 47,734 62,934 93,334 123,734 184,534
3300 17,875 33,550 49,225 64,900 96,250 127,600 190,300
3400 18,417 34,567 50,717 66,867 99,167 131,467 196,067
MTOPS
Six-Core
MTOPS
Eight-Core
MTOPS
Twelve-Core
MTOPS
Single-Core
Frequency MTO PS
Dual-Core
MTOPS
Triple-Core
MTOPS
Quad-Core
PID: 43374 Rev 3.19 - June 2010 AMD Family 10h Server and Workstation Processor
Power and Thermal Data Sheet
98APP
6APP
Table 31 shows the Adjusted Peak Performance (APP) calculations for the
AMD Opteron™ processor. The calculations are stated in millions of Weighted Teraflops (WT) and
are based upon a formula in the United States Department of Commerce Export Administration
Regulations 15 CFR 774 (Advisory Note 4 for Category 4).
All calculations contained herein are subject to change without notice. AMD makes no representation
or warranty as to the accuracy or reliability of such calculations.
THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES
WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY
PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD
PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.
Furthermore, AMD shall have no liability for any losses or damages including direct, indirect,
special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or
other economic loss occurring in connection with use of the Calculations, even if AMD has been
advised in advance of the possibility of such damages. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted herein.
Table 31. Adjusted Peak Performance (APP) Calculation
1600 0.0019 0.0038 0.0058 0.0077 0.0115 0.0154 0.0230
1700 0.0020 0.0041 0.0061 0.0082 0.0122 0.0163 0.0245
1800 0.0022 0.0043 0.0065 0.0086 0.0130 0.0173 0.0259
1900 0.0023 0.0046 0.0068 0.0091 0.0137 0.0182 0.0274
2000 0.0024 0.0048 0.0072 0.0096 0.0144 0.0192 0.0288
2100 0.0025 0.0050 0.0076 0.0101 0.0151 0.0202 0.0302
2200 0.0026 0.0053 0.0079 0.0106 0.0158 0.0211 0.0317
2300 0.0028 0.0055 0.0083 0.0110 0.0166 0.0221 0.0331
2400 0.0029 0.0058 0.0086 0.0115 0.0173 0.0230 0.0346
2500 0.0030 0.0060 0.0090 0.0120 0.0180 0.0240 0.0360
2600 0.0031 0.0062 0.0094 0.0125 0.0187 0.0250 0.0374
2700 0.0032 0.0065 0.0097 0.0130 0.0194 0.0259 0.0389
2800 0.0034 0.0067 0.0101 0.0134 0.0202 0.0269 0.0403
2900 0.0035 0.0070 0.0104 0.0139 0.0209 0.0278 0.0418
3000 0.0036 0.0072 0.0108 0.0144 0.0216 0.0288 0.0432
3100 0.0037 0.0074 0.0112 0.0149 0.0223 0.0298 0.0446
3200 0.0038 0.0077 0.0115 0.0154 0.0230 0.0307 0.0461
3300 0.0040 0.0079 0.0119 0.0158 0.0238 0.0317 0.0475
3400 0.0041 0.0082 0.0122 0.0163 0.0245 0.0326 0.0490
Frequency APP
Ei g h t -C o re
APP
Twelve-Core
APP
Single-Core
APP
Six-Core
APP
Dual-Core
APP
Triple-Core
APP
Quad-Core