Datasheet AC/DC Drivers PWM type DC/DC converter IC Included 650V MOSFET BM2P039 General The PWM type DC/DC converter BM2P039 for AC/DC provides an optimum system for all products that include an electrical outlet. BM2P039 supports both isolated and non-isolated devices, enabling simpler design of various types of low-power electrical converters. BM2P039 built in a HV starter circuit that tolerates 650V, it contributes to low-power consumption. With current detection resistors as external devices, a higher degree of design freedom is achieved. Switching frequency adopts fixed system. Since current mode control is utilized, current is restricted in each cycle and excellent performance is demonstrated in bandwidth and transient response. The switching frequency is 100 kHz. At light load, the switching frequency is reduced and high efficiency is achieved. A frequency hopping function is also on chip, which contributes to low EMI. Features PWM frequency : 100kHz PWM current mode method Frequency hopping function Burst operation when load is light Frequency reduction function Built-in 650V start circuit Built-in 650V switching MOSFET VCC pin under voltage protection VCC pin overvoltage protection SOURCE pin Open protection SOURCE pin Short protection SOURCE pin Leading-Edge-Blanking function Per-cycle over current protection circuit Soft start Secondary Over current protection circuit BR pin AC input low voltage protection Package DIP7K: 9.20mmx6.35mmx4.30mm pitch 2.54mm (Typ) (Typ) (Typ) (Typ) Basic Specifications Operating Power Supply Voltage Range : VCC: 8.9V to 26.0V DRAIN: to 650V Operating Current : Normal Mode 1.000mA (Typ) Burst Mode 0.400mA (Typ) Oscillation Frequency : 100kHz (Typ) Operating Temperature : -40 oC to +105 oC MOSFET ON Resistance : 2.4 (Typ) Applications AC adapters, TV and household appliances (vacuum cleaners, humidifiers, air cleaners, air conditioners, IH cooking heaters, rice cookers, etc.) Application circuit + AC FUSE Filter 85 -265 Vac Diode Bridge - BR ERROR AMP Figure 1. Application circuit Product structure : Silicon monolithic integrated circuit .www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211114001 This product has no designed protection against radioactive rays 1/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.007 Datasheet BM2P039 Absolute Maximum Ratings (Ta=25C) Parameter Symbol Rating Unit Conditions Maximum applied voltage 1 Vmax1 -0.3 to 30 V VCC Maximum applied voltage 2 Vmax2 -0.3 to 6.5 V SOURCE, FB, BR Maximum applied voltage 3 Vmax3 650 V DRAIN Drain current pulse IDP 5.20 A PW=10usec, Duty cycle=1% Allowable dissipation Pd 2.00 W Topr -40 to +105 oC Tjmax 150 oC Tstr -55 to +150 Operating temperature range Maximum junction temperature Storage temperature range oC (Note) DIP7 : When mounted (on 74.2 mm x 74.2 mm,x1.6 mm thick, glass epoxy on double-layer substrate). Reduce to 16 mW/C when Ta = 25C or above. Operating Conditions (Ta=25C) Parameter Symbol Rating Unit Conditions Power supply voltage range 1 VCC 8.9 to 26.0 V VCC pin voltage Power supply voltage range 2 VDRAIN to 650 V DRAIN pin voltage Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta=25C, VCC=15V) Parameter Symbol Specifications Minimum Standard Maximum Unit Conditions [MOSFET Block ] Between drain and source voltage Drain leak current V(BR)DDS 650 - - V ID=1mA / VGS=0V IDSS - - 100 A VDS=650V / VGS=0V On resistance RDS(ON) - 2.4 3.6 Avalanche Energy EAS 400 ID=0.25A / VGS=10V J Design assurance Avalanche Energy circuit EAS IAS V(BR)DSS VGS VDS VDD L RG : Avalanche Energy : Avalanche Current : Drain - Source breakdown voltage : Gate - Source voltage : Drain - Source voltage : Power supply voltage : Coil : Gate resistance www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 Electrical Characteristics (Unless otherwise noted, Ta=25C, VCC=15V) Parameter [ Circuit current ] Circuit current (ON) 1 Circuit current (ON) 2 [ VCC protection function ] VCC UVLO voltage 1 VCC UVLO voltage 2 VCC UVLO hysteresis VCC OVP voltage 1 VCC OVP voltage 2 Latch released VCC voltage VCC recharge start voltage VCC recharge stop voltage Latch mask time Thermal shut down temperature [ PWM type DCDC driver block ] Oscillation frequency 1 Oscillation frequency 2 Frequency hopping width 1 Hopping fluctuation frequency Minimum pulse width Soft start time 1 Soft start time 2 Soft start time 3 Soft start time 4 Maximum duty FB pin pull-up resistance FB / CS gain FB burst voltage FB voltage of starting frequency reduction mode FB OLP voltage 1a FB OLP voltage 1b FB OLP ON timer FB OLP Start up timer FB OLP OFF timer [ Over current detection block ] Overcurrent detection voltage Overcurrent detection voltage SS1 Overcurrent detection voltage SS2 Overcurrent detection voltage SS3 Overcurrent detection voltage SS4 Leading Edge Blanking Time Over current detection AC voltage compensation factor SOURCE pin short protection voltage [ Start circuit block ] Start current 1 Start current 2 OFF current Start current switching voltage [BR pin function] BR UVLO detection voltage1 BR UVLO detection voltage 2 BR UVLO hysteresis BR UVLO detection delay time1 BR UVLO detection delay time2 www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Symbol Specifications Unit Conditions 1350 500 A A FB=2.0V (at pulse operation) FB=0.0V (at burst operation) V V V V V V V V s C VCC rises VCC falls VUVLO3 = VUVLO1 - VUVLO2 VCC rises VCC falls 8.70 13.00 100 145 14.50 8.90 29.0 9.70 14.00 150 172 90 20 75 0.30 0.60 1.20 4.80 68.0 23 0.300 100 25 6.0 125 650 0.50 1.00 2.00 8.00 75.0 30 4.00 0.400 110 30 175 1000 0.70 1.40 2.80 11.20 82.0 37 0.500 kHz kHz kHz Hz ns ms ms ms ms % k V/V V FB=2.0V FB=0.4V FB=2.0V VDLT 1.100 1.250 1.400 V VFOLP1A VFOLP1B TFOLP1 TFOLP1 TFOLP2 2.60 40 26 358 2.80 2.60 64 32 512 3.00 88 38 666 V V ms ms ms Overload is detected (FB rise) Overload is detected (FB drop) VCS VCS_SS1 VCS_SS2 VCS_SS3 VCS_SS4 TLEB 0.380 - 0.400 0.100 0.150 0.200 0.300 250 0.420 - V V V V V ns Ton=0us 0 [ms] to TSS1 [ms] TSS1 [ms] to TSS2 [ms] TSS2 [ms] to TSS3 [ms] TSS3 [ms] to TSS4 [ms] KCS 12 20 28 mV/s VCSSHT 0.020 0.050 0.080 V ISTART1 ISTART2 0.100 1.000 0.500 2.500 1.000 4.600 mA mA ISTART3 - 10 20 uA VSC 0.800 1.500 2.100 V VBR1 VBR2 VBR3 TBR1 TBR2 0.45 0.29 50 150 0.50 0.35 0.15 100 256 0.55 0.41 150 350 V V V s ms Minimum Standard Maximum ION1 ION2 650 - 1000 400 VUVLO1 VUVLO2 VUVLO3 VOVP1 VOVP2 VLATCH VCHG1 VCHG2 TLATCH TSD 12.50 7.50 26.0 7.70 12.00 50 118 13.50 8.20 5.30 27.5 23.5 FSW1 FSW2 FDEL1 FCH Tmin TSS1 TSS2 TSS3 TSS4 Dmax RFB Gain VBST VUVLO2-0.5 3/18 FB falls VCC=0V VCC=10V Input current of DRAIN pin, when VCC UVLO released. (MOSFET OFF) BR rises BR falls VBR3 = VBR1 - VBR2 BR rises BR falls TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 PIN DESCRIPTIONS Table 1. Pin Description NO. Pin Name I/O 1 SOURCE I/O 2 BR I 3 GND I/O Function ESD Diode VCC GND MOSFET SOURCE pin Input AC voltage monitor pin - GND pin - 4 FB I Feedback signal input pin - 5 VCC I Power supply input pin - 6 DRAIN I/O MOSFET DRAIN pin - - 7 DRAIN I/O MOSFET DRAIN pin - - I/O Equivalent Circuit Diagram Figure 2. I/O Equivalent Circuit Diagram www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 Block Diagram Figure 3. Block Diagram www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 Description of Blocks ( 1 ) Start circuit (DRIAN: 6,7pin) This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting. After starting, consumption power is idling current ISTART3 (Typ=10A) only. Reference values of Starting time are shown in Figure 6. When Cvcc=10F it can start less than 0.1 sec. Figure 4. Block diagram of start circuit ISTART2 ISTART1 ISTART3 0 Vsc 10V V UVLO1 VCC Voltage[V] Figure 5. Start current vs VCC voltage Figure 6. Start time (reference value) * Start current flows from the DRAIN pin ex) Consumption power of start circuit only when the Vac=100V PVH100V*2*10uA=1.41mW ex) Consumption power of start circuit only when the Vac=240V PVH240V*2*10uA=3.38mW www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 ( 2 ) Start sequences (Soft start operation, light load operation, and auto recovery operation during overload protection) Start sequences are shown in Figure 7. See the sections below for detailed descriptions. VH VCC=13.5V VCC(1pin) VCC=8.2V Internal REF Pull Up Within 32ms FB OLP ON 64ms FB(8pin) Vout Over Load Normal Load Light LOAD Iout Burst mode Switching stop Switing Soft Start A BC E D F GH I Figure 7. Start sequences Timing Chart A: Input voltage VH is applied. B: This IC starts operation when VCC pin voltage rises and VCC > VUVLO1 (Typ=13.5V). Switching function starts when other protection functions are judged as normal. Then the VCC pin voltage drop because of consumption current of VCC pin. In the case of VCC < VCHG1 (Typ=8.7V), the VCC recharge circuit operates. C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current. D: When the switching operation starts, and VOUT rises. When the output voltage becomes to stable state, VCC voltage also becomes to stable state through auxiliary winding. Please set the rated voltage within the TFOLP1b period (32msec typ) from VCC voltage > VUVLO1. E: During a light load, if it reaches FB voltage < VBST (Typ=0.4V), the IC starts burst operation to keep power consumption low. During burst operation, it becomes low-power consumption mode. F: When the FB Voltage > VFOLP1A (Typ=2.8V), it becomes a overload operation. G: When FB pin voltage keeps VFOLP1A (Typ=2.8V) at or above TFOLP (Typ=64msec), the overload protection function is triggered and switching stops 64msec later. If the FB pin voltage becomes FB < VFOLP1B even once, the IC's FB OLP timer is reset. H: If the VCC voltage drops to VCC < VUVLO2 (Typ=7.7V) or below, restart is executed. I: The IC's circuit current is reduced and the VCC pin value rises. (Same as B) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 ( 3 ) VCC pin protection function BM2P039 built in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), over voltage protection function VCC OVP (Over Voltage Protection) and VCC charge function that operates in case of dropping the VCC voltage. VCC UVLO and VCC OVP monitor VCC pin and prevent VCC pin from destroying switching MOSFET at abnormal voltage. VCC charge function stabilizes the secondary output voltage by charging from the high voltage line by start circuit at dropping the VCC voltage. ( 3-1 ) VCC UVLO VCC OVP function VCC UVLO and VCC OVP are auto recovery protections. And they have voltage hysteresis. Refer to the operation Figure 8. Switching is stopped by the VCCOVP function when VCC pin voltage > Vovp1 (Typ=27.5V), and switching is restart when VCC pin voltage < Vovp2 (Typ=23.5V) Figure 8. VCC UVLO / OVP Timing Chart A: When voltage is applied to the DRAIN pin, VCC pin voltage starts rising. B: When the VCC pin is more than VUVLO, the VCC UVLO function is released and DC/DC operation starts C: When the VCC pin is less than VCHG1, VCC charge function operates and the VCC voltage rises. D: When the VCC pin is more than VCHG2, VCC charge function is stopped. E: The condition the VCC pin is more than VOVP1 continues for TLATCH (Typ=100usec), the switching operation is stopped by the VCCOVP function. F: When the VCC pin less than VOVP2, the switching operation restarts. G: The high voltage line VH drops. H: Same as C. I: Same as D. J: When the VCC pin is less than VUVLO2, the switching operation is stopped by the VCC UVLO function. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 ( 3-2 ) VCC Charge function If the VCC pin drops to VCHC1 after once the VCC pin becomes more than VUVLO1 and the IC starts to operate, the VCC charge function operates. At that time, the VCC pin is charged from DRAIN pin through start circuit. By this operation, BM2P039 doesn't occur to start failure. When the VCC pin voltage raises to VCHG2 or above, charge is stopped. The operations are shown in Figure 9. VH VUVLO1 VCHG2 VCC VCHG1 VUVLO2 Switching VH charge charge charge charge charge OUTPUT voltage A B C D E F G H Figure 9. Charge operation VCC pin charge operation A: DRAIN pin voltage raises and the VCC pin starts to be charged by the VCC charge function. B: When the VCC pin is more than VUVLO1, the VCC UVLO function releases and VCC charge function stops. Then the DC/DC operation starts. C: When DC/DC operation starts, the VCC voltage drops because the output voltage is low. D: When the VCC pin is less than VCHG1, the VCC recharge function operates and VCC pin voltage rises. E: When the VCC pin is more than VCHG2, VCC recharge function stops. F: When the VCC pin is less than VCHG1, VCC recharge function operates and VCC pin voltage rises. G: When the VCC pin is more than VCHG2, VCC recharge function stops. H: After starting of the output voltage finished, VCC is charged by the auxiliary winding and VCC pin stabilizes. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 ( 4 ) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst) BM2P039 performs current mode PWM control. An internal oscillator sets a fixed switching frequency (100 kHz Typ). BM2P039 is integrated switching frequency hopping function which changes the switching frequency to fluctuate as shown in Figure 10 below. The fluctuation cycle is 125 Hz typ. Switching Frequency [kHz] 500us 106.0 104.5 103.0 101.5 100.0 98.5 97.0 95.5 94.0 125 Hz(8ms) Time Figure 10. Frequency hopping function Max duty cycle is fixed as 75% (Typ) and MIN pulse width is fixed as 650 nsec (Typ). With current mode control, when the duty cycle exceeds 50%, sub harmonic oscillation may occur. As a countermeasure to this, BM2P039 is built in slope compensation circuits. BM2P039 is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption. FB pin is pulled up by RFB (30k Typ).FB pin voltage is changed by secondary output voltage (secondary load power). FB pin is monitored, burst mode operation and frequency detection start. Figure 11 shows the FB voltage, and switching frequency, DCDC operation. mode1 : Burst operation mode2 : Frequency reduction operation mode3 : Fixed frequency operation (operate at the max frequency) mode4 : Over load operation (detect the over load state and stop the pulse operation) Switching Y Frequency [kHz] mode1 mode2 mode3 mode4 100kHz 25kHz 0.40V 1.25V 2.00V 2.80V FB [V] X Figure 11. Switching operation state changes by FB pin voltage www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 ( 5 ) Over current limiter BM2P039 is built in over current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching is stopped. It is also built in AC voltage compensation function. This is the function which compensates the maximum power as the AC voltage's change by increasing over current limiter with time. Shown in Figure 12, 13 and14. Figure 12. No AC voltage compensation function Figure 13. Built-in AC compensation voltage Primary peak current is decided as the formula below. Primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay Vcs: Over current limiter voltage internal IC, Rs: Current detection resistance, Vdc: Input DC voltage, Lp: Primary inductance, Tdelay: delay time after detection of over current limiter Figure 14. Over current limiter voltage ( 6 ) L.E.B. period When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current. Therefore, because SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter circuit. To prevent this detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250nsec by the on-chip L.E.B. (Leading Edge Blanking) function. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 ( 7 ) SOURCE pin short protection function When the SOURCE pin is shorted, BM2P039 is over heat. BM2P039 built in short protection function to prevent destroying. ( 8 ) SOURCE pin open protection If the SOURCE pin becomes OPEN, BM2P039 may be damaged. To prevent to be damaged, BM2P039 built in OPEN protection circuit (auto recovery protection). ( 9 ) Output over load protection function (FB OLP Comparator) The output overload protection function monitors the secondary output load status at the FB pin, and stops switching when an overload occurs. In case of overload, the output voltage is reduced and current no longer flows to the photo coupler, so the FB pin voltage rises. When the status that FB pin voltage is more than VFOLP1A (Typ=2.8V) continues for the period TFOLP1 (Typ=64msec), it is judged as an overload and stops switching. When the FB pin > VFOLP1A (Typ=2.8V), if the voltage goes lower than VFOLP1B (Typ=2.6V) during the period TFOLP1 (Typ=64msec), the overload protection timer is reset. The switching operation is performed during this period TFOLP1 (Typ=64msec). At startup, the FB voltage is pulled up to the IC's internal voltage, so operation starts at a voltage of VFOLP1A (Typ=2.8V) or above. Therefore, at startup the FB voltage must be set to go to VFOLP1B (Typ=2.6V) or below during the period TFOLP1 (Typ=64msec), and the secondary output voltage's start time must be set within the period TFOLP1 (Typ=64msec) following startup of the IC. Recovery from the once detection of FBOLP, after the period TFOLP2 (Typ=512msec). VFOLP 1 A FB VH charge charge charge 64ms 64ms Switching 512ms VUVLO 1 VCHG 2 VCC 512ms VCHG1 VUVLO 2 A B C D E F G H Figure 15. Over load protection (Auto recovery) A: The FBOLP comparator detects over load because the FB pin is more than VFOLP1A. B: If the State of A continues for the period TFOLP1 (Typ=64msec), switching is stopped after T FOLP1 (Typ=64msec) from FB OLP detection. C: While switching stops by the over load protection function, if the VCC pin voltage drops and VCC pin voltage reaches VCHG1 or above, the VCC charge function operates so the VCC pin voltage rises. D: VCC charge function stops when the VCC pin voltage becomes more than VCHG2. E: If TFOLP2 (Typ=512msec) go on from B point, the switching function starts on soft start. F: If TFOLP1b (Typ=64msec) go on from E point to continues an overload condition (FB > VFOLP1A), the switching function stops. G: While the switching stops, VCC pin voltage drops to VCHG1 or below. Then the VCC charge function operates and VCC pin voltage rises. H: If the VCC pin voltage becomes over VCHG2 by the VCC charge function, the VCC charge function operation stops. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 ( 10 ) Input voltage protection function This IC has BR-UVLO function to monitor input voltage. By monitoring input voltage, it can be prevented from breaking of IC. AC voltage and DC voltage can be monitored by BR pin. + + FUSE AC 85 -265 Vac Diode Bridge Filter FUSE AC 85 -265 Vac - Filter Diode Bridge - ERROR AMP BR BR RBR1 RBR1 RBR2 RBR2 Figure 16(a). AC voltage monitor setting ERROR AMP Figure 16(b). DC voltage monitor setting BR UVLO function can protect the breaking of IC when input voltage is low. Operation mode of protection circuit Operation mode of protection functions are shown in Table 2. Table 2. Operation mode of protection circuit Function Operation mode VCC Under Voltage Locked Out Auto recovery VCC Over Voltage Protection Auto recovery TSD Latch (with 100usec timer) FB Over Limited Protection Auto recovery (with 64msec timer) SOURCE Open Protection Auto recovery BR UVLO Auto recovery (with 256msec timer) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 Sequence The sequence diagram is show in Figure 17. In all condition, the operations transit OFF Mode If the VCC voltage becomes less than 8.2V. OFF MODE Soft Start1 Soft Start2 Soft Start3 BR UVLO (Pulse Stop) Soft Start4 SOURCE OPEN (Pulse Stop) FBOLP OFF TIMER (512ms) LATCH OFF MODE (Pulse Stop) Normal MODE PULSE OFF OLP MODE (Pulse Stop) Burst MODE & Low Power MODE *Pulse OFF VCC OVP (Pulse Stop) Figure 17. The sequence diagram Thermal loss The thermal design should set operation for the following conditions. (Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.) 1. The ambient temperature Ta must be 105 oC or less. 2. The IC's loss must be within the allowable dissipation Pd. The thermal abatement characteristics are as follows. (PCB: 74.2 mm x 74.2mm x 1.6 mm, mounted on glass epoxy double-layer substrate.) 3000 2500 Pd[m W ] 2000 1500 1000 500 0 0 25 50 75 100 125 150 Ta[] Figure 18. DIP7K Thermal Abatement Characteristics www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 Ordering Model Name Selection B M 2 P 0 3 9 - Z Product name Physical Dimension Tape and Reel Information DIP7K <Tape and Reel information> Container Tube Quantity 2000pcs Direction of feed Direction of products is fixed in a container tube Order quantity needs to be multiple of the minimum quantity. Making Diagram DIP7K 7 6 5 Part Number Marking LOT Number BM2P039 1 2 3 4 www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. 9. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 Operational Notes - continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 19. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the TSD threshold. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Datasheet BM2P039 date Rev. No. Revision Point 2015.10.14 001 2016.1.20 002 2016.4.5 003 2017.9.22 004 New Release P.3 Minimum pulse width, Standard 400ns 650ns P.10 MIN pulse width is fixed as 400 nsec 650 nsec P.1 DIP7DIP7K P.2 Avalanche Energy addition P.3 Thermal shut down temperature max value addition P.3 Maximum value of Minimum pulse width addition P.3 Start current 2 specification change P.6 Start time point data addition P.14 DIP7DIP7K P.15 Ordering Model Name Selection P.15 DIP7DIP7K P.3 Start current2 min=2.6mA1.0mA, typ=3.0mA2.5mA, max=6.0mA4.6mA www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/18 TSZ02201-0F1F0A200150-1-2 22.Sep.2017.Rev.004 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. 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