ARTIK 055s Module Datasheet
2
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
MODULE OVERVIEW
The Samsung ARTIK™ 055s Module is a highly integrated module for
secure Internet of Things (IoT) devices that require Wi-Fi® connectivity. It is
based on an ARM® Cortex® R4 core, with on-module RAM and flash
memory, a complete 2.4GHz Wi-Fi subsystem with on-module antenna, an
independent security subsystem, PUF-based module authentication, and a
large complement of standard I/O interfaces.
The ARTIK 055s Module provides excellent performance in a variety of
environments, with a feature set tailored specifically for IoT end nodes.
Processor
CPU 32-bit ARM® Cortex® R4 with 32KB I-Cache and 32KB D-Cache @ 320MHz
Memory
RAM 1280KB (General usage)
128KB (Global IPC data)
FLASH 8MB Flash
Security
Secure Subsystem AES/DES/TDES, SHA-1/SHA-2, PKA (Public Key Accelerator), PRNG/DTRNG
(Random Number Generators), Secure key storage
PUF Physically Unclonable Function
Radio
Wi-Fi Certified IEEE802.11™ b/g/n Wi-Fi® 2.4GHz radio served by a dedicated 32-bit ARM
Cortex R4 with 32KB I-Cache and 16KB D-Cache @ 480MHz
Regulatory FCC (U.S.), IC (Canada), CE (EU), KC (Korea), SRRC (China)
Power Management
Single Supply 3.3V
Interfaces
I/O UART, I2C, SPI, PWM, ADC, GPIO. I2S
Form Factor
Dimensions 15mm W x 26mm D x 3.9mm H
Operation Enviroment
Temperture –20 to 85 oC Tc
Figure 1. ARTIK 055s Module Top View
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
TABLE OF CONTENTS
3
Module Overview................................................................................................................................................................2
Version History ................................................................................................................................................................... 7
Block Diagram.....................................................................................................................................................................8
CPU ...............................................................................................................................................................................8
Memory.........................................................................................................................................................................9
Real Time Clock............................................................................................................................................................9
PUF Unit ........................................................................................................................................................................9
Security Subsystem ................................................................................................................................................... 10
Wi-Fi Subsystem.......................................................................................................................................................... 11
GPIO Interfaces ........................................................................................................................................................... 11
SPI Interfaces............................................................................................................................................................... 11
I2C Interfaces............................................................................................................................................................... 11
PWM Interfaces ........................................................................................................................................................... 11
I2S Interface................................................................................................................................................................ 12
ADC Interfaces ........................................................................................................................................................... 12
UART Interfaces.......................................................................................................................................................... 13
Module Pad Physical Layout............................................................................................................................................. 14
Module Pad Signal Definitions ......................................................................................................................................... 15
Module Pad Signal Definitions by Function..................................................................................................................... 18
GPIO Interface ............................................................................................................................................................ 18
I2C Interface ............................................................................................................................................................... 19
SPI Interface ............................................................................................................................................................... 19
I2S Interface .............................................................................................................................................................. 20
ADC Interface ............................................................................................................................................................ 20
PWM Interface ............................................................................................................................................................ 21
UART Interface ........................................................................................................................................................... 21
Debug Interface ......................................................................................................................................................... 21
INT Interface ............................................................................................................................................................... 22
Reset Interface ........................................................................................................................................................... 22
Power Interface .......................................................................................................................................................... 22
Electrical Specifications ...................................................................................................................................................23
Absolute Maximum Rating.........................................................................................................................................23
Recommended Operating Conditions ......................................................................................................................23
DC Electrical Characteristics .....................................................................................................................................24
Power and Current Consumption..............................................................................................................................25
ESD Ratings ................................................................................................................................................................25
RF Electrical Characteristics ......................................................................................................................................25
Mechanical Specifications ............................................................................................................................................... 27
Module Antenna Placement Requirements ..............................................................................................................28
Certification and Compliance ..........................................................................................................................................29
CE................................................................................................................................................................................29
FCC Regulatory Disclosures ......................................................................................................................................29
Industry Canada Regulatory Disclosures .................................................................................................................. 31
Industry Canada Statement ................................................................................................................................ 31
KC................................................................................................................................................................................ 31
SRRC ........................................................................................................................................................................... 31
EU Regulatory Disclosures .........................................................................................................................................32
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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CE Statement ......................................................................................................................................................32
Ordering Information .......................................................................................................................................................33
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
LIST OF FIGURES
5
Figure 1. ARTIK 055s Module Top View .............................................................................................................................2
Figure 2. ARTIK 055s Module Block Diagram ....................................................................................................................8
Figure 3. ADC LSB behavior ............................................................................................................................................. 12
Figure 4. ARTIK 055s Module Edge Pinout (Top View) ................................................................................................... 14
Figure 5. ARTIK 055s Module Mechanical Dimensions................................................................................................... 27
Figure 6. Module Placement Restrictions........................................................................................................................28
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
LIST OF TABLES
6
Table 1. ARTIK 055s Module Pinout Signal Descriptions................................................................................................. 15
Table 2. GPIO Interface .................................................................................................................................................... 18
Table 3. I2C Interface ....................................................................................................................................................... 19
Table 4. SPI Interface........................................................................................................................................................ 19
Table 5. I2S Interface....................................................................................................................................................... 20
Table 6. ADC Interface .................................................................................................................................................... 20
Table 7. PWM Interface..................................................................................................................................................... 21
Table 8. UART Interface.................................................................................................................................................... 21
Table 9. Debug Interface.................................................................................................................................................. 21
Table 10. Interrupt Interface............................................................................................................................................. 22
Table 11. Reset Interface ...................................................................................................................................................22
Table 12. Power Interface ................................................................................................................................................. 22
Table 13. Absolute Maximum Ratings ..............................................................................................................................23
Table 14. Recommended Operating Conditions.............................................................................................................23
Table 15. GPIO DC Electrical Characteristics...................................................................................................................24
Table 16. GPIO Signal Drive Strengths.............................................................................................................................24
Table 17. ADC DC Electrical Characteristics ....................................................................................................................25
Table 18. ARTIK 055s Module Power Consumption ........................................................................................................25
Table 19. ESD Ratings .......................................................................................................................................................25
Table 20. Tx Performance Characteristics ......................................................................................................................25
Table 21. Rx Performance Characteristics ......................................................................................................................26
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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VERSION HISTORY
Revision Date Description
V1.0 November 20, 2017 First release.
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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BLOCK DIAGRAM
Figure 2 shows a functional block diagram of the ARTIK 055s Module.
Figure 2. ARTIK 055s Module Block Diagram
CPU
The ARTIK 055s Module CPU has an ARM® Cortex® R4. It has the following features:
32KB of Instruction Cache (I-Cache)
32KB of Data Cache (D-Cache)
•320MHz execution clock
R4 core tuned for embedded and real-time applications
58 GPIO
4Std UART
Ports
6PWM
Signals
3I2CPorts
4SPIPorts
1I2SPort
Debug
UART&
JTAG
4ADC
Signals
16
Interrupts
PowerManagement
Wi‐FiSubsystem
SecuritySubsystem
PUF
ProcessorSystem
ARMCortexR4
32KBI‐Cache
32KBD‐Cache
1280KBRAM
8MBFlash
128KBRAM
Global IPCData
RTC
58
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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Memory
The ARTIK 055s Module on-module memory has the following features:
CPU and general purpose RAM
–1280KB CPU RAM
128KB global Inter-Process Communication (IPC) RAM
•8MB flash
Real Time Clock
The ARTIK 055s Module has a Real Time Clock (RTC) for tracking date/time. The RTC has the following features:
Binary-Coded Decimal (BCD) coded seconds, minutes, hour, day of the week, day, month, and year
Leap year detection and compensation
Millisecond tick time interrupt for Real-Time Operating System (RTOS) kernel time tick
PUF Unit
The ARTIK 055s Module has a Physically Unclonable Function (PUF) unit. The PUF unit has the following features:
Generates unique key values, locked to an individual ARTIK 055s Module
The algorithm construction is unique to each module
Allows individual ARTIK 055s Modules to be “fingerprint-identified”
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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Security Subsystem
The ARTIK 055s Module has an independent security subsystem to ensure secure end-to-end operation in any IoT
environment. The security subsystem includes the following features:
Secure IPC Mailbox for inter-subsystem communication
Encapsulated key support
Backup encryption key - 256 bits
Security subsystem root private key - 521 bits
Storage key - 256 bits
Symmetric key engines
Secure AES
Secure DES/Triple-DES
Stream cipher engine
–ARC4 engine
•Various Hash engines
SHA-1, SHA2-256, SHA2-384, SHA2-512, MD5 HMAC
Asymmetric key engines
PKA (Public Key Accelerator) engine
PRNG (Pseudo Random Number Generator)
DTRNG (Digital True Random Number Generator)
Secure key storage
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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Wi-Fi Subsystem
The ARTIK 055s Module has an 802.11b/g/n Wi-Fi subsystem. The Wi-Fi subsystem has the following features:
802.11™ b/g/n support at 2.4GHz
20MHz single stream (802.11n)
•WPA/WPA2
Dedicated Wi-Fi Processor subsystem with 480MHz 32-bit ARM Cortex R4 supported by 32KB I-Cache and
16KB D-Cache.
GPIO Interfaces
The ARTIK 055s Module has flexible General Purpose Input Output (GPIO) interfaces:
58 configurable GPIO ports
Independently configurable for either general purpose input or output
43 configurable for alternate functionality
Configurable internal pull-up or pull-down resistors
SPI Interfaces
The ARTIK 055s Module has four SPI interfaces, each with the following features:
Full duplex communication
8, 16 or 32-bit shift registers and bus interface
Motorola SPI protocol and National Semiconductor Microwire protocol
Master and slave mode operation
Two independent 32-bit wide transmit/receive FIFOs
Transmit and receive speeds up to 50MHz
I2C Interfaces
The ARTIK 055s Module has three high speed multi-master I2C interfaces available, with speeds up to 3.4Mbps.
PWM Interfaces
The ARTIK 055s Module has six PWM timers, each with the following features:
32 bits of resolution for each PWM signal
Two 8-bit prescalers (first level of division) and 5 clock dividers/multiplexers for second-level division
Continuous run or one-shot pulse mode
Dead zone generator to avoid simultaneous change of multiple PWM signals
Interrupt generation
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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I2S Interface
The ARTIK 055s Module has one I2S interface with the following features:
Each channel includes a 32-bit × 64 data FIFO for both transmit and receive
Supports stereo I2S bus channels with external DMA-based operations
Can mix two sound sources from a primary and secondary source
Serial data transfer formats of 8 bits, 16 bits, or 24 bits per channel
Supports both MSB and LSB justified data formats
Can be used in I2S slave mode
ADC Interfaces
The ARTIK 055s Module has four analog-to-digital converter (ADC) channels. Each interface has the following
features:
12-bit resolution
ADC conversion clock at 1.08 mega-samples per second (MSPS) using a main 6.5MHz clock
Supports sample averaging over 1, 2, 4, 8, 16, 32, or 64 samples
Differential non-linearity error range of ±2 LSB bits (value of ±2)
Integral non-linearity error range of ±3 LSB bits (value of ±6)
Top and bottom offset error range of ±4 LSB bits (value of ±10)
Voltage range up to 1.8V
Figure 3 depicts the dynamic behavior between input voltage on the ADC and resulting LSB value in the ADC
register.
Figure 3. ADC LSB behavior
Result (LSB)
Analog in (V)
Top
offset
Bottom
offset
Real
value
Ideal
value
Ideal value
with offset
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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UART Interfaces
The ARTIK 055s Module has five 2-pin UART interfaces; one is used in the debug block. Each has the following
features:
Can be operated in DMA or interrupt-based mode
Support for 5, 6, 7, or 8-bit serial data transmit and receive
Programmable baud rate
One or two stop-bit insertion
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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MODULE PAD PHYSICAL LAYOUT
The ARTIK 055s Module utilizes 82 signal, power, and ground pads. The figure below shows how the physical layout
orients the signal pads assigned at the edge of the ARTIK 055s Module. Figure 1 shows the edge pads and the
signal names.
Figure 4. ARTIK 055s Module Edge Pinout (Top View)
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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MODULE PAD SIGNAL DEFINITIONS
The tables below describes the characteristics of the ARTIK 055s Module pad signals. Some signals can be
configured for alternate functionality. The remaining signals have dedicated functionality. Refer to the following
column definitions.
Pad Number defines the signal pad on the edge of the module. Refer to Figure 4 for pad/signal physical
layout.
Pad Name defines the net list name of the signal. The pad name may reflect on one of the possible optional
signal functionality, and dictates the default power-on function.
GPIO Name defines a generic name for referring to GPIO signals regardless of their current configured
functionality. The name order is the same order as the GPIO signals appear in the GPIO configuration
registers.
PU/PD defines the power-on state of the internal pull up/pull down definition. PU:pull up, PD:pull down, N:no
pull up/down.
GPIO Drive defines the power-on state drive strength of GPIO and other signals. Configurable to 2mA, 4mA,
8mA, or 12mA. Do not use GPIO signals to power discrete components directly (such as LEDs). Use an
external driver device instead (such as a transistor).
Option 1 - Option 6 lists the alternative functionality some signals can be configured to. Those signals
without any options are dedicated to their function. The pad name signifies the default power-on state.
Table 1. ARTIK 055s Module Pinout Signal Descriptions
Pad
Number
Pad Name
& Default
Function
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
1GND
2 XADC0AIN_1
3XADC0AIN_0
4 XADC0AIN_2
5XADC0AIN_3
6 XGPIO22 GPIO39 PD 2mA GP Input GP Output NWEINT_GPG2[6]
7 XGPIO23 GPIO40 PD 2mA GP Input GP Output NWEINT_GPG2[7]
8XRESET_N
9XJTAG_TRST_N PD
10 XJTAG_TMS PU
11 XJTAG_TCK PD
12 XJTAG_TDO PD 2mA
13 XJTAG_TDI PU
14 XEINT_0 GPIO45 PD 2mA GP Input GP Output NWEINT_GPA0[0]
15 XEINT_2 GPIO47 PD 2mA GP Input GP Output NWEINT_GPA0[2]
16 XEINT_1 GPIO46 PD 2mA GP Input GP Output NWEINT_GPA0[1]
17 XI2C0_SCL GPIO48 PD 8mA GP Input GP Output HSI2C_0_SCL
18 XI2C0_SDA GPIO49 PD 8mA GP Input GP Output HSI2C_0_SDA
19 XI2C1_SCL GPIO50 PD 8mA GP Input GP Output HSI2C_1_SCL
20 XI2C1_SDA GPIO51 PD 8mA GP Input GP Output HSI2C_1_SDA
21 XUART0_RXD GPIO52 PD 8mA GP Input GP Output UART_0_RXD
22 XUART0_TXD GPIO53 PD 8mA GP Input GP Output UART_0_TXD
23 XDEBUG_RXD GPIO54 PD 8mA GP Input GP Output Xdebug_RXD
24 XDEBUG_TXD GPIO55 PD 8mA GP Input GP Output Xdebug_TXD
25 XPWMTOUT_5 GPIO16 PD 8mA GP Input GP Output PWM_TOUT_6
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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26 XPWMTOUT_4 GPIO15 PD 8mA GP Input GP Output PWM_TOUT_5
27 VIN_3P3
28 VIN_3P3
29 XPWMTOUT_3 GPIO13 PD 8mA GP Input GP Output PWM_TOUT_3
30 XPWMTOUT_2 GPIO12 PD 8mA GP Input GP Output PWM_TOUT_2
31 XPWMTOUT_1 GPIO11 PD 8mA GP Input GP Output PWM_TOUT_1 COUNTER_0 UART_3_RTSn
32 GND -
33 XPWMTOUT_0 GPIO10 PD 8mA GP Input GP Output PWM_TOUT_0 UART_3_CTSn
34 XGPIO27 GPIO44 PD 2mA GP Input GP Output I2S_0_SDI
35 XSPI0_CLK GPIO00 PD 8mA GP Input GP Output SPI_0_CLK
36 XSPI0_MOSI GPIO03 PD 8mA GP Input GP Output SPI_0_MOSI
37 XSPI0_CSN GPIO01 PD 8mA GP Input GP Output SPI_0_CSn
38 XSPI0_MISO GPIO02 PD 8mA GP Input GP Output SPI_0_MISO
39 XUART1_RXD GPIO04 PD 8mA GP Input GP Output UART_1_RXD UART_2_CTSn
40 XUART1_TXD GPIO05 PD 8mA GP Input GP Output UART_1_TXD UART_2_RTSn
41 XUART2_RXD GPIO06 PD 8mA GP Input GP Output UART_2_RXD
42 XUART2_TXD GPIO07 PD 8mA GP Input GP Output UART_2_TXD
43 GND -
44 XUART3_RXD GPIO08 PD 8mA GP Input GP Output UART_3_RXD
45 XUART3_TXD GPIO09 PD 8mA GP Input GP Output UART_3_TXD
46 XGPIO12 GPIO29 PD 2mA GP Input GP Output NWEINT_GPG1[4]
47 XGPIO9 GPIO26 PD 2mA GP Input GP Output SPI_3_CSn NWEINT_GPG1[1]
48 XGPIO11 GPIO28 PD 2mA GP Input GP Output SPI_3_MOSI NWEINT_GPG1[3]
49 XGPIO8 GPIO25 PD 2mA GP Input GP Output SPI_3_CLK NWEINT_GPG1[0]
50 XGPIO10 GPIO27 PD 2mA GP Input GP Output SPI_3_MISO NWEINT_GPG1[2]
51 XGPIO7 GPIO24 PD 2mA GP Input GP Output SPI_2_MOSI
52 XGPIO6 GPIO23 PD 2mA GP Input GP Output SPI_2_MISO
53 XGPIO5 GPIO22 PD 2mA GP Input GP Output SPI_2_CSn
54 XGPIO4 GPIO21 PD 2mA GP Input GP Output SPI_2_CLK
55 XSPI1_MISO GPIO58 PD 2mA GP Input GP Output SPI_1_MISO
56 XSPI1_CLK GPIO56 PD 2mA GP Input GP Output SPI_1_CLK
57 XSPI1_MOSI GPIO59 PD 2mA GP Input GP Output SPI_1_MOSI
58 XSPI1_CSN GPIO57 PD 2mA GP Input GP Output SPI_1_CSn
59 XGPIO1 GPIO18 PD 2mA GP Input GP Output HSI2C_2_SDA
60 XGPIO2 GPIO19 PD 2mA GP Input GP Output HSI2C_3_SCL
61 XGPIO3 GPIO20 PD 2mA GP Input GP Output HSI2C_3_SDA
62 XGPIO24 GPIO41 PD 2mA GP Input GP Output I2S_0_BCLK
63 XGPIO25 GPIO42 PD 2mA GP Input GP Output I2S_0_LRCK
64 XGPIO26 GPIO43 PD 2mA GP Input GP Output I2S_0_SDO
65 XGPIO18 GPIO35 PD 2mA GP Input GP Output NWEINT_GPG2[2]
66 XGPIO19 GPIO36 PD 2mA GP Input GP Output NWEINT_GPG2[3]
67 XGPIO20 GPIO37 PD 2mA GP Input GP Output NWEINT_GPG2[4]
68 XGPIO21 GPIO38 PD 2mA GP Input GP Output NWEINT_GPG2[5]
69 XGPIO15 GPIO32 PD 2mA GP Input GP Output NWEINT_GPG1[7]
70 XGPIO16 GPIO33 PD 2mA GP Input GP Output NWEINT_GPG2[0]
71 XGPIO17 GPIO34 PD 2mA GP Input GP Output NWEINT_GPG2[1]
72 XGPIO13 GPIO30 PD 2mA GP Input GP Output NWEINT_GPG1[5]
73 XGPIO14 GPIO31 PD 2mA GP Input GP Output NWEINT_GPG1[6]
Table 1. ARTIK 055s Module Pinout Signal Descriptions (Continued)
Pad
Number
Pad Name
& Default
Function
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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74 GND
75 GND
76 GND
77 GND
78 GND
79 GND
80 GND
81 GND
82 GND
Table 1. ARTIK 055s Module Pinout Signal Descriptions (Continued)
Pad
Number
Pad Name
& Default
Function
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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MODULE PAD SIGNAL DEFINITIONS BY FUNCTION
GPIO Interface
Table 2. GPIO Interface
GPIO
Name
Pad Name
& Default
Function
Pad
Number PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
GPIO00 XSPI0_CLK 35 PD 8mA GP Input GP Output SPI_0_CLK
GPIO01 XSPI0_CSN 37 PD 8mA GP Input GP Output SPI_0_CSn
GPIO02 XSPI0_MISO 38 PD 8mA GP Input GP Output SPI_0_MISO
GPIO03 XSPI0_MOSI 36 PD 8mA GP Input GP Output SPI_0_MOSI
GPIO04 XUART1_RXD 39 PD 8mA GP Input GP Output UART_1_RXD UART_2_CTSn
GPIO05 XUART1_TXD 40 PD 8mA GP Input GP Output UART_1_TXD UART_2_RTSn
GPIO06 XUART2_RXD 41 PD 8mA GP Input GP Output UART_2_RXD
GPIO07 XUART2_TXD 42 PD 8mA GP Input GP Output UART_2_TXD
GPIO08 XUART3_RXD 44 PD 8mA GP Input GP Output UART_3_RXD
GPIO09 XUART3_TXD 45 PD 8mA GP Input GP Output UART_3_TXD
GPIO10 XPWMTOUT_0 33 PD 8mA GP Input GP Output PWM_TOUT_0 UART_3_CTSn
GPIO11 XPWMTOUT_1 31 PD 8mA GP Input GP Output PWM_TOUT_1 COUNTER_0 UART_3_RTSn
GPIO12 XPWMTOUT_2 30 PD 8mA GP Input GP Output PWM_TOUT_2
GPIO13 XPWMTOUT_3 29 PD 8mA GP Input GP Output PWM_TOUT_3
GPIO15 XPWMTOUT_4 26 PD 8mA GP Input GP Output PWM_TOUT_5
GPIO16 XPWMTOUT_5 25 PD 8mA GP Input GP Output PWM_TOUT_6
GPIO18 XGPIO1 59 PD 2mA GP Input GP Output HSI2C_2_SDA
GPIO19 XGPIO2 60 PD 2mA GP Input GP Output HSI2C_3_SCL
GPIO20 XGPIO3 61 PD 2mA GP Input GP Output HSI2C_3_SDA
GPIO21 XGPIO4 54 PD 2mA GP Input GP Output SPI_2_CLK
GPIO22 XGPIO5 53 PD 2mA GP Input GP Output SPI_2_CSn
GPIO23 XGPIO6 52 PD 2mA GP Input GP Output SPI_2_MISO
GPIO24 XGPIO7 51 PD 2mA GP Input GP Output SPI_2_MOSI
GPIO25 XGPIO8 49 PD 2mA GP Input GP Output SPI_3_CLK NWEINT_GPG1[0]
GPIO26 XGPIO9 47 PD 2mA GP Input GP Output SPI_3_CSn NWEINT_GPG1[1]
GPIO27 XGPIO10 50 PD 2mA GP Input GP Output SPI_3_MISO NWEINT_GPG1[2]
GPIO28 XGPIO11 48 PD 2mA GP Input GP Output SPI_3_MOSI NWEINT_GPG1[3]
GPIO29 XGPIO12 46 PD 2mA GP Input GP Output NWEINT_GPG1[4]
GPIO30 XGPIO13 72 PD 2mA GP Input GP Output NWEINT_GPG1[5]
GPIO31 XGPIO14 73 PD 2mA GP Input GP Output NWEINT_GPG1[6]
GPIO32 XGPIO15 69 PD 2mA GP Input GP Output NWEINT_GPG1[7]
GPIO33 XGPIO16 70 PD 2mA GP Input GP Output NWEINT_GPG2[0]
GPIO34 XGPIO17 71 PD 2mA GP Input GP Output NWEINT_GPG2[1]
GPIO35 XGPIO18 65 PD 2mA GP Input GP Output NWEINT_GPG2[2]
GPIO36 XGPIO19 66 PD 2mA GP Input GP Output NWEINT_GPG2[3]
GPIO37 XGPIO20 67 PD 2mA GP Input GP Output NWEINT_GPG2[4]
GPIO38 XGPIO21 68 PD 2mA GP Input GP Output NWEINT_GPG2[5]
GPIO39 XGPIO22 6 PD 2mA GP Input GP Output NWEINT_GPG2[6]
GPIO40 XGPIO23 7 PD 2mA GP Input GP Output NWEINT_GPG2[7]
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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I2C Interface
SPI Interface
GPIO41 XGPIO24 62 PD 2mA GP Input GP Output I2S_0_BCLK
GPIO42 XGPIO25 63 PD 2mA GP Input GP Output I2S_0_LRCK
GPIO43 XGPIO26 64 PD 2mA GP Input GP Output I2S_0_SDO
GPIO44 XGPIO27 34 PD 2mA GP Input GP Output I2S_0_SDI
GPIO45 XEINT_0 14 PD 2mA GP Input GP Output NWEINT_GPA0[0]
GPIO46 XEINT_1 16 PD 2mA GP Input GP Output NWEINT_GPA0[1]
GPIO47 XEINT_2 15 PD 2mA GP Input GP Output NWEINT_GPA0[2]
GPIO48 XI2C0_SCL 17 PD 8mA GP Input GP Output HSI2C_0_SCL
GPIO49 XI2C0_SDA 18 PD 8mA GP Input GP Output HSI2C_0_SDA
GPIO50 XI2C1_SCL 19 PD 8mA GP Input GP Output HSI2C_1_SCL
GPIO51 XI2C1_SDA 20 PD 8mA GP Input GP Output HSI2C_1_SDA
GPIO52 XUART0_RXD 21 8mA GP Input GP Output UART_0_RXD
GPIO53 XUART0_TXD 22 8mA GP Input GP Output UART_0_TXD
GPIO54 XSPI1_CLK 56 PD 2mA GP Input GP Output SPI_1_CLK
GPIO55 XSPI1_CSN 58 PD 2mA GP Input GP Output SPI_1_CSn
GPIO56 XSPI1_MISO 55 PD 2mA GP Input GP Output SPI_1_MISO
GPIO57 XSPI1_MOSI 57 PD 2mA GP Input GP Output SPI_1_MOSI
Table 3. I2C Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XI2C0_SCL 17 GPIO48 PD 8mA GP Input GP Output HSI2C_0_SCL
XI2C0_SDA 18 GPIO49 PD 8mA GP Input GP Output HSI2C_0_SDA
XI2C1_SCL 19 GPIO50 PD 8mA GP Input GP Output HSI2C_1_SCL
XI2C1_SDA 20 GPIO51 PD 8mA GP Input GP Output HSI2C_1_SDA
XGPIO2 60 GPIO02 PD 2mA GP Input GP Output HSI2C_3_SCL
XGPIO3 61 GPIO03 PD 2mA GP Input GP Output HSI2C_3_SDA
Table 4. SPI Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XSPI0_CLK 35 GPIO00 PD 8mA GP Input GP Output SPI_0_CLK
XSPI0_CSN 37 GPIO01 PD 8mA GP Input GP Output SPI_0_CSn
XSPI0_MISO 38 GPIO02 PD 8mA GP Input GP Output SPI_0_MISO
XSPI0_MOSI 36 GPIO03 PD 8mA GP Input GP Output SPI_0_MOSI
Table 2. GPIO Interface (Continued)
GPIO
Name
Pad Name
& Default
Function
Pad
Number PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
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I2S Interface
ADC Interface
XSPI1_CLK 56 GPIO56 PD 2mA GP Input GP Output SPI_1_CLK
XSPI1_CSN 58 GPIO57 PD 2mA GP Input GP Output SPI_1_CSn
XSPI1_MISO 55 GPIO58 PD 2mA GP Input GP Output SPI_1_MISO
XSPI1_MOSI 57 GPIO59 PD 2mA GP Input GP Output SPI_1_MOSI
XGPIO5 53 GPIO22 PD 2mA GP Input GP Output SPI_2_CSn
XGPIO4 54 GPIO21 PD 2mA GP Input GP Output SPI_2_CLK
XGPIO6 52 GPIO23 PD 2mA GP Input GP Output SPI_2_MISO
XGPIO7 51 GPIO24 PD 2mA GP Input GP Output SPI_2_MOSI
XGPIO9 47 GPIO26 PD 2mA GP Input GP Output SPI_3_CSn NWEINT_GPG1[1]
XGPIO11 48 GPIO28 PD 2mA GP Input GP Output SPI_3_MOSI NWEINT_GPG1[3]
XGPIO8 49 GPIO25 PD 2mA GP Input GP Output SPI_3_CLK NWEINT_GPG1[0]
XGPIO10 50 GPIO27 PD 2mA GP Input GP Output SPI_3_MISO NWEINT_GPG1[2]
Table 5. I2S Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XGPIO24 62 GPIO41 PD 2mA GP Input GP Output I2S_0_BCLK
XGPIO25 63 GPIO42 PD 2mA GP Input GP Output I2S_0_LRCK
XGPIO26 64 GPIO43 PD 2mA GP Input GP Output I2S_0_SDO
XGPIO27 34 GPIO44 PD 2mA GP Input GP Output I2S_0_SDI
Table 6. ADC Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XADC0AIN_0 3
XADC0AIN_1 2
XADC0AIN_2 4
XADC0AIN_3 5
Table 4. SPI Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
21
PWM Interface
UART Interface
Debug Interface
Table 7. PWM Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XPWMTOUT_0 33 GPIO10 PD 8mA GP Input GP Output PWM_TOUT_0 UART_3_CTSn
XPWMTOUT_1 31 GPIO11 PD 8mA GP Input GP Output PWM_TOUT_1 COUNTER_0 UART_3_RTSn
XPWMTOUT_2 30 GPIO12 PD 8mA GP Input GP Output PWM_TOUT_2
XPWMTOUT_3 29 GPIO13 PD 8mA GP Input GP Output PWM_TOUT_3
XPWMTOUT_4 26 GPIO15 PD 8mA GP Input GP Output PWM_TOUT_5
XPWMTOUT_5 25 GPIO16 PD 8mA GP Input GP Output PWM_TOUT_6
Table 8. UART Interface
Pad Name
& Default
Funtion
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XUART0_RXD 21 GPIO52 PD 8mA GP Input GP Output UART_0_RXD
XUART0_TXD 22 GPIO53 PD 8mA GP Input GP Output UART_0_TXD
XUART1_RXD 39 GPIO04 PD 8mA GP Input GP Output UART_1_RXD UART_2_CTSn
XUART1_TXD 40 GPIO05 PD 8mA GP Input GP Output UART_1_TXD UART_2_RTSn
XUART2_RXD 41 GPIO06 PD 8mA GP Input GP Output UART_2_RXD
XUART2_TXD 42 GPIO07 PD 8mA GP Input GP Output UART_2_TXD
XUART3_RXD 44 GPIO08 PD 8mA GP Input GP Output UART_3_RXD
XUART3_TXD 45 GPIO09 PD 8mA GP Input GP Output UART_3_TXD
Table 9. Debug Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XJTAG_TCK 11 PD
XJTAG_TMS 10 PU
XJTAG_TDI 13 PU
XJTAG_TDO 12 PD
XJTAG_TRST_N 9 PD
XDEBUG_RXD 23 GPIO54 PD 8mA GP Input GP Output Xdebug_RXD
XDEBUG_TXD 24 GPIO55 PD 8mA GP Input GP Output Xdebug_TXD
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
22
INT Interface
Reset Interface
Power Interface
Table 10. Interrupt Interface
Pad Name
& Default
Function
Pad
Number
GPIO
Name PU/PD GPIO
Drive Option 1 Option 2 Option 3 Option 4 Option 5 Option 6
XEINT_0 14 GPIO45 PD 2mA GP Input GP Output NWEINT_GPA0[0]
XEINT_1 16 GPIO46 PD 2mA GP Input GP Output NWEINT_GPA0[1]
XEINT_2 15 GPIO47 PD 2mA GP Input GP Output NWEINT_GPA0[2]
XGPIO8 49 GPIO25 PD 2mA GP Input GP Output SPI_3_CLK NWEINT_GPG1[0]
XGPIO9 47 GPIO26 PD 2mA GP Input GP Output SPI_3_CSn NWEINT_GPG1[1]
XGPIO10 50 GPIO27 PD 2mA GP Input GP Output SPI_3_MISO NWEINT_GPG1[2]
XGPIO11 48 GPIO28 PD 2mA GP Input GP Output SPI_3_MOSI NWEINT_GPG1[3]
XGPIO12 46 GPIO29 PD 2mA GP Input GP Output NWEINT_GPG1[4]
XGPIO13 72 GPIO30 PD 2mA GP Input GP Output NWEINT_GPG1[5]
XGPIO14 73 GPIO31 PD 2mA GP Input GP Output NWEINT_GPG1[6]
XGPIO15 69 GPIO32 PD 2mA GP Input GP Output NWEINT_GPG1[7]
XGPIO16 70 GPIO33 PD 2mA GP Input GP Output NWEINT_GPG2[0]
XGPIO17 71 GPIO34 PD 2mA GP Input GP Output NWEINT_GPG2[1]
XGPIO18 65 GPIO35 PD 2mA GP Input GP Output NWEINT_GPG2[2]
XGPIO19 66 GPIO36 PD 2mA GP Input GP Output NWEINT_GPG2[3]
XGPIO20 67 GPIO37 PD 2mA GP Input GP Output NWEINT_GPG2[4]
XGPIO21 68 GPIO38 PD 2mA GP Input GP Output NWEINT_GPG2[5]
XGPIO22 6 GPIO39 PD 2mA GP Input GP Output NWEINT_GPG2[6]
XGPIO23 7 GPIO40 PD 2mA GP Input GP Output NWEINT_GPG2[7]
Table 11. Reset Interface
Pad Name Pad Number
XRESET_N 8
Table 12. Power Interface
Pad Name Pad Number
VIN_3P3 [27-28]
GND [1, 32, 43, 74, 75, 76, 77, 78, 79, 80, 81,
82]
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
23
ELECTRICAL SPECIFICATIONS
Absolute Maximum Rating
Recommended Operating Conditions
The recommended operation of the ARTIK 055s Module is based on the operating conditions listed in Table 14
Table 13. Absolute Maximum Ratings
PAD
Number Symbol Description Min Typ Max Units
[27, 28] VIN Input voltage VIN ––3.8V
[2-20],
[23-26],
[29-31],
[33-42],
[44-73]
Vundershoot Undershoot voltage for I/O -0.3 V
Table 14. Recommended Operating Conditions
Parameter Symbol Min Typ Max Units
Main Power Supply: PAD: [27, 28] VIN_3P3 3.1 3.3 3.6 V
Operating Temperature Tc-20 85 °C
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
24
DC Electrical Characteristics
Table 15. GPIO DC Electrical Characteristics
PAD
Number Symbol Description Condition Min Typ Max Units
[6-7],
[14-26],
[29-31],
[33-42],
[44-73]
VTOL Tolerant External Voltage 3.3 Power Off and On 3.6 V
VIH
High-Level Input Voltage
CMOS Interface 2.31 3.6 V
VIL
Low-Level Input Voltage
CMOS Interface VDD = 3.3V ± 10% -0.3 0.7 V
ΔVHysteresis Voltage 0.15 V
IIH
High-Level Input Current
Input Buffer VIN = 3.3V VDD = 3.3V Power On -3 3
μAVDD= 3.3V Power Off & SNS=0 -5 5
Input Buffer Pull-Down VIN = 3.3V VDD = 3.3V ± 10% 13 40 90
IIL
Low-Level Input Current
Input Buffer VIN = 0V VDD = 3.3V Power On and Off -3 3
μA
Input Buffer Pull-Down VIN = 0V VDD = 3.3V -13 -90
VOH Output High Voltage IOH = 2.0mA, 4.0mA, 8.0mA and 12.0mA 2.64 3.3 V
VOL Output Low Voltage IOL = -2.0mA, -4.0mA, -8.0mA and -12.0mA 0 0.66
VOZ Output Hi-Z Current -5 5 μA
CIN Input Capacitance Any input and bi-directional buffers 5 pF
COUT Output Capacitance Any output buffers 5 pF
Table 16. GPIO Signal Drive Strengths
State Currents: Max conditions VDD = 3.3V Units
02mA
14mA
28 (default)mA
312mA
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
25
Power and Current Consumption
The values in this table are nominal. Measurements were taken on sample boards at room temperature using a 3.3V
system power supply.
ESD Ratings
RF Electrical Characteristics
Table 17. ADC DC Electrical Characteristics
PAD
Number Symbol Description Condition Min Typ Max Units
[2-5]
VIH High Level Input Voltage Guaranteed Logic High Level 1.26 1.8 V
VIL Low Level Input Voltage Guaranteed Logic Low Level 0 0.54 V
VOH Output High Voltage IOH = 2mA, 4mA, 8mA and 12mA 1.44 1.8 V
VOL Output Low Voltage IOL = 2mA, 4mA, 8mA and 12mA 0 0.36 V
IRPU Input Pull-Up Resistor
Current
VPAD = 0 15 77 μA
IRPD Input Pull-Down Resistor
Current
VPAD = 1.8 17 77 μA
VHInput Hysteresis 0.18 V
IPAD Input Leakage Current
for Non Tolerant Cells
DVDD = 1.8, VPAD = 0 or 1.8V -6 +6 μA
IOZ Off State Leakage
Current
DVDD = 1.8, VPAD = 0 or 1.8V -6 +6 μA
Table 18. ARTIK 055s Module Power Consumption
Category Scenario Condition Throughput
Conditions
Current
(mA)
Power
(W)
Wi-Fi 802.11n Tx Transfer packet using iperf3 @ 25 Mbps Max 320 1.06
802.11n Rx Transfer packet using iperf3 @ 25 Mbps Max 240 0.79
802.11n Idle DTIM3 –540.18
Table 19. ESD Ratings
Parameter Min Typ Max Units
ESD stress voltage Human Body Model (JEDEC) -1.0 1.0 kV
ESD stress voltage Charged Device Model –250 V
Table 20. Tx Performance Characteristics
Parameter Min Typ Max Units
RF frequency range 2412 - 2472 GHz
11b (1-11Mbps) –16dBm
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
26
11g (6-54Mbps) –13dBm
11n, HT20 (MCS0-7) –12dBm
Table 21. Rx Performance Characteristics a
a. Measured in a conduction test performed in a shielded room
Parameter Min Type Max Units
RF frequency range 2412 2472 GHz
11b (1Mbps) ––96dBm
11b (11Mbps) ––87dBm
11g (6Mbps) ––91dBm
11g (54Mbps) ––74dBm
11n, HT20 (MCS0) ––92dBm
11n, HT20 (MCS07) ––71dBm
Table 20. Tx Performance Characteristics
Parameter Min Typ Max Units
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
27
MECHANICAL SPECIFICATIONS
Figure 5 shows the mechanical dimensions of the ARTIK 055s Module. All dimensions are in mm.
Figure 5. ARTIK 055s Module Mechanical Dimensions
The top layer “NO PCB ROUTING” gray areas are to prevent any shorts between exposed vias or traces and
unused ARTIK 055s Module pads.
The ground pads (79–82) are not centered on the module. Pad 82 is 7.15mm from the East side of the
module and 7.65mm from the West side.
Alldimensionsinmm
1.0
0.7
0.6
0.7
0.4
0.6
1.0
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
28
Module Antenna Placement Requirements
The ARTIK 055s Module has an integrated on-module antenna. The figure below describes the required restrictions
on location when placing the ARTIK 055s Module on your native PCB design. In addition, adhere to the following
guidelines:
To avoid severe Wi-Fi radiation loss, Samsung Semiconductor, Inc. strongly recommends allocating a “No
PCB Routing or Power Planes” metal-free area of at least 5×6.7mm (all layers) next to the on-module antenna,
as shown in Figure 6.
Locate the antenna area at the edge of your PCB board, and as far away from other electronics as possible.
Figure 6. Module Placement Restrictions
ARTIK 055s
Module
Wi‐FiAntenna
Keep‐outArea
Keep‐
out
Area
Keep‐
out
Area
5mm 5mm
6.7mm
PCBDesignRoutingPCBDesignRouting
6.7mm
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
29
CERTIFICATION AND COMPLIANCE
CE
The ARTIK 055s Module is in compliance with each applicable article of the Radio Equipment Directive (RED)
Compliance with the following standards was confirmed:
Article 3.1a (Health and Safety) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2001 + A2:2013
Article 3.1.b (EMC) EN 301 489-1 V2.1.1
EN 301 489-17 V3.1.1
Article 3.2 (Radio spectrum use) EN 300 328 V2.1.1
EN 62311:2008
For a formal notified body statement of opinion contact your sales representative.
FCC Regulatory Disclosures
This device complies with Part 15 of the FCC`s Rules. Operation is subject to the following two Conditions: (1) This
device may not cause harmful interference, and (2) This device must accept any interference received, including
interference that may cause undesirable operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/ TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with a minimum distance of 20cm between the transmitter’s radiating
structure(s) and the body of the user or nearby persons.
This module is intended for OEM integration. The OEM integrator is responsible for FCC compliance and compliance
with all applicable regulations including those for modular transmitters 47 C.F.R. 15.212. The OEM product must
comply with all applicable labeling requirements including those contained in 15 C.F.R. 15.19. The OEM is solely
responsible for certification and testing and labeling of its own products. In addition to any independently required
labels, the OEM shall also affix to the outside of a device into which the module is installed a label referring to the
enclosed module. This exterior label should be prepared in a legible font and permanently affixed and using the
wording “Contains Transmitter Module FCCID: A3LSIP0P5WRS50.
The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of
20 cm between the equipment’s radiating structure(s) and the body of the user or nearby persons. The OEM shall
also advise its end user of this requirement as required by applicable rules.
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
30
The OEM shall require that the end user of its product be informed that the FCC radio frequency exposure guidelines
for an uncontrolled environment can be satisfied. The OEM shall further inform its end user that any change or
modifications to this module not expressly approved by the manufacturer will void the warranty and the users’
authority to operate the equipment.
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
31
Industry Canada Regulatory Disclosures
Industry Canada Statement
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). L’opération est soumise aux
deux conditions suivantes:(1) cet appareil ne peut causer d’interférences, et?(2) cet appareil doit accepter toute
interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l’appareil.
Industry Canada Radiation Exposures Statement and Limitations on Use
This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. This
equipment should be installed and must not be co-located or operating in conjunction with any other antenna or
transmitter.
In the United States and Canada, only Channel 1~11 can be operated and these channel assignments deal only with
the 2.4 GHz range.
The end product must be labeled to display the Industry Canada certification number of the module
Contains transmitter module IC: 649E-SIP0P5WRS50
Le dispositif d’accueil doivent être étiquetés pour afficher le numéro de certification d’Industrie Canada du module.
Contient module émetteur IC : 649E-SIP0P5WRS50
KC
The ARTIK 055s Module complies with the standards set by the Korean communications commission (KC).
KC Identifier: MSIP-CRM-SEC-SIP0P5WRS50
SRRC
Both the ARTIK 055s Module complies with the standards set by the People’s Republic of China.
CMIIT ID: 2017DJ5889 (M)
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
32
EU Regulatory Disclosures
CE Statement
The following statement must be supplied with each product but can be printed in the user manual, the packaging, or
provided as a separated leaflet.
Hereby, Samsung declares that this IoT Module is in compliance with the essential requirements and other
relevant provisions of Article 3 Essential requirements of the Radio Equipment Directive 2014/53/EU and
RoHS directive 2011/65/EU.
“The declaration of conformity may be consulted at www.artik.io/certification”
The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of
20 cm between the equipment’s radiating structure(s) and the body of the user or nearby persons. The OEM shall
also advise its end user of this requirement as required by applicable rules.
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
33
ORDERING INFORMATION
For volume ordering of evaluation kits, contact a sales representative in your area or visit:
https://www.artik.io/contact-us/
Type Order Number Description
ARTIK 055s Module SIP-0P5WRS502 One ARTIK 055s Module
ARTIK 055s Development Kit SIP-KITNXH002 One ARTIK 055s Module
One Embedded Evaluation Board
Samsung Semiconductor, Inc. ARTIK 055s Module Datasheet
LEGAL INFORMATION
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIK™ DEVELOPMENT KIT
AND ALL RELATED PRODUCTS, UPDATES, AND DOCUMENTATION (HEREINAFTER "SAMSUNG PRODUCTS"). NO
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
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SAMSUNG PRODUCTS ARE GOVERNED EXCLUSIVELY BY THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT
THAT YOU AGREED TO WHEN YOU REGISTERED AS A DEVELOPER TO RECEIVE THE SAMSUNG PRODUCTS. EXCEPT
AS PROVIDED IN THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND
ITS AFFILIATES (COLLECTIVELY, "SAMSUNG") ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT
LIMITATION CONSEQUENTIAL OR INCIDENTAL DAMAGES, AND SAMSUNG DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, ARISING OUT OF OR RELATED TO YOUR SALE, APPLICATION AND/OR USE OF SAMSUNG PRODUCTS
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SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS
WITHOUT NOTICE. THIS INCLUDES MAKING CHANGES TO THIS DOCUMENTATION AT ANY TIME WITHOUT PRIOR
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DISCUSSED HEREIN IS PROVIDED ON AN "AS IS" BASIS, WITHOUT WARRANTIES OF ANY KIND. SAMSUNG ASSUMES
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DOCUMENTATION CONTAINED HEREIN.
Samsung Products are not intended for use in medical, life support, critical care, safety equipment, or similar
applications where product failure could result in loss of life or personal or physical harm, or any military or defense
application, or any governmental procurement to which special terms or provisions may apply.
This document and all information discussed herein remain the sole and exclusive property of Samsung. All brand
names, trademarks and registered trademarks belong to their respective owners. For updates or additional
information about Samsung ARTIK™, contact the Samsung ARTIK™ team via the Samsung ARTIK™ website at
www.artik.io.
Copyright © 2017 Samsung Electronics Co., Ltd.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any
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consent of Samsung Electronics.
34
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis,
without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the
other party under this document, by implication, estoppel or other-wise. Samsung products are not intended for use in life support, critical
care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional
information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong
to their respective owners.