72T7295L10BB - Integrated Device Technology (IDT)

1JUNE 2017

DSC-5994/16

IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The TeraSync FIFO is a trademark of Integrated Device Technology, Inc.

COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES

2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 72-BIT CONFIGURATIONS

16,384 x 72, 32,768 x 72,

65,536 x 72, 131,072 x 72 IDT72T7285, IDT72T7295,

IDT72T72105, IDT72T72115

FUNCTIONAL BLOCK DIAGRAM

INPUT REGISTER

OUTPUT REGISTER

RAM ARRAY

16,384 x 72

32,768 x 72

65,536 x 72

131,072 x 72

FLAG

LOGIC

FF/IR

PAF

EF/OR

PAE

READ POINTER

READ

CONTROL

LOGIC

WRITE CONTROL

LOGIC

WRITE POINTER

RESET

LOGIC

WEN WCLK/WR

D0 -Dn (x72, x36 or x18)

MRS

REN

RCLK/RD

Q0 -Qn (x72, x36 or x18)

OFFSET REGISTER

PRS

FWFT/SI

SEN

5994 drw01

BUS

CONFIGURATION

CONTROL

LOGIC

PFM

FSEL0

FSEL1

MARK

SCLK

RCS

JTAG CONTROL

(BOUNDARY SCAN)

TCK

TMS

TDO

TDI

TRST

ASYR

WCS

ERCLK

EREN

HSTL I/0

CONTROL

Vref

WHSTL

RHSTL

ASYW

SHSTL

FEATURES:

••

•Choose among the following memory organizations:

IDT72T7285 ⎯⎯

⎯⎯

⎯16,384 x 72

IDT72T7295 ⎯⎯

⎯⎯

⎯32,768 x 72

IDT72T72105 ⎯⎯

⎯⎯

⎯65,536 x 72

IDT72T72115 ⎯⎯

⎯⎯

⎯131,072 x 72

••

•Up to 225 MHz Operation of Clocks

••

•User selectable HSTL/LVTTL Input and/or Output

••

•Read Enable & Read Clock Echo outputs aid high speed operation

••

•User selectable Asynchronous read and/or write port timing

••

•2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage

••

•3.3V Input tolerant

••

•Mark & Retransmit, resets read pointer to user marked position

••

•Write Chip Select (WCS) input disables Write Port HSTL inputs

••

•Read Chip Select (RCS) synchronous to RCLK

••

•Programmable Almost-Empty and Almost-Full flags, each flag can

default to one of eight preselected offsets

••

•Program programmable flags by either serial or parallel means

••

•Selectable synchronous/asynchronous timing modes for Almost-

Empty and Almost-Full flags

••

•Separate SCLK input for Serial programming of flag offsets

••

•User selectable input and output port bus-sizing

- x72 in to x72 out

- x72 in to x36 out

- x72 in to x18 out

- x36 in to x72 out

- x18 in to x72 out

••

•Big-Endian/Little-Endian user selectable byte representation

••

•Auto power down minimizes standby power consumption

••

•Master Reset clears entire FIFO

••

•Partial Reset clears data, but retains programmable settings

••

•Empty, Full and Half-Full flags signal FIFO status

••

•Select IDT Standard timing (using EF and FF flags) or First Word

Fall Through timing (using OR and IR flags)

••

•Output enable puts data outputs into high impedance state

••

•JTAG port, provided for Boundary Scan function

••

•Available in 324-pin (19mm x 19mm)Plastic Ball Grid Array (PBGA)

••

•Easily expandable in depth and width

••

•Independent Read and Write Clocks (permit reading and writing

simultaneously)

••

•High-performance submicron CMOS technology

••

•Industrial temperature range (–40°°

°°

°C to +85°°

°°

°C) is available

••

•Green parts are available, see ordering information

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

PIN CONFIGURATION

D21

D19 D20 D13

GND

TDO

D4 TMS

D5D10

D23

D22

Q24

Q14GND Q0 Q2 Q11Q8Q3

DDQ

GND V

DDQ

D60

D57

D59

D51

D48

D45

D24

D64

GND

GND GND

GND

D69

REN

GND

PAF

EREN Q64

RCLKD63 D66

D39

Q69 Q66

Q65

Q52

Q49

Q46

12 345678910111213141516

A1 BALL PAD CORNER

MRS

D67

D38

D35

D32

D29

D26

D44

D41

D36

D33

D30

D27

D56

D53

D50

D47

SEN

D43

D37

D40

D34

D31

D28

D25 Q27

Q43

Q40

Q39

Q36

Q33

Q30

RCS Q67Q70

D52

D49

D46

SCLK

D42

D58 D62 D70

WCS

D65 D71D68 PAELD HF

GND Q68MARK Q71

SHSTLFWFT/SI FS0OW IPFS1 BE

GND PFMBM ASYR

RHSTL

DDQ

WHSTL

ASYW

VREF

D61

Q58

Q55D54

WEN GND

WCLK PRS

D55

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D18

D16 D15

TDI

TCK

TRST

D6 D0

D9D12

D14D17

Q15

Q16GND ERCLK Q4 Q13Q10Q7

Q5D11 D8D7 GND Q6Q1 Q9 Q12

17 18

Q22

Q20Q21

Q23

DDQ

Q63

Q62

Q54

Q51

Q48

Q25

Q45

Q42

Q37

Q34

Q31

Q28

Q61

Q59

Q56

Q41

Q38

Q35

Q32

Q29

Q26

Q53

Q50

Q47

Q44

Q60

Q57

Q19

DDQ

Q17

Q18

DDQ

GNDGND V

DDQ

GNDGND V

DDQ

GNDV

GNDGND GNDGND GND V

DDQ

GND

GND V

DDQ

GND GNDGND V

DDQ

GNDV

DDQ

GND V

DDQ

GNDV

GND V

DDQ

GND V

DDQ

GND V

DDQ

GND V

DDQ

PBGA: 1mm pitch, 19mm x 19mm (BB324, BBG324) Order code: BB, BBG

TOP VIEW

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

DESCRIPTION:

The IDT72T7285/72T7295/72T72105/72T72115 are exceptionally deep,

extremely high speed, CMOS First-In-First-Out (FIFO) memories with clocked

read and write controls and a flexible Bus-Matching x72/x36/x18 data flow.

These FIFOs offer several key user benefits:

• Flexible x72/x36/x18 Bus-Matching on both read and write ports

• A user selectable MARK location for retransmit

• User selectable I/O structure for HSTL or LVTTL

• Asynchronous/Synchronous translation on the read or write ports

• The first word data latency period, from the time the first word is written to an

empty FIFO to the time it can be read, is fixed and short.

• High density offerings up to 9 Mbit

Bus-Matching TeraSync FIFOs are particularly appropriate for network,

video, telecommunications, data communications and other applications that

need to buffer large amounts of data and match busses of unequal sizes.

Each FIFO has a data input port (Dn) and a data output port (Qn), both of

which can assume either a 72-bit, 36-bit or a 18-bit width as determined by the

state of external control pins Input Width (IW), Output Width (OW), and Bus-

Matching (BM) pin during the Master Reset cycle.

The input port can be selected as either a Synchronous (clocked) interface,

or Asynchronous interface. During Synchronous operation the input port is

controlled by a Write Clock (WCLK) input and a Write Enable (WEN) input. Data

present on the Dn data inputs is written into the FIFO on every rising edge of

WCLK when WEN is asserted. During Asynchronous operation only the WR

input is used to write data into the FIFO. Data is written on a rising edge of WR,

the WEN input should be tied to its active state, (LOW).

The output port can be selected as either a Synchronous (clocked) interface,

or Asynchronous interface. During Synchronous operation the output port is

controlled by a Read Clock (RCLK) input and Read Enable (REN) input. Data

is read from the FIFO on every rising edge of RCLK when REN is asserted.

During Asynchronous operation only the RD input is used to read data from the

FIFO. Data is read on a rising edge of RD, the REN input should be tied to its

active state, LOW. When Asynchronous operation is selected on the output port

the FIFO must be configured for Standard IDT mode, also the RCS should be

tied LOW and the OE input used to provide three-state control of the outputs, Qn.

The output port can be selected for either 2.5V LVTTL or HSTL operation,

this operation is selected by the state of the RHSTL input during a master reset.

An Output Enable (OE) input is provided for three-state control of the outputs.

A Read Chip Select (RCS) input is also provided, the RCS input is synchronized

to the read clock, and also provides three-state control of the Qn data outputs.

When RCS is disabled, the data outputs will be high impedance. During

Asynchronous operation of the output port, RCS should be enabled, held LOW.

Echo Read Enable, EREN and Echo Read Clock, ERCLK outputs are

provided. These are outputs from the read port of the FIFO that are required

for high speed data communication, to provide tighter synchronization between

the data being transmitted from the Qn outputs and the data being received by

the input device. Data read from the read port is available on the output bus with

respect to EREN and ERCLK, this is very useful when data is being read at

high speed. The ERCLK and EREN outputs are non-functional when the Read

port is setup for Asynchronous mode.

The frequencies of both the RCLK and the WCLK signals may vary from 0

to fMAX with complete independence. There are no restrictions on the frequency

of the one clock input with respect to the other.

There are two possible timing modes of operation with these devices: IDT

Standard mode and First Word Fall Through (FWFT) mode.

In IDT Standard mode, the first word written to an empty FIFO will not appear

on the data output lines unless a specific read operation is performed. A read

operation, which consists of activating REN and enabling a rising RCLK edge,

will shift the word from internal memory to the data output lines.

In FWFT mode, the first word written to an empty FIFO is clocked directly

to the data output lines after three transitions of the RCLK signal. A REN does

not have to be asserted for accessing the first word. However, subsequent

words written to the FIFO do require a LOW on REN for access. The state of

the FWFT/SI input during Master Reset determines the timing mode in use.

For applications requiring more data storage capacity than a single FIFO

can provide, the FWFT timing mode permits depth expansion by chaining FIFOs

in series (i.e. the data outputs of one FIFO are connected to the corresponding

data inputs of the next). No external logic is required.

These FIFOs have five flag pins, EF/OR (Empty Flag or Output Ready),

FF/IR (Full Flag or Input Ready), HF (Half-full Flag), PAE (Programmable

Almost-Empty flag) and PAF (Programmable Almost-Full flag). The EF and FF

functions are selected in IDT Standard mode. The IR and OR functions are

selected in FWFT mode. HF, PAE and PAF are always available for use,

irrespective of timing mode.

PAE and PAF can be programmed independently to switch at any point in

memory. Programmable offsets determine the flag switching threshold and can

be loaded by two methods: parallel or serial. Eight default offset settings are also

provided, so that PAE can be set to switch at a predefined number of locations

from the empty boundary and the PAF threshold can also be set at similar

predefined values from the full boundary. The default offset values are set during

Master Reset by the state of the FSEL0, FSEL1, and LD pins.

For serial programming, SEN together with LD on each rising edge of

SCLK, are used to load the offset registers via the Serial Input (SI). For parallel

programming, WEN together with LD on each rising edge of WCLK, are used

to load the offset registers via Dn. REN together with LD on each rising edge

of RCLK can be used to read the offsets in parallel from Qn regardless of whether

serial or parallel offset loading has been selected.

During Master Reset (MRS) the following events occur: the read and write

pointers are set to the first location of the FIFO. The FWFT pin selects IDT

Standard mode or FWFT mode.

The Partial Reset (PRS) also sets the read and write pointers to the first

location of the memory. However, the timing mode, programmable flag

programming method, and default or programmed offset settings existing before

Partial Reset remain unchanged. The flags are updated according to the timing

mode and offsets in effect. PRS is useful for resetting a device in mid-operation,

when reprogramming programmable flags would be undesirable.

It is also possible to select the timing mode of the PAE (Programmable Almost-

Empty flag) and PAF (Programmable Almost-Full flag) outputs. The timing

modes can be set to be either asynchronous or synchronous for the PAE and

PAF flags.

If asynchronous PAE/PAF configuration is selected, the PAE is asserted

LOW on the LOW-to-HIGH transition of RCLK. PAE is reset to HIGH on the LOW-

to-HIGH transition of WCLK. Similarly, the PAF is asserted LOW on the LOW-

to-HIGH transition of WCLK and PAF is reset to HIGH on the LOW-to-HIGH

transition of RCLK.

If synchronous PAE/PAF configuration is selected , the PAE is asserted and

updated on the rising edge of RCLK only and not WCLK. Similarly, PAF is

asserted and updated on the rising edge of WCLK only and not RCLK. The mode

desired is configured during Master Reset by the state of the Programmable Flag

Mode (PFM) pin.

This device includes a Retransmit from Mark feature that utilizes two control

inputs, MARK and , RT (Retransmit). If the MARK input is enabled with respect

to the RCLK, the memory location being read at that point will be marked. Any

subsequent retransmit operation, RT goes LOW, will reset the read pointer to

this ‘marked’ location.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

DESCRIPTION (CONTINUED)

The device can be configured with different input and output bus widths as

shown in Table 1.

A Big-Endian/Little-Endian data word format is provided. This function is

useful when data is written into the FIFO in long word format (x36/x18) and read

out of the FIFO in small word (x18/x9) format. If Big-Endian mode is selected,

then the most significant byte (word) of the long word written into the FIFO will

be read out of the FIFO first, followed by the least significant byte. If Little-Endian

format is selected, then the least significant byte of the long word written into the

FIFO will be read out first, followed by the most significant byte. The mode desired

is configured during master reset by the state of the Big-Endian (BE) pin. See

Figure 5 for Bus-Matching Byte Arrangement.

The Interspersed/Non-Interspersed Parity (IP) bit function allows the user

to select the parity bit in the word loaded into the parallel port (D0-Dn) when

programming the flag offsets. If Interspersed Parity mode is selected, then the

FIFO will assume that the parity bit is located in bit positions D8, D17, D26 and

D35 during the parallel programming of the flag offsets. If Non-Interspersed

Parity mode is selected, then D8 and D17 are assumed to be valid bits. IP mode

is selected during Master Reset by the state of the IP input pin.

If, at any time, the FIFO is not actively performing an operation, the chip will

automatically power down. Once in the power down state, the standby supply

current consumption is minimized. Initiating any operation (by activating control

inputs) will immediately take the device out of the power down state.

Both an Asynchronous Output Enable pin (OE) and Synchronous Read

Chip Select pin (RCS) are provided on the FIFO. The Synchronous Read Chip

Select is synchronized to the RCLK. Both the output enable and read chip select

control the output buffer of the FIFO, causing the buffer to be either HIGH

impedance or LOW impedance.

A JTAG test port is provided, here the FIFO has fully functional Boundary

Scan feature, compliant with IEEE 1449.1 Standard Test Access Port and

Boundary Scan Architecture.

The TeraSync FIFO has the capability of operating its ports (write and/or

read) in either LVTTL or HSTL mode, each ports selection independent of the

other. The write port selection is made via WHSTL and the read port selection

via RHSTL. An additional input SHSTL is also provided, this allows the user

to select HSTL operation for other pins on the device (not associated with the

write or read ports).

The IDT72T7285/72T7295/72T72105/72T72115 are fabricated using

high speed submicron CMOS technology.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

TABLE 1 — BUS-MATCHING CONFIGURATION MODES

NOTE:

1. Pin status during Master Reset.

Figure 1. Single Device Configuration Signal Flow Diagram

(x72, x36, x18) DATA OUT (Q

- Q

)(x72, x36, x18) DATA IN (D

- D

)

MASTER RESET (MRS)

READ CLOCK (RCLK/RD)

READ ENABLE (REN)

OUTPUT ENABLE (OE)

EMPTY FLAG/OUTPUT READY (EF/OR)

PROGRAMMABLE ALMOST-EMPTY (PAE)

WRITE CLOCK (WCLK/WR)

WRITE ENABLE (WEN)

LOAD (LD)

FULL FLAG/INPUT READY (FF/IR)

PROGRAMMABLE ALMOST-FULL (PAF)

IDT

72T7285

72T7295

72T72105

72T72115

PARTIAL RESET (PRS)

FIRST WORD FALL THROUGH/

SERIAL INPUT (FWFT/SI) RETRANSMIT (RT)

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HALF-FULL FLAG (HF)

SERIAL ENABLE(SEN)

INPUT WIDTH (IW) OUTPUT WIDTH (OW)

BIG-ENDIAN/LITTLE-ENDIAN (BE)

INTERSPERSED/

NON-INTERSPERSED PARITY (IP)

BUS-

MATCHING

(BM)

SERIAL CLOCK (SCLK)

MARK

READ CHIP SELECT (RCS)

RCLK ECHO, ERCLK

REN ECHO, EREN

WRITE CHIP SELECT (WCS)

BM IW OW Write Port Width Read Port Width

L L L x72 x72

H L L x72 x36

H L H x72 x18

H H L x36 x72

H H H x18 x72

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

PIN DESCRIPTION

Symbol Name I/O TYPE Description

ASYR(1) Asynchronous LVTTL A HIGH on this input during Master Reset will select Synchronous read operation for the output port. A LOW

Read Port INPUT will select Asynchronous operation. If Asynchronous is selected the FIFO must operate in IDT Standard mode.

ASYW(1) Asynchronous LVTTL A HIGH on this input during Master Reset will select Synchronous write operation for the input port. A LOW

Write Port INPUT will select Asynchronous operation.

BE(1) Big-Endian/ LVTTL During Master Reset, a LOW on BE will select Big-Endian operation. A HIGH on BE during Master Reset

Little-Endian INPUT will select Little-Endian format.

BM(1) Bus-Matching LVTTL BM works with IW and OW to select the bus sizes for both write and read ports. See Table 1 for bus size

INPUT configuration.

D0–D71 Data Inputs HSTL-LVTTL Data inputs for a 72-, 36- or 18-bit bus. When in 36- or 18-bit mode, the unused input pins are in a don’t care

INPUT state.

EF/OR Empty Flag/ HSTL-LVTTL In the IDT Standard mode, the EF function is selected. EF indicates whether or not the FIFO memory is empty.

Output Ready OUTPUT In FWFT mode, the OR function is selected. OR indicates whether or not there is valid data available at the

outputs.

ERCLK RCLK Echo HSTL-LVTTL Read clock Echo output, only available when the Read is setup for Synchronous mode.

OUTPUT

EREN Read Enable Echo HSTL-LVTTL Read Enable Echo output, only available when the Read is setup for Synchronous mode.

OUTPUT

FF/IR Full Flag/ HSTL-LVTTL In the IDT Standard mode, the FF function is selected. FF indicates whether or not the FIFO memory is

Input Ready OUTPUT full. In the FWFT mode, the IR function is selected. IR indicates whether or not there is space available for

writing to the FIFO memory.

FSEL0(1) Flag Select Bit 0 LVTTL During Master Reset, this input along with FSEL1 and the LD pin, will select the default offset values for the

INPUT programmable flags PAE and PAF. There are up to eight possible settings available.

FSEL1(1) Flag Select Bit 1 LVTTL During Master Reset, this input along with FSEL0 and the LD pin will select the default offset values for the

INPUT programmable flags PAE and PAF. There are up to eight possible settings available.

FWFT/ First Word Fall HSTL-LVTTL During Master Reset, selects First Word Fall Through or IDT Standard mode. After Master Reset, this pin

SI Through/Serial In INPUT functions as a serial input for loading offset registers. If Asynchronous operation of the read port has been

selected then the FIFO must be set-up in IDT Standard mode.

HF Half-Full Flag HSTL-LVTTL HF indicates whether the FIFO memory is more or less than half-full.

OUTPUT

IP(1) Interspersed Parity LVTTL During Master Reset, a LOW on IP will select Non-Interspersed Parity mode. A HIGH will select Interspersed

INPUT Parity mode.

IW(1) Input Width LVTTL This pin, along with OW and BM, selects the bus width of the write port. See Table 1 for bus size configuration.

INPUT

LD Load HSTL-LVTTL This is a dual purpose pin. During Master Reset, the state of the LD input along with FSEL0 and FSEL1,

INPUT determines one of eight default offset values for the PAE and PAF flags, along with the method by which these

offset registers can be programmed, parallel or serial (see Table 2). After Master Reset, this pin enables writing

to and reading from the offset registers. THIS PIN MUST BE HIGH AFTER MASTER RESET TO WRITE OR

READ DATA TO/FROM THE FIFO MEMORY.

MARK Mark for Retransmit HSTL-LVTTL When this pin is asserted the current location of the read pointer will be marked. Any subsequent Retransmit

INPUT operation will reset the read pointer to this position.

MRS Master Reset HSTL-LVTTL MRS initializes the read and write pointers to zero and sets the output register to all zeroes. During Master

INPUT Reset, the FIFO is configured for either FWFT or IDT Standard mode, Bus-Matching configurations,

Synchronous/Asynchronous operation of the read or write port, one of eight programmable flag default settings,

serial or parallel programming of the offset settings, Big-Endian/Little-Endian format, zero latency timing mode,

interspersed parity, and synchronous versus asynchronous programmable flag timing modes.

OE Output Enable HSTL-LVTTL OE provides Asynchronous three-state control of the data outputs, Qn. During a Master or Partial Reset the

INPUT OE input is the only input that provide High-Impedance control of the data outputs.

OW(1) Output Width LVTTL This pin, along with IW and BM, selects the bus width of the read port. See Table 1 for bus size configuration.

INPUT

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

PIN DESCRIPTION (CONTINUED)

Symbol Name I/O TYPE Description

PAE Programmable HSTL-LVTTL PAE goes LOW if the number of words in the FIFO memory is less than offset n, which is stored in the

Almost-Empty Flag OUTPUT Empty Offset register. PAE goes HIGH if the number of words in the FIFO memory is greater than or equal

to offset n.

PAF Programmable HSTL-LVTTL PAF goes HIGH if the number of free locations in the FIFO memory is more than offset m, which is stored in

Almost-Full Flag OUTPUT the Full Offset register. PAF goes LOW if the number of free locations in the FIFO memory is less than or equal

to m.

PFM(1) Programmable LVTTL During Master Reset, a LOW on PFM will select Asynchronous Programmable flag timing mode. A HIGH on

Flag Mode INPUT PFM will select Synchronous Programmable flag timing mode.

PRS Partial Reset HSTL-LVTTL PRS initializes the read and write pointers to zero and sets the output register to all zeroes. During Partial Reset,

INPUT the existing mode (IDT or FWFT), programming method (serial or parallel), and programmable flag settings

are all retained.

Q0–Q71 Data Outputs HSTL-LVTTL Data outputs for an 72-, 36- or 18-bit bus. When in 36- or 18-bit mode, any unused output pins should not

OUTPUT be connected. Outputs are not 3.3V tolerant regardless of the state of OE and RCS.

RCLK/ Read Clock/ HSTL-LVTTL If Synchronous operation of the read port has been selected, when enabled by REN, the rising edge of RCLK

RD Read Strobe INPUT reads data from the FIFO memory and offsets from the programmable registers. If LD is LOW, the values loaded

into the offset registers is output on a rising edge of RCLK. If Asynchronous operation of the read port has

been selected, a rising edge on RD reads data from the FIFO in an Asynchronous manner. REN should be

tied LOW.

RCS Read Chip Select HSTL-LVTTL RCS provides synchronous control of the read port and output impedance of Qn, synchronous to RCLK. During

INPUT a Master Reset or Partial Reset the RCS input is don’t care, if OE is LOW the data outputs will be Low-Impedance

regardless of RCS.

REN Read Enable HSTL-LVTTL If Synchronous operation of the read port has been selected, REN enables RCLK for reading data from the

INPUT FIFO memory and offset registers. If Asynchronous operation of the read port has been selected, the REN

input should be tied LOW.

RHSTL(1) Read Port HSTL LVTTL This pin is used to select HSTL or 2.5V LVTTL outputs for the FIFO. If HSTL or eHSTL outputs are

Select INPUT required, this input must be tied HIGH. Otherwise it should be tied LOW.

RT Retransmit HSTL-LVTTL RT asserted on the rising edge of RCLK initializes the READ pointer to zero, sets the EF flag to LOW (OR to

INPUT HIGH in FWFT mode) and doesn’t disturb the write pointer, programming method, existing timing mode or

programmable flag settings. If a mark has been set via the MARK input pin, then the read pointer will jump to

the ‘mark’ location.

SCLK Serial Clock HSTL-LVTTL A rising edge on SCLK will clock the serial data present on the SI input into the offset registers providing that

INPUT SEN is enabled.

SEN Serial Enable HSTL-LVTTL SEN enables serial loading of programmable flag offsets.

INPUT

SHSTL System HSTL LVTTL All inputs not associated with the write or read port can be selected for HSTL operation via the SHSTL input.

Select INPUT

TCK(2) JTAG Clock HSTL-LVTTL Clock input for JTAG function. One of four terminals required by IEEE Standard 1149.1-1990. Test operations

INPUT of the device are synchronous to TCK. Data from TMS and TDI are sampled on the rising edge of TCK and

outputs change on the falling edge of TCK. If the JTAG function is not used this signal needs to be tied to GND.

TDI(2) JTAG Test Data HSTL-LVTTL One of four terminals required by IEEE Standard 1149.1-1990. During the JTAG boundary scan operation,

Input INPUT test data serially loaded via the TDI on the rising edge of TCK to either the Instruction Register, ID Register

and Bypass Register. An internal pull-up resistor forces TDI HIGH if left unconnected.

TDO(2) JTAG Test Data HSTL-LVTTL One of four terminals required by IEEE Standard 1149.1-1990. During the JTAG boundary scan operation,

Output OUTPUT test data serially loaded output via the TDO on the falling edge of TCK from either the Instruction Register, ID

SHIFT-IR controller states.

TMS(2) JTAG Mode HSTL-LVTTL TMS is a serial input pin. One of four terminals required by IEEE Standard 1149.1-1990. TMS directs the

Select INPUT the device through its TAP controller states. An internal pull-up resistor forces TMS HIGH if left unconnected.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

TRST(2) JTAG Reset HSTL-LVTTL TRST is an asynchronous reset pin for the JTAG controller. The JTAG TAP controller does not automatically

INPUT reset upon power-up, thus it must be reset by either this signal or by setting TMS= HIGH for five TCK cycles.

If the TAP controller is not properly reset then the FIFO outputs will always be in high-impedance. If the JTAG

function is used but the user does not want to use TRST, then TRST can be tied with MRS to ensure proper

FIFO operation. If the JTAG function is not used then this signal needs to be tied to GND.

WEN Write Enable HSTL-LVTTL When Synchronous operation of the write port has been selected, WEN enables WCLK for writing data into

INPUT the FIFO memory and offset registers. If Asynchronous operation of the write port has been selected, the

WEN input should be tied LOW.

WCS Write Chip Select HSTL-LVTTL This pin disables the write port data inputs when the device write port is configured for HSTL mode. This

INPUT provides added power savings.

WCLK/ Write Clock/ HSTL-LVTTL If Synchronous operation of the write port has been selected, when enabled by WEN, the rising edge of WCLK

WR Write Strobe INPUT writes data into the FIFO. If Asynchronous operation of the write port has been selected, WR writes data into

the FIFO on a rising edge in an Asynchronous manner, (WEN should be tied to its active state).

WHSTL(1) Write Port HSTL LVTTL This pin is used to select HSTL or 2.5V LVTTL inputs for the FIFO. If HSTL inputs are required, this input must

Select INPUT be tied HIGH. Otherwise it should be tied LOW.

VCC +2.5v Supply I These are Vcc supply inputs and must be connected to the 2.5V supply rail.

GND Ground Pin I These are Ground pins and must be connected to the GND rail.

Vref Reference I This is a Voltage Reference input and must be connected to a voltage level determined from the table,

Voltage “Recommended DC Operating Conditions”. This provides the reference voltage when using HSTL class

inputs. If HSTL class inputs are not being used, this pin should be tied LOW.

VDDQ O/P Rail Voltage I This pin should be tied to the desired voltage rail for providing power to the output drivers.

PIN DESCRIPTION (CONTINUED)

Symbol Name I/O TYPE Description

NOTES:

1. Inputs should not change state after Master Reset.

2. These pins are for the JTAG port. Please refer to pages 29-31 and Figures 6-8.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Symbol Rating Commercial Unit

VTERM Terminal Voltage –0.5 to +3.6(2) V

with respect to GND

TSTG Storage Temperature –55 to +125 °C

IOUT DC Output Current –50 to +50 mA

DC ELECTRICAL CHARACTERISTICS

(Commercial: VCC = 2.5V ± 0.125V, TA = 0°C to +70°C;Industrial: VCC = 2.5V ± 0.125V, TA = -40°C to +85°C)

Symbol Parameter Min. Typ. Max. Unit

VCC Supply Voltage 2.375 2.5 2.625 V

GND Supply Voltage 0 0 0 V

VIH Input High Voltage ⎯ LVTTL 1.7 — 3.45 V

⎯ eHSTL VREF+0.2 — VDDQ+0.3 V

⎯ HSTL VREF+0.2 — VDDQ+0.3 V

VIL Input Low Voltage ⎯ LVTTL -0.3 — 0.7 V

⎯ eHSTL -0.3 — VREF-0.2 V

⎯ HSTL -0.3 — VREF-0.2 V

VREF(1) Voltage Reference Input ⎯ eHSTL 0 .8 0.9 1.0 V

⎯ HSTL 0.68 0.75 0.9 V

TAOperating Temperature Commercial 0 — 70 °C

TAOperating Temperature Industrial -40 — 85 °C

Symbol Parameter Min. Max. Unit

ILI Input Leakage Current –10 10 μA

ILO Output Leakage Current –10 10 μA

VOH(5) Output Logic “1” Voltage, IOH = –8 mA @VDDQ = 2.5V ± 0.125V (LVTTL) VDDQ -0.4 — V

IOH = –8 mA @VDDQ = 1.8V ± 0.1V (eHSTL) VDDQ -0.4 — V

IOH = –8 mA @VDDQ = 1.5V ± 0.1V (HSTL) VDDQ -0.4 — V

VOL Output Logic “0” Voltage, IOL = 8 mA @VDDQ = 2.5V ± 0.125V (LVTTL) — 0.4V V

IOL = 8 mA @VDDQ = 1.8V ± 0.1V (eHSTL) — 0.4V V

IOL = 8 mA @VDDQ = 1.5V ± 0.1V (HSTL) — 0.4V V

ICC1(1,2) Active VCC Current (VCC = 2.5V) I/O = LVTTL — 80 mA

I/O = HSTL — 130 m A

I/O = eHSTL — 130 mA

ICC2(1) Standby VCC Current (VCC = 2.5V) I/O = LVTTL — 20 mA

I/O = HSTL — 90 mA

I/O = eHSTL — 90 mA

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED DC OPERATING CONDITIONS

NOTES:

1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause

permanent damage to the device. This is a stress rating only and functional operation

of the device at these or any other conditions above those indicated in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect reliability.

2. Compliant with JEDEC JESD8-5. VCC terminal only.

NOTE:

1. VREF is only required for HSTL or eHSTL inputs. VREF should be tied LOW for LVTTL operation.

2. Outputs are not 3.3V tolerant.

Symbol Parameter(1) Conditions Max. Unit

CIN(2,3) Input VIN = 0V 10(3) pF

Capacitance

COUT(1,2) Output VOUT = 0V 10 pF

Capacitance

NOTES:

1 . Both WCLK and RCLK toggling at 20MHz. Data inputs toggling at 10MHz. WCS = HIGH, REN or RCS = HIGH.

2. Typical ICC1 calculation:for LVTTL I/O ICC1 (mA) = 2.24mA x fs, fs = WCLK frequency = RCLK frequency (in MHz)

for HSTL or eHSTL I/O ICC1 (mA) = 55mA + (2.24mA x fs), fs = WCLK frequency = RCLK frequency (in MHz)

3. Typical IDDQ calculation: With Data Outputs in High-Impedance: IDDQ (mA) = 0.15mA x fs

With Data Outputs in Low-Impedance: IDDQ (mA) = (CL x VDDQ x fs x N)/2000

fs = WCLK frequency = RCLK frequency (in MHz), VDDQ = 2.5V for LVTTL; 1.5V for HSTL; 1.8V for eHSTL, N = Number of outputs switching.

tA = 25°C, CL = capacitive load (pf).

4 . Total Power consumed: PT = (VCC x ICC) + VDDQ x IDDQ).

5. Outputs are not 3.3V tolerant.

CAPACITANCE (TA = +25°C, f = 1.0MHz)

NOTES:

1. With output deselected, (OE ≥ VIH).

2. Characterized values, not currently tested.

3. CIN for Vref is 20pF.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

AC ELECTRICAL CHARACTERISTICS(1) — SYNCHRONOUS TIMING

(Commercial: VCC = 2.5V ± 5%, TA = 0°C to +70°C;Industrial: VCC = 2.5V ± 5%, TA = -40 °C to +85°C)

NOTES:

1. All AC timings apply to both Standard IDT mode and First Word Fall Through mode.

2. Pulse widths less than minimum values are not allowed.

3. Values guaranteed by design, not currently tested.

4. Industrial temperature range product for the 5ns speed grade is available as a standard device. All other speed grades are available by special order.

Commercial Com’l & Ind’l Commercial

IDT72T7285L4-4 IDT72T7285L5 IDT72T7285L6-7 IDT72T7285L10

IDT72T7295L4-4 IDT72T7295L5 IDT72T7295L6-7 IDT72T7295L10

IDT72T72105L4-4 IDT72T72105L5 IDT72T72105L6-7 IDT72T72105L10

IDT72T72115L4-4 IDT72T72115L5 IDT72T72115L6-7 IDT72T72115L10

Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit

fCClock Cycle Frequency (Synchronous) — 2 25 — 2 00 — 1 50 100 MHz

tAData Access Time 0.6 3.4 0.6 3.6 0.6 3.8 0.6 4.5 ns

tCLK Clock Cycle Time 4.44 — 5 — 6.7 — 10 — ns

tCLKH Clock High Time 2. 0 — 2. 3 — 2. 8 — 4. 5 — ns

tCLKL Clock Low Time 2 .0 — 2 .3 — 2 . 8 — 4 .5 — ns

tDS Data Setup Time 1.2 — 1.5 — 2.0 — 3.0 — ns

tDH Data Hold Time 0.5 — 0.5 — 0.5 — 0.5 — ns

tENS Enable Setup Time 1.2 — 1.5 — 2.0 — 3.0 — ns

tENH Enable Hold Time 0.5 — 0.5 — 0.5 — 0.5 — ns

tLDS Load Setup Time 1.2 — 1.5 — 2.0 — 3.0 — ns

tLDH Load Hold Time 0.5 — 0.5 — 0.5 — 0.5 — ns

tWCSS WCS setup time 1.2 — 1.5 — 2.0 — 3.0 — ns

tWCSH WCS hold time 0.5 — 0.5 — 0.5 — 0.5 — ns

fSClock Cycle Frequency (SCLK) — 10 — 10 — 10 — 10 M H z

tSCLK Serial Clock Cycle 100 — 100 — 100 — 100 — ns

tSCKH Serial Clock High 45 — 45 — 45 — 45 — ns

tSCKL Serial Clock Low 45 — 45 — 45 — 45 — ns

tSDS Serial Data In Setup 15 — 15 — 15 — 15 — ns

tSDH Serial Data In Hold 5 — 5 — 5 — 5 — ns

tSENS Serial Enable Setup 5 — 5 — 5 — 5 — ns

tSENH Serial Enable Hold 5 — 5 — 5 — 5 — ns

tRS Reset Pulse Width(2) 30 — 30 — 30 — 30 — ns

tRSS Reset Setup Time 15 — 15 — 15 — 15 — ns

tHRSS HSTL Reset Setup Time 4 — 4 — 4 — 4 — μs

tRSR Reset Recovery Time 10 — 10 — 10 — 10 — ns

tRSF Reset to Flag and Output Time — 10 — 12 — 1 5 — 15 ns

tWFF Write Clock to FF or IR — 3.4 — 3.6 — 3.8 — 4.5 ns

tREF Read Clock to EF or OR — 3.4 — 3.6 — 3.8 — 4.5 ns

tPAFS Write Clock to Synchronous Programmable Almost-Full Flag — 3.4 — 3.6 — 3.8 — 4.5 ns

tPAES Read Clock to Synchronous Programmable Almost-Empty Flag — 3.4 — 3.6 — 3.8 — 4.5 ns

tERCLK RCLK to Echo RCLK output — 3. 8 — 4 — 4. 3 — 5 ns

tCLKEN RCLK to Echo REN output — 3. 4 — 3. 6 — 3 .8 — 4.5 ns

tRCSLZ RCLK to Active from High-Z(3) — 3.4 — 3.6 — 3.8 — 4.5 ns

tRCSHZ RCLK to High-Z(3) — 3.4 — 3.6 — 3.8 — 4.5 ns

tSKEW1 Skew time between RCLK and WCLK for EF/OR and FF/IR 3.5— 4 —5 —7 —ns

tSKEW2 Skew time between RCLK and WCLK for PAE and PAF 4—5—6 —8—ns

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

AC ELECTRICAL CHARACTERISTICS — ASYNCHRONOUS TIMING

(Commercial: VCC = 2.5V ± 5%, TA = 0°C to +70°C;Industrial: VCC = 2.5V ± 5%, TA = -40 °C to +85°C)

Commercial Com’l & Ind’l Commercial

IDT72T7285L4-4 IDT72T7285L5 IDT72T7285L6-7 IDT72T7285L10

IDT72T7295L4-4 IDT72T7295L5 IDT72T7295L6-7 IDT72T7295L10

IDT72T72105L4-4 IDT72T72105L5 IDT72T72105L6-7 IDT72T72105L10

IDT72T72115L4-4 IDT72T72115L5 IDT72T72115L6-7 IDT72T72115L10

Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit

fACycle Frequency (Asynchronous) — 1 0 0 — 8 3 — 6 6 — 5 0 MHz

tAA Data Access Time 0.6 8 0.6 10 0.6 1 2 0.6 14 ns

tCYC Cycle Time 10 — 12 — 15 — 20 — ns

tCYH Cycle HIGH Time 4.5 — 5 — 7 — 8 — ns

tCYL Cycle LOW Time 4 .5 — 5 — 7 — 8 — n s

tRPE Read Pulse after EF HIGH 8 — 10 — 12 — 14 — ns

tFFA Clock to Asynchronous FF — 8—10—12 —14ns

tEFA Clock to Asynchronous EF — 8—10—12 —14ns

tPAFA Clock to Asynchronous Programmable Almost-Full Flag — 8 — 10 — 12 — 14 ns

tPAEA Clock to Asynchronous Programmable Almost-Empty Flag — 8 — 10 — 12 — 14 ns

tOLZ Output Enable to Output in Low Z(1) 0—0—0— 0—ns

tOE Output Enable to Output Valid — 3.4 — 3.6 — 3.8 — 4.5 ns

tOHZ Output Enable to Output in High Z(1) — 3.4 — 3.6 — 3.8 — 4.5 ns

tHF Clock to HF — 8—10—12 —14ns

NOTES:

1. Values guaranteed by design, not currently tested.

2. Industrial temperature range product for the 5ns speed grade is available as a standard device. All other speed grades are available by special order.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Input Pulse Levels 0.25 to 1.25V

Input Rise/Fall Times 0.4ns

Input Timing Reference Levels 0.75

Output Reference Levels VDDQ/2

HSTL

1.5V AC TEST CONDITIONS

Figure 2b. Lumped Capacitive Load, Typical Derating

AC TEST LOADS

Figure 2a. AC Test Load

Input Pulse Levels 0.4 to 1.4V

Input Rise/Fall Times 0.4ns

Input Timing Reference Levels 0.9

Output Reference Levels VDDQ/2

EXTENDED HSTL

1.8V AC TEST CONDITIONS

Input Pulse Levels GND to 2.5V

Input Rise/Fall Times 1ns

Input Timing Reference Levels VCC/2

Output Reference Levels VDDQ/2

2.5V LVTTL

2.5V AC TEST CONDITIONS

5994 drw04

VDDQ/2

I/O Z

= 50

5994 drw04a

20 30 50 80 100 200

acitance

)

tCD

(Typical, ns)

NOTE:

1. VDDQ = 1.5V±.

NOTE:

1. VDDQ = 1.8V±.

NOTE:

1. For LVTTL VCC = VDDQ.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

OUTPUT ENABLE & DISABLE TIMING

VIH

VIL

tOE & tOLZ

VCC

100mV

tOHZ

100mV

Output

Normally

LOW

Output

Normally

HIGH

VOL

VOH

VCC

5994 drw04b

Output

Enable

Output

Disable

READ CHIP SELECT ENABLE & DISABLE TIMING

RCS

tENS

tENH

tRCSLZ

RCLK

VCC

100mV

tRCSHZ

100mV

Output

Normally

LOW

Output

Normally

HIGH

VCC

5994 drw04c

NOTES:

1. REN is HIGH.

2. RCS is LOW.

NOTES:

1. REN is HIGH.

2. OE is LOW.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

FUNCTIONAL DESCRIPTION

TIMING MODES: IDT STANDARD vs FIRST WORD FALL THROUGH

(FWFT) MODE

The IDT72T7285/72T7295/72T72105/72T72115 support two different

timing modes of operation: IDT Standard mode or First Word Fall Through

(FWFT) mode. The selection of which mode will operate is determined during

Master Reset, by the state of the FWFT/SI input.

If, at the time of Master Reset, FWFT/SI is LOW, then IDT Standard mode

will be selected. This mode uses the Empty Flag (EF) to indicate whether or not

there are any words present in the FIFO. It also uses the Full Flag function (FF)

to indicate whether or not the FIFO has any free space for writing. In IDT

Standard mode, every word read from the FIFO, including the first, must be

requested using the Read Enable (REN) and RCLK.

If, at the time of Master Reset, FWFT/SI is HIGH, then FWFT mode will be

selected. This mode uses Output Ready (OR) to indicate whether or not there

is valid data at the data outputs (Qn). It also uses Input Ready (IR) to indicate

whether or not the FIFO has any free space for writing. In the FWFT mode, the

first word written to an empty FIFO goes directly to Qn after three RCLK rising

edges, REN = LOW is not necessary. Subsequent words must be accessed

using the Read Enable (REN) and RCLK.

Various signals, both input and output signals operate differently depending

on which timing mode is in effect.

IDT STANDARD MODE

In this mode, the status flags, FF, PAF, HF, PAE, and EF operate in the

manner outlined in Table 3. To write data into to the FIFO, Write Enable (WEN)

must be LOW. Data presented to the DATA IN lines will be clocked into the FIFO

on subsequent transitions of the Write Clock (WCLK). After the first write is

performed, the Empty Flag (EF) will go HIGH. Subsequent writes will continue

to fill up the FIFO. The Programmable Almost-Empty flag (PAE) will go HIGH

after n + 1 words have been loaded into the FIFO, where n is the empty offset

value. The default setting for these values are stated in the footnote of Table 2.

This parameter is also user programmable. See section on Programmable Flag

Offset Loading.

If one continued to write data into the FIFO, and we assumed no read

operations were taking place, the Half-Full flag (HF) would toggle to LOW once

the 8,193rd word for IDT72T7285, 16,385th word for IDT72T7295, 32,769th

word for IDT72T72105 and 65,537th word for IDT72T72115, respectively was

written into the FIFO. Continuing to write data into the FIFO will cause the

Programmable Almost-Full flag (PAF) to go LOW. Again, if no reads are

performed, the PAF will go LOW after (16,384-m) writes for the IDT72T7285,

(32,768-m) writes for the IDT72T7295, (65,536-m) writes for the IDT72T72105

and (131,072-m) writes for the IDT72T72115. The offset “m” is the full offset

value. The default setting for these values are stated in the footnote of Table 2.

This parameter is also user programmable. See section on Programmable Flag

Offset Loading.

When the FIFO is full, the Full Flag (FF) will go LOW, inhibiting further write

operations. If no reads are performed after a reset, FF will go LOW after D writes

to the FIFO. D = 16,384 writes for the IDT72T7285, 32,768 writes for the

IDT72T7295, 65,536 writes for the IDT72T72105 and 131,072 writes for the

IDT72T72115, respectively.

If the FIFO is full, the first read operation will cause FF to go HIGH.

Subsequent read operations will cause PAF and HF to go HIGH at the conditions

described in Table 3. If further read operations occur, without write operations,

PAE will go LOW when there are n words in the FIFO, where n is the empty

offset value. Continuing read operations will cause the FIFO to become empty.

When the last word has been read from the FIFO, the EF will go LOW inhibiting

further read operations. REN is ignored when the FIFO is empty.

When configured in IDT Standard mode, the EF and FF outputs are double

Relevant timing diagrams for IDT Standard mode can be found in Figure

11, 12, 13 and 18.

FIRST WORD FALL THROUGH MODE (FWFT)

In this mode, the status flags, IR, PAF, HF, PAE, and OR operate in the

manner outlined in Table 4. To write data into to the FIFO, WEN must be LOW.

Data presented to the DATA IN lines will be clocked into the FIFO on subsequent

transitions of WCLK. After the first write is performed, the Output Ready (OR)

flag will go LOW. Subsequent writes will continue to fill up the FIFO. PAE will go

HIGH after n + 2 words have been loaded into the FIFO, where n is the empty

offset value. The default setting for these values are stated in the footnote of

Table 2. This parameter is also user programmable. See section on Program-

mable Flag Offset Loading.

If one continued to write data into the FIFO, and we assumed no read

operations were taking place, the HF would toggle to LOW once the 8,194th

word for the IDT72T7285, 16,386th word for the IDT72T7295, 32,770th word

for the IDT72T72105 and 65,538th word for the IDT72T72115, respectively

was written into the FIFO. Continuing to write data into the FIFO will cause the

PAF to go LOW. Again, if no reads are performed, the PAF will go LOW

after (16,385-m) writes for the IDT72T7285, (32,769-m) writes for the

IDT72T7295, (65,537-m) writes for the IDT72T72105 and (131,073-m) writes

for the IDT72T72115, where m is the full offset value. The default setting for

these values are stated in the footnote of Table 2.

When the FIFO is full, the Input Ready (IR) flag will go HIGH, inhibiting further

write operations. If no reads are performed after a reset, IR will go HIGH after

D writes to the FIFO. D = 16,385 writes for the IDT72T7285, 32,769 writes for

the IDT72T7295, 65,537 writes for the IDT72T72105 and 131,073 writes for

the IDT72T72115, respectively. Note that the additional word in FWFT mode

is due to the capacity of the memory plus output register.

If the FIFO is full, the first read operation will cause the IR flag to go LOW.

Subsequent read operations will cause the PAF and HF to go HIGH at the

conditions described in Table 4. If further read operations occur, without write

operations, the PAE will go LOW when there are n + 1 words in the FIFO, where

n is the empty offset value. Continuing read operations will cause the FIFO to

become empty. When the last word has been read from the FIFO, OR will go

HIGH inhibiting further read operations. REN is ignored when the FIFO is empty.

When configured in FWFT mode, the OR flag output is triple register-

buffered, and the IR flag output is double register-buffered.

Relevant timing diagrams for FWFT mode can be found in Figure 14, 15,

16 and 19.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

PROGRAMMING FLAG OFFSETS

Full and Empty Flag offset values are user programmable. The IDT72T7285/

72T7295/72T72105/72T72115 have internal registers for these offsets. There

are eight default offset values selectable during Master Reset. These offset

values are shown in Table 2. Offset values can also be programmed into the

FIFO in one of two ways; serial or parallel loading method. The selection of the

loading method is done using the LD (Load) pin. During Master Reset, the state

of the LD input determines whether serial or parallel flag offset programming is

enabled. A HIGH on LD during Master Reset selects serial loading of offset

values. A LOW on LD during Master Reset selects parallel loading of offset

values.

In addition to loading offset values into the FIFO, it is also possible to read

the current offset values. Offset values can be read via the parallel output port

Q0-Qn, regardless of the programming mode selected (serial or parallel). It is

not possible to read the offset values in serial fashion.

Figure 3, Programmable Flag Offset Programming Sequence, summaries

the control pins and sequence for both serial and parallel programming modes.

For a more detailed description, see discussion that follows.

The offset registers may be programmed (and reprogrammed) any time

after Master Reset, regardless of whether serial or parallel programming has

been selected. Valid programming ranges are from 0 to D-1.

SYNCHRONOUS vs ASYNCHRONOUS PROGRAMMABLE FLAG

TIMING SELECTION

The IDT72T7285/72T7295/72T72105/72T72115 can be configured during

the Master Reset cycle with either synchronous or asynchronous timing for PAF

and PAE flags by use of the PFM pin.

If synchronous PAF/PAE configuration is selected (PFM, HIGH during

MRS), the PAF is asserted and updated on the rising edge of WCLK only and

not RCLK. Similarly, PAE is asserted and updated on the rising edge of RCLK

only and not WCLK. For detail timing diagrams, see Figure 23 for synchronous

PAF timing and Figure 24 for synchronous PAE timing.

If asynchronous PAF/PAE configuration is selected (PFM, LOW during

MRS), the PAF is asserted LOW on the LOW-to-HIGH transition of WCLK and

PAF is reset to HIGH on the LOW-to-HIGH transition of RCLK. Similarly, PAE

is asserted LOW on the LOW-to-HIGH transition of RCLK. PAE is reset to HIGH

on the LOW-to-HIGH transition of WCLK. For detail timing diagrams, see

Figure 25 for asynchronous PAF timing and Figure 26 for asynchronous PAE

timing.

IDT72T7285,72T7295,72T72105,72T72115

*LD FSEL1 FSEL0 Offsets n,m

H L L 1,023

LH L511

L L H 255

L L L 127

LHH63

HH L31

HL H15

HH H7

*LD FSEL1 FSEL0 Program Mode

H X X Serial(3)

L X X Parallel(4)

*THIS PIN MUST BE HIGH AFTER MASTER RESET TO WRITE

OR READ DAT A T O/FROM THE FIFO MEMOR Y.

TABLE 2 — DEF AULT PROGRAMMABLE

FLAG OFFSETS

NOTES:

1. n = empty offset for PAE.

2 . m = full offset for PAF.

3. As well as selecting serial programming mode, one of the default values will also

be loaded depending on the state of FSEL0 & FSEL1.

4. As well as selecting parallel programming mode, one of the default values will

also be loaded depending on the state of FSEL0 & FSEL1.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

IDT72T7285 IDT72T7295

1 to n

(1)

(n+1) to 16,384

16,385 to (32,768-(m+1))

(32,768-m) to 32,767

32,768

1 to n

(1)

(n+1) to 8,192

8,193 to (16,384-(m+1))

(16,384-m) to 16,383

16,384

IDT72T72105

1 to n

(1)

(n+1) to 32,768

32,769 to (65,536-(m+1))

(65,536-m) to 65,535

65,536

TABLE 3 ⎯ STATUS FLAGS FOR IDT STANDARD MODE

IDT72T7285 IDT72T7295

00 0

1 to n+1 1 to n+1 1 to n+1

(n+2) to 16,385 (n+2) to 32,769 (n+2) to 65,537

16,386 to (32,769-(m+1)) 32,770 to (65,537-(m+1)) 65,538 to (131,073-(m+1))

(32,769-m) to 32,768 (65,537-m) to 65,536 (131,073-m) to 131,072

32,769 65,537 131,073

IDT72T72105 IDT72T72115

1 to n+1

(n+2) to 8,193

8,194 to (16,385-(m+1))

(16,385-m) to 16,384

16,385

IR PAF HF PAE OR

HL H

HL L

HHL

LHLHL

LLLH L

HL LH L

Number of

Words in

FIFO

TABLE 4 ⎯ STATUS FLAGS FOR FWFT MODE

FF PAF HF PAE EF

HHHL L

HHHL H

HHHHH

HHL HH

HLLHH

LLLHH

5994 drw05

IDT72T72115

1 to n

(1)

(n+1) to 65,536

65,537 to (131,072-(m+1))

(131,072-m) to 131,071

131,072

Number of

Words in

FIFO

NOTE:

1. See table 2 for values for n, m.

NOTE:

1. See table 2 for values for n, m.

COMMERCIAL AND INDUSTRIAL

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™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 3. Programmable Flag Offset Programming Sequence

NOTES:

1. The programming method can only be selected at Master Reset.

2. Parallel reading of the offset registers is always permitted regardless of which programming method has been selected.

3. The programming sequence applies to both IDT Standard and FWFT modes.

WCLK RCLK

WEN

REN

SEN

No Operation

Write Memory

Read Memory

No Operation

Parallel write to registers:

Empty Offset (LSB)

Empty Offset (MSB)

Full Offset (LSB)

Full Offset (MSB)

IDT72T7285

IDT72T7295

IDT72T72105

IDT72T72115

Parallel read from registers:

Empty Offset (LSB)

Empty Offset (MSB)

Full Offset (LSB)

Full Offset (MSB)

Serial shift into registers:

Ending with Full Offset (MSB)

28 bits for the IDT72T7285

30 bits for the IDT72T7295

32 bits for the IDT72T72105

34 bits for the IDT72T72115

1 bit for each rising SCLK edge

Starting with Empty Offset (LSB)

5994 drw06

SCLK

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™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 3. Programmable Flag Offset Programming Sequence (Continued)

D/Q17 D/Q0

D/Q8

EMPTY OFFSET REGISTER (PAE)

# of Bits Used

234

910111213

1st Parallel Offset Write/Read Cycle

234

56781213

1415

16 11

Interspersed

Parity

D/Q35 D/Q19

D/Q17 D/Q0

D/Q8

FULL OFFSET REGISTER (PAF)

# of Bits Used

234

910111213

2nd Parallel Offset Write/Read Cycle

234

56781213

1415

16 11

Interspersed

Parity

x36 Bus Width

Non-Interspersed

Parity

Non-Interspersed

Parity

D/Q35 D/Q19

# of Bits Used:

14 bits for the IDT72T7285

15 bits for the IDT72T7295

16 bits for the IDT72T72105

17 bits for the IDT72T72115

Note: All unused input bits

are don’t care.

5994 drw07

D/Q17 D/Q0

D/Q8

EMPTY OFFSET REGISTER (PAE)

# of Bits Used

234

910111213

1st Parallel Offset Write/Read Cycle

234

56781213

1415

16 11

Interspersed

Parity

D/Q71 D/Q19

D/Q17 D/Q0

D/Q8

FULL OFFSET REGISTER (PAF)

# of Bits Used

234

910111213

2nd Parallel Offset Write/Read Cycle

234

56781213

1415

16 11

Interspersed

Parity

x72 Bus Width

Non-Interspersed

Parity

Non-Interspersed

Parity

D/Q71 D/Q19

D/Q17

D/Q0D/Q16

EMPTY OFFSET (LSB) REGISTER (PAE)

Data Inputs/Outputs

# of Bits Used

1234

56789101112131415

EMPTY OFFSET (MSB) REGISTER (PAE)

Data Inputs/Outputs

1st Parallel Offset Write/Read Cycle

2nd Parallel Offset Write/Read Cycle

Data Inputs/Outputs

3rd Parallel Offset Write/Read Cycle

4th Parallel Offset Write/Read Cycle

1234

5678

1213

1415 9

FULL OFFSET (LSB) REGISTER (PAF)

12345678910

1112

1415

2345678

1011121314

15 9

FULL OFFSET (MSB) REGISTER (PAF)

Non-Interspersed

Parity

Interspersed

Parity

D/Q0

D/Q8

D/Q17 D/Q16

D/Q17

D/Q16

D/Q17 D/Q16

x18 Bus Width

NOTE:

1. Consecutive reads of the offset registers is not permitted. The read operation must be disabled for a minimum of one RCLK cycle in between offset register accesses. (Please

refer to Figure 22, Parallel Read of Programmable Flag Registers (IDT Standard and FWFT Modes) for more details).

COMMERCIAL AND INDUSTRIAL

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™™

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16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

SERIAL PROGRAMMING MODE

If Serial Programming mode has been selected, as described above, then

programming of PAE and PAF values can be achieved by using a combination

of the LD, SEN, SCLK and SI input pins. Programming PAE and PAF proceeds

as follows: when LD and SEN are set LOW, data on the SI input are written, one

bit for each SCLK rising edge, starting with the Empty Offset LSB and ending

with the Full Offset MSB. A total of 28 bits for the IDT72T7285, 30 bits for the

IDT72T7295, 32 bits for the IDT72T72105 and 34 bits for the IDT72T72115.

See Figure 20, Serial Loading of Programmable Flag Registers, for the timing

diagram for this mode.

Using the serial method, individual registers cannot be programmed selec-

tively. PAE and PAF can show a valid status only after the complete set of bits

(for all offset registers) has been entered. The registers can be reprogrammed

as long as the complete set of new offset bits is entered. When LD is LOW and

SEN is HIGH, no serial write to the registers can occur.

Write operations to the FIFO are allowed before and during the serial

programming sequence. In this case, the programming of all offset bits does not

have to occur at once. A select number of bits can be written to the SI input and

then, by bringing LD and SEN HIGH, data can be written to FIFO memory via

Dn by toggling WEN. When WEN is brought HIGH with LD and SEN restored

to a LOW, the next offset bit in sequence is written to the registers via SI. If an

interruption of serial programming is desired, it is sufficient either to set LD LOW

and deactivate SEN or to set SEN LOW and deactivate LD. Once LD and SEN

are both restored to a LOW level, serial offset programming continues.

From the time serial programming has begun, neither programmable flag will

be valid until the full set of bits required to fill all the offset registers has been written.

Measuring from the rising SCLK edge that achieves the above criteria; PAF will

be valid after three more rising WCLK edges plus tPAF, PAE will be valid after

the next three rising RCLK edges plus tPAE.

It is only possible to read the flag offset values via the parallel output port Qn.

PARALLEL MODE

If Parallel Programming mode has been selected, as described above, then

programming of PAE and PAF values can be achieved by using a combination

of the LD, WCLK , WEN and Dn input pins. Programming PAE and PAF

proceeds as follows: LD and WEN must be set LOW. For x72, x36 or x18 data

on the inputs Dn are written into the Empty Offset Register on the first LOW-to-

HIGH transition of WCLK. Upon the second LOW-to-HIGH transition of WCLK,

data are written into the Full Offset Register. The third transition of WCLK writes,

once again, to the Empty Offset Register. See Figure 3, Programmable Flag

Offset Programming Sequence. See Figure 21, Parallel Loading of Program-

mable Flag Registers, for the timing diagram for this mode.

The act of writing offsets in parallel employs a dedicated write offset register

pointer. The act of reading offsets employs a dedicated read offset register

pointer. The two pointers operate independently; however, a read and a write

should not be performed simultaneously to the offset registers. A Master Reset

initializes both pointers to the Empty Offset (LSB) register. A Partial Reset has

no effect on the position of these pointers.

Write operations to the FIFO are allowed before and during the parallel

programming sequence. In this case, the programming of all offset registers does

not have to occur at one time. One, two or more offset registers can be written

and then by bringing LD HIGH, write operations can be redirected to the FIFO

memory. When LD is set LOW again, and WEN is LOW, the next offset register

in sequence is written to. As an alternative to holding WEN LOW and toggling

LD, parallel programming can also be interrupted by setting LD LOW and

toggling WEN.

Note that the status of a programmable flag (PAE or PAF) output is invalid

during the programming process. From the time parallel programming has

begun, a programmable flag output will not be valid until the appropriate offset

word has been written to the register(s) pertaining to that flag. Measuring from

the rising WCLK edge that achieves the above criteria; PAF will be valid after

two more rising WCLK edges plus tPAF, PAE will be valid after the next two rising

RCLK edges plus tPAE plus tSKEW2.

The act of reading the offset registers employs a dedicated read offset register

pointer. The contents of the offset registers can be read on the Q0-Qn pins when

LD is set LOW and REN is set LOW. It is important to note that consecutive reads

of the offset registers is not permitted. The read operation must be disabled for

a minimum of one RCLK cycle in between offset register accesses. For x72, x36

and x18 output bus width, 2 read cycles are required to obtain the values of the

offset registers. Starting with the Empty Offset Registers LSB and finishing with

the Full Offset Registers MSB. See Figure 3, Programmable Flag Offset

Programming Sequence. See Figure 22, Parallel Read of Programmable

Flag Registers, for the timing diagram for this mode.

It is permissible to interrupt the offset register read sequence with reads or

writes to the FIFO. The interruption is accomplished by deasserting REN, LD,

or both together. When REN and LD are restored to a LOW level, reading of

the offset registers continues where it left off. It should be noted, and care should

be taken from the fact that when a parallel read of the flag offsets is performed,

the data word that was present on the output lines Qn will be overwritten.

Parallel reading of the offset registers is always permitted regardless of which

timing mode (IDT Standard or FWFT modes) has been selected.

RETRANSMIT FROM MARK OPERATION

The Retransmit from Mark feature allows FIFO data to be read repeatedly

starting at a user-selected position. The FIFO is first put into retransmit mode that

will ‘mark’ a beginning word and also set a pointer that will prevent ongoing FIFO

write operations from over-writing retransmit data. The retransmit data can be

read repeatedly any number of times from the ‘marked’ position. The FIFO can

be taken out of retransmit mode at any time to allow normal device operation.

The ‘mark’ position can be selected any number of times, each selection over-

writing the previous mark location. Retransmit operation is available in both IDT

standard and FWFT modes.

During IDT standard mode the FIFO is put into retransmit mode by a Low-

to-High transition on RCLK when the ‘MARK’ input is HIGH and EF is HIGH.

The rising RCLK edge ‘marks’ the data present in the FIFO output register as

the first retransmit data. The FIFO remains in retransmit mode until a rising edge

on RCLK occurs while MARK is LOW.

Once a ‘marked’ location has been set (and the device is still in retransmit

mode, MARK is HIGH), a retransmit can be initiated by a rising edge on RCLK

while the retransmit input (RT) is LOW. REN must be HIGH (reads disabled)

before bringing RT LOW. The device indicates the start of retransmit setup by

setting EF LOW, also preventing reads. When EF goes HIGH, retransmit setup

is complete and read operations may begin starting with the first data at the MARK

location. Since IDT standard mode is selected, every word read including the

first ‘marked’ word following a retransmit setup requires a LOW on REN (read

enabled).

Note, write operations may continue as normal during all retransmit functions,

however write operations to the ‘marked’ location will be prevented. See Figure

18, Retransmit from Mark (IDT standard mode), for the relevant timing

diagram.

During FWFT mode the FIFO is put into retransmit mode by a rising RCLK

edge when the ‘MARK’ input is HIGH and OR is LOW. The rising RCLK edge

‘marks’ the data present in the FIFO output register as the first retransmit data.

The FIFO remains in retransmit mode until a rising RCLK edge occurs while

MARK is LOW.

COMMERCIAL AND INDUSTRIAL

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IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Once a marked location has been set (and the device is still in retransmit mode,

MARK is HIGH), a retransmit can be initiated by a rising RCLK edge while the

retransmit input (RT) is LOW. REN must be HIGH (reads disabled) before

bringing RT LOW. The device indicates the start of retransmit setup by setting

OR HIGH.

When OR goes LOW, retransmit setup is complete and on the next rising

RCLK edge after retransmit setup is complete, (RT goes HIGH), the contents

of the first retransmit location are loaded onto the output register. Since FWFT

mode is selected, the first word appears on the outputs regardless of REN, a

LOW on REN is not required for the first word. Reading all subsequent words

requires a LOW on REN to enable the rising RCLK edge. See Figure 19,

Retransmit from Mark timing (FWFT mode), for the relevant timing diagram.

Note, there must be a minimum of 32 bytes of data between the write pointer

and read pointer when the MARK is asserted. (32 bytes = 16 word = 8 long

words). Also, once the MARK is set, the write pointer will not increment past the

“marked” location until the MARK is deasserted. This prevents “overwriting” of

retransmit data.

HSTL/LVTTL I/O

Both the write port and read port are user selectable between HSTL or LVTTL

I/O, via two select pins, WHSTL and RHSTL respectively. All other control pins

are selectable via SHSTL, see Table 5 for details of groupings.

Note, that when the write port is selected for HSTL mode, the user can reduce

the power consumption (in stand-by mode by utilizing the WCS input).

All “Static Pins” must be tied to VCC or GND. These pins are LVTTL only,

and are purely device configuration pins.

WHSTL SELECT RHSTL SELECT SHSTL SELECT STATIC PINS

WHSTL: HIGH = HSTL RHSTL: HIGH = HSTL SHSTL: HIGH = HSTL LVTTL ONLY

LOW = L VTTL LOW = L VTTL LOW = L VTTL

Dn (I/P) RCLK/RD (I/P) EF/OR (O/P) SCLK (I/P) PRS (I/P) IW (I/P) OW (I/P)

WCLK/WR (I/P) RCS (I/P) PAF (O/P) LD (I/P) TRST (I/P) BM (I/P) ASYW (I/P)

WEN (I/P) MARK (I/P) EREN (O/P) MRS (I/P) TDI (I/P) ASYR (I/P) BE (I/P)

WCS (I/P) REN (I/P) PAE (O/P) TCK (I/P) IP (I/P) FSEL0 (I/P)

OE (I/P) FF/IR (O/P) TMS (I/P) FSEL1 (I/P) PFM (I/P)

RT (I/P) HF (O/P) SEN (I/P) SHSTL (I/P) WHSTL (I/P)

Qn (O/P) ERCLK (O/P) FWFT/SI (I/P) RHSTL (I/P)

TDO (O/P)

T ABLE 5 — I/O CONFIGURATION

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16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

SIGNAL DESCRIPTION

INPUTS:

DATA IN (D0 - Dn)

Data inputs for 72-bit wide data (D0 - D71), data inputs for 36-bit wide data

(D0 - D35) or data inputs for 18-bit wide data (D0 - D17).

CONTROLS:

MASTER RESET ( MRS )

A Master Reset is accomplished whenever the MRS input is taken to a LOW

state. This operation sets the internal read and write pointers to the first location

of the RAM array. PAE will go LOW, PAF will go HIGH, and HF will go HIGH.

If FWFT/SI is LOW during Master Reset then the IDT Standard mode,

along with EF and FF are selected. EF will go LOW and FF will go HIGH. If

FWFT/SI is HIGH, then the First Word Fall Through mode (FWFT), along with

IR and OR, are selected. OR will go HIGH and IR will go LOW.

All control settings such as OW, IW, BM, BE, RM, PFM and IP are defined

during the Master Reset cycle.

During a Master Reset, the output register is initialized to all zeroes. A Master

Reset is required after power up, before a write operation can take place. MRS

is asynchronous.

See Figure 9, Master Reset Timing, for the relevant timing diagram.

PARTIAL RESET (PRS)

A Partial Reset is accomplished whenever the PRS input is taken to a LOW

state. As in the case of the Master Reset, the internal read and write pointers

are set to the first location of the RAM array, PAE goes LOW, PAF goes HIGH,

and HF goes HIGH.

Whichever mode is active at the time of Partial Reset, IDT Standard mode

or First Word Fall Through, that mode will remain selected. If the IDT Standard

mode is active, then FF will go HIGH and EF will go LOW. If the First Word

Fall Through mode is active, then OR will go HIGH, and IR will go LOW.

Following Partial Reset, all values held in the offset registers remain

unchanged. The programming method (parallel or serial) currently active at

the time of Partial Reset is also retained. The output register is initialized to all

zeroes. PRS is asynchronous.

A Partial Reset is useful for resetting the device during the course of

operation, when reprogramming programmable flag offset settings may not be

convenient.

See Figure 10, Partial Reset Timing, for the relevant timing diagram.

ASYNCHRONOUS WRITE (ASYW)

The write port can be configured for either Synchronous or Asynchronous

mode of operation. If during Master Reset the ASYW input is LOW, then

Asynchronous operation of the write port will be selected. During Asynchro-

nous operation of the write port the WCLK input becomes WR input, this is the

Asynchronous write strobe input. A rising edge on WR will write data present

on the Dn inputs into the FIFO. (WEN must be tied LOW when using the write

port in Asynchronous mode).

When the write port is configured for Asynchronous operation the full flag

(FF) operates in an asynchronous manner, that is, the full flag will be updated

based in both a write operation and read operation. Note, if Asynchronous

mode is selected, FWFT is not permissable. Refer to Figures 30, 31, 34 and

35 for relevant timing and operational waveforms.

ASYNCHRONOUS READ (ASYR)

The read port can be configured for either Synchronous or Asynchronous

mode of operation. If during a Master Reset the ASYR input is LOW, then

Asynchronous operation of the read port will be selected. During Asynchro-

nous operation of the read port the RCLK input becomes RD input, this is the

Asynchronous read strobe input. A rising edge on RD will read data from the

FIFO via the output register and Qn port. (REN must be tied LOW during

Asynchronous operation of the read port).

The OE input provides three-state control of the Qn output bus, in an

asynchronous manner. (RCS, provides three-state control of the read port in

Synchronous mode).

When the read port is configured for Asynchronous operation the device

must be operating on IDT standard mode, FWFT mode is not permissible if the

read port is Asynchronous. The Empty Flag (EF) operates in an Asynchronous

manner, that is, the empty flag will be updated based on both a read operation

and a write operation. Refer to figures 32, 33, 34 and 35 for relevant timing and

operational waveforms.

RETRANSMIT (RT)

The Retransmit (RT) input is used in conjunction with the MARK input,

together they provide a means by which data previously read out of the FIFO

can be reread any number of times. If retransmit operation has been selected

(i.e. the MARK input is HIGH), a rising edge on RCLK while RT is LOW will reset

the read pointer back to the memory location set by the user via the MARK input.

If IDT standard mode has been selected the EF flag will go LOW and remain

LOW for the time that RT is held LOW. RT can be held LOW for any number

of RCLK cycles, the read pointer being reset to the marked location. The next

rising edge of RCLK after RT has returned HIGH, will cause EF to go HIGH,

allowing read operations to be performed on the FIFO. The next read operation

will access data from the ‘marked’ memory location.

Subsequent retransmit operations may be performed, each time the read

pointer returning to the ‘marked’ location. See Figure 18, Retransmit from Mark

(IDT Standard mode) for the relevant timing diagram.

If FWFT mode has been selected the OR flag will go HIGH and remain HIGH

for the time that RT is held LOW. RT can be held LOW for any number of RCLK

cycles, the read pointer being reset to the ‘marked’ location. The next RCLK

rising edge after RT has returned HIGH, will cause OR to go LOW and due to

FWFT operation, the contents of the marked memory location will be loaded onto

the output register, a read operation being required for all subsequent data

reads.

Subsequent retransmit operations may be performed each time the read

pointer returning to the ‘marked’ location. See Figure 19, Retransmit from Mark

(FWFT mode) for the relevant timing diagram.

MARK

The MARK input is used to select Retransmit mode of operation. An RCLK

rising edge while MARK is HIGH will mark the memory location of the data

currently present on the output register, the device will also be placed into

retransmit mode. Note, for the IDT72T7285/72T7295/72T72105, there must

be a minimum of 128 bytes of data between the write pointer and read pointer

when the MARK is asserted. For the IDT72T72115, there must be a minimum

of 256 bytes of data between the write pointer and read pointer when the MARK

is asserted. Remember, 8 (x9) bytes = 4 (x18) words = 2 (x36) words = 1 (x72)

word. Also, once the MARK is set, the write pointer will not increment past the

“marked” location until the MARK is deasserted. This prevents “overwriting”

of retransmit data.

The MARK input must remain HIGH during the whole period of retransmit

mode, a falling edge of RCLK while MARK is LOW will take the device out of

retransmit mode and into normal mode. Any number of MARK locations can be

set during FIFO operation, only the last marked location taking effect. Once a

mark location has been set the write pointer cannot be incremented past this

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

marked location. During retransmit mode write operations to the device may

continue without hindrance.

FIRST WORD FALL THROUGH/SERIAL IN (FWFT/SI)

This is a dual purpose pin. During Master Reset, the state of the FWFT/

SI input determines whether the device will operate in IDT Standard mode or

First Word Fall Through (FWFT) mode.

If, at the time of Master Reset, FWFT/SI is LOW, then IDT Standard mode

will be selected. This mode uses the Empty Flag (EF) to indicate whether or

not there are any words present in the FIFO memory. It also uses the Full Flag

function (FF) to indicate whether or not the FIFO memory has any free space

for writing. In IDT Standard mode, every word read from the FIFO, including

the first, must be requested using the Read Enable (REN) and RCLK.

If, at the time of Master Reset, FWFT/SI is HIGH, then FWFT mode will be

selected. This mode uses Output Ready (OR) to indicate whether or not there

is valid data at the data outputs (Qn). It also uses Input Ready (IR) to indicate

whether or not the FIFO memory has any free space for writing. In the FWFT

mode, the first word written to an empty FIFO goes directly to Qn after three RCLK

rising edges, REN = LOW is not necessary. Subsequent words must be

accessed using the Read Enable (REN) and RCLK.

After Master Reset, FWFT/SI acts as a serial input for loading PAE and PAF

offsets into the programmable registers. The serial input function can only be

used when the serial loading method has been selected during Master Reset.

Serial programming using the FWFT/SI pin functions the same way in both IDT

Standard and FWFT modes.

WRITE STROBE & WRITE CLOCK (WR/WCLK)

If Synchronous operation of the write port has been selected via ASYW, this

input behaves as WCLK.

A write cycle is initiated on the rising edge of the WCLK input. Data setup

and hold times must be met with respect to the LOW-to-HIGH transition of the

WCLK. It is permissible to stop the WCLK. Note that while WCLK is idle, the FF/

IR, PAF and HF flags will not be updated. (Note that WCLK is only capable of

updating HF flag to LOW). The Write and Read Clocks can either be

independent or coincident.

If Asynchronous operation has been selected this input is WR (write strobe).

Data is Asynchronously written into the FIFO via the Dn inputs whenever there

is a rising edge on WR. In this mode the WEN input must be tied LOW.

WRITE ENABLE (WEN)

When the WEN input is LOW, data may be loaded into the FIFO RAM array

on the rising edge of every WCLK cycle if the device is not full. Data is stored

in the RAM array sequentially and independently of any ongoing read

operation.

When WEN is HIGH, no new data is written in the RAM array on each WCLK

cycle.

To prevent data overflow in the IDT Standard mode, FF will go LOW,

inhibiting further write operations. Upon the completion of a valid read cycle,

FF will go HIGH allowing a write to occur. The FF is updated by two WCLK

cycles + tSKEW after the RCLK cycle.

To prevent data overflow in the FWFT mode, IR will go HIGH, inhibiting

further write operations. Upon the completion of a valid read cycle, IR will go

LOW allowing a write to occur. The IR flag is updated by two WCLK cycles +

tSKEW after the valid RCLK cycle.

WEN is ignored when the FIFO is full in either FWFT or IDT Standard mode.

If Asynchronous operation of the write port has been selected, then WEN

must be held active, (tied LOW).

READ STROBE & READ CLOCK (RD/RCLK)

If Synchronous operation of the read port has been selected via ASYR, this

input behaves as RCLK. A read cycle is initiated on the rising edge of the RCLK

input. Data can be read on the outputs, on the rising edge of the RCLK input.

It is permissible to stop the RCLK. Note that while RCLK is idle, the EF/OR, PAE

and HF flags will not be updated. (Note that RCLK is only capable of updating

the HF flag to HIGH). The Write and Read Clocks can be independent or

coincident.

If Asynchronous operation has been selected this input is RD (Read

Strobe) . Data is Asynchronously read from the FIFO via the output register

whenever there is a rising edge on RD. In this mode the REN and RCS inputs

must be tied LOW. The OE input is used to provide Asynchronous control of the

three-state Qn outputs.

WRITE CHIP SELECT (WCS)

The WCS disables all Write Port inputs (data only) if it is held HIGH. To

perform normal operations on the write port, the WCS must be enabled, held

LOW.

READ ENABLE (REN)

When Read Enable is LOW, data is loaded from the RAM array into the

output register on the rising edge of every RCLK cycle if the device is not empty.

When the REN input is HIGH, the output register holds the previous data

and no new data is loaded into the output register. The data outputs Q0-Qn

maintain the previous data value.

In the IDT Standard mode, every word accessed at Qn, including the first

word written to an empty FIFO, must be requested using REN provided that

RCS is LOW. When the last word has been read from the FIFO, the Empty Flag

(EF) will go LOW, inhibiting further read operations. REN is ignored when the

FIFO is empty. Once a write is performed, EF will go HIGH allowing a read to

occur. The EF flag is updated by two RCLK cycles + tSKEW after the valid WCLK

cycle. Both RCS and REN must be active, LOW for data to be read out on the

rising edge of RCLK.

In the FWFT mode, the first word written to an empty FIFO automatically goes

to the outputs Qn, on the third valid LOW-to-HIGH transition of RCLK + tSKEW

after the first write. REN and RCS do not need to be asserted LOW for the First

Word to fall through to the output register. In order to access all other words,

a read must be executed using REN and RCS. The RCLK LOW-to-HIGH

transition after the last word has been read from the FIFO, Output Ready (OR)

will go HIGH with a true read (RCLK with REN = LOW; RCS = LOW), inhibiting

further read operations. REN is ignored when the FIFO is empty.

If Asynchronous operation of the Read port has been selected, then REN

must be held active, (tied LOW).

SERIAL ENABLE ( SEN )

The SEN input is an enable used only for serial programming of the offset

registers. The serial programming method must be selected during Master

Reset. SEN is always used in conjunction with LD. When these lines are both

LOW, data at the SI input can be loaded into the program register one bit for each

LOW-to-HIGH transition of SCLK.

When SEN is HIGH, the programmable registers retains the previous

settings and no offsets are loaded. SEN functions the same way in both IDT

Standard and FWFT modes.

OUTPUT ENABLE ( OE )

When Output Enable is enabled (LOW), the parallel output buffers receive

data from the output register. When OE is HIGH, the output data bus (Qn) goes

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

into a high impedance state. During Master or a Partial Reset the OE is the only

input that can place the output bus Qn, into High-Impedance. During Reset the

RCS input can be HIGH or LOW, it has no effect on the Qn outputs.

READ CHIP SELECT ( RCS )

The Read Chip Select input provides synchronous control of the Read

output port. When RCS goes LOW, the next rising edge of RCLK causes the

Qn outputs to go to the Low-Impedance state. When RCS goes HIGH, the next

RCLK rising edge causes the Qn outputs to return to HIGH Z. During a Master

or Partial Reset the RCS input has no effect on the Qn output bus, OE is the only

input that provides High-Impedance control of the Qn outputs. If OE is LOW the

Qn data outputs will be Low-Impedance regardless of RCS until the first rising

edge of RCLK after a Reset is complete. Then if RCS is HIGH the data outputs

will go to High-Impedance.

The RCS input does not effect the operation of the flags. For example, when

the first word is written to an empty FIFO, the EF will still go from LOW to HIGH

based on a rising edge of RCLK, regardless of the state of the RCS input.

Also, when operating the FIFO in FWFT mode the first word written to an

empty FIFO will still be clocked through to the output register based on RCLK,

regardless of the state of RCS. For this reason the user must take care when

a data word is written to an empty FIFO in FWFT mode. If RCS is disabled when

an empty FIFO is written into, the first word will fall through to the output register,

but will not be available on the Qn outputs which are in HIGH-Z. The user must

take RCS active LOW to access this first word, place the output bus in LOW-Z.

REN must remain disabled HIGH for at least one cycle after RCS has gone LOW.

A rising edge of RCLK with RCS and REN active LOW, will read out the next

word. Care must be taken so as not to lose the first word written to an empty

FIFO when RCS is HIGH. Refer to Figure 17,

RCS

and

REN

Read Operation

(FWFT Mode). The RCS pin must also be active (LOW) in order to perform

a Retransmit. See Figure 13 for Read Cycle and Read Chip Select Timing (IDT

Standard Mode). See Figure 16 for Read Cycle and Read Chip Select Timing

(First Word Fall Through Mode).

If Asynchronous operation of the Read port has been selected, then RCS

must be held active, (tied LOW). OE provides three-state control of Qn.

WRITE PORT HSTL SELECT (WHSTL)

The control inputs, data inputs and flag outputs associated with the write port

can be setup to be either HSTL or LVTTL. If WHSTL is HIGH during the Master

Reset, then HSTL operation of the write port will be selected. If WHSTL is LOW

at Master Reset, then LVTTL will be selected.

The inputs and outputs associated with the write port are listed in Table 5.

READ PORT HSTL SELECT (RHSTL)

The control inputs, data inputs and flag outputs associated with the read port

can be setup to be either HSTL or LVTTL. If RHSTL is HIGH during the Master

Reset, then HSTL operation of the read port will be selected. If RHSTL is LOW

at Master Reset, then LVTTL will be selected for the read port, then echo clock

and echo read enable will not be provided.

The inputs and outputs associated with the read port are listed in Table 5.

SYSTEM HSTL SELECT (SHSTL)

All inputs not associated with the write and read port can be setup to be either

HSTL or LVTTL. If SHSTL is HIGH during Master Reset, then HSTL operation

of all the inputs not associated with the write and read port will be selected. If

SHSTL is LOW at Master Reset, then LVTTL will be selected. The inputs

associated with SHSTL are listed in Table 5.

LOAD (LD)

This is a dual purpose pin. During Master Reset, the state of the LD input,

along with FSEL0 and FSEL1, determines one of eight default offset values for

the PAE and PAF flags, along with the method by which these offset registers

can be programmed, parallel or serial (see Table 2). After Master Reset, LD

enables write operations to and read operations from the offset registers. Only

the offset loading method currently selected can be used to write to the registers.

Offset registers can be read only in parallel.

After Master Reset, the LD pin is used to activate the programming process

of the flag offset values PAE and PAF. Pulling LD LOW will begin a serial loading

or parallel load or read of these offset values. THIS PIN MUST BE HIGH

AFTER MASTER RESET TO WRITE OR READ DATA TO/FROM THE FIFO

MEMORY.

BUS-MATCHING (BM, IW, OW)

The pins BM, IW and OW are used to define the input and output bus widths.

During Master Reset, the state of these pins is used to configure the device bus

sizes. See Table 1 for control settings. All flags will operate on the word/byte

size boundary as defined by the selection of bus width. See Figure 5 for Bus-

Matching Byte Arrangement.

BIG-ENDIAN/LITTLE-ENDIAN ( BE )

During Master Reset, a LOW on BE will select Big-Endian operation. A

HIGH on BE during Master Reset will select Little-Endian format. This function

is useful when the following input to output bus widths are implemented: x72 to

x36, x72 to x18, x36 to x72 and x18 to x72. If Big-Endian mode is selected,

then the most significant byte (word) of the long word written into the FIFO will

be read out of the FIFO first, followed by the least significant byte. If Little-Endian

format is selected, then the least significant byte of the long word written into the

FIFO will be read out first, followed by the most significant byte. The mode

desired is configured during master reset by the state of the Big-Endian (BE)

pin. See Figure 5 for Bus-Matching Byte Arrangement.

PROGRAMMABLE FLAG MODE (PFM)

During Master Reset, a LOW on PFM will select Asynchronous Program-

mable flag timing mode. A HIGH on PFM will select Synchronous Program-

mable flag timing mode. If asynchronous PAF/PAE configuration is selected

(PFM, LOW during MRS), the PAE is asserted LOW on the LOW-to-HIGH

transition of RCLK. PAE is reset to HIGH on the LOW-to-HIGH transition of

WCLK. Similarly, the PAF is asserted LOW on the LOW-to-HIGH transition of

WCLK and PAF is reset to HIGH on the LOW-to-HIGH transition of RCLK.

If synchronous PAE/PAF configuration is selected (PFM, HIGH during

MRS) , the PAE is asserted and updated on the rising edge of RCLK only and

not WCLK. Similarly, PAF is asserted and updated on the rising edge of WCLK

only and not RCLK. The mode desired is configured during master reset by

the state of the Programmable Flag Mode (PFM) pin.

INTERSPERSED PARITY (IP)

During Master Reset, a LOW on IP will select Non-Interspersed Parity

mode. A HIGH will select Interspersed Parity mode. The IP bit function allows

the user to select the parity bit in the word loaded into the parallel port (D0-Dn)

when programming the flag offsets. If Interspersed Parity mode is selected, then

the FIFO will assume that the parity bits are located in bit position D8, D17, D26,

D35, D44, D53, D62 and D71 during the parallel programming of the flag offsets.

If Non-Interspersed Parity mode is selected, then D8, D17 and D28 are is

assumed to be valid bits and D64, D65, D66, D67, D68, D69, D70 and D71 are

ignored. IP mode is selected during Master Reset by the state of the IP input pin.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

OUTPUTS:

FULL FLAG ( FF/IR )

This is a dual purpose pin. In IDT Standard mode, the Full Flag (FF) function

is selected. When the FIFO is full, FF will go LOW, inhibiting further write

operations. When FF is HIGH, the FIFO is not full. If no reads are performed

after a reset (either MRS or PRS), FF will go LOW after D writes to the FIFO

(D =16,384 for the IDT72T7285, 32,768 for the IDT72T7295, 65,536 for the

IDT72T72105 and 131,072 for the IDT72T72115). See Figure 11, Write Cycle

and Full Flag Timing (IDT Standard Mode), for the relevant timing information.

In FWFT mode, the Input Ready (IR) function is selected. IR goes LOW

when memory space is available for writing in data. When there is no longer

any free space left, IR goes HIGH, inhibiting further write operations. If no reads

are performed after a reset (either MRS or PRS), IR will go HIGH after D writes

to the FIFO (D =16,385 for the IDT72T7285, 32,769 for the IDT72T7295,

65,537 for the IDT72T72105 and 131,073 for the IDT72T72115). See Figure

14, Write Timing (FWFT Mode), for the relevant timing information.

The IR status not only measures the contents of the FIFO memory, but also

counts the presence of a word in the output register. Thus, in FWFT mode, the

total number of writes necessary to deassert IR is one greater than needed to

assert FF in IDT Standard mode.

FF/IR is synchronous and updated on the rising edge of WCLK. FF/IR are

double register-buffered outputs.

Note, when the device is in Retransmit mode, this flag is a comparison of the

write pointer to the ‘marked’ location. This differs from normal mode where this

flag is a comparison of the write pointer to the read pointer.

EMPTY FLAG ( EF/OR )

This is a dual purpose pin. In the IDT Standard mode, the Empty Flag (EF)

function is selected. When the FIFO is empty, EF will go LOW, inhibiting further

read operations. When EF is HIGH, the FIFO is not empty. See Figure 12, Read

Cycle, Empty Flag and First Word Latency Timing (IDT Standard Mode), for

the relevant timing information.

In FWFT mode, the Output Ready (OR) function is selected. OR goes LOW

at the same time that the first word written to an empty FIFO appears valid on

the outputs. OR stays LOW after the RCLK LOW to HIGH transition that shifts

the last word from the FIFO memory to the outputs. OR goes HIGH only with

a true read (RCLK with REN = LOW). The previous data stays at the outputs,

indicating the last word was read. Further data reads are inhibited until OR goes

LOW again. See Figure 15, Read Timing (FWFT Mode), for the relevant timing

information.

EF/OR is synchronous and updated on the rising edge of RCLK.

In IDT Standard mode, EF is a double register-buffered output. In FWFT

mode, OR is a triple register-buffered output.

PROGRAMMABLE ALMOST-FULL FLAG ( PAF )

The Programmable Almost-Full flag (PAF) will go LOW when the FIFO

reaches the almost-full condition. In IDT Standard mode, if no reads are

performed after reset (MRS), PAF will go LOW after (D - m) words are written

to the FIFO. The PAF will go LOW after (16,384-m) writes for the IDT72T7285,

(32,768-m) writes for the IDT72T7295, (65,536-m) writes for the IDT72T72105

and (131,072-m) writes for the IDT72T72115. The offset “m” is the full offset

value. The default setting for this value is stated in the footnote of Table 3.

In FWFT mode, the PAF will go LOW after (16,385-m) writes for the

IDT72T7285, (32,769-m) writes for the IDT72T7295, (65,537-m) writes for the

IDT72T72105 and (131,073-m) writes for the IDT72T72115, where m is the

full offset value. The default setting for this value is stated in Table 4.

See Figure 23, Synchronous Programmable Almost-Full Flag Timing (IDT

Standard and FWFT Mode), for the relevant timing information.

If asynchronous PAF configuration is selected, the PAF is asserted LOW

on the LOW-to-HIGH transition of the Write Clock (WCLK). PAF is reset to HIGH

on the LOW-to-HIGH transition of the Read Clock (RCLK). If synchronous PAF

configuration is selected, the PAF is updated on the rising edge of WCLK. See

Figure 25, Asynchronous Almost-Full Flag Timing (IDT Standard and FWFT

Mode).

Note, when the device is in Retransmit mode, this flag is a comparison of the

write pointer to the ‘marked’ location. This differs from normal mode where this

flag is a comparison of the write pointer to the read pointer.

PROGRAMMABLE ALMOST-EMPTY FLAG ( PAE )

The Programmable Almost-Empty flag (PAE) will go LOW when the FIFO

reaches the almost-empty condition. In IDT Standard mode, PAE will go LOW

when there are n words or less in the FIFO. The offset “n” is the empty offset

value. The default setting for this value is stated in the footnote of Table 1.

In FWFT mode, the PAE will go LOW when there are n+1 words or less

in the FIFO. The default setting for this value is stated in Table 2.

See Figure 24, Synchronous Programmable Almost-Empty Flag Timing

(IDT Standard and FWFT Mode), for the relevant timing information.

If asynchronous PAE configuration is selected, the PAE is asserted LOW

on the LOW-to-HIGH transition of the Read Clock (RCLK). PAE is reset to HIGH

on the LOW-to-HIGH transition of the Write Clock (WCLK). If synchronous PAE

configuration is selected, the PAE is updated on the rising edge of RCLK. See

Figure 26, Asynchronous Programmable Almost-Empty Flag Timing (IDT

Standard and FWFT Mode).

HALF-FULL FLAG ( HF )

This output indicates a half-full FIFO. The rising WCLK edge that fills the FIFO

beyond half-full sets HF LOW. The flag remains LOW until the difference between

the write and read pointers becomes less than or equal to half of the total depth

of the device; the rising RCLK edge that accomplishes this condition sets HF

HIGH.

In IDT Standard mode, if no reads are performed after reset (MRS or PRS),

HF will go LOW after (D/2 + 1) writes to the FIFO, where D = 16,384 for the

IDT72T7285, 32,768 for the IDT72T7295, 65,536 for the IDT72T72105 and

131,072 for the IDT72T72115.

In FWFT mode, if no reads are performed after reset (MRS or PRS), HF

will go LOW after (D-1/2 + 2) writes to the FIFO, where D = 16,385 for the

IDT72T7285, 32,769 for the IDT72T7295, 65,537 for the IDT72T72105 and

131,073 for the IDT72T72115.

See Figure 27, Half-Full Flag Timing (IDT Standard and FWFT Modes),

for the relevant timing information. Because HF is updated by both RCLK and

WCLK, it is considered asynchronous.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

ECHO READ CLOCK (ERCLK)

The Echo Read Clock output is provided in both HSTL and LVTTL mode,

selectable via RHSTL. The ERCLK is a free-running clock output, it will always

follow the RCLK input regardless of REN and RCS.

The ERCLK output follows the RCLK input with an associated delay. This

delay provides the user with a more effective read clock source when reading

data from the Qn outputs. This is especially helpful at high speeds when

variables within the device may cause changes in the data access times. These

variations in access time maybe caused by ambient temperature, supply

voltage, device characteristics. The ERCLK output also compensates for any

trace length delays between the Qn data outputs and receiving devices inputs.

Any variations effecting the data access time will also have a corresponding

effect on the ERCLK output produced by the FIFO device, therefore the ERCLK

output level transitions should always be at the same position in time relative to

the data outputs. Note, that ERCLK is guaranteed by design to be slower than

the slowest Qn, data output. Refer to Figure 4, Echo Read Clock and Data

Output Relationship, Figure 28, Echo Read Clock & Read Enable Operation

and Figure 29, Echo RCLK & Echo

REN

Operation for timing information.

ECHO READ ENABLE (EREN)

The Echo Read Enable output is provided in both HSTL and LVTTL mode,

selectable via RHSTL.

The EREN output is provided to be used in conjunction with the ERCLK

output and provides the reading device with a more effective scheme for reading

data from the Qn output port at high speeds. The EREN output is controlled by

internal logic that behaves as follows: The EREN output is active LOW for the

RCLK cycle that a new word is read out of the FIFO. That is, a rising edge of

RCLK will cause EREN to go active, LOW if both REN and RCS are active, LOW

and the FIFO is NOT empty.

SERIAL CLOCK (SCLK)

During serial loading of the programming flag offset registers, a rising edge

on the SCLK input is used to load serial data present on the SI input provided

that the SEN input is LOW.

DATA OUTPUTS (Q0-Qn)

(Q0-Q71) are data outputs for 72-bit wide data, (Q0 - Q35) are data outputs

for 36-bit wide data or (Q0-Q17) are data outputs for 18-bit wide data.

Figure 4. Echo Read Clock and Data Output Relationship

NOTES:

1. REN is LOW.

2. tERCLK > tA, guaranteed by design.

3. Qslowest is the data output with the slowest access time, tA.

4. Time, tD is greater than zero, guaranteed by design.

5994 drw08

ERCLK

tAtD

SLOWEST

(3)

RCLK

tERCLK

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

D71-D54 D53-D36 D35-D18 D17-D0

(a) x72 INPUT to x72 OUTPUT

(b) x72 INPUT to x36 OUTPUT - BIG-ENDIAN

(d) x72 INPUT to x18 OUTPUT - BIG-ENDIAN

Write to FIFO

Read from FIFO

1st: Read from FIFO

BE BM IW OW

BYTE ORDER ON INPUT PORT:

2nd: Read from FIFO

3rd: Read from FIFO

4th: Read from FIFO

1st: Read from FIFO

2nd: Read from FIFO

(e) x72 INPUT to x18 OUTPUT - LITTLE-ENDIAN

1st: Read from FIFO

2nd: Read from FIFO

3rd: Read from FIFO

4th: Read from FIFO

5994 drw09

BYTE ORDER ON OUTPUT PORT:

L H L L

H H L L

L H L H

H H L H

X L X X

BE BM IW OW

Q71-Q54 Q53-Q36 Q35-Q18 Q17-Q0

Figure 5. Bus-Matching Byte Arrangement

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 5. Bus-Matching Byte Arrangement (Continued)

D71-D54 D53-D36 D35-D18 D17-D0

(a) x36 INPUT to x72 OUTPUT - BIG-ENDIAN

Read from FIFO

1st: Write to FIFO

BYTE ORDER ON INPUT PORT:

2nd: Write to FIFO

3rd: Write to FIFO

4th: Write to FIFO

1st: Write to FIFO

2nd: Write to FIFO

5994 drw10

BYTE ORDER ON OUTPUT PORT:

CDAB

(b) x36 INPUT to x72 OUTPUT - LITTLE-ENDIAN

Read from FIFO

BE BM IW OW

H H H L

BYTE ORDER ON INPUT PORT:

ABCD

(a) x18 INPUT to x72 OUTPUT - BIG-ENDIAN

Read from FIFO

BE BM IW OW

L H H H

BYTE ORDER ON OUTPUT PORT:

DCBA

(b) x18 INPUT to x72 OUTPUT - LITTLE-ENDIAN

Read from FIFO

BE BM IW OW

H H H H

BE BM IW OW

L H H L

D71-D54 D53-D36 D35-D18 D17-D0

Q71-Q54 Q53-Q36 Q35-Q18 Q17-Q0

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 6. Standard JTAG Timing

SYSTEM INTERFACE PARAMETERS

Parameter Symbol Test

Conditions Min. Max. Units

JTAG Clock Input Period tTCK - 100 - ns

JTAG Clock HIGH tTCKHIGH -40-ns

JTAG Clock Low tTCKLOW -40-ns

JTAG Clock Rise Time tTCKRISE --5

(1) ns

JTAG Clock Fall Time tTCKFALL --5

(1) ns

JTAG Reset tRST -50-ns

JTAG Reset Recovery tRSR -50-ns

JTAG

AC ELECTRICAL CHARACTERISTICS

(vcc = 2.5V ± 5%; Tcase = 0°C to +85°C)

IDT72T7285

IDT72T7295

IDT72T72105

IDT72T72115

Parameter Symbol Test Conditions Min. Max. Units

Data Output tDO(1) -20ns

Data Output Hold tDOH(1) 0-ns

Data Input tDS trise=3ns 10 -ns

tDH tfall=3ns 10 -

NOTE:

1. 50pf loading on external output signals.

JTAG TIMING SPECIFICATION

NOTE:

1. Guaranteed by design.

TDO

TDI/

TMS

TCK

TRST

Notes to diagram:

t1 =

TCKLOW

t2 =

TCKHIGH

t3 =

TCKFALL

t4 = t

TCKRISE

t5 =

tRST

(reset pulse width)

t6 = tRSR (reset recovery)

5994 drw11

t1t2

TCK

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

JTAG INTERFACE

Five additional pins (TDI, TDO, TMS, TCK and TRST) are provided to

support the JTAG boundary scan interface. The IDT72T7285/72T7295/

72T72105/72T72115 incorporates the necessary tap controller and modified

pad cells to implement the JTAG facility.

Note that IDT provides appropriate Boundary Scan Description Language

program files for these devices.

The Standard JTAG interface consists of four basic elements:

•Test Access Port (TAP)

•TAP controller

•Instruction Register (IR)

•Data Register Port (DR)

The following sections provide a brief description of each element. For a

complete description refer to the IEEE Standard Test Access Port Specification

(IEEE Std. 1149.1-1990).

The Figure below shows the standard Boundary-Scan Architecture

Figure 7. Boundary Scan Architecture

TEST ACCESS PORT (TAP)

The Tap interface is a general-purpose port that provides access to the

internal of the processor. It consists of four input ports (TCLK, TMS, TDI, TRST)

and one output port (TDO).

THE TAP CONTROLLER

The Tap controller is a synchronous finite state machine that responds to

TMS and TCLK signals to generate clock and control signals to the Instruction

and Data Registers for capture and update of data.

TAP

Cont-

roller

Mux

DeviceID Reg.

Boundary Scan Reg.

Bypass Reg.

clkDR, ShiftDR

UpdateDR

TDO

TDI

TMS

TCLK

TRST

clklR, ShiftlR

UpdatelR

Instruction Register

Instruction Decode

Control Signals

5994 drw12

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 8. TAP Controller State Diagram

Test-Logic

Reset

Run-Test/

Idle

Select-

DR-Scan

Select-

IR-Scan

111

Capture-IR

Capture-DR

EXit1-DR

Pause-DR

Exit2-DR

Update-DR

Exit1-IR

Exit2-IR

Update-IR

5994 drw13

Shift-DR

Shift-IR

Pause-IR

Input = TMS

Refer to the IEEE Standard Test Access Port Specification (IEEE Std.

1149.1) for the full state diagram

All state transitions within the TAP controller occur at the rising edge of the

TCLK pulse. The TMS signal level (0 or 1) determines the state progression

that occurs on each TCLK rising edge. The TAP controller takes precedence

over the FIFO memory and must be reset after power up of the device. See

TRST description for more details on TAP controller reset.

Test-Logic-Reset All test logic is disabled in this controller state enabling the

normal operation of the IC. The TAP controller state machine is designed in such

a way that, no matter what the initial state of the controller is, the Test-Logic-Reset

state can be entered by holding TMS at high and pulsing TCK five times. This

is the reason why the Test Reset (TRST) pin is optional.

Run-Test-Idle In this controller state, the test logic in the IC is active only if

certain instructions are present. For example, if an instruction activates the self

test, then it will be executed when the controller enters this state. The test logic

in the IC is idles otherwise.

Select-DR-Scan This is a controller state where the decision to enter the

Data Path or the Select-IR-Scan state is made.

Select-IR-Scan This is a controller state where the decision to enter the

Instruction Path is made. The Controller can return to the Test-Logic-Reset state

other wise.

Capture-IR In this controller state, the shift register bank in the Instruction

last two significant bits are always required to be “01”.

Shift-IR In this controller state, the instruction register gets connected

between TDI and TDO, and the captured pattern gets shifted on each rising edge

of TCK. The instruction available on the TDI pin is also shifted in to the instruction

Exit1-IR This is a controller state where a decision to enter either the Pause-

IR state or Update-IR state is made.

Pause-IR This state is provided in order to allow the shifting of instruction

Exit2-DR This is a controller state where a decision to enter either the Shift-

IR state or Update-IR state is made.

Update-IR In this controller state, the instruction in the instruction register is

latched in to the latch bank of the Instruction Register on every falling edge of

TCK. This instruction also becomes the current instruction once it is latched.

Capture-DR In this controller state, the data is parallel loaded in to the data

registers selected by the current instruction on the rising edge of TCK.

Shift-DR, Exit1-DR, Pause-DR, Exit2-DR and Update-DR These

controller states are similar to the Shift-IR, Exit1-IR, Pause-IR, Exit2-IR and

Update-IR states in the Instruction path.

NOTES:

1. Five consecutive TCK cycles with TMS = 1 will reset the TAP.

2. TAP controller does not automatically reset upon power-up. The user must provide a reset to the TAP controller (either by TRST or TMS).

3. TAP controller must be reset before normal FIFO operations can begin.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

THE INSTRUCTION REGISTER

The Instruction register allows an instruction to be shifted in serially into the

processor at the rising edge of TCLK.

The Instruction is used to select the test to be performed, or the test data

at the completion of the shifting process when the TAP controller is at Update-

IR state.

The instruction register must contain 4 bit instruction register-based cells

which can hold instruction data. These mandatory cells are located nearest the

serial outputs they are the least significant bits.

TEST DATA REGISTER

The Test Data register contains three test data registers: the Bypass, the

Boundary Scan register and Device ID register.

These registers are connected in parallel between a common serial input

and a common serial data output.

The following sections provide a brief description of each element. For a

complete description, refer to the IEEE Standard Test Access Port Specification

(IEEE Std. 1149.1-1990).

TEST BYPASS REGISTER

The register is used to allow test data to flow through the device from TDI

to TDO. It contains a single stage shift register for a minimum length in serial path.

When the bypass register is selected by an instruction, the shift register stage

is set to a logic zero on the rising edge of TCLK when the TAP controller is in

the Capture-DR state.

The operation of the bypass register should not have any effect on the

operation of the device in response to the BYPASS instruction.

THE BOUNDARY-SCAN REGISTER

The Boundary Scan Register allows serial data TDI be loaded in to or read

out of the processor input/output ports. The Boundary Scan Register is a part

of the IEEE 1149.1-1990 Standard JTAG Implementation.

THE DEVICE IDENTIFICATION REGISTER

The Device Identification Register is a Read Only 32-bit register used to

specify the manufacturer, part number and version of the processor to be

determined through the TAP in response to the IDCODE instruction.

IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity

is dropped in the 11-bit Manufacturer ID field.

For the IDT72T7285/72T7295/72T72105/72T72115, the Part Number

field contains the following values:

IDT72T7285/95/105/115 JTAG Device Identification Register

31(MSB) 28 27 12 11 1 0(LSB)

V ersion (4 bits) Part Number (16-bit) Manufacturer ID (1 1-bit)

0X0 0X33 1

JTAG INSTRUCTION REGISTER

The Instruction register allows instruction to be serially input into the device

when the TAP controller is in the Shift-IR state. The instruction is decoded to

perform the following:

•Select test data registers that may operate while the instruction is current.

The other test data registers should not interfere with chip operation and the

selected data register.

•Define the serial test data register path that is used to shift data between

TDI and TDO during data register scanning.

The Instruction Register is a 4 bit field (i.e. IR3, IR2, IR1, IR0) to decode

16 different possible instructions. Instructions are decoded as follows.

Hex Value Instruction Function

0x00 EXTEST Select Boundary Scan Register

0x02 IDCODE Select Chip Identification data register

0x01 SAMPLE/PRELOAD Select Boundary Scan Register

0x03 HIGH-IMPEDANCE JTAG

0x0F BYPASS Select Bypass Register

JTAG Instruction Register Decoding

The following sections provide a brief description of each instruction. For

a complete description refer to the IEEE Standard Test Access Port Specification

(IEEE Std. 1149.1-1990).

EXTEST

The required EXTEST instruction places the IC into an external boundary-

test mode and selects the boundary-scan register to be connected between TDI

and TDO. During this instruction, the boundary-scan register is accessed to

drive test data off-chip via the boundary outputs and receive test data off-chip

via the boundary inputs. As such, the EXTEST instruction is the workhorse of

IEEE. Std 1149.1, providing for probe-less testing of solder-joint opens/shorts

and of logic cluster function.

IDCODE

The optional IDCODE instruction allows the IC to remain in its functional mode

and selects the optional device identification register to be connected between

TDI and TDO. The device identification register is a 32-bit shift register containing

information regarding the IC manufacturer, device type, and version code.

Accessing the device identification register does not interfere with the operation

of the IC. Also, access to the device identification register should be immediately

available, via a TAP data-scan operation, after power-up of the IC or after the

TAP has been reset using the optional TRST pin or by otherwise moving to the

Test-Logic-Reset state.

SAMPLE/PRELOAD

The required SAMPLE/PRELOAD instruction allows the IC to remain in a

normal functional mode and selects the boundary-scan register to be connected

between TDI and TDO. During this instruction, the boundary-scan register can

be accessed via a date scan operation, to take a sample of the functional data

entering and leaving the IC. This instruction is also used to preload test data into

the boundary-scan register before loading an EXTEST instruction.

HIGH-IMPEDANCE

The optional High-Impedance instruction sets all outputs (including two-state

as well as three-state types) of an IC to a disabled (high-impedance) state and

selects the one-bit bypass register to be connected between TDI and TDO.

During this instruction, data can be shifted through the bypass register from TDI

to TDO without affecting the condition of the IC outputs.

BYPASS

The required BYPASS instruction allows the IC to remain in a normal

functional mode and selects the one-bit bypass register to be connected between

TDI and TDO. The BYPASS instruction allows serial data to be transferred

through the IC from TDI to TDO without affecting the operation of the IC.

Device Part# Field

IDT72T7285 0493

IDT72T7295 0492

IDT72T72105 0491

IDT72T72115 0490

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 9. Master Reset Timing

5994 drw14

SEN

RSF

OE = HIGH

OE = LOW

PAE

PAF, HF

- Q

(1)

RSF

EF/OR

FF/IR

RSF

If FWFT = HIGH, OR = HIGH

If FWFT = LOW, EF = LOW

If FWFT = LOW, FF = HIGH

If FWFT = HIGH, IR = LOW

RSS

PFM

HRSS

MRS

RSR

REN

RSS

FWFT/SI

RSR

WEN

FSEL0,

FSEL1

OW,

IW, BM

RSR

RSS

WHSTL

RHSTL

SHSTL

RSS

HRSS

NOTE:

1 . During Master Reset the High-Impedance control of the Qn data outputs is provided by OE only, RCS can be HIGH or LOW until the first rising edge of RCLK after Master Reset

is complete.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 10. Partial Reset Timing

PRS

RSR

REN

RSS

5994 drw15

RSR

WEN

SEN

RSF

OE = HIGH

OE = LOW

PAE

PAF, HF

- Q

(1)

RSF

EF/OR

FF/IR

RSF

RSF If FWFT = HIGH, OR = HIGH

If FWFT = LOW, EF = LOW

If FWFT = LOW, FF = HIGH

If FWFT = HIGH, IR = LOW

RSS

NOTE:

1 . During Partial Reset the High-Impedance control of the Qn data outputs is provided by OE only, RCS can be HIGH or LOW until the first rising edge of RCLK after Master Reset

is complete.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 11. Write Cycle and Full Flag Timing (IDT Standard Mode)

D0 - Dn

WEN

RCLK

REN

tENH t

ENH

Q0 - QnDATA READ NEXT DATA READ

SKEW1

(1)

5994 drw16

WCLK

NO WRITE

1212

NO WRITE

WFF

tENS t

ENS

(1)

tDS

CLK

CLKH

RCS

tENS

tRCSLZ

WFF

SKEW1

CLKL

X+1

WFF

tDS t

Figure 12. Read Cycle, Output Enable, Empty Flag and First Data Word Latency (IDT Standard Mode)

5994 drw17

D0 - Dn

NO OPERATION

RCLK

REN

CLK

CLKH

CLKL

ENH

REF

OLZ

Q0 - Qn

WCLK

(1)

SKEW1

WEN

ENS

ENH

OLZ

NO OPERATION

LAST WORD D

ENS

ENH

OHZ

LAST WORD

REF

ENH

ENS

REF

ENS

ENH

WCS

WCSS

WCSH

NOTES:

1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the

rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle.

2. LD = HIGH.

3. First data word latency = tSKEW1 + 1*TRCLK + tREF.

4. RCS is LOW.

NOTES:

1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle pus tWFF). If the time between the

rising edge of the RCLK and the rising edge of the WCLK is less than tSKEW1, then the FF deassertion may be delayed one extra WCLK cycle.

2. LD = HIGH, OE = LOW, EF = HIGH.

3. WCS = LOW.

COMMERCIAL AND INDUSTRIAL

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™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 13. Read Cycle and Read Chip Select (IDT Standard Mode)

RCLK

REN

5994 drw18

RCS

Q0 - Qn

WCLK

WEN

tENS

LAST DATA

tENS tENS tENS

tREF

tRCSLZ

LAST DATA-1

tRCSHZ

tRCSLZ tAtRCSHZ

tSKEW1(1)

tENHtENS

tDH

tDS

tENH

NOTES:

1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the

rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle.

2. LD = HIGH.

3. First data word latency = tSKEW1 + 1*TRCLK + tREF.

4. OE is LOW.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 14. Write Timing (First Word Fall Through Mode)

NOTES:

1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that OR will go LOW after two RCLK cycles plus tREF. If the time between the rising edge of WCLK and the rising edge of RCLK

is less than tSKEW1, then OR assertion may be delayed one extra RCLK cycle.

2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH after one RCLK cycle plus tPAES. If the time between the rising edge of WCLK and the rising edge of RCLK

is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.

3. LD = HIGH, OE = LOW

4. n = PAE offset, m = PAF offset and D = maximum FIFO depth.

5. D = 16,385 for IDT72T7285, 32,769 for IDT72T7295, 65,537 for IDT72T72105 and 131,073 for IDT72T72115.

6. First data word latency = tSKEW1 + 2*TRCLK + tREF.

[n +2]

[D-m-1]

[D-m-2]

[D-1]

[n+3]

[n+4]

[D-m]

[D-m+1]

WCLK

WEN

D0 - Dn

RCLK

SKEW1

(1)

REN

Q0 - Qn

PAF

PAE

SKEW2

REF

PAES

PAFS

WFF

[D-m+2]

ENH

5994 drw19

PREVIOUS DATA IN OUTPUT REGISTER

(2)

123

D-1

][

D-1

][

D-1

][

ENS

RCS

RCSLZ

ENS

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 15. Read Timing (First Word Fall Through Mode)

WCLK 12

WEN

D0 - Dn

RCLK

ENS

REN

Q0 - Qn

PAF

PAE

m+2

[m+3]

OHZ

SKEW1

ENH

PAFS

WFF

ENS

SKEW2

5994 drw20

PAES

[D-n]

[D-n-1]

REF

[D-1]

[D-n+1]

[m+4]

[D-n+2]

(1) (2)

ENS

D-1

][

D-1

][

NOTES:

1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that IR will go LOW after one WCLK cycle plus tWFF. If the time between the rising edge of RCLK and the rising edge of WCLK

is less than tSKEW1, then the IR assertion may be delayed one extra WCLK cycle.

2. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH after one WCLK cycle plus tPAFS. If the time between the rising edge of RCLK and the rising edge of WCLK

is less than tSKEW2, then the PAF deassertion may be delayed one extra WCLK cycle.

3. LD = HIGH.

4. n = PAE Offset, m = PAF offset and D = maximum FIFO depth.

5. D = 16,385 for IDT72T7285, 32,769 for IDT72T7295, 65,537 for IDT72T72105 and 131,073 for IDT72T72115.

6. RCS = LOW.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 16. Read Cycle and Read Chip Select Timing (First Word Fall Through Mode)

WCLK

WEN

D0 - Dn

RCLK

REN

Q0 - Qn

PAF

PAE

m+2

[m+3]

RCSHZ

SKEW1

ENH

PAFS

WFF

ENS

RCS

SKEW2

5994 drw21

PAES

[D-n]

[D-n-1]

[D-1]

[D-n+1]

[m+4]

[D-n+2]

(1) (2)

ENS

RCSLZ

ENS

REF

D-1

][

D-1

][

ENH

NOTES:

is less than tSKEW1, then the IR assertion may be delayed one extra WCLK cycle.

is less than tSKEW2, then the PAF deassertion may be delayed one extra WCLK cycle.

3. LD = HIGH.

4. n = PAE Offset, m = PAF offset and D = maximum FIFO depth.

5. D = 16,385 for IDT72T7285, 32,769 for IDT72T7295, 65,537 for IDT72T72105 and 131,073 for IDT72T72115.

6. OE = LOW.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

WCLK

RCLK

REN

WEN

ENS

ENH

ENS

ENH

ENS

REF

RCS

RCSLZ

W1 W2

RCSHZ

RCSLZ

SKEW

ENS

ENH

1st Word falls through to

O/P register on this cycle

5994 drw22

HIGH-Z

Figure 17 . RCS and REN Read Operation (FWFT Mode)

NOTES:

1 . It is very important that the REN be held HIGH for at least one cycle after RCS has gone LOW. If REN goes LOW on the same cycle as RCS or earlier, then Word, W1 will be lost, Word, W2 will be read on the output when the

bus goes to LOW-Z.

2. The 1st Word will fall through to the output register regardless of REN and RCS. However, subsequent reads require that both REN and RCS be active, LOW.

COMMERCIAL AND INDUSTRIAL

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IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

tREF

tENS

tENH

5994 drw23

tENS

WMK-1

WCLK

RCLK

REN

PAF

PAE

tPAFS

tREF

WEN

tENS

WMK WMK+1

tAtA

WMK+n

WMK WMK+1

tENS

MARK

tENHtENS

tPAES(6)

tSKEW2

tHF

Figure 18. Retransmit from Mark (IDT Standard Mode)

NOTES:

1. Retransmit setup is complete when EF returns HIGH.

2. OE = LOW; RCS = LOW.

3. RT must be HIGH when reading from FIFO.

4. Once MARK is set, the write pointer will not increment past the ‘marked’ location, preventing overwrites of Retransmit data.

5. Before a “MARK” can be set there must be at least x number of bytes of data between the Write Pointer and Read Pointer locations. For the IDT72T7285/72T7295/72T72105 x = 128, for the IDT72T72115 x = 256.

Remember, 8 bytes = 4 (x16) words = 2 (x36) words = 1 (x72) word.

6. A transition in the PAE flag may occur one RCLK cycle earlier than shown, (on cycle 2).

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 19. Retransmit from Mark (First Word Fall Through Mode)

REF

ENS

ENH

5994 drw24

ENS

MK-1

WCLK

RCLK

REN

PAF

PAE

PAFS

REF

WEN

ENS

MK+1

MK+n

MK+1

MK+2

ENS

MARK

ENH

ENS

PAES

(6)

SKEW2

NOTES:

1. Retransmit setup is complete when OR returns LOW.

2. OE = LOW; RCS = LOW.

3. RT must be HIGH when reading from FIFO.

4. Once MARK is set, the write pointer will not increment past the ‘marked’ location, preventing overwrites of Retransmit data.

Remember, 8 bytes = 4 (x16) words = 2 (x36) words = 1 (x72) word.

6. A transition in the PAE flag may occur one RCLK cycle earlier than shown, (on cycle 2).

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 20. Serial Loading of Programmable Flag Registers (IDT Standard and FWFT Modes)

NOTE:

1 . X = 14 for the IDT72T7285, X = 15 for the IDT72T7295, X = 16 for the IDT72T72105, X = 17 for the IDT72T72115.

SCLK

SEN

5994 drw25

EMPTY OFFSET

FULL OFFSET

BIT X

(1)

SENS

LDS

SDS

SENH

LDS

BIT X

(1)

BIT 1

ENH

LDH

SDH

SCLK

SCKH

SCKL

BIT 1

NOTES:

1. OE = LOW; RCS = LOW.

2. The timing diagram illustrates reading of offset registers with an output bus width of 72 bits.

3 . The offset registers cannot be read on consecutive RCLK cycles. The read must be disabled (REN = HIGH) for a minimum of one RCLK cycle in between register accesses.

Figure 22. Parallel Read of Programmable Flag Registers (IDT Standard and FWFT Modes)

Figure 21. Parallel Loading of Programmable Flag Registers (IDT Standard and FWFT Modes)

NOTE:

1. This timing diagram illustrates programming with an input bus width of 72 bits.

WCLK

WEN

- D

5994 drw26

PAE

OFFSET

PAF

OFFSET

LDH

ENH

LDH

ENS

LDS

CLK

CLKH

CLKL

RCLK

REN

- Q

nDATA IN OUTPUT REGISTER PAE OFFSET VALUE PAF OFFSET VALUE

5994 drw27

tLDH

tENH

tCLK

tCLKL

tCLKH

tLDS tLDH

tLDS

tENS

tENH

tENS

tENH

tENS

PAE OFFSET

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

NOTES:

1. m = PAF offset.

2. D = maximum FIFO depth.

In IDT Standard mode: D = 16,384 for the IDT72T7285, 32,768 for the IDT72T7295, 65,536 for the IDT72T72105 and 131,072 for the IDT72T72115.

In FWFT mode: D = 16,385 for the IDT72T7285, 32,769 for the IDT72T7295, 65,537 for the IDT72T72105 and 131,073 for the IDT72T72115.

SKEW2

is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH (after one WCLK cycle plus t

PAFS

). If the time between the

rising edge of RCLK and the rising edge of WCLK is less than t

SKEW2

, then the PAF deassertion time may be delayed one extra WCLK cycle.

4. PAF is asserted and updated on the rising edge of WCLK only.

5. Select this mode by setting PFM HIGH during Master Reset.

Figure 23. Synchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes)

WCLK

WEN

PAF

RCLK

REN

5994 drw28

1212

D-(m+1) words

in FIFO

(2)

D - m words in FIFO

(2)

D - (m +1) words in FIFO

(2)

ENH

ENS

PAFS

ENS

ENH

CLKL

SKEW2

(3)

PAFS

NOTES:

1 . n = PAE offset.

2. For IDT Standard mode

3. For FWFT mode.

tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH (after one RCLK cycle plus tPAES). If the time between the

rising edge of WCLK and the rising edge of RCLK is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.

5. PAE is asserted and updated on the rising edge of WCLK only.

6. Select this mode by setting PFM HIGH during Master Reset.

7. RCS = LOW. Figure 24. Synchronous Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Modes)

WCLK

WEN

PAE

RCLK 12 12

REN

5994 drw29

n + 1 words in FIFO(2),

n + 2 words in FIFO(3)

ENS

SKEW2

(4)

ENH

PAES

n words in FIFO(2),

n + 1 words in FIFO(3)

PAES

n words in FIFO(2),

n + 1 words in FIFO(3)

ENS

ENH

CLKH

CLKL

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

NOTES:

1. m = PAF offset.

2. D = maximum FIFO Depth.

In IDT Standard Mode:

D= 16,384 for the IDT72T7285, 32,768 for the IDT72T7295, 65,536 for the IDT72T72105 and 131,072 for the IDT72T72115.

In FWFT Mode: D= 16,385 for the IDT72T7285, 32,769 for the IDT72T7295, 65,537 for the IDT72T72105 and 131,073 for the IDT72T72115.

3. PAF is asserted to LOW on WCLK transition and reset to HIGH on RCLK transition.

4. Select this mode by setting PFM LOW during Master Reset.

5. RCS = LOW.

Figure 25. Asynchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes)

WCLK

WEN

PAF D - (m + 1) words

in FIFO

RCLK

PAFA

REN

5994 drw30

D - m words

in FIFO

D - (m + 1) words in FIFO

ENS

PAFA

ENH

ENS

CLKL

CLKH

NOTES:

1 . n = PAE offset.

2. For IDT Standard Mode.

3. For FWFT Mode.

4. PAE is asserted LOW on RCLK transition and reset to HIGH on WCLK transition.

5. Select this mode by setting PFM LOW during Master Reset.

6. RCS = LOW.

Figure 26. Asynchronous Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Modes)

WCLK

WEN

PAE n words in FIFO(2),

n + 1 words in FIFO(3)

RCLK

REN

5994 drw31

tPAEA

n + 1 words in FIFO(2),

n + 2 words in FIFO(3)

tPAEA

tENS

tENS tENH

tCLKLtCLKH

n words in FIFO(2),

n + 1 words in FIFO(3)

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

NOTES:

1. In IDT Standard mode: D = maximum FIFO depth. D = 16,384 for the IDT72T7285, 32,768 for the IDT72T7295, 65,536 for the IDT72T72105 and 131,072 for the IDT72T72115.

2. In FWFT mode: D = maximum FIFO depth. D = 16,385 for the IDT72T7285, 32,769 for the IDT72T7295, 65,537 for the IDT72T72105 and 131,073 for the IDT72T72115.

3. RCS = LOW.

Figure 27. Half-Full Flag Timing (IDT Standard and FWFT Modes)

WCLK

tENS tENH

WEN

tENS

tHF

RCLK

tHF

REN

5994 drw32

tCLKLtCLKH

D/2 words in FIFO

(1)

[ + 1] words in FIFO

(2)

D-1

D/2 + 1 words in FIFO

(1)

[ + 2] words in FIFO

(2)

D/2 words in FIFO

(1)

[ + 1] words in FIFO

(2)

D-1

2D-1

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 28. Echo Read Clock & Read Enable Operation (IDT Standard Mode Only)

ENS

ENH

ENS

RCS

RCLK

REN

ERCLK

ENS

5994 drw33

ERCLK

ENH

EREN

CLKEN

REF

D-4

OLZ

OHZ

OLZ

Last Word, W

D-3

D-2

D-1

CLKEN

NOTES:

1. The EREN output is an “ANDed” function of RCS and REN and will follow these inputs provided that the FIFO is not empty. If the FIFO is empty, EREN will go HIGH, thus preventing any reads.

2. The EREN output is synchronous to RCLK.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 29. Echo RCLK and Echo REN Operation (FWFT Mode Only)

NOTE:

1. The O/P Register is the internal output register. Its contents are available on the Qn output bus only when RCS and OE are both active, LOW, that is the bus is not in High-

Impedance state.

2. OE is LOW.

Cycle:

a&b. At this point the FIFO is empty, OR is HIGH.

RCS and REN are both disabled, the output bus is High-Impedance.

c. Word Wn+1 falls through to the output register, OR goes active, LOW.

RCS is HIGH, therefore the Qn outputs are High-Impedance. EREN goes LOW to indicate that a new word has been placed on the output register.

d. EREN goes HIGH, no new word has been placed on the output register on this cycle.

e. No Operation.

f. RCS is LOW on this cycle, therefore the Qn outputs go to Low-Impedance and the contents of the output register (Wn+1) are made available.

NOTE: In FWFT mode is important to take RCS active LOW at least one cycle ahead of REN, this ensures the word (Wn+1) currently in the output register is made

available for at least one cycle.

g. REN goes active LOW, this reads out the second word, Wn+2.

EREN goes active LOW to indicate a new word has been placed into the output register.

h. Word Wn+3 is read out, EREN remains active, LOW indicating a new word has been read out.

NOTE: Wn+3 is the last word in the FIFO.

i. This is the next enabled read after the last word, Wn+3 has been read out. OR flag goes HIGH and EREN goes HIGH to indicate that there is no new word available.

O/P

Reg.

REF

5994 drw34

RCSLZ

REN t

ENS

ENH

RCS

ENS

RCLK

abcdefghi

n+1

WCLK

WEN

D0 - Dn

SKEW1

ENS

ENH

n+2

n+3

ERCLK

EREN

CLKEN

n+1

n+2

n+3

REF

n+1

n+2

n+3

Last Word

ERCLK

HIGH-Z

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 30. Asynchronous Write, Synchronous Read, Full Flag Operation (IDT Standard Mode)

Figure 31. Asynchronous Write, Synchronous Read, Empty Flag Operation (IDT Standard Mode)

RCLK

REN

5994 drw35

Qn W0

tENHtENS

tFFA

WR tCYH

tDS

tDH

WD+1

tCYC

RCLK

REN

5994 drw36

Last Word

tENHtENS

tSKEW

tDH

tREF

tCYL

tDS

tCYH

tDH

tDS

tCYC

NOTE:

1. OE = LOW, WEN = LOW and RCS = LOW.

NOTE:

1. OE = LOW, WEN = LOW and RCS = LOW.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 32. Synchronous Write, Asynchronous Read, Full Flag Operation (IDT Standard Mode)

Figure 33. Synchronous Write, Asynchronous Read, Empty Flag Operation (IDT Standard Mode)

WCLK

WEN

5994 drw37

SKEW

Dn D

WFF

CYL

CYH

Last Word

No Write

F+1

X+1

CYC

WCLK

WEN

5994 drw38

Qn Last Word in Output Register W

EFA

CYH

ENS

ENH

EFA

RPE

NOTE:

1. OE = LOW, RCS = LOW and REN = LOW.

2. Asynchronous Read is available in IDT Standard Mode only.

NOTE:

1. OE = LOW, REN = LOW and RCS = LOW.

2. Asynchronous Read is available in IDT Standard Mode only.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

Figure 34. Asynchronous Write, Asynchronous Read, Empty Flag Operation (IDT Standard Mode)

Figure 35. Asynchronous Write, Asynchronous Read, Full Flag Operation (IDT Standard Mode)

5994 drw39

Qn Last Word in O/P Register

tAA

tCYH

Dn W

tDH

tAA

tEFA

tCYL

tDH

tDS

tCYC

tRPE

5994 drw40

CYH

Dn W

FFA

CYL

y+1

x+1

x+2

FFA

CYC

CYH

CYL

CYC

NOTES:

1. OE = LOW, WEN = LOW, REN = LOW and RCS = LOW

2. Asynchronous Read is available in IDT Standard Mode only.

NOTES:

1. OE = LOW, WEN = LOW, REN = LOW and RCS = LOW.

2. Asynchronous Read is available in IDT Standard Mode only.

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

OPTIONAL CONFIGURATIONS

WIDTH EXPANSION CONFIGURATION

Word width may be increased simply by connecting together the control

signals of multiple devices. Status flags can be detected from any one device.

The exceptions are the EF and FF functions in IDT Standard mode and the IR

and OR functions in FWFT mode. Because of variations in skew between RCLK

and WCLK, it is possible for EF/FF deassertion and IR/OR assertion to vary

by one cycle between FIFOs. In IDT Standard mode, such problems can be

avoided by creating composite flags, that is, ANDing EF of every FIFO, and

separately ANDing FF of every FIFO. In FWFT mode, composite flags can

be created by ORing OR of every FIFO, and separately ORing IR of every

FIFO.

Figure 36 demonstrates a width expansion using two IDT72T7285/

72T7295/72T72105/72T72115 devices. D0 - D71 from each device form a

144-bit wide input bus and Q0-Q71 from each device form a 144-bit wide output

bus. Any word width can be attained by adding additional IDT72T7285/

72T7295/72T72105/72T72115 devices.

NOTES:

1. Use an AND gate in IDT Standard mode, an OR gate in FWFT mode.

2. Do not connect any output control signals directly together.

3. FIFO #1 and FIFO #2 must be the same depth, but may be different word widths.

Figure 36. Block Diagram of 16,384 x 144, 32,768 x 144, 65,536 x 144 and 131,072 x 144 Width Expansion

WRITE CLOCK (WCLK)

m + n

MASTER RESET (MRS)

READ CLOCK (RCLK)

DATA OUT

m + n

WRITE ENABLE (WEN)

FULL FLAG/INPUT READY (FF/IR)

PROGRAMMABLE (PAF)

PROGRAMMABLE (PAE)

EMPTY FLAG/OUTPUT READY (EF/OR) #2

OUTPUT ENABLE (OE)

READ ENABLE (REN)

LOAD (LD)

IDT

72T7285

72T7295

72T72105

72T72115

EMPTY FLAG/OUTPUT READY (EF/OR) #1

PARTIAL RESET (PRS)

5994 drw41

FULL FLAG/INPUT READY (FF/IR) #2

HALF-FULL FLAG (HF)

FIRST WORD FALL THROUGH/

SERIAL INPUT (FWFT/SI)

RETRANSMIT (RT)

FIFO

GATE

(1)

GATE

(1)

- D

DATA IN

m+1

- D

- Qm

m+1

- Q

FIFO

READ CHIP SELECT (RCS)

SERIAL CLOCK (SCLK)

IDT

72T7285

72T7295

72T72105

72T72115

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)

The IDT72T7285 can easily be adapted to applications requiring depths

greater than 16,384, 32,768 for the IDT72T7295, 65,536 for the IDT72T72105

and 131,072 for the IDT72T72115 with an 72-bit bus width. In FWFT mode,

the FIFOs can be connected in series (the data outputs of one FIFO connected

to the data inputs of the next) with no external logic necessary. The resulting

configuration provides a total depth equivalent to the sum of the depths

associated with each single FIFO. Figure 37 shows a depth expansion using

two IDT72T7285/72T7295/72T72105/72T72115 devices.

Care should be taken to select FWFT mode during Master Reset for all FIFOs

in the depth expansion configuration. The first word written to an empty

configuration will pass from one FIFO to the next ("ripple down") until it finally

appears at the outputs of the last FIFO in the chain – no read operation is

necessary but the RCLK of each FIFO must be free-running. Each time the

data word appears at the outputs of one FIFO, that device's OR line goes LOW,

enabling a write to the next FIFO in line.

For an empty expansion configuration, the amount of time it takes for OR of

the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's

outputs) after a word has been written to the first FIFO is the sum of the delays

for each individual FIFO:

(N – 1)*(4*transfer clock) + 3*TRCLK

where N is the number of FIFOs in the expansion and TRCLK is the RCLK

period. Note that extra cycles should be added for the possibility that the tSKEW1

specification is not met between WCLK and transfer clock, or RCLK and transfer

clock, for the OR flag.

The "ripple down" delay is only noticeable for the first word written to an empty

depth expansion configuration. There will be no delay evident for subsequent

words written to the configuration.

The first free location created by reading from a full depth expansion

configuration will "bubble up" from the last FIFO to the previous one until it finally

moves into the first FIFO of the chain. Each time a free location is created in one

FIFO of the chain, that FIFO's IR line goes LOW, enabling the preceding FIFO

to write a word to fill it.

For a full expansion configuration, the amount of time it takes for IR of the first

FIFO in the chain to go LOW after a word has been read from the last FIFO is

the sum of the delays for each individual FIFO:

(N – 1)*(3*transfer clock) + 2 TWCLK

where N is the number of FIFOs in the expansion and TWCLK is the WCLK

period. Note that extra cycles should be added for the possibility that the tSKEW1

specification is not met between RCLK and transfer clock, or WCLK and transfer

clock, for the IR flag.

The Transfer Clock line should be tied to either WCLK or RCLK, whichever

is faster. Both these actions result in data moving, as quickly as possible, to the

end of the chain and free locations to the beginning of the chain.

Figure 37. Block Diagram of 32,768 x 72, 65,536 x 72, 131,072 x 72 and 262,144 x 72 Depth Expansion

INPUT READY

WRITE ENABLE

WRITE CLOCK

WEN

WCLK

DATA IN

RCLK READ CLOCK

RCLK

REN

OE OUTPUT ENABLE

OUTPUT READY

GND

WEN

WCLK

REN

READ ENABLE

DATA OUT

TRANSFER CLOCK

5994 drw42

n n

FWFT/SI FWFT/SI

FWFT/SI

RCS READ CHIP SELECT

RCS

IDT

72T7285

72T7295

72T72105

72T72115

IDT

72T7285

72T7295

72T72105

72T72115

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync ™™

™™

™ 72-BIT FIFO

16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

ORDERING INFORMATION

Plastic Ball Grid Array (BB324, BBG324)

Commercial (0°C to +70°C)

Industrial (-40°C to +85°C)

Low Power

5994 drw43

XXXXX

Device Type

Power

Speed

Package

Process /

Temperature

Range

BLANK

(1)

72T7285 16,384 x 72 ⎯2.5V TeraSync™ FIFO

72T7295 32,768 x 72 ⎯2.5V TeraSync™ FIFO

72T72105 65,536 x 72 ⎯2.5V TeraSync™ FIFO

72T72115 131,072 x 72 ⎯2.5V TeraSync™ FIFO

Commercial Only

Commercial and Industrial

Commercial Only

Clock Cycle Time (t

CLK

)

Speed in Nanoseconds

4-4

6-7

Green

(2)

NOTES:

1. Industrial temperature range product for 5ns speed grade is available as a standard device. All other speed grades are available by special order.

2. Green parts available. For specific speeds contact your sales office.

ORDERABLE PART INFORMATION

Speed

(ns) Orderable Part ID Pkg.

Code Pkg.

Type Temp.

Grade

4-4 72T7285L4-4BB BB324 PBGA C

4-4 72T7285L4-4BBG BBG324 PBGA C

5 72T7285L5BB BB324 PBGA C

6-7 72T7285L6-7BB BB324 PBGA C

10 72T7285L10BB BB324 PBGA C

Speed

(ns) Orderab le Pa rt ID Pkg.

Code Pkg.

Type Temp.

Grade

4-4 72T7295L4-4BB BB324 PBGA C

4-4 72T7295L4-4BBG BBG324 PBGA C

5 72T7295L5BB BB324 PBGA C

6-7 72T7295L6-7BB BB324 PBGA C

10 72T7295L10BB BB324 PBGA C

Speed

(ns) Orde ra b le Part ID Pkg.

Code Pkg.

Type Temp.

Grade

4-4 72T72105L4-4BB BB324 PBGA C

4-4 72T72105L4-4BBG BB324 PBGA C

5 72T72105L5BB BB324 PBGA C

5 72T72105L5BBGI BB324 PBGA I

6-7 72T72105L6-7BB BB324 PBGA C

10 72T72105L10BB BB324 PBGA C

Speed

(ns) Orderable Part ID Pkg.

Code Pkg.

Type Temp.

Grade

4-4 72T72115L4-4BB BB324 PBGA C

4-4 72T72115L4-4BBG BB324 PBGA C

5 72T72115L5BB BB324 PBGA C

5 72T72115L5BBGI BBG324 PBGA I

5 72T72115L5BBI BB324 PBGA I

6-7 72T72115L6-7BB BB324 PBGA C

10 72T72115L10BB BB324 PBGA C

CORPORATE HEADQUARTERS for SALES: for Tech Support:

6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 408-360-1753

San Jose, CA 95138 fax: 408-284-2775 email: FIFOhelp@idt.com

www.idt.com

DATASHEET DOCUMENT HISTORY

05/25/2001 pgs. 1, and 8.

07/19/2001 pgs. 1, and 8.

10/22/2001 pgs. 1-52.

11/19/2001 pgs. 1, 9, 12, 39, and 40.

11/29/2001 pgs. 1, 39, and 40.

01/15/2002 pg. 41.

03/04/2002 pgs. 9, and 27.

06/05/2002 pgs. 9, and 13.

06/10/2002 pg. 9.

02/11/2003 pgs. 7, 8, and 30.

03/03/2003 pgs. 1, 9-11, 28, and 30-31.

09/02/2003 pgs. 6, 15, and 23.

01/11/2007 pgs. 1, and 53.

02/05/2009 pg. 53.

06/12/2017 pgs. 1, 2, and 53.