NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 1 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
1.0 Objective
This specification defines the performa nce, test, quality and reliability requirements of Serial Attached SCSI -
3 host and device series products.
2.0 Scope
This specification is applicable to the termination characteristics of the SAS-3(up to 12Gb/s) family of
products which provide s for direct blin d mate interconnection of disk drives to backplanes.
3.0 Ratings
3.1 Operating Voltage Rating = 30 Volts Max (V
AC
or V
DC
)
3.2 Operating Current Rating = 1.5 Amperes per contact (DC or AC (RMS) MAX. @ 60 HZ)
3.3 Operating Temperature Range = 0 to 85 (
o
C)
3.4 Non-Operating Temperatur e Range = -40 to 85 (
o
C)
4.0 Applicable Documents
4.1 FCI Specifications
4.1.1 Engineering drawings
4.1.2 Process drawings
4.1.3 Application specification(s)
4.1.3.1 BUS-03-114: Capacitance Measurement
4.1.3.2 BUS-15-002/X: Nickel Plating
4.1.3.3 GS-15-007: Electrodeposited Tin
4.1.3.4 GS-15-015: Gold in Contact Plating
4.1.3.5 BUS-19-002: Solderability
4.1.3.6 GS-19-048: Porosity
4.1.3.7 GS-19-039: Plating Adhesion
4.1.3.8 BUS-19-122: Solder Joint Reliability
4.1.3.9 GS-19-027: Moisture Sensitivity Level
4.1.3.10 GS-22-011: Pb-free Solder Heat Resistance Procedure – Convection Oven
Flow
4.1.3.11 GS-22-012: Pb-free Solder Heat Resistance Procedure – Wave Solder
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 2 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
4.1.4 Material specification(s)
4.1.4.1 Refer to the respective FCI engineering drawings
4.2 National or International Standards
4.2.1 Flammability: UL94V-0
4.2.2 EIA 364: Electrical Connector/Socket Test Procedures Includin g Environmental Classifications.
4.2.3 SFF-8482, SFF-8680 Current Revision
4.3 FCI Laboratory Reports - Supporting Data
DL-2012-07-025A-CR (Test per GS-12-282)
4.4 Safety Agency Approvals
UL File: E66906
5.0 Requirements
5.1 Qualification
Connectors furnished under this specification shall be capable of meeting the qualificatio n test
requirements specified h erein. Unless otherwise specified, all measurements shall be performed within
the following lab conditions:
Temperature: 15 to 35°C
Relative Humidity: 20% to 80%
Atmospheric Pressure: 650mm to 800mm of Hg (86~106Kpa)
5.2 Material
The material for each component shall be as specified herein or equivalent. Substitute material shall
meet the performance requirements of this spe cification.
5.2.1 Receptacle Terminal - The base materia l shall be phosphor bronze strip o r equivalent.
5.2.2 Plug Terminal – The base material shall be bra ss or equivalent.
5.2.3 Plug and Receptacle Insulator Housi ngs – The insulators for the plug and receptacle
connectors shall be molded of glass filled high performance polyplastic that is rated UL94V-0
or better in accordance with UL-94. See applicable produ ct drawing for material.
5.2.4 Plug Hold-down Terminal – The ba se material shall be brass or equivalent.
5.2.5 Receptacle Hold-down Terminal – The base material shall be phosphor or brass. See
applicable product dra win g for material.
5.3 Finish
5.3.1 The finish for applicable components shall be as specified herein or equivalent. The plug and
receptacle terminals shall be plated in the contact area to the minimum gold o r palladiu m
nickel with gold flash plating thickness specified on product prints (over 1,27um/50u”
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 3 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
minimum nickel underplate). The plug and receptacle terminal soldertail section shall be
plated with 1,27um/50u” minimum tin as specified on product print (over 1,27um/50u” ni ckel
minimum underplate). The plug and receptacle press fit area shall be plated with 0,5um/20u”
minimum – 1,5um/60u” maximum tin (over 1,27um/50u” nickel minimum underplate). No
plating at cut-off point.
5.3.2 The metal hold down terminals for the plug and recept acle connectors shall be plated with
1,27um/50u” minimum tin as specified on product prints (over 1,2 7um/50um minimum nickel
underplate). No plating at cut-off point.
5.4 Design and Construction
Connectors shall be of the design, const ruction, and physical dimensions specified on the applicable
product drawing. The plug connector shall be a multi-piece assembly having single row of contacts in
the mating area which dividing into two signal segments (S1-S7, S8-S14) and power se gment (P1-
P15) or either one which transition out to either surface mount style or solder style solde rtail to
accommodate various P.C. board thickness. The cont act pattern in the mating area will have short and
long terminals in a specifi c pattern that results in a 0.5mm (0,020’) differential between contact points
in the long and short terminals. (This allows for first mate-last break capability - see respective product
prints for location of short and long terminals.)
The receptacle connector shall be a multi-piece assembly having single row of contacts in the mating
area which dividing into two signal segments (S1-S7, S8-S14) and a power segment (P1-P15) which
transit out to a in-line or stagger through hole pattern or surface mount pad. The contact pattern in the
mating area will have short and long terminals in a specific pattern that results in a 0.5mm (0.020”)
differential between contact points in the long and short terminals. (This allows for first mate-last break
capability – see respective product prints for location of short and long terminals.) The receptacle hold
down terminal has the board retention features that secures the connector to the board in preparation
for solder reflow (through-hole) or board termination (press-fit or SMT).
A polarization peg (optional) on the bottom of the connector housing assures proper connector
orientation during board mounting. The receptacle through hole connector and press fit connector are
designed to terminate to board thickness of 1.57mm (0.062”), 2.36mm (0.093”) and 3.18mm (0.125”).
Visual examinations of connectors are to be done per EIA 364-18.
5.4.1 Mating. The connectors shall be capable of mating and unmating manually without
the use of special tools.
5.4.2 Workmanship. Connectors shall be uniform in quality and shall be free from burrs,
scratches, cracks, voids, chips, blisters, pin holes, sharp edges, and other defects that will
adversely affect product’s life or serviceability.
6.0 Electrical Characteristics
6.1 Current Rati ng
The temperature rise above ambient shall not exceed 30°C at any point in the system when all
contacts are powered at _1.5___ (amperes) or one conta ct is po wered at _1.5___ (amperes).
The following details shall apply:
a. Ambient Conditions – still air at 25°C
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 4 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
b. Current Rating – 1.5A min per contact, continuous
c. Test configuration – (i) Mount the connector to a test PCB.
(ii) Wire power pins P1, P2, P8 and P9 in parallel for power.
(iii) Wire ground pins P4, P5, P6 and P10 and P12 in parallel for return.
(iv) Supply 6A in total of DC current to the power pins in parallel, returning
from the parallel ground pins (P4, P5, P6, P10 and P12).
(v) Measure and record the temperature after 96 hours (45 minutes ON and
15 minutes OFF per hour).
d. Reference SFF-8680 - Power section (per pin):
- Continuous Current 1.5A
- Peak Current 2.5A 1.5s
- Peak Current Pre-charge 6A 1ms
- Signal section (per pin):
- Continuous current 500 mA
6.2 Contact Resistance, Lo w Level (LLCR)
The low level contact resistance shall not exceed __30__ milliohms initially. The low level contact
resistance shall also not exceed __15___ milliohms increase in resistance (from the initial
measurement) after any treatment and/or environmental exposure. Measureme nts shall be in
accordance with EIA 364-23.
The following details shall apply:
a. Test Voltage - 20 milli-volts DC max at open circuit.
b. Test Current - Not to exceed 100 milli-amperes.
6.3 Insulation Resistance
The insulation resistance of mated connectors shall not be less than _1000M_ ohms initially and after
environmental exposure.
Measurements shall be in accordance with EIA 364-21.
The following details shall apply:
a. Test Voltage - _500__ volts DC.
b. Preparation – The connectors shall be mated but not soldered to a PC board
c. Electrification Time - 1 minute.
d. Points of Measurement - Between adjacent contacts
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 5 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
6.4 Dielectric Withstanding Voltage
There shall be no evidence of arc-over, insulation breakdown, or excessive leakage current > _0.5mA
max (amperes) when the mated connectors are tested in accordance with EIA 364-20, method B
The following details shall apply:
a. Test Voltage – DC 500V or AC 500Vrms___ volts (DC or AC RMS, 60Hz).
b. Preparation – The connectors shall be mated but not soldered to a PC board
b. Test Duration – 1 minute.
c. Test Condition - 1 (760 Torr - sea level).
d. Points of Measurement - Between adjacent contacts.
6.5 Press-fit Interface Contact Resistance, Low Level (LLCR)
The interface between compliant section and plated through hole. The change in low level contact
resistance shall not exceed __1.0_ milliohms after environmental exposure when measured in
accordance with EIA 364-23.
The following details shall apply:
a. Test Voltage - 20 milli-volts DC max at open circuit.
b. Test Current - Not to exceed 100 milli-amperes.
7.0 Mechanical Characteristics
7.1 Mating/Unmating Force
Backplane/ Blindmate: The force to mate a receptacle connector and compatible plug conn ector shall
not exceed _25 N (2.55 kgf). The unmat ing force shall not be less than 5 N (0.51 kgf) initial and after
500 cycles.
Cable: The force to mate a receptacle con nector and compatible plug shall not exceed _50 N_(5.1
kgf). The unmating force shall not be less than 20 N (2.04 kgf) initial after 25 cycles.
The following details shall apply:
a. Cros s Head Speed - max. rate 25 mm per minute.
b. Utilize free floating fixtures.
d. Reference – EIA 364-13.
7.2 Durability
Backplane/ Blindmate : The connector pairs shall be capable of withstanding _500___
mating/unmating cycles.
When used for pre-conditioning treatment, __50__ mating/unmating cycles shall be applied prior to
mechanical/environmental exposure and _500___ mat ing/unmating cycles shall be applied after
mechanical/environmental exposure.
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 6 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
Cable : The connector pairs shall be capable of withstanding _25___ mating/unmating cycles.
When used for pre-conditioning treatment, __20__ mating/unmating cycles shall be applied prior to
mechanical/environmental exposure and _25___ mating/unmating cycles shall be applied after
mechanical/environmental exposure.
The following details shall apply:
a. Cycle Rated – Automated Equipment : max rate 200 cycles per hour.
b. Reference – EIA 364-09.
c. No physical damage shall be observed
7.3 Contact Retention
The individual contacts (signal and hold down terminal ) in the plug and receptacle housing shall
withstand an axial load of 227grams mi nimum applied at a rate of 0.20 inches/ minute without
disloging from the housing cavity. Referen ce EIA 364-2 9
7.4 Normal Force
The contact normal force shall not be less tha n 60 grams (nor greater than 200 grams) when tested
in accordance with FCI test specification BUS-03-404.
7.5 Press-fit Individual Pin Insertion/ Retention Force
The force required to insert an individual compliant pin into a plated through hole in a printed circuit
board at a rate of 5mm/0.2 inches per minute shall not exceed 50N. The retention force in the axial
direction opposite that of insertion shall not be less than 3N.
7.6 PCB Hole Deformation Radius
Cross-section parallel to board surface. Photograph and measure hole deformation (deformation on
board material) radius at a point 0.25 mm/ 0.010” from the surface and at the center of the compliant
pin section. Include 10 holes. The minimum average (of 10 holes) hole deformation radius shall be no
greater than 37,5um/ 0.0015” when measured from the drilled hole. The absolute maximum
deformation radius shall not exceed 50u m/ 0.002”. Reference MIL-STD-2166 or EIA-364-96.
Prior to cross-section preparation, pe rform _3___ compliant pin insertions and __3__ compliant pin
withdrawals.
7.7 PCB Hole Wall Damage
Cross-section perpendicular to board surface and through the compliant section wear track.
Photograph and measure the copper thickness remaining between the compliant section and the
printed wiring board laminate. Include 10 holes. The minimum average (of 10 holes) copper thickness
remaining between the compliant pin and the printed wiring board laminate shall not be less than
7.5um/ 0.0003”. In addition, there shall be no copper cracks, separations between conductive
interfaces, or laminate-to-copper separa tions . Reference MIL-STD-2166 or EIA-364-96.
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 7 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
Prior to cross-section preparation, pe rform _3__ compliant pin insertions and _3__ compliant pin
withdrawals.
8.0 Environmental Conditions
After exposure to the following environmental conditions in accordance with the specified test procedure
and/or details, the product shall show no physical damage and shall meet the electrical and mechanical
requirements per pa ragraphs 6.0 and 7.0 as specified in the Table 1 test sequences. Product subjected to
these environmental tests must be ap plied to printed circuit boards. Unless specified otherwise, assemblies
shall be mated during exposure.
8.1 Thermal Shock – EIA 364-32, Test Condition I.
a. Number of Cycles - _10_____
b. Temperature Range - Between – 55°C +0/-3°C _ and +85°C +3/-0° C
c. Time at Each Temperature - _30_ minutes
d. Transfer Time - _5_ minutes, maximum
8.2 Humidity-Temperature Cycling - EIA 364-31 method II, Test Condition A
a. Relative Humidity - _90% ~ 95%
b. Temperature Range - + 40°C ± 2° C
c. Duration - _96 hours__
8.3 High Temperature Life – EIA 364-17, Test Condition III, Method A
a. Test Temperature - +85°C ± 2° C
b. Test Duration - 500 hours
8.4 Mixed Flowing Gas (MFG) – EIA 364-65
a. Class – IIA
b. Duration – 14 days
c. Temperature – 30°C ± 1°C, 70± 2% RH
d. Gas Concentration - Cl
2
10±3ppb, NO
2
200±50ppb, H
2
S 10±5ppb, SO
2
100±20ppb
e. Half of the samples are exposed unmated for seven days, then mated for the remainin g seven
days. Other half of the samples are exposed mate d for full duration test period.
8.5 Mechanical Shock – EIA 364-27
a. Condition – Subject mated connectors to 50G’s half-sine shock pulses of 11 milliseconds during
each x, y and z axis (18 shocks total).
b. Mounting - Rigidly mount assemblies
c. No discontinuities greater than 1 microseconds and no physi cal damage observed
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 8 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
d. Free from any defect such as break, deformation, loosing and falling off etc. on each portion of the
connector
8.6 Vibration (Random) – EIA 364-28
a. Test Condition – VII
b. Vibration Amplitude – Subject mated connectors to 3.10G’ s RMS b etween 20-500 Hz
c. Duration – 15 minutes in each of three mutually perpendicular pla nes
d. Mounting - Rigidly mount assemblies.
e. No di scontinuities greater than 1 microsecond
8.7 Solderability (Lead-Free)
a) Pre-heating : +150°C ± 10°C, 60 ~ 120 sec
b) Soldering : 230°C ± 5°C M IN, 10 ± 1 sec
c) Solder paste to be used is JIS Z 3282 H60A or H63A. Soldering particle is more than 200
meshes. Flux used shall b e from Inactive Rosin family
d) Acceptable Wet Solder Coverage: 95% minimum
e) Reference : GS-19-037 or EIA-364-52 or ANSI-J-STD-002
8.8 Resistance to Soldering Heat (Lead-Free)
For reflow Solder :
a) Pre-heating : 150°C ~ 200°C, 60 ~ 180 sec
b) Soldering : 230°C min, 60 sec max
c) Peak Temperature : 260°C ± 5°C MIN, 10 ± 1 sec
d) Number of times : 3 times
e) Reference : GS-22-011 Peak Reflow – 260 °C
For Dip and Wave Solder :
a) Test Temperature : 260°C ± 5°C, 5 ~ 10 sec ± 1 sec
b) Reference : GS-22-012
8.9 Moisture Sensitivity Testing (For lead free SMT)
8.9.1 Baking :
a) Temperature : +125°C ± 5°C
b) Test Duration : 24 hours ± 2 hours
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 9 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
8.9.2 Humidification :
a) Temperature : +85°C
b) Relative Humidity : 85%
c) Test Duration : 168 hours ± 4 hours
8.9.3 Reflow Soldering
a) Pre-heating : 150°C ~ 200°C, 60 ~ 180 sec
b) Soldering : 217°C min, 60 ~ 150 sec
c) Peak Temperature (at solder joint) : 260°C , 10 ± 1 sec
d) Number of times : 3 times
Reference : GS-19-027
8.10 Salt Spray Test. After exposure of the mate connectors to a salt fog atmosphere, the LLCR shall not
exceed 30 milliohms. The test shall be in accordance with EIA 364-26.
a) Mate connectors
b) Salt Solution : 5 percent (by weight)
c) Test Condition (Duration) : B (48 hours)
9.0 QUALITY ASSURANCE PROVISIONS
9.1 Equipment Calibration
All test equipment and inspection facilities used in the performance of any test shall be maintained in a
calibration system in accordan ce with ANSI Z-540 and ISO 9000.
9.2 Inspection Conditions
Unless otherwise specified herein, all inspections shall be perform ed under the following
ambient conditions:
a. Temperature: 25 ± 5 deg C
b. Relative Humidity: 30% to 60%
c. Barometric Pressure: Local ambient
9.3 Sample Quantity and Description
The numbers of samples to be tested in each group shown in Table 1 are defined as follows:
Group 1 through 11
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 10 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
5 samples in each group: All samples must be free of defects that would impair normal connector
operation. All samples must meet dimensional requirements of connector.
9.4 Acceptance
9.4.1 Electrical and mechanical requirements placed on test samples as indicated in parag ra phs
6.0 and 7.0 shall be established from test data using appropriate statistical techniques or
shall otherwise be customer specified, and all samples tested in accordance with this product
specification shall meet the stated requirements.
9.4.2 Failures attributed to equipment, test setup, or operator error shall not disqualify the product.
If product failure occurs, corrective action shall be taken and samples resubmit ted for
qualification.
9.5 Qualification Testing
Qualification testing shall be performed on sample units produced with equipment and procedures
normally used in production. The test sequences shall be as shown in Table 1.
Visual Examination: EIA 364-18
9.6 Re-Qualification Testing
If any of the following conditions occur, the responsible product engineer shall initiate requalification
testing consisting of all applicable parts of the qualification test matrix Table 1.
a. A significant design change is made to the existing product which impacts the produ ct form, fit
or function. Examples of significant changes shall include, but not be limited to, changes in the
plating material composition or thickness, contact force, contact surface geometry, insulator
design, contact base material, or contact lubrication require ments.
b. A significant change is made to the manufacturing process which impacts the product form, fit or
function.
c. A significant event occurs during production or end use requiring corrective action to be taken
relative to the product design or manufacturing process.
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 11 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
9.7 Qualification Test T able
Table 1 Qualification Testing Matrix
TEST GROUP
1 2 3 4 5A 5B 6 7 8 9 10 11
TEST OR EXAMINATION
PARA
Examination of Product(s) 5.4 1, 5 1, 9 1, 7 1, 8 1, 9 1, 9 1, 4 1,3 1,5,8 1 1,3 1,5
Low Level Contact Resistance 6.2 2(a), 4 3(a),
7 2(a),
4, 6 2, 4(a),
6, 8 2, 4(a),
6, 8 2,4
Insulation Resistance 6.3 2, 6
Dielectric Withstanding Voltage 6.4 3, 7
Current Rating 6.1 2
Low Level Press Fit Interface
Resistance 6.5 2(b)* 3(b)* 2(b)* 4(b)* 4(b)*
Mating (Insertion) Force 7.1 2
Unmating (Removal) Force 7.1 8
Durability 7.2 3
Thermal Shock 8.1 4
Humidity, Temperature Cycling 8.2 5
High Temperature Life 8.3 3 4
Mixed Flowing Gas(7day
unmated + 7day mated) 8.4 5
Mixed Flowing Gas(14day mated) 5
Mechanical Shock 8.5 6
Vibration 8.6 5
Durability (Pre-Condition) 7.2 4 3 3
Reseating (manually unplug/plug
three times) 5 7 7
Contact Retention 7.3 3,7
Normal Force 7.4 2,6
Insertion Force (Press Fit Only) 7.5 2,4,6
Retention Force (Press Fit Only) 7.5 3,5,7
PCB Hole Deformation Radius 7.6 8
PCB Hole Wall Damage 7.7 9
Solderability (Lead Free) 8.7 2
Resistance to Soldering Heat
(Lead Free) 8.8 3
Moisture Sensitivity Test (Lead
Free-For SMT only) 8.9 2
Salt Spray 8.10 3
* Press Fit Connector
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
NUMBER
GS-12-1120
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
Serial Attached SCSI -3 (SAS -3) Connector 12 of 12 C
AUTHORIZED BY DATE
HK LIM 19OCT2017
CLASSIFICATION
UNRESTRICTED
©
2016 AFCI.
Form E-3701 – Revision D
GS-01-029
REVISION RECORD
Rev Page Description EC# Date
A ALL NEW RELEASE S13-0049 25 Nov 13
B 1
ALL Revise operating temperature range to 85 degree C elsi us Max.;
Revise form template ELX-S-24339-
1 20 JUN 16
C 2
11 Remove 4.2 Military Standard
Revise Qualification T est Matrix by adding Test Group 5B ELX-S-28189-
1 19 OCT 17
PDS: Rev :C STATUS:Released Printed: Oct 26, 2017
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
FCI / Amphenol:
10124274-001TRLF 10120998-001C-TRLF 10120909-001C-TRLF 10129880-001C-TRLF 10125549-003C-TRLF
10129900-001LF 10129900-001TRLF 10129368-001C-TRLF 10125550-001C-TRLF 10130433-004C-TRLF
