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ActivePMUTM and ActivePathTM are trademarks of Active-Semi.
I2CTM is a trademark of NXP.
SiRF PrimaTM and Atlas I
V
TM are trademarks of SiRF Technolo
gy,
Inc.
Copyright © 2013 Active-Semi, Inc.
Innovative PowerTM
Active-Semi ProprietaryFor Authorized Recipients and Customers
Rev 4, 17-Sep-13
ACT8935
TYPICAL APPLICATION DIAGRAM
Advanced PMU for SiRF PrimaTM and Atlas IVTM
FEATURES
Optimized for SiRF PrimaTM/Atlas IVTM Processors
Three Step-Down DC/DC Converters
Four Low-Dropout Linear Regulators
Integrated ActivePathTM Charger
I2CTM Serial Interface
Advanced Enable/Disable Sequencing Controller
Minimal External Components
Tiny 5×5mm TQFN55-40 Package
0.75mm Package Height
Pb-Free and RoHS Compliant
GENERAL DESCRIPTION
The ACT8935 is a complete, cost effective, highly-
efficient ActivePMUTM power management solution,
optimized for the unique power, voltage-
sequencing, and control requirements of the SiRF
PrimaTM and Atlas IVTM processors.
This device features three step-down DC/DC
converters and four low-noise, low-dropout linear
regulators, along with a complete battery charging
solution featuring the advanced ActivePathTM
system-power selection function.
The three DC/DC converters utilize a high-
efficiency, fixed-frequency (2MHz), current-mode
PWM control architecture that requires a minimum
number of external components. Two DC/DCs are
capable of supplying up to 900mA of output current,
while the third supports up to 700mA. All four low-
dropout linear regulators are high-performance,
low-noise regulators that each supply up to 150mA.
The ACT8935 is available in a compact, Pb-Free
and RoHS-compliant TQFN55-40 package.
ACT8935
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ActivePMUTM and ActivePathTM are trademarks of Active-Semi. Copyright © 2013 Active-Semi, Inc.
Innovative PowerTM
Active-Semi ProprietaryFor Authorized Recipients and Customers
TABLE OF CONTENTS
General Information ..................................................................................................................................... p. 01
Functional Block Diagram ............................................................................................................................ p. 03
Ordering Information .................................................................................................................................... p. 04
Pin Configuration ......................................................................................................................................... p. 04
Pin Descriptions ........................................................................................................................................... p. 05
Absolute Maximum Ratings ......................................................................................................................... p. 07
I2C Interface Electrical Characteristics ........................................................................................................ p. 08
Global Register Map .................................................................................................................................... p. 09
Register and Bit Descriptions ...................................................................................................................... p. 10
System Control Electrical Characteristics .................................................................................................... p. 15
Step-Down DC/DC Electrical Characteristics .............................................................................................. p. 16
Low-Noise LDO Electrical Characteristics ................................................................................................... p. 17
ActivePathTM Charger Electrical Characteristics .......................................................................................... p. 18
Typical Performance Characteristics ........................................................................................................... p. 20
Application Information ................................................................................................................................ p. 27
Interfacing with the SiRF PrimaTM/Atlas IVTM ................................................................................... p. 27
Control Signals ................................................................................................................................. p. 28
Push-Button Control ......................................................................................................................... p. 29
Control Sequences ........................................................................................................................... p. 29
Functional Description ................................................................................................................................. p. 33
I2C Interface ..................................................................................................................................... p. 33
Voltage Monitor and Interrupt ........................................................................................................... p. 33
Thermal Shutdown ........................................................................................................................... p. 34
Step-Down DC/DC Regulators .................................................................................................................... p. 35
General Description .......................................................................................................................... p. 35
100% Duty Cycle Operation ............................................................................................................. p. 35
Synchronous Rectification ................................................................................................................ p. 35
Soft-Start .......................................................................................................................................... p. 35
Compensation .................................................................................................................................. p. 35
Configuration Options ....................................................................................................................... p. 35
OK[ ] and Output Fault Interrupt ....................................................................................................... p. 36
PCB Layout Considerations ............................................................................................................. p. 36
Low-Noise, Low-Dropout Linear Regulators ................................................................................................ p. 37
General Description .......................................................................................................................... p. 37
Output Current Limit ......................................................................................................................... p. 37
Compensation .................................................................................................................................. p. 37
Configuration Options ....................................................................................................................... p. 37
OK[ ] and Output Fault Interrupt ....................................................................................................... p. 37
PCB Layout Considerations ............................................................................................................. p. 37
ActivePathTM Charger .................................................................................................................................. p. 39
General Description .......................................................................................................................... p. 39
ActivePath Architecture .................................................................................................................... p. 39
System Configuration Optimization .................................................................................................. p. 39
Input Protection ................................................................................................................................ p. 39
Battery Management ........................................................................................................................ p. 39
Charge Current Programming .......................................................................................................... p. 40
Charger Input Interrupts ................................................................................................................... p. 40
Charge-Control State Machine ......................................................................................................... p. 42
State Machine Interrupts .................................................................................................................. p. 42
Thermal Regulation .......................................................................................................................... p. 43
Charge Safety Timers ...................................................................................................................... p. 43
Charge Timer Interrupts ................................................................................................................... p. 43
Charge Status Indicator.................................................................................................................... p. 43
Reverse-Current Protection ............................................................................................................. p. 43
Battery Temperature Monitoring ...................................................................................................... p. 43
Battery Temperature Interrupts ........................................................................................................ p. 44
TQFN55-40 Package Outline and Dimensions ........................................................................................... p. 45
ACT8935
Rev 4, 17-Sep-13
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Innovative PowerTM
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FUNCTIONAL BLOCK DIAGRAM
REG6
LDO
REG7
LDO
ACT8935
Charge
Control
CHGIN
BAT
CURRENT SENSE
VOLTAGE SENSE
4.35V to 6V
AC Adaptor
USB
Li+ Battery
BODY
SWITCH
SDA
ActivePath
Control
System Supply
VSYS
BODY
SWITCH
2.85V
PRE-
CONDITION
110°C
THERMAL
REGULATION
VP2
GP12
SW2
OUT2
OUT2
VP1
GP12
SW1
OUT1
OUT1
To VSYS
(Optional)
TH
OUT7
OUT6
REG5
LDO OUT5
OUT7
OUT6
OUT5
System
Control
nIRQ
REG4
LDO OUT4
OUT4
INL
REFBP
Reference
ACIN
ISET
VP3
GP3
SW3
OUT3
OUT3
+
CHGLEV
GA EP
nSTAT
CHARGE STATUS
VSYS
To VSYS
To VSYS
To VSYS
nPBSTAT
PWRHLD
PWREN
SCL
PBIN
PUSH BUTTON
nRSTO
EXTON
nLBO
1.2V
-
+
LBI
OUT2
BAT
102µA
OUT2
OUT2
OUT2
ACT8935
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Innovative PowerTM
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PIN CONFIGURATION
TOP VIEW
Thin - QFN (TQFN55-40)
ORDERING INFORMATION
: All Active-Semi components are RoHS Compliant and with Pb-free plating unless otherwise specified.
: Standard product options are listed in this table. Contact factory for custom options. Minimum order quantity is 12,000 units.
ACT8935QJ_ _ _-T
Option Code
Pin Count
Package Code
Product Number
Active-Semi
Tape and Reel
PART NUMBER VOUT1 V
OUT2 V
OUT3 V
OUT4 V
OUT5 V
OUT6 V
OUT7 PACKAGE PINS TEMPERATURE
RANGE
ACT8935QJ10D-T 1.8V 3.3V 1.2V 1.2V 1.2V 2.5V 3.3V TQFN55-40 40 -40°C to +85°C
ACT8935QJ1E2-T 2.5V 3.3V 1.2V 1.2V 1.2V 2.5V 3.3V TQFN55-40 40 -40°C to +85°C
LBI
nLBO
OUT3
VP3
SW3
GP3
nPBSTAT
nIRQ
nRSTO
PWREN
VSYS
VSYS
CHGIN
OUT2
VP2
SW2
GP12
SW1
VP1
NC
ACTIVE
AA33
DATE CODE
ACT8935
Rev 4, 17-Sep-13
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Innovative PowerTM
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PIN DESCRIPTIONS
PIN NAME DESCRIPTION
1 REFBP
Reference Bypass. Connect a 0.047F ceramic capacitor from REFBP to GA. This pin is
discharged to GA in shutdown.
2 OUT1 Output Feedback Sense for REG1.
3 GA
Analog Ground. Connect GA directly to a quiet ground node. Connect GA, GP12 and GP3
together at a single point as close to the IC as possible.
4 OUT4
REG4 output. Capable of delivering up to 150mA of output current. Connect a 1.5µF ceramic
capacitor from OUT4 to GA. The output is discharged to GA with 1.5k resistor when disabled.
5 OUT5
REG5 output. Capable of delivering up to 150mA of output current. Connect a 1.5µF ceramic
capacitor from OUT5 to GA. The output is discharged to GA with 1.5k resistor when disabled.
6 INL
Power Input for REG4, REG5, REG6, and REG7. Bypass to GA with a high quality ceramic
capacitor placed as close to the IC as possible.
7 OUT7
REG7 output. Capable of delivering up to 150mA of output current. Connect a 1.5µF ceramic
capacitor from OUT7 to GA. The output is discharged to GA with 1.5k resistor when disabled.
8 OUT6
REG6 output. Capable of delivering up to 150mA of output current. Connect a 1.5µF ceramic
capacitor from OUT6 to GA. The output is discharged to GA with 1.5k resistor when disabled.
9 PBIN
Master Enable Input. Drive PBIN to VSYS through a 50k resistor to enable the IC, drive PBIN
directly to VSYS to assert a manual reset condition. Refer to the PBIN Multi-Function Input section
for more information. PBIN is internally pulled down to GA through a 35k resistor.
10 PWRHLD Power Hold Input. Refer to the Control Sequences section for more information.
11 nRSTO Active Low Reset Output. See the nRSTO Output section for more information.
12 nIRQ
Open-Drain Interrupt Output. nIRQ is asserted any time an unmasked fault condition exists or a
charger interrupt occurs. See the nIRQ Output section for more information.
13 nPBSTAT
Active-Low Open-Drain Push-Button Status Output. nPBSTAT is asserted low whenever the PBIN
is pushed, and is high-Z otherwise. See the nPBSTAT Output section for more information.
14 GP3
Power Ground for REG3. Connect GA, GP12, and GP3 together at a single point as close to the
IC as possible.
15 SW3 Switching Node Output for REG3.
16 VP3
Power Input for REG3. Bypass to GP3 with a high quality ceramic capacitor placed as close to the
IC as possible.
17 OUT3 Output Feedback Sense for REG3.
18 PWREN Power Enable Input. Refer to the Control Sequences section for more information.
19 nLBO
Low Battery Indicator Output. nLBO is asserted low whenever the voltage at LBI is lower than
1.2V, and is high-Z otherwise. See the Precision Voltage Detector section for more information.
20 LBI
Low Battery Input. The input voltage is compared to 1.2V and the output of this comparison drives
nLBO. See the Precision Voltage Detector section for more information.
21 ACIN AC Input Supply Detection. See the Charge Current Prog ramming section for more information.
22 CHGLEV Charge Current Selection Input. See the Charge Current Programming section for more information.
ACT8935
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PIN DESCRIPTIONS CONT’D
PIN NAME DESCRIPTION
25 EXTON
System Wake Up Input. Drive to VSYS or a logic high to wake up the IC from Sleep Mode or
Deep Sleep Mode.
26 SCL Clock Input for I2C Serial Interface.
27 SDA Data Input for I2C Serial Interface. Data is read on the rising edge of SCL.
28 nSTAT
Active-Low Open-Drain Charger Status Output. nSTAT has a 8mA (typ) current limit, allowing it
to directly drive an indicator LED without additional external components. See the Charge Status
Indicator section for more information.
29, 30 BAT Battery Charger Output. Connect this pin directly to the battery anode (+ terminal)
31, 32 VSYS System Output Pin. Bypass to GA with a 10µF or larger ceramic capacitor.
33 CHGIN
Power Input for the Battery Charger. Bypass CHGIN to GA with a capacitor placed as close to
the IC as possible. The battery charger is automatically enabled when a valid voltage is present
on CHGIN .
34 OUT2 Output Feedback Sense for REG2.
35 VP2
Power Input for REG2. Bypass to GP12 with a high quality ceramic capacitor placed as close to
the IC as possible.
36 SW2 Switching Node Output for REG2.
37 GP12
Power Ground for REG1 and REG2. Connect GA, GP12 and GP3 together at a single point as
close to the IC as possible.
38 SW1 Switching Node Output for REG1.
39 VP1
Power Input for REG1. Bypass to GP12 with a high quality ceramic capacitor placed as close to
the IC as possible.
40 NC No Connect. Not internally connected.
EP EP Exposed Pad. Must be soldered to ground on PCB.
24 TH
Temperature Sensing Input. Connect to battery thermistor. TH is pulled up with a 102µA (typ) current
internally. See the Battery Temperature Monitoring section for more information.
23 ISET
Charge Current Set. Program the charge current by connecting a resistor (RISET) between ISET
and GA. See the Charge Current Programming section for more information.
ACT8935
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ABSOLUTE MAXIMUM RATINGS
PARAMETER VALUE UNIT
VP1, VP2 to GP12
VP3 to GP3 -0.3 to + 6 V
CHGIN to GA -0.3 to +14 V
SW1, OUT1 to GP12 -0.3 to (VVP1 + 0.3) V
SW3, OUT3 to GP3 -0.3 to (VVP3 + 0.3) V
PBIN, ACIN, CHGLEV, ISET, LBI, PWRHLD, PWREN, REFBP, SCL, SDA, TH,
EXTON to GA
-0.3 to (VSYS +
0.3) V
OUT4, OUT5, OUT6, OUT7 to GA -0.3 to (VINL + 0.3) V
GP12, GP3 to GA -0.3 to + 0.3 V
Operating Ambient Temperature -40 to 85 °C
Maximum Junction Temperature 125 °C
Maximum Power Dissipation
TQFN55-40 (Thermal Resistance JA = 30oC/W) 2.7 W
Storage Temperature -65 to 150 °C
Lead Temperature (Soldering, 10 sec) 300 °C
BAT, VSYS, INL to GA -0.3 to + 6 V
SW2, OUT2 to GP12 -0.3 to (VVP2 + 0.3) V
nIRQ, nLBO, nPBSTAT, nRSTO, nSTAT to GA -0.3 to + 6 V
: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may
affect device reliability.
ACT8935
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Figure 1:
I2C Compatible Serial Bus Timing
SDA
SCL
tST tSU
tHD tSP
tSCL
Start
condition
Stop
condition
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SCL, SDA Input Low VVSYS = 3.1V to 5.5V, TA = -40ºC to 85ºC 0.35 V
SCL, SDA Input High VVSYS = 3.1V to 5.5V, TA = -40ºC to 85ºC 1.55 V
SDA Leakage Current 1 µA
SDA Output Low IOL = 5mA 0.35 V
SCL Clock Period, tSCL 1.5 µs
SDA Data Setup Time, tSU 100 ns
SDA Data Hold Time, tHD 300 ns
Start Setup Time, tST For Start Condition 100 ns
Stop Setup Time, tSP For Stop Condition 100 ns
SCL Leakage Current
8 18 µA
I2C INTERFACE ELECTRICAL CHARACTERISTICS
ACT8935
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OUTPUT ADDRESS D7 D6 D5 D4 D3 D2 D1 D0
SYS 0x00 NAME TRST nSYSMODE nSYSLEVMSK nSYSSTAT SYSLEV[3] SYSLEV[2] SYSLEV[1] SYSLEV[0]
DEFAULT 0 1 0 R 0 1 1 1
SYS 0x01 NAME Reserved Reserved PWRDS Reserved SCRATCH SCRATCH DSRDY SDREQ
DEFAULT 0 0 0 0 0 0 0 0
REG1 0x20 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]
DEFAULT 0 0 1 0 0 1 0 0
REG1 0x21 NAME Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
DEFAULT 0 0 1 0 0 1 0 0
REG1 0x22 NAME ON PHASE MODE DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK
DEFAULT 0 0 0 0 1 1 0 R
REG2 0x30 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]
DEFAULT 0 0 1 1 1 0 0 1
REG2 0x31 NAME Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
DEFAULT 0 0 1 1 1 0 0 1
REG2 0x32 NAME ON PHASE MODE DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK
DEFAULT 0 0 0 0 1 1 0 R
REG3 0x40 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]
DEFAULT 0 0 0 1 1 0 0 0
REG3 0x41 NAME Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
DEFAULT 0 0 0 1 1 0 0 0
REG3 0x42 NAME ON PWRSTAT MODE DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK
DEFAULT 0 0 0 0 0 0 0 R
REG4 0x50 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]
DEFAULT 0 0 0 1 1 0 0 0
REG4 0x51 NAME ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK
DEFAULT 0 1 0 0 0 0 0 R
REG5 0x54 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]
DEFAULT 0 0 0 1 1 0 0 0
REG5 0x55 NAME ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK
DEFAULT 0 1 0 0 0 0 0 R
REG6 0x60 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]
DEFAULT 0 0 1 1 0 0 0 1
REG6 0x61 NAME ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK
DEFAULT 0 1 0 0 0 0 0 R
REG7 0x64 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]
DEFAULT 0 0 1 1 1 0 0 1
REG7 0x65 NAME ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK
DEFAULT 0 1 0 0 0 0 0 R
APCH 0x70 NAME Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
DEFAULT 0 1 0 1 0 0 0 0
APCH 0x71 NAME SUSCHG Reserved TOTTIMO[1] TOTTIMO[0] PRETIMO[1] PRETIMO[0] OVPSET[1] OVPSET[0]
DEFAULT 0 0 1 0 1 0 0 0
APCH 0x78 NAME TIMRSTAT TEMPSTAT INSTAT CHGSTAT TIMRDAT TEMPDAT INDAT CHGDAT
DEFAULT 0 0 0 0 R R R R
APCH 0x79 NAME TIMRTOT TEMPIN INCON CHGEOCIN TIMRPRE TEMPOUT INDIS CHGEOCOUT
DEFAULT 0 0 0 0 0 0 0 0
APCH 0x7A NAME Reserved Reserved CSTATE[0] CSTATE[1] Reserved Reserved ACINSTAT Reserved
DEFAULT 0 0 R R R R R R
BITS
GLOBAL REGISTER MAP
: Default values of ACT8935QJ10D-T.
2: All bits are automatically cleared to default values when the input power is removed or falls below the system UVLO.
ACT8935
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REGISTER AND BIT DESCRIPTIONS
Table 1:
Global Register Map
OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION
SYS 0x00 [7] TRST R/W
Reset Timer Setting. Defines the reset time-out threshold. Reset
time-out is 65ms when value is 1, reset time-out is 260ms when
value is 0. See nRSTO Output section for more information.
SYS 0x00 [6] nSYSMODE R/W
SYSLEV Mode Select. Defines the response to the SYSLEV
voltage detector, 1: Generate an interrupt when VVSYS falls
below the programmed SYSLEV threshold, 0: automatic
shutdown when VVSYS falls below the programmed SYSLEV
threshold.
SYS 0x00 [5] nSYSLEVMSK R/W
System Voltage Level Interrupt Mask. SYSLEV interrupt is
masked by default, set to 1 to unmask this interrupt. See the
Programmable System Voltage Monitor section for more
information
SYS 0x00 [4] nSYSSTAT R
System Voltage Status. Value is 1 when VVSYS is lower than the
SYSLEV voltage threshold, value is 0 when VVSYS is higher than
the system voltage detection threshold.
SYS 0x00 [3:0] SYSLEV R/W
System Voltage Detect Threshold. Defines the SYSLEV voltage
threshold. See the Programmable System V oltage Monitor
section for more information.
SYS 0x01 [7:6] - R/W Reserved.
SYS 0x01 [5] PWRDS R/W
DEEP-SLEEP Enable Bit. Set bit to 1 to enter DEEP-SLEEP
mode, clear bit to 0 to wake from DEEP-SLEEP. Bit
automatically cleared to 0 when PBIN asserted.
SYS 0x01 [4] - R/W Reserved.
SYS 0x01 [3:2] SCRATCH R/W
Scratchpad Bits. Non-functional bits, maybe be used by user to
store system status information. Volatile bits, which are cleared
when system voltage falls below UVLO threshold.
SYS 0x01 [1] DSRDY R/W
Deep-Sleep Ready Flag. Set bit to 1 before entering DEEP-
SLEEP mode, then read bit during enable sequence to identify
system status: if bit value is 1 the system is waking from DEEP-
SLEEP mode, if bit value is 0 the system is waking from a
disabled state.
SYS 0x01 [0] SDREQ R/W
Shutdown Request Flag. Set the bit value right after start-up
then microprocessor could check whenever the second push-
button is asserted.
REG1 0x20 [7:6] - R Reserved.
REG1 0x20 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage Programmi ng
section for more information.
REG1 0x21 [7:0] - R Reserved.
REG1 0x22 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear
bit to 0 to disable the regulator.
REG1 0x22 [6] PHASE R/W
Regulator Phase Control. Set bit to 1 for the regulator to operate
180° out of phase with the oscillator, clear bit to 0 for the
regulator to operate in phase with the oscillator.
REG1 0x22 [5] MODE R/W
Regulator Mode Select. Set bit to 1 for fixed-frequency PWM
under all load conditions, clear bit to 0 to transit to power-
savings mode under light-load conditions.
REG1 0x22 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG1, REG2, REG3
Turn-on Delay section for more information.
REG1 0x22 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-interrupts,
clear bit to 0 to disable fault-interrupts.
REG1 0x22 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage
exceeds the power-OK threshold, value is 0 otherwise.
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REGISTER AND BIT DESCRIPTIONS CONT’D
OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION
REG2 0x30 [7:6] - R Reserved.
REG2 0x30 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage
Programming section for more information.
REG2 0x31 [7:0] - R Reserved.
REG2 0x32 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear
bit to 0 to disable the regulator.
REG2 0x32 [6] PHASE R/W
Regulator Phase Control. Set bit to 1 for the regulator to
operate 180° out of phase with the oscillator, clear bit to 0 for
the regulator to operate in phase with the oscillator.
REG2 0x32 [5] MODE R/W
Regulator Mode Select. Set bit to 1 for fixed-frequency PWM
under all load conditions, clear bit to 0 to transit to power-
savings mode under light-load conditions.
REG2 0x32 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG1, REG2,
REG3 Turn-on Delay section for more information.
REG2 0x32 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-
interrupts, clear bit to 0 to disable fault-interrupts.
REG2 0x32 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage
exceeds the power-OK threshold, value is 0 otherwise.
REG3 0x40 [7:6] - R Reserved.
REG3 0x40 [5:0] VSET R/W Output Voltage Selection. See the Output Volt age
Programming section for more information.
REG3 0x41 [7:0] - R Reserved.
REG3 0x42 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear
bit to 0 to disable the regulator.
REG3 0x42 [6] PWRSTAT R/W Configures regulator behavior with respect to the PBIN input.
Set bit to 0 to enable regulator when PBIN is asserted
REG3 0x42 [5] MODE R/W
Regulator Mode Select. Set bit to 1 for fixed-frequency PWM
under all load conditions, clear bit to 0 to transit to power-
savings mode under light-load conditions.
REG3 0x42 [4:2] DELAY R/W
Regulator Turn-On Delay Control. See the REG1, REG2,
REG3 Turn-on Delay section for more information.
REG3 0x42 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-
interrupts, clear bit to 0 to disable fault-interrupts.
REG3 0x42 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage
exceeds the power-OK threshold, value is 0 otherwise.
REG4 0x50 [7:6] - R Reserved.
REG4 0x50 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage
Programming section for more information.
REG4 0x51 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear
bit to 0 to disable the regulator.
REG4 0x51 [6] DIS R/W
Output Discharge Control. When activated, LDO output is
discharged to GA through 1.5k resistor when in shutdown.
Set bit to 1 to enable output voltage discharge in shutdown,
clear bit to 0 to disable this function.
REG4 0x51 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power
operating mode, clear bit to 0 for normal mode.
REG4 0x51 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5,
REG6, REG7 Turn-on Delay section for more information.
REG4 0x51 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-
interrupts, clear bit to 0 to disable fault-interrupts.
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OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION
REG4 0x51 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage
exceeds the power-OK threshold, value is 0 otherwise.
REG5 0x54 [7:6] - R Reserved.
REG5 0x54 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage
Programming section for more information.
REG5 0x55 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator,
clear bit to 0 to disable the regulator.
REG5 0x55 [6] DIS R/W
Output Discharge Control. When activated, LDO output is
discharged to GA through 1.5k resistor when in shutdown.
Set bit to 1 to enable output voltage discharge in shutdown,
clear bit to 0 to disable this function.
REG5 0x55 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power
operating mode, clear bit to 0 for normal mode.
REG5 0x55 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5,
REG6, REG7 Turn-on Delay section for more information.
REG5 0x55 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-
interrupts, clear bit to 0 to disable fault-interrupts.
REG5 0x55 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage
exceeds the power-OK threshold, value is 0 otherwise.
REG6 0x60 [7:6] - R Reserved.
REG6 0x60 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage
Programming section for more information.
REG6 0x61 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator,
clear bit to 0 to disable the regulator.
REG6 0x61 [6] DIS R/W
Output Discharge Control. When activated, LDO output is
discharged to GA through 1.5k resistor when in shutdown.
Set bit to 1 to enable output voltage discharge in shutdown,
clear bit to 0 to disable this function.
REG6 0x61 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power
operating mode, clear bit to 0 for normal mode.
REG6 0x61 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5,
REG6, REG7 Turn-on Delay section for more information.
REG6 0x61 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-
interrupts, clear bit to 0 to disable fault-interrupts.
REG6 0x61 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage
exceeds the power-OK threshold, value is 0 otherwise.
REG7 0x64 [7:6] - R Reserved.
REG7 0x64 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage
Programming section for more information.
REG7 0x65 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator,
clear bit to 0 to disable the regulator.
REG7 0x65 [6] DIS R/W
Output Discharge Control. When activated, LDO output is
discharged to GA through 1.5k resistor when in shutdown.
Set bit to 1 to enable output voltage discharge in shutdown,
clear bit to 0 to disable this function.
REG7 0x65 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power
operating mode, clear bit to 0 for normal mode.
REG7 0x65 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5,
REG6, REG7 Turn-on Delay section for more information.
REG7 0x65 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-
interrupts, clear bit to 0 to disable fault-interrupts.
REGISTER AND BIT DESCRIPTIONS CONT’D
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OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION
REG7 0x65 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage
exceeds the power-OK threshold, value is 0 otherwise.
APCH 0x70 [7:0] - R Reserved.
APCH 0x71 [7] SUSCHG R/W
Charge Suspend Control Input. Set bit to 1 to suspend
charging, clear bit to 0 to allow charging to resume.
APCH 0x71 [6] - R/W Reserved.
APCH 0x71 [5:4] TOTTIMO R/W
Total Charge Time-out Selection. See the Charge Safety
Timers section for more information.
APCH 0x71 [3:2] PRETIMO R/W
Precondition Charge Time-out Selection. See the Charge
Safety Timers section for more information.
APCH 0x71 [1:0] OVPSET R/W
Input Over-Voltage Protection Threshold Selection. See the
Input Over-Voltage Protection section for more information.
APCH 0x78 [7] TIMRSTAT1 R/W
Charge Time-out Interrupt Status. Set this bit with
TIMRPRE[ ] and/or TIMRTOT[ ] to 1 to generate an interrupt
when charge safety timers expire, read this bit to get charge
time-out interrupt status. See the Charge Safety Timers
section for more information.
APCH 0x78 [6] TEMPSTAT1 R/W
Battery Temperature Interrupt Status. Set this bit with
TEMPIN[ ] and/or TEMPOUT[ ] to 1 to generate an interrupt
when a battery temperature event occurs, read this bit to get
the battery temperature interrupt status. See the Battery
Temperature Monitoring section for more information.
APCH 0x78 [5] INSTAT R/W
Input Voltage Interrupt Status. Set this bit with INCON[ ] and/
or INDIS[ ] to generate an interrupt when UVLO or OVP
condition occurs, read this bit to get the input voltage
interrupt status. See the Charge Current Progra mming
section for more information.
APCH 0x78 [4] CHGSTAT1 R/W
Charge State Interrupt Status. Set this bit with
CHGEOCIN[ ] and/or CHGEOCOUT[ ] to 1 to generate an
interrupt when the state machine gets in or out of EOC state,
read this bit to get the charger state interrupt status. See the
State Machine Interrupts section for more information.
APCH 0x78 [3] TIMRDAT1 R
Charge Timer Status. Value is 1 when precondition time-out
or total charge time-out occurs. Value is 0 in other case.
APCH 0x78 [2] TEMPDAT1 R
Temperature Status. Value is 0 when battery temperature is
outside of valid range. Value is 1 when battery temperature is
inside of valid range.
APCH 0x78 [1] INDAT R
Input Voltage Status. Value is 1 when a valid input at CHGIN
is present. Value is 0 when a valid input at CHGIN is not
present.
APCH 0x78 [0] CHGDAT1 R
Charge State Machine Status. Value is 1 indicates the
charger state machine is in EOC state, value is 0 indicates
the charger state machine is in other states.
APCH 0x79 [7] TIMRTOT R/W
Total Charge Time-out Interrupt control. Set both this bit and
TIMRSTAT[ ] to 1 to generate an interrupt when a total
charge time-out occurs. See the Charge Safety Timers
section for more information.
APCH 0x79 [6] TEMPIN R/W
Battery Temperature Interrupt Control. Set both this bit and
TEMPSTAT[ ] to 1 to generate an interrupt when the battery
temperature goes into the valid range. See the Battery
Temperature Monitoring section for more information.
REGISTER AND BIT DESCRIPTIONS CONT’D
: Valid only when CHGIN UVLO Threshold<VCHGIN<CHGIN OVP Threshold.
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APCH 0x79 [0] CHGEOCOUT R/W
Charge State Interrupt Control. Set both this bit and
CHGSTAT[ ] to 1 to generate an interrupt when the state
machines jumps out of the EOC state. See the State
Machine Interrupts section for more information.
APCH 0x7A [7:6] - R Reserved.
APCH 0x7A [5:4] CSTATE R
Charge State. Values indicate the current charging state.
See the State Machine Interrupts section for more
information.
APCH 0x7A [3:2] - R Reserved.
APCH 0x7A [1] ACINSTAT R
ACIN Status. Indicates the state of the ACIN input, typically
in order to identify the type of input supply connected. Value
is 1 when ACIN is above the 1.2V precision threshold, value
is 0 when ACIN is below this threshold.
APCH 0x7A [0] - R Reserved.
OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION
APCH 0x79 [1] INDIS R/W
Input Voltage Interrupt Control. Set both this bit and
INSTAT[ ] to 1 to generate an interrupt when CHGIN input
voltage goes out of the valid range. See the Charge Current
Programming section for more information.
APCH 0x79 [2] TEMPOUT R/W
Battery Temperature Interrupt Control. Set both this bit and
TEMPSTAT[ ] to 1 to generate an interrupt when the battery
temperature goes out of the valid range. See the Battery
Temperature Monitoring section for more information.
APCH 0x79 [3] TIMRPRE R/W
PRECHARGE Time-out Interrupt control. Set both this bit
and TIMRSTAT[ ] to 1 to generate an interrupt when a
PRECHARGE time-out occurs. See the Charge Safety
Timers section for more information.
APCH 0x79 [4] CHGEOCIN R/W
Charge State Interrupt Control. Set both this bit and
CHGSTAT[ ] to 1 to generate an interrupt when the state
machine goes into the EOC state. See the State Machine
Interrupts section for more information.
APCH 0x79 [5] INCON R/W
Input Voltage Interrupt Control. Set both this bit and
INSTAT[ ] to 1 to generate an interrupt when CHGIN input
voltage goes into the valid range. See the C harge Current
Programming section for more information.
REGISTER AND BIT DESCRIPTIONS CONT’D
ACT8935
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SYSTEM CONTROL ELECTRICAL CHARACTERISTICS
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input Voltage Range 2.7 5.5 V
UVLO Threshold Voltage VVSYS Rising 2.2 2.45 2.65 V
UVLO Hysteresis VVSYS Falling 200 mV
Supply Current
REG1 Enabled. REG2, REG3, REG4,
REG5, REG6 and REG7 Disabled 155
REG1, REG2 and REG5 Enabled. REG3,
REG4, REG6 and REG7 Disabled 260
REG1, REG2, REG3, REG4, REG5,
REG6 and REG7 Enabled 420
Shutdown Supply Current All Regulators Disabled 8 18 µA
Oscillator Frequency 1.8 2 2.2 MHz
Logic High Input Voltage1 1.4 V
Logic Low Input Voltage 0.4 V
Leakage Current VnIRQ = VnRSTO = 4.2V 1 µA
Low Level Output Voltage2 I
SINK = 5mA 0.35 V
nRSTO Delay 260 ms
Thermal Shutdown Temperature Temperature rising 160 °C
Thermal Shutdown Hysteresis 20 °C
µA
LBI Threshold Voltage VBAT Falling 1.03 1.2 1.31 V
LBI Hysteresis Threshold VBAT Rising 200 mV
: PWRHLD, PWREN, EXTON are logic inputs.
2: nLBO, nPBSTAT, nIRQ, nRSTO are open drain outputs.
3: Typical value shown. Actual value may vary from 227.9ms to 291.2ms.
ACT8935
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STEP-DOWN DC/DC ELECTRICAL CHARACTERISTICS
(VVP1 = VVP2 = VVP3 = 3.6V, TA = 25°C, unless otherwise specified.)
PARAMETER CONDITIONS MIN TYP MAX UNIT
Operating Voltage Range 2.7 5.5 V
UVLO Threshold Input Voltage Rising 2.5 2.6 2.7 V
UVLO Hysteresis Input Voltage Falling 100 mV
Quiescent Supply Current Regulator Enabled 65 90 µA
Shutdown Current VVP = 5.5V, Regulator Disabled 0 1 µA
Output Voltage Accuracy VOUT 1.2V, IOUT = 10mA -1% VNOM
1%
VOUT < 1.2V, IOUT = 10mA -2% VNOM
2%
Line Regulation VVP = Max(VNOM
1
+1, 3.2V) to 5.5V 0.15 %/V
Load Regulation IOUT = 10mA to IMAX2 0.0017 %/mA
Power Good Threshold VOUT Rising 93 %VNOM
Power Good Hysteresis VOUT Falling 2 %VNOM
Oscillator Frequency VOUT 20% of VNOM 1.8 2 2.2 MHz
VOUT = 0V 500 kHz
Soft-Start Period 400 µs
Minimum On-Time 75 ns
REG1
Maximum Output Current 0.9 A
Current Limit 1.2 1.4 1.7 A
PMOS On-Resistance ISW1 = -100mA 0.18
NMOS On-Resistance ISW1 = 100mA 0.16
SW1 Leakage Current VVP1 = 5.5V, VSW1 = 0 or 5.5V 0 1 µA
REG2
Maximum Output Current 0.7 A
Current Limit 0.9 1.1 1.3 A
PMOS On-Resistance ISW2 = -100mA 0.21
NMOS On-Resistance ISW2 = 100mA 0.16
SW2 Leakage Current VVP2 = 5.5V, VSW2 = 0 or 5.5V 0 1 µA
REG3
Maximum Output Current 0.9 A
Current Limit 1.2 1.4 1.7 A
PMOS On-Resistance ISW3 = -100mA 0.18
NMOS On-Resistance ISW3 = 100mA 0.16
SW3 Leakage Current VVP3 = 5.5V, VSW3 = 0 or 5.5V 0 1 µA
V
: VNOM refers to the nominal output voltage level for VOUT as defined by the Ordering Information section.
2: IMAX Maximum Output Current.
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LOW-NOISE LDO ELECTRICAL CHARACTERISTICS
(VINL = 3.6V, COUT4 = COUT5 = COUT6 = COUT7 = 1.5µF, TA = 25°C, LOWIQ[-] = [0], unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Operating Voltage Range 2.5 5.5 V
Output Voltage Accuracy VOUT 1.2V, TA = 25°C, IOUT = 10mA -1% VNOM
2% V
VOUT < 1.2V, TA = 25°C, IOUT = 10mA -2% VNOM
4%
Line Regulation
VINL = Max (VOUT + 0.5V, 3.6V) to 5.5V
LOWIQ[ ] = [0] 0.05
VINL = Max (VOUT + 0.5V, 3.6V) to 5.5V
LOWIQ[ ] = [1] 0.5
Load Regulation IOUT = 1mA to IMAX 0.08 V/A
Power Supply Rejection Ratio f = 1kHz, IOUT = 20mA, VOUT = 1.2V 75 dB
f = 10kHz, IOUT = 20mA, VOUT = 1.2V 65
Supply Current per Output
Regulator Enabled, LOWIQ[ ] = [0] 37 60
µA Regulator Enabled, LOWIQ[ ] = [1] 31 52
Regulator Disabled 0 1
Soft-Start Period VOUT = 2.9V 140 µs
Power Good Threshold VOUT Rising 89 %VNOM
Power Good Hysteresis VOUT Falling 3 %VNOM
Output Noise IOUT = 20mA, f = 10Hz to 100kHz, VOUT =
1.2V 50 µVRMS
Discharge Resistance LDO Disabled, DIS[ ] = 1 1.5 k
REG4
Dropout Voltage IOUT = 80mA, VOUT > 3.1V 90 180 mV
Maximum Output Current 150 mA
Current Limit VOUT = 95% of regulation voltage 200 mA
Stable COUT4 Range 1.5 20 µF
REG5
Dropout Voltage IOUT = 80mA, VOUT > 3.1V 140 280 mV
Maximum Output Current 150 mA
Current Limit VOUT = 95% of regulation voltage 200 mA
Stable COUT5 Range 1.5 20 µF
REG6
Dropout Voltage IOUT = 80mA, VOUT > 3.1V 90 180 mV
Maximum Output Current 150 mA
Current Limit VOUT = 95% of regulation voltage 200 mA
Stable COUT6 Range 1.5 20 µF
REG7
Dropout Voltage IOUT = 80mA, VOUT > 3.1V 140 280 mV
Maximum Output Current 150 mA
Current Limit VOUT = 95% of regulation voltage 200 mA
Stable COUT7 Range 1.5 20 µF
mV/V
: VNOM refers to the nominal output voltage level for VOUT as defined by the Ordering Information section.
2: IMAX Maximum Output Current.
3: Dropout Voltage is defined as the differential voltage between input and output when the output voltage drops 100mV below the
regulation voltage (for 3.1V output voltage or higher).
: LDO current limit is defined as the output current at which the output voltage drops to 95% of the respective regulation voltage.
Under heavy overload conditions the output current limit folds back by 30% (typ)
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ActivePathTM CHARGER ELECTRICAL CHARACTERISTICS
(VCHGIN = 5.0V, TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ActivePath
CHGIN Operating Voltage Range 4.35 6.0 V
CHGIN UVLO Threshold CHGIN Voltage Rising 3.1 3.5 3.9 V
CHGIN UVLO Hysteresis CHGIN Voltage Falling 0.5 V
CHGIN OVP Threshold CHGIN Voltage Rising 6.0 6.6 7.2 V
CHGIN OVP Hysteresis CHGIN Voltage Falling 0.4 V
CHGIN Supply Current
VCHGIN < VUVLO 35 70 µA
VCHGIN < VBAT + 50mV, VCHGIN > VUVLO 100 200 µA
VCHGIN > VBAT + 150mV, VCHGIN > VUVLO
Charger disabled, IVSYS = 0mA 1.3 2.0 mA
CHGIN to VSYS On-Resistance IVSYS = 100mA 0.3
CHGIN to VSYS Current Limit
ACIN = VSYS 1.5 2 A
ACIN = GA, CHGLEV = GA 80 90 100
mA
ACIN = GA, CHGLEV = VSYS 400 450 500
VSYS REGULATION
VSYS Regulated Voltage IVSYS = 10mA 4.45 4.6 4.8 V
nSTAT OUTPUT
nSTAT Sink current VnSTAT = 2V 4 8 12 mA
nSTAT Leakage Current VnSTAT = 4.2V 1 µA
ACIN AND CHGLEV INPUTS
CHGLEV Logic High Input Voltage 1.4 V
CHGLEV Logic Low Input Voltage 0.4 V
CHGLEV Leakage Current VCHGLEV = 4.2V 1 µA
ACIN Voltage Thresholds ACIN voltage rising 1.03 1.2 1.31 V
ACIN Hysteresis Voltage ACIN voltage falling 200 mV
ACIN Leakage Current VACIN = 4.2V 1 µA
TH INPUT
TH Pull-Up Current VCHGIN > VBAT + 100mV, Hysteresis = 50mV 91 102 110 µA
VTH Upper Temperature Voltage
Threshold (VTHH) Hot Detect NTC Thermistor 2.44 2.51 2.58 V
VTH Lower Temperature Voltage
Threshold (VTHL) Cold Detect NTC Thermistor 0.47 0.50 0.53 V
VTH Hysteresis Upper and Lower Thresholds 30 mV
ACT8935
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ActivePathTM CHARGER ELECTRICAL CHARACTERISTICS CONT’D
(VCHGIN = 5.0V, TA = 25°C, unless otherwise specified.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CHARGER
BAT Reverse Leakage Current VCHGIN = 0V, VBAT = 4.2V, IVSYS = 0mA 8 µA
BAT to VSYS On-Resistance 70 m
ISET Pin Voltage Fast Charge 1.2 V
Precondition 0.13
Charge Termination Voltage
VTERM
TA = -20°C to 70°C 4.179 4.2 4.221 V
TA = -40°C to 85°C 4.170 4.2 4.230
Charge Current VBAT = 3.8V
RISET = 6.8K
ACIN = VSYS, CHGLEV = VSYS -10% ICHG
1 +10%
mA
ACIN = VSYS, CHGLEV = GA -10% ICHG/5 +10%
ACIN = GA, CHGLEV = VSYS 400 450 500
ACIN = GA, CHGLEV = GA 80 90 100
Precondition Charge Current VBAT = 2.7V
RISET = 6.8K
ACIN = VSYS, CHGLEV = VSYS 10% ICHG
mA
ACIN = VSYS, CHGLEV = GA 10% ICHG
ACIN = GA, CHGLEV = VSYS 45
ACIN = GA, CHGLEV = GA 45
Precondition Threshold Voltage VBAT Voltage Rising 2.75 2.85 3.0 V
Precondition Threshold
Hysteresis VBAT Voltage Falling 150 mV
END-OF-CHARGE Current
Threshold VBAT = 4.15V
ACIN = VSYS, CHGLEV = VSYS 10% ICHG
ACIN = VSYS, CHGLEV = GA 10% ICHG
Charge Restart Threshold VTERM - VBAT, VBAT Falling 190 205 220 mV
Precondition Safety Timer PRETIMO[ ] = 10 80 min
Total Safety Timer TOTTIMO[ ] = 10 5 hr
Thermal Regulation Threshold 100 °C
mA
ACIN = GA, CHGLEV = GA 45
ACIN = GA, CHGLEV = VSYS 45
: RISET (k) = 2336 × (1V/ICHG (mA)) - 0.205
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TYPICAL PERFORMANCE CHARACTERISTICS
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)
Temperature (°C)
-40 -20 0 20 40 60 80 100 120
ACT8935-001
VREF vs. Temperature
VREF (%)
ACT8935-003
PBIN Startup Sequence
ACT8935-004
PWRHLD Startup Sequence
ACT8935-005
PWREN Sequence
CH1
CH1: VPWRHRD, 5V/div
CH2: VOUT5, 1V/div
CH3: VOUT1, 1.5V/div
CH4: VOUT2, 3V/div
TIME: 2ms/div
CH1
CH2
CH3
CH4
CH5
CH1: VPBIN, 5V/div
CH2: VOUT3, 1V/div
CH3: VOUT5, 1V/div
CH4: VOUT1, 1.5V/div
CH5: VOUT2, 3V/div
TIME: 2ms/div
CH1: VPWREN, 5V/div
CH2: VOUT3, 1V/div
CH3: VOUT4, 1V/div
CH4: VOUT6, 2.5V/div
CH5: VOUT7, 3V/div
TIME: 2ms/div
CH1
CH2
CH3
CH4
CH5
CH2
CH3
CH4
ACT8935-002
Frequency vs. Temperature
Frequency (%)
Temperature (°C)
-40 -20 0 20 40 60 80 85
REG3/PWRSTAT[ ] = 0
Typical VREF=1.2V Typical Oscillator Frequency=2MHz
0.84
0.42
0
-0.42
-0.84
2.5
2
1.5
1
0.5
0
-0.5
-1
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ACT8935-006
Push-Button Response (First Power-Up)
(TA = 25°C, unless otherwise specified.)
ACT8935-008
REG1 Efficiency vs. Output Current
Efficiency (%)
Output Current (mA)
1 10 100 1000
ACT8935-009
REG2 Efficiency vs. Output Current
100
80
60
40
20
0
Efficiency (%)
Output Current (mA)
1 10 100 1000
100
80
60
40
20
0
ACT8935-010
REG3 Efficiency vs. Output Current
100
80
60
40
20
0
Efficiency (%)
Output Current (mA)
1 10 100 1000
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D
CH1
CH2
CH3
Manual Reset Response
CH1
CH2
CH3
ACT8935-007
VOUT = 1.8V VOUT = 3.3V
VOUT = 1.2V
CH1: VPBIN, 2V/div
CH2: VnPBSTAT, 2V/div
CH3:VnRSTO , 2V/div
TIME: 100ms/div
PBIN Resistor = 0
CH1: VPBIN, 1V/div
CH2: VnPBSTAT, 2V/div
CH3: VnRSTO, 2V/div
TIME: 100ms/div
PBIN Resistor = 50k
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN = 5.0V
VIN = 5.0V
VIN = 3.6V
VIN = 3.6V
VIN = 4.2V
VIN = 4.2V
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(TA = 25°C, unless otherwise specified.)
Temperature (°C)
-40 -20 0 20 40 60 80 100 120
ACT8935-013
REG3 Output Voltage vs. Temperature
Output Voltage (V)
1.210
1.206
1.202
1.198
1.194
1.190
Temperature (°C)
-40 -20 0 20 40 60 80 100 120
ACT8935-011
REG1 Output Voltage vs. Temperature
Output Voltage (V)
1.815
1.809
1.803
1.797
1.791
1.785
VOUT1 = 1.8V
ILOAD = 100mA
VOUT3 = 1.2V
ILOAD = 100mA
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D
Temperature (°C)
-40 -20 0 20 40 60 80 100 120
ACT8935-012
REG2 Output Voltage vs. Temperature
Output Voltage (V)
3.310
3.306
3.302
3.298
3.294
3.290
VOUT2 = 3.3V
ILOAD = 100mA
ACT8935-014
REG2 MOSFET Resistance
RDSON (m)
Input Voltage (V)
3.0 3.5 4.0 4.5 5.0 5.5
300
250
200
150
100
50
0
350
ILOAD = 100mA
PMOS
NMOS
ACT8935-015
REG1, 3 MOSFET Resistance
RDSON (m)
Input Voltage (V)
3.0 3.5 4.0 4.5 5.0 5.5
300
250
200
150
100
50
0
350
ILOAD = 100mA
PMOS
NMOS
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(TA = 25°C, unless otherwise specified.)
Output Voltage vs. Output Current
ACT8935-017
1.300
1.260
1.220
1.180
1.140
1.180
Output Voltage (V)
Output Current (mA)
0 20 40 60 80 100 120 160 140
REG4, REG5
ACT8935-016
3.10
2.90
2.70
2.50
2.30
2.10
3.30
3.50
3.70
Output Voltage (V)
Output Voltage vs. Output Current
Output Current (mA)
0 20 40 60 80 100 120 160 140
REG7
REG6
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D
Output Current (mA)
0 20 40 60 80 100 120 140 160
ACT8935-018
Dropout Voltage vs. Output Current
Dropout Voltage (mV)
160
100
80
60
40
20
0
140
120
VIN = 3.3V
REG4
ACT8935-019
Dropout Voltage vs. Output Current
Dropout Voltage (mV)
250
200
150
100
50
0
VIN = 3.3V
REG5
Output Current (mA)
0 20 40 60 80 100 120 140 160
Output Current (mA)
0 50 100 150 200 250 300
ACT8935-020
Dropout Voltage vs. Output Current
Dropout Voltage (mV)
180
100
80
60
40
20
0
160
140
120
REG6
VIN = 3.3V
Output Current (mA)
0 50 100 150 200 250 300
ACT8935-021
Dropout Voltage vs. Output Current
Dropout Voltage (mV)
VIN = 3.3V
REG7
300
250
200
150
100
50
0
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(TA = 25°C, unless otherwise specified.)
ESR ()
ACT8935-023
Region of Stable COUT ESR vs. Output Current
1
0.1
0.01
Output Current (mA)
0 50 100 150
Stable ESR
ACT8935-024
LDO Output Voltage Noise
CH1
CH1: VOUTx, 200µV/div (AC COUPLED)
TIME: 200ms/div
Temperature (°C)
-40 -20 0 20 40 60 80 100 120
ACT8935-022
Output Voltage vs. Temperature
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0
4.00
Output Voltage (V)
REG4, REG5
REG7
REG6
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D
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(TA = 25°C, unless otherwise specified.)
ACIN/CHGLEV = 01
ACT8935-025
VSYS Voltage vs. VSYS Current
6.0
5.0
4.0
3.0
2.0
1.0
0
VSYS Voltage (V)
VSYS Current (mA)
0 500 1000 1500 2000 2500
Battery Voltage (V)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Battery Voltage (V)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
ACT8935-026
VSYS Voltage vs. CHGIN Voltage
VSYS Voltage (V)
CHGIN Voltage (V)
0 2 4 6 8 10
5.2
5.0
4.8
4.6
4.4
4.2
4.0
VVSYS = 4.6V
ACIN/CHGLEV = 11
CH1: IVSYS, 1.00A/div
CH2: IBAT, 1.00A/div
CH3: VBAT, 1.00V/div
CH4: VVSYS, 1V/div
TIME: 200ms/div
DCCC and Battery Supplement Modes
ACT8935-030
CH3
CH4
CH1
CH2 VBAT = 3.5V
VVSYS = 4.6V
IVSYS = 0-1.8A
ICHARGE = 1000mA
VCHGIN = 5.1V-3A
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D
ACT8935-027
Charger Current (mA)
Charger Current vs. Battery Voltage
100
90
80
70
60
50
40
30
20
10
0
ACT8935-028
Charger Current (mA)
Charger Current vs. Battery Voltage
500
450
400
350
300
250
200
150
100
50
0
VCHGIN = 5V
ACIN = 0
CHGLEV = 1
450mA USB
VCHGIN = 5V
ACIN = 0
CHGLEV = 0
90mA USB
ACT8935-029
Charger Current vs. Battery Voltage
1200
1000
800
600
400
200
0
Battery Voltage (V)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Charger Current (mA)
RISET = 2.4k
VCHGIN = 5V
ACIN/CHGLEV = 11
VBAT Falling
VBAT Rising
VBAT Falling
VBAT Rising
VBAT Falling
VBAT Rising
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(TA = 25°C, unless otherwise specified.)
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D
VAC Applied
ACT8935-031
CH1
CH2
CH3
CH4
VCHGIN = 5V
VBAT = 3.5V
RVSYS = 100
ACIN/CHGLEV = 01
CH1: IBAT, 400mA/div
CH2: VBAT, 1V/div
CH3: VVSYS, 2V/div
CH4: VCHGIN, 5V/div
TIME: 40ms/div
VAC Removed
ACT8935-032
CH1
CH2
CH3
CH4
CH1: IBAT, 200mA/div
CH2: VVSYS, 2V/div
CH3: VBAT, 1V/div
CH4: VCHGIN, 5V/div
TIME: 100ms/div
VCHGIN = 5V
VBAT = 3.5V
RVSYS = 100
ACIN/CHGLEV = 01
CH1: IBAT, 1A/div
CH2: VBAT, 2V/div
CH3: VVSYS, 2V/div
CH4: VCHGIN, 5V/div
TIME: 40ms/div
VAC Applied
ACT8935-033
CH1
CH2
CH3
CH4
VCHGIN = 5V
VBAT = 3.97V
RVSYS = 47
ACIN/CHGLEV = 11
VAC Removed
ACT8935-034
CH4
CH3
CH2
CH1
CH1: IBAT, 1A/div
CH2: VVSYS, 2V/div
CH3: VBAT, 2V/div
CH4: VCHGIN, 5V/div
TIME: 40ms/div
VCHGIN = 5V
VBAT = 3.97V
RVSYS = 47
ACIN/CHGLEV = 11
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The ACT8935 is optimized for use in applications
using the SiRF PrimaTM and Atlas IVTM processors,
supporting both the power domains as well as the
signal interface for these processors.
While the ACT8935 supports many possible
configurations for powering these processors, one
of the most common configurations is detailed in
this datasheet. In general, this document refers to
the ACT8935 pin names and functions. However, in
cases where the description of interconnections
between these devices benefits by doing so, both
the ACT8935 pin names and the Prima/Atlas IV pin
names are provided. When this is done, the
Prima/Atlas IV pin names are located after the
ACT8935 pin names, and are italicized and located
inside parentheses. For example, PWREN
(X_PWR_EN) refers to the logic signal applied to
the ACT8935's PWREN input, identifying that it is
driven from the Prima/Atlas IV's X_PWR_EN
output. Likewise, REG2 (VDD_IO) refers to
ACT8935's OUT2 pin, identifying that it is
connected to the Prima/Atlas IV's VDD_IO power
domain.
SiRF POWER DOMAIN ACT8935 CHANNEL TYPE DEFAULT VOLTAGE CURRENT CAPABILITY
VDDIO_MEM REG1 DC/DC 1.8V 900mA
VDD_IO REG2 DC/DC 3.3V 700mA
VDD_PDN/VDD_TSC REG3 DC/DC 1.2V 900mA
VDD_PLL REG4 LDO 1.2V 150mA
VDD_PRE REG5 LDO 1.2V 150mA
VREF_ADC
REG6 LDO 2.5V 150mA VDDA_TSC
VDD2V5_USB
VDD3V3_USB REG7 LDO 3.3V 150mA
Table 2:
ACT8935 and SiRF Power Domains
Table 3:
ACT8935 and SiRF Power Modes
Table 4:
ACT8935 and SiRF Signal Interface
1, 2, , : Typical connections shown, actual connections may vary.
5: Optional connection for power hold control.
ACT8935 DIRECTION SiRF Prima / Atlas IV
PWREN X_PWR_EN
SCL X_SCL_0
SDA X_SDA_0
EXTON X_RTC_Alarm
nRSTO X_Reset_B
nIRQ X_GPIO[1]1
nPBSTAT X_GPIO[0]2
nLBO X_GPIO[4]
CHGLEV X_VIP_PXD[6]
PWRHLD GPIO5
APPLICATION INFORMATION
Interfacing with the SiRF PrimaTM/Atlas IVTM
POWER MODE CONTROL STATE POWER DOMAIN STATE QUIESCENT CURRENT
ALL ON PWRHLD is asserted, PWREN is
asserted, PWRDS[ ] is 0
REG1, REG2, REG3, REG4, REG5,
REG6 and REG7 are on 420µA
SLEEP PWRHLD is asserted, PWREN is
de-asserted, PWRDS[ ] is 0
REG1, REG2 and REG5 are on.
REG3, REG4, REG6 and REG7 are off 260µA
DEEP-SLEEP PWRHLD is asserted, PWREN is
de-asserted, PWRDS[ ] is 1
REG1 is on. REG2, REG3, REG4,
REG5, REG6 and REG7 are off 155µA
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PIN NAME IF PWRSTAT[ ] = 0 IF PWRSTAT[ ] = 1
PBIN REG1, REG2, REG3, REG5 REG1, REG2, REG5
EXTON REG1, REG2, REG3, REG5 REG1, REG2, REG5
PWRHLD REG1, REG2, REG5
PWREN REG3, REG4, REG6, REG7
Table 5:
Control Pins
Control Signals
Enable Inputs
The ACT8935 features a variety of control inputs,
which are used to enable and disable outputs
depending upon the desired mode of operation.
PWREN, PWRHLD, and EXTON are logic inputs,
while PBIN is a unique, multi-function input. Refer
to Table 5 for a description of which channels are
controlled by each input.
PBIN Multi-Function Input
ACT8935 features the PBIN multi-function pin,
which combines system enable/disable control with
a hardware reset function. Select either of the two
pin functions by asserting this pin, either through a
direct connection to VSYS, or through a 50k
resistor to VSYS, as shown in Figure 2.
Figure 2:
PBIN Input
Enable / Wake-Up
The most common application for PBIN is to drive it
to VSYS through a 50k resistor. In this case, PBIN
initiates system enable, if the system is disabled, or
is used to initiate a wake up routine from SLEEP
mode.
In order to initiate a wake up routine or any other
function that is initiated through push-button
assertion, the processor should monitor the
ACT8935's nPBSTAT output. See the nPBSTAT
Output section for more information.
Manual Reset Function
The second major function of the PBIN input is to
provide a manual-reset input for the processor. To
manually-reset the processor, drive PBIN directly to
VSYS through a low impedance (less than 2.5k).
When this occurs, nRSTO immediately asserts low,
then remains asserted low until the PBIN input is
de-asserted and the reset time-out period expires.
nPBSTAT Output
nPBSTAT is an open-drain output that reflects the
state of the PBIN input; nPBSTAT is asserted low
whenever PBIN is asserted, and is high-Z
otherwise. This output is typically used as an
interrupt signal to the processor, to initiate a
software-programmable routine such as operating
mode selection or to open a menu. Connect
nPBSTAT to an appropriate supply voltage
(typically OUT2) through a 10k or greater resistor.
nRSTO Output
nRSTO is an open-drain output which asserts low
upon startup or when manual reset is asserted via
the PBIN input. When asserted on startup, nRSTO
remains low until reset time-out period expires after
OUT2 reaches its power-OK threshold. When
asserted due to manual-reset, nRSTO immediately
asserts low, then remains asserted low until the
PBIN input is de-asserted and the reset time-out
period expires.
Connect a 10k or greater pull-up resistor from
nRSTO to an appropriate voltage supply (typically
OUT2) .
nIRQ Output
nIRQ is an open-drain output that asserts low any
time an interrupt is generated. Connect a 10k or
greater pull-up resistor from nIRQ to an appropriate
voltage supply. nIRQ is typically used to drive the
interrupt input of the system processor.
Many of the ACT8935's functios support interrupt-
generation as a result of various conditions. These
are typically masked by default, but may be
unmasked via the I2C interface. For more
information about the available fault conditions,
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unmasked via the I2C interface. For more
information about the available fault conditions,
refer to the appropriate sections of this datasheet.
Note that under some conditions a false interrupt
may be generated upon initial startup. For this
reason, it is recommended that the interrupt service
routine check and validate nSYSLEVMSK[-] and
nFLTMSK[-] bits before processing an interrupt
generated by these bits. These interrupts may be
validated by nSYSSTAT[-], OK[-] bits.
Push-Button Control
The ACT8935 is designed to initiate a system
enable sequence when the PBIN multi-function
input is asserted. Once this occurs, a power-on
sequence commences, as described below. The
power-on sequence must complete and the
microprocessor must take control (by asserting
PWREN or PWRHLD) before PBIN is de-asserted.
If the microprocessor is unable to complete its
power-up routine successfully before the user
releases the push-button, the ACT8935
automatically shuts the system down. This provides
protection against accidental or momentary
assertions of the push-button. If desired, longer
“push-and-hold” times can be implemented by
simply adding an additional time delay before
asserting PWREN or PWRHLD.
Control Sequences
The ACT8935 features a variety of control
sequences that are optimized for supporting system
enable and disable, as well as both SLEEP and
DEEP-SLEEP modes of the SiRF Prima and Atlas
IV processors.
Enable Sequence
A typical enable sequence initiates as a result of
asserting PBIN, and begins by enabling REG3 and
REG5. When REG5 reaches its power-OK
threshold, REG1 and REG2 are enabled and
nRSTO is asserted low, resetting the
microprocessor. If REG5 is above its power-OK
threshold when the reset timer expires, nRSTO is
de-asserted, allowing the microprocessor to begin
its boot sequence.
During the boot sequence, the processor should
read the DSRDY[ ] bit; if the value of DSRDY[ ] is 0
then the software should proceed with a typical
enable sequence, whereas if the value of DSRDY[-]
is 1 then the software should proceed with a “wake
from DEEP-SLEEP” routine. See the DEEP-SLEEP
Sequence section for more information. During the
boot sequence, the microprocessor must assert
PWRHLD, holding REG1, REG2, and REG5, and
assert PWREN (X_PWR_EN), enabling REG4,
REG6, REG7 and holding REG3 to ensure that the
system remains powered after PBIN is released.
The logic required to control the Prima and Atlas IV
processors requires that REG3 is enabled when
PBIN is asserted during power-up, but then operate
independently of PBIN during SLEEP mode. For
this reason, the ACT8935 features the
REG3/PWRSTAT[-] bit, which controls how REG3
responds when the PBIN input is asserted. The
required functionality may be achieved either by
setting PWRSTAT[-] to 1 during the boot sequence
or, alternatively, as part of the process of entering
SLEEP mode.
Once the power-up routine is completed, the
system remains enabled after the push-button is
released as long as either PWRHLD or PWREN are
asserted high. If the processor does not assert
PWRHLD or PWREN before the user releases the
push-button, the boot-up sequence is terminated
and all regulators are disabled. This provides
protection against "false-enable", when the push-
button is accidentally depressed, and also ensures
that the system remains enabled only if the
processor successfully completes the boot-up
sequence.
Alternatively, an enable sequence may initiate as a
result of asserting the EXTON input. EXTON
enables the ACT8935 in an identical manner as
PBIN, but does not assert nPBSTAT. EXTON is
normally driven by the Prima/Atlas IV's RTC Alarm
signal in order to enable or wake the system from
SLEEP, DEEP-SLEEP, or shut down modes.
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260ms
Power Up Sequence
PBIN
nPBSTAT
nRSTO
PWREN
PWRHLD
OUT5
OUT1
OUT2
OUT4, OUT6, OUT7
OUT3
REG3/PWRSTAT[ ]
SDREQ[ ]
8ms
93% of regulation
Figure 3:
Power Enable Sequence
SLEEP Mode Sequence
The ACT8935 supports Prima/Atlas IV SLEEP
mode operation. Once a successful power-up
routine has been completed, SLEEP mode may be
initiated through a variety of software-controlled
mechanisms.
The Prima and Atlas IV processors require that
REG3 is enabled by PBIN, but then operate
independently of PBIN in SLEEP mode. Therefore,
it is important that REG3/PWRSTAT[-] be set to 1
prior to entering SLEEP mode. This may be done
as part of the boot sequence or as part of the
sequence to enter SLEEP mode.
SLEEP mode is typically initiated when the user
presses the push-button during normal operation.
Pressing the push-button asserts, the nPBSTAT
output, which interrupts the processor. In response
to this interrupt the processor should de-assert
PWREN (X_PWR_EN), disabling REG3, REG4,
REG6 and REG7. PWRHLD should remain
asserted during SLEEP mode so that REG1, REG2
and REG5 remain enabled.
Waking from SLEEP mode is initiated when the
user presses the push-button again, which asserts
nPBSTAT. Processors should respond by asserting
PWREN (X_PWR_EN), which enables REG3,
REG4, REG6 and REG7, so that normal operation
may resume.
DEEP-SLEEP Mode Sequence
The ACT8935 supports Prima/Atlas IV DEEP-
SLEEP mode operation. Once a successful power-
up routine has been completed, DEEP-SLEEP
mode may be initiated through a variety of software-
controlled mechanisms.
DEEP-SLEEP mode is typically initiated when the
user presses the push-button during normal
operation. Pressing the push-button asserts, the
nPBSTAT output, which interrupts the processor. In
response to this interrupt the processor should first
set the DSRDY[ ] bit to 1, then set the PWRDS[-] bit
to 1, disabling REG2, REG3, REG4, REG5, REG6,
and REG7.
Waking from DEEP-SLEEP mode is initiated when
the user presses the push-button again. Asserting
PBIN clears the PWRDS[-] bit to 0, enabling REG3
and REG5. Once REG5 reaches regulation, REG2
is enabled and the nRSTO timer begins. Once the
reset timer period expires the nRSTO output is de-
asserted and the processor initiates a boot-up
sequence, during which it should determine the
system status by reading the DSRDY[-] bit; if the
value of DSRDY[-] is 0 then the software should
proceed with a typical enable sequence, whereas if
the value of DSRDY[-] is 1 then the software should
proceed with a “wake from DEEP-SLEEP” routine.
To complete the wake process, the processor should
assert PWRHLD to ensure that the system remains
enabled after the push-button is released, and assert
PWREN to enable REG4, REG6, and REG7, then set
DSRDY[-] to 0 to complete a full wake-up routine.
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Figure 4:
Sleep Mode Sequence
Figure 5:
Deep Sleep Mode Sequence
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Shutdown Sequence
PBIN
nPBSTAT
nRSTO
PWREN
PWRHLD
OUT5
OUT1
OUT2
OUT4, OUT6, OUT7
OUT3
SDREQ[ ]
Figure 6:
Power Disable Sequence
Disable Sequence
As with the enable sequence, a typical disable
sequence is initiated when the user presses the
push-button, which interrupts the processor via the
nPBSTAT output. The actual disable sequence is
completely software-controlled, but typically
involved initiating various “clean-up” processes
before clear SDREQ[-] bit to 0, disabling all
regulators and shutting the system down.
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I2C Interface
The ACT8935 features an I2C interface that allows
advanced programming capability to enhance
overall system performance. To ensure
compatibility with a wide range of system
processors, the I2C interface supports clock speeds
of up to 400kHz (“Fast-Mode” operation) and uses
standard I2C commands. I2C write-byte commands
are used to program the ACT8935, and I2C read-
byte commands are used to read the ACT8935’s
internal registers. The ACT8935 always operates as
a slave device, and is addressed using a 7-bit slave
address followed by an eighth bit, which indicates
whether the transaction is a read-operation or a
write-operation, [1011011x].
SDA is a bi-directional data line and SCL is a clock
input. The master device initiates a transaction by
issuing a START condition, defined by SDA
transitioning from high to low while SCL is high.
Data is transferred in 8-bit packets, beginning with
the MSB, and is clocked-in on the rising edge of
SCL. Each packet of data is followed by an
“Acknowledge” (ACK) bit, used to confirm that the
data was transmitted successfully.
For more information regarding the I2C 2-wire serial
interface, go to the NXP website: http://www.nxp.com.
Voltage Monitor and Interrupt
Programmable System Voltage Monitor
The ACT8935 features a programmable system-
voltage monitor, which monitors the voltage at
VSYS and compares it to a programmable
threshold voltage. The programmable voltage
threshold is programmed by SYSLEV[3:0], as
shown in Table 6.
SYSLEV[ ] is set to 3.0V by default. There is a
200mV rising hysteresis on SYSLEV[ ] threshold
such that VVSYS needs to be 3.2V(typ) or higher in
order to power up the IC.
The nSYSSTAT[-] bit reflects the output of an
internal voltage comparator that monitors VVSYS
relative to the SYSLEV[-] voltage threshold, the
value of nSYSTAT[-] = 1 when VVSYS is lower than
the SYSLEV[-] voltage threshold, and nSYSTAT[-] =
0 when VVSYS is higher than the SYSLEV[-] voltage
threshold. Note that the SYSLEV[-] voltage
threshold is defined for falling voltages, and that the
comparator produces about 200mV of hysteresis at
VSYS. As a result, once VVSYS falls below the
SYSLEV threshold, its voltage must increase by
more than about 200mV to clear that condition.
After the IC is powered up, the ACT8935 responds
in one of two ways when the voltage at VSYS falls
below the SYSLEV[-] voltage threshold:
1) If nSYSMODE[-] = 1 (default case), when system
vol t age le vel in t err u p t i s u nma s k ed
(nSYSLEVMSK[ ]=1) and VVSYS falls below the
programmable threshold, the ACT8935 asserts
nIRQ, providing a software “under-voltage alarm”.
The response to this interrupt is controlled by the
CPU, but will typically initiate a controlled shutdown
sequence either or alert the user that the battery is
low. In this case the interrupt is cleared when VVSYS
rises up again above the SYSLEV rising threshold
and nSYSSTAT[-] is read via I2C.
2) If nSYSMODE[-] = 0, when VVSYS falls below the
programmable threshold the ACT8935 shuts down,
immediately disabling all regulators. This option is
useful for implementing a programmable “under-
voltage lockout” function that forces the system off
when the battery voltage falls below the SYSLEV
threshold voltage. Since this option does not
support a controlled shutdown sequence, it is
generally used as a "fail-safe" to shut the system
down when the battery voltage is too low.
Table 6:
SYSLEV Falling Threshold
Precision Voltage Detector
The LBI input connects to one input of a precision
voltage comparator, which can be used to monitor a
system voltage such as the battery voltage. An
external resistive-divider network can be used to set
voltage monitoring thresholds, as shown in
Functional Block Diagram. The output of the
comparator is present at the nLBO open-drain
output.
SYSLEV[3:0] SYSLEV Falling Threshold
(Hysteresis = 200mV)
0000 2.3
0001 2.4
0010 2.5
0011 2.6
0100 2.7
0101 2.8
0110 2.9
0111 3.0
1000 3.1
1001 3.2
1010 3.3
1011 3.4
1100 3.5
1101 3.6
1110 3.7
1111 3.8
FUNCTIONAL DESCRIPTION
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Thermal Shutdown
The ACT8935 integrates thermal shutdown
protection circuitry to prevent damage resulting
from excessive thermal stress, as may be
encountered under fault conditions. This circuitry
disables all regulators if the ACT8935 die
temperature exceeds 160°C, and prevents the
regulators from being enabled until the IC
temperature drops by 20°C (typ).
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General Description
The ACT8935 features three synchronous, fixed-
frequency, current-mode PWM step down
converters that achieve peak efficiencies of up to
97%. REG1 and REG3 are capable of supplying up
to 900mA of output current, while REG2 supports
up to 700mA. These regulators operate with a fixed
frequency of 2MHz, minimizing noise in sensitive
applications and allowing the use of small external
components.
100% Duty Cycle Operation
Each regulator is capable of operating at up to
100% duty cycle. During 100% duty-cycle
operation, the high-side power MOSFET is held on
continuously, providing a direct connection from the
input to the output (through the inductor), ensuring
the lowest possible dropout voltage in battery
powered applications.
Synchronous Rectification
REG1, REG2, and REG3 each feature integrated n-
channel synchronous rectifiers, maximizing
efficiency and minimizing the total solution size and
cost by eliminating the need for external rectifiers.
Soft-Start
When enabled, each output voltages tracks an
internal 400s soft-start ramp, minimizing input
current during startup and allowing each regulator
to power up in a smooth, monotonic manner that is
independent of output load conditions.
Compensation
Each buck regulator utilizes current-mode control
and a proprietary internal compensation scheme to
simultaneously simplify external component
selection and optimize transient performance over
its full operating range. No compensation design is
required; simply follow a few simple guidelines
described below when choosing external
components.
Input Capacitor Selection
The input capacitor reduces peak currents and
noise induced upon the voltage source. A 4.7F
ceramic capacitor is recommended for each
regulator in most applications.
Output Capacitor Selection
For most applications, 22F ceramic output
capacitors are recommended for REG1 and REG3,
while 15F ceramic output capacitor is
recommended for REG2.
Despite the advantages of ceramic capacitors, care
must be taken during the design process to ensure
stable operation over the full operating voltage and
temperature range. Ceramic capacitors are
available in a variety of dielectrics, each of which
exhibits different characteristics that can greatly
affect performance over their temperature and
voltage ranges.
Two of the most common dielectrics are Y5V and
X5R. Whereas Y5V dielectrics are inexpensive and
can provide high capacitance in small packages,
their capacitance varies greatly over their voltage
and temperature ranges and are not recommended
for DC/DC applications. X5R and X7R dielectrics
are more suitable for output capacitor applications,
as their characteristics are more stable over their
operating ranges, and are highly recommended.
Inductor Selection
REG1, REG2, and REG3 utilize current-mode
control and a proprietary internal compensation
scheme to simultaneously simplify external
component selection and optimize transient
performance over their full operating range. These
devices were optimized for operation with 2.2H
inductors, although inductors in the 1.5H to 3.3H
range can be used. Choose an inductor with a low
DC-resistance, and avoid inductor saturation by
choosing inductors with DC ratings that exceed the
maximum output current by at least 30%.
Configuration Options
Output Voltage Programming
By default, each regulator powers up and regulates
to its default output voltage. Once the system is
enabled, each regulator's output voltage may be
independently programmed to a different value,
typically in order to minimize the power
consumption of the microprocessor during some
operating modes. Program the output voltages via
the I2C serial interface by writing to the regulator's
VSET[-] register as shown in Table 8.
Enable / Disable Control
During normal operation, each buck may be
enabled or disabled via the I2C interface by writing
to that regulator's ON[ ] bit. The regulator accept
rising or falling edge of ON[ ] bit as on/off signal. To
enable the regulator, clear ON[ ] to 0 first then set to
1. To disable the regulator, set ON[ ] to 1 first then
clear it to 0.
PWRSTAT Control Bit (REG3)
PWRSTAT[-] is a control bit which configures
REG3's behavior with respect to the PBIN input.
STEP-DOWN DC/DC REGULATORS
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The Prima and Atlas IV processors require that
REG3 enable with PBIN, but then operate
independently of PBIN when implementing sleep
modes. PWRSTAT[ ] provides a convenient means
of doing so; PWRSTAT defaults to 0, in which case
REG3 is enabled when PBIN is asserted. Set
PWRSTAT[-] to 1, making REG3's enable state
independent of PBIN, prior to entering SLEEP
mode.
REG1, REG2, REG3 Turn-on Delay
Each of REG1, REG2 and REG3 features a
programmable Turn-on Delay which help ensure a
reliable qualification. This delay is programmed by
DELAY[2:0], as shown in Table 7.
Table 7:
REGx/DELAY[ ] Turn-On Delay
Operating Mode
By default, REG1, REG2, and REG3 each operate
in fixed-frequency PWM mode at medium to heavy
loads, while automatically transitioning to a
proprietary power-saving mode at light loads in
order to maximize standby battery life. In
applications where low noise is critical, force fixed-
frequency PWM operation across the entire load
current range, at the expense of light-load
efficiency, by setting the MODE[ ] bit to 1.
OK[ ] and Output Fault Interrupt
Each DC/DC features a power-OK status bit that
can be read by the system microprocessor via the
I2C interface. If an output voltage is lower than the
power-OK threshold, typically 7% below the
programmed regulation voltage, that regulator's
OK[ ] bit will be 0.
If a DC/DC's nFLTMSK[-] bit is set to 1, the
ACT8935 will interrupt the processor if that DC/DC's
output voltage falls below the power-OK threshold.
In this case, nIRQ will assert low and remain
asserted until either the regulator is turned off or
back in regulation, and the OK[ ] bit has been read
via I2C.
PCB Layout Considerations
High switching frequencies and large peak currents
make PC board layout an important part of step-
down DC/DC converter design. A good design
minimizes excessive EMI on the feedback paths
and voltage gradients in the ground plane, both of
which can result in instability or regulation errors.
Step-down DC/DCs exhibit discontinuous input
current, so the input capacitors should be placed as
close as possible to the IC, and avoiding the use of
via if possible. The inductor, input filter capacitor,
and output filter capacitor should be connected as
close together as possible, with short, direct, and
wide traces. The ground nodes for each regulator's
power loop should be connected at a single point in
a star-ground configuration, and this point should
be connected to the backside ground plane with
multiple via. The output node for each regulator
should be connected to its corresponding OUTx pin
through the shortest possible route, while keeping
sufficient distance from switching nodes to prevent
noise injection. Finally, the exposed pad should be
directly connected to the backside ground plane
using multiple via to achieve low electrical and
thermal resistance.
REGx/VSET[2:0] 000 001 010 011 100 101 110 111
000 0.600 0.800 1.000 1.200 1.600 2.000 2.400 3.200
001 0.625 0.825 1.025 1.250 1.650 2.050 2.500 3.300
010 0.650 0.850 1.050 1.300 1.700 2.100 2.600 3.400
011 0.675 0.875 1.075 1.350 1.750 2.150 2.700 3.500
100 0.700 0.900 1.100 1.400 1.800 2.200 2.800 3.600
101 0.725 0.925 1.125 1.450 1.850 2.250 2.900 3.700
110 0.750 0.950 1.150 1.500 1.900 2.300 3.000 3.800
111 0.775 0.975 1.175 1.550 1.950 2.350 3.100 3.900
REGx/VSET[5:3]
DELAY[2] DELAY[1] DELAY[0] TURN-ON DELAY
0 0 0 0 ms
0 0 1 2 ms
0 1 0 4 ms
0 1 1 8 ms
1 0 0 16 ms
1 0 1 32 ms
1 1 0 64 ms
1 1 1 128 ms
Table 8:
REGx/VSET[ ] Output Voltage Setting
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General Description
REG4, REG5, REG6, and REG7 are low-noise,
low-dropout linear regulators (LDOs) that are each
capable of supplying up to 150mA. Each LDO has
been optimized to achieve low noise and high-
PSRR, achieving more than 65dB PSRR at
frequencies up to 10kHz.
Output Current Limit
Each LDO contains current-limit circuitry featuring a
current-limit fold-back function. During normal and
moderate overload conditions, the regulators can
support more than their rated output currents.
During extreme overload conditions, however, the
current limit is reduced by approximately 30%,
reducing power dissipation within the IC.
Compensation
The LDOs are internally compensated and require
very little design effort, simply select input and
output capacitors according to the guidelines below.
Input Capacitor Selection
Each LDO requires a small ceramic input capacitor
to supply current to support fast transients at the
input of the LDO. Bypassing each INL pin to GA
with 1F. High quality ceramic capacitors such as
X7R and X5R dielectric types are strongly
recommended.
Output Capacitor Selection
Each LDO requires a small 1.5F ceramic output
capacitor for stability. For best performance, each
output capacitor should be connected directly
between the output and GA pins, as close to the
output as possible, and with a short, direct
connection. High quality ceramic capacitors such as
X7R and X5R dielectric types are strongly
recommended.
Configuration Options
Output Voltage Programming
By default, each LDO powers up and regulates to
its default output voltage. Once the system is
enabled, each output voltage may be independently
programmed to a different value by writing to the
regulator's VSET[-] register via the I2C serial
interface as shown in Table 8.
Enable / Disable Control
During normal operation, each LDO may be
enabled or disabled via the I2C interface by writing
to that LDO's ON[ ] bit. The regulator accept rising
or falling edge of ON[ ] bit as on/off signal. To
enable the regulator, clear ON[ ] to 0 first then set to
1. To disable the regulator, set ON[ ] to 1 first then
clear it to 0.
REG4, REG5, REG6, REG7 Turn-on Delay
Each of REG4, REG5, REG6 and REG7 features a
programmable Turn-on Delay which help ensure a
reliable qualification. This delay is programmed by
DELAY[2:0], as shown in Table 7.
Output Discharge
Each of the ACT8935’s LDOs features an optional
output discharge function, which discharges the
output to ground through a 1.5k resistance when
the LDO is disabled. This feature may be enabled
or disabled by setting DIS[-]; set DIS[-] to 1 to
enable this function, clear DIS[-] to 0 to disable it.
Low-Power Mode
Each of ACT8935's LDOs features a LOWIQ[-] bit
which, when set to 1, reduces the LDO's quiescent
current by about 16%, saving power and extending
battery lifetime.
OK[ ] and Output Fault Interrupt
Each LDO features a power-OK status bit that can
be read by the system microprocessor via the
interface. If an output voltage is lower than the
power-OK threshold, typically 11% below the
programmed regulation voltage, the value of that
regulator's OK[-] bit will be 0.
If a LDO's nFLTMSK[-] bit is set to 1, the ACT8935
will interrupt the processor if that LDO's output
voltage falls below the power-OK threshold. In this
case, nIRQ will assert low and remain asserted until
either the regulator is turned off or back in
regulation, and the OK[-] bit has been read via I2C.
PCB Layout Considerations
The ACT8935’s LDOs provide good DC, AC, and
noise performance over a wide range of operating
conditions, and are relatively insensitive to layout
considerations. When designing a PCB, however,
careful layout is necessary to prevent other circuitry
from degrading LDO performance.
A good design places input and output capacitors
as close to the LDO inputs and output as possible,
and utilizes a star-ground configuration for all
regulators to prevent noise-coupling through
ground. Output traces should be routed to avoid
close proximity to noisy nodes, particularly the SW
nodes of the DC/DCs.
LOW-NOISE, LOW-DROPOUT LINEAR REGULATORS
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REFBP is a noise-filtered reference, and internally
has a direct connection to the linear regulator
controller. Any noise injected into REFBP will
directly affect the outputs of the linear regulators,
and therefore special care should be taken to
ensure that no noise is injected to the outputs via
REFBP. As with the LDO output capacitors, the
REFBP bypass capacitor should be placed as close
to the IC as possible, with short, direct connections
to the star-ground. Avoid the use of via whenever
possible. Noisy nodes, such as from the DC/DCs,
should be routed as far away from REFBP as
possible.
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General Description
The ACT8935 features an advanced battery
charger that incorporates the patent-pending
ActivePath architecture for system power selection.
This combination of circuits provides a complete,
advanced battery-management system that
automatically selects the best available input
supply, manages charge current to ensure system
power availability, and provides a complete, high-
accuracy (±0.5%), thermally regulated, full-featured
single-cell linear Li+ charger that can withstand
input voltages of up to 12V.
ActivePath Architecture
The ActivePath architecture performs three
important functions:
1) System Configuration Optimization
2) Input Protection
3) Battery-Management
System Configuration Optimization
The ActivePath circuitry monitors the state of the
input supply, the battery, and the system, and
automatically reconfigures itself to optimize the
power system. If a valid input supply is present,
ActivePath powers the system from the input while
charging the battery in parallel. This allows the
battery to charge as quickly as possible, while
supplying the system. If a valid input supply is not
present, ActivePath powers the system from the
battery. Finally, if the input is present and the
system current requirement exceeds the capability
of the input supply, ActivePath allows system power
to be drawn from both the battery and the input
supply.
Input Protection
Input Over-Voltage Protection
The ActivePath circuitry features input over-voltage
protection circuitry. This circuitry disables charging
when the input voltage exceeds the voltage set by
OVPSET[-] as shown in table 13, but stands off the
input voltage in order to protect the system. Note
that the adjustable OVP threshold is intended to
provide the charge cycle with adjustable immunity
against upward voltage transients on the input, and
is not intended to allow continuous charging with
input voltages above the charger's normal operating
voltage range. Independent of the OVPSET[-]
setting, the charge cycle is not allowed to resume
until the input voltage falls back into the charger's
normal operating voltage range (i.e. below 6.0V).
In an input over-voltage condition this circuit limits
VVSYS to 4.6V, protecting any circuitry connected to
VSYS from the over-voltage condition, which may
exceed this circuitry's voltage capability. This circuit
is capable of withstanding input voltages of up to
12V.
Table 9:
Input Over-Voltage Protection Setting
Input Supply Overload Protection
The ActivePath circuitry monitors and limits the total
current drawn from the input supply to a value set
by the ACIN and CHGLEV inputs, as well as the
resistor connected to ISET. Drive ACIN to a logic-
low for “USB Mode”, which limits the input current to
either 100mA, when CHGLEV is driven to a logic-
low, or 450mA, when CHGLEV is driven to a logic-
high. Drive ACIN to a logic-high for “AC-Mode”,
which limits the input current to 2A, typically.
Input Under Voltage Lockout
If the input voltage applied to CHGIN falls below
3.5V (typ), an input under-voltage condition is
detected and the charger is disabled. Once an input
under-voltage condition is detected, a new charge
cycle will initiate when the input exceeds the under-
voltage threshold by at least 500mV.
Battery Management
The ACT8935 features a full-featured, intelligent
charger for Lithium-based cells, and was designed
specifically to provide a complete charging solution
with minimum system design effort.
The core of the charger is a CC/CV (Constant-
Current/Constant-Voltage), linear-mode charge
controller. This controller incorporates current and
voltage sense circuitry, an internal 70m power
MOSFET, thermal-regulation circuitry, a full-
featured state machine that implements charge
control and safety features, and circuitry that
eliminates the reverse blocking diode required by
conventional charger designs.
The charge termination voltage is highly accurate
(±0.5%), and features a selection of charge safety
time-out periods that protect the system from
operation with damaged cells. Other features
ActivePathTM CHARGER
OVPSET[1] OVPSET[0] OVP THRESHOLD
0 0 6.6V
0 1 7.0V
1 0 7.5V
1 1 8.0V
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include pin-programmable fast-charge current and
one current-limited nSTAT output that can directly
drive LED indicator or provide a logic-level status
signal to the host microprocessor.
Dynamic Charge Current Contr ol (DCCC)
The ACT8935's ActivePath charger features
dynamic charge current control (DCCC) circuitry,
which acts to ensure that the system remains
powered while operating within the maximum output
capability of the power adapter. The DCCC circuitry
continuously monitors VVSYS, and if the voltage at
VSYS drops by more than 200mV, the DCCC
circuitry automatically reduces charge current in
order to prevent VVSYS from continuing to drop.
Charge Current Programming
The ACT8935's ActivePath charger features a
flexible charge current-programming scheme that
combines the convenience of internal charge
current programming with the flexibility of resistor
based charge current programming. Current limits
and charge current programming are managed as a
function of the ACIN and CHGLEV pins, in
combination with RISET, the resistance connected to
the ISET pin.
ACIN is a logic input that configures the current-limit
of ActivePath's linear regulator as well as that of the
battery charger. ACIN features a precise 1.2V logic
threshold, so that the input voltage detection
threshold may be adjusted with a simple resistive
voltage divider. This input also allows a simple, low-
cost dual-input charger switch to be implemented
with just a few, low-cost components.
When the voltage at ACIN is above the 1.2V
threshold, the charger operates in “AC-Mode” with a
charge current programmed by RISET, and the RISET
is given by:
RISET (k) = 2336 × (1V/ICHG (mA)) - 0.205
With a given RISET then charge current will reduce 5
times when CHGLEV is driven low.
When ACIN is below the 1.2V threshold, the
charger operates in “USB-Mode”, with a maximum
CHGIN input current and charge current defined by
the CHGLEV input; 450mA, if CHGLEV is driven to
a logic-high, or 100mA, if CHGLEV is driven to a
logic-low.
The ACT8935's charge current settings are
summarized in Table 10.
Note that the actual charge current may be limited
to a current lower than the programmed fast charge
current due to the ACT8935’s internal thermal
regulation loop. See the Thermal Regulation section
for more information.
Charger Input Interrupts
In order to ease input supply detection and
eliminate the size and cost of external detection
circuitry, the charger has the ability to generate
interrupts based upon the status of the input supply.
This function is capable of generating an interrupt
when the input is connected, disconnected, or both.
An interrupt is generated any time the input supply
is connected when INSTAT[ ] bit is set to 1 and the
INCON[-] bit is set to 1, and an interrupt is
generated any time the input supply is disconnected
when INSTAT[ ] bit is set to 1 and the INDIS[ ] bit is
set to 1.
INDAT[-] indicates the status of the CHGIN input
supply. A value of 1 indicates that a valid CHGIN
input (CHGIN UVLO Threshold<VCHGIN<CHGIN
OVP Threshold) is present, a value of 0 indicates a
valid input is not present.
When an interrupt is generated by the input supply,
reading the INSTAT[ ] returns a value of 1.
INSTAT [ ] is automatically cleared to 0 upon
reading. When no interrupt is generated by the
input supply, reading the INSTAT[ ] returns a value
of 0.
When responding to an Input Status Interrupt, it is
often useful to know the state of the ACIN input. For
example, in a dual-input charger application
knowing the state of the ACIN input can identify
which type of input supply has been connected. The
state of the ACIN input can be read at any time by
reading the ACINSTAT[-] bit, where a value of 1
indicates that the voltage at ACIN is above the 1.2V
threshold (indicating that a wall-cube has been
attached), and a value of 0 indicates that the
voltage is below this threshold (indicating that ACIN
input is not valid and USB supply input is selected).
ACIN CHGLEV CHARGE CURRENT
(mA)
PRECONDITION CHARGE CURRENT
(mA)
0 0 90 45
0 1 450 45
1 0 ICHG/5 10% × ICHG
1 1 ICHG 10% × ICHG
Table 10:
ACIN and CHGLEV Inputs
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Figure 7:
Typical Li+ charge profile and ACT8935 charge states
A: PRECONDITION State
B: FAST-CHARGE State
C: TOP-OFF State
D: END-OF-CHARGE State
Figure 8:
Charger State Diagram
SUSPEND
PRECONDITION
FAST-CHARGE
END-OF-CHARGE
(VCHGIN < VBAT) OR (VCHGIN <V
CHGIN UVLO)
OR (VCHGIN > VOVP) OR (SUSCHG[ ] = 1)
(VCHGIN > VBAT) AND (VCHGIN >V
CHGIN UVLO)
AND (VCHGIN < VOVP) AND (SUSCHG[ ] = 0)
(VBAT > 2.85V) AND
(TQUAL = 32ms)
(VBAT = VTERM ) AND
(TQUAL = 32ms)
TEMP-FAULT
TOP-OFF
(IBAT < 10% x ICHG) OR (Total
Time-out) AND (TQUAL = 32ms)
Total Time-out
TEMP OK
ANY STATE
TEMP NOT OK
TIME-OUT-FAULT
PRECONDITION
Time-out
(VBAT < VTERM - 205mV )
AND (TQUAL = 32ms)
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Charge-Control State Machine
PRECONDITION State
A new charging cycle begins with the
PRECONDITION state, and operation continues in
this state until VBAT exceeds the Precondition
Threshold Voltage. When operating in
PRECONDITION state, the cell is charged at 10%
of the programmed maximum fast-charge constant
current, ICHG.
Once VBAT reaches the Precondition Threshold
Voltage, the state machine jumps to the FAST-
CHARGE state. If VBAT does not reach the
Precondition Threshold Voltage before the
Precondition Time-out period expires, then the state
machine jumps to the TIME-OUT-FAULT state in
order to prevent charging a damaged cell. See the
Charge Safety Timers section for more information.
FAST-CHARGE State
In the FAST-CHARGE state, the charger operates
in constant-current (CC) mode and regulates the
charge current to the current set by RISET . Charging
continues in CC mode until VBAT reaches the charge
termination voltage (VTERM), at which point the state-
machine jumps to the TOP-OFF state. If VBAT does
not reach VTERM before the total time out period
expires then the state-machine will jump to the
“EOC” state and will re-initiate a new charge cycle
after 32ms “relax”. See the Current Limits and
Charge Current Programming sections for more
information about setting the maximum charge
current.
TOP-OFF State
In the TOP-OFF state, the cell charges in constant-
voltage (CV) mode. In CV mode operation, the
charger regulates its output voltage to the 4.20V
charge termination voltage, and the charge current
is naturally reduced as the cell approaches full
charge. Charging continues until the charge current
drops to END-OF-CHARGE current threshold, at
which point the state machine jumps to the END-
OF-CHARGE (EOC) state.
If the state-machine does not jump out of the TOP-
OFF state before the Total-Charge Time-out period
expires, the state machine jumps to the EOC state
and will re-initiate a new charge cycle if VBAT falls
below termination voltage 205mV (typ). For more
information about the charge safety timers, see the
Charging Safety Times section.
END-OF-CHARGE (EOC) State
In the END-OF-CHARGE (EOC) state, the charger
presents a high-impedance to the battery,
minimizing battery current drain and allowing the
cell to “relax”. The charger continues to monitor the
cell voltage, and re-initiates a charging sequence if
the cell voltage drops to 205mV (typ) below the
charge termination voltage.
SUSPEND State
The state-machine jumps to the SUSPEND state
any time the battery is removed, and any time the
input voltage either falls below the CHGIN UVLO
threshold or exceeds the OVP threshold. Once
none of these conditions are present, a new charge
cycle initiates.
A charging cycle may also be suspended manually
by setting the SUSPEND[ ] bit. In this case, initiate
a new charging sequence by clearing SUSPEND[ ]
to 0.
State Machine Interrupts
The charger features the ability to generate
interrupts when the charger state machine
transitions, based upon the status of the CHG_ bits.
Set CHGEOCIN[ ] bit to 1 and CHGSTAT[ ] bit to 1
to generate an interrupt when the charger state
machine goes into the END-OF-CHARGE (EOC)
state. Set CHGEOCOUT[ ] bit to 1 and CHGSTAT[ ]
bit to 1 to generate an interrupt when the charger
state machine exits the EOC state.
CHGDAT[ ] indicates the status of the charger state
machine. A value of 1 indicates that the charger
state machine is in END-OF-CHARGE state, a
value of 0 indicates the charger state machine is in
other states.
When an interrupt is generated by the charger state
machine, reading the CHGSTAT[ ] returns a value
of 1. CHGSTAT[ ] is automatically cleared to 0 upon
reading. When no interrupt is generated by the
charger state machine, reading the CHGSTAT[ ]
returns a value of 0.
For additional information about the charge cycle,
CSTATE[0:1] may be read at any time via I2C to
determine the current charging state.
Table 11:
Charging Status Indication
CSTATE[0] CSTATE[1] STATE MACHINE STATUS
1 1 PRECONDITION State
1 0 FAST-CHARGE/
TOP-OFF State
0 1 END-OF-CHARGE State
0 0 SUSPEND/DISABLED/
FAULT State
ACT8935
Rev 4, 17-Sep-13
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ActivePMUTM and ActivePathTM are trademarks of Active-Semi. Copyright © 2013 Active-Semi, Inc.
Innovative PowerTM
Active-Semi ProprietaryFor Authorized Recipients and Customers
TOTTIMO[1] TOTTIMO[0] TOTAL TIME-OUT
PERIOD
0 0 3 hrs
0 1 4 hrs
1 0 5 hrs
1 1 Disabled
Thermal Regulation
The charger features an internal thermal regulation
loop that monitors die temperature and reduces
charging current as needed to ensure that the die
temperature does not exceed the thermal regulation
threshold of 110°C. This feature protects against
excessive junction temperature and makes the
device more accommodating to aggressive thermal
designs. Note, however, that attention to good
thermal designs is required to achieve the fastest
possible charge time by maximizing charge current.
Charge Safety Timers
The charger features programmable charge safety
timers which help ensure a safe charge by
detecting potentially damaged cells. These timers
are programmable via the PRETIMO[1:0] and
TOTTIMO[1:0] bits, as shown in Table 11 and Table
13. Note that in order to account for reduced charge
current resulting from DCCC operation in thermal
regulation mode, the charge time-out periods are
extended proportionally to the reduction in charge
current. As a result, the actual safety period may
exceed the nominal timer period.
Charger Timer Interrupts
The charger features the ability to generate
interrupts based upon the status of the charge
timers. Set the TIMRPRE[ ] bit to 1 and
TIMRSTAT[ ] bit to 1 to generate an interrupt when
the Precondition Timer expires. Set the TIMRTOT[ ]
bit to 1 and TIMRSTAT[ ] bit to 1 to generate an
interrupt when the Total-Charge Timer expires.
TIMRDAT[ ] indicates the status of the charge
timers. A value of 1 indicates a precondition time-
out or a total charge time-out occurs, a value of 0
indicates other cases.
When an interrupt is generated by the charge
timers, reading the TIMRSTAT[ ] returns a value of
1. TIMRSTAT[ ] is automatically cleared to 0 upon
reading. When no interrupt is generated by the
charge timers, reading the TIMRSTAT[ ] returns a
value of 0.
Table 12:
PRECONDITION Safety Timer Setting
Table 13:
Total Safety Timer Setting
Charge Status Indicator
The charger provides a charge-status indicator
output, nSTAT. nSTAT is an open-drain output
which sinks current when the charger is in an
active-charging state, and is high-Z otherwise.
nSTAT features an internal 8mA current limit, and is
capable of directly driving a LED without the need
of a current-limiting resistor or other external
circuitry. To drive an LED, simply connect the LED
between nSTAT pin and an appropriate supply,
such as VSYS. For a logic-level charge status
indication, simply connect a resistor from nSTAT to
an appropriate voltage supply.
Table 14:
Charging Status Indication
Reverse-Current Protection
The charger includes internal reverse-current
protection circuitry that eliminates the need for
blocking diodes, reducing solution size and cost as
well as dropout voltage relative to conventional
battery chargers. When the voltage at CHGIN falls
below VBAT, the charger automatically reconfigures
its power switch to minimize current drawn from the
battery.
Battery Temperature Monitoring
In a typical application, the TH pin is connected to
the battery pack's thermistor input, as shown in
Figure 9. The charger continuously monitors the
temperature of the battery pack by injecting a
102A (typ) current into the thermistor (via the TH
PRETIMO[1] PRETIMO[0] PRECONDITION
TIME-OUT PERIOD
0 0 40 mins
0 1 60 mins
1 0 80 mins
1 1 Disabled
STATE nSTAT
PRECONDITION Active
FAST-CHARGE Active
TOP-OFF Active
END-OF-CHARGE High-Z
SUSPEND High-Z
TEMPERATURE FAULT High-Z
TIME-OUT-FAULT High-Z
ACT8935
Rev 4, 17-Sep-13
- 44 - www.active-semi.com
ActivePMUTM and ActivePathTM are trademarks of Active-Semi. Copyright © 2013 Active-Semi, Inc.
Innovative PowerTM
Active-Semi ProprietaryFor Authorized Recipients and Customers
pin) and sensing the voltage at TH. The voltage at
TH is continuously monitored, and charging is
suspended if the voltage at TH exceeds either of
the internal VTHH and VTHL thresholds of 0.5V and
2.51V, respectively.
The net resistance (from TH to GA) required to
cross the thresholds are given by:
102A × RNOM × kHOT = 0.5V RNOM × kHOT 5k
102A × RNOM × kCOLD = 2.51V RNOM × kCOLD
25k
where RNOM is the nominal thermistor resistance at
room temperature, and kHOT and kCOLD represent the
ratios of the thermistor's resistance at the desired
hot and cold thresholds, respectively, to the
resistance at 25°C.
Battery Temperature Interrupts
In order to ease detecting the status of the battery
temperature, the charger features the ability to
generate interrupts based upon the status of the
battery temperature. Set the TEMPOUT[ ] bit to 1
and TEMPSTAT[ ] bit to 1 to generate an interrupt
when battery temperature goes out of the valid
temperature range. Set the TEMPIN[ ] bit to 1 and
TEMPSTAT[ ] bit to 1 to generate an interrupt when
battery temperature returns to the valid range.
TEMPDAT[ ] indicates the status of the battery
temperature. A value of 1 indicates the battery
temperature is inside of the valid range, a value of 0
indicates the battery is outside of the valid range.
When an interrupt is generated by the battery
temperature event, reading the TEMPSTAT[ ]
returns a value of 1. TEMPSTAT[ ] is automatically
cleared to 0 upon reading. When no interrupt is
generated by the battery temperature event,
reading the TEMPSTAT[ ] returns a value of 0.
Figure 9:
Simple Configuration
ACT8935
Rev 4, 17-Sep-13
- 45 - www.active-semi.com
ActivePMUTM and ActivePathTM are trademarks of Active-Semi. Copyright © 2013 Active-Semi, Inc.
Innovative PowerTM
Active-Semi ProprietaryFor Authorized Recipients and Customers
TQFN55-40 PACKAGE OUTLINE AND DIMENSIONS
SYMBOL
DIMENSION IN
MILLIMETERS
DIMENSION IN
INCHES
MIN MAX MIN MAX
A 0.700 0.800 0.028 0.031
A1 0.200 REF 0.008 REF
A2 0.000 0.050 0.000 0.002
b 0.150 0.250 0.006 0.010
D 4.900 5.100 0.193 0.201
E 4.900 5.100 0.193 0.201
D2 3.450 3.750 0.136 0.148
E2 3.450 3.750 0.136 0.148
e 0.400 BSC 0.016 BSC
L 0.300 0.500 0.012 0.020
R 0.300 0.012
Active-Semi, Inc. reserves the right to modify the circuitry or specifications without notice. Users should evaluate each
product to make sure that it is suitable for th eir applicatio ns. Active-Se mi products are not inten ded or authori zed for use
as critical components in life-support devices or systems. Active-Semi, Inc. does not assume any liability arising out of
the use of any product or circuit described in this datasheet, nor does it convey any patent license.
Active-Semi and its logo are trademarks of Active-Semi, Inc. F or more info rmation on this and other products, contact
sales@active-semi.com or visit http://www.active-semi.com.
is a registered trademark of Active-Semi.
Mouser Electronics
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