Absolute Maximum Ratings
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
(Note 5)
LM108/LM208 LM308
Supply Voltage g20V g18V
Power Dissipation (Note 1) 500 mW 500 mW
Differential Input Current (Note 2) g10 mA g10 mA
Input Voltage (Note 3) g15V g15V
Output Short-Circuit Duration Continuous Continuous
Operating Temperature Range (LM108) b55§Ctoa
125§C0
§
Ctoa
70§C
(LM208) b25§Ctoa85§C
Storage Temperature Range b65§Ctoa
150§Cb65§Ctoa
150§C
Lead Temperature (Soldering, 10 sec)
DIP 260§C 260§C
H Package Lead Temp
(Soldering 10 seconds) 300§C 300§C
Soldering Information
Dual-In-Line Package
Soldering (10 seconds) 260§C
Small Outline Package
Vapor Phase (60 seconds) 215§C
Infrared (15 seconds) 220§C
See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product
Reliability’’ for other methods of soldering surface mount devices.
ESD Tolerance (Note 6) 2000V
Electrical Characteristics (Note 4)
Parameter Condition LM108/LM208 LM308 Units
Min Typ Max Min Typ Max
Input Offset Voltage TAe25§C 0.7 2.0 2.0 7.5 mV
Input Offset Current TAe25§C 0.05 0.2 0.2 1 nA
Input Bias Current TAe25§C 0.8 2.0 1.5 7 nA
Input Resistance TAe25§C 3070 1040 MX
Supply Current TAe25§C 0.3 0.6 0.3 0.8 mA
Large Signal Voltage TAe25§C, VSeg15V 50 300 25 300 V/mV
Gain VOUT eg10V, RLt10 kX
Input Offset Voltage 3.0 10 mV
Average Temperature
Coefficient of Input 3.0 15 6.0 30 mV/§C
Offset Voltage
Input Offset Current 0.4 1.5 nA
Average Temperature
Coefficient of Input 0.5 2.5 2.0 10 pA/§C
Offset Current
Input Bias Current 3.0 10 nA
Supply Current TAea
125§C 0.15 0.4 mA
Large Signal Voltage VSeg15V, VOUT eg10V 25 15 V/mV
Gain RLt10 kX
Output Voltage Swing VSeg15V, RLe10 kXg13 g14 g13 g14 V
2