RClamp7522T Ultra Low Capacitance TVS Array PROTECTION PRODUCTS - RailClamp(R) Description PRELIMINARY Features RailClamp TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClamp(R)7522T has a typical capacitance of only 0.25pF. This allows it to be used on circuits operating in excess of 3GHz without signal attenuation. Each device will protect two data lines lines and the voltage supply bus in USB applications. Steering diodes serve as backdrive protection on the VBus pin for operation during power-down. The device may also be used to protect up to three high speed data lines in applications such as camera data lines in mobile phones. The RClamp7522T is in a 5-pin SLP1007N5T package. It measures 1.0 x 0.7mm with a nominal height of 0.40mm. The innovative flow through package design simplifies pcb layout and maximizes signal integrity on high-speed lines. The combination of small size, low capacitance, and high level of ESD protection makes this device a flexible solution for applications such as camera data lines, MHL, and USB interfaces. (R) ESD protection for high-speed data lines to IEC 61000-4-2 (ESD) 25kV (air), 15kV (contact) IEC 61000-4-5 (Lightning) 5A (8/20s) IEC 61000-4-4 (EFT) 40A (5/50ns) Package design optimized for high speed lines Flow-Through design Very small PCB area: 0.7mm2 Protects up to three high-speed lines Backdrive protection on VBus pin Low capacitance: 0.25pF (typical) Low ESD clamping voltage Solid-state silicon-avalanche technology Mechanical Characteristics SLP1007N5T 5-pin package (1.0 x 0.7 x 0.40mm) Pb-Free, Halogen Free, RoHS/WEEE Compliant Lead finish: NiPdAu Marking: Marking Code Packaging: Tape and Reel Applications USB 2.0 & USB 3.0 Camera Data Lines MHL Dimensions Circuit Diagram 1.00 0.35 BSC 1 1 2 0.70 3 4 5 0.40 Nominal Dimensions in mm (Bottom View) Revision 11/29/2011 Device Schematic 1 www.semtech.com RClamp7522T PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20s) Pp k 100 Watts Peak Pulse Current (tp = 8/20s) IP P 4 A ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) VESD +/- 25 +/- 15 kV TJ -55 to +125 C TSTG -55 to +150 C Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Any I/O to GN D Reverse Breakdown Voltage V BR It = 1mA, Any I/O to GN D Reverse Leakage Current IR VRWM = 5.0V, Any I/O to GN D Clamping Voltage VC Clamping Voltage Junction Capacitance (c) 2011 Semtech Corp. Maximum Units 5 V 9 11 V 0.005 0.100 A IPP = 1A, tp = 8/20s Any I/O to GN D 15 V VC IPP = 4A, tp = 8/20s Any I/O to GN D 25 V Cj VR = 0V, f = 1MHz, Any I/O to GN D 0.4 pF 2 Minimum 6.5 Typical 0.25 www.semtech.com RClamp7522T PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Pulse Waveform 110 10 Waveform Parameters: tr = 8s td = 20s 100 Peak Pulse Power - P PP (kW) 90 PP 80 Percent of I 1 0.1 70 e-t 60 50 40 td = IPP/2 30 20 10 0 0.01 0.1 1 10 100 0 1000 5 10 15 Pulse Duration - tp (us) 30 1.2 25 1.0 20 0.8 15 10 Waveform Parameters: tr = 8s td = 20s 0.6 0.4 0.2 f = 1 MHz 0.0 0 0 1 2 3 4 5 0 6 1 2 3 4 5 Reverse Voltage - VR (V) Peak Pulse Current - IPP (A) (c) 2011 Semtech Corp. 30 Normalized Capacitance vs. Reverse Voltage Cj(VR)/Cj(VR=0V) Clamping Voltage -VC (V) 25 Time (s) Clamping Voltage vs. Peak Pulse Current (Between any I/O and Ground) 5 20 3 www.semtech.com RClamp7522T PRELIMINARY PROTECTION PRODUCTS Typical Characteristics (Con't) Insertion Loss S21 - I/O to GND CH1 S21 LOG 6 dB / REF 0 dB 1: - .03480 dB 800 MHz 2: - .04930 dB 900 MHz 0 dB 12 3 4 3: - .09650 dB 1.8 GHz -6 dB -12 dB 4: - .29330 dB 2.5 GHz -18 dB -24 dB -30 dB -36 dB -42 dB -48 dB 1 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz START . 030 MHz USB 3.0 Eye Pattern with RClamp7522T (c) 2011 Semtech Corp. 4 www.semtech.com RClamp7522T PRELIMINARY PROTECTION PRODUCTS Typical Characteristics (Con't) ESD Clamping (+8kV Contact per IEC 61000-4-2) 250 Clamping Voltage (V) 200 150 100 50 0 -20 0 20 40 60 80 60 80 Time (ns) ESD Clamping (-8kV Contact per IEC 61000-4-2) 0 Clamping Voltage (V) -50 -100 -150 -200 -250 -20 0 20 40 Time (ns) (c) 2011 Semtech Corp. 5 www.semtech.com RClamp7522T PRELIMINARY PROTECTION PRODUCTS Typical Characteristics (Con't) TLP Characteristic 30 TLP Current (A) 25 20 RDYN: 0.90 15 10 TLP Parameters: tp = 100ns tr = 200ps 5 0 0 10 20 30 40 50 TLP Voltage (V) (c) 2011 Semtech Corp. 6 www.semtech.com RClamp7522T PRELIMINARY PROTECTION PRODUCTS Applications Information Design Recommendations for USB Protection The RClamp7522T is specifically designed for protection of high-speed interfaces. They present <0.40pF capacitance between any line and ground while being rated to handle >15kV ESD contact discharges (>25kV air discharge) as outlined in IEC 61000-4-2. Each device is in a leadless SLP package that occupies a nominal PCB area of 0.7mm2. The pin configuration is designed such that the traces can be routed straight through the device. The narrow package and flow-through design reduces discontinuity and minimizes impact on signal integrity. 1 3 4 5 Figure 1 - Circuit Diagram Design Recommendations for Camera Data Line Protection Figure 2 shows the recommended pin configuration for protection of camera data lines in mobile phone applications. The camera data lines are connected at pins 3, 4, and 5. The ground connection is made at pin 1. The steering diodes at pin 1 serve to reduce the overall line capacitance. GND 1 Reset NC I2C-SDA I2C-SDC Design Recommendations for USB Protection Figure 3 shows the recommended pin configuration for protection of USB data lines. The voltage supply bus is connected at pin 1. The steering diode pair at pin 1 serve as backdrive protection for operation during power down. Data lines are connected at pins 3 and 4. Ground is connected at pin 5. The ground and data line pins are interchangeable since the ground connection contains a steering diode pair for reduced capacitance. Figure 2 - Pin Configuration (Top View) for Camera Data Line Protection Applications VBus 1 GND NC DD+ Figure 3 - Pin Configuration (Top View) for USB 2.0 Applications (c) 2011 Semtech Corp. 7 www.semtech.com RClamp7522T PRELIMINARY PROTECTION PRODUCTS Applications Information Recommended Mounting Pattern Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech's recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Solder Stencil Design Aper ture shape Stencil Opening (200x413 mm) .200 .175 .413 .388 .175 .950 R ecommendation Laser cut, Electro-polished 1.000 Rectangular All Dimensions are in mm. Land Pad. Solder Stencil Thickness Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish (c) 2011 Semtech Corp. Land Pad (175x388 mm) Stencil opening Component 0.100 mm (0.004") Type 4 size sphere or smaller Per JEDEC J-STD-020 N on-Solder mask defined OSP OR N iAu 8 www.semtech.com RClamp7522T PRELIMINARY PROTECTION PRODUCTS Outline OutlineDrawing Drawing- -SO-8 SLP1007N5T A B D PIN 1 INDICATOR (LASER MARK) DIMENSIONS MILLIMETERS MIN NOM MAX DIM E A SEATING PLANE aaa C C A1 A2 b1xN bbb D/2 A A1 A2 b b1 D E e L N aaa bbb 0.37 0.40 0.43 0.00 0.02 0.05 (0.13) 0.125 0.15 0.175 0.15 0.175 0.20 0.90 1.00 1.10 0.60 0.70 0.80 0.35 BSC 0.225 0.25 0.275 5 0.08 0.10 C A B e 1 2 LxN E/2 N bxN e/2 bbb C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1007N5T P/2 (C) DIMENSIONS G DIM C G P X Y Z Z Y P X MILLIMETERS (0.563) 0.175 0.35 0.175 0.388 0.95 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. (c) 2011 Semtech Corp. 9 www.semtech.com RClamp7522T PRELIMINARY PROTECTION PRODUCTS Marking Codes Ordering Information 72 Part Number Qty per Reel Reel Size RClamp 7522T.TN T 10,000 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. Notes: Marking will also include line matrix date code Carrier Tape Specification Device Orientation in Tape 72 72 72 72 72 Pin 1 Location (Towards Sprocket Holes) Contact Information for Semtech International AG Taiw an Branch Korea Branch Tel: 886-2-2748-3380 Fax: 886-2-2748-3390 Semtech Sw itz erland GmbH Japan Branch Tel: 81-3-6408-0950 Fax: 81-3-6408-0951 Tel: 82-2-527-4377 Fax: 82-2-527-4376 Semtech Limited (U.K.) Tel: 44-1794-527-600 Fax: 44-1794-527-601 Tel: 86-21-6391-0830 Fax: 86-21-6391-0831 Semtech France SARL Tel: 33-(0)169-28-22-00 Fax: 33-(0)169-28-12-98 Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. Semtech Germany GmbH Tel: 49-(0)8161-140-123 Fax: 49-(0)8161-140-124 (c) 2011 Semtech Corp. 10 Shanghai Office www.semtech.com