W24L011A
128K
×
8 HIGH SPEED CMOS STATIC RAM
Publication Release Date: April 26, 2002
- 1 - Revision A3
GENERAL DESCRIPTION
The W24L011A is a high speed, low power CMOS static RAM organized as 131072 x 8 bits that
operates on a single 3.3-volt power supply. This device is manufactured using Winbond's high
performance CMOS technology.
FEATURES
• High speed access time: 10/12/15 nS
• Single +3.3V power supply
• Center power/ground pin configuration
• Fully static operation
• All inputs and outputs directly TTL compatible
• Three-state outputs
• Available packages: 32-pin 300 mil SOJ, Small
TSOP-I (8 x 13.4 mm), TSOP-I (8 x 20 mm)
and 400 mil SOJ
PIN CONFIGURATIONS
1
2
3
4
5
24
25
26
27
28
6
7
8
9
20
21
22
23
10
11
12
13
16 17
18
19
14
15
32
31
30
29
1
2
3
4
5
6
7
8
9
11
12
14
15
16
32-pin
TSOP
32
31
30
29
27
26
25
24
23
22
21
20
19
18
17
10
13
28
A0
A1
A2
A3
CS#
I/O1
I/O2
Vcc
Vss
I/O3
I/O4
WE#
A4
A5
A6
A7 A8
A9
A10
A11
A12
I/O5
I/O6
Vcc
Vss
I/O7
I/O8
OE#
A13
A14
A15
A16
A8
A9
A10
A11
A12
I/O5
I/O6
Vcc
Vss
I/O7
I/O8
OE#
A13
A14
A15
A16
A0
A1
A2
A4
CS#
I/O1
I/O2
Vcc
Vss
I/O3
I/O4
WE#
A4
A5
A6
A7
BLOCK DIAGRAM
A0
.
CS
A16
WE
I/O1
I/O8
OE
V
V
.
.
DATA I/O
ARRAY
DECODER CORE
.
CONTROL
DD
SS
PIN DESCRIPTION
SYMBOL DESCRIPTION
A0 − A16 Address Inputs
I/O1 − I/O8 Data Inputs/Outputs
CS Chip Select Inputs
WE
Write Enable Input
OE
Output Enable Input
VDD Power Supply
VSS Ground
W24L011A
- 2 -
TRUTH TABLE
CS OE
WE
MODE I/O1
−
I/O8 VDD CURRENT
H X X Not Selected High Z ISB, ISB1
L H H Output Disable High Z IDD
L L H Read Data Out IDD
L X L Write Data In IDD
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER RATING UNIT
Supply Voltage to VSS Potential -0.5 to +4.6 V
Input/Output to VSS Potential -0.5 to VDD +0.5 V
Allowable Power Dissipation 1.0 W
Storage Temperature -65 to +150 °C
Operating Temperature 0 to +70 °C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
of the device.
Operating Characteristics
(VDD = 3.3V ±5%, VSS = 0V, TA = 0 to 70° C)
PARAMETER SYM.
TEST CONDITIONS MIN.
TYP.
MAX. UNIT
Input Low Voltage VIL - -0.5 - 0.8 V
Input High Voltage VIIH - +2.0
- VDD +0.5
V
Input Leakage Current ILI VIN = VSS to VDD -10 - +10 µA
Output Leakage
Current ILO
VI/O = VSS to VDD, CS = VIH (min.) or
OE = VIH (min.) or WE = VIL (max.)
-10
-
+10
µA
Output Low Voltage VOL IOL = +8.0 mA - - 0.4 V
Output High Voltage VOH IOH = -4.0 mA 2.4 - - V
Operating Power IDD CS = VIL (max.), I/O = 0 mA 10 - - 130
Supply Current Cycle = mim., Duty = 100% 12 - - 120 mA
15 - - 100
Standby Power ISB CS = VIH (min.) - - 15 mA
Supply Current ISB1 CS ≥ VDD -0.2V - - 5 mA
Note: Typical characteristics are at VDD = 3.3V, TA = 25° C.
W24L011A
Publication Release Date: April 26, 2002
- 3 - Revision A3
CAPACITANCE
(VDD = 3.3V, TA = 25° C, f = 1 MHz)
PARAMETER SYM. CONDITIONS MAX. UNIT
Input Capacitance CIN VIN = 0V 8 pF
Input/Output Capacitance CI/O VOUT = 0V 10 pF
Note: These parameters are sampled but not 100% tested.
AC CHARACTERISTICS
AC Test Conditions
PARAMETER CONDITIONS
Input Pulse Levels 0V to 3V
Input Rise and Fall Times 3 nS
Input and Output Timing Reference Level 1.5V
Output Load CL = 30 pF, IOH/IOL = -4 mA/8 mA
AC Test Loads and Waveform
90% 90%
3 nS
10%
3 nS 10%
R1 320 ohm
3.3V
OUTPUT R2
350 ohm
30 pF
Including
Jig and
Scope
3.0V
0V
3.3V
OUTPUT
R1 320 ohm
5pF
Including
Jig and
Scope
R2
350 ohm
(For T
CLZ, OLZ, CHZ, OHZ, WHZ, OW
TTTT T )
W24L011A
- 4 -
AC Characteristics, continued
(VDD = 3.3V ±5%, VSS = 0V, TA = 0 to 70°)
Read Cycle
PARAMETER SYM. W24L011A-10 W24L011A-12 W24L011A-15 UNIT
MIN.
MAX.
MIN.
MAX.
MIN.
MAX.
Read Cycle Time TRC 10 - 12 - 15 - nS
Address Access Time TAA - 10 - 12 - 15 nS
Chip Select Access Time TACS - 10 - 12 - 15 nS
Output Enable to Output Valid TAOE - 5 - 6 - 8 nS
Chip Selection to Output in Low Z TCLZ 3 - 3 - - 3 nS
Output Enable to Output in Low Z TOLZ*
0 - 0 - - nS
Chip Deselection to Output in High Z
TCHZ - 5 - 6 - 8 nS
Output Disable to Output in High Z TOHZ*
- 5 - 6 - 8 nS
Output Hold from Address Change TOH 3 - 3 - 3 - nS
* These parameters are sampled but not 100% tested.
Write Cycle
PARAMETER SYM. W24L011A-10 W24L011A-12 W24L011A-15 UNIT
MIN.
MAX.
MIN.
MAX.
MIN.
MAX.
Write Cycle Time TWC 10 - 12 - 15 - nS
Chip Selection to End of Write TCW 9 - 10 - 12 - nS
Address Valid to End of Write TAW 9 - 10 - 12 - nS
Address Setup Time TAS 0 - 0 - 0 - nS
Write Pulse Width TWP 9 - 10 - 12 - nS
Write Recovery Time CS , WE
TWR 0 - 0 - 0 - nS
Data Valid to End of Write TDW 5 - 7 - 9 - nS
Data Hold from End of Write TDH 0 - 0 - 0 - nS
Write to Output in High Z TWHZ*
- 5 - 6 - 8 nS
Output Disable to Output in High Z TOHZ*
- 5 - 6 - 8 nS
Output Active from End of Write TOW 0 - 0 - 0 - nS
* These parameters are sampled but not 100% tested.
W24L011A
Publication Release Date: April 26, 2002
- 5 - Revision A3
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled,
CS
=
OE
= VIL,
WE
= VIH)
Address
T
T
TT
D
OH AA
RC
OH
OUT
Read Cycle 2
(Chip Select Controlled)
CS
TT
ACS CHZ
D
TCLZ
OUT
Address
TRC
Read Cycle 3
(Output Enable Controlled)
OE
CS
T
T
T
T
T
TT
OH
CHZ
AA
AOE
CLZ ACS
OLZ
DOUT
Address
TRC
W24L011A
- 6 -
Timing Waveforms, continued
Write Cycle 1
(
OE
Clock)
Address
OE
CS
TWC
TWR
TCW
WE
D
D
T(1, 4)
OUT
IN
OHZ
TAW TWP
TAS
TDW TDH
Write Cycle 2
(
OE
= VIL Fixed)
Address
CS
T
T T
WC
CW WR
WE
D
D
T
T
T
T
T
T
(2) (3)
T
T
AW
WP
OW
WHZ (1, 4)
DW DH
OH
AS
OUT
IN
Notes:
1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.
2. The data output from DOUT are the same as the data written to DIN during the write cycle.
3. DOUT provides the read data for the next address.
4. Transition is measured ±200 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
W24L011A
Publication Release Date: April 26, 2002
- 7 - Revision A3
ORDERING INFORMATION
PART NO. ACCESS
TIME
(nS)
OPERATING
CURRENT
MAX. (mA)
STANDBY
CURRENT
MAX. (mA)
OPERATION
TEMPERATURE
(
°
C) PACKAGE
W24L011AJ-10 10 130 10 0 to +70 300 mil SOJ
W24L011AJ-12 12 120 10 0 to +70 300 mil SOJ
W24L011AJ-15 15 110 10 0 to +70 300 mil SOJ
W24L011AI-10 10 130 10 0 to +70 400 mil SOJ
W24L011AI-12 12 120 10 0 to +70 400 mil SOJ
W24L011AI-15 15 110 10 0 to +70 400 mil SOJ
W24L010AT-10 10 130 10 0 to +70 TSOP (8 x 20 mm)
W24L010AT-12 12 120 10 0 to +70 TSOP (8 x 20 mm)
W24L010AT-15 15 110 10 0 to +70 TSOP (8 x 20 mm)
W24L010AQ-10 10 130 10 0 to +70 TSOP (8 x 13.4 mm)
W24L010AQ-12 12 120 10 0 to +70 TSOP (8 x 13.4 mm)
W24L010AQ-15 15 110 10 0 to +70 TSOP (8 x 13.4 mm)
Notes:
1. Winbond reserves the right to make changes to its products without prior notice.
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications
where personal injury might occur as a consequence of product failure.
W24L011A
- 8 -
PACKAGE DIMENSIONS
32-pin SOJ (300 mil)
D
H
B
b
e
e
116
17
32
E
Y
A
A
A
Seating Plane
c
L
S
θ
Symbol Dimension in mmDimension in Inches
Min. Nom. Max. Min. Nom. Max.
A
A
A
B
b
c
D
E
e
e
H
L
S
Y
0.140
0.020
0.095 0.100 0.105
0.032
0.0280.026
0.0220.0180.016
0.014
0.010
0.008
0.835
0.825
0.305
0.3000.295
0.0560.0500.044
0.2870.2670.247
0.345
0.3350.325
0.080
0.045
0.004
010
0.815
3.556
0.508
2.413 2.540 2.667
0.8130.7110.660
0.559
0.4570.406
0.356
0.2540.203
21.20920.955
7.7477.6207.493
1.422
1.2701.118
7.2906.782
6.274
8.7638.509
8.255
2.032
1.143
0.102
0°10°
20.701
θ
__ __
__ __
__ __
__ __
__ __ __ __
__ __
__
__ __
__ __
__ __
__
1
2
1
e
e
1
2
1
32-pin SOJ (400 mil)
1. Dimension D Max & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
4. Controlling dimension: Inches
5. General appearance spec. should be based
on final visual inspection spec.
0.28
0.15
0.011
0.006
Notes:
Symbol Min. Nom. Max. Max.
Nom.
Min.
Dimension in inches Dimension in mm
A
b
c
D
e
HE
L
y
A
A
S
1
1
2
E
0.145 3.68
0.025
0.105
0.016
0.110 0.115
0.020
2.67
0.41
0.635
2.79 2.91
0.51
0.082
0.004
-5 6
0.825 0.830
2.08
20.96 21.08
0.37 9.40
0.10
10.29
10.16
10.03
0.405
0.400
0.395
11.05 11.18 11.31
0.435 0.440 0.445
3. Dimension D & E include mold mismatch
and are determined at the mold parting line.
e
b1
0.044 0.050 0.056 1.12 1.27 1.42
0.045 1.14
D
Seating Plane
sb
b1
1
32
e1
A
y
A2AL
1
e
16
17
EEH
c
3.51
3.33
0.138
0.131
0.026 0.028 0.032 0.66 0.71 0.81
0.820 20.83
0.018 0.46
0.008 0.20
0.360 0.380 9.15 9.65
-5 6
2 2
θ
θ
W24L011A
Publication Release Date: April 26, 2002
- 9 - Revision A3
Package Dimensions, continued
32-pin TSOP
A
A
A
2
1
L
L1Y
c
E
H
D
D
b
eM
0.10(0.004)
θ
Min. Nom. Max. Min. Nom. Max.
Symbol
A
A
b
c
D
E
e
L
L
Y
1
1
2
A
HD
Note:
Controlling dimension: Millimeter
Dimension in Inches
0.047
0.006
0.041
0.039
0.037
0.007 0.008 0.009
0.005 0.006 0.007
0.720 0.724 0.728
0.311 0.315 0.319
0.780 0.787 0.795
0.020
0.016 0.020 0.024
0.031
0.000 0.004
135
0.002
1.20
0.05 0.15
1.051.00
0.95
0.17
0.12
18.30
7.90
19.80
0.40
0.00
1
0.20 0.23
0.15 0.17
18.40 18.50
8.00 8.10
20.00 20.20
0.50
0.50 0.60
0.80
0.10
35
Dimension in mm
θ
__ __ __ __
__ __
__ __
__ __
__
__
__
__
__
__
32-Lead Small Type One TSOP (8 x 13.4)
A
AA
2
1
L
L1Y
c
E
H
D
D
b
e
1
θ
Controlling dimension: Millimeters
Min.
Dimension in mm
Nom. Max. Min. Nom. Max.
Symbol
A
A
b
c
D
E
e
L
L
Y
1
1
2
A
HD
11.70
13.20
0.675
1.25
0.05 0.15
1.05
1.00
0.95
0.17
0.14
0.30
0.00
0.20 0.27
0.15 0.16
11.80 11.90
13.40 13.60
0.50
0.50 0.70
0.10
0.049
0.006
0.041
0.039
0.037
0.007 0.008 0.009
0.0056 0.0059 0.0062
0.461 0.465 0.469
7.90 8.00 8.100.311 0.315 0.319
0.520 0.528 0.536
0.020
0.012 0.020 0.028
0.027
0.000 0.004
0 3 50 3 5
0.002
θ
Dimension in Inches
W24L011A
- 10 -
VERSION HISTORY
VERSION
DATE PAGE DESCRIPTION
A1 Aug. 1997 - Initial Issued
A2 Aug. 1999 1, 2, 4, 7 Add 15 nS specification
A3 Apr. 26, 2002
1, 2, 7, 9 Add TSOP package and change (IDD, ISB & ISBC) current
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5665577
http://www.winbond.com.tw/
Taipei Office
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-5441798
Winbond Electronics (H.K.) Ltd.
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
FAX: 852-27552064
Unit 9-15, 22F, Millennium City,
TEL: 852-27513100
Please note that all data and specifications are subject to change without notice.
All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
Winbond Electronics (Shanghai) Ltd.
200336 China
FAX: 86-21-62365998
27F, 2299 Yan An W. Rd. Shanghai,
TEL: 86-21-62365999
Winbond Electronics Corporation Japan
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
FAX: 81-45-4781800
7F Daini-ueno BLDG, 3-7-18
TEL: 81-45-4781881
9F, No.480, Rueiguang Rd.,
Neihu Chiu, Taipei, 114,
Taiwan, R.O.C.
