RHFL4913XX25 RHFL4913XX33 - RHFL4913XX50 Rad-hard positive fixed voltage regulator Features 2 and 3 A low dropout voltage Embedded overtemperature, overcurrent protections Adjustable current limitation Output overload monitoring/signalling Fixed 2.5 V, 3.3 V, 5.0 V output voltages Inhibit (ON/OFF) TTL-compatible control Programmable output short-circuit current Remote sensing operation Rad-hard: tested up to 300 krad Mil Std 883E Method 1019.6 and low dose rate conditions SMD.5 Flat-16 TO-257 Heavy Ions SEL immune Description specifically intended for space and harsh radiation environments. Input supply range is up to 12 V. RHFL4913 fixed is QML-V qualified, DSCC SMD are 5962F02534 / 02535 / 02536. The RHFL4913 fixed is a high performance Radhard positive voltage regulator family. Available in various hermetic ceramic packages, it is Figure 1. Block diagram for package SMD.5 and TO-257 December 2011 Doc ID 10004 Rev 13 1/19 www.st.com 19 Contents RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Contents 1 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 5.1 Low pin count package limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5.2 SENSE pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5.3 Inhibit ON-OFF control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5.4 Overtemperature protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5.5 Overcurrent protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5.6 OCM pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.7 Alternate to . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.1 7 Remote sensing operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Notes about Flat-16 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7.1 Radiation performances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7.2 Die information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2/19 Doc ID 10004 Rev 13 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 1 Diagram Figure 2. Block diagram for package Flat-16 Doc ID 10004 Rev 13 Diagram 3/19 Pin configuration RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 2 Pin configuration Figure 3. Pin configuration (top view for Flat-16, bottom view for SMD.5) Flat-16 SMD.5 TO-257 Table 1. Pin description Pin name Flat-16 (1) SMD.5 (2) TO-257 VO 1, 2, 6, 7 1 3 VI 3, 4, 5 2 1 GND 13 3 2 ISC 8 OCM 10 INHIBIT 14 SENSE 16 NC 9, 11, 12, 15 1. The upper metallic package lid and the bottom metallization are neither connected to regulator die nor to package terminals, hence electrically floating. 2. The upper metallic package lid is neither connected to regulator die nor to package terminals, hence electrically floating. 4/19 Doc ID 10004 Rev 13 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 3 Maximum ratings Table 2. Absolute maximum ratings (1) Symbol Maximum ratings Parameter Value Unit 14 V VI DC input voltage, VI - VGROUND IO Output current PD TC = 25C power dissipation TSTG Storage temperature range -65 to +150 C TOP Operating junction temperature range -55 to +150 C +150 C TJ ESD RHFL4913S, ESY 3 RHFL4913KP 2 KP, S Versions 15 ESY Version 10 A Junction temperature W (2) Electrostatic discharge capability Class 3 1. Exceeding maximum ratings may damage the device. 2. Internally limited to about maximum +175 C by thermal shutdown circuit. Table 3. Symbol Thermal data Parameter RthJC Thermal resistance junction-case max. TSOLD Maximum soldering temperature, 10 sec. Flat-16 TO-257 SMD.5 Unit 8.3 12.5 8.3 C/W Doc ID 10004 Rev 13 300 C 5/19 Electrical characteristics 4 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Electrical characteristics TJ = 25 C, VI = VO + 2.5 V, CI = CO = 1 F, unless otherwise specified. Table 4. Electrical characteristics Symbol Parameter Test conditions VI Operating input voltage IO = 2 A (Flat-16) or 3A (SMD.5 & TO-257) VO Output voltage accuracy VI = VO+2.5V, IO = 5mA ISHORT Output current limit (1) Min. Typ. -2 Adjustable by mask/external resistor Max. Unit 12 V 2 % 4.5 A VO Operating output voltage IO = 2 A, 2.5 V output voltage 2.45 2.55 V VO Operating output voltage IO = 2 A, 3.3 V output voltage 3.23 3.37 V VO Operating output voltage IO = 2 A, 5.0 V output voltage 4.9 5.1 V VI = VO+2.5V to 12 V, IO = 5mA (+25C) 0.3 % VI = VO+2.5V to 12 V, IO = 5mA (-55C) 0.4 % VI = VO+2.5V to 12 V, IO = 5mA (+125C) 0.4 % VI = VO+2.5V, IO = 5mA to 400 mA (+25C) 0.2 % VI = VO+2.5V, IO = 5mA to 400 mA (-55C) 0.3 % VI = VO+2.5V, IO = 5mA to 400 mA (+125C) 0.3 % VI = VO+2.5V, IO = 5mA to 1A (+25C) 0.3 % VI = VO+2.5V, IO = 5mA to 1A (-55C) 0.4 % VI = VO+2.5V, IO = 5mA to 1A (+125C) 0.4 % VO/VI Line regulation VO/VO Load regulation ZOUT Iq Iq 6/19 Output impedance Quiescent current Quiescent current IO = 100 mA DC and 20 mA rms 100 m VI = VO+2.5V, IO = 30mA, on mode 8 VI = VO+2.5V, IO = 300mA, on mode 25 VI = VO+2.5V, IO = 1A, on mode 60 VI = VO+2.5V, IO = 3A, on mode (only for SMD.5 and TO-257) 150 VI = VO+2V, VINH = 2.4V, off mode 1 VI =VO+2.5V, IO=1A, TJ=+125C, on mode 40 VI =VO+2.5V, IO=1A, TJ=-55C, on mode 100 Doc ID 10004 Rev 13 mA mA RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Table 4. Electrical characteristics (continued) Symbol Vd Parameter Test conditions Dropout voltage Typ. Max. IO = 400mA, TJ = -55C 300 400 IO = 400mA, TJ = +25C 350 450 IO = 400mA, TJ = +125C 450 550 550 IO = 1A, TJ = +25C 650 IO = 1A, TJ = +125C 800 750 IO = 2A, TJ = +125C 950 VINH(OFF) Inhibit voltage IO = 5mA, TJ= -55 to 125C ISH VOCM tPLH tPHL eN 0.8 60 70 f = 33kHz 30 40 Shutdown input current VINH = 5 V OCM pin voltage Sinked IOCM = 24 mA active low Output noise voltage (1) V f = 120Hz VI = VO+2.5V 1V, IO = 5mA (1) V 2.4 (1) Inhibit propagation delay Unit mV IO = 2A, TJ = +25C IO = 5mA, TJ= -55 to 125C Supply voltage rejection Min. IO = 1A, TJ = -55C VINH(ON) Inhibit voltage SVR Electrical characteristics dB VI = VO+2.5V, VINH = 2.4 V, IO = 400 mA B= 10Hz to 100kHz, IO = 5mA to 2A 15 A 0.38 V on-off 20 s off-on 100 s 40 Vrms 1. This value is guaranteed by design. For each application it's strongly recommended to comply with the maximum current limit of the package used. Figure 4. Application diagram for remote sensing operation Doc ID 10004 Rev 13 7/19 Device description 5 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Device description The RHFL4913 fixed voltage contains a PNP type power element controlled by a signal resulting from amplified comparison between the internal temperature compensated bandgap cell and the fraction of the desired output voltage value. This fractional value is obtained from an internal-to-die resistor divider bridge set by STMicroelectronics. The device is protected by several functional blocks. 5.1 Low pin count package limitations Some functions (INHIBIT, OCM, SENSE) are not available due to lack of pins. Corresponding die pads are by default connected inside silicon. 5.2 SENSE pin The load voltage is applied by a Kelvin line connected to SENSE pin: Voltage feed-back comes from the internal divider resistor bridge. Therefore possible output voltages are set by manufacturer mask metal options. SENSE pin is not available in 3pin packages. 5.3 Inhibit ON-OFF control By setting INHIBIT pin TTL-high, the device switches off the output current and voltage. The device is ON when INHIBIT pin is set low. Since INHIBIT pin is internally pulled down, it can be left floating in case inhibit function is not utilized. INHIBIT pin is not available in 3pin packages. 5.4 Overtemperature protection A temperature detector internally monitors the power element junction temperature. The device goes OFF at approx. 175 C, returning to ON mode when back to approx. 40 C. It is worth noting that when the internal temperature detector reaches 175 C, the active power element can be at 225 C: device reliability cannot be granted in case of extensive operation under these conditions. 5.5 Overcurrent protection ISC pin. An internal non-fold back short-circuit limitation is set with ISHORT > 3.8 A (VO is 0 V). This value can be reduced by an external resistor connected between ISC pin and VI pin, with a typical value range of 25 k to 200 k. This adjustment feature is not available in 3 pin packages. To keep excellent VO regulation, it is necessary to set ISHORT 1.6 times greater than the maximum desired application IO. When IO reaches ISHORT - 300 mA, the current limiter overrules regulation and VO starts to drop and the OCM flag is risen. When no current limitation adjustment is required, ISC pin must be left unbiased (as it is in 3 pin packages). 8/19 Doc ID 10004 Rev 13 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 5.6 Device description OCM pin Goes low when current limiter starts to be active, otherwise VOCM = VI. It is bufferized and can sink 10 mA. OCM pin is internally pulled-up by a 5 k resistor. Not available in 3 pin packages. 5.7 Alternate to RHFL4913 fixed (& custom) voltages replace all 3-terminal industry devices, providing essential benefits - Lower drop-out - High radiation performance - Better SVR - Saving the high stability external setting resistors. Doc ID 10004 Rev 13 9/19 Application information 6 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Application information The RHFL4913 fixed voltage is functional as soon as VI-VO voltage difference is slightly above the power element saturation voltage. A minimum 0.5 mA IO ensures perfect "noload" regulation. All available VI pins must always be externally interconnected, same thing for all available VO pins, otherwise device stability and reliability cannot be granted. All NC pins can be connected to ground. The INHIBIT function switches off the output current in an electronic way, that is very quickly. According to Lenz's Law, external circuitry reacts with -LdI/dt terms which can be of high amplitude in case some series-inductance exists. The effect would be a large transient voltage developed on both device terminals. It is necessary to protect the device with Schottky diodes preventing negative voltage excursions. In the worst case, a 14 V Zener diode shall protect the device input. The device has been designed for high stability and low drop out operation: minimum 1 F input and output tantalum capacitors are therefore mandatory. Capacitor ESR range is from 0.01 to over 20 . Such range turns out to be useful when ESR increases at low temperature. When large transient currents are expected, larger value capacitors are necessary. In case of high current operation with expected short-circuit events, caution must be considered relatively to capacitors. They must be connected as close as possible to device terminals. As some tantalum capacitors may permanently fail when submitted to high charge-up surge currents, it is recommended to decouple them with 470 nF polyester capacitors. Being RHFL4913 fixed voltage manufactured with very high speed bipolar technology 6 GHz fT transistors), the PCB lay-out must be performed with extreme care, very low inductance, low mutually coupling lines, otherwise high frequency parasitic signals may be picked-up by the device resulting into self-oscillation. User's benefit is a SVR performance extended to far higher frequencies. 6.1 Remote sensing operation In case the load is located far from the regulator, it is recommended to comply with the scheme below. To obtain the best regulation, it is in addition essential to care about: - The wire connecting R2 to the load end must not be crossed by the load current (Kelvin sense). The noise captured by the wires between the load and the chip could bring a noisy output voltage. In case this happens, it is recommended that shielded cables are used for these connections. The external wrap must be used for connecting the ground of the chip with the load ground. It is also recommended to place 1 F tantalum capacitors between output and ground close to the device and another next to the load. 10/19 Doc ID 10004 Rev 13 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 7 Notes about Flat-16 package Notes about Flat-16 package The bottom of package is metallized to allow user to directly solder the voltage regulator to PCB, no heat sink needed, in order to optimize heat removal performance. 7.1 Radiation performances The RHFL4913F has been tested against: 300krad TID ELDERS in accordance with Mil1019.6, bipolar section: post radiation parameters are within datasheet pre-rad limits. Submitted to 200MeV Iodine ions of 60.4MeV/cm2/mg LET up to 1exp(+7) ions / cm2, no SEL event has been detected. 7.2 Die information RHFL4913 fixed is also available in die form. Space dice are electrically tested by STMicroelectronics in such a way that, when mounted in proper thermal and electrical substrate, they provide full compliance with equivalent packaged product. - Max die dimensions: 2.794 mm by 3.861 mm or 110 mils by 152 mils - Die thickness: 357 m +/- 50 m - Pad size: 184 m by 184 m - Metallization: Aluminum 4% silicon alloy - Die backside: Bare silicon - Die backside potential: Ground Figure 5. Die size (*) Die SENSE pad is active in RHFL4913 fixed die. It shall not be left unbonded. It should be bonded to VO pin. (**) Die adjust pad is available in the die lay-out but is not electrically connected to the IC. It shall be left unconnected during hybrid bonding. Doc ID 10004 Rev 13 11/19 Package mechanical data 8 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 12/19 Doc ID 10004 Rev 13 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Package mechanical data Flat-16 (MIL-STD-1835) mechanical data mm. inch. Dim. Min. A Typ. 2.16 Max. Min. 2.72 0.085 Typ. 0.107 b 0.43 0.017 c 0.13 0.005 D 9.91 0.390 E 6.91 0.272 E2 4.32 0.170 E3 0.76 0.030 e 1.27 0.050 L 6.72 0.265 Q 0.66 S1 0.13 Max. 1.14 0.026 0.045 0.005 b e c L E3 9 16 E E2 1 8 E3 L S1 D Doc ID 10004 Rev 13 Q A 7450901A 13/19 Package mechanical data RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 SMD.5 mechanical data Dim. mm. inch. Min. Typ. Max. Min. Typ. Max. A 2.84 3.00 3.15 0.112 0.118 0.124 A1 0.25 0.38 0.51 0.010 0.015 0.020 b 7.13 7.26 7.39 0.281 0.286 0.291 b1 5.58 5.72 5.84 0.220 0.225 0.230 b2 2.28 2.41 2.54 0.090 0.095 0.100 b3 2.92 3.05 3.18 0.115 0.120 0.125 D 10.03 10.16 10.28 0.395 0.400 0.405 D1 0.76 E 7.39 0.296 0.301 e 0.030 7.52 7.64 1.91 0.291 0.075 E 7386434B 14/19 Doc ID 10004 Rev 13 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Package mechanical data TO-257 mechanical data Dim. mm. Min. Typ. inch. Max. Min. Typ. A 10.54 0.415 B 10.54 0.415 C 16.64 0.655 D 4.7 E F 5.33 0.185 1.02 3.56 3.68 0.210 0.40 3.81 0.140 0.145 G 13.51 0.532 H 5.26 0.207 I 0.76 0.030 J 3.05 0.120 K 2.54 0.100 L M 15.2 16.5 2.29 N R Max. 0.598 0.150 0.650 0.090 0.71 1.65 0.028 0.065 0117268C Doc ID 10004 Rev 13 15/19 Ordering information RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 9 Ordering information Table 5. Order codes DIE Terminal finish Out. volt. Q.ty level RHFL4913KP25-01V RHFL4913S25-03V RHFL4913ESY2505V GOLD 2.5 V QML-V RHFL4913KP25-02V RHFL4913S25-04V RHFL4913ESY2506V SOLDER 2.5 V QML-V Flat-16 SMD.5 TO-257 RHFL4913KP251 RHFL4913S251 RHFL4913ESY251 GOLD 2.5 V EM1 RHFL4913KP252 RHFL4913S252 RHFL4913ESY252 GOLD 2.5 V EM1=EM 2+48h B.I. L491325DIE2V NA 2.5 V QML-V L491325DIE2S NA 2.5 V EM1 RHFL4913KP33-01V RHFL4913S33-03V RHFL4913ESY3305V GOLD 3.3 V QML-V RHFL4913KP33-02V RHFL4913S33-04V RHFL4913ESY3306V SOLDER 3.3 V QML-V RHFL4913KP331 RHFL4913S331 RHFL4913ESY331 GOLD 3.3 V EM1 RHFL4913KP332 RHFL4913S332 RHFL4913ESY332 GOLD 3.3 V EM1=EM 2+48h B.I. L491333DIE2V NA 3.3 V QML-V L491333DIE2S NA 3.3 V EM1 RHFL4913KP50-01V RHFL4913S50-03V RHFL4913ESY5005V GOLD 5.0 V QML-V RHFL4913KP50-02V RHFL4913S50-04V RHFL4913ESY5006V SOLDER 5.0 V QML-V RHFL4913KP501 RHFL4913S501 RHFL4913ESY501 GOLD 5.0 V EM1 RHFL4913KP502 RHFL4913S502 RHFL4913ESY502 GOLD 5.0 V EM1=EM 2+48h B.I. L491350DIE2V NA 5.0 V QML-V L491350DIE2S NA 5.0 V EM1 16/19 Doc ID 10004 Rev 13 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Table 6. Ordering information Part number - SMD equivalent ST part number SMD part number RHFL4913KP25-01V 5962F0253401VXC RHFL4913KP25-02V 5962F0253401VXA RHFL4913KP33-01V 5962F0253501VXC RHFL4913KP33-02V 5962F0253501VXA RHFL4913KP50-01V 5962F0253601VXC RHFL4913KP50-02V 5962F0253601VXA RHFL4913S25-03V 5962F0253402VYC RHFL4913S25-04V 5962F0253402VYA RHFL4913S33-03V 5962F0253502VYC RHFL4913S33-04V 5962F0253502VYA RHFL4913S50-03V 5962F0253602VYC RHFL4913S50-04V 5962F0253602VYA RHFL4913ESY2505V 5962F0253402VZC RHFL4913ESY2506V 5962F0253402VZA RHFL4913ESY3305V 5962F0253502VZC RHFL4913ESY3306V 5962F0253502VZA RHFL4913ESY5005V 5962F0253602VZC RHFL4913ESY5006V 5962F0253602VZA L491325DIE2V 5962F0253402V9A L491333DIE2V 5962F0253502V9A L491350DIE2V 5962F0253602V9A Note: 3 V version is available on request. Table 7. Environmental characteristics Parameter Conditions Value Unit Output voltage thermal drift -55C to +125C 40 ppm/C Output voltage radiation drift From 0 krad to 300 krad at 0.55 rad/s 8 ppm/krad Output voltage radiation drift From 0 krad to 300 krad, Mil Std 883E Method 1019.6 6 ppm/krad Doc ID 10004 Rev 13 17/19 Revision history RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 10 Revision history Table 8. Document revision history Date Revision 05-May-2004 4 Mistake in pin description SMD.5 on table 3. 28-Oct-2004 5 New order codes added - tables 4 and 5. 27-May-2005 6 The features, tables 4, 5 and the figures 1, 2 updated. 08-Jun-2005 7 Modified: PD on table 1, the RthJC for TO-257 on table 2 and the tables 6 and 7, added DIE information. 26-Aug-2008 8 Added new output 1.5 V, modified: Table 4 on page 6, Table 5 on page 16 and Table 6 on page 17. 02-Oct-2008 9 Modified: Features on page 1, Application information on page 10 and SMD.5 mechanical data on page 14. 20-Nov-2009 10 Modified: Table 5 on page 16. 19-Oct-2010 11 Modified: Section 7 on page 11. 08-Feb-2011 12 Added: note Table 1 on page 4. 07-Dec-2011 13 Removed the note under Table 1 on page 4 and added footnotes 1 and 2. 18/19 Changes Doc ID 10004 Rev 13 RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 10004 Rev 13 19/19