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WF60 Product Specification
13.5mm x 14.6mm x 2.7 mm
Description
Amp’ed RF Tech presents the WF60 WiFi dual
band module: 802.11abgn. The WF60 is a small
footprint low cost RF module intended to help
customers shorten product development cycles
and reduce cost. It’s fully compatible with Linux &
Android systems, or our own upper layer stack,
Amp’ed UP, for a complete host & controller
solution.
Features
WLAN
• 802.11a/b/g/n
• Dual Band: 2.4GHz and 5GHz
• Output Power, +21.5dBm
• Power savings mode
• Transmit power back-off
• Wi-Fi Direct (concurrent)
• Wi-Fi Display
• Wi-Fi Protected Setup
• Soft Access Point
• Hotspot 2.0
• Security: WPAI/WPA2, A ES, WEP
Hardware
• Interface, SDIO 2.0 or SP I
• 1 LPO input
• Standby current, 40 μA
• RoHS conformance
• FCC/IC c ertified TBD
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Contents
1. Hardware Specifications .................................................................................. 4
1.1. Recommended Operating Conditions .......................................................................................... 4
1.2. Absolute Maximum Ratings ......................................................................................................... 4
1.3. I/O Operating Conditions .............................................................................................................. 4
1.4. Current Consumption ................................................................................................................... 5
1.5. Selected RF Characteristics ......................................................................................................... 6
1.6. Transmit Power Back-off .............................................................................................................. 7
1.7. Pin Assignment ............................................................................................................................ 8
1.8. Pin Placement Diagram (Top View) ............................................. Error! Bookmark not de fined.
1.9. La yout Dra wing ............................................................................................................................ 9
2. Hardware Block Diagram ............................................................................... 10
3. Hardware Design ............................................................................................ 11
3.1. Modu le Ref lo w Insta llat ion ......................................................................................................... 11
4. Ref eren ce Desig n Example ........................................................................... 12
5. Startup behavior ............................................................................................. 13
4.1. RESET and PMUEN .................................................................................................................. 13
4.2. SDIO and SPI interface .............................................................................................................. 13
6. Ordering Information ..................................................................................... 14
7. Revision History ............................................................................................. 14
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1. Har d ware Sp ec if icat ions
General Conditions (VIN= 3. 6V and 25°C)
1.1. Recommended Operating Conditions
Rating Min Typical Max Unit
Operating Temperature Range -40 - 85 °C
Supply Vol t age VIN 2.3 3.6 4.8 Volts
Signal Pin Voltage - 1.8 - Volts
RF Frequency 2400 - 2483.5 MHz
1.2. Absolute Maximum Ratings
Rating Min Typical Max Unit
Storage temperature range -55 - +150 °C
Supply voltage VIN -0.3 - +5.0 Volts
I/O pin voltage VIO -0.3 - +2.5 Volts
RF input power - - -5 dBm
1.3. I/O Operatin g Conditions
Symbol Parameter Min Max Unit
VIL Low-Level Input Voltage - 0.6 Volts
VIH High-Level Input Voltage 1.3 - Volts
VOL Low-Level Output Voltage - 0.2 Volts
VOH High-Level Output Voltage 1.6 - Volts
IOL Low –Level O ut put Current - 4.0 mA
IOH High-Level Output Current - 4.0 mA
RPU Pull-up Resistor 80 120 KΩ
RPD Pull-down Resistor 80 120 KΩ
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1.4. Current Consumption
Modes (WLAN Max Power Consumption)
VBAT=3.6v Avg Unit
Complete Power Down (PMUEN low) 17 μA
Sleep 101 μA
Power save (beacon period including DTIM 100ms, beacon length 1ms )
-proprietary power saving feat ures enabl ed 0.77 mA
RX (idle, 2.4GHz) 62.07 mA
RX (active, 2.4GHz, OFDM) 65.87 mA
TX (active, 2.4GHz, OFDM), 15.5dBm @RF port 257.67 mA
TX (active, 2.4GHz, OFDM), 20.5dBm @RF port 279.67 mA
A VoIP call using a standard codec G.711 (64Kb/s, 320 byte packets) and
U-APSD (WMM power save) power-saving mode. 4.65 mA
Video streaming; the device is receiving 2.0 Mbps of data using legacy
PSM mode (for example, MPEG-4@2Mbps) 13.31 mA
Ipeak: system maximum peak current draw 378 mA
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1.5. Selected RF Characteristics
Parameters Conditions Typica
l Unit
Antenna load 50 ohm
Wi-Fi Receiver 2.4GHz
Sensitivity DSSS 1Mbps@FER<8% -98.5 dBm
Sensitivity DSSS 2Mbps@FER<8% -96 dBm
Sensitivity CCK 5.5Mbps@FER<8% -94 dBm
Sensitivity CCK 11Mbps@FER<8% -89 dBm
Sensitivity BPSK 6Mbps@PER<10% -94.5 dBm
Sensitivity BPSK 9Mbps@PER<10% -92.5 dBm
Sensitivity QPSK 12Mbps@PER<10% -91.5 dBm
Sensitivity QPSK 18Mbps@PER<10% -89 dBm
Sensitivity 16QAM 24Mbps@PER<10% -86 dBm
Sensitivity 16QAM 36Mbps@PER<10% -83 dBm
Sensitivity 64QAM 48Mbps@PER<10% -78.5 dBm
Sensitivity 64QAM 54Mbps@PER<10% -77 dBm
Sensitivity BPSK 6.5Mbps@PER<10% -92.5 dBm
Sensitivity QPSK 13Mbps@PER<10% -89.5 dBm
Sensitivity QPSK 19.5Mbps@PER<10% -87 dBm
Sensitivity 16QAM 26Mbps@PER<10% -84.5 dBm
Sensitivity 16 QAM 39Mbps@PER<10% -81 dBm
Sensitivity 64QAM 52Mbps@PER<10% -77 dBm
Sensitivity 64QAM 58.5Mbps@PER<10% -75.5 dBm
Sensitivity 64QAM 65Mbps@PER<10% -73.5 dBm
Wi-Fi Receiver 5GHz 11n
Sensitivity BPSK 6.5Mbps@PER<10%,Nss=1 -91 dBm
Sensitivity QPSK 13Mbps@PER<10%, Nss=1 -88 dBm
Sensitivity 16QAM 26MbpsPER<10%,Nss=1 -83 dBm
Sensitivity 64QAM 65MbpsPER<10%,Nss=1 -72.5 dBm
Wi-Fi Transmitter 2.4GHz
Output Power 802.11b/g BP SK 1/2 20 dBm
Output Power 802.11b/g BP SK 3/4 20 dBm
Output Power 802.11b/g Q PSK 1/ 2 20 dBm
Output Power 802.11b/g Q PSK 3/ 4 20 dBm
Output Power 802.11b/g 16Q A M 1/2 19.5 dBm
Output Power 802.11b/g 16Q A M 3/4 18.5 dBm
Output Power 802.11b/g 64Q A M 2/3 17.5 dBm
Output Power 802.11b/g 64Q A M 3/4 16.5 dBm
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Output Power 802.11n MCS-0 20 dBm
Output Power 802.11n MCS-1 20 dBm
Output Power 802.11n MCS-2 20 dBm
Output Power 802.11n MCS-3 19.5 dBm
Output Power 802.11n MCS-4 18.5 dBm
Output Power 802.11n MCS-5 17.5 dBm
Output Power 802.11n MCS-6 16.5 dBm
Output Power 802.11n MCS-7 15.5 dBm
Wi-Fi Transmitter 5GHz, 11n
Output Power 802.11n MCS-0 19.5 dBm
Output Power 802.11n MCS-7 14.5 dBm
1.6. Tr ansmit Power Back-off
When 2.7 V < VIN < 3.6 V, the output power shall be backed off by 0.8 dB per300 mV drop
of VIN below 3.6 V to guarantee m eeting spectral mask, EVM, harmonic levels, spurious
emissions and regulatory requirements in general.
When 2.3 V < VIN < 2.7 V, an additional back-off of the output power is needed to guarantee
meeting spectral mask, EVM, harmonic levels, spurious emissions and regulatory
requirements in general.
When the load is not 50Ω, the output power is backed off to guarantee meeting spectral
mask , EVM, harmonic level s, spurious em issions and regulator y r equirem ents in general.
The device is able to withstand a VSWR of up to 12:1 without any damage.
W hen the tem perature incr eases fr om +25°C t o +85° C, the out put po wer shall be back ed
off by 0.25 dB per 10°C increase to guarantee meeting spectral mask, EVM, harmonic
levels, spurious emissions and regulatory requirements in general.
Tx Power vs Vin
15.0
17.0
19.0
21.0
23.0
25.0
2.4 2.9 3.4
Tx Power dBm
Tx Power dBm
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1.7. Pin Assignment
Name Type Pin # Description ALT Function
Power and Ground
VIN 15 VIN
GND 14 GND
Control signal
RESET I 12 Reset input
PMUEN I 13 Power enable
Digital interface
SDIO [0] I/O 4 SDIO CMD SPI D I
SDIO [1] I/O 3 SDIO DATA0 SPI DO
SDIO [2] I/O 2 SDIO DATA1 SPI INT
SDIO [3] I/O 18 SDIO DATA3 SPI CSN
SDIO [4] I/O 17 SDIO CLK SPI C L K
SDIO [5] I/O 1 SDIO DATA2
SDIO INT 11 SDIO INT
LPO
LPO I 16 Low power clock input
External A ntenna
GND 5 GND
ANT 2.4G I/O 6 External 2.4GHz antenna
GND 7 GND
GND 8 GND
ANT 5G I/O 9 E xternal 5GHz antenna
GND 10 GND
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1.8. Layout Drawing
Size: 13.5 mm x 14.6 mm x 2. 7 mm
574.8 mil
(14.6 mm)
1 SDIO5
2 SDIO2
3 SDIO1
4 SDIO0
5 GND
6 ANT 2.4GHz
7 GND
GND 14
PMUEN 13
RESET12
SD IO IN T 11
GND 10
ANT 5GHz 9
GND 8
31.2 mil
(0.8 mm)
40 mil
(1.0 mm)
59 mil
(1.5 mm)
20 mil
(0.5 mm)
531.5 mil
(13.5 mm)
VIN 15
LPO 16
SDIO4 17
18 SDIO3
336.5 mil
(8.6 mm)
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3. Hardware Design
• All unused pins should be left floating; do not ground.
• All GND pins must be well grounded.
• The area around the antenna should be free of any ground planes, power planes, trace routings, or metal for
at least 6.5 mm in all directions.
• Traces should not be routed underneath the module.
3.1. Module Reflow Installation
The WF60 is a surface mount Bluetooth module supplied on a 18 pin, 6-layer PCB. The final assembly
recommended reflow profiles are:
For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended.
• Maximum peak temperature of 230° - 240°C (below 250°C).
• Maximum rise and fall slope after liquidous of < 2°C/second.
• Maximum rise and fall slope after liquidous of < 3°C/second.
• Maximum time at liquidous of 40 – 80 seconds.
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5. Startup behavior
5.1. RESET and PMUEN
A valid reset shall be obtained by maintaining RESET active (low) for at least two cycles of LPO after VIN is
stable within its operating range. There is no constraint on the activation of the other supplies during this
process.
5.2. SDIO and SPI int erf ace
SDIO 5 is the selection pin; the state of this pin is monitored on the rising edge of RESET.
• LOW selects SPI
• HIGH selects SDIO
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6. Ordering Information
Part Name Description
WF60-DB Dual band, internal antenna for 2.4GHz, 5GHz
ext antenna
WF60-DB-EXT Dual band, external antenna option for 2.4GHz,
5GHz ext antenna
WF60-LB Low band only, 2. 4G Hz, internal antenna
WF60-LB-EXT Low band only, 2.4GHz, ext antenna
7. Revision History
Data Revision Description
14-June-2016 1.0 First release
