TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1991, Texas Instruments Incorporated
1
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of T exas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Functionally Equivalent to the
TIBPAL22V10/10A, with Additional
Feedback Paths in the Output Logic
Macrocell
Choice of Operating Speeds:
TIBPAL22VP10-20C . . . 20 ns Max
TIBPAL22VP10-25M . . . 25 ns Max
Variable Product Term Distribution
Allows More Complex Functions to Be
Implemented
Each Output Is User Programmable for
Registered or Combinational Operation,
Polarity, and Output Enable Control
TTL-Level Preload for Improved Testability
Extra Terms Provide Logical Synchronous
Set and Asynchronous Reset Capability
Fast Programming, High Programming
Yield, and Unsurpassed Reliability Ensured
Using Ti-W Fuses
AC and DC Testing Done at the Factory
Utilizing Special Designed-In Test Features
Dependable Texas Instruments Quality and
Reliability
Package Options Include Plastic
Dual-In-Line and Chip Carrier Packages
description
The TIBPAL22VP10’ is equivalent to the
TIBPAL22V10A but offers additional flexibility in
the output structure. The improved output
macrocell uses the registered outputs as inputs
when in a high-impedance condition. This
provides two additional output configurations for a
total of six possible macrocell configurations all of
which are shown in Figure 1.
These devices contain up to 22 inputs and 10 outputs. They incorporate the unique capability of defining and
programming the architecture of each output on an individual basis. Outputs may be registered or nonregistered
and inverting or noninverting. In addition, the data may be fed back into the array from either the register or the
I/O port. The ten potential outputs are enabled through the use of individual product terms.
Further advantages can be seen in the introduction of variable product term distribution. This technique
allocates from 8 to 16 logical product terms to each output for an average of 12 product terms per output. This
variable allocation of terms allows far more complex functions to be implemented than in previously available
devices.
These devices are covered by U.S. Patent 4,410,987.
IMPACT-X is a trademark of Texas Instruments Incorporated.
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
CLK/I
I
I
I
I
I
I
I
I
I
I
GND
VCC
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I
3212827
12 13
5
6
7
8
9
10
11
25
24
23
22
21
20
19
I/O/Q
I/O/Q
I/O/Q
NC
I/O/Q
I/O/Q
I/O/Q
I
I
I
NC
I
I
I
426
14 15 16 1718
I
I
GND
NC
I
I/O/Q
I/O/Q
I
I
CLK/I
NC
I/O/Q
I/O/Q
NC No internal connection
Pin assignments in operating mode
VCC
C SUFFIX . . . NT PACKAGE
M SUFFIX . . . JT PACKAGE
(TOP VIEW)
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
2
description (continued)
Circuit design is enhanced by the addition of a synchronous set and an asynchronous reset product term. These
functions are common to all registers. When the synchronous set product term is a logic 1, the output registers
are loaded with a logic 1 on the next low-to-high clock transition. When the asynchronous reset product term
is a logic 1, the output registers are loaded with a logic 0. The output logic level after set or reset depends on
the polarity selected during programming. Output registers can be preloaded to any desired state during testing.
Preloading permits full logical verification during product testing.
With features such as programmable output logic macrocells and variable product term distribution, the
TIBPAL22VP10’ of fers quick design and development of custom LSI functions with complexities of 500 to 800
equivalent gates. Since each of the ten output pins may be individually configured as inputs on either a
temporary or permanent basis, functions requiring up to 21 inputs and a single output or down to 12 inputs and
10 outputs are possible.
A power-up clear function is supplied that forces all registered outputs to a predetermined state after power is
applied to the device. Registered outputs selected as active-low power-up with their outputs high. Registered
outputs selected as active-high power-up with their outputs low.
A single security fuse is provided on each device to discourage unauthorized copying of fuse patterns. Once
blown, the verification circuitry is disabled and all other fuses will appear to be open.
The TIBPAL22V10-20C is characterized for operation from 0°C to 75°C. The TIBPAL22V10-25M is
characterized for operation over the full military temperature range of –55°C to 125°C.
TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 3
functional block diagram (positive logic)
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
10
12
14
EN
16
16
14
12
10
22
22
1
10
&
44 x 132
I/O/Q
I/O/Q
I/O/Q
I/O/Q
EN
EN
EN
EN
EN
EN
EN
EN
EN
10
10
8
8
10
11
CLK/I
I
Set
Reset 1S
R
C1
Output
Logic
Macrocell
denotes fused inputs
TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
4
0 4 8 1216202428
Increments
First
Fuse
Numbers
32 36 40
Macro-
cell
R = 5809
P = 5808
R = 581 1
P = 5810
R = 5813
P = 5812
R = 5815
P = 5814
R = 5817
P = 5816
logic symbol (positive logic)
Asynchronous Reset
23
22
21
20
19
1
2
3
4
5
(to all registers)
396
0
440
880
924
1452
1496
2112
2156
2860
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I
I
I
I
CLK/I
Macro-
cell
Macro-
cell
Macro-
cell
Macro-
cell
TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 5
Fuse number = First fuse number + Increment
R = 5819
P = 5818
R = 5821
P = 5820
R = 5823
P = 5822
R = 5825
P = 5824
R = 5827
P = 5826
18
6
7
8
9
10
11
17
16
15
14
Synchronous Set
13 (to all registers)
Inside each MACROCELL the ”P” fuse is the polarity fuse and the ”R” fuse is the register fuse.
2904
3608
3652
4268
4312
4840
4884
5324
5368
5720
5764
I
I
I
I
I
I
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I/O/Q
I
Macro-
cell
Macro-
cell
Macro-
cell
Macro-
cell
Macro-
cell
TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
6
output logic macrocell diagram
C1
G0
3
0
1
1
0
3
2MUX
I = 0
1S
1D
R
MUX
1/2/3
SS
AR
From Clock Buffer
S1
S0
AR = asynchronous reset
SS = synchronous set
Output Logic Macrocell
G0
3
0
1
S2
This fuse is unique to the Texas Instruments TIBPAL22VP10’. It allows feedback from the I/O port using registered outputs as shown in the
macrocell fusing logic function table.
TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 7
C1
1S
1D
R
C1
1S
1D
R
S2 = 0
S1 = 0
S0 = 0
S2 = 0
S1 = 0
S0 = 1
REGISTER FEEDBACK, REGISTERED, ACTIVE-LOW OUTPUT REGISTER FEEDBACK, REGISTERED, ACTIVE-HIGH OUTPUT
C1
1S
1D
R
C1
1S
1D
R
S2 = 1
S1 = 0
S0 = 0
S2 = 1
S1 = 0
S0 = 1
I/O FEEDBACK, REGISTERED, ACTIVE-LOW OUTPUTI/O FEEDBACK, REGISTERED, ACTIVE-HIGH OUTPUT
S2 = X
S1 = 1
S0 = 0
S2 = X
S1 = 1
S0 = 1
I/O FEEDBACK, COMBINATIONAL, ACTIVE-LOW OUTPUT I/O FEEDBACK, COMBINATIONAL, ACTIVE-HIGH OUTPUT
These configurations are unique to the TIBP AL22VP10’ and provide added flexibility when comparing it to the TIBP AL22V10 or TIBP AL22V10A.
Figure 1. Resultant Macrocell Feedback and Output Logic After Programming
FEEDBACK AND OUTPUT CONFIGURATION
tsu Setup time before clock
ns
ns
Pulse durationtw
UNIT
TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
8
MACROCELL FEEDBACK AND OUTPUT FUNCTION TABLE
FUSE SELECT
S2 S1 S0
0 0 0 Register feedback Registered Active low
00 1 Register feedback Registered Active high
10 0 I/O feedback Registered Active low
10 1 I/O feedback Registered Active high
X1 0 I/O feedback Combinational Active low
X 1 1 I/O feedback Combinational Active high
0 = unblown fuse, 1 = blown fuse, X = unblown or blown fuse
S2, S1 and S0 are select-function fuses as shown in the output logic macrocell diagram.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage (see Note 1) 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to disabled output (see Note 1) 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range: TIBPAL22VP10-20C 0°C to 75°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TIBPAL22VP10-25M 55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NOTE 1: These ratings apply except for programming pins during a programming cycle or during a preload cycle.
recommended operating conditions
TIBPAL22VP10-20C TIBPAL22VP10-25M
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 4.75 5 5.25 4.5 5 5.5 V
VIH High-level input voltage 2 5.5 2 5.5 V
VIL Low-level input voltage 0.8 0.8 V
IOH High-level output current 3.2 –2 mA
IOL Low-level output current 16 12 mA
fclock Clock frequency37 25 MHz
Clock high or low 10 20
Asynchronous Reset high or low 20 30
Input 15 20
Feedback 15 20
Synchronous Preset (active) 15 20
Asynchronous Reset (inactive) 20 25
thHold time, input, preset, or feedback after clock0 0 ns
TAOperating free-air temperature 0 75 –55 125 °C
fclock (with feedback)
+
1
tsu
)
tpd (CLK to Q), fclock without feedback can be calculated as
fclock (without feedback)
+
1
twhigh
)
twlow.
IOZL µA
VCC = 5.25 V, VO = 0.4 V
TIBPAL22VP10-20C
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 9
electrical characteristics over recommended operating free-air temperature range
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
VIK VCC = 4.75 V, II = –18 mA 1.2 V
VOH VCC = 4.75 V, IOH = –3.2 mA 2.4 3.5 V
VOL VCC = 4.75 V, IOL = 16 mA 0.35 0.5 V
IOZH VCC = 5.25 V, VO = 2.7 V 0.1 mA
Any output 100
Any I/O 250
IIVCC = 5.25 V, VI = 5.5 V 1 mA
IIH VCC = 5.25 V, VI = 2.7 V 25 µA
IIL VCC = 5.25 V, VI = 0.4 V 0.25 mA
IOSVCC = 5.25 V, VO = 0.5 V –30 –90 mA
ICC VCC = 5.25 V, VI = GND, Outputs open 140 180 mA
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER FROM
(INPUT) TO
(OUTPUT) TEST CONDITION MIN TYPMAX UNIT
fmax§37 50 MHz
tpd I, I/O I/O CL = 50 pF, 12 20 ns
tpd I, I/O (reset) QR1 = 300 , 12 20 ns
tpd CLK Q R2 = 390 , 8 12 ns
ten I, I/O I/O, Q See Figure 4 12 20 ns
tdis I, I/O I/O, Q 12 20 ns
All typical values are at VCC = 5 V, TA = 25°C.
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. VO is set at 0.5 V to
avoid test problems caused by test equipment ground degradation.
§fmax (with feedback)
+
1
tsu
)
tpd (CLK to Q), fmax without feedback can be calculated as
fmax (without feedback)
+
1
twhigh
)
twlow.
TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
10
electrical characteristics over recommended operating free-air temperature range
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
VIK VCC = 4.5 V, II = –18 mA 1.2 V
VOH VCC = 4.5 V, IOH = –2 mA 2.4 3.5 V
VOL VCC = 4.5 V, IOL = 12 mA 0.25 0.5 V
IOZH VCC = 5.5 V, VO = 2.7 V 0.1 mA
IOZL VCC = 5.5 V, VO = 0.4 V 0.1 mA
IIVCC = 5.5 V, VI = 5.5 V 1 mA
IIH VCC = 5.5 V, VI = 2.7 V 25 µA
IIL VCC = 5.5 V, VI = 0.4 V 0.25 mA
IOSVCC = 5.5 V, VO = 0.5 V –30 –90 mA
ICC VCC = 5.5 V, VI = GND, Outputs open 140 200 mA
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER FROM
(INPUT) TO
(OUTPUT) TEST CONDITION MIN TYPMAX UNIT
fmax§25 50 MHz
tpd I, I/O I/O CL = 50 pF, 12 25 ns
tpd I, I/O (reset) QR1 = 390 , 12 25 ns
tpd CLK Q R2 = 750 , 8 15 ns
ten I, I/O I/O, Q See Figure 4 12 25 ns
tdis I, I/O I/O, Q 12 25 ns
All typical values are at VCC = 5 V, TA = 25°C.
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. VO is set at 0.5 V to
avoid test problems caused by test equipment ground degradation.
§fmax (with feedback)
+
1
tsu
)
tpd (CLK to Q), fmax without feedback can be calculated as
fmax (without feedback)
+
1
twhigh
)
twlow.
TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 11
preload procedure for registered outputs (see Notes 2 and 3)
The output registers can be preloaded to any desired state during device testing. This permits any state to be
tested without having to step through the entire state-machine sequence. Each register is preloaded individually
by following the steps given below:
Step 1. With VCC at 5 V and pin 1 at VIL, raise pin 13 to VIHH.
Step 2. Apply either VIL or VIH to the output corresponding to the register to be preloaded.
Step 3. Pulse pin 1, clocking in preload data.
Step 4. Remove output voltage, then lower pin 13 to VIL. Preload can be verified by observing the voltage level
at the output pin.
tdtsu twtd
VIHH
VIL
VIL
VOL
VOH
VIH
Pin 13
Pin 1
Registered I/O Input Output
VIH
VIL
Figure 2. Preload Waveforms
NOTES: 2. Pin numbers shown are for JT and NT packages only. If chip-carrier socket adapter is not used, pin numbers must be changed
accordingly.
3. td = tsu = tw = 100 ns to 1000 ns. VIHH = 10.25 V to 10.75 V.
TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
12
power-up reset
Following power up, all registers are reset to zero. The output level depends on the polarity selected during
programming. This feature provides extra flexibility to the system designer and is especially valuable in
simplifying state-machine initialization. To ensure a valid power-up reset, it is important that the rise of VCC be
monotonic. Following power-up reset, a low-to-high clock transition must not occur until all applicable input and
feedback setup times are met.
1.5 V
tsu
tpd
tw
VOL
VOH
VIL
VIH
5 V
VCC
Active High
Registered Output
Active Low
Registered Output
CLK
4 V
VOH
VOL
1.5 V
1.5 V
(600 ns typ, 1000 ns MAX)
State Unknown
1.5 V
State Unknown
This is the power-up reset time and applies to registered outputs only. The values shown are from characterization data.
This is the setup time for input or feedback.
Figure 3. Power-Up Reset Waveforms
programming information
Texas Instruments programmable logic devices can be programmed using widely available software and
inexpensive device programmers.
When the additional fuses are not being used, the TIBPAL22VP10 can be programmed using the
TIBP AL22V10/10A programming algorithm. The fuse configuration data can either be from a JEDEC file (format
per JEDEC Standard No. 3-A) or a TIBPAL22V10/10A master.
Complete programming specifications, algorithms, and the latest information on hardware, software, and
firmware are available upon request. Information on programmers capable of programming Texas Instruments
programmable logic is also available, upon request, from the nearest TI field sales office, local authorized TI
distributor, or by calling Texas Instruments at (214) 997-5666.
TIBPAL22VP10-20C, TIBPAL22VP10-25M
HIGH-PERFORMANCE IMPACT-X PROGRAMMABLE ARRAY LOGIC CIRCUITS
SRPS013 – D2943, FEBRUAR Y 1987 – REVISED JUNE 1991
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 13
PARAMETER MEASUREMENT INFORMATION
tsu
S1
R2
CL
(see Note A)
LOAD CIRCUIT FOR
3-STATE OUTPUTS
(3.5 V) [3 V]
(0.3 V) [0]
1.5 V
1.5 V
th
1.5 V
tpd
tpd
tpd
tpd
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOH
VOH
VOL
VOL
1.5 V 1.5 V
1.5 V 1.5 V
tw
1.5 V 1.5 V
3.3 V
VOL
VOH
VOH –0.5 V
0 V
ten
ten
tdis
tdis
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATIONS
1.5 V 1.5 V
1.5 V
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V
R1
VOL +0.5 V
5 V
(3.5 V) [3 V]
(0.3 V) [0]
(3.5 V) [3 V]
(0.3 V) [0]
(3.5 V) [3 V]
(0.3 V) [0]
(3.5 V) [3 V]
(0.3 V) [0]
(3.5 V) [3 V]
(0.3 V) [0]
From Output
Under Test Test
Point
Input
Out-of-Phase
Output
(see Note D)
Timing
Input
Data
Input
In-Phase
Output
High-Level
Pulse
Low-Level
Pulse
Output
Control
(low–level
enabling)
W aveform 1
S1 Closed
(see Note B)
W aveform 2
S1 Open
(see Note B)
NOTES: A. CL includes probe and jig capacitance and is 50 pF for tpd and ten, 5 pF for tdis.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2
is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses have the following characteristics: For C suffix, use the voltage levels indicated in parentheses ( ). PRR 1 MHz,
tr = tf 2 ns, duty cycle = 50%. For M suffix, use the voltage levels indicated in brackets [ ]. PRR 10 MHz, tr and tf 2 ns,
duty cycle = 50%.
D. When measuring propagation delay times of 3-state outputs, switch S1 is closed.
E. Equivalent loads may be used for testing.
Figure 4. Load Circuit and Voltage Waveforms
B0892
1992 Texas Instruments Incorporated
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-86053033A ACTIVE LCCC FK 28 TBD Call TI N / A for Pkg Type
5962-8605303KA ACTIVE CFP W 24 1 TBD Call TI N / A for Pkg Type
5962-8605303KA ACTIVE CFP W 24 1 TBD Call TI N / A for Pkg Type
5962-8605303LA ACTIVE CDIP JT 24 TBD Call TI N / A for Pkg Type
5962-8605303LA ACTIVE CDIP JT 24 TBD Call TI N / A for Pkg Type
TIBPAL22VP10-20CFN OBSOLETE PLCC FN 28 TBD Call TI Call TI
TIBPAL22VP10-20CFN OBSOLETE PLCC FN 28 TBD Call TI Call TI
TIBPAL22VP10-20CNT OBSOLETE PDIP NT 24 TBD Call TI Call TI
TIBPAL22VP10-20CNT OBSOLETE PDIP NT 24 TBD Call TI Call TI
TIBPAL22VP10-25MFKB OBSOLETE LCCC FK 28 TBD Call TI Call TI
TIBPAL22VP10-25MFKB OBSOLETE LCCC FK 28 TBD Call TI Call TI
TIBPAL22VP10-25MJTB OBSOLETE CDIP JT 24 TBD Call TI Call TI
TIBPAL22VP10-25MJTB OBSOLETE CDIP JT 24 TBD Call TI Call TI
TIBPAL22VP10-25MWB ACTIVE CFP W 24 1 TBD Call TI N / A for Pkg Type
TIBPAL22VP10-25MWB ACTIVE CFP W 24 1 TBD Call TI N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 6-Dec-2006
Addendum-Page 1
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
JT (R-GDIP-T**) CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
4040110/C 08/96
B
0.200 (5,08) MAX
0.320 (8,13)
0.290 (7,37)
0.130 (3,30) MIN
0.008 (0,20)
0.014 (0,36)
Seating Plane
13
12
0.030 (0,76)
0.070 (1,78)
0.015 (0,38) MIN
A
24
1
0.100 (2,54) MAX
0.023 (0,58)
0.015 (0,38)
0.100 (2,54)
0°–15°
1.440
(37,08)
1.460
0.285
(7,39)
0.291
(36,58)
(7,24)
28
PINS **
1.280
1.240
0.300
0.245
(7,62)
DIM
B MAX
A MAX
A MIN
B MIN (6,22)
24
(32,51)
(31,50)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
MECHANICAL DATA
MCFP007 – OCTOBER 1994
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
W (R-GDFP-F24) CERAMIC DUAL FLATPACK
4040180-5/B 03/95
1.115 (28,32)
0.090 (2,29)
0.375 (9,53)
0.019 (0,48)
0.030 (0,76)
0.045 (1,14)
0.006 (0,15)
0.045 (1,14)
0.015 (0,38)
0.015 (0,38)
0.026 (0,66)
0.004 (0,10)
0.340 (8,64)
0.840 (21,34)
124
0.360 (9,14)
0.240 (6,10)
1312
Base and Seating Plane
30° TYP
0.360 (9,14)
0.240 (6,10)
0.395 (10,03)
0.360 (9,14)
0.640 (16,26)
0.490 (12,45)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
E. Index point is provided on cap for terminal identification only.
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MPDI004 – OCTOBER 1994
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
NT (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE
4040050/B 04/95
24 PINS SHOWN
1.425
(36,20)
1.385
0.295
(7,49)
(8,00)
0.315
(35,18)
28
PINS **
A MIN
A MAX
B MAX
B MIN
13
0.250 (6,35)
0.280 (7,11)
12
0.200 (5,08) MAX
DIM 24
1.230
(31,24)
(32,04)
1.260
0.310
(7,87)
(7,37)
0.290
B
0.125 (3,18) MIN
Seating Plane
0.010 (0,25) NOM
A
0.070 (1,78) MAX
24
1
0.015 (0,38)
0.021 (0,53)
0.020 (0,51) MIN
0.100 (2,54)
M
0.010 (0,25)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
MECHANICAL DATA
MPLC004A – OCTOBER 1994
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER
4040005/B 03/95
20 PIN SHOWN
0.026 (0,66)
0.032 (0,81)
D2/E2
0.020 (0,51) MIN
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D2/E2
0.013 (0,33)
0.021 (0,53)
Seating Plane
MAX
D2/E2
0.219 (5,56)
0.169 (4,29)
0.319 (8,10)
0.469 (11,91)
0.569 (14,45)
0.369 (9,37)
MAX
0.356 (9,04)
0.456 (11,58)
0.656 (16,66)
0.008 (0,20) NOM
1.158 (29,41)
0.958 (24,33)
0.756 (19,20)
0.191 (4,85)
0.141 (3,58)
MIN
0.441 (11,20)
0.541 (13,74)
0.291 (7,39)
0.341 (8,66)
18
19
14
13
D
D1
13
9
E1E
4
8
MINMAXMIN
PINS
**
20
28
44
0.385 (9,78)
0.485 (12,32)
0.685 (17,40)
52
68
84 1.185 (30,10)
0.985 (25,02)
0.785 (19,94)
D/E
0.395 (10,03)
0.495 (12,57)
1.195 (30,35)
0.995 (25,27)
0.695 (17,65)
0.795 (20,19)
NO. OF D1/E1
0.350 (8,89)
0.450 (11,43)
1.150 (29,21)
0.950 (24,13)
0.650 (16,51)
0.750 (19,05)
0.004 (0,10)
M
0.007 (0,18)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete. All products are sold
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent
TI deems necessary to support this warranty. Except where mandated by government requirements, testing
of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible
for their products and applications using TI components. To minimize the risks associated with customer
products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,
or process in which TI products or services are used. Information published by TI regarding third-party
products or services does not constitute a license from TI to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or
other intellectual property of the third party, or a license from TI under the patents or other intellectual
property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not
responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service
and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandInterface interface.ti.com Digital Control www.ti.com/digitalcontrolLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityLow Power www.ti.com/lpw Telephony www.ti.com/telephonyWireless
Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandInterface interface.ti.com Digital Control www.ti.com/digitalcontrolLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityLow Power www.ti.com/lpw Telephony www.ti.com/telephonyWireless
Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandInterface interface.ti.com Digital Control www.ti.com/digitalcontrolLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityLow Power www.ti.com/lpw Telephony www.ti.com/telephonyWireless
Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandInterface interface.ti.com Digital Control www.ti.com/digitalcontrolLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityLow Power www.ti.com/lpw Telephony www.ti.com/telephonyWireless
Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandInterface interface.ti.com Digital Control www.ti.com/digitalcontrolLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityLow Power www.ti.com/lpw Telephony www.ti.com/telephonyWireless
Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandInterface interface.ti.com Digital Control www.ti.com/digitalcontrolLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityLow Power www.ti.com/lpw Telephony www.ti.com/telephonyWireless
Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-8605303KA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type
TIBPAL22VP10-20CFN OBSOLETE PLCC FN 28 TBD Call TI Call TI
TIBPAL22VP10-20CFN OBSOLETE PLCC FN 28 TBD Call TI Call TI
TIBPAL22VP10-20CNT OBSOLETE PDIP NT 24 TBD Call TI Call TI
TIBPAL22VP10-20CNT OBSOLETE PDIP NT 24 TBD Call TI Call TI
TIBPAL22VP10-25MFKB ACTIVE LCCC FK 28 TBD Call TI Call TI
TIBPAL22VP10-25MFKB ACTIVE LCCC FK 28 TBD Call TI Call TI
TIBPAL22VP10-25MJTB ACTIVE CDIP JT 24 TBD Call TI Call TI
TIBPAL22VP10-25MJTB ACTIVE CDIP JT 24 TBD Call TI Call TI
TIBPAL22VP10-25MWB ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type
TIBPAL22VP10-25MWB ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MCFP007 – OCTOBER 1994
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
W (R-GDFP-F24) CERAMIC DUAL FLATPACK
4040180-5/B 03/95
1.115 (28,32)
0.090 (2,29)
0.375 (9,53)
0.019 (0,48)
0.030 (0,76)
0.045 (1,14)
0.006 (0,15)
0.045 (1,14)
0.015 (0,38)
0.015 (0,38)
0.026 (0,66)
0.004 (0,10)
0.340 (8,64)
0.840 (21,34)
124
0.360 (9,14)
0.240 (6,10)
1312
Base and Seating Plane
30° TYP
0.360 (9,14)
0.240 (6,10)
0.395 (10,03)
0.360 (9,14)
0.640 (16,26)
0.490 (12,45)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
E. Index point is provided on cap for terminal identification only.
MECHANICAL DATA
MPLC004A – OCTOBER 1994
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER
4040005/B 03/95
20 PIN SHOWN
0.026 (0,66)
0.032 (0,81)
D2/E2
0.020 (0,51) MIN
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D2/E2
0.013 (0,33)
0.021 (0,53)
Seating Plane
MAX
D2/E2
0.219 (5,56)
0.169 (4,29)
0.319 (8,10)
0.469 (11,91)
0.569 (14,45)
0.369 (9,37)
MAX
0.356 (9,04)
0.456 (11,58)
0.656 (16,66)
0.008 (0,20) NOM
1.158 (29,41)
0.958 (24,33)
0.756 (19,20)
0.191 (4,85)
0.141 (3,58)
MIN
0.441 (11,20)
0.541 (13,74)
0.291 (7,39)
0.341 (8,66)
18
19
14
13
D
D1
13
9
E1E
4
8
MINMAXMIN
PINS
**
20
28
44
0.385 (9,78)
0.485 (12,32)
0.685 (17,40)
52
68
84 1.185 (30,10)
0.985 (25,02)
0.785 (19,94)
D/E
0.395 (10,03)
0.495 (12,57)
1.195 (30,35)
0.995 (25,27)
0.695 (17,65)
0.795 (20,19)
NO. OF D1/E1
0.350 (8,89)
0.450 (11,43)
1.150 (29,21)
0.950 (24,13)
0.650 (16,51)
0.750 (19,05)
0.004 (0,10)
M
0.007 (0,18)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
JT (R-GDIP-T**) CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
4040110/C 08/96
B
0.200 (5,08) MAX
0.320 (8,13)
0.290 (7,37)
0.130 (3,30) MIN
0.008 (0,20)
0.014 (0,36)
Seating Plane
13
12
0.030 (0,76)
0.070 (1,78)
0.015 (0,38) MIN
A
24
1
0.100 (2,54) MAX
0.023 (0,58)
0.015 (0,38)
0.100 (2,54)
0°–15°
1.440
(37,08)
1.460
0.285
(7,39)
0.291
(36,58)
(7,24)
28
PINS **
1.280
1.240
0.300
0.245
(7,62)
DIM
B MAX
A MAX
A MIN
B MIN (6,22)
24
(32,51)
(31,50)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDLP® Products www.dlp.com Broadband www.ti.com/broadbandDSP dsp.ti.com Digital Control www.ti.com/digitalcontrolClocks and Timers www.ti.com/clocks Medical www.ti.com/medicalInterface interface.ti.com Military www.ti.com/militaryLogic logic.ti.com Optical Networking www.ti.com/opticalnetworkPower Mgmt power.ti.com Security www.ti.com/securityMicrocontrollers microcontroller.ti.com Telephony www.ti.com/telephonyRFID www.ti-rfid.com Video & Imaging www.ti.com/videoRF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2009, Texas Instruments Incorporated