
MB-0146-2
8/8
JAE PMK Div. Proprietary. Copyright © 2006,Japan Aviation Electronics Industry, Ltd.
Japan Aviation Electronics Industry, Limited
Product Marketing Division
Aobadai Building, 3-1-19, Aobadai, Meguro-ku, Tokyo 153-8539
Phone: +81- 3-3780-2787 FAX: +81-3-378 0 -2946
Notice: Products shown in this leaflet are
made for the applications listed below. However,
if the above-mentioned products are to be used in
aerospace devices, marine cable-co nnection
devices, atomic power control systems, medical
equipment for life-support systems, or any other
specific application requ iring extremely high
reliability, please contact JAE for further
information.
Recommended applications: Computers, Office
machines, Measuring devices,
Telecommunication devices (Terminals, Mobile
devices), AV devices, Household applications, FA
devices, etc.
FPC configuration (Recommended)
(Note) Be sure to request specifications.
JAHL-10293Operating Manual
JACS-10293Specification Table
SJ104079 (odd number)
SJ104400 (even number)
Drawing
Document No.Specification
Recommended
G old Plating Electrolysis Plating 0.1um min.
Nickel Plating Electrolysis Plating Soft type (If available)
Copper Rolled Material Nominal 18um max.
Adhesive Thermosetting A dhesive None (Recommended)
Base Film Polyimide 25um
Adhesive Thermosetting Adhesive 30um max.
Reinforce Plante Polyimide -
Composition