November 2003 ASM3P2184A
rev 1.0
Alliance Semiconductor
2575, Augustine Drive Santa Clara, CA Tel: 408.855.4900 Fax: 408.855 .4999 www.alsc.com
Notice: The information in this document is subject to change without notice.
LCD Panel EMI Reduction IC
Features
FCC approved method of EMI attenuation.
Provides up to 15dB EMI reduction.
Generates a 1X low EMI spread spectrum clock of
the input frequency.
Input frequency range: 6MHz to 70 MHz.
Internal loop filter minimizes external components
and board space.
Spread option: Center Spread.
2 spread frequency deviation selections:
o ±0.625% or ±1.875%
Low inherent cycle-to-cycle jitter.
3.3V operating voltage range.
Low power CMOS design.
Supports notebook VGA and other LCD timing
controller applications.
Product available for industrial temperature range.
Available in 8-pin SOIC and TSSOP.
Product Description
The ASM3P2184A is a versatile spread spectrum
frequency modulators designed specifically for a wide
range of input clock frequencies from 6MHz to 70MHz.
(Refer Input Frequency and Modulation Rate Table). The
ASM3P2184A can generate an EMI reduced clock from
an OSC or a system generated clock. The
ASM3P2184A offers a Center Spread clock with 2
percentage deviations; ±0.625% and ±1.675%.
The ASM3P2184A reduces electromagnetic interference
(EMI) at the clock source, allowing system wide reduction
of EMI of down stream clock and data dependent
signals. The ASM3P2184A allows significant system cost
savings by reducing the number of circuit board layers
ferrite beads, shielding and other passive components
that are traditionally required to pass EMI regulations.
The ASM3P2184A uses the most efficient and optimized
modulation profile approved by the FCC and is
implemented in a proprietary all digital method.
The ASM3P2184A modulates the output of a single PLL
in order to “spread” the bandwidth of a synthesized clock,
and more importantly, decreases the peak amplitudes of
its harmonics. This results in significantly lower system
EMI compared to the typical narrow band signal produced
by oscillators and most frequency generators. Lowering
EMI by increasing a signal’s bandwidth is called ‘spread
spectrum clock generation’.
Applications
The ASM3P2184A is targeted towards EMI management
for memory and LVDS interfaces in mobile graphic
chipsets and high-speed digital applications such as PC
peripheral devices, consumer electronics, and embedded
controller systems.
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1
2
3
4 5
6
7
8
XIN
XOUT
GND
SS% ModOUT
VDD
FS0
FS1
ASM3P2184A
Block Diagram
Pin Configuration
VSS
XIN Crystal
Oscillator
Frequency
Divider
Feedback
Divider
Modulation
Phase
Detector Loop
Filter VCO Output
Divider
MODOUT
PLL
VDD
SS%
FS0 FS1
XOUT
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Pin Description
Pin# Pin Name Type Description
1 XIN I
Crystal connection or external frequency input. This pin has dual functions.
It can be connected to either an external crystal or an external reference
clock.
2 XOUT I
Crystal connection. Input connection for an external crystal. If using an
external reference, this pin must be left unconnected.
3 GND P Ground to entire chip.
4 SS% I
Spread range select. Digital logic input used to select frequency deviation
(Refer Spread Deviation S election Table). This pin has an internal pull-up
resistor.
5 ModOUT O Spread spectrum low EMI output.
6 VDD P Power supply for the entire chip (3.3V).
7 FS0 I
Frequency range select. Digital logic input used to select frequency range
(Refer Input Frequency and Modulation Rate Table). This pin has an internal
pull-up resistor.
8 FS1 I
Frequency range select. Digital logic input used to select frequency range
(Refer Input Frequency and Modulation Rate Table). This pin has an internal
pull-up resistor.
Input Frequency and Modulation Rate Table
FS1 (pin 8) FS0 (pin 7) Frequency Range
0 0 6 MHz to 13 MHz
0 1 12 MHz to 25 MHz
1 0 18 MHz to 35 MHz
1 1 40 MHz to 70 MHz
Spread Deviation Selection Table
Part Number SS% (pin 4) Spread Deviation (%)
0 ± 0.625
ASM3P2184A
1 ± 1.875
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Absolute Maximum Ratings
Symbol Parameter Rating Unit
VDD, VIN Voltage on any pin with respect to GND -0.5 to + 7.0 V
TSTG Storage temperature -65 to +125 °C
TA Operating temperature 0 to 70 °C
Note: These are stress ratings only and functional operation is not implied. Exposure to absolute maximum
ratings for extended periods may affect device reliability.
DC Electrical Characteris tics
Symbol Parameter Min Typ Max Unit
VIL Input low voltage GND – 0.3 - 0.8 V
VIH Input high voltage 2.0 - VDD + 0.3 V
IIL Input low current - - -35 µA
IIH Input high current - - 35 µA
IXOL XOUT Output low current
(@ 0.4V, VDD = 3.3V) - TBD - mA
IXOH XOUT Output high current
(@ 2.5V, VDD = 3.3V) - TBD - mA
VOL Output low voltage (VDD = 3.3V, IOL = 20mA) - - 0.4 V
VOH Output high voltage (VDD = 3.3V, IOH = 20mA) 2.5 - - V
ICC Dynamic supply current
Normal mode (3.3V and 10pF loading) 8.46 12 17.78 mA
IDD Static supply current
Standby mode 0.6 mA
VDD Operating voltage 2.7 3.3 3.7 V
tON Power up time (first locked clock cycle after power up) - 0.18 - mS
ZOUT Clock out impedance - 50 -
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AC Electrical Characteris tics
Symbol Parameter Min Typ Max Unit
XIN Input frequency 6 - 70 MHz
ModOUT Output frequency 6 - 70 MHz
tLH* Output rise time (measured at 0.8V to 2.0V) 0.7 0.9 1.1 ns
tHL* Output fall time (measured at 2.0V to 0.8V) 0.6 0.8 1.0 ns
tJC Jitter (cycle to cycle) - - 200 ps
TD Output duty cycle 45 50 55 %
tLH and tHL are measured into a capacitive load of 15pF
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D
EH
D
A1
A2
A
θ
L
C
B
e
Package Information
8-Pin SOIC
Symbol Dimensions in inches Dimensions in millimeters
Min Max Min Max
A 0.057 0.071 1.45 1.80
A1 0.004 0.010 0.10 0.25
A2 0.053 0.069 1.35 1.75
B 0.012 0.020 0.31 0.51
C 0.004 0.01 0.10 0.25
D 0.186 0.202 4.72 5.12
E 0.148 0.164 3.75 4.15
e 0.050 BSC 1.27 BSC
H 0.224 0.248 5.70 6.30
L 0.012 0.028 0.30 0.70
0° 8° 0°
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E
H
A
A1
A2
D
B
C
L
θ
e
8-Pin TSSOP
Dimensions in inches Dimensions in millimeters
Symbol Min Max Min Max
A 0.047 1.10
A1 0.002 0.006 0.05 0.15
A2 0.031 0.041 0.80 1.05
B 0.007 0.012 0.19 0.30
C 0.004 0.008 0.09 0.20
D 0.114 0.122 2.90 3.10
E 0.169 0.177 4.30 4.50
e 0.026 BSC 0.65 BSC
H 0.244 0.260 6.20 6.60
L 0.018 0.030 0.45 0.75
θ
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Ordering Information
Ordering Code Package Name Package Type
ASM3P2184A-08ST 8-Pin SOIC Tube
ASM3P2184A-08SR 8-Pin SOIC Tape and Reel
ASM3P2184A-08TT 8-Pin TSSOP Tube
ASM3P2184A-08TR 8-Pin TSSOP Tape and Reel
ASM3P2184A-08-TR
OR - SOT23/T/R ST – SOIC, TUBE
TT – TSSOP, TUBE SR - SOIC, T/R
TR – TSSOP, T/R QR – QFN, T/R
QT - QFN, TUBE VT – TVSOP, TUBE
BT - BGA, TUBE VR – TVSOP, T/R
BR – BGA, T/R JR – SSOP, T/R
JT - SSOP, TUBE
PIN COUNT
X = Automotive I = Industrial P or n/c = Commercial
1 – reserved 6 – power management
2 - Non PLL based 7 – power management
3 – EMI Reduction 8 – power management
4 – DDR support products 9 – Hi performance
5
STD Zero Dela
y
Buffe
r
0 - reserved
Alliance Semiconductor Mixed Signal Product
PART NUMBER
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Notice: The information in this document is subject to change without notice.
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are
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Alliance Semiconductor Corporation
2595, Augustine Drive,
Santa Clara, CA 95054
Tel# 408-855-4900
Fax: 408-855-4999
www.alsc.com
Copyright © Alliance Semiconductor
All Rights Reserved
Preliminary Information
Part Number: ASM3P2184A
Document Version: v1.0