GP2S60
GP2S60
■ Absolute Maximum Ratings
■ Outline Dimensions (Unit : mm)
Detector center
Emitter center
(0.7)
(0.65)
1.7
1.1
0.4
(0.57)(0.57)
2−0.65
(0.63)
(0.7)
2.7
3.2
(1.8)
2−1
(0.55)
1
1
4
2
3
3
2
4
3
1
4
2
Anode
Collector
Emitter
Cathode
Plating area
Pattern wiring is not allowed on portion not to cause
short-circuit.
Internal connection diagram
❈ Unspecified tolerance : ±0.15mm
❈( ) : Reference dimensions
❈ Tolerance : ±0.1mm
2−12−1.7
Recommended pattern
2−0.65
2−0.45
Parameter Symbol Rating Unit
Input
Forward current 50 mA
6V
Output
75
75
mW
mW
100 mW
35
6
V
V
20 mA
−25 to +85 ˚C
Storage temperature −40 to +100 ˚C
260 ˚C
Operating temperature
Reverse voltage
Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Collector current
Collector power dissipation
IF
VR
PD
VCEO
VECO
IC
PC
Tstg
Topr
Ptot
(Ta=25˚C)
Soldering temperature Tsol
*
*For MAX. 5s
Total power dissipation
1. Audio equipment
2. VCR
3. Camcoders
4. Printers
5. CD-ROM drives
■ Features
■ Applications
Subminiature, Reflective Type
Photointerrupter for Automatic
Mounting
1. Subminiature, leadless type. (Dimensions : 3.2×1.7×1.1mm)
2. Soldering reflow.
(Peak temperature : 240˚C, 10s or less)
3. Taped model. (2 000 pcs/reel)
4. Visible light cut-off type.
Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet Internet address for Electronic Components Group http://sharp-world.com/ecg/
GP2S60
■ Electro-optical Characteristics
Parameter Symbol Unit
Input Forward voltage VFV
VR=6V µA
nA
IR
ICEO nA
µA
Reverse current
Collector dark current
Collector current
Leak current
Output
IC
ILEAK
µs
µs
IF=20mA
VCE=20V
VCE=2V, IF=4mA
VCE=2V, IF=4mA
MIN.
−
−
−
−
−
−
10
100
130
500
MAX.
100
100
1.4
Conditions
VCE=2V, IC=100µA
RL=1 000Ω, d=1mm
TYP.
−
85
−
40
−
20
20
1.2
1
(Ta=25˚C)
Rise time tr
Fall time tf
Transfer
charac-
teristics
Response time
*1
*2
*1 Refer to Fig.11
*2 No Reflective object
■ Rank Table
Model No. Ic(µA) ConditionsRank mark
GP2S60A
GP2S60
GP2S60B
A
A or B
40 to 80
40 to 130
65 to 130B
IF=4mA
VCE=2V
Ta=25˚C
Fig.2 Power Dissipation vs. Ambient
Temperature
Forward current IF (mA)
0
10
20
30
40
50
60
−25 0 1007550 8525
Ambient temperature Ta (°C)
Fig.1 Forward Current vs. Ambient
Temperature
Power dissipation P (mW)
Ambient temperature Ta (°C)
0
20
40
60
80
100
120
Ptot
−25 0 1007550 8525
P,PC
GP2S60
Fig.5 Collector Current vs. Collector-
emitter Voltage
Fig.7 Collector Dark Current vs.
Ambient Temperature
Fig.6 Relative Collector Current vs.
Ambient Temperature
Fig.3 Forward Current vs. Forward
Voltage
Fig.4 Collector Current vs. Forward
Current
Forward current IF (mA)
500
200
100
50
20
10
5
2
0 0.5 1 1.5 2 2.5 3
Forward voltage VF (V)
Ta=75°C
50°C
25°C
0°C
−25°C
10
100
200
300
400
500
600
700
0 5 10 15 20
Forward current IF (mA)
Collector current IC (µA)
VCE=2V
Ta=25°C
−25
VCE=2V
IF=4mA
0
20
40
60
80
100
120
0 255075
Relative collector current (%)
Ambient temperature Ta (°C)
Collector current IC (µA)
0
100
200
300
400
500
600
0246810
Collector-emitter voltage VCE (V)
IF=15mA
10mA
7mA
4mA
2mA
Ta=25°C
Collector dark current ICEO (A)
10−10
10−6
10−7
2
5
2
5
2
5
2
5
10−8
10−9
0 255075100
Ambient temperature Ta (°C)
VCE=20V
GP2S60
Fig.9 Test Circuit For Response Time
Fig.10
Relative Collector Current vs. Distance Between
Sensor and Aluminum Evaporation Glass
Fig.11 Measuring Configulation of Collector
Current
Fig.12 Spectral Sensitivity
L
Al evaporation glass
10
20
30
40
50
60
70
80
90
100
1 4.523453.52.51.50.5
VCE=2V
IF=4mA
Ta=25˚C
Relative collector current (%)
Distance between sensor and Aluminum evaporation glass L (mm)
Relative sensitivity (%)
0
100
80
60
40
20
600 700 800 900 1000 1100 1200
Wavelength λ (nm)
Ta=25°C
10%
Input
Output
Input Output
90%
ts
td
VCC
RD
RL
tf
tr
d=1mm
glass plate
Aluminum evaporation glass
Fig.8
Response Time vs. Load
Resistance
Response time (µs)
1
10
100
1000
0.1 1 100010 100
Load resistance RL (kΩ)
VCE=2V
IC=100µA
Ta=25°C
tf
ts
td
tr
GP2S60
Fig.13 Relative Collector Current vs.OMS
Card Moving Distance
Fig.14 Relative
Collector Current
vs.OMS
Card Moving Distance
20
40
60
80
100
6420351−3−1−2
Relative collector current (%)
OMS card moving distance (mm)
VCE=2V
IF=4mA
d=1mm
1mm
d
0
OMS test card
Sensor +−
Fig.15 Reflow Soldering
Max.120s
Max.90s
Max.60s
Max.10s
Max. 165°C
Only one time soldering is available within the temperature profile
shown below.
200°C
25°C
Max. 240°C
1 to 4˚C/s
1 to 4˚C/s
1 to 4˚C/s
Sensor
20
40
60
80
100
6420351−3−1−2
Relative collector current (%)
OMS card moving distance (mm)
VCE=2V
IF=4mA
d=1mm
1mm
d
0
OMS test card
+−
■ Other Precautions
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package
temperature within that specified in Item 1. Also avoid immersing the resin part in the solder. Even if within the temperature
profile above, there is the possibility that the gold wire in package is broken in case that the deformation of PCW gives the
affection to lead pins. Please use after confirmation the conditions fully by actual solder reflow machine.
NOTICE
●The circuit application examples in this publication are provided to explain representative applications of SHARP
devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes
no responsibility for any problems related to any intellectual property right of a third party resulting from the use of
SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP
reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents
described herein at any time without notice in order to improve design or reliability. Manufacturing locations are
also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage
caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used
specified in the relevant specification sheet nor meet the following conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when
SHARP devices are used for or in connection with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of
reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications
other than those recommended by SHARP or when it is unclear which category mentioned above controls the
intended use.
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign
Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright
laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written
permission is also required before any use of this publication may be made by a third party.
●Contact and consult with a SHARP representative if there are any questions about the contents of this publication.
