TECHNICAL DATA SHEET
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LDS-0160 Rev. 1 (100435) Page 3 of 3
PACKAGE DIMENSIONS
NOTE: Dimensions
1. Dimensions are in inches. Ltr Inches Millimeters
2. Millimeters are given for general information only. Min Max Min Max
3. In accordance with ASME Y14.5M, diameters are equivalent to
x BD .094 .105 2.39 2.67
symbology. BL .189 .205 4.80 5.21
ECT .016 .022 0.41 0.55
S .001 min 0.03 min
FIGURE 1. Physical dimensions (DO-213A B).
DESIGN DATA
CASE: DO-213AB, Hermetically sealed glass case. (MELF, LL41).
LEAD FINISH: Tin / Lead
THERMAL RESISTANCE: (RθJEC): 50°C/W maximum at L = 0 i nch
THERMAL IMPEDANCE: (ZθJX): 25 °C/W max imum
POLARITY: Diode to be operated with the banded (Cathode) end negative.
MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) of this device is approximately +6PPM/°C.
The COE of the Mounting Surface System should be selected to provide A suitable match with this device.
DO-213AB