cExpress-HL COM Express(R) Compact Size Type 6 Module with Intel(R) CoreTM i7/i5/i3 Processor Features 4th Generation Intel(R) CoreTM i7/i5/i3 Processor SoC Up to 16 GB DDR3L SDRAM at 1600MHz Two DDI channels, one LVDS supporting 3 independent displays Four PCIe x1 or 1 PCIe x4 GbE, four SATA 6 Gb/s, two USB 3.0, six USB 2.0 Supports Smart Embedded Management Agent (SEMA(R)) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System CPU 4th Generation Intel(R) CoreTM Processors (Mobile) - 22nm (formerly codename "Haswell-ULT") CoreTM i7-4650U 1.7 GHz (3.3 GHz Turbo), 15W (2C/GT3) CoreTM i5-4300U 1.9 GHz (2.9 GHz Turbo), 15W (2C/GT2) CoreTM i3-4010U 1.7 GHz (no Turbo) 3MB, 15W (2C/GT2) Celeron(R) 2980U 1.6 GHz (no Turbo) 15W (2C/GT1) Supports : Intel(R) VT, Intel(R) TXT, Intel(R) SSE4.2, Intel(R) HT Technology, Intel(R) 64 Architecture, Execute Disable Bit, Intel(R) Turbo Boost Technology 2.0, Intel(R) AVX2, Intel(R) AES-NI, PCLMULQDQ Instruction, Intel(R) Secure Key and Intel(R) TSX Note: Availability of the features may vary between processor SKUs. Memory Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 16GB in dual SODIMM socket Embedded BIOS Video GPU Feature Support Generation 7.5 graphics core architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/ HDMI/ LVDS monitors Encode/transcode HD content LVDS Single/dual channel 18/24-bit LVDS from eDP (two lanes) Digital Display Interface DDI1 supporting DisplayPort / HDMI / DVI DDI2 supporting DisplayPort / HDMI / DVI Audio Chipset Intel(R) HD Audio integrated in SoC AMI EFI with CMOS backup in 8MB SPI BIOS with Intel(R) AMT 9.0 support Audio Codec L3 Cache Located on carrier Express-BASE6 (ALC886 standard supported) 4MB for i7-4650U, 3MB for i5-4300U and i3-4010U; 2MB for 2980U Expansion Busses 4 PCI Express x1: lanes 0/1/2/3 LPC bus, SMBus (system), I2C (user) SEMA Board Controller Supports : Voltage/Current monitoring, Power sequence debug support, AT/ ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2C, Failsafe BIOS (dual BIOS ), Watchdog Timer and Fan Control Debug Headers 40-pin multipurpose flat cable connector Use in combination with DB-40 debug module Providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/Chipset Ethernet Intel(R) MAC/PHY: i218LM (Enterprise SKU) with AMT 9.0 support Interface: 10/100/1000 GbE connection I/O Interfaces USB: 2x USB 3.0 (USB 0,1) and 6x USB 2.0 (USB2,3,4,5,6,7) SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) Serial: 2 UART ports COM1/2 with console redirection GPIO: 4 GPO and 4 GPI with interrupt Super I/O On carrier if needed (standard support for W83627DHG-P) TPM Chipset: Atmel AT97SC3204 Type: TPM 1.2 Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times. Specifications Power Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5% Wide Input: ATX = 5~20 V / 5Vsb 5% or AT = 5~20V Management: ACPI 4.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving Operating Systems Standard Support Windows 7/8 32/64-bit, Linux 32/64-bit Extended Support (BSP) WES7/8, Linux , VxWorks Mechanical and Environmental Form Factor: PICMG COM.0: Rev 2.1 Type 6 Dimension: Compact size: 95 mm x 95 mm Operating Temperature Standard: 0C to +60C Extreme RuggedTM: -40C to +85C (build option) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times. Functional Diagram SODIMM 2 1333/1600 MHz 1~8 GB DDR3L XDP 60-pin SODIMM 2 1333/1600 MHz 1~8 GB DDR3L DDI 0 (port B) DP / HDMI / DVI eDP - LVDS RTD2136R/N single / dual 18-24-bit LVDS eDP 2 lane 4th Generation Intel(R) CoreTM i7/i5/i3 Processor 4x PCIe x1 (Gen2) (port 0~3) GbE i218LM DDI 1 (port C) DP / HDMI / DVI 2x USB 3.0 (port 0/1) PCIe x1 (port 4) SoC "Haswell - ULT" 4x SATA3 (port 0/1/2/3) 6x USB 2.0 (port 2~7) HD Audio UART0 UART1 Serial NCT5104D TPM Atmel AT97SC3204 LPC bus 4x GP0 4x GPI SPI 0 BIOS GPIO PCA9535 SPI_CS0 SPI_CS1 SMBus GP I2C DDC I2C SPI_CS# SPI SEMA BMC SPI 1 BIOS LM73 Ordering Information Accessories cExpress-HL-i7-4650U COM Express(R) Compact Size Type 6 Module with Intel(R) CoreTM i7-4650U at 1.7 GHz with GT3 level graphics cExpress-HL-i5-4300U COM Express(R) Compact Size Type 6 Module with Intel(R) CoreTM i5-4300U at 1.9 GHz with GT2 level graphics cExpress-HL-i3-4010U COM Express(R) Compact Size Type 6 Module with Intel(R) CoreTM i3-4010U at 1.7 GHz with GT2 level graphics cExpress-HL-2980U COM Express(R) Compact Size Type 6 Module with Intel(R) Celeron(R) 2980u with 1.6GHz ULV 15W 2+1F and HD graphics Starter Kit Heat Spreaders HTS-cHL-BT Heatspreader for cExpress-HL with through hole standoffs for top mounting Passive Heatsinks COM Express Type 6 Starter Kit Plus COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit HTS-cHL-B Heatspreader for cExpress-HL with threaded standoffs for bottom mounting THS-cHL-B Low profile heatsink for cExpress-HL with threaded standoffs for bottom mounting THS-cHL-BT Low profile heatsink for cExpress-HL with through hole standoffs for top mounting THSH-cHL-B High profile heatsink for cExpress-HL with threaded standoffs for bottom mounting Active Heatsink THSF-cHL-B High profile heatsink with Fan for cExpress-HL with threaded standoffs for bottom mounting www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Mar. 01, 2017. (c)2017 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ADLINK Technology: THS-cHL-B cExpress-HL-i3-4010U HTS-cHL-BT cExpress-HL-i7-4650U cExpress-HL-2980U THSF-cHL-B THScHL-BT cExpress-HL-i5-4300U HTS-cHL-B THSH-cHL-B t2cExpress-HL-i3-4010U t2cExpress-HL-2980U t2cExpress-HL-i5-4300U t2cExpress-HL-i7-4650U