CMOS INTEGRATED CIRCUIT PD5738T6N D WIDE BAND DPDT SWITCH DESCRIPTION The PD5738T6N is a CMOS MMIC DPDT (Double Pole Double Throw) switch which is developed for mobile UE communications, wireless communications and another RF switching applications. This device can operate within frequency from 0.01 to 2.5 GHz, having low insertion loss and high isolation performances. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6N) package, which allows high-density surface mounting. FEATURES * Supply voltage * Switch control voltage * * * * O NT IN * : VDD = 1.5 to 3.6 V (2.8 V TYP.) : Vcont (H) = 1.5 to 3.6 V (2.8 V TYP.) : Vcont (L) = 0.2 to +0.4 V (0 V TYP.) Low insertion loss Note : Lins1 = 0.5 dB TYP. @ f = 0.01 to 0.05 GHz : Lins2 = 0.8 dB TYP. @ f = 0.05 to 1.0 GHz : Lins3 = 1.4 dB TYP. @ f = 1.0 to 2.0 GHz : Lins4 = 1.6 dB TYP. @ f = 2.0 to 2.5 GHz High isolation Note : ISL1 = 45 dB TYP. @ f = 0.01 to 0.05 GHz : ISL2 = 22 dB TYP. @ f = 0.05 to 1.0 GHz : ISL3 = 16 dB TYP. @ f = 1.0 to 2.0 GHz : ISL4 = 15 dB TYP. @ f = 2.0 to 2.5 GHz Handling power Note : Pin (1 dB) = +20 dBm TYP. @ f = 1.0 GHz : Pin (0.1 dB) = +15 dBm TYP. @ f = 1.0 GHz High-density surface mounting : 6-pin plastic TSON (T6N) package (1.5 1.5 0.37 mm) High ESD voltage : machine-model 200 V (TYP.), human-body-model 3 kV (TYP.) Note TA = 25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V APPLICATIONS SC * Mobile communications * Wireless communications * Another RF switching applications ORDERING INFORMATION Part Number PD5738T6N-E2 Order Number PD5738T6N-E2-A Package 6-pin plastic TSON C3X Supplying Form Embossed tape 8 mm wide Pin 1, 6 face the perforation side of the tape Qty 3 kpcs/reel DI (T6N) (Pb-Free) Marking Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: PD5738T6N-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PU10750EJ01V0DS (1st edition) Date Published February 2009 NS PD5738T6N PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin Name 1 INPUT1 2 Vcont 3 OUTPUT1 4 INPUT2 5 VDD 6 OUTPUT2 UE D Pin No. Remark Exposed pad : GND TRUTH TABLE Vcont INPUT1OUTPUT1, INPUT2OUTPUT2 INPUT1OUTPUT2, INPUT2OUTPUT1 Low ON OFF High OFF O NT IN ON Remark High: +2.8 V, Low: 0 V ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified) Parameter Symbol Ratings Unit VDD 0.5 to +4.6 V Vcont 0.5 to +4.6 V Vcont (H) +0.5 V Pin +23 dBm Operating Ambient Temperature TA 45 to +85 C Storage Temperature Tstg 55 to +150 C Supply Voltage Switch Control Voltage Voltage Difference VDD Input Power SC RECOMMENDED OPERATING RANGE (T A = +25C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit VDD +1.5 +2.8 +3.6 V Switch Control Voltage (H) Vcont (H) +1.5 +2.8 +3.6 V Switch Control Voltage (L) Vcont (L) 0.2 0 +0.4 V Supply Voltage DI Remark VDD 0.4 V Vcont (H) VDD + 0.2 V 2 Data Sheet PU10750EJ01V0DS PD5738T6N ELECTRICAL CHARACTERISTICS (T A = +25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, Z0 = 50 , DC blocking capacitors = 10 000 pF, unless otherwise specified) Symbol Test Conditions MIN. Insertion Loss 1 Lins1 f = 0.01 to 0.05 GHz Insertion Loss 2 Lins2 f = 0.05 to 1.0 GHz Insertion Loss 3 Lins3 f = 1.0 to 2.0 GHz Insertion Loss 4 Lins4 f = 2.0 to 2.5 GHz Isolation 1 ISL1 f = 0.01 to 0.05 GHz Isolation 2 ISL2 f = 0.05 to 1.0 GHz Isolation 3 ISL3 f = 1.0 to 2.0 GHz Isolation 4 ISL4 f = 2.0 to 2.5 GHz Return Loss 1 RL1 f = 0.01 to 1.0 GHz Return Loss 2 RL2 f = 1.0 to 2.5 GHz TYP. MAX. Unit D Parameter 0.9 dB 0.8 1.2 dB 1.4 1.8 dB 1.6 2.0 dB 35 45 dB 18 22 dB 13 16 dB 12 15 dB 13 18 dB 8 12 dB +10 +15 dBm f = 1.0 GHz +20 dBm IDD VDD = Vcont = 2.8 V, RF off 0.01 1 A Switch Control Current Icont VDD = Vcont = 2.8 V, RF off 0.01 1 A Switch Control Speed tSW f = 1.0 GHz 0.4 1 s O NT IN 0.1 dB Loss Compression Input Power Note 1 1 dB Loss Compression Input Power Note 2 Supply Current UE 0.5 Pin (0.1 dB) f = 1.0 GHz Pin (1 dB) Notes 1. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 2. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Please do not supply any DC bias to the terminals SC Caution DC blocking capacitors are necessary. (INPUT1, INPUT2, OUTPUT1, OUTPUT2). The value of DC blocking capacitors should be chosen to accommodate the frequency of DI operation, bandwidth, switching speed and the condition with actual board of your system. Data Sheet PU10750EJ01V0DS 3 PD5738T6N UE D EVALUATION CIRCUIT O NT IN Caution This IC has pull down resistances inside between each RF line and GND line, which bias each RF pin internally to GND, then the IC cannot be used for DC switching. DI SC The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PU10750EJ01V0DS PD5738T6N O NT IN UE D ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD USING THE EVALUATION BOARD Symbol 1 0000 pF SC C1 Values 1 000 pF DI C2 Data Sheet PU10750EJ01V0DS 5 PD5738T6N DI SC O NT IN UE D TYPICAL CHARACTERISTICS (T A = +25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, Z0 = 50 , DC blocking capacitors = 10 000 pF, unless otherwise specified) Remark The graphs indicate nominal characteristics. 6 Data Sheet PU10750EJ01V0DS DI SC O NT IN UE D PD5738T6N Remark The graphs indicate nominal characteristics. Data Sheet PU10750EJ01V0DS 7 PD5738T6N MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS SC O NT IN UE D 6-PIN PLASTIC TSON (UNIT: mm) Remark The mounting pad and solder mask layouts in this document are for reference only. DI When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. 8 Data Sheet PU10750EJ01V0DS PD5738T6N PACKAGE DIMENSIONS DI SC O NT IN UE D 6-PIN PLASTIC TSON (T6N) (UNIT: mm) Data Sheet PU10750EJ01V0DS 9 PD5738T6N RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Partial Heating Condition Symbol : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 3 seconds or less : 0.2%(Wt.) or below DI SC O NT IN Caution Do not use different soldering methods together (except for partial heating). 10 IR260 D Peak temperature (package surface temperature) UE Infrared Reflow Soldering Conditions Data Sheet PU10750EJ01V0DS HS350 NOTICE 5. 6. 7. 8. 9. 10. 11. 12. D UE 4. IN 3. NT 2. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. 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