Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
WIDE BAND DPDT SWITCH
CMOS INTEGRATED CIRCUIT
PD5738T6N
Document No. PU10750EJ01V0DS (1st edition)
Date Published February 2009 NS
DESCRIPTION
The
PD5738T6N is a CMOS MMIC DPDT (Double Pole Double Throw) switch which is developed for mobile
communications, wireless communications and another RF switching applications.
This device can operate within frequency from 0.01 to 2.5 GHz, having low insertion loss and high isolation
performances. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6N) package,
which allows high-density surface mounting.
FEATURES
•Supply voltage : VDD = 1.5 to 3.6 V (2.8 V TYP.)
•Switch control voltage : Vcont (H) = 1.5 to 3.6 V (2.8 V TYP.)
: Vcont (L) = 0.2 to +0.4 V (0 V TYP.)
•Low insertion loss Note : Lins1 = 0.5 dB TYP. @ f = 0.01 to 0.05 GHz
: Lins2 = 0.8 dB TYP. @ f = 0.05 to 1.0 GHz
: Lins3 = 1.4 dB TYP. @ f = 1.0 to 2.0 GHz
: Lins4 = 1.6 dB TYP. @ f = 2.0 to 2.5 GHz
•High isolation Note : ISL1 = 45 dB TYP. @ f = 0.01 to 0.05 GHz
: ISL2 = 22 dB TYP. @ f = 0.05 to 1.0 GHz
: ISL3 = 16 dB TYP. @ f = 1.0 to 2.0 GHz
: ISL4 = 15 dB TYP. @ f = 2.0 to 2.5 GHz
•Handling power Note : Pin (1 dB) = +20 dBm TYP. @ f = 1.0 GHz
: Pin (0.1 dB) = +15 dBm TYP. @ f = 1.0 GHz
•High-density surface mounting : 6-pin plastic TSON (T6N) package (1.5 1.5 0.37 mm)
•High ESD voltage : machine-model 200 V (TYP.), human-body-model 3 kV (TYP.)
Note TA = 25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
APPLICATIONS
•Mobile communications
•Wireless communications
•Another RF switching applications
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
Supplying Form
PD5738T6N-E2
PD5738T6N-E2-A
6-pin plastic TSON
(T6N) (Pb-Free)
C3X
Embossed tape 8 mm wide
Pin 1, 6 face the perforation side of the tape
Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order:
PD5738T6N-A
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Data Sheet PU10750EJ01V0DS
PD5738T6N
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Remark Exposed pad : GND
TRUTH TABLE
Vcont
INPUT1OUTPUT1, INPUT2OUTPUT2
INPUT1OUTPUT2, INPUT2OUTPUT1
Low
ON
OFF
High
OFF
ON
Remark High: +2.8 V, Low: 0 V
ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Supply Voltage
VDD
0.5 to +4.6
V
Switch Control Voltage
Vcont
0.5 to +4.6
V
Voltage Difference
Vcont (H)
VDD
+0.5
V
Input Power
Pin
+23
dBm
Operating Ambient Temperature
TA
45 to +85
C
Storage Temperature
Tstg
55 to +150
C
RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VDD
+1.5
+2.8
+3.6
V
Switch Control Voltage (H)
Vcont (H)
+1.5
+2.8
+3.6
V
Switch Control Voltage (L)
Vcont (L)
0.2
0
+0.4
V
Remark VDD 0.4 V Vcont (H) VDD + 0.2 V
Pin No.
Pin Name
1
INPUT1
2
Vcont
3
OUTPUT1
4
INPUT2
5
VDD
6
OUTPUT2
DISCONTINUED
Data Sheet PU10750EJ01V0DS
3
PD5738T6N
ELECTRICAL CHARACTERISTICS
(TA = +25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, Z0 = 50 , DC blocking
capacitors
= 10 000 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
Lins1
f = 0.01 to 0.05 GHz
0.5
0.9
dB
Insertion Loss 2
Lins2
f = 0.05 to 1.0 GHz
0.8
1.2
dB
Insertion Loss 3
Lins3
f = 1.0 to 2.0 GHz
1.4
1.8
dB
Insertion Loss 4
Lins4
f = 2.0 to 2.5 GHz
1.6
2.0
dB
Isolation 1
ISL1
f = 0.01 to 0.05 GHz
35
45
dB
Isolation 2
ISL2
f = 0.05 to 1.0 GHz
18
22
dB
Isolation 3
ISL3
f = 1.0 to 2.0 GHz
13
16
dB
Isolation 4
ISL4
f = 2.0 to 2.5 GHz
12
15
dB
Return Loss 1
RL1
f = 0.01 to 1.0 GHz
13
18
dB
Return Loss 2
RL2
f = 1.0 to 2.5 GHz
8
12
dB
0.1 dB Loss Compression
Pin (0.1 dB)
f = 1.0 GHz
+10
+15
dBm
Input Power Note 1
1 dB Loss Compression
Pin (1 dB)
f = 1.0 GHz
+20
dBm
Input Power Note 2
Supply Current
IDD
VDD = Vcont = 2.8 V, RF off
0.01
1
A
Switch Control Current
Icont
VDD = Vcont = 2.8 V, RF off
0.01
1
A
Switch Control Speed
tSW
f = 1.0 GHz
0.4
1
s
Notes 1. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of
linear range.
2. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of
linear range.
Caution DC blocking capacitors are necessary. Please do not supply any DC bias to the terminals
(INPUT1, INPUT2, OUTPUT1, OUTPUT2).
The value of DC blocking capacitors should be chosen to accommodate the frequency of
operation, bandwidth, switching speed and the condition with actual board of your system.
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Data Sheet PU10750EJ01V0DS
PD5738T6N
EVALUATION CIRCUIT
Caution This IC has pull down resistances inside between each RF line and GND line, which bias each RF
pin internally to GND, then the IC cannot be used for DC switching.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
DISCONTINUED
Data Sheet PU10750EJ01V0DS
5
PD5738T6N
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
USING THE EVALUATION BOARD
Symbol
Values
C1
1 0000 pF
C2
1 000 pF
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Data Sheet PU10750EJ01V0DS
PD5738T6N
TYPICAL CHARACTERISTICS (TA = +25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm,
Z0 = 50 , DC blocking capacitors = 10 000 pF, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10750EJ01V0DS
7
PD5738T6N
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10750EJ01V0DS
PD5738T6N
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
Remark The mounting pad and solder mask layouts in this document are for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of
solder bridge and so on, in order to optimize the design.
DISCONTINUED
Data Sheet PU10750EJ01V0DS
9
PD5738T6N
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (T6N) (UNIT: mm)
DISCONTINUED
10 Data Sheet PU10750EJ01V0DS
PD5738T6N
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Partial Heating
Peak temperature (terminal temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
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