CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
REV.
0.1
SUBJECT
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE
PAGE
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PANASONIC’S CODE
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DATE
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Power Electronics R&D Center
Wireless Connectivity
Panasonic Industrial Devices Europe GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
Product Specification
Applicant / Manufacturer
Hardware
Panasonic Industrial Devices Europe GmbH
Zeppelinstrasse 19
21337 Lüneburg
Germany
Applicant / Manufacturer
Software
Refer to chapter 22 / 26.5 for information regarding software
versions
Software Version
Refer to chapter 22 / 26.5 for information regarding software
versions
By purchase of any of products described in this document the customer accepts the
document's validity and declares their agreement and understanding of its contents and
recommendations. Panasonic reserves the right to make changes as required without
notification.
CLASSIFICATION
PRODUCT SPECIFICATION
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REV.
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TABLE OF CONTENTS
1. Scope of this Document ................................................................................................ 4
2. History for this Document .............................................................................................. 4
3. Data Sheet Status ......................................................................................................... 4
4. Related Documents ....................................................................................................... 4
5. Key Features ................................................................................................................. 5
6. Applications for the Module ........................................................................................... 5
7. Wireless Local Area Network ........................................................................................ 5
8. Description for the Module ............................................................................................. 6
9. Detailed Description ...................................................................................................... 7
9.1. PAN9320 Terminal Layout ................................................................................... 7
9.2. Common Terminal Pin-Configuration ................................................................... 7
10. General Features .......................................................................................................... 9
11. HOST Interfaces ........................................................................................................... 9
11.1. UART0 Interface (Command) ............................................................................... 9
11.2. UART1 Interface (data) ........................................................................................ 9
12. Peripheral Bus Interface ................................................................................................ 9
13. WLAN Features ........................................................................................................... 10
13.1. IEEE 802.11 / Standards .................................................................................... 10
13.2. WLAN MAC ........................................................................................................ 10
13.3. WLAN Baseband ................................................................................................ 10
13.4. WLAN Radio ...................................................................................................... 11
13.5. WLAN Encryption ............................................................................................... 11
14. PAN9320 Block Diagram ............................................................................................. 12
15. Key Parts List .............................................................................................................. 12
16. Test Conditions ........................................................................................................... 12
17. General Requirements and Operation ......................................................................... 13
17.1. Absolute Maximum Ratings ................................................................................ 13
17.2. Recommended Operating Conditions ................................................................. 13
17.3. Digital Pin Characteristics .................................................................................. 13
17.4. Electrical characeristics ...................................................................................... 14
17.4.1. Current consumption ............................................................................. 14
17.5. Internal Operating Frequencies .......................................................................... 14
17.6. Coexistence Interface Specification.................................................................... 15
17.6.1. Marvell® 3/4-Wire Timing Data .............................................................. 15
17.6.2. WL_ACTIVE 2/3/4-Wire Timing Data .................................................... 16
17.7. Host Interface Specification ................................................................................ 17
17.7.1. UART0 Interface (Command) ................................................................ 17
17.7.2. UART1 Interface (Data) ........................................................................ 17
18. RF Electrical Characteristics ....................................................................................... 18
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PRODUCT SPECIFICATION
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18.1. WLAN Radio Specification ................................................................................. 18
18.2. WLAN RF Characteristics .................................................................................. 19
18.2.1. RF Characteristics for IEEE 802.11b ..................................................... 19
18.2.2. RF Characteristics for IEEE 802.11g ..................................................... 20
18.2.3. RF Characteristics for IEEE 802.11n (BW 20 MHz) ............................... 21
18.2.4. RF Characteristics for IEEE 802.11n (BW 40 MHz) ............................... 22
19. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 23
19.1. For lead solder ................................................................................................... 23
19.2. For leadfree solder ............................................................................................. 23
20. PAN9320 Module Dimension ...................................................................................... 24
21. PAN9320 FootPrint of the Module ............................................................................... 25
22. Case Marking (Example for PAN9320) ........................................................................ 26
23. Mechanical Requirements ........................................................................................... 27
24. Reliability Tests ........................................................................................................... 27
25. Cautions ...................................................................................................................... 27
25.1. Design Notes ..................................................................................................... 27
25.2. Installation Notes ................................................................................................ 28
25.3. Usage Conditions Notes ..................................................................................... 28
25.4. Storage Notes .................................................................................................... 28
25.5. Safety Cautions .................................................................................................. 29
25.6. Other cautions .................................................................................................... 29
26. Packaging ................................................................................................................... 30
26.1. PAN9320 Tape Dimension ................................................................................. 30
26.2. Packing in Tape ................................................................................................. 30
26.3. Component Direction ......................................................................................... 31
26.4. Reel Dimension .................................................................................................. 31
26.5. Label for Package .............................................................................................. 32
26.6. Total Package .................................................................................................... 32
27. Ordering Information ................................................................................................... 33
28. RoHS Declaration ....................................................................................................... 33
29. Regulatory Information ................................................................................................ 34
29.1. FCC for US ........................................................................................................ 34
29.2. Industry Canada Certification ............................................................................. 34
29.3. European R&TTE Declaration of Conformity ...................................................... 34
30. General Information ..................................................................................................... 35
31. Life Support Policy ...................................................................................................... 35
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
REV.
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1. SCOPE OF THIS DOCUMENT
This product specification applies to Panasonic’s Wi-Fi IEEE 802.11 b/g/n full embedded module with series
name PAN9320.
2. HISTORY FOR THIS DOCUMENT
Revision
Date
Modification / Remarks
0.1
22.04.2015
1st preliminary version
3. DATA SHEET STATUS
This data sheet contains the PRELIMINARY specification. Supplementary data will be published at a later
date.
Panasonic reserves the right to make changes at any time without notice.
Consult the most recently issued data sheet before initiating or completing a design.
4. RELATED DOCUMENTS
Search these homepages for documentation updates.
[1] PAN9320 Software-Guide
http://pideu.panasonic.de/produkte/Funkmodule.html
[2] Semiconductor Datasheet
88MC200 from Marvell®
88W8782 from Marvell®
[3] Application Note Land Grid Array
http://www.pideu.panasonic.de/pdf/184ext.pdf
[4] REACH and RoHS Certificate
http://pideu.panasonic.de/files/Documents/WM_Documents/PAN9320/WM-
REACH_and_RoHS_directive.pdf
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PRODUCT SPECIFICATION
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5. KEY FEATURES
Surface Mount Type 29.0 x 13.5 x 2.6 mm³
Wireless Local Area Network (WLAN) module with integrated MCU and Radio (SoC)
Operating in the 2.4GHz ISM band
Supports IEEE 802.11
IEEE 802.11b/g payload data rates
IEEE 802.11n high throughput data rates
IEEE 802.11i security standards WEP, TKIP, AES-CCMP and AES-CMAC
IEEE 802.11e Quality of Service (QoS)
Coexistence Interface for external co-located 2.4GHz radios (e.g. Bluetooth)
Tx power up to +18 dBm (IEEE 802.11b)
High Rx sensitivity
-98dBm (IEEE 802.11b DSSS 1Mbps)
-76dBm (IEEE 802.11g OFDM 54Mbps)
-74dBm (IEEE 802.11n MCS7 HT20 65Mbps)
-71dBm (IEEE 802.11n MCS7 HT40 135Mbps)
Marvell® 88W8782 WLAN System-on-Chip (SoC) and 88MC200 (MCU) inside
Integrated flash for customer web contents and configuration file 1,5MByte (extentable)
High performance low power CPU core
Internal crystal oscillators for Radio (40MHz) and MCU (32MHz)
2 UART interfaces (Command, Data)
Integrated shielding to resist EMI
Manufactured in conformance with RoHS
6. APPLICATIONS FOR THE MODULE
All Embedded Wireless Applications
White goods
Printer
Home Automation
Smart Meters
Internet of Things
Media Player
Fitness Equipment
Sensors
Lighting Control
POS Terminal
M2M Communication
Patient Monitors
7. WIRELESS LOCAL AREA NETWORK
Wireless Local Area Network (WLAN) is a local radio network defined in part by the IEEE 802.11 family of
standards. The IEEE 802.11 is an international standard describing the wireless network. The standard
defines the lower layers of the OSI model for wireless communication with the Physical Layer (PHY) and the
Data Link Layer (DLL) with its two sub-layers Logical Link Control (LLC) and Media Access Control (MAC),
making it possible to use any protocol over a IEEE 802.11 wireless network as an Ethernet network.
Basically WLAN networks use two operating modes for connecting station computers (STA) equipped with a
wireless network adapter. The first one is the infrastructure mode where the wireless clients are connected
via one or more access points (AP) to a wired network. In this case the network is configured with the same
Service Set Identifier (SSID) network name in order to communicate. The second one is the ad-hoc mode
where wireless clients are connected without any access point to the internet.
WLAN devices typically have a higher transmit power to cover a radio range about 100m. Furthermore
WLAN is commonly used to transmit high throughput data using Orthogonal Frequency Division Multiplexing
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(OFDM) modulation. The Carrier Sense Multiple Access with Collosion Avoidance (CSMA/CA) mechanism
enables the parallel access of more than one device to the media of a IEEE 802.11 network. By
implementation of security mechanisms like Adavanced Encryption Standard (AES) with Counter Mode CBC-
MAC Protocol (CCMP) or Cipher-Based Message Authentication Code (CMAC) and Wired Equivalent
Privacy (WEP) with Temporal Key Integrity Protocol (TKIP) the network is supporting the security standard
IEEE 802.11i. Video, voice and multimedia applications are supported by the IEEE 802.11e Quality of
Service amendment.
8. DESCRIPTION FOR THE MODULE
The PAN9320 series is a 2.4GHz ISM band wireless radio module for implementing WLAN functionality into
various electronic devices. A block diagram can be found in chapter 14.
The PAN9320 series is a cost-effective, low-power consumption, system-on-chip (SoC) solution for WLAN
applications. It enables wireless network adapters and cards to be built with low total bill-of-material costs.
The PAN9320 series combines an excellent 802.11 wireless radio, baseband processor, medium access
controller, encryption unit, CPU, boot ROM with patching capability, internal SRAM, in-system programmable
flash memory and many other powerful supporting features and peripherals. The PAN9320 is suitable for
wireless network systems based on WLAN IEEE 802.11 b/g/n 2.4GHz where small form factor, highly
integration, high throughput data rates and low RF expertise are required.
The PAN9320 includes integrated firmware consisting of TCP/IP-stack on 802.11 MAC with various
application features.
The Driver-Firmware Interface handles all 802.11 MAC management tasks by converting standard 802.3
Ethernet frames to the SoC firmware to transmit over the wireless link as 802.11 frames and processes the
received 802.11 frames and converts them into 802.3 Ethernet frames before forwarding them to the host
driver. The HOST driver is seperated in three modules. The Standard Ethernet driver, the 802.11 Extensions
and the Hardware Interface Driver. The 802.11 Extensions module extends the Standard Ethernet driver in
order to view and control the state of the WLAN adapter. The Hardware Interface Driver controls the
hardware interface on the HOST side. Additonally the software package from Marvell® consists of various
applications, demonstrations and utilities.
Refer to [1] PAN9320 Software-Guide and chapter 27 Ordering Information.
Please contact your local sales office for further details on additional options and services:
www.panasonic.com/rfmodules for the US,
http://industrial.panasonic.com/eu/i/29606/wireless_modules/wireless_modules.html for EU
or write an e-mail to wireless@eu.panasonic.com.
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9. DETAILED DESCRIPTION
9.1. PAN9320 TERMINAL LAYOUT
Top View, Application PCB
36 22
Top View
151
16
17
18
19
20
21
42
41
40
39
38
37
Chip
Antenna
F1 F2 F3 F4 F5
E1 E2 E3 E4 E5
D1 D2 D3 D4 D5
C1 C2 C3 C4 C5
B1 B2 B3 B4 B5
A1 A2 A3 A4 A5
2 3 4 5 6 7 8 9 10 11 12 13 14
35 34 33 32 31 30 29 28 27 26 25 24 23
GND
THERMO GND
THERMO
GND
THERMO GND
THERMO
9.2. COMMON TERMINAL PIN-CONFIGURATION
No
Pin Name
Pin Type
Description
1
GND
Ground Pin
Connect to Ground
2
GPIO441
Digital I/O
Digital I/O #44
3
GPIO451
Digital I/O
Digital I/O #45
4
USB AVDD 33
Power
Don’t connect, only for internal purpose
5
USB DP
Analog I/O
Don’t connect, only for internal purpose
6
USB DM
Analog I/O
Don’t connect, only for internal purpose
7
3.3V
Power
3.0V – 3.6V power supply connection
8
3.3V
Power
3.0V – 3.6V power supply connection
9
UART1 CTS
Digital In
CTSn for UART1
10
UART1 RTS
Digital Out
RTSn for UART 1
11
UART1 TXD
Digital Out
TXD for UART1
12
UART1 RXD
Digital In
RXD for UART1
13
QSPI CS2
Digital Out
Chip Select for external QSPI Flash Memory (option)
14
GND
Ground Pin
Connect to Ground
15
GND
Ground Pin
Connect to Ground
16
NC
NC
NC
17
GND
Ground Pin
Connect to Ground
18
GND
Ground Pin
Connect to Ground
19
GND
Ground Pin
Connect to Ground
20
GND
Ground Pin
Connect to Ground
21
GND
Ground Pin
Connect to Ground
22
GND
Ground Pin
Connect to Ground
1
All GPIO’s are initial set to output with low level
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No
Pin Name
Pin Type
Description
23
GND
Ground Pin
Connect to Ground
24
GND
Ground Pin
Connect to Ground
25
GND
Ground Pin
Connect to Ground
26
W STAT LED
Digital Out
Connect to WiFi-Status LED
27
UART0 TXD
Digital Out
TXD for UART0
28
UART0 RXD
Digital In
RXD for UART0
29
GPIO41
Digital I/O
Digital I/O #4
30
GPIO51
Digital I/O
Digital I/O #5
31
GPIO61
Digital I/O
Digital I/O #6
32
GPIO71
Digital I/O
Digital I/O #7
33
STAT LED1
Digital Out
Connect to Microcontroller-Status LED, active low
34
STAT LED2
Digital Out
Connect to IP-Connectivity LED active low
35
STAT LED3
Digital Out
Connect to Error LED active low
36
GND
Ground Pin
Connect to Ground
37
RESETn
Digital In
Resetn, active low
38
WAKE UP0
Digital In
Wake up signal for MCU, active high
39
BOOT
Digital In
Boot option, High level: boot from internal flash, Low level: boot over UART2
40
GPIO281
Digital I/O
Digital I/O #28
41
MCU READY
Digital Out
Connect to Ready-LED, active high
42
FACTORY RESET
Digital In
Factory reset, active high
A1
SD DAT3
Digital I/O
Don’t connect, only for internal purpose
A2
SD DAT2
Digital I/O
Don’t connect, only for internal purpose
A3
SD DAT1
Digital I/O
Don’t connect, only for internal purpose
A4
SD DAT0
Digital I/O
Don’t connect, only for internal purpose
A5
SD CMD
Digital I/O
Don’t connect, only for internal purpose
B1
SD CLK
Digital Out
Don’t connect, only for internal purpose
B2
BT FREQ
Input Signal
Information BT using channel which overlaps WLAN channel or not
B3
BT GRANTN
Output Signal
Indicate permission to transmit, low BT can transmit
B4
BT REQ
Input Signal
BT device request access to medium
B5
BT STATE
Input Signal
Information BT_REQ priority (1- or 2-bit) and direction BT RX/TX
C1
NC
Don’t connect, only for internal purpose
C2
NC
Don’t connect, only for internal purpose
C3
WAKE UP1
Digital In
Don’t connect, only for internal purpose
C4
QSPI CLK
Digital Out
Clock for QSPI
C5
QSPI D3
Digital I/O
Data3 for QSPI
D1
TDI
Digital In
TDI for JTAG
D2
TRSTn
Digital In
TRSTn for JTAG
D3
NC
Don’t connect, only for internal purpose
D4
QSPI D0
Digital I/O
Data0 for QSPI
D5
QSPI D1
Digital I/O
Data1 for QSPI
E1
TDO
Digital Out
TDO for JTAG
E2
TCK
Digital Out
TCK for JTAG
E3
TMS
Digital I/O
TMS for JTAG
E4
QSPI D2
Digital I/O
Data2 for QSPI
E5
QSPI CS
Digital Out
Chip select for internal QSPI Flash Memory
F1
W PDn
Digital In
Don’t connect, only for internal purpose
F2
W RESETn
Input Signal
Don’t connect, only for internal purpose
F3
GND
Ground Pin
Connect to Ground
F4
GND
Ground Pin
Connect to Ground
F5
GND
Ground Pin
Connect to Ground
2
Connect the Boot-Pin over a 100 Ohm resistor to Vcc or GND
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10. GENERAL FEATURES
Surface Mount Type 29,0 x 13.5 x 2.66 mm³
Wireless Local Area Network (WLAN) module with integrated MCU and Radio (SoC)
Integrated embedded stack, interfaces Telnet, http, Ajax, Jason, others
Wireless Update of Radio Driver and MCU Firmware with integrated bootloader
Integrated flash for customer web contents up to 1.5MByte
Evaluation and Development software for Windows
Getting started Tutorials, Libraries, APIs
Easy to use Evaluation Board for quick development and reduced time to market
Supports IEEE 802.11 b/g/n and security standards WEP, WPA, WPA2
Tx power up to +18 dBm (IEEE 802.11b)
High Rx sensitivity -98 dBm (IEEE 802.11b DSSS 1Mbps)
Marvell® 88W8782 WLAN System-on-Chip (SoC) and 88MC200 (MCU) inside
High performance low power CPU core
Two Internal crystal oscillator 32MHz and 40MHz
Programming over JTAG
HOST communication interfaces UART0 (Command) and UART1 (Data tunnel)
Integrated shielding to resist EMI
11. HOST INTERFACES
11.1. UART0 INTERFACE (COMMAND)
2-wire data transfer (RX, TX)
Programmable baud rate (110bps to 1.5 Mbps)
Data format (LSB first)
Data bit: (5-8 bit)
Parity bit: (0-4 bit)
Stop bit: (1-2 bit)
11.2. UART1 INTERFACE (DATA)
4-wire data transfer (RX, TX, RTS, CTS)
Programmable baud rate (110bps to 1.5 Mbps)
Data format (LSB first)
Data bit: (5-8 bit)
Parity bit: (0-4 bit)
Stop bit: (1-2 bit)
12. PERIPHERAL BUS INTERFACE
Embedded WLAN SoC with following features:
Clocked Serial Unit (CSU)
3-Wire, 4-Wire (3W4W) Interface
2-Wire Serial Interface (TWSI)
1-Wire Serial Interface
General-Purpose I/O (GPIO) Interface
User-defined GPIOs, I/O configured to either input or output
GPIOs independently controlled
GPIO1 with LED output functionality
LED Pulse Stretching to observe short duration of status events
Two software controlled blink rates to indicate events
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13. WLAN FEATURES
13.1. IEEE 802.11 / STANDARDS
802.11 data rates 1 and 2 Mbps (DSSS)
802.11b data rates 5.5 and 11 Mbps (CCK)
802.11g data rates 6, 9, 12 , 18, 24, 36, 48 and 54 Mb ps ( OF DM)
802.11b/g perf orm ance enhanc em ents
802.11n com pliant with maximum data r ates up to 72 Mbps (20 MHz channel) and
150 Mbps (40 MH z channe l)
802.11d international r oam ing
802.11i enhanced security (WEP, WPA, WPA2)
802.11k radio resource measurement
3
802.11r fast hand-off for AP roaming3
802.11w protected management frames3
Support clients (stations) implementing IEEE Power Save mode
13.2. WLAN MAC
Ad-Hoc3 and Infrastructure Modes
RTS/CTS for operation und DCF
Hardware filtering of 32 multicast addresses and duplicate frame detection for up to 32 unicast
addresses
WLAN SoC with Tx and Rx FIFO for maximum throughput
Open System and Shared Key Authentication services
A-MPDU Rx (de-aggregation) and Tx (aggregation)
20/40 MHz channel coex istenc e
Reduced Inter-Frame Spacing (RIFS) bursting
Management Information Base (MIB) counter
Radio resource measurement counters
Block acknowledgement with 802.11n extensions
Transmit beamformer support
Transmit rate adaptation
Transmit power control
Long and short preamb le generation on a frame-by-frame basis for 802.11b frames
Marvell® Mobile Hotspot technology (MMH)
13.3. WLAN BASEBAND
802.11n 1x1 SISO (WLAN SoC with SISO RF radio)
Backward compatibility with legacy 802.11b/g technology
PHY data rates up to 150 Mbps (802.11n - MCS7)
20 MHz bandwidth/channel, 40 MHz bandwidth/channel, upper/lower 20 MHz bandwidth in 40
MHz channel and 20 MHz duplicate legacy bandwidth in 40 MHz channel mode operation
Modulation and Coding Scheme MCS 0 ~ 7 and MCS 32 (duplicate 6 Mbps)
Radio resource measurement
Optional 802.11n SISO features:
20/40 MHz coexistenc e
1-stream Space-Time-Block-Coding (STBC) reception
Short Guard Interval
RIFS on receive path
Beamformer function and hardware acceleration
Greenfield Tx/Rx
3
Hardware supported, not implemented in the software stack
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13.4. WLAN RADIO
20 and 40 MH z channel ba ndwidth
Embedded WLAN SoC with following features:
Direct conversion radio (no SAW filter)
2.4GHz Tx/Rx switch, Power Amplifier (PA) and Low Noise Amplifier (LNA) path
Gain selectable LNAs with optimized noise figure and power consumption
Power Amplifiers with power control
Closed loop power control (0.5 dB step increments)
Optimized Tx gain distribution for linearity and noise performance
Fine channel step with AFC (adaptive frequency control)
13.5. WLAN ENCRYPTION
Embedded WLAN SoC with following features:
WEP 64-bit and 128-bit encryption with hardware TKIP processing (WPA)
AES-CCMP hardware implementation as part of 802.11i security standard (WPA2)
Enhanced AES engine performance
AES-Cipher-Based Message Authentication Code (CMAC) as part of the 802.11w security
standard3
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14. PAN9320 BLOCK DIAGRAM
PAN 9320
Wi-Fi 2.4G b/g/n – Full Embedded – Module
WLAN-SoC
SDIO
802.11
MAC
Baseband
Peripheral
Bus Unit
Power Management
C
P
U
B
U
S
SPDT
WLAN RF
Direct
Conversion
SRAM
CPU
CPU I/F
ROM
Encryption
C
O
N
T
R
O
L
B
U
S
JTAG
UART
GPIO
Sleep
OTP
LDO I/F
OSC
PLL
LED Stretch
Crystal
40 MHz
Ceramic Chip
Antenna
2.4G
2.4G
TX/RX
LPF
Microcontroller Unit
Connectivity MPU
I2C
Q-SPI
GPIO
UART
Vcc 3.3V
GPIO‘s
UART0 (Command)
UART1 (Data)
Q-SPI (ext. FLASH)
RESETn / PDn
I2S
USB
Memory
ROM
SRAM
AON Unit
OSC
PMIP
PMU
Debug
SWD
JTAG
AHB Bus
Flash Cntl RTC
SDIO
I/O Multiplexer
DMA
System Unit
Timer
WDT
ADC/DAC
ACOMP
FLASH
Crystal
32 MHz
T-Sensor
Analog Unit
OSC/PLL
SDIO Controller
DC/DC
Step-down
Converter
Q-SPI
Flash
Status LED‘s
JTAG
1.8V
3.3V
3.3V
MCU READY
USB (CDC Device)
WAKE UP0/1
Factory Reset
SDIO (Testing)
15. KEY PARTS LIST
Part Name
Material
P.W.Board
Glass cloth epoxide resin with gold plating
Casing
Material: C7521, thickness 0.30mm
IC (WLAN-SoC)
88W8782 (Marvell®, www.marvell.com)
IC (Microcontroller Unit)
88MC200 (Marvell®, www.marvell.com)
16. TEST CONDITIONS
Measurements shall be made under operating free-air temperature range unless otherwise specified.
Temperature 25 ± 10°C
Humidity 40 to 85%RH
Supply Voltage 3.3V
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17. GENERAL REQUIREMENTS AND OPERATION
All specifications are over temperature and process, unless indicated otherwise.
17.1. ABSOLUTE MAXIMUM RATINGS
The maximum ratings may not be exceeded under any circumstances, not even momentarily and
individually, as permanent damage to the module will result.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
TSTOR
Storage temperature
-40
+85
°C
VESD
ESD robustness
All pads, according to human-body model, JEDEC
STD 22, method A114
1000
V
According to charged-device model, JEDEC STD 22,
method C101
500
V
PRF
RF input level
+20
dBm
VDDMAX
Maximum voltage
Maximum power supply voltage from any pin with
respect to VSS (GND)
-0.3
3.6
V
VDIG
Voltage on any digital pins
GPIOs, PDn, RESETn, Coex I/F
-0.3
VDDMAX
V
17.2. RECOMMENDED OPERATING CONDITIONS
The maximum ratings may not be exceeded under any circumstances, not even momentarily and
individually, as permanent damage to the module will result.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
TA
Ambient operating
temperature range
Extendet grade
-30
+70
°C
VDD
3V3 Supply voltage4
Voltage on pins 7, 8 (3.3V)
I/O supply voltage internally connected to VDD
3.0
3.3
3.6
V
17.3. DIGITAL PIN CHARACTERISTICS
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VIH
High level input voltage5
3.3V Operation (VIO = VDD)
0.7VDD
VDD+0.3
V
VIL
Low level input voltage5
3.3V Operation (VIO = VDD)
-0.3
0.3VDD
V
IOH @ VDD-0.4V
High level output current5
3.3V Operation (VIO = VDD)
4
mA
IOL @ 0.4V
Low level output current5
3.3V Operation (VIO = VDD)
4
mA
4
The supply current must be limited to max. 1A
5
The capacitive load should not be larger than 50 pF for all I/O’s when using the default driver strength settings. Generally, large capacitance loads increase
the overall current consumption.
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17.4. ELECTRICAL CHARACERISTICS
The current consumption depends on the user scenario and the setup and timing in the power modes.
Assume VDD = 3.3V, Tamb = 25°C if nothing else stated
17.4.1. Current consumption
Symbol
Parameter
Current Consumption
Condition
Min.
Typ.
Max.
Units
ITX
Active Transmit 6
PTX = +18 dBm for 802.11b @ 11 Mbps
430
mA
PTX = +15 dBm for 802.11g @ 54 Mbps
370
mA
PTX = +13 dBm for 802.11n (20MHz) @ 65 Mbps
350
mA
IRX
Active Receive 7
802.11b @ 11 Mbps
160
mA
802.11g @ 54 Mbps
165
mA
802.11n @ 65 Mbps
170
mA
IRXIdle
Receive Idle 8
Passive receive state, ready to receive packets, but
no active decoding
160
mA
IIEEE-PSM
IEEE 802.11 PS
Radio in “IEEE PS DTIM 1” mode
tbd
mA
IShut-off
Shut-off mode
MCU and Radio in Power Safe mode
tbd
mA
17.5. INTERNAL OPERATING FREQUENCIES
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
fSYSCLK1
CPU/System/Encryption
clock speed
Refers to clock speed of WLAN SoC
128
MHz
fSYSCLK2
CPU/System clock speed
Refers to clock speed of MCU
200
MHz
fREFCLK1
WLAN SoC Crystal
fundamental frequency
Frequency tolerance < ±10 ppm over operating
temperature and process
40
MHz
fREFCLK2
Microcontroller Crystal
fundamental frequency
Frequency tolerance < ±10 ppm over operating
temperature and process
32
MHz
6
Peak values for specified output power level and data rate with UDP traffic between the AP and Device (STA).
7
Peak values for specified data rate with UDP traffic between the AP and Device (STA)..
8
The device is powered on and is ready to receive packets, but is not actively decoding.
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17.6. COEXISTENCE INTERFACE SPECIFICATION
The Coexistence Interface pins are powered from the VIO voltage supply internally connected to
VDD = 3.3V. See Chapter 17.3 Digital Pin Characteristics for DC specification.
17.6.1. Marvell® 3/4-Wire Timing Data
Symbol
Parameter
Min.
Typ.
Max.
Units
T1
Priority[0] info is valid in BT_STATE on and after T1 from BT_REQ rise.
0
1
100
µs
T2
TxRx Info is valid in BT_STATE on and after T2. The BT_STATE must hold until
there is any change of direction in the next slots.
2
19
100
µs
T3
Time from TxRx Info valid to BCA grant decision (T3 = T7 – T4 – T2 – T8 – T1).
2
40
594
µs
T4
BT_GRANTn needs to be valid T4 time before the upcoming slot. BT_GRANTn
indicates Tx grant, and may also indicate Rx grant. Once a slot is granted, the
subsequent slots are also granted unless there is a change in direction from Rx to
Tx. Rx to Tx change always re-arbitrates.
2
80
594
µs
T5
TxRx Info for the next slot is valid on and after T5 to the start of the next slot. If
direction remains the same for the next slot, then BT_STATE must not change
during the current slot. If the direction changes for the next slot, the BT_STATE
must change only after the last bit of Bluetooth data is transferred; otherwise the
transfer may be disrupted.
5
40
600
µs
T6
The BT_REQ signal de-asserts T6 time after last bit of Bluetooth data is transferred.
0
15
25
µs
T7
Time from BT_REQ rise to first Bluetooth slot boundary. Bluetooth slot boundary is
marked by first bit of Bluetooth data.
8
150
600
µs
T8
Optional
Priority[1] information is valid in BT_STAT on and after T8. This time parameter only
exists if BCA is configured for 2-bit priority on same BT_STATE pin. Otherwise, the
start of T2 would come after T1.
2
10
100
µs
Ttx
Slot time (fixed fpr Bluetooth)
625
µs
Trx
Slot time (fixed fpr Bluetooth)
625
µs
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17.6.2. WL_ACTIVE 2/3/4-Wire Timing Data
Symbol
Parameter
Min.
Typ.
Max.
Units
T1
If WLAN can be stopped, WL_ACTIVE will de-asser prior to Bluetooth slot
start (T1 < T2)
If the Bluetooth device samples WL_ACTIVE before starting priority transfer,
WL_ACTIVE needs to de-assert earlier than the sampling time.
0
499
µs
T2
Time from BT_PRIORITY rise to start of Bluetooth activity.
20
50
499
µs
T3
Time from end of Bluetooth activity to BT_PRIORITY fall.
0
0
499
µs
T4
Slot time (fixed fpr Bluetooth)
625
µs
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17.7. HOST INTERFACE SPECIFICATION
17.7.1. UART0 Interface (Command)
UART0 Interface bus signals:
Module Pin No
Signal Name
Description
27
TXD for UART0
Transmit data output
28
RXD for UART0
Receive data input
Protocol
Item
Range
Default
Comment
Baudrate
300 ~ 1528000
115200
Data Bits
5 ~ 8 (LSB first)
8
LSB first
Parity Bits
0 ~ 4
0
Stop Bit
1 / 1,5 / 2
1
Initial setting:
One Bit
Serial data 8 Data bits StopStart
One Character
17.7.2. UART1 Interface (Data)
UART1 Interface bus signals
Module Pin No
Signal Name
Description
9
CTS for UART1
Clear to send
10
RTS for UART1
Request to send
11
TXD for UART1
Transmit data output
12
RXD for UART1
Receive data input
Protokol
Item
Range
Default
Comment
Baudrate
300 ~ 1528000
115200
Data Bits
5 ~ 8 (LSB first)
8
LSB first
Parity Bits
0 ~ 4
0
Stop Bit
1 / 1,5 / 2
1
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18. RF ELECTRICAL CHARACTERISTICS
18.1. WLAN RADIO SPECIFICATION
Parameter
Operation mode
Specification
Standard Conformance
IEEE 802.11 / IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Modulation
IEEE 802.11b
DSSS / CCK
IEEE 802.11g
OFDM
IEEE 802.11n
OFDM @ MCS0~7 and MCS32 (duplicate 6 Mbps)
Physical layer data rates
IEEE 802.11
1, 2 Mbps @ DSSS
IEEE 802.11b
5.5, 11 Mbps @ DSSS / CCK
Supported data rates
IEEE 802.11g
6, 9, 12, 18, 24, 36, 48, 54 Mbps
IEEE 802.11n
MCS0~7
HT20
LGI
6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps
SGI
7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65, 72.2 Mbps
HT40
LGI
13.5, 27, 40.5, 54, 81, 108, 121.5, 135 Mbps
SGI
15, 30, 45, 60, 90, 120, 135, 150 Mbps
Supported bandwidth
IEEE 802.11n
20, 40 MHz (BW)
Supported channel mode operation
IEEE 802.11n
20 MHz BW / channel, 40 MHz BW / channel,
upper / lower 20 MHz BW @ 40 MHz channel,
20 MHz duplicate legacy BW @ 40 MHz channel
Supported Guard Interval
IEEE 802.11n
400 ns (SGI), 800 ns (LGI)
Supported channel 2.4GHz
IEEE 802.11g
North America
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11
Europe
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13
Spain
10, 11
France
10, 11, 12, 13
Japan MMK
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13
IEEE 802.11n
North America
1-5, 2-6, 3-7, 4-8, 5-9, 6-10, 7-11
Europe
Spain
France
Japan MMK
-
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18.2. WLAN RF CHARACTERISTICS
18.2.1. RF Characteristics for IEEE 802.11b
Assume VDD = 3.3V, Tamb = 25°C if nothing else stated
50 Ohm terminal load connected to the RF connector
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2400
2483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
Transmit output power
+16
+18
+20
dBm
Spectrum mask
fC ± 11 MHz
-30
dBr
fC ± 22 MHz
-50
Power-on / Power-down ramp
2
µs
RF Carrier suppression
-15
dB
Error Vector Magnitude (EVM)
Peak
35
%
Minimum Receive Sensitivity
1 Mbps (DSSS)
FER ≤ 8%
-98
-86
dBm
2 Mbps (DSSS)
FER ≤ 8%
-95
-83
dBm
5.5 Mbps (CCK)
FER ≤ 8%
-91
-79
dBm
11 Mbps (CCK)
FER ≤ 8%
-88
-76
dBm
Maximum Input Level
FER ≤ 8%
-10
dBm
Adjacent Channel Rejection
FER ≤ 8%
35
dB
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18.2.2. RF Characteristics for IEEE 802.11g
Assume VDD = 3.3V, Tamb = 25°C if nothing else stated
50 Ohm terminal load connected to the RF connector
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2400
2483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
Transmit output power
6 Mbps ~ 36 Mbps
+14
+16
+18
dBm
48 Mbps ~ 54 Mbps
+13
+15
+17
dBm
Spectrum mask
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-40
dBr
Transmitter center frequency leakage
-15
dB
Transmitter Spectral Flatness
-2
+2
dB
Constellation Error (EVM)
BPSK, CR 1/2 (6 Mbps)
-5
dB
BPSK, CR 3/4 (9 Mbps)
-8
dB
QPSK, CR 1/2 (12 Mbps)
-10
dB
QPSK, CR 3/4 (18 Mbps)
-13
dB
16-QAM, CR 1/2 (24 Mbps)
-16
dB
16-QAM, CR 3/4 (36 Mbps)
-19
dB
64-QAM, CR 2/3 (48 Mbps)
-22
dB
64-QAM, CR 3/4 (54 Mbps)
-25
dB
Minimum Receive Sensitivity
BPSK, CR 1/2 (6 Mbps)
PER ≤ 10%
-93
-82
dBm
BPSK, CR 3/4 (9 Mbps)
PER ≤ 10%
-92
-81
dBm
QPSK, CR 1/2 (12 Mbps)
PER ≤ 10%
-90
-79
dBm
QPSK, CR 3/4 (18 Mbps)
PER ≤ 10%
-88
-77
dBm
16-QAM, CR 1/2 (24 Mbps)
PER ≤ 10%
-85
-74
dBm
16-QAM, CR 3/4 (36 Mbps)
PER ≤ 10%
-81
-70
dBm
64-QAM, CR 2/3 (48 Mbps)
PER ≤ 10%
-77
-66
dBm
64-QAM, CR 3/4 (54 Mbps)
PER ≤ 10%
-76
-65
dBm
Maximum Input Level
PER ≤ 10%
-20
dBm
Adjacent channel rejection
BPSK, CR 1/2 (6 Mbps)
PER ≤ 10%
16
dB
64-QAM, CR 3/4 (54 Mbps)
PER ≤ 10%
-1
dB
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18.2.3. RF Characteristics for IEEE 802.11n (BW 20 MHz)
Assume VDD = 3.3V, Tamb = 25°C if nothing else stated
50 Ohm terminal load connected to the RF connector
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2400
2483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
Transmit output power
MCS0 ~ MCS2
13
15
17
dBm
MCS3 ~ MCS4
12
14
16
dBm
MCS5 ~ MCS7
11
13
15
dBm
Spectrum mask
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-45
dBr
Transmitter center frequency leakage
-15
dB
Transmitter Spectral Flatness
-2
+2
dB
Constellation Error (EVM)
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Minimum Receive Sensitivity 9
6.5 Mbps (MCS0)
PER ≤ 10%
-92
-82
dBm
13 Mbps (MCS1)
PER ≤ 10%
-89
-79
dBm
19.5 Mbps (MCS2)
PER ≤ 10%
-87
-77
dBm
26 Mbps (MCS3)
PER ≤ 10%
-84
-74
dBm
39 Mbps (MCS4)
PER ≤ 10%
-80
-70
dBm
52 Mbps (MCS5)
PER ≤ 10%
-76
-66
dBm
58.5 Mbps (MCS6)
PER ≤ 10%
-75
-65
dBm
65 Mbps (MCS7)
PER ≤ 10%
-74
-64
dBm
Maximum Input Level
PER ≤ 10%
-20
dBm
Adjacent channel rejection 10
65 Mbps (MCS7)
PER ≤ 10%
-2
dB
9
The Minimum Sensitivity levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI and BCC.
10
The Adjacent Channel Rejection levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI and BCC.
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18.2.4. RF Characteristics for IEEE 802.11n (BW 40 MHz)
Assume VDD = 3.3V, Tamb = 25°C if nothing else stated
50 Ohm terminal load connected to the RF connector
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2400
2483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
Transmit output power
MCS0 ~ MCS2
11
13
15
dBm
MCS3 ~ MCS4
10
12
14
dBm
MCS5 ~ MCS7
9
11
13
dBm
Spectrum mask
fC ± 21 MHz
-20
dBr
fC ± 40 MHz
-28
dBr
fC ± 60 MHz
-45
dBr
Transmitter center frequency leakage
-15
dB
Transmitter Spectral Flatness
-2
+2
dB
Constellation Error (EVM)
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Minimum Receive Sensitivity 9
13.5 Mbps (MCS0)
PER ≤ 10%
-89
-79
dBm
27 Mbps (MCS1)
PER ≤ 10%
-86
-76
dBm
40.5 Mbps (MCS2)
PER ≤ 10%
-84
-74
dBm
54 Mbps (MCS3)
PER ≤ 10%
-81
-71
dBm
81 Mbps (MCS4)
PER ≤ 10%
-77
-67
dBm
108 Mbps (MCS5)
PER ≤ 10%
-73
-63
dBm
121.5 Mbps (MCS6)
PER ≤ 10%
-72
-62
dBm
135 Mbps (MCS7)
PER ≤ 10%
-71
-61
dBm
Maximum Input Level
PER ≤ 10%
-20
dBm
Adjacent channel rejection 10
135 Mbps (MCS7)
PER ≤ 10%
-2
dB
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19. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
19.1. FOR LEAD SOLDER
Recommended temp. profile
for reflow soldering
Temp.[°C]
Time [s]
235°C max.
220 5°C
200°C
150 10°C
90 30s
10 1s
30 +20/-10s
19.2. FOR LEADFREE SOLDER
Our used temp. profile
for reflow soldering
Temp.[°C]
Time [s]
230°C -250°C max.
220°C
150°C – 190°C
90 30s
30 +20/-10s
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight.
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29
13,50
2,66
20. PAN9320 MODULE DIMENSION
No.
Item
Dimension
Tolerance
Remark
1
Width
13.50
0.30
2
Length
29.00
0.30
3
Height
2.66
0.20
with case
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21. PAN9320 FOOTPRINT OF THE MODULE
All dimensions are in millimeters.
The outer dimensions have a tolerance of 0.3mm.
Top view, Application PCB
36 22
0,40 mm
1,70 mm
2,50 mm
3,30 mm
29,00 mm
0,25 mm
1,55 mm
2,35 mm
3,15 mm
13,50 mm
Top View
151
3,10 mm
5.00 mm
16
17
18
19
20
21
42
41
40
39
38
37
Chip
Antenna
1,60 mm 1,30 mm
0,80 mm
1,30 mm
0,80 mm 1,6 mm
F1 F2 F3 F4 F5
E1 E2 E3 E4 E5
D1 D2 D3 D4 D5
C1 C2 C3 C4 C5
B1 B2 B3 B4 B5
A1 A2 A3 A4 A5
0,80 mm
0,80 mm
24,60 mm
2 3 4 5 6 7 8 9 10 11 12 13 14
35 34 33 32 31 30 29 28 27 26 25 24 23
GND
THERMO GND
THERMO
GND
THERMO GND
THERMO
2,40 mm
2,40 mm
5,70 mm
12,90 mm
16,90 mm
0,80 mm
5,60 mm
2,40 mm
4.25 mm 4.25 mm
9,55 mm
0,80 mm
Ground plane
keep out area
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22. CASE MARKING (EXAMPLE FOR PAN9320)
PAN9320 01/01
ENW49A01A3JF
YYWWDLL
12345678
ABCDEFABCDEF
FCC ID: T7V-9320
IC: 216Q-9320
1
3
4
5
6
7
8
2
10
9
No.
Remark
1
PAN9320 (Model Name), see chapter 27 Ordering Information
2
Hardware/Software version
3
Part Number, see Ordering Information, chapter 27 Ordering Information
4
Lot code: YearYear, WeekWeek, Day, LotLot
5
Serial Number (8 digits)
6
WLAN MAC address (12 digits)
7
FCC ID, refer to chapter 29.1 (tbd)
8
IC Canada, refer to chapter 29.2 (tbd)
9
Marking for Pin 1 (Circle 0,15 mm)
10
2D-Code, for internal usage only and can be change without any notice
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23. MECHANICAL REQUIREMENTS
No.
Item
Limit
Condition
1
Solderability
More than 75% of the soldering area shall be coated by
solder
Reflow soldering with recommendable
temperature profile
2
Resistance to soldering
heat
It shall be satisfied electrical requirements and not be
mechanical damage
See chapter 19.2
24. RELIABILITY TESTS
The measurement should be done after being exposed to room temperature and humidity for 1 hour.
No.
Item
Limit
Condition
1
Vibration test
Electrical parameter should be in
specification
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
2
Shock test
the same as above
Dropped onto hard wood from height of 50cm for 3 times
3
Heat cycle test
the same as above
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
4
Moisture test
the same as above
+60°C, 90% RH, 300h
5
Low temp. test
the same as above
-40°C, 300h
6
High temp. test
the same as above
+85°C, 300h
25. CAUTIONS
Failure to follow the guidelines set forth in this document may result in degrading of the product’s functions
and damage to the product.
25.1. DESIGN NOTES
(1) Follow the conditions written in this specification, especially the control signals of this
module.
(2) The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47uF
directly at the module).
(3) This product should not be mechanically stressed when installed.
(4) Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
(5) Avoid assembly and use of the target equipment in conditions where the products'
temperature may exceed the maximum tolerance.
(6) The supply voltage should not be exceedingly high or reversed. It should not carry noise
and/or spikes.
(7) Keep this product away from other high frequency circuits.
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25.2. INSTALLATION NOTES
(1) Reflow soldering is possible twice based on the conditions in chapter 15.
Set up the tem peratur e at the s oldering porti on of this produc t ac cor ding to this ref low
profile.
(2) Carefully position the products so that their heat will not burn into printed circuit boards or
affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due to the
effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between the cover and
these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) To repair the board by hand soldering, follow the conditions set forth in this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause damage to
the unit.
(10) For more details on LGA (Land Grid Array) soldering processes refer to the application
note.
25.3. USAGE CONDITIONS NOTES
(1) Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, check and evaluate their operation befor assembly on the final products.
(2) Do not use dropped produ cts .
(3) Do not touch, dam age or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to this product.
(5) Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB.
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
(7) These products are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information and communication
equipment.
25.4. STORAGE NOTES
(1) The module should not be stressed mechanically during storage.
(2) Do not store these products in the following conditions or the performance characteristics
of the product, such as RF performance will be adversely affected:
Storage in salty air or in an environment with a high concentration of corrosive gas, such as
Cl2, H2S, NH3, SO2, or NOX
Storage in direct sunlight
Storage in an environment where the temperature may be outside the range of 5°C to 35°C
range, or where the humidity may be outside the 45 to 85% range.
Storage of the products for more than one year after the date of delivery Storage period:
Please check the adhesive strength of the embossed tape and soldering after 6 months of
storage.
(3) Keep this product away from water, poisonous gas and corrosive gas.
(4) This product should not be stressed or shocked when transported.
(5) Follow the specification when stacking packed crates (max. 10).
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25.5. SAFETY CAUTIONS
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications, without deviation when using the products. These products may short-circuit. If electrical
shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs,
then provide the following failsafe functions, as a minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a protection
device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another system to
prevent a single fault causing an unsafe status.
25.6. OTHER CAUTIONS
(1) This specification sheet is copyrighted. Do not disclose it to a third party.
(2) Do not use the products f or other purpos es than thos e listed.
(3) Be sure to provide an appropriate fail-safe function on your product to prevent an additional
damage that may be caused by the abnor mal function or the failure of the produc t.
(4) This product has been manufactured without any ozone chemical controlled under the
Montreal Protocol.
(5) These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check their
performance and reliability under the said special conditions carefully to determine whether
or not they can be used in such a manner.
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid
may splash.
In direct sunlight, outdoors, or in a dusty environment
In an environment where condensation occurs .
In an environment with a high conc entration of harmf ul gas (e.g. salty air, HCl, Cl2, SO2,
H2S, NH3, and NOX)
(6) If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to provide
normal performance even if their electronic characteristics and appearances appear
satisfactory.
(7) When you have any question or uncertainty, contact Panasonic.
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26. PACKAGING
Mass production status product -- as indicated in Chapter 3 -- will be delivered in the package described
below.
26.1. PAN9320 TAPE DIMENSION
26.2. PACKING IN TAPE
Empty spaces in component packed area shall be less than two per reel and those spaces shall not be
consecutive.
Top cover tape shall not be found on reel holes and shall not stick out from reel.
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26.3. COMPONENT DIRECTION
26.4. REEL DIMENSION
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26.5. LABEL FOR PACKAGE
The picture shows an example from similar product.
(1T) Lot code [YYWWDLL-AAA] Example from above:
YY year printed 08
WW normal calendar week printed 01
D day printed 5 (Friday)
L line identifier, if more as one printed 1
L lot identifier per day printed 1
AAA number of the reel (example 001, 002,…, 999) printed 001
(1P) Customer Order Code, if any, otherwise company name will be printed
(2P) Panasonic Order Code: ENW49A01x3EF (see chapter 27 Ordering Information)
(3P) Model type, (see chapter 27 Ordering Information)
(9D) Date code as [YYWW]
(Q) Quantity [XXXX], variable max. 500
(HW/SW) Hardware/Software Release
26.6. TOTAL PACKAGE
barcode
label
moisture-sensitive print
(already exist on barrier bag) barcode
label
desiccant 1) 2)
moisture indicator
barrier bag
sealed
inner carton box
size 340 x 340 x 41 mm³
1) quantity of desiccant according
to calculation
2) optional: desiccant placed into
the corner of the barrier bag
(3P): PAN9320
RoHS
-AAA
ENW49A01A3EF
Company
500
xy/ab
Country of Origin: Slovakia
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27. ORDERING INFORMATION
Ordering part number
Model type
Description
MOQ (1)
ENW49A01A3EF
PAN9320
WLAN IEEE 802.11 b/g/n 2.4GHz Full Embedded
Module with ceramic chip-antenna
500
The PAN9320 will be delivered with a preinstalled embedded Web-Stack, see [1] PAN9320 Software-Guide
Notes:
(1) Abbreviation for Minimum Order Quantity (MOQ). The standard MOQ for mass production is 500
pieces, fewer only on customer demand. Samples for evaluation can be de livered at an y quantity
via the distribution channels.
28. ROHS DECLARATION
Declaration of environmental compatibility for supplied products:
Hereby we declare to our best present knowledge based on declaration of our suppliers that this product
does not contain the following substances which are banned by Directive 2002/95/EC (RoHS) or contains a
maximum concentration of 0.1% by weight in homogeneous materials for
Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0.01% by weight in homogeneous materials for
Cadmium and cadmium compounds
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29. REGULATORY INFORMATION
29.1. FCC FOR US
Under preparation
29.2. INDUSTRY CANADA CERTIFICATION
Under preparation
29.3. EUROPEAN R&TTE DECLARATION OF CONFORMITY
Under preparation
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30. GENERAL INFORMATION
© Panasonic Industrial Devices Europe GmbH 2015.
All rights reserved.
This product description does not lodge the claim to be complete and free of mistakes.
Please contact the related product manager in every case.
If ES samples are delivered to the customer, these samples have the status Engineering
Samples. This means, the design of this product is not yet concluded. Engineering Samples may
be partially or fully functional, and there may be differences to be published Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series
production.
Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear defects
due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular,
Panasonic disclaims liability for damages caused by
the use of the Engineering Sample other than for Evaluation Purposes, particularly the
installation or integration in another product to be sold by Customer,
deviation or lapse in function of Engineering Sample,
improper use of Engineering Samples.
Panasonic Industrial Devices Europe GmbH disclaimes any liability for consequential and
incidental damages. In case of any questions, please contact your local sales partner or the
related product manager.
31. LIFE SUPPORT POLICY
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness. Customers using or selling
these products for use in such applications do so at their own risk and agree to fully indemnify
Panasonic Industrial Devices Europe GmbH for any damages resulting.