MKP4 4700/400/10 LS7.5 - WIMA

DESCRIPTIONS

zThe Hyper Red source color devices are made with

AlGaInP on GaAs substrate Light Emitting Diode

zElectrostatic discharge and power surge could

damage the LEDs

zIt is recommended to use a wrist band or

anti-electrostatic glove when handling the LEDs

zAll devices, equipments and machineries must be

electrically grounded

FEATURES

z 0.5 inch character height

z Low current operation

z High contrast and light output

z Easy mounting on P.C. boards or sockets

z Mechanically rugged

z Standard: gray face, white segment

zRoHS compliant

APPLICATIONS

zHome and smart appliances

z Display time and digital combination

z Industrial and instrumental applications

zNumeric status

ATTENTION

Observe precautions for handling

electrostatic discharge sensitive devices

PACKAGE DIMENSIONS

PSC05-11SURKWA

12.7 mm (0.5 inch) 16 Segment Single Digit Alphanumeric Display

Notes:

1. All dimensions are in millimeters (inches), Tolerance is ±0.25(0.01")unless otherwise noted.

2. The specifications, characteristics and technical data described in the datasheet are subject to change

without prior notice.

SELECTION GUIDE

Notes:

1. Luminous intensity / luminous Flux: +/-15%.

* Luminous intensity value is traceable to CIE127-2007 standards.

Part Number Emitting Color

(Material) Lens Type Iv (ucd) @ 10mA [1]

Min. Typ.

PSC05-11SURKWA ■ Hyper Red (AlGaInP) White Diffused

52000 110000

Common Cathode,

Rt. Hand Decimal

*14000 *31000

Description

Kingbright

ABSOLUTE MAXIMUM RATINGS at TA=25°C

ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C

PSC05-11SURKWA

Notes:

1. 1/10 Duty Cycle, 0.1ms Pulse Width.

2. 2mm below package base.

3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

Parameter Symbol Value Unit

Power Dissipation PD 75 mW

Reverse Voltage VR 5 V

Junction Temperature Tj 115 °C

Operating Temperature Top -40 to +85 °C

Storage Temperature Tstg -40 to +85 °C

DC Forward Current IF 30 mA

Peak Forward Current IFM [1] 185 mA

Electrostatic Discharge Threshold (HBM) - 3000 V

Lead Solder Temperature [2] 260°C For 3-5 Seconds

Notes:

1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )

2. Forward voltage: ±0.1V.

3. Wavelength value is traceable to CIE127-2007 standards.

4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

Parameter Symbol Emitting Color Value Unit

Typ. Max.

Wavelength at Peak Emission IF = 10mA λpeak Hyper Red 645 - nm

Dominant Wavelength IF = 10mA λdom [1] Hyper Red 630 - nm

Spectral Bandwidth at 50% Φ REL MAX

IF = 10mA Δλ Hyper Red 28 - nm

Capacitance C Hyper Red 35 - pF

Forward Voltage IF = 10mA VF [2] Hyper Red 1.85 2.35 V

Reverse Current (VR = 5V) IR Hyper Red - 10 uA

Kingbright

TECHNICAL DATA

HYPER RED

PSC05-11SURKWA

20%

40%

60%

80%

100%

350 400 450 500 550 600 650 700 750 800

= 25 °C

Red

Wavelength (nm)

Relative Intensity (a. u.)

RELATIVE INTENSITY vs. WAVELENGTH

RECOMMENDED WAVE SOLDERING PROFILE Soldering General Notes

1. Through-hole displays are incompatible with reflow soldering.

2. If components will undergo multiple soldering processes,

or other processes where the components may be subjected

to intense heat, please check with Kingbright for compatibility.

CLEANING

1. Mild "no-clean" fluxes are recommended for use in soldering.

2. If cleaning is required, Kingbright recommends to wash

components with water only. Do not use harsh organic

solvents for cleaning because they may damage the plastic

parts .

3. The cleaning process should take place at room temperature

and the devices should not be washed for more than one

minute.

4. When water is used in the cleaning process, Immediately

remove excess moisture from the component with forced-air

drying afterwards.

Notes:

1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple

attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath

temperature of 260°C

2. Peak wave soldering temperature between 245°C ~ 255°Cfor 3 sec (5 sec max).

3. Do not apply stress to the epoxy resin while the temperature is above 85°C.

4. Fixtures should not incur stress on the component when mounting and during soldering process.

5. SAC 305 solder alloy is recommended.

6. No more than one wave soldering pass.

7. During wave soldering, the PCB top-surface temperature should be kept below 105°C.

1.6 1.7 1.8 1.9 2.0 2.1

= 25 °C

Forward voltage (V)

Forward current (mA)

0.0

0.5

1.0

1.5

2.0

2.5

048121620

= 25 °C

Forward current (mA)

Luminous intensity normalised at

10 mA

-40-20 0 20406080100

Ambient temperature (°C)

Permissible forward current (mA)

0.0

0.5

1.0

1.5

2.0

2.5

-40-200 20406080100

Ambient temperature (°C)

Luminous intensity normalised at

Ta = 25 °C

Forward Current vs.

Forward Voltage Luminous Intensity vs.

Forward Current Forward Current Derating Curve Luminous Intensity vs.

Ambient Temperature

Kingbright

PSC05-11SURKWA

PACKING & LABEL SPECIFICATIONS

THROUGH HOLE DISPLAY MOUNTING METHOD

Lead Forming

Do not bend the component leads by hand without

proper tools. The leads should be bent by clinching the

upper part of the lead firmly such that the bending force

is not exerted on the plastic body.

Installation

1. The installation process should not apply stress to the lead terminals.

2. When inserting for assembly, ensure the terminal pitch matches the substrate board's hole pitch to prevent spreading or pinching

the lead terminals. (Fig.1)

3. The component shall be placed at least 5mm from edge of PCB to avoid damage caused excessive heat during

wave soldering.(Fig.2)

CIRCUIT DESIGN NOTES

1. Protective current-limiting resistors may be necessary to operate the LEDs within the specified range.

2. LEDs mounted in parallel should each be placed in series with its own current-limiting resistor.(Fig.3)

3. The driving circuit should be designed to protect the LED against reverse

voltages and transient voltage spikes when the circuit is powered up

or shut down.

4. The safe operating current should be chosen after considering the

maximum ambient temperature of the operating environment.

5. Prolonged reverse bias should be avoided, as it could cause metal

migration, leading to an increase in leakage current or causing

a short circuit.

PRECAUTIONARY NOTES

1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.

2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to

the latest datasheet for the updated specifications.

3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If

customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.

4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening

liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.

5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.

6. All design applications should refer to Kingbright application notes available at http://www.kingbright.com/application_notes

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