October 2009 I
© 2009 Actel Corporation
ProASIC3 Flash Family FPGAs
with Optional Soft ARM® Support
Features and Benefits
High Capacity
15 k to 1 M System Gates
Up to 144 kbits of True Dual-Port SRAM
Up to 300 User I/Os
Reprogrammable Flash Technology
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
Live at Power-Up (LAPU) Level 0 Support
Single-Chip Solution
Retains Programmed Design when Powered Off
High Performance
350 MHz System Performance
3.3 V, 66 MHz 64-Bit PCI
In-System Programming (ISP) and Security
Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption (except ARM-enabled ProASIC®3
devices) via JTAG (IEEE 1532–compliant)
® to Secure FPGA Contents
Low Power
Core Voltage for Low Power
Support for 1.5 V-Only Systems
Low-Impedance Flash Switches
High-Performance Routing Hierarchy
Segmented, Hierarchical Routing and Clock Structure
Advanced I/O
700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
Bank-Selectable I/O Voltages—up to 4 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X and LVCMOS
2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS (A3P250 and above)
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Weak Pull-Up/-Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages across the ProASIC3 Family
Clock Conditioning Circuit (CCC) and PLL
Six CCC Blocks, One with an Integrated PLL
Configurable Phase-Shift, Multiply/Divide, Delay
Capabilities and External Feedback
Wide Input Frequency Range (1.5 MHz to 350 MHz)
Embedded Memory
1 kbit of FlashROM User Nonvolatile Memory
SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)
True Dual-Port SRAM (except ×18)
ARM Processor Support in ProASIC3 FPGAs
M1 ProASIC3 Devices—ARM®Cortex™-M1 Soft Processor
Available with or without Debug
A3P015 and A3P030 devices do not support this feature. Supported only by A3P015 and A3P030 devices.
Table 1 • ProASIC3 Product Family
ProASIC3 Devices A3P015 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000
Cortex-M1 Devices 1M1A3P250 M1A3P400 M1A3P600 M1A3P1000
System Gates 15 k 30 k 60 k 125 k 250 k 400 k 600 k 1 M
Typical Equivalent Macrocells 128 256 512 1,024 2,048
VersaTiles (D-flip-flops) 384 768 1,536 3,072 6,144 9,216 13,824 24,576
RAM kbits (1,024 bits) 18 36 36 54 108 144
4,608-Bit Blocks ––488122432
FlashROM Bits 1 k 1 k 1 k 1 k 1 k 1 k 1 k 1 k
Secure (AES) ISP 2 Yes Yes Yes Yes Yes Yes
Integrated PLL in CCCs ––111 1 1 1
VersaNet Globals 36 6 18 18 18 18 18 18
I/O Banks 22224 4 4 4
Maximum User I/Os 49 81 96 133 157 194 235 300
Package Pins
QN68 QN48, QN68,
QN132 5
FG144/256 5PQ208
1. Refer to the Cortex-M1 product brief for more information.
2. AES is not available for ARM-enabled ProASIC3 devices.
3. Six chip (main) and three quadrant global networks are available for A3P060 and above.
4. For higher densities and support of additional features, refer to the ProASIC3E Flash Family FPGAs handbook.
5. The M1A3P250 device does not support this package.
II v1.3
I/Os Per Package 1
Devices A3P015 A3P030 A3P060 A3P125 A3P250 3A3P400 3A3P600 A3P1000
Devices M1A3P250 3,6 M1A3P400 3M1A3P600 M1A3P1000
I/O Type
Single-Ended I/O
Single-Ended I/O
Single-Ended I/O
Single-Ended I/O
Single-Ended I/O2
Differential I/O Pairs
Single-Ended I/O2
Differential I/O Pairs
Single-Ended I/O2
Differential I/O Pairs
Single-Ended I/O2
Differential I/O Pairs
QN48 34
QN68 49 49 –– –––
QN132 8180848719
CS121 96 ––––––
VQ100 77 71 71 68 13
TQ144 91 100 ––––––
PQ208 133 151 34 151 34 154 35 154 35
FG144 96 97 97 24 97 25 97 25 97 25
FG256 157 38 178 38 177 43 177 44
FG484 194 38 235 60 300 74
1. When considering migrating your design to a lower- or higher-density device, refer to the ProASIC3 Flash Family FPGAs
handbook to ensure complying with design and board migration requirements.
2. Each used differential I/O pair reduces the number of single-ended I/Os available by two.
3. For A3P250 and A3P400 devices, the maximum number of LVPECL pairs in east and west banks cannot exceed 15. Refer
to the ProASIC3 Flash Family FPGAs handbook for position assignments of the 15 LVPECL pairs.
4. FG256 and FG484 are footprint-compatible packages.
5. "G" indicates RoHS-compliant packages. Refer to "ProASIC3 Ordering Information" on page III for the location of the
"G" in the part number.
6. The M1A3P250 device does not support FG256 or QN132 packages.
Table 2 • ProASIC3 FPGAs Package Sizes Dimensions
Package QN48 CS121 QN68 QN132 VQ100 TQ144 PQ208 FG144 FG256 FG484
Length × Width
6 × 6 6 × 6 8 × 8 8 × 8 14 × 14 20 × 20 28 × 28 13 × 13 17 × 17 23 × 23
Nominal Area
36 36 64 64 196 400 784 169 289 529
Pitch (mm) 0.4 0.5 0.4 0.5 0.5 0.5 0.5 1.0 1.0 1.0
Height (mm) 0.90 0.99 0.90 0.75 1.00 1.40 3.40 1.45 1.60 2.23
ProASIC3 Flash Family FPGAs
v1.3 III
ProASIC3 Ordering Information
Speed Grade
Blank = Standard
1 = 15% Faster than Standard
2 = 25% Faster than Standard
A3P1000 FG
Part Number
ProASIC3 Devices
Package Type
VQ =Very Thin Quad Flat Pack (0.5 mm pitch)
QN =Quad Flat Pack No Leads (0.4 mm and 0.5 mm pitches)
TQ =Thin Quad Flat Pack (0.5 mm pitch)
144 I
Package Lead Count
Lead-Free Packaging
Application (Temperature Range)
Blank = Commercial (0°C to +70°C Ambient Temperature)
I = Industrial (40°C to +85°C Ambient Temperature)
Blank = Standard Packaging
G= RoHS-Compliant (Green) Packaging (some packages also halogen-free)
PP = Pre-Production
ES = Engineering Sample (Room Temperature Only)
30,000 System Gates
A3P030 =
15,000 System Gates
A3P015 =
60,000 System Gates
A3P060 =
125,000 System Gates
A3P125 =
250,000 System Gates
A3P250 =
400,000 System Gates
A3P400 =
600,000 System Gates
A3P600 =
1,000,000 System Gates
A3P1000 =
ProASIC3 Devices with Cortex-M1
250,000 System Gates
M1A3P250 =
400,000 System Gates
M1A3P400 =
600,000 System Gates
M1A3P600 =
1,000,000 System Gates
M1A3P1000 =
PQ =Plastic Quad Flat Pack (0.5 mm pitch)
FG =Fine Pitch Ball Grid Array (1.0 mm pitch)
CS =Chip Scale Package (0.5 mm pitch)
IV v1.3
Temperature Grade Offerings
Speed Grade and Temperature Grade Matrix
References made to ProASIC3 devices also apply to ARM-enabled ProASIC3 devices. The ARM-enabled part numbers start
with M1 (Cortex-M1).
Contact your local Actel representative for device availability: http://www.actel.com/contact/default.aspx.
A3P015 and A3P030
The A3P015 and A3P030 are architecturally compatible; there are no RAM or PLL features.
Package A3P015 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000
Cortex-M1 Devices M1A3P250 M1A3P400 M1A3P600 M1A3P1000
QN48 C, I–––
QN68 C, I C, I
QN132 C, I C, I C, I C, I
CS121 C, I–––
VQ100 C, I C, I C, I C, I
TQ144 C, I C, I
PQ208 C, I C, I C, I C, I C, I
FG144 C, I C, I C, I C, I C, I C, I
FG256 C, I C, I C, I C, I
FG484 C, I C, I C, I
1. C = Commercial temperature range: 0°C to 70°C ambient temperature
2. I = Industrial temperature range: –40°C to 85°C ambient temperature
Temperature Grade Std. –1 –2
1. C = Commercial temperature range: 0°C to 70°C ambient temperature
2. I = Industrial temperature range: –40°C to 85°C ambient temperature
v1.3 1-1
1 – ProASIC3 Device Family Overview
General Description
ProASIC3, the third-generation family of Actel flash FPGAs, offers performance, density, and
features beyond those of the ProASICPLUS® family. Nonvolatile flash technology gives ProASIC3
devices the advantage of being a secure, low-power, single-chip solution that is live at power-up
(LAPU). ProASIC3 is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost.
These features enable designers to create high-density systems using existing ASIC or FPGA design
flows and tools.
ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as
clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and
A3P030 devices have no PLL or RAM support. ProASIC3 devices have up to 1 million system gates,
supported with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os.
ProASIC3 devices support the ARM Cortex-M1 processor. The ARM-enabled devices have Actel
ordering numbers that begin with M1A3P (Cortex-M1) and do not support AES decryption.
Flash Advantages
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike
SRAM-based FPGAs, flash-based ProASIC3 devices allow all functionality to be live at power-up; no
external boot PROM is required. On-board security mechanisms prevent access to all the
programming information and enable secure remote updates of the FPGA logic. Designers can
perform secure remote in-system reprogramming to support future design iterations and field
upgrades with confidence that valuable intellectual property (IP) cannot be compromised or
copied. Secure ISP can be performed using the industry-standard AES algorithm. The ProASIC3
family device architecture mitigates the need for ASIC migration at higher user volumes. This
makes the ProASIC3 family a cost-effective ASIC replacement solution, especially for applications in
the consumer, networking/ communications, computing, and avionics markets.
The nonvolatile, flash-based ProASIC3 devices do not require a boot PROM, so there is no
vulnerable external bitstream that can be easily copied. ProASIC3 devices incorporate FlashLock,
which provides a unique combination of reprogrammability and design security without external
overhead, advantages that only an FPGA with nonvolatile flash programming can offer.
ProASIC3 devices utilize a 128-bit flash-based lock and a separate AES key to secure programmed
intellectual property and configuration data. In addition, all FlashROM data in ProASIC3 devices
can be encrypted prior to loading, using the industry-leading AES-128 (FIPS192) bit block cipher
encryption standard. The AES standard was adopted by the National Institute of Standards and
Technology (NIST) in 2000 and replaces the 1977 DES standard. ProASIC3 devices have a built-in AES
decryption engine and a flash-based AES key that make them the most comprehensive
programmable logic device security solution available today. ProASIC3 devices with AES-based
security allow for secure, remote field updates over public networks such as the Internet, and
ensure that valuable IP remains out of the hands of system overbuilders, system cloners, and IP
thieves. The contents of a programmed ProASIC3 device cannot be read back, although secure
design verification is possible.
ARM-enabled ProASIC3 devices do not support user-controlled AES security mechanisms. Since the
ARM core must be protected at all times, AES encryption is always on for the core logic, so
bitstreams are always encrypted. There is no user access to encryption for the FlashROM
programming data.
ProASIC3 Device Family Overview
1-2 v1.3
Security, built into the FPGA fabric, is an inherent component of the ProASIC3 family. The flash cells
are located beneath seven metal layers, and many device design and layout techniques have been
used to make invasive attacks extremely difficult. The ProASIC3 family, with FlashLock and AES
security, is unique in being highly resistant to both invasive and noninvasive attacks. Your valuable
IP is protected and secure, making remote ISP possible. A ProASIC3 device provides the most
impenetrable security for programmable logic designs.
Single Chip
Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed,
the configuration data is an inherent part of the FPGA structure, and no external configuration
data needs to be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based
ProASIC3 FPGAs do not require system configuration components such as EEPROMs or
microcontrollers to load device configuration data. This reduces bill-of-materials costs and PCB
area, and increases security and system reliability.
Live at Power-Up
The Actel flash-based ProASIC3 devices support Level 0 of the LAPU classification standard. This
feature helps in system component initialization, execution of critical tasks before the processor
wakes up, setup and configuration of memory blocks, clock generation, and bus activity
management. The LAPU feature of flash-based ProASIC3 devices greatly simplifies total system
design and reduces total system cost, often eliminating the need for CPLDs and clock generation
PLLs that are used for these purposes in a system. In addition, glitches and brownouts in system
power will not corrupt the ProASIC3 device's flash configuration, and unlike SRAM-based FPGAs,
the device will not have to be reloaded when system power is restored. This enables the reduction
or complete removal of the configuration PROM, expensive voltage monitor, brownout detection,
and clock generator devices from the PCB design. Flash-based ProASIC3 devices simplify total
system design and reduce cost and design risk while increasing system reliability and improving
system initialization time.
Firm Errors
Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere,
strike a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the
configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way.
These errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be
a complete system failure. Firm errors do not exist in the configuration memory of ProASIC3 flash-
based FPGAs. Once it is programmed, the flash cell configuration element of ProASIC3 FPGAs
cannot be altered by high-energy neutrons and is therefore immune to them. Recoverable (or soft)
errors occur in the user data SRAM of all FPGA devices. These can easily be mitigated by using error
detection and correction (EDAC) circuitry built into the FPGA fabric.
Low Power
Flash-based ProASIC3 devices exhibit power characteristics similar to an ASIC, making them an ideal
choice for power-sensitive applications. ProASIC3 devices have only a very limited power-on current
surge and no high-current transition period, both of which occur on many FPGAs.
ProASIC3 devices also have low dynamic power consumption to further maximize power savings.
ProASIC3 Device Family Overview
v1.3 1-3
Advanced Flash Technology
The ProASIC3 family offers many benefits, including nonvolatility and reprogrammability through
an advanced flash-based, 130-nm LVCMOS process with seven layers of metal. Standard CMOS
design techniques are used to implement logic and control functions. The combination of fine
granularity, enhanced flexible routing resources, and abundant flash switches allows for very high
logic utilization without compromising device routability or performance. Logic functions within
the device are interconnected through a four-level routing hierarchy.
Advanced Architecture
The proprietary ProASIC3 architecture provides granularity comparable to standard-cell ASICs. The
ProASIC3 device consists of five distinct and programmable architectural features (Figure 1-1 and
Figure 1-2 on page 1-4):
FPGA VersaTiles
Dedicated FlashROM
Dedicated SRAM/FIFO memory
Extensive CCCs and PLLs
Advanced I/O structure
The A3P015 and A3P030 do not support PLL or SRAM.
*Not supported by A3P015 and A3P030 devices
Figure 1-1 • ProASIC3 Device Architecture Overview with Two I/O Banks (A3P015, A3P030, A3P060, and
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block*
User Nonvolatile
FlashROM Charge Pumps
Bank 0
Bank 1Bank 1
Bank 0Bank 0
Bank 1
ProASIC3 Device Family Overview
1-4 v1.3
The FPGA core consists of a sea of VersaTiles. Each VersaTile can be configured as a three-input
logic function, a D-flip-flop (with or without enable), or a latch by programming the appropriate
flash switch interconnections. The versatility of the ProASIC3 core tile as either a three-input
lookup table (LUT) equivalent or as a D-flip-flop/latch with enable allows for efficient use of the
FPGA fabric. The VersaTile capability is unique to the Actel ProASIC family of third-generation
architecture flash FPGAs. VersaTiles are connected with any of the four levels of routing hierarchy.
Flash switches are distributed throughout the device to provide nonvolatile, reconfigurable
interconnect programming. Maximum core utilization is possible for virtually any design.
In addition, extensive on-chip programming circuitry allows for rapid, single-voltage (3.3 V)
programming of ProASIC3 devices via an IEEE 1532 JTAG interface.
The ProASIC3 core consists of VersaTiles, which have been enhanced beyond the ProASICPLUS® core
tiles. The ProASIC3 VersaTile supports the following:
All 3-input logic functions—LUT-3 equivalent
Latch with clear or set
D-flip-flop with clear or set
Enable D-flip-flop with clear or set
Figure 1-2 • ProASIC3 Device Architecture Overview with Four I/O Banks (A3P250, A3P600, and A3P1000)
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block
(A3P600 and A3P1000)
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block
User Nonvolatile
FlashROM Charge Pumps
Bank 0
Bank 3Bank 3
Bank 1Bank 1
Bank 2
ProASIC3 Device Family Overview
v1.3 1-5
Refer to Figure 1-3 for VersaTile configurations.
User Nonvolatile FlashROM
Actel ProASIC3 devices have 1 kbit of on-chip, user-accessible, nonvolatile FlashROM. The FlashROM
can be used in diverse system applications:
Internet protocol addressing (wireless or fixed)
System calibration settings
Device serialization and/or inventory control
Subscription-based business models (for example, set-top boxes)
Secure key storage for secure communications algorithms
Asset management/tracking
Date stamping
Version management
The FlashROM is written using the standard ProASIC3 IEEE 1532 JTAG programming interface. The
core can be individually programmed (erased and written), and on-chip AES decryption can be used
selectively to securely load data over public networks (except in the A3P015 and A3P030 devices),
as in security keys stored in the FlashROM for a user design.
The FlashROM can be programmed via the JTAG programming interface, and its contents can be
read back either through the JTAG programming interface or via direct FPGA core addressing. Note
that the FlashROM can only be programmed from the JTAG interface and cannot be programmed
from the internal logic array.
The FlashROM is programmed as 8 banks of 128 bits; however, reading is performed on a byte-by-
byte basis using a synchronous interface. A 7-bit address from the FPGA core defines which of the 8
banks and which of the 16 bytes within that bank are being read. The three most significant bits
(MSBs) of the FlashROM address determine the bank, and the four least significant bits (LSBs) of
the FlashROM address define the byte.
The Actel ProASIC3 development software solutions, Libero® Integrated Design Environment (IDE)
and Designer, have extensive support for the FlashROM. One such feature is auto-generation of
sequential programming files for applications requiring a unique serial number in each part.
Another feature allows the inclusion of static data for system version control. Data for the
FlashROM can be generated quickly and easily using Actel Libero IDE and Designer software tools.
Comprehensive programming file support is also included to allow for easy programming of large
numbers of parts with differing FlashROM contents.
ProASIC3 devices (except the A3P015 and A3P030 devices) have embedded SRAM blocks along their
north and south sides. Each variable-aspect-ratio SRAM block is 4,608 bits in size. Available memory
configurations are 256×18, 519, 1k×4, 2k×2, and 4k×1 bits. The individual blocks have
independent read and write ports that can be configured with different bit widths on each port.
For example, data can be sent through a 4-bit port and read as a single bitstream. The embedded
SRAM blocks can be initialized via the device JTAG port (ROM emulation mode) using the UJTAG
macro (except in A3P015 and A3P030 devices).
Figure 1-3 • VersaTile Configurations
Data Y
Data Y
LUT-3 Equivalent D-Flip-Flop with Clear or Set Enable D-Flip-Flop with Clear or Set
ProASIC3 Device Family Overview
1-6 v1.3
In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the
SRAM block to be configured as a synchronous FIFO without using additional core VersaTiles. The
FIFO width and depth are programmable. The FIFO also features programmable Almost Empty
(AEMPTY) and Almost Full (AFULL) flags in addition to the normal Empty and Full flags. The
embedded FIFO control unit contains the counters necessary for generation of the read and write
address pointers. The embedded SRAM/FIFO blocks can be cascaded to create larger configurations.
ProASIC3 devices provide designers with very flexible clock conditioning capabilities. Each member
of the ProASIC3 family contains six CCCs. One CCC (center west side) has a PLL. The A3P015 and
A3P030 devices do not have a PLL.
The six CCC blocks are located at the four corners and the centers of the east and west sides.
All six CCC blocks are usable; the four corner CCCs and the east CCC allow simple clock delay
operations as well as clock spine access.
The inputs of the six CCC blocks are accessible from the FPGA core or from one of several inputs
located near the CCC that have dedicated connections to the CCC block.
The CCC block has these key features:
Wide input frequency range (fIN_CCC) = 1.5 MHz to 350 MHz
Output frequency range (fOUT_CCC) = 0.75 MHz to 350 MHz
Clock delay adjustment via programmable and fixed delays from –7.56 ns to +11.12 ns
2 programmable delay types for clock skew minimization
Clock frequency synthesis (for PLL only)
Additional CCC specifications:
Internal phase shift = 0°, 90°, 180°, and 270°. Output phase shift depends on the output
divider configuration (for PLL only).
Output duty cycle = 50% ± 1.5% or better (for PLL only)
Low output jitter: worst case < 2.5% × clock period peak-to-peak period jitter when single
global network used (for PLL only)
Maximum acquisition time = 300 µs (for PLL only)
Low power consumption of 5 mW
Exceptional tolerance to input period jitter— allowable input jitter is up to 1.5 ns (for PLL
Four precise phases; maximum misalignment between adjacent phases of 40 ps × (350 MHz /
fOUT_CCC) (for PLL only)
Global Clocking
ProASIC3 devices have extensive support for multiple clocking domains. In addition to the CCC and
PLL support described above, there is a comprehensive global clock distribution network.
Each VersaTile input and output port has access to nine VersaNets: six chip (main) and three
quadrant global networks. The VersaNets can be driven by the CCC or directly accessed from the
core via multiplexers (MUXes). The VersaNets can be used to distribute low-skew clock signals or for
rapid distribution of high fanout nets.
ProASIC3 Device Family Overview
v1.3 1-7
I/Os with Advanced I/O Standards
The ProASIC3 family of FPGAs features a flexible I/O structure, supporting a range of voltages
(1.5 V, 1.8 V, 2.5 V, and 3.3 V). ProASIC3 FPGAs support many different I/O standards—single-ended
and differential.
The I/Os are organized into banks, with two or four banks per device. The configuration of these
banks determines the I/O standards supported (Table 1-1).
Each I/O module contains several input, output, and enable registers. These registers allow the
implementation of the following:
Single-Data-Rate applications
Double-Data-Rate applications—DDR LVDS, B-LVDS, and M-LVDS I/Os for point-to-point
ProASIC3 banks for the A3P250 device and above support LVPECL, LVDS, B-LVDS and M-LVDS.
B-LVDS and M-LVDS can support up to 20 loads.
Hot-swap (also called hot-plug, or hot-insertion) is the operation of hot-insertion or hot-removal of
a card in a powered-up system.
Cold-sparing (also called cold-swap) refers to the ability of a device to leave system data
undisturbed when the system is powered up, while the component itself is powered down, or
when power supplies are floating.
Wide Range I/O Support
Actel ProASIC3 devices support JEDEC-defined wide range I/O operation. ProASIC3 supports the
JESD8-B specification, covering both 3 V and 3.3 V supplies, for an effective operating range of
2.7 V to 3.6 V.
Wider I/O range means designers can eliminate power supplies or power conditioning components
from the board or move to less costly components with greater tolerances. Wide range eases I/O
bank management and provides enhanced protection from system voltage spikes, while providing
the flexibility to easily run custom voltage applications.
Table 1-1 • I/O Standards Supported
I/O Bank Type Device and Bank Location
I/O Standards Supported
Advanced East and west Banks of A3P250 and
larger devices
Standard Plus North and south banks of A3P250 and
larger devices
All banks of A3P060 and A3P125
Not supported
Standard All banks of A3P015 and A3P030 Not
Not supported
ProASIC3 Device Family Overview
1-8 v1.3
Part Number and Revision Date
Part Number 51700097-001-4
Revised October 2009
List of Changes
The following table lists critical changes that were made in the current version of the document.
Previous Version Changes in Current Version (v1.3) Page
(August 2009)
The CS121 package was added to Table 1 · ProASIC3 Product Family, the "I/Os
Per Package 1" table, Table 2 · ProASIC3 FPGAs Package Sizes Dimensions,
"ProASIC3 Ordering Information", and the "Temperature Grade Offerings"
"ProASIC3 Ordering Information" was revised to include the face that some
RoHS compliant packages are halogen-free.
(February 2009)
All references to M7 devices (CoreMP7) and speed grade –F were removed from
this document.
Table 1-1 · I/O Standards Supported is new. 1-7
The "I/Os with Advanced I/O Standards" section was revised to add definitions
of hot-swap and cold-sparing.
(February 2008)
The "Advanced I/O" section was revised to add a bullet regarding wide range
power supply voltage support.
The Table 1 · ProASIC3 Product Family was updated to include a value for
typical equivalent macrocells for A3P250.
The QN48 package was added to the following tables:
"ProASIC3 Product Family"
"I/Os Per Package 1"
"ProASIC3 FPGAs Package Sizes Dimensions"
"Temperature Grade Offerings"
The number of singled-ended I/Os for QN68 was added to the "I/Os Per
Package 1" table.
The "Wide Range I/O Support" section is new. 1-7
51700097-001-1 This document was divided into two sections and given a version number,
starting at v1.0. The first section of the document includes features, benefits,
ordering information, and temperature and speed grade offerings. The second
section is a device family overview.
(January 2008)
This document was updated to include A3P015 device information. QN68 is a
new package that was added because it is offered in the A3P015. The following
sections were updated:
"Features and Benefits"
"ProASIC3 Ordering Information"
"Temperature Grade Offerings"
"ProASIC3 Product Family"
"A3P015 and A3P030" note
"Introduction and Overview"
The "ProASIC3 FPGAs Package Sizes Dimensions" table is new. II
ProASIC3 Device Family Overview
v1.3 1-9
In the "ProASIC3 Ordering Information", the QN package measurements were
updated to include both 0.4 mm and 0.5 mm.
In the "General Description" section, the number of I/Os was updated from 288
to 300.
(July 2007)
This document was previously in datasheet v2.2. As a result of moving to the
handbook format, Actel has restarted the version numbers. The new version
number is 51700097-001-0.
(May 2007)
The M7 and M1 device part numbers have been updated in Table 1 ProASIC3
Product Family, "I/Os Per Package", "Automotive ProASIC3 Ordering
Information", "Temperature Grade Offerings", and "Speed Grade and
Temperature Grade Matrix".
i, ii, iii,
iii, iv
The words "ambient temperature" were added to the temperature range in
the "Automotive ProASIC3 Ordering Information", "Temperature Grade
Offerings", and "Speed Grade and Temperature Grade Matrix" sections.
iii, iv
(April 2007)
In the "Clock Conditioning Circuit (CCC) and PLL" section, the Wide Input
Frequency Range (1.5 MHz to 200 MHz) was changed to (1.5 MHz to 350 MHz).
The "Clock Conditioning Circuit (CCC) and PLL" section was updated. i
In the "I/Os Per Package" section, the A3P030, A3P060, A3P125, ACP250, and
A3P600 device I/Os were updated.
Advance v0.7
(January 2007)
In the "Packaging Tables", Ambient was deleted. ii
Ambient was deleted from the "Speed Grade and Temperature Grade Matrix". iv
Advance v0.6
(April 2006)
In the "I/Os Per Package" table, the I/O numbers were added for A3P060,
A3P125, and A3P250. The A3P030-VQ100 I/O was changed from 79 to 77.
Advance v0.5
(January 2006)
B-LVDS and M-LDVS are new I/O standards added to the datasheet. N/A
The term flow-through was changed to pass-through. N/A
Table 1 was updated to include the QN132. ii
The "I/Os Per Package" table was updated with the QN132. The footnotes were
also updated. The A3P400-FG144 I/O count was updated.
"Automotive ProASIC3 Ordering Information" was updated with the QN132. iii
"Temperature Grade Offerings" was updated with the QN132. iii
Advance v0.4
(November 2005)
The "I/Os Per Package" table was updated for the following devices and
Device Package
A3P250/M7ACP250 VQ100
A3P250/M7ACP250 FG144
A3P1000 FG256
Advance v0.3 M7 device information is new. N/A
The I/O counts in the "I/Os Per Package" table were updated. ii
Advance v0.2 The "I/Os Per Package" table was updated. ii
Previous Version Changes in Current Version (v1.3) Page
ProASIC3 Device Family Overview
1-10 v1.3
Datasheet Categories
In order to provide the latest information to designers, some datasheets are published before data
has been fully characterized. Datasheets are designated as "Product Brief," "Advance,"
"Preliminary," and "Production." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains
general product information. This document gives an overview of specific device and family
This version contains initial estimated information based on simulation, other products, devices, or
speed grades. This information can be used as estimates, but not for production. This label only
applies to the DC and Switching Characteristics chapter of the datasheet and will only be used
when the data has not been fully characterized.
The datasheet contains information based on simulation and/or initial characterization. The
information is believed to be correct, but changes are possible.
Unmarked (production)
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations
(EAR). They could require an approved export license prior to export from the United States. An
export includes release of product or disclosure of technology to a foreign national inside or
outside the United States.
Actel Safety Critical, Life Support, and High-Reliability
Applications Policy
The Actel products described in this advance status document may not have completed Actel’s
qualification process. Actel may amend or enhance products during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the
responsibility of each customer to ensure the fitness of any Actel product (but especially a new
product) for a particular purpose, including appropriateness for safety-critical, life-support, and
other high-reliability applications. Consult Actel’s Terms and Conditions for specific liability
exclusions relating to life-support applications. A reliability report covering all of Actel’s products is
available on the Actel website at http://www.actel.com/documents/ORT_Report.pdf. Actel also
offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your
local Actel sales office for additional reliability information.
v1.4 2-1
2 – ProASIC3 DC and Switching Characteristics
General Specifications
Operating Conditions
Stresses beyond those listed in Table 2-1 may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings are stress ratings only; functional operation of the device at these or
any other conditions beyond those listed under the Recommended Operating Conditions specified
in Table 2-2 on page 2-2 is not implied.
Table 2-1 • Absolute Maximum Ratings
Symbol Parameter Limits Units
VCC DC core supply voltage –0.3 to 1.65 V
VJTAG JTAG DC voltage –0.3 to 3.75 V
VPUMP Programming voltage –0.3 to 3.75 V
VCCPLL Analog power supply (PLL) –0.3 to 1.65 V
VCCI DC I/O output buffer supply voltage –0.3 to 3.75 V
VMV DC I/O input buffer supply voltage –0.3 to 3.75 V
VI I/O input voltage –0.3 V to 3.6 V
(when I/O hot insertion mode is enabled)
–0.3 V to (VCCI + 1 V) or 3.6 V, whichever voltage is lower
(when I/O hot-insertion mode is disabled)
TSTG 2Storage temperature –65 to +150 °C
TJ2Junction temperature +125 °C
1. The device should be operated within the limits specified by the datasheet. During transitions, the input
signal may undershoot or overshoot according to the limits shown in Table 2-4 on page 2-3.
2. For flash programming and retention maximum limits, refer to Table 2-3 on page 2-2, and for
recommended operating limits, refer to Table 2-2 on page 2-2.
ProASIC3 DC and Switching Characteristics
2-2 v1.4
Table 2-2 • Recommended Operating Conditions 1,2
Symbol Parameter Commercial Industrial Units
TAAmbient temperature 0 to +70 -40 to +85 °C
TJJunction temperature 0 to 85 -40 to 100
VCC31.5 V DC core supply voltage 1.425 to 1.575 1.425 to 1.575 V
VJTAG JTAG DC voltage 1.4 to 3.6 1.4 to 3.6 V
VPUMP Programming voltage Programming Mode 3.0 to 3.6 3.0 to 3.6 V
Operation 4 0 to 3.6 0 to 3.6 V
VCCPLL Analog power supply (PLL) 1.4 to 1.6 1.4 to 1.6 V
VCCI and VMV 1.5 V DC supply voltage 1.425 to 1.575 1.425 to 1.575 V
1.8 V DC supply voltage 1.7 to 1.9 1.7 to 1.9 V
2.5 V DC supply voltage 2.3 to 2.7 2.3 to 2.7 V
3.3 V DC supply voltage 2.7 to 3.6 2.7 to 3.6 V
3.3 V wide range DC supply voltage 5 3.0 to 3.6 3.0 to 3.6 V
LVDS/B-LVDS/M-LVDS differential I/O 2.375 to 2.625 2.375 to 2.625 V
LVPECL differential I/O 3.0 to 3.6 3.0 to 3.6 V
1. All parameters representing voltages are measured with respect to GND unless otherwise specified.
2. To ensure targeted reliability standards are met across ambient and junction operating temperatures, Actel
recommends that the user follow best design practices using Actel’s timing and power simulation tools.
3. The ranges given here are for power supplies only. The recommended input voltage ranges specific to each
I/O standard are given in Table 2-18 on page 2-18. VMV and VCCI should be at the same voltage within a
given I/O bank.
4. VPUMP can be left floating during operation (not programming mode).
5. 3.3 V wide range is compliant to the JDEC8b specification and supports 3.0 V VCCI operation.
Table 2-3 • Flash Programming Limits – Retention, Storage and Operating Temperature1
Product Grade
Program Retention
Maximum Storage
Temperature TSTG (°C) 2
Maximum Operating
Junction Temperature TJ (°C) 2
Commercial 500 20 years 110 100
Industrial 500 20 years 110 100
1. This is a stress rating only; functional operation at any condition other than those indicated is not implied.
2. These limits apply for program/data retention only. Refer to Table 2-1 on page 2-1 and Table 2-2 for device
operating conditions and absolute limits.
ProASIC3 DC and Switching Characteristics
v1.4 2-3
I/O Power-Up and Supply Voltage Thresholds for Power-On Reset
(Commercial and Industrial)
Sophisticated power-up management circuitry is designed into every ProASIC®3 device. These
circuits ensure easy transition from the powered-off state to the powered-up state of the device.
The many different supplies can power up in any sequence with minimized current spikes or surges.
In addition, the I/O will be in a known state through the power-up sequence. The basic principle is
shown in Figure 2-1 on page 2-4.
There are five regions to consider during power-up.
ProASIC3 I/Os are activated only if ALL of the following three conditions are met:
1. VCC and VCCI are above the minimum specified trip points (Figure 2-1 on page 2-4).
2. VCCI > VCC – 0.75 V (typical)
3. Chip is in the operating mode.
VCCI Trip Point:
Ramping up: 0.6 V < trip_point_up < 1.2 V
Ramping down: 0.5 V < trip_point_down < 1.1 V
VCC Trip Point:
Ramping up: 0.6 V < trip_point_up < 1.1 V
Ramping down: 0.5 V < trip_point_down < 1 V
VCC and VCCI ramp-up trip points are about 100 mV higher than ramp-down trip points. This
specifically built-in hysteresis prevents undesirable power-up oscillations and current surges. Note
the following:
During programming, I/Os become tristated and weakly pulled up to VCCI.
JTAG supply, PLL power supplies, and charge pump VPUMP supply have no influence on I/O
PLL Behavior at Brownout Condition
Actel recommends using monotonic power supplies or voltage regulators to ensure proper power-
up behavior. Power ramp-up should be monotonic at least until VCC and VCCPLLX exceed brownout
activation levels. The VCC activation level is specified as 1.1 V worst-case (see Figure 2-1 on page 2-4
for more details).
When PLL power supply voltage and/or VCC levels drop below the VCC brownout levels (0.75 V ±
0.25 V), the PLL output lock signal goes low and/or the output clock is lost. Refer to the
Table 2-4 • Overshoot and Undershoot Limits 1
Average VCCI–GND Overshoot or Undershoot
Duration as a Percentage of Clock Cycle2Maximum Overshoot/
2.7 V or less 10% 1.4 V
5% 1.49 V
3 V 10% 1.1 V
5% 1.19 V
3.3 V 10% 0.79 V
5% 0.88 V
3.6 V 10% 0.45 V
5% 0.54 V
1. Based on reliability requirements at 85°C.
2. The duration is allowed at one out of six clock cycles. If the overshoot/undershoot occurs at one out of two
cycles, the maximum overshoot/undershoot has to be reduced by 0.15 V.
3. This table does not provide PCI overshoot/undershoot limits.
ProASIC3 DC and Switching Characteristics
2-4 v1.4
Power-Up/-Down Behavior of Low-Power Flash Devices chapter of the handbook for information
on clock and lock recovery.
Internal Power-Up Activation Sequence
1. Core
2. Input buffers
Output buffers, after 200 ns delay from input buffer activation
Figure 2-1 • I/O State as a Function of VCCI and VCC Voltage Levels
Region 1: I/O buffers are OFF
Region 2: I/O buffers are ON.
I/Os are functional (except differential inputs)
but slower because VCCI/VCC are below
specification. For the same reason, input
buffers do not meet VIH/VIL levels, and
output buffers do not meet VOH/VOL levels.
Min VCCI datasheet specification
voltage at a selected I/O
standard; i.e., 1.425 V or 1.7 V
or 2.3 V or 3.0 V
VCC = 1.425 V
Region 1: I/O Buffers are OFF
Activation trip point:
Va = 0.85 V ± 0.25 V
Deactivation trip point:
Vd = 0.75 V ± 0.25 V
Activation trip point:
Va = 0.9 V ± 0.3 V
Deactivation trip point:
Vd = 0.8 V ± 0.3 V
VCC = 1.575 V
Region 5: I/O buffers are ON
and power supplies are within
I/Os meet the entire datasheet
and timer specifications for
speed, VIH/VIL , VOH/VOL , etc.
Region 4: I/O
buffers are ON.
I/Os are functional
(except differential
but slower because VCCI is
below specification. For the
same reason, input buffers do not
meet VIH/VIL levels, and output
buffers do not meet VOH/VOL levels.
Region 4: I/O
buffers are ON.
I/Os are functional
(except differential inputs)
where VT can be from 0.58 V to 0.9 V (typically 0.75 V)
Region 3: I/O buffers are ON.
I/Os are functional; I/O DC
specifications are met,
but I/Os are slower because
the VCC is below specification.
ProASIC3 DC and Switching Characteristics
v1.4 2-5
Thermal Characteristics
The temperature variable in the Actel Designer software refers to the junction temperature, not
the ambient temperature. This is an important distinction because dynamic and static power
consumption cause the chip junction to be higher than the ambient temperature.
EQ 2-1 can be used to calculate junction temperature.
TJ = Junction Temperature = ΔT + TA
EQ 2-1
TA = Ambient Temperature
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θja * P
θja = Junction-to-ambient of the package. θja numbers are located in Table 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θjc and the junction-to-ambient air thermal
resistivity is θja. The thermal characteristics for θja are shown for two air flow rates. The absolute
maximum junction temperature is 100°C. EQ 2-2 shows a sample calculation of the absolute
maximum power dissipation allowed for a 484-pin FBGA package at commercial temperature and
in still air.
EQ 2-2
Maximum Power Allowed Max. junction temp. (°C) Max. ambient temp. (°C)
--------------------------------------------------------------------------------------------------------------------------------------- 100°C70°C
------------------------------------ 1 . 4 6 3 W
Table 2-5 • Package Thermal Resistivities
Package Type Device Pin Count θjc
UnitsStill Air 200 ft./min. 500 ft./min.
Quad Flat No Lead A3P030 132 0.4 21.4 16.8 15.3 C/W
A3P060 132 0.3 21.2 16.6 15.0 C/W
A3P125 132 0.2 21.1 16.5 14.9 C/W
A3P250 132 0.1 21.0 16.4 14.8 C/W
Very Thin Quad Flat Pack (VQFP) All devices 100 10.0 35.3 29.4 27.1 C/W
Thin Quad Flat Pack (TQFP) All devices 144 11.0 33.5 28.0 25.7 C/W
Plastic Quad Flat Pack (PQFP) All devices 208 8.0 26.1 22.5 20.8 C/W
PQFP with embedded heatspreader All devices 208 3.8 16.2 13.3 11.9 C/W
Fine Pitch Ball Grid Array (FBGA) See note* 144 3.8 26.9 22.9 21.5 C/W
See note* 256 3.8 26.6 22.8 21.5 C/W
See note* 484 3.2 20.5 17.0 15.9 C/W
A3P1000 144 6.3 31.6 26.2 24.2 C/W
A3P1000 256 6.6 28.1 24.4 22.7 C/W
A3P1000 484 8.0 23.3 19.0 16.7 C/W
*This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal
information will be available in future revisions of the datasheet.
ProASIC3 DC and Switching Characteristics
2-6 v1.4
Temperature and Voltage Derating Factors
Calculating Power Dissipation
Quiescent Supply Current
Power per I/O Pin
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays
(normalized to TJ = 70°C, VCC = 1.425 V)
Array Voltage VCC (V)
Junction Temperature (°C)
–40°C 0°C 25°C 70°C 85°C 100°C
1.425 0.88 0.93 0.95 1.00 1.02 1.04
1.500 0.83 0.88 0.90 0.95 0.96 0.98
1.575 0.80 0.84 0.87 0.91 0.93 0.94
Table 2-7 • Quiescent Supply Current Characteristics
A3P015 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000
Typical (25°C) 2 mA 2 mA 2 mA 2 mA 3 mA 3 mA 5 mA 8 mA
Max. (Commercial) 10 mA 10 mA 10 mA 10 mA 20 mA 20 mA 30 mA 50 mA
Max. (Industrial) 15 mA 15 mA 15 mA 15 mA 30 mA 30 mA 45 mA 75 mA
Note: IDD Includes VCC, VPUMP, VCCI, and VMV currents. Values do not include I/O static
contribution, which is shown in Table 2-11 and Table 2-12 on page 2-8.
Table 2-8 • Summary of I/O Input Buffer Power (Per Pin) – Default I/O Software Settings
Applicable to Advanced I/O Banks
Static Power
PDC2 (mW) 1 Dynamic Power PAC9
(µW/MHz) 2
3.3 V LVTTL / 3.3 V LVCMOS 3.3 16.22
3.3 V LVCMOS Wide Range3 3.3 16.22
2.5 V LVCMOS 2.5 5.12
1.8 V LVCMOS 1.8 2.13
1.5 V LVCMOS (JESD8-11) 1.5 1.45
3.3 V PCI 3.3 18.11
3.3 V PCI-X 3.3 18.11
LVDS 2.5 2.26 1.20
LVPECL 3.3 5.72 1.87
1. PDC2 is the static power (where applicable) measured on VMV.
2. PAC9 is the total dynamic power measured on VCC and VMV.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the
JESD8b specification.
ProASIC3 DC and Switching Characteristics
v1.4 2-7
Table 2-9 • Summary of I/O Input Buffer Power (Per Pin) – Default I/O Software Settings
Applicable to Standard Plus I/O Banks
Static Power
PDC2 (mW) 1 Dynamic Power
PAC9 (µW/MHz) 2
3.3 V LVTTL / 3.3 V LVCMOS 3.3 16.23
3.3 V LVCMOS Wide Range33.3 16.23
2.5 V LVCMOS 2.5 5.14
1.8 V LVCMOS 1.8 2.13
1.5 V LVCMOS (JESD8-11) 1.5 1.48
3.3 V PCI 3.3 18.13
3.3 V PCI-X 3.3 18.13
1. PDC2 is the static power (where applicable) measured on VMV.
2. PAC9 is the total dynamic power measured on VCC and VMV.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the
JESD8b specification.
Table 2-10 • Summary of I/O Input Buffer Power (Per Pin) – Default I/O Software Settings
Applicable to Standard I/O Banks
Static Power
PDC2 (mW) 1 Dynamic Power
PAC9 (µW/MHz) 2
3.3 V LVTTL / 3.3 V LVCMOS 3.3 17.24
3.3 V LVCMOS Wide Range33.3 17.24
2.5 V LVCMOS 2.5 5.19
1.8 V LVCMOS 1.8 2.18
1.5 V LVCMOS (JESD8-11) 1.5 1.52
1. PDC2 is the static power (where applicable) measured on VMV.
2. PAC9 is the total dynamic power measured on VCC and VMV.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the
JESD8b specification.