SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Features
Any frequency between 220.000001 MHz and 725 MHz,
accurate to 6 decimal places
LVPECL, LVDS and HCSL output signaling
0.1ps RMS phase jitter (random) for Ethernet applications
Contact SiTime for frequency stability as low as ±10 ppm
Wide temperature range from -40°C to 85°C
Contact SiTime for higher temperature range options
Industry-standard packages: 3.2 x 2.5, 7.0 x 5.0 mm
Contact SiTime for 5.0 x 3.2 mm package
Applications
100 GB Ethernet, SONET, SATA, SAS, Fibre Channel
Telecom, networking, instrumentation, storage, servers
Electrical Characteristics
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output termination show in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter Symbol Min. Typ. Max. Unit Condition
Frequency Range
Output Frequency Range f 220.000001
725 MHz Accurate to 6 decimal places
Frequency Stability
Frequency Stability F_stab -10
+10 ppm Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations.
Contact SiTime for ± 10 ppm.
-20
+20 ppm Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations
-25
+25 ppm
-50
+50 ppm
First Year Aging F_aging1
±1
ppm At 25°C
Temperature Range
Operating Temperature Range T_use -20 +70 °C Extended Commercial
-40 +85 °C Industrial.
Contact SiTime for higher temperature range options
Supply Voltage
Supply Voltage Vdd 2.97 3.30 3.63
V
2.70 3.00 3.30
V
2.52 2.80 3.08
V
2.25 2.50 2.75
V
Input Characteristics
Input Voltage High VIH 70%
Vdd Pin 1, OE
Input Voltage Low VIL
30% Vdd Pin 1, OE
Input Pull-up Impedance Z_in
100 - k Pin 1, OE logic high or logic low
Output Characteristics
Duty Cycle DC 45
55
%
Startup and OE Timing
Startup Time T_start
3.0 ms Measured from the time Vdd reaches its rated minimum
value.
OE Enable/Disable Time T_oe 3.8 µs f = 322.265652 MHz.
Rev 1.0
September 6, 2017 www.sitime.com
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 2 of 12 www.sitime.com
Table 2. Electrical Characteristics – LVPECL Specific
Parameter Symbol Min. Typ. Max. Unit Condition
Current Consumption
Current Consumption Idd
94 mA Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE Disable Supply Current I_OE
63 mA OE = Low
Output Disable Leakage Current I_leak
0.15
µA OE = Low
Maximum Output Current I_driver
32 mA Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage VOH Vdd-1.1
Vdd-0.7
V
See Figure 2
Output Low Voltage VOL Vdd-1.9
Vdd-1.5
V
See Figure 2
Output Differential Voltage Swing V_Swing 1.2 1.6 2.0
V
See Figure 3
Rise/Fall Time Tr, Tf
225 290 ps 20% to 80%, see Figure 2
Jitter
RMS Phase Jitter (random) T_phj
0.225 0.270 ps f = 322.265625 MHz, Integration bandwidth = 12 kHz to 20 MHz, all
Vdds, Includes spurs. 7.0 x 5.0 mm package.
0.225 0.275 ps f = 322.265625 MHz, Integration bandwidth = 12 kHz to 20 MHz, all
Vdds, Includes spurs. 3.2 x 2.5 mm package.
0.1
ps f = 322.265625 MHz, IEEE802.3-2005 10GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, Includes spurs, all
Vdds
RMS Period Jitter[1] T_jitt
1.0 1.6 ps f = 322.265625 MHz, VDD = 3.3V or 2.5V
Notes:
1. Measured according to JESD65B
Table 3. Electrical Characteristics – LVDS Specific
Parameter Symbol Min. Typ. Max. Unit Condition
Current Consumption
Current Consumption Idd 89 mA Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE Disable Supply Current I_OE 67 mA OE = Low
Output Disable Leakage Current I_leak 0.15 µA OE = Low
Output Characteristics
Differential Output Voltage VOD 250 455
mV
See Figure 4
VOD Magnitude Change VOD 50
mV
See Figure 4
Offset Voltage VOS 1.125 1.375
V
See Figure 4
VOS Magnitude Change VOS 50
mV
See Figure 4
Rise/Fall Time Tr, Tf 370 465 ps Measured with 2 pF capacitive loading to GND, 20% to 80%,
see Figure 4
Jitter
RMS Phase Jitter (random) T_phj 0.215 0.265 ps f = 322.265625 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdds, Includes spurs. 7.0 x 5.0 mm package.
0.235 0.282 ps f = 322.265625 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdds, Includes spurs. 3.2 x 2.5 mm package.
0.1
ps f = 322.265625 MHz, IEEE802.3-2005 10GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, Includes spurs, all
Vdds
RMS Period Jitter[2] T_jitt 0.92 1.6 ps f = 322.265625 MHz, VDD = 3.3V or 2.5V
Notes:
2. Measured according to JESD65B
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 3 of 12 www.sitime.com
Table 4. Electrical Characteristics – HCSL Specific
Parameter Symbol Min. Typ. Max. Unit Condition
Current Consumption
Current Consumption Idd 97 mA Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE Disable Supply Current I_OE 63 mA OE = Low
Output Disable Leakage Current I_leak 0.15 µA OE = Low
Maximum Output Current I_driver
35 mA Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage VOH 0.60 0.90
V
See Figure 2
Output Low Voltage VOL -0.05 0.08
V
See Figure 2
Output Differential Voltage Swing V_Swing 1.2 1.4 1.9
V
See Figure 3
Rise/Fall Time Tr, Tf 360 470 ps Measured with 2 pF capacitive loading to GND, 20% to 80%,
see Figure 2
Jitter
RMS Phase Jitter (random) T_phj 0.215 0.270 ps f = 322.265625 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdds, Includes spurs. 7.0 x 5.0 mm package.
0.225 0.275 ps f = 322.265625 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdds, Includes spurs. 3.2 x 2.5 mm package.
0.1 ps f = 322.265625 MHz, IEEE802.3-2005 10GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, Includes spurs,
all Vdds
RMS Period Jitter[3] T_jitt 1.0 1.6 ps f = 322.265625 MHz, VDD = 3.3V or 2.5V
Notes:
3. Measured according to JESD65
Table 5. Pin Description
Pin Map Functionality
1 OE/NC
Output Enable
(OE)
H[4]: specified frequency output
L: output is high impedance
Non Connect
(NC)
H or L or Open: No effect on output frequency or other device
functions
2 NC NA No Connect; Leave it floating or connect to GND for better
heat dissipation
3 GND Power VDD Power Supply Ground
4 OUT+ Output Oscillator output
5 OUT- Output Complementary oscillator output
6 VDD Power Power supply voltage[5]
Notes:
4. In OE mode, a pull-up resistor of 10 k or less is recommended if pin 1 is not externally driven.
5. A capacitor of value 0.1 µF or higher between Vdd and GND is required. An additional 10 µF capacitor
between Vdd and GND is required for the best phase jitter performance
Top View
Figure 1. Pin Assignments
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 4 of 12 www.sitime.com
Table 6. Absolute Maximum Ratings
Attempted operation outside the absolute maximum ratings may cause permanent damage to the part.
Actual performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.
Parameter Min. Max. Unit
VDD -0.5 4.0
V
VIH VDD + 0.3V
V
VIL -0.3
V
Storage Temperature -65 150 ºC
Maximum Junction Temperature 130 ºC
Soldering Temperature (follow standard Pb-free soldering guidelines) 260 ºC
Table 7. Thermal Considerations
[6]
Package
θ
JA, 4 Layer Board (°C/W)
θ
JC, Bottom (°C/W)
3225, 6-pin 80 30
7050, 6-pin 52 19
Notes:
6. Refer to JESD51 for θJA and θJC definitions, and reference layout used to determine the θJA and θJC values in the above table.
Table 8. Maximum Operating Junction Temperature
[7]
Max Operating Temperature (ambient) Maximum Operating Junction Temperature
70°C 95°C
85°C 110°C
Notes:
7. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature.
Table 9. Environmental Compliance
Parameter Test Conditions Value Unit
Mechanical Shock Resistance MIL-STD-883F, Method 2002 10,000
g
Mechanical Vibration Resistance MIL-STD-883F, Method 2007 70
g
Soldering Temperature (follow standard Pb free soldering guidelines) MIL-STD-883F, Method 2003 260 °C
Moisture Sensitivity Level MSL1 @ 260°C
Electrostatic Discharge (HBM) HBM, JESD22-A114 2,000
V
Charge-Device Model ESD Protection JESD220C101 750
V
Latch-up Tolerance JESD78 Compliant
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 5 of 12 www.sitime.com
Waveform Diagrams
Figure
.
LVPECL/HCSL Voltage Levels per Differential Pin (OUT+/OUT
-
)
Figure
.
LVPECL/HCSL Voltage
Levels across Differential Pair
Figure
.
LVDS Voltage Levels per Differential Pin (OUT+/OUT
-
)
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 6 of 12 www.sitime.com
Termination Diagrams
LVPECL:
Figure 5. LVPECL with AC-coupled termination
VDD
R
1
R
2
R
1
R
2
OUT+
OUT-
OUT+
OUT-
VDD R
1
82.5 127
62.5 250
3.3 V
2.5 V
R
2
Zo = 50
Zo = 50
Thevenin-equivalent
Termination network
D-
D+
D-
D+
LVPECL
Figure 6. LVPECL DC-coupled load termination with Thevenin equivalent network
R
1
R
2
OUT+
OUT-
OUT+
OUT-
VDD R
1
50 50
50 50
3.3 V
2.5 V
R
2
R
3
50
18
Zo = 50
Zo = 50
R
3
C
1
0.1µF
Y-Bias Termination
network
D-
D+
D-
D+
LVPECL
Figure 7. LVPECL with Y-Bias termination
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 7 of 12 www.sitime.com
Termination Diagrams
(Continued)
OUT+
OUT-
OUT+
OUT-
50
Zo = 50
Zo = 50
V
T
=VDD-2V
50
Shunt Bias Termination
network
D-
D+
D-
D+
LVPECL
Figure 8. LVPECL with DC-coupled parallel shunt load termination
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 8 of 12 www.sitime.com
Termination Diagrams
(Continued)
LVDS:
OUT+
OUT-
OUT+
OUT-
100
Zo = 50
Zo = 50
LVDS
OUT+
OUT-
OUT+
OUT-
Figure 9. LVDS single DC termination at the load
OUT+
OUT-
100 Ω
Zo = 50Ω
Zo = 50Ω
0.1µF
0.1µF
LVDS
OUT+
OUT-
100 Ω
Figure 10. LVDS double AC termination with capacitor close to the load
OUT+
OUT-
100 Ω
Zo = 50Ω
Zo = 50Ω
LVDS
OUT+
OUT-
100 Ω
Figure 11. LVDS double DC termination
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 9 of 12 www.sitime.com
Termination Diagrams
(Continued)
HCSL:
OUT+
OUT-
OUT+
OUT-
Zo = 50
Zo = 50
D-
D+
D-
D+
R2
R1
R1 = R2 = 33
5050
Figure 12. HCSL interface termination
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 10 of 12 www.sitime.com
Dimensions and Patterns
Package Size – Dimensions (Unit: mm)
[8]
Recommended Land Pattern (Unit: mm)
[9]
3.2 x 2.5 x 0.75 mm
3.2 x 2.5 x 0.75 mm
7.0 x 5.0 x 0.90 mm[10]
7.0 x 5.0 x 0.90 mm[10]
Notes:
8. Top Marking: Y denotes manufacturing origin and XXXX denotes manufacturing lot number. The value of “Y” will depend on the assembly location of the
device.
9. A capacitor of value 0.1 µF or higher between Vdd and GND is required. An additional 10 µF capacitor between Vdd and GND is required for the best
phase jitter performance
10. The center pad has no electrical function. Soldering down the center pad to the GND is recommended for best thermal dissipation, but is optional.
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 11 of 12 www.sitime.com
Ordering Information
Notes:
11. Contact SiTime for higher temperature range options
12. Contact SiTime for 5.0 x 3.2 mm package
13. Contact SiTime for ± 10 ppm option
14. Bulk is available for sampling only
Table 10. Ordering Codes for Supported Tape & Reel Packing Method
Device Size
(mm x mm)
8 mm T&R
(3ku)
8 mm T&R
(1ku)
12 mm T&R
(3ku)
12 mm T&R
(1ku)
16 mm T&R
(3ku)
16 mm T&R
(1ku)
7.0 x 5.0
T Y
3.2 x 2.5 D E T
Y
SiT9367
220 to 725 MHz Ultra-low Jitter Differential Oscillator
Rev 1.0
Page 12 of 12 www.sitime.com
Table 11 .Revision History
Revision Release Date Change Summary
1.0 09/06/2017 Final release
SiTime Corporation, 5451 Patrick Henry Drive, Santa Clara, CA 95054, USA | Phone: +1-408-328-4400 | Fax: +1-408-328-4439
© SiTime Corporation 2017. The information contained herein is subject to change at any time without notice. SiTime assumes no responsibility
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defect of a Product which is caused in whole or in part by (i) use of any circuitry other than circuitry embodied in a SiTime produc
t, (ii) misuse or abuse including static discharge, neglect or
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