H Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers 6N134* 81028 HCPL-563X HCPL-663X Technical Data HCPL-665X 5962-90855 HCPL-560X *See matrix for available extensions. Features * Dual Marked with Device Part Number and DESC Drawing Number * Manufactured and Tested on a MIL-PRF-38534 Certified Line * QML-38534, Class H and K * Five Hermetically Sealed Package Configurations * Performance Guaranteed over -55C to +125C * High Speed: 10 M Bit/s * CMR: > 10,000 V/s Typical * 1500 Vdc Withstand Test Voltage * High Radiation Immunity * 6N137, HCPL-2601, HCPL2630/-31 Function Compatibility * Reliability Data * TTL Circuit Compatibility Applications * Military and Space * High Reliability Systems * Transportation, Medical, and Life Critical Systems * Line Receiver * Voltage Level Shifting * * * * Isolated Input Line Receiver Isolated Output Line Driver Logic Ground Isolation Harsh Industrial Environments * Isolation for Computer, Communication, and Test Equipment Systems Truth Table (Positive Logic) Multichannel Devices Input On (H) Off (L) Output L H Single Channel DIP Description These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DESC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DESC Qualified Manufacturers List QML38534 for Hybrid Microcircuits. Quad channel devices are available by special order in the 16 pin DIP through hole packages. Input On (H) Off (L) On (H) Off (L) Enable H H L L Output L H H H Functional Diagram Multiple Channel Devices Available VCC VE VOUT GND CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 1-536 5965-3003E and E respectively), 16 pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details. Standard Military Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations, and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts' performance for die related reliability and certain limited radiation test results. Selection Guide-Package Styles and Lead Configuration Options Package 16 Pin DIP Lead Style Through Hole Channels 2 Common Channel VCC, GND Wiring HP Part # & Options Commercial 6N134* MIL-PRF-38534, Class H 6N134/883B MIL-PRF-38534, Class K HCPL-268K Standard Lead Finish Gold Plate Solder Dipped Option #200 Butt Cut/Gold Plate Option #100 Gull Wing/Soldered Option #300 SMD Part # Prescript for all below None Either Gold or Solder 8102801EX Gold Plate 8102801EC Solder Dipped 8102801EA Butt Cut/Gold Plate 8102801UC Butt Cut/Soldered 8102801UA Gull Wing/Soldered 8102801TA 8 Pin DIP Through Hole 1 None 8 Pin DIP Through Hole 2 VCC, GND 16 Pin Flat Pack Unformed Leads 4 VCC, GND 20 Pad LCCC Surface Mount 2 None HCPL-5600 HCPL-5601 HCPL-560K Gold Plate Option #200 Option #100 Option #300 HCPL-5630 HCPL-5631 HCPL-563K Gold Plate Option #200 Option #100 Option #300 HCPL-6650 HCPL-6651 HCPL-665K Gold Plate HCPL-6630 HCPL-6631 HCPL-663K Solder Pads 59629085501HPX 9085501HPC 9085501HPA 9085501HYC 9085501HYA 9085501HXA None 8102802PX 8102802PC 8102802PA 8102802YC 8102802YA 8102802ZA None 8102804FX 8102804FC None 81028032X 81028032A *JEDEC registered part. 1-537 HERMETIC/HI-REL OPTOCOUPLERS Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated high speed photon detector. The output of the detector is an open collector Schottky clamped transistor. Internal shields provide a guaranteed common mode transient immunity specification of 1000 V/s. Selection for higher levels of CMR values are available by special request. Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P Functional Diagrams 16 Pin DIP Through Hole 2 Channels 8 Pin DIP Through Hole 1 Channel 8 Pin DIP Through Hole 2 Channels 16 Pin Flat Pack Unformed Leads 4 Channels 2 VCC 15 3 VO1 14 VCC 1 VE 2 13 4 VO2 5 GND 7 7 VOUT 3 12 6 1 VCC VO1 2 VO2 3 4 11 6 8 4 GND 10 GND 5 8 7 2 VCC 15 3 VO1 14 4 VO2 13 5 VO3 12 6 VCC2 19 VO2 20 2 GND2 VO1 VCC1 13 12 10 3 5 6 VO4 11 7 GND 10 GND1 7 8 9 8 9 8 15 16 1 16 1 20 Pad LCCC Surface Mount 2 Channels Note: All DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections. Outline Drawings 16 Pin DIP Through Hole, 2 Channels 20.06 (0.790) 20.83 (0.820) 8.13 (0.320) MAX. 0.89 (0.035) 1.65 (0.065) 4.45 (0.175) MAX. 0.51 (0.020) MIN. 3.81 (0.150) MIN. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MAX. 0.20 (0.008) 0.33 (0.013) 7.36 (0.290) 7.87 (0.310) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). Leaded Device Marking HP LOGO HP P/N DESC SMD* DESC SMD* PIN ONE/ ESD IDENT HP QYYWWZ XXXXXX XXXXXXX XXX USA * 50434 * QUALIFIED PARTS ONLY 1-538 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) COUNTRY OF MFR. HP FSCN* Leadless Device Marking HP LOGO HP P/N PIN ONE/ ESD IDENT COUNTRY OF MFR. HP QYYWWZ XXXXXX * XXXX XXXXXX USA 50434 * QUALIFIED PARTS ONLY COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) DESC SMD* DESC SMD* HP FSCN* HERMETIC/HI-REL OPTOCOUPLERS Outline Drawings (continued) 16 Pin Flat Pack, 4 Channels 7.24 (0.285) 6.99 (0.275) 2.29 (0.090) MAX. 1.27 (0.050) REF. 11.13 (0.438) 10.72 (0.422) 0.46 (0.018) 0.36 (0.014) 8.13 (0.320) MAX. 2.85 (0.112) MAX. 0.88 (0.0345) MIN. 0.89 (0.035) 0.69 (0.027) 5.23 (0.206) MAX. 0.31 (0.012) 0.23 (0.009) 9.02 (0.355) 8.76 (0.345) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 20 Terminal LCCC Surface Mount, 2 Channels 8 Pin DIP Through Hole, 1 and 2 Channel 4.95 (0.195) 5.21 (0.205) 1.78 (0.070) 2.03 (0.080) 8.13 (0.320) 8.13 (0.320) MAX. MAX. 9.40 (0.370) 9.91 (0.390) 0.76 (0.030) 1.27 (0.050) 8.70 (0.342) 9.10 (0.358) 7.16 (0.282) 7.16 (0.282) 7.57 (0.298) 7.57 (0.298) 1.02 (0.040) (3 PLCS) 4.32 (0.170) MAX. 1.14 (0.045) 1.40 (0.055) 8.70 (0.342) 9.10 (0.358) 4.95 (0.195) 5.21 (0.205) TERMINAL 1 IDENTIFIER 2.16 (0.085) 0.51 (0.020) MIN. 3.81 (0.150) MIN. 0.20 (0.008) 0.20 (0.008) 0.33 (0.013) 0.33 (0.013) METALLIZED CASTILLATIONS (20 PLCS) 1.78 (0.070) 2.03 (0.080) 0.64 (0.025) (20 PLCS) 0.51 (0.020) 1.52 (0.060) 2.03 (0.080) 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MAX. 7.36 (0.290) 7.36 (0.290) 7.87 (0.310) 7.87 (0.310) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX. 1-539 Hermetic Optocoupler Options Option 100 Description Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). 4.32 (0.170) MAX. 0.51 (0.020) MIN. 1.14 (0.045) 1.40 (0.055) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 4.32 (0.170) MAX. 0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110) 1.14 (0.045) 1.40 (0.055) 0.20 (0.008) 0.33 (0.013) 0.51 (0.020) MAX. 7.36 (0.290) 7.87 (0.310) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 200 300 Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 and 16 pin DIP. DESC Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature. Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This option has solder dipped leads. 5.57 (0.180) MAX. 0.51 (0.020) MIN. 1.40 (0.055) 1.65 (0.065) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 5.57 (0.180) MAX. 0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110) 1.40 (0.055) 1.65 (0.065) 5 MAX. 0.51 (0.020) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 1-540 5.57 (0.180) MAX. 0.20 (0.008) 0.33 (0.013) 9.65 (0.380) 9.91 (0.390) HERMETIC/HI-REL OPTOCOUPLERS Absolute Maximum Ratings (No derating required up to +125C) Storage Temperature Range, TS ................................... -65C to +150C Operating Temperature, TA .......................................... -55C to +125C Case Temperature, TC ................................................................ +170C Junction Temperature, TJ ........................................................... +175C Lead Solder Temperature ............................................... 260C for 10 s Peak Forward Input Current, IF PK, (each channel, 1 ms duration) ...................................................................... 40 mA Average Input Forward Current, IF AVG (each channel) ................ 20 mA Input Power Dissipation (each channel) ..................................... 35 mW Reverse Input Voltage, VR (each channel) ......................................... 5 V Supply Voltage, VCC (1 minute maximum) ........................................ 7 V Output Current, IO (each channel) ............................................... 25 mA Output Power Dissipation (each channel) .................................. 40 mW Output Voltage, VO (each channel) .................................................. 7 V* Package Power Dissipation, PD (each channel) ........................ 200 mW *Selection for higher output voltages up to 20 V is available. Single Channel Product Only Emitter Input Voltage, VE ............................................................... 5.5 V 8 Pin Ceramic DIP Single Channel Schematic Note enable pin 7. An external 0.01 F to 0.1 F bypass capacitor must be connected between VCC and ground for each package type. ESD Classification (MIL-STD-883, Method 3015) HCPL-5600/01 ..................................................................... (), Class 1 6N134, 6N134/883B, HCPL-5630/31, HCPL-6630/31 and HCPL-6650/51 ................................. (Dot), Class 3 Recommended Operating Conditions Parameter Input Current, Low Level, Each Channel Input Current, High Level, Each Channel* Supply Voltage, Output Fan Out (TTL Load) Each Channel Symbol IFL IFH VCC N Min. 0 10 4.5 Max. 250 20 5.5 6 Units A mA V *Meets or exceeds DESC SMD and JEDEC requirements. 1-541 Recommended Operating Conditions (cont'd.) Single Channel Product Only[10] Parameter High Level Enable Voltage Low Level Enable Voltage Symbol VEH VEL Min. 2.0 0 Max. VCC 0.8 Units V V Electrical Characteristics (TA = -55C to +125C, unless otherwise specified) Parameter High Level Output Current Low Level Output Voltage Current Transfer Ratio Logic Single High Channel Supply Dual Current Channel Quad Channel Logic Single Low Channel Supply Dual Current Channel Quad Channel Input Forward Voltage Limits Group A[13] Symbol Test Conditions Subgroups Min. Typ.** Max. Units Fig. Note IOH* VCC = 5.5 V, VO = 5.5 V, 1, 2, 3 20 250 A 1 1 IF = 250 A VOL* VCC = 5.5 V, IF = 10 mA, 1, 2, 3 0.3 0.6 V 2 1, 9 IOL (Sinking) = 10 mA hF CTR VO = 0.6 V, IF = 10 mA, 1, 2, 3 100 % 1 VCC = 5.5 V ICCH* VCC = 5.5 V, IF = 0 mA 1, 2, 3 9 14 mA 1 ICCL* VF* VCC = 5.5 V, IF1 = IF2 = 0 mA VCC = 5.5 V, IF1 = IF2 = IF3 = IF4 = 0 mA VCC = 5.5 V, IF = 20 mA VCC = 5.5 V, IF1 = IF2 = 20 mA VCC = 5.5 V, IF1 = IF2 = IF3 = IF4 = 20 mA IF = 20 mA Input Reverse Breakdown Voltage Input-Output Leakage Current BVR* IR = 10 A II-O* Capacitance Between Input/ Output CI-O VI-O = 1500 Vdc, RH = 45% TA = 25C, t = 5 s f = 1 MHz, TC = 25C *Identified test parameters for JEDEC registered parts. **All typical values are at VCC = 5 V, TA = 25C. 1-542 1, 2, 3 1, 2, 3 1, 2 3 1, 2, 3 18 28 mA 25 42 mA 13 18 mA 1 26 36 mA 6 33 50 mA 1.5 1.55 1.9 1.75 1.85 V V 5 1 4 1.0 6 3 3 1, 15 1, 16 V 1 1.0 A 2, 8 4.0 pF 1, 3, 14 Test Parameter Symbol Conditions Propagation Delay t * VCC = 5 V, PLH Time to High RL = 510 , Output Level CL = 50 pF, IF = 13 mA Propagation Delay tPHL* Time to Low Output Level Output Rise Time Output Fall Time Common Mode Transient Immunity at High Output Level Common Mode Transient Immunity at Low Output Level tLH tHL RL = 510 , CL = 50 pF, IF = 13 mA Limits Group A[13] Subgroups Min. Typ.** Max. Units Fig. Note 9 60 10, 11 Single Channel Product Only Low Level IEL VCC = 5.5 V, Enable Current VE = 0.5 V High Level VEH Enable Voltage Low Level VEL Enable Voltage ns 4, 5, 6 140 9 55 10, 11 100 1, 5 ns 120 9, 10, 11 |CMH| VCM = 50 V (PEAK), VCC = 5 V, VO (min.) = 2 V, RL = 510 , IF = 0 mA |CML| VCM = 50 V (PEAK), VCC = 5 V, VO (max.) = 0.8 V, RL = 510 k, IF = 10 mA 100 35 35 90 40 ns 1 9, 10, 11 1000 >10000 V/s 7 1, 7, 14 9, 10, 11 1000 >10000 V/s 7 1, 7, 14 1, 2, 3 1, 2, 3 -1.45 -2.0 2.0 1, 2, 3 mA V 0.8 10 V *Identified test parameters for JEDEC registered part. **All typical values are at VCC = 5 V, TA = 25C. Typical Characteristics, TA = 25C, VCC = 5 V Parameter Input Capacitance Input Diode Temperature Coefficient Resistance (Input-Output) Single Channel Product Only Propagation Delay Time of Enable from VEH to VEL Propagation Delay Time of Enable from VEL to VEH Sym. CIN VF TA RI-O Typ. 60 -1.5 Units pF mV/C 1012 VI-O = 500 V tELH 35 ns tEHL 35 ns RL = 510 , CL = 50 pF IF = 13 mA, VEH = 3 V, VEL = 0 V 0.5 nA 1012 0.55 pF Dual and Quad Channel Product Only Input-Input II-I Leakage Current Resistance (Input-Input) RI-I Capacitance (Input-Input) CI-I Test Conditions VF = 0 V, f = 1 MHz IF = 20 mA Relative Humidity = 45% VI-I = 500 V, t = 5 s VI-I = 500 V f = 1 MHz Fig. Note 1 1 2 8, 9 1, 11 1, 12 4 4 4 1-543 HERMETIC/HI-REL OPTOCOUPLERS Electrical Characteristics, (Contd.) TA = -55C to +125C unless otherwise specified Notes: 1. Each channel. 2. All devices are considered two-terminal devices; II-O is measured between all input leads or terminals shorted together and all output leads or terminals shorted together. 3. Measured between each input pair shorted together and all output connections for that channel shorted together. 4. Measured between adjacent input pairs shorted together for each multichannel device. 5. tPHL propagation delay is measured from the 50% point on the leading edge of the input pulse to the 1.5 V point on the leading edge of the output pulse. The tPLH propagation delay is measured from the 50% point on the trailing edge of the input pulse to the 1.5 V point on the trailing edge of the output pulse. 6. The HCPL-6630 and HCPL-6631 dual channel parts function as two independent single channel units. Use the single channel parameter limits for each channel. 7. CML is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic low state (VO < 0.8 V). CMH is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic high state (VO > 2.0 V). 8. This is a momentary withstand test, not an operating condition. 9. It is essential that a bypass capacitor (0.01 to 0.1 F, ceramic) be connected from VCC to ground. Total lead length between both ends of this external capacitor and the isolator connections should not exceed 20 mm. 10. No external pull up is required for a high logic state on the enable input. 11. The tELH enable propagation delay is measured from the 1.5 V point on the trailing edge of the enable input pulse to the 1.5 V point on the trailing edge of the output pulse. 12. The tEHL enable propagation delay is measured from the 1.5 V point on the leading edge of the enable input pulse to the 1.5 V point on the leading edge of the output pulse. 13. Standard parts receive 100% testing at 25C (Subgroups 1 and 9). SMD and 883B parts receive 100% testing at 25, 125, and -55C (Subgroups 1 and 9, 2 and 10, 3 and 11, respectively). 14. Parameters are tested as part of device initial characterization and after design and process changes. Parameters are guaranteed to limits specified for all lots not specifically tested. 15. Not required for 6N134, 6N134/883B and 8102801 types. 16. Required for 6N134, 6N134/883B and 8102801 types only. Figure 1. High Level Output Current vs. Temperature. 1-544 Figure 2. Input-Output Characteristics. Figure 3. Input Diode Forward Characteristic. PULSE GENERATOR ZO = 50 tH = 5 ns INPUT MONITORING NODE HERMETIC/HI-REL OPTOCOUPLERS D.U.T. 5V VCC RL IF VO 0.01 F BYPASS VO CL* GND Rm * CLINCLUDES PROBE AND STRAY WIRING CAPACITANCE. Figure 5. Propagation Delay, tPHL and tPLH vs. Pulse Input Current, IFH. Figure 4. Test Circuit for tPHL and tPLH.* D.U.T. B II VCC +5 V 510 A 0.01 F BYPASS OUTPUT VO MONITORING NODE GND VFF VCM + - PULSE GEN. Figure 6. Propagation Delay vs. Temperature. Figure 7. Test Circuit for Common Mode Transient Immunity and Typical Waveforms. 1-545 PULSE GENERATOR ZO = 50 tr = 5 ns OUTPUT VE MONITORING NODE +5 V D.U.T. VCC VE IF = 13 mA RL VOUT 0.01 F BYPASS OUTPUT VO MONITORING NODE C L* GND * CL INCLUDES PROBE AND STRAY WIRING CAPACITANCE. Figure 9. Enable Propagation Delay vs. Temperature. Figure 8. Test Circuit for tEHL and tELH. VCC +5.5 V VOC +5.5 V D.U.T.* VCC (EACH INPUT) + VIN 0.01 F - 200 5.3 V (EACH OUTPUT) GND 200 (EACH OUTPUT) CONDITIONS: IF = 20 mA IO = 25 mA TA = +125 C * ALL CHANNELS TESTED SIMULTANEOUSLY. Figure 10. Operating Circuit for Burn-In and Steady State Life Tests. 1-546 HERMETIC/HI-REL OPTOCOUPLERS MIL-PRF-38534 Class H, Class K, and DESC SMD Test Program Hewlett-Packard's Hi-Rel Optocouplers are in compliance with MIL-PRF-38534 Classes H and K. Class H devices are also in compliance with DESC drawings 81028, and 5962-90855. Testing consists of 100% screening and quality conformance inspection to MIL-PRF-38534. 1-547