C Series Open Mode Design Type: C2012 [EIA CC0805] C3216 [EIA CC1206] C3225 [EIA CC1210] C4532 [EIA CC1812] C5750 [EIA CC2220] Issue date: April 2011 TDK MLCC US Catalog Version B11 REMINDERS Please read before using this product SAFETY REMINDERS REMINDERS 1. 2. 3. 4. 5. 6. 7. If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other damage, you must contact our company's sales window. We may modify products or discontinue production of a product listed in this catalog without prior notification. We provide "Delivery Specification" that explain precautions for the specifications and safety of each product listed in this catalog. We strongly recommend that you exchange these delivery specifications with customers that use one of these products. If you plan to export a product listed in this catalog, keep in mind that it may be a restricted item according to the "Foreign Exchange and Foreign Trade Control Law". In such cases, it is necessary to acquire export permission in harmony with this law. Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from our company. We are not responsible for problems that occur related to the intellectual property rights or other rights of our company or a third party when you use a product listed in this catalog. We do not grant license of these rights. This catalog only applies to products purchased through our company or one of our company's official agencies. This catalog does not apply to products that are purchased through other third parties. TDK MLCC US Catalog Page 180 Version B11 C Series Open Mode Design Type: C2012, C3216, C3225, C4532, C5750 Features * Increase resistance to mechanical bending, temperature cycle, vibration, and electrical stresses * Available in X7R and X8R dielectrics * When a chip capacitor is cracked by mechanical stress such as board bending, open mode construction helps user reduce the risk of short circuits * The Open Mode design defines that the L-Gap length shall be wider than the terminal band width <Standard> <Open Mode Design> Fail Short L-Gap Applications * Automotive and other high stress applications * Battery line circuits with high board flex stress Shape & Dimensions Fail Open L-Gap L W T B Dimensions in mm Crack Crack Body Length Body Width Body Height Terminal Width * The Open Mode concept does not guaranteed MLCC will always fail open. This design is intended to reduce the risk of the MLCC failing short. All MLCC caution guidelines apply. Symbol 5 Part Number Construction C Series Name Dimensions L x W (mm) Case Code C2012 C3216 C3225 C4532 C5750 Length 2.00 0.20 3.20 0.20 3.20 0.40 4.50 0.40 5.70 0.40 3216 X7R 2A 105 K T 5XXX Width 1.25 0.20 1.60 0.20 2.50 0.30 3.20 0.40 5.00 0.40 Capacitance Change 15% 15% Temperature Range -55 to +125C -55 to +150C Style Open Mode Design Packaging Code T Style Tape & Reel Tolerance Code K M Tolerance 10% 20% Nominal Capacitance (pF) The capacitance is expressed in three digit codes and in units of pico Farads (pF). The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. R designates a decimal point. Voltage (DC) 16V 25V 50V 100V 250V 630V TDK MLCC US Catalog Termination Code 5xxx Capacitance Tolerance Rated Voltage (DC) Voltage Code 1C 1E 1H 2A 2E 2J Internal Codes Packaging Style Temperature Characteristic Temperature Characteristics X7R X8R Design Open Mode Capacitance Code 0R5 010 102 105 Page 181 Capacitance 0.5pF 1pF 1,000pF (1nF) 1,000,000pF (1F) Version B11 Capacitance Range Chart C2012 [EIA CC0805] Capacitance Range Chart Temperature Characteristics: X7R, ( 15%), X8R ( 15%) Rated Voltage: 250V (2E), 100V (2A), 50V (1H) Capacitance (pF) 1,000 1,500 2,200 3,300 4,700 6,800 10,000 15,000 22,000 33,000 47,000 68,000 100,000 X7R Cap Code 102 152 222 332 472 682 103 153 223 333 473 683 104 Tolerance 2E (250V) 2A (100V) X8R 1H (50V) 1H (50V) K: 10% Standard Thickness 0.85 mm 1.25 mm Capacitance Range Table C2012 [EIA CC0805] Class 2 (Temperature Stable) Temperature Characteristics X7R (-55 to +125C, 15%), X8R (-55 to +150C, 15%) TDK Part Number Temperature Rated Capacitance Capacitance (Ordering Code) Characteristics Voltage (pF) Tolerance Thickness (mm) C2012X7R1H104KT5 X7R 50V 100,000 10% 1.25 0.20 C2012X7R2A102KT5 X7R 100V 1,000 10% 0.85 0.10 C2012X7R2A152KT5 X7R 100V 1,500 10% 0.85 0.10 C2012X7R2A222KT5 X7R 100V 2,200 10% 0.85 0.10 C2012X7R2A332KT5 X7R 100V 3,300 10% 0.85 0.10 C2012X7R2A472KT5 X7R 100V 4,700 10% 0.85 0.10 C2012X7R2A682KT5 X7R 100V 6,800 10% 0.85 0.10 C2012X7R2A103KT5 X7R 100V 10,000 10% 0.85 0.10 C2012X7R2A153KT5 X7R 100V 15,000 10% 1.25 0.20 C2012X7R2A223KT5 X7R 100V 22,000 10% 1.25 0.20 C2012X7R2E102KT5 X7R 250V 1,000 10% 0.85 0.10 C2012X7R2E152KT5 X7R 250V 1,500 10% 0.85 0.10 C2012X7R2E222KT5 X7R 250V 2,200 10% 0.85 0.10 C2012X7R2E332KT5 X7R 250V 3,300 10% 0.85 0.10 C2012X7R2E472KT5 X7R 250V 4,700 10% 0.85 0.10 C2012X7R2E682KT5 X7R 250V 6,800 10% 1.25 0.20 C2012X7R2E103KT5 X7R 250V 10,000 10% 1.25 0.20 C2012X7R2E153KT5 X7R 250V 15,000 10% 1.25 0.20 C2012X8R1H223KT5 X8R 50V 22,000 10% 0.85 0.10 C2012X8R1H333KT5 X8R 50V 33,000 10% 0.85 0.10 C2012X8R1H473KT5 X8R 50V 47,000 10% 1.25 0.20 C2012X8R1H683KT5 X8R 50V 68,000 10% 1.25 0.20 TDK MLCC US Catalog Page 182 Version B11 Capacitance Range Chart C3216 [EIA CC1206] Capacitance Range Chart Temperature Characteristics: X7R, ( 15%) Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 16V (1C) Capacitance (pF) 1,000 1,500 2,200 3,300 4,700 6,800 10,000 15,000 22,000 33,000 47,000 68,000 100,000 150,000 1,000,000 4,700,000 X7R Cap Code 102 152 222 332 472 682 103 153 223 333 473 683 104 154 105 475 Tolerance 2J (630V) 2E (250V) 2A (100V) 1C (16V) K: 10% Standard Thickness 1.15 mm 1.30 mm 1.60 mm Capacitance Range Table C3216 [EIA CC1206] Class 2 (Temperature Stable) Temperature Characteristics X7R (-55 to +125C, 15%) TDK Part Number Temperature Rated (Ordering Code) Characteristics Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C3216X7R1C475MT5 X7R 16V 4,700,000 20% 1.60 0.30 C3216X7R2A333KT5 X7R 100V 33,000 10% 1.15 0.10 C3216X7R2A473KT5 X7R 100V 47,000 10% 1.15 0.10 C3216X7R2A683KT5 X7R 100V 68,000 10% 1.60 0.30 C3216X7R2A104KT5 X7R 100V 100,000 10% 1.60 0.30 C3216X7R2A154KT5 X7R 100V 150,000 10% 1.60 0.30 C3216X7R2A105KT5 X7R 100V 1,000,000 10% 1.60 0.30 C3216X7R2E153KT5 X7R 250V 15,000 10% 1.15 0.10 C3216X7R2E223KT5 X7R 250V 22,000 10% 1.15 0.10 C3216X7R2E333KT5 X7R 250V 33,000 10% 1.60 0.30 C3216X7R2E473KT5 X7R 250V 47,000 10% 1.60 0.30 C3216X7R2E683KT5 X7R 250V 68,000 10% 1.60 0.30 C3216X7R2E104KT5 X7R 250V 100,000 10% 1.60 0.30 C3216X7R2J102KT5 X7R 630V 1,000 10% 1.15 0.10 C3216X7R2J152KT5 X7R 630V 1,500 10% 1.15 0.10 C3216X7R2J222KT5 X7R 630V 2,200 10% 1.15 0.10 C3216X7R2J332KT5 X7R 630V 3,300 10% 1.15 0.10 C3216X7R2J472KT5 X7R 630V 4,700 10% 1.15 0.10 C3216X7R2J682KT5 X7R 630V 6,800 10% 1.15 0.10 C3216X7R2J103KT5 X7R 630V 10,000 10% 1.15 0.10 C3216X7R2J153KT5 X7R 630V 15,000 10% 1.30 0.15 C3216X7R2J223KT5 X7R 630V 22,000 10% 1.30 0.15 C3216X7R2J333KT5 X7R 630V 33,000 10% 1.60 0.30 TDK MLCC US Catalog Page 183 Version B11 Capacitance Range Chart C3225 [EIA CC1210] Capacitance Range Chart Temperature Characteristics: X7R, ( 15%) Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C) Capacitance (pF) 47,000 68,000 100,000 150,000 220,000 330,000 470,000 680,000 1,000,000 1,500,000 2,200,000 3,300,000 4,700,000 X7R Cap Code 473 683 104 154 224 334 474 684 105 155 225 335 475 Tolerance 2J (630V) 2E (250V) 2A (100V) 1H (50V) 1E (25V) 1C (16V) K: 10% Standard Thickness 1.15 mm 1.60 mm 2.00 mm 2.30 mm 2.50 mm Capacitance Range Table C3225 [EIA CC1210] Class 2 (Temperature Stable) Temperature Characteristics X7R (-55 to +125C, 15%) TDK Part Number Temperature Rated (Ordering Code) Characteristics Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C3225X7R1C335KT5 X7R 16V 3,300,000 10% 2.00 0.20 C3225X7R1C475KT5 X7R 16V 4,700,000 10% 2.50 0.30 C3225X7R1E105KT5 X7R 25V 1,000,000 10% 1.15 0.10 C3225X7R1E155KT5 X7R 25V 1,500,000 10% 1.60 0.30 C3225X7R1E225KT5 X7R 25V 2,200,000 10% 2.00 0.20 C3225X7R1H474KT5 X7R 50V 470,000 10% 1.60 0.30 C3225X7R1H684KT5 X7R 50V 680,000 10% 2.00 0.20 C3225X7R2A334KT5 X7R 100V 330,000 10% 2.00 0.20 C3225X7R2A105KT5 X7R 100V 1,000,000 10% 2.00 0.20 C3225X7R2A225KT5 X7R 100V 2,200,000 10% 2.30 0.20 C3225X7R2E104KT5 X7R 250V 100,000 10% 2.00 0.20 C3225X7R2E154KT5 X7R 250V 150,000 10% 2.00 0.20 C3225X7R2E224KT5 X7R 250V 220,000 10% 2.00 0.20 C3225X7R2J473KT5 X7R 630V 47,000 10% 2.00 0.20 C3225X7R2J683KT5 X7R 630V 68,000 10% 2.00 0.20 TDK MLCC US Catalog Page 184 Version B11 Capacitance Range Chart C4532 [EIA CC1812] Capacitance Range Chart Temperature Characteristics: X7R, ( 15%) Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C) Capacitance (pF) Cap Code 68,000 100,000 150,000 220,000 330,000 470,000 680,000 1,000,000 1,500,000 3,300,000 4,700,000 6,800,000 10,000,000 683 104 154 224 334 474 684 105 155 335 475 685 106 X7R Tolerance 2J (630V) 2E (250V) 2A (100V) 1H (50V) 1E (25V) 1C (16V) K: 10% Standard Thickness 1.60 mm 2.00 mm 2.30 mm Capacitance Range Table C4532 [EIA CC1812] Class 2 (Temperature Stable) Temperature Characteristics X7R (-55 to +125C, 15%) TDK Part Number Temperature Rated (Ordering Code) Characteristics Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C4532X7R1C685KT5 X7R 16V 6,800,000 10% 2.00 0.20 C4532X7R1C106KT5 X7R 16V 10,000,000 10% 2.30 0.20 C4532X7R1E335KT5 X7R 25V 3,300,000 10% 1.60 0.30 C4532X7R1E475KT5 X7R 25V 4,700,000 10% 2.00 0.20 C4532X7R1H105KT5 X7R 50V 1,000,000 10% 1.60 0.30 C4532X7R1H155KT5 X7R 50V 1,500,000 10% 2.30 0.20 C4532X7R2A684KT5 X7R 100V 680,000 10% 2.30 0.20 C4532X7R2E154KT5 X7R 250V 150,000 10% 1.60 0.30 C4532X7R2E224KT5 X7R 250V 220,000 10% 2.30 0.20 C4532X7R2E334KT5 X7R 250V 330,000 10% 2.30 0.20 C4532X7R2E474KT5 X7R 250V 470,000 10% 2.30 0.20 C4532X7R2J683KT5 X7R 630V 68,000 10% 1.60 0.30 C4532X7R2J104KT5 X7R 630V 100,000 10% 2.30 0.20 TDK MLCC US Catalog Page 185 Version B11 Capacitance Range Chart C5750 [EIA CC2220] Capacitance Range Chart Temperature Characteristics: X7R, ( 15%) Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C) Capacitance (pF) Cap Code 150,000 220,000 330,000 470,000 680,000 1,000,000 1,500,000 2,200,000 3,300,000 4,700,000 6,800,000 10,000,000 15,000,000 22,000,000 154 224 334 474 684 105 155 225 335 475 685 106 156 226 X7R Tolerance 2J (630V) 2E (250V) 2A (100V) 1H (50V) 1E (25V) 1C (16V) K: 10% Standard Thickness 1.60 mm 2.00 mm 2.30 mm 2.80 mm Capacitance Range Table C5750 [EIA CC2220] Class 2 (Temperature Stable) Temperature Characteristics X7R (-55 to +125C, 15%) TDK Part Number Temperature Rated (Ordering Code) Characteristics Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C5750X7R1C226MT5 X7R 16V 22,000,000 20% 2.80 0.20 C5750X7R1E685KT5 X7R 25V 6,800,000 10% 1.60 0.30 C5750X7R1E106KT5 X7R 25V 10,000,000 10% 2.00 0.20 C5750X7R1E156MT5 X7R 25V 15,000,000 20% 2.80 0.20 C5750X7R1H225KT5 X7R 50V 2,200,000 10% 1.60 0.30 C5750X7R1H335KT5 X7R 50V 3,300,000 10% 2.30 0.20 C5750X7R1H475KT5 X7R 50V 4,700,000 10% 2.80 0.20 C5750X7R2A684KT5 X7R 100V 680,000 10% 1.60 0.30 C5750X7R2A105KT5 X7R 100V 1,000,000 10% 2.30 0.20 C5750X7R2A155KT5 X7R 100V 1,500,000 10% 2.30 0.20 C5750X7R2E334KT5 X7R 250V 330,000 10% 1.60 0.30 C5750X7R2E474KT5 X7R 250V 470,000 10% 2.30 0.20 C5750X7R2E684KT5 X7R 250V 680,000 10% 2.30 0.20 C5750X7R2E105KT5 X7R 250V 1,000,000 10% 2.30 0.20 C5750X7R2J154KT5 X7R 630V 150,000 10% 1.60 0.30 C5750X7R2J224KT5 X7R 630V 220,000 10% 2.30 0.20 TDK MLCC US Catalog Page 186 Version B11 General Specifications C Series - Open Mode Design No. Item Performance Test or Inspection Method 1 External Appearance No defects which may affect performance. Inspect with magnifying glass (3x). 2 Insulation Resistance 10,000M or 500M*F min., whichever smaller. (As for the capacitors of rated voltage 16V DC, 10,000 M or 100M*F min.,) Apply rated voltage for 60s. As for the rated voltage 630V DC, apply 500V DC. 3 Voltage Proof Withstand test voltage without insulation breakdown or other damage. Rated Voltage Apply voltage RV 100V 2.5 xrated voltage RV > 100V 1.5 xrated voltage Above DC voltage shall be applied for 1 to 5s. Charge / discharge current shall not exceed 50mA. 4 Capacitance Within the specified tolerance. Class Class 2 5 6 7 Dissipation Factor (Class 2) Temperature Characteristics of Capacitance (Class 2) Robustness of Terminations T.C. Rated Voltage (DC) D.F. X7R X8R RV = 25V& 50V 3% max. RV 16V 5% max. Capacitance Change (%) Rated Capacitance Measuring Frequency Measuring voltage C 10uF 1kHz10% 1.00.2Vrms C > 10uF 120Hz20% 0.50.2 Vrms See No.4 in this table for measuring condition. Capacitance shall be measured by the steps shown in the following table after thermal equilibrium is obtained for each step. C be calculated ref. STEP 3 reading No Voltage Applied X7R: 15% X8R: 15% Step No sign of termination coming off, breakage of ceramic, or other abnormal signs. Temperature (C) 1 Reference temp. 2 2 Min. operating temp. 2 3 Reference temp. 2 4 Max. operating temp. 2 Reflow solder the capacitors on P.C. board (shown in Appendix 1a or Appendix 1b) and apply a pushing force of 5N for 101s. Pushing force Capacitor 8 Bending No mechanical damage. P.C. board Reflow solder the capacitor on P.C. board (shown in Appendix 2) and bend it for 1mm. 20 50 F R230 1 45 TDK MLCC US Catalog Page 187 45 Unit: mm Version B11 General Specifications C Series - Open Mode Design No. Item Performance Test or Inspection Method 9 Solderability New solder to cover over 75% of termination. Completely soak both terminations in solder at 2355C for 20.5s. 25% may have pinholes or rough spots but not concentrated in one spot. Solder: H63A (JIS Z 3282) Ceramic surface of "A sections" shall not be exposed due to melting or shifting of termination material. Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. A section 10 Resistance to solder heat External appearance Capacitance No cracks are allowed and terminations shall be covered at least 60% with new solder. Characteristics Class 2 11 X7R X8R Change from the value before test 7.5% Meet the initial spec. Insulation Resistance Meet the initial spec. Voltage Proof No insulation breakdown or other damage. Class 2 D.F. (Class 2) TDK MLCC US Catalog Reflow solder the capacitor on P.C. board (shown in Appendix 1a or Appendix 1b) before testing. No mechanical damage. Characteristics X7R X8R Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Leave the capacitor in ambient conditions for 6 to 24h before measurement. Vibration Capacitance Preheating condition Temp.: 15010C Time : 1 to 2min. Solder: H63A (JIS Z 3282) D.F. (Class 2) External appearance Completely soak both terminations in solder at 2605C for 51s. Change from the value before test 7.5% Vibrate the capacitor with amplitude of 1.5mm P-P sweeping the frequencies from 10Hz to 55Hz and back to 10Hz after 1min. Repeat this for 2h each in 3 perpendicular directions. Meet the initial spec. Page 188 Version B11 General Specifications No. Item 12 Temperature cycle External appearance Capacitance C Series - Open Mode Design Performance Reflow solder the capacitors on a P.C. board (shown in Appendix 1a or Appendix 1b) before testing. No mechanical damage. Characteristics Class 2 X7R X8R Change from the value before test 7.5% Expose the capacitor in the conditions in step 1 through step 4, and repeat 5 times consecutively. Leave the capacitor in ambient conditions for 242h before measurement. Step Temperature (C) Time (min.) Meet the initial spec. 1 Min. operating temp. 3 30 3 2 Reference Temp. 2-5 Insulation Resistance Meet the initial spec. 3 Max. operating temp. 2 30 2 4 Reference Temp. 2-5 Voltage Proof No insulation breakdown or other damage. D.F. (Class 2) 13 Test or Inspection Method Moisture Resistance (Steady State) External appearance Capacitance Reflow solder the capacitor on P.C. board (shown in Appendix 1a or Appendix 1b) before testing. No mechanical damage. Characteristics Class 2 X7R X8R Change from the value before test 12.5% D.F. (Class 2) Characteristics X7R: 200% of initial spec. max. X8R: 200% of initial spec. max. Insulation Resistance 1,000M or 50M*F min., whichever smaller. (As for the capacitors of rated voltage 16V DC, 1,000 M or 10M*F min.,) TDK MLCC US Catalog Page 189 Leave at temperature 402C, 90 to 95%RH for 500 +24,0h. Leave the capacitor in ambient condition for 242h before measurement. Version B11 General Specifications C Series - Open Mode Design No. Item 14 Moisture Resistance External appearance Capacitance Performance Reflow solder the capacitors on P.C. board (shown in Appendix 1a or Appendix 1b) before testing. No mechanical damage. Characteristics Class 2 15 Test or Inspection Method X7R X8R Apply the rated voltage at temperature 402C and 90 to 95%RH for 500 +24,0h. Change from the value before test Charge/discharge current shall not exceed 50mA. 12.5% Leave the capacitor in ambient conditions for 242h before measurement. D.F. (Class 2) Characteristics X7R: 200% of initial spec. max. X8R: 200% of initial spec. max. Insulation Resistance 500M or 25M*F min., whichever smaller. (As for the capacitors of rated voltage 16V DC, 500 M or 5M*F min.,) Life External appearance Capacitance Class 2 D.F. (Class 2) Insulation Resistance X7R X8R Leave the capacitors in ambient condition for 242h before measurement. Use this measurement for initial value. Reflow solder the capacitors on P.C. board (shown in Appendix 1a or Appendix 1b) before testing. No mechanical damage. Characteristics Voltage conditioning: Voltage treat the capacitors under testing temperature and voltage for 1 hour. Change from the value before test Apply rated voltage at maximum operating temperature 2C for 1,000 +48, 0h. Some items may be tested at higher voltage (1.2x, 1.5x or 2xRV). Charge/discharge current shall not exceed 50mA. 15% Characteristics X7R: 200% of initial spec. max. X8R: 200% of initial spec. max. 1,000M or 50M*F min., whichever smaller. (As for the capacitors of rated voltage 16V DC, 1,000 M or 10M*F min.,) Leave the capacitor in ambient conditions for 242h before measurement. Voltage conditioning: Voltage treat the capacitors under testing temperature and voltage for 1 hour. Leave the capacitors in ambient condition for 242h before measurement. Use this measurement for initial value. *As for the initial measurement of capacitors (Class 2) on number 6, 10, 11, 12 and 13, leave capacitor at 150 -10, 0C for 1 hour and measure the value after leaving capacitor for 242h in ambient condition. TDK MLCC US Catalog Page 190 Version B11 General Specifications Appendix - 1a Appendix - 1b P.C. Board for reliability test Applied for C2012, C3216 P.C. Board for reliability test Applied for C3225, C4532, C5750 c c Solder Resist 40 mm b 100 mm a 40 mm 100 mm a b C Series - Open Mode Design Solder Resist Slit Copper Copper Appendix - 2 P.C. Board for bending test 100 mm b Solder Resist 40 mm c 1.0 mm a Copper Material : Glass Epoxy ( As per JIS C6484 GE4 ) Case Code P.C. Board thickness: 1.6mm Copper ( thickness 0.035mm ) Solder resist TDK MLCC US Catalog Page 191 Dimensions (mm) JIS EIA a b c C2012 CC0805 1.2 4.0 1.65 C3216 CC1206 2.2 5.0 2.0 C3225 CC1210 2.2 5.0 2.9 C4532 CC1812 3.5 7.0 3.7 C5750 CC2220 4.5 8.0 5.6 Version B11 Soldering Information C Series - Open Mode Design * Recommended Soldering Land Pattern Chip capacitor * Recommended Soldering Profile Wave Soldering Solder land Preheating Unit: mm C2012 [CC0805] C3216 [CC1206] 1.0 - 1.3 2.1 - 2.5 B 1.0 - 1.2 1.1 - 1.3 C 0.8 - 1.1 1.0 - 1.3 A Reflow Soldering C3216 [CC1206] A 0.9 - 1.2 2.0 - 2.4 B 0.7 - 0.9 1.0 - 1.2 C 0.9 - 1.2 1.1 - 1.6 Symbol Reflow Soldering Temp (C) Preheating 3sec. (As short as possible) Unit: mm 2.0 - 2.4 3.1 - 3.7 4.1 - 4.8 B 1.0 - 1.2 1.2 - 1.4 1.2 - 1.4 C 1.9 - 2.5 2.4 - 3.2 4.0 - 5.0 * Recommended Solder Amount Higher tensile force on the chip capacitor may cause cracking. Recommended soldering duration Temp./ Dura. Maximum amount Minimum amount Small solder fillet may cause contact failure or failure to hold the chip capacitor to the P.C. board. Wave Soldering Reflow Soldering Peak temp (C) Duration (sec.) Peak temp (C) Duration (sec.) Sn-Pb Solder 250 max. 3 max. 230 max. 20 max. Lead-Free Solder 260 max. 5 max. 260 max. 10 max. Solder Recommended solder compositions Sn-37Pb (Sn-Pb solder) Sn-3.0Ag-0.5Cu (Lead Free Solder) Preheating Condition Soldering TDK MLCC US Catalog T 0 A Insufficient solder Peak Temp time 300 C5750 [CC2220] Adequate solder Over 60 sec. Manual soldering (Solder iron) C4532 [CC1812] Excessive solder 0 T Peak Temp time C3225 [CC1210] Type Symbol Over 60 sec. Over 60 sec. Unit: mm C2012 [CC0805] Type 0 T Temp. (C) Wave Soldering Solder resist Soldering Natural cooling Preheating Peak Temp Temp. (C) A B Symbol Reflow Soldering Natural cooling Peak Temp C Type Soldering Wave soldering Reflow soldering Manual soldering Page 192 Case Size - JIS (EIA) C2012(CC0805), C3216(CC1206) Temp. (C) T 150 C2012(CC0805), C3216(CC1206) T 150 C3225(CC1210), C4532(CC1812), C5750(CC2220) T 130 C2012(CC0805), C3216(CC1206) T 150 C3225(CC1210), C4532(CC1812), C5750(CC2220) T 130 Version B11 Packaging Information C Series - Open Mode Design * Carrier Tape Configuration Bulk 160mm min. Bulk 160mm min Chips Leader Drawing direction 400mm min * Peel Back Force (Top Tape) * Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm with components in tape. * The missing of components shall be less than 0.1% * Components shall not stick to the cover tape. * The cover tape shall not protrude beyond the edges of the carrier tape and shall not cover the sprocket holes. Direction & angle of pull Top cover tape Carrier tape 0.05 - 0.7 N 0~15 * Chip Quantity Per Reel and Structure of Reel (Paper & Plastic) Paper Carrier Tape & Reel Top cover tape Plastic Carrier Tape & Reel Top cover tape Pitch hole C2012 CC0805 C3216 CC1206 C3225 C4532 C5750 CC1210 CC1812 CC2220 Plastic carrier tape Paper carrier tape Bottom cover tape Case Code JIS EIA Pitch hole Chip Thickness 0.85 mm 1.25 mm 1.15 mm 1.30 mm 1.60 mm 1.15 mm 1.60 mm 2.00 mm 2.30 mm 2.50 mm 1.60 mm 2.00 mm 2.30 mm 1.60 mm 2.00 mm 2.30 mm 2.80 mm TDK MLCC US Catalog Taping Material Paper/Plastic Plastic Plastic Chip quantity (pcs.) 178mm (7") reel 330mm (13") reel 4,000 10,000 2,000 2,000 2,000 10,000 8,000 10,000 8,000 Plastic 1,000 Plastic 1,000 5,000 3,000 500 1,000 Plastic 3,000 500 2,000 Page 193 Version B11 Additional Information C Series - Open Mode Design * Shape & Dimensions * Environmental Information Terminal electrode L B B W G T TDK Corporation established internal product environmental assurance standards that include the six hazardous substances banned by the EU RoHS Directive1 enforced on July 1, 2006 along with additional substances independently banned by TDK and has successfully completed making general purpose electronic components conform to the RoHS Directive2. 1. Abbreviation for Restriction on Hazardous Substances, which refers to the regulation EU Directive 2002/95/EC on hazardous substances by the European Union (EU) effective from July 1, 2006. The Directive bans the use of six specific hazardous substances in electric and electronic devices and products handled within the EU. The six substances are lead, mercury, cadmium, hexavalent chromium, PBB (polybrominated biphenyls), and PBDE (polybrominated diphenyl ethers). 2. This means that, in conformity with the EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Internal electrode Ceramic dielectric Case Code JIS EIA L C2012 CC0805 2.00 C3216 CC1206 3.20 C3225 CC1210 3.20 C4532 CC1812 4.50 C5750 CC2220 5.70 Dimensions (mm) T B 0.85 1.20 0.20 min. 1.25 1.15 1.60 1.30 0.20 min. 1.60 1.15 1.60 0.20 min. 2.50 2.00 2.30 0.30 min. 2.50 1.60 3.20 2.00 0.20 min. 2.30 1.60 2.00 5.00 0.20 min. 2.30 2.80 W G 0.50 min. 1.00 min. 1.00 min. 2.00 min. For REACH (SVHC : 15 substances according to ECHA / October 2008) : All TDK MLCC do not contain these 15 substances. For European Directive 2000/53/CE and 2005/673/CE : Cadmium, Hexavalent Chromium, Mercury, Lead are not contained in all TDK MLCC. For European Directive 2003/11/CE : Pentabromodiphenylether, Octabromodiphenyl-ether are not contained in all TDK MLCC. 2.00 min. * Inside Structure & Material System 3 4 2 1 No. NAME (1) Ceramic Dielectric (2) Internal Electrode (3) (4) 5 MATERIAL Class 1 Class 2 CaZrO3 BaTiO3 Nickel (Ni) Copper (Cu) Termination (5) TDK MLCC US Catalog Nickel (Ni) Tin (Sn) Page 194 Version B11