BC857BLP4
Document number: DS31361 Rev. 5 - 2 1 of 5
www.diodes.com February 2011
© Diodes Incorporated
BC857BLP4
45V PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
Epitaxial Die Construction
Ultra-Small Leadless Surface Mount Package
Ultra-low Profile (0.40mm max)
Complementary NPN Type Available (BC847BLP4)
“Lead Free”, RoHS Compliant (Note 1)
Halogen and Antimony Free "Green" Device (Note 2)
Mechanical Data
Case: DFN1006H4-3
Case Material: Molded Plastic, "Green" Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.0008 grams (approximate)
Ordering Information (Note 3)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
BC857BLP4-7 F2 7 8 3,000
BC857BLP4-7B F2 7 8 10,000
Notes: 1. No purposefully added lead.
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Top View
Device Schematic
Bottom View
F2 = Product Type Marking Code
DFN1006H4-3
Device Symbol
C
E
B
C
E
B
BC857BLP4-7 BC857BLP4-7B
Top View
Bar Denotes Base
and Emitter Side
Top View
Dot Denotes
Collector Side
F2F2
BC857BLP4
Document number: DS31361 Rev. 5 - 2 2 of 5
www.diodes.com February 2011
© Diodes Incorporated
BC857BLP4
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage VCBO -50 V
Collector-Emitter Voltage VCEO -45 V
Emitter-Base Voltage VEBO -5.0 V
Collector Current IC -100 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4) @TA = 25°C PD 250 mW
Thermal Resistance, Junction to Ambient Air (Note 4) @TA = 25°C R
θ
JA 500 °C/W
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic (Note 5) Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage V
(
BR
)
CBO -50 — V
IC = 10μA, IB = 0
Collector-Emitter Breakdown Voltage V
(
BR
)
CEO -45 — V
IC = 10mA, IB = 0
Emitter-Base Breakdown Voltage V
(
BR
)
EBO -5 — V
IE = 1μA, IC = 0
DC Current Gain hFE 220 300 475
VCE = -5.0V, IC = -2.0mA
Collector-Emitter Saturation Voltage VCE(SAT) -90
-250 -300
-650 mV IC = -10mA, IB = -0.5mA
IC = -100mA, IB = -5.0mA
Base-Emitter Saturation Voltage VBE(SAT)
-700
-850
mV IC = -10mA, IB = -0.5mA
IC = -100mA, IB = -5.0mA
Base-Emitter Voltage VBE(ON) -600
-670
-710 -750
-820 mV VCE = -5.0V, IC = -2.0mA
VCE = -5.0V, IC = -10mA
Collector-Cutoff Current ICBO
-15
-4.0 nA
µA VCB = -30V
VCB = -30V, TA = 150°C
Gain Bandwidth Product fT 100 — MHz
VCE = -5.0V, IC = -10mA,
f = 100MHz
Collector-Base Capacitance CCBO — 3.0 — pF
VCB = -10V, f = 1.0MHz
Notes: 4. Device mounted on FR-4 PCB, pad layout as shown on Diodes Inc. suggested pad layout document AP02001 on our website at http://www.diodes.com
5. Short duration pulse test used to minimize self-heating effect.
BC857BLP4
Document number: DS31361 Rev. 5 - 2 3 of 5
www.diodes.com February 2011
© Diodes Incorporated
BC857BLP4
0
50
100
0 255075100125150
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N (mW)
D
T , AMBIENT TEMPERA T URE (°C)
Fig. 1 Power Derating Curve
A
150
200
250
300
R = 500 C/W
θ
JA
°
-V , COLLECTOR-EMITTER VOLTAGE (V)
CE
-I ,
C
O
LLE
C
T
O
R
C
U
R
R
EN
T
(A)
C
Fig. 2 Typical Collector Current vs. Collector-Emitter V oltage
012345
0
20
40
60
80
100
I = -0.1mA
B
I = -0.2mA
B
I = -0.3mA
B
I = -0.4mA
B
I = -0.5mA
B
0
100
200
300
400
500
1 10 100 1,000
I , COLLECTOR CURRENT (A)
C
V , COLLECTOR-EMITTER
SATURATION VOLTAGE (V)
CE(SAT)
Fig. 4 Ty pical Collector-Emitter Saturation Voltage
vs. Collector Current
0
0.1
0.2
0.3
0.1 1 10 100
I , COLLECTOR CURRENT (A)
C
V , BASE-EMITTER TURN-ON VOLT AGE (V)
BE(ON)
Fig. 5 Typical Base-Emitter Turn-On Voltage
vs. C ollecto r Cu r r ent
0
0.2
0.4
0.6
0.8
1.0
0.1 1 10 100
Fig. 6 Typical Base-Emitter Saturation V oltage
vs. Collector Current
I , COLLECTOR CURRENT (A)
C
V , BASE-EMITTER SATURATION VOLTAGE (V)
BE(SAT)
0.1 1 10 100
BC857BLP4
Document number: DS31361 Rev. 5 - 2 4 of 5
www.diodes.com February 2011
© Diodes Incorporated
BC857BLP4
Package Outline Dimensions
Suggested Pad Layout
DFN1006H4-3
Dim Min Max Typ
A 0.40
A1 0 0.05 0.02
b1 0.10 0.20 0.15
b2 0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e 0.35
L1 0.20 0.30 0.25
L2 0.20 0.30 0.25
L3 0.40
All Dimensions in mm
Dimensions Value (in mm)
Z 1.1
G1 0.3
G2 0.2
X 0.7
X1 0.25
Y 0.4
C 0.7
L2
A1
Eb2
L1L3
D
e
b1
A
Y
C
G1
G2
X
X
1
Z
BC857BLP4
Document number: DS31361 Rev. 5 - 2 5 of 5
www.diodes.com February 2011
© Diodes Incorporated
BC857BLP4
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LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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