Product description:
• Halogen free, lead free, RoHS compliant
• High I2t 1206 footprint surface mount
fuse
• High inrush withstand capability
• Excellent temperature and cycling
characteristics
• RoHS compliant, and lead free and
halogen free construction
• Compatible with solder reflow and wave
solder
Applications
• Flat panel displays and televisions
• Automotive infotainment and ECU
• Computer servers
• Portable electronics
• Mobile device chargers
Agency information
• cURus Recognition File number: E19180, Guide
JDYX2/JDYX8
• AEC-Q200 Automotive Grade Certified
Ordering
• 3000 fuses on 8mm tape-and-reel on a 7 inch
(178mm) reel per EIA Standard 481. Specify
Catalog Symbol and package code suffix
“-TR”(e.g., CC12H1A-TR)
Bussmann CC12H Series
High I2t Chip™ fuses
Technical Data 4309
Effective July 2014
Supersedes May, 2013
Bussmann is now
part of Eaton
Same great
products plus
even more.
The Bussmann brand of
circuit protection products
(formerly of the
Bussmann Division of
Cooper Industries) is now
part of Eaton’s Electrical
Group, Electronics
Division.
HALOGEN
HF
FREE
Pb
www.eaton.com/elx2
Technical Data 4309
Effective July 2014
CC12H Series
High I2t Chip™ fuses
Electrical characteristics
Amp Rating % of Amp Rating Opening Time
750mA-20A 100% 4 Hours, min
1-3A 200% 1-60 Seconds
1-5A 250% 5 Seconds, max
1-5A 300% 0.1-3 Seconds
750mA, 6-20A 350% 5 Seconds, max
750mA-20A 1000% 0.2-20mS
Specifications
Catalog
Symbol
Current Rating
(amps)
Voltage Rating
(Vdc)
Interrupting
Rating* (amps)
Resistance
(Ω)** Typical
Typical Melt
(I2t)† DC
Typical Voltage
Drop (mV)‡
Alpha
Marking
CC12H750mA 0.75 63 50 0.780 0.15 840 E
CC12H1A 1 63 50 0.470 0.18 490 H
CC12H1.5A 1.5 63 50 0.218 0.4 355 K
CC12H2A 2 63 50 0.133 1.1 305 N
CC12H2.5A 2.5 63 50 0.079 1.7 240 O
CC12H3A 3 63 50 0.049 2.2 185 P
CC12H3.5A 3.5 63 50 0.037 2.7 180 R
CC12H4A 4 63 50 0.033 3.2 169 S
CC12H4.5A 4.5 32 100 0.028 4.2 160 X
CC12H5A 5 32 100 0.023 6.0 140 T
CC12H6A 6 32 100 0.0155 8.0 140 F
CC12H7A 7 32 100 0.011 9.0 120 J
CC12H8A 8 32 100 0.007 12.0 80 M
CC12H10A 10 32 100 0.0065 33 90 U
CC12H12A 12 32 100 0.0045 45 80 W
CC12H15A 15 32 100 0.0030 40 70 Y
CC12H20A 20 32 100 0.0020 50 60 Q
* DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source)
** DC Cold Resistance (Measured at 10% of rated current)
† Typical Melting I2t (Measured with a battery bank at rated DC voltage, 10x-rated current, not to exceed interrupting rating, time constant of calibrated circuit less than 50
microseconds)
‡ Typical Voltage Drop (Measured at rated current after temperature stabilizes)
Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at
elevated ambient temperatures.
Dimensions - mm (in)
Drawing not to scale.
Environmental data
• Thermal Shock: MIL-STD-202, Method 107, Test Condition B
• Vibration: MIL-STD-202, Method 204, Test Condition C
• Moisture Resistance: MIL-STD-202, Method 106, 50 day cycle
• Solderability: ANSI/J-STD-002, Test B
• Normal ambient temperature: 23°C
• Operating temperature range -40°C to +125°C
Soldering method
• Wave Solder Immersion: 260°C, 10 seconds maximum.
• Solder Reflow: 260°C, 30 seconds maximum.
End View
Top View
Side View
0.51 +/- 0.25 typ.
(0.02 +/- 0.01)
0.51 +/- 0.25 typ.
(0.02 +/- 0.01)
1.6 +/- 0.2
(0.063 +/- 0.008)
3.2 +/- 0.2
(0.126 + /- 0.008)
1.6 +/- 0.2 typ.
(0.063 +/- 0.008)
0.6 + 0.2, -0.15
(0.024 +0.008, -0.006)
Pad layout
1.52 (0.06)
1.52 (0.06)
2.03 (0.08)
www.eaton.com/elx 3
Time-current curves — 750mA-5A average melt
Technical Data 4309
Effective July 2014
CC12H Series
High I2t Chip™ fuses
www.eaton.com/elx4
Technical Data 4309
Effective July 2014
CC12H Series
High I2t Chip™ fuses
Time-current curves — 6A-20A average melt
www.eaton.com/elx 5
Technical Data 4309
Effective July 2014
CC12H Series
High I2t Chip™ fuses
I2t vs. time curves — 750mA-5A
I2t (A2s)
www.eaton.com/elx6
I2t vs. time curves — 6A-20A
Technical Data 4309
Effective July 2014
CC12H Series
High I2t Chip™ fuses
I2t (A2s)
www.eaton.com/elx 7
Technical Data 4309
Effective July 2014
CC12H Series
High I2t Chip™ fuses
I2t vs. current curves — 750mA-5A
I2t (A2s)
www.eaton.com/elx8
Technical Data 4309
Effective July 2014
CC12H Series
High I2t Chip™ fuses
I2t vs. current curves — 6A-20A
I2t (A2s)
www.eaton.com/elx 9
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Eaton’s Electrical Group
Electronics Division
114 Old State Road
Ellisville, MO 63021
United States
www.eaton.com/elx
© 2014 Eaton
All Rights Reserved
Publication No. 4309 — BU-SB14479
July 2014
North America
Eaton’s Electrical Group
Electronics Division
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Eaton’s Electrical Group
Electronics Division
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Eaton’s Electrical Group
Electronics Division
Burton-on-the-Wolds
Leicestershire, LE 12 5th UK
Phone: +44 (0) 1509 882 600
Fax: +44 (0) 1509 882 786
Eaton’s Electrical Group
Electronics Division
Avda Santa Eulalia, 290
Terrassa, Barcelona 08223 Spain
Phone: +34-93-736-2813
Fax: +34-93-783-5055
Asia Pacific
Eaton’s Electrical Group
Electronics Division
No.2, #06-01
Serangoon North Avenue 5
Singapore 554911
Tel: +65 6645 9888
Fax: +65 6728 3155
The only controlled copy of this Data Sheet is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained
in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support
systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
Technical Data 4309
Effective July 2014
CC12H Series
High I2t Chip™ fuses
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Table 1 - Standard SnPb Solder (Tc)
Volume Volume
Packagemm3mm3
Thickness <350 >
_350
<2.5mm 235°C 220°C
>
_2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Volume Volume Volume
Packagemm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min.(Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
L
) 183°C 217°C
Time at liquidous (tL) 60-150 Seconds 60-150 Seconds
Peak package body temperature (TP)* Table 1Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tpto Tsmax) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Solder reflow profile
