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Power Management Switch ICs for PCs and Digital Consumer Products
Load Switch ICs
for Potable Equipment
BD2202G, BD2206G
●Description
The High-side switch for memory card slot is an IC High-side switch with a function of over-current protection used in the power
supply line of a memory card slot. In the switch part an N channel MOSFET low ON resistance has been 1 circuit integrated.
The switch goes OFF when the over-current condition lasts longer than the over-current shutdown time. The OFF switch is
set on latch off mode.The operating voltage range is 2.7V to 3.6V and the current limit value is set on 400mA, 1A.
Moreover, a soft start function, an under voltage lockout function and an over temperature protection function are integrated.
●Feature
1) Single low on-resistance (Typ. = 150mΩ) Nch MOS FET
2) Continuous load current 0.2A(BD2202G) / 0.5A(BD2206G)
3) Control input logic: Active-High
4) Soft start function
5) Over current protection circuit
6) Over temperature protection circuit
7) Under voltage lockout
8) Power supply voltage range 2.7V～3.6V
9) Operating temperature range -25℃～85℃
●Applications
Memory card slots of STB, Digital still camera, Cell Phones, Notebook PC.
●Line up
Parameter BD2202G BD2206G
Continuous load current (A) 0.2 0.5
Short circuit current limit (A) 0.4 1.0
Logic Control input High High
●Absolute Maximum Ratings
Parameter Symbol Limits Unit
Supply voltage VIN -0.3 to 6.0 V
En voltage VEN -0.3 to 6.0 V
OUT voltage VOUT -0.3 to VIN + 0.3 V
Storage temperature TSTG -55 to 150 °C
Power dissipation PD 675*1 mW
*1 Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating : 5.4mW/℃ for operating above Ta=25℃
* Does not do radiation resistance design.
* There is no operation guarantee.
●Operating conditions
◎BD2202G
Parameter Symbol Limits Unit
Operating voltage range VIN 2.7 to 3.6 V
Operating temperature range TOPR -25 to 85 °C
Operating load current ILO 0 to 200 mA
◎BD2206G
Parameter Symbol Limits Unit
Operating voltage range VIN 2.7 to 3.6 V
Operating temperature range TOPR -25 to 85 °C
Operating load current ILO 0 to 500 mA
No.11029EBT07
BD2202G,BD2206G
Technical Note
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© 2011 ROHM Co., Ltd. All rights reserved.
●Electrical characteristics
◎BD2202G (Unless otherwise specified, VIN = 3.3V, Ta = 25°C)
DC characteristics
Parameter Symbol
Limits Unit Condition
Min. Typ. Max.
Operating current IDD - 70 90 μA VEN = 3.3V, VOUT = OPEN
Standby current ISTB - 0.01 1 μA VEN = 0V, OUT = OPEN
EN input voltage VEN 2.0 - - V High level input
- - 0.8 V Low level input
EN input current IEN -1.0 0.01 1.0 μA VEN = 0V or VEN = 3.3V
ON resistance RON - 150 200 mΩ IOUT = 50mA
Short-circuit output current ISC 200 - 600 mA VOUT = 0V
Output leak current ILEAK - 0.01 10 μA VEN = 0V, VOUT = 0V
UVLO threshold VTUVH 2.1 2.3 2.5 V VIN increasing
VTUVL 2.0 2.2 2.4 V VIN decreasing
AC characteristics
Parameter Symbol
Limits Unit Condition
Min. Typ. Max.
Output rise time TON1 0.25 1.2 6 ms ROUT=500Ω, COUT=0.1μF
Output turn on time TON2 0.4 2 10 ms ROUT=500Ω, COUT=0.1μF
Output fall time TOFF1 50 100 200 μs ROUT=500Ω, COUT=0.1μF
Output turn off time TOFF2 50 100 200 μs ROUT=500Ω, COUT=0.1μF
Over current shutdown time 1 TBLANK1 5 10 15 ms At continuous over current
Over current shutdown time 2 TBLANK2 3 - 15 ms At discontinuous over current
◎BD2206G (Unless otherwise specified, VIN = 3.3V, Ta = 25°C)
DC characteristics
Parameter Symbol
Limits Unit Condition
Min. Typ. Max.
Operating current IDD - 70 90 μA VEN = 3.3V, VOUT = OPEN
Standby current ISTB - 0.01 1 μA VEN = 0V, OUT = OPEN
EN input voltage VEN 2.0 - - V High level input
- - 0.8 V Low level input
EN input current IEN -1.0 0.01 1.0 μA VEN = 0V or VEN = 3.3V
ON resistance RON - 150 200 mΩ IOUT = 50mA
Short-circuit output current ISC 750 - 1350 mA VOUT = 0V
Output leak current ILEAK - 0.01 10 μA VEN = 0V, VOUT = 0V
UVLO threshold VTUVH 2.1 2.3 2.5 V VIN increasing
VTUVL 2.0 2.2 2.4 V VIN decreasing
AC characteristics
Parameter Symbol
Limits Unit Condition
Min. Typ. Max.
Output rise time TON1 0.25 1.2 6 ms ROUT=500Ω, COUT=0.1μF
Output turn on time TON2 0.4 2 10 ms ROUT=500Ω, COUT=0.1μF
Output fall time TOFF1 50 100 200 μs ROUT=500Ω, COUT=0.1μF
Output turn off time TOFF2 50 100 200 μs ROUT=500Ω, COUT=0.1μF
Over current shutdown time 1 TBLANK1 5 10 15 ms At continuous over current
Over current shutdown time 2 TBLANK2 3 - 15 ms At discontinuous over current
BD2202G,BD2206G
Technical Note
3/12
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© 2011 ROHM Co., Ltd. All rights reserved.
●Measurement circuits
VIN
GND
EN
OUT
NC
VIN
GND
EN
OUT
NC
Operating current EN input voltage, Output rise / fall time
VIN
GND
EN
OUT
NC
VIN
GND
EN
OUT
NC
ON resistance Over current protection characteristics
Fig.1 Measurement circuits
●Timing diagrams
Fig.2 Switch Turn on / off time Fig.3 Over current limits characteristics
TON2 TOFF2
TON1 TOFF1
VEN
VOUT
50% 50%
10%
90%
10%
90%
V
OUT
I
OUT
T
BLANK
Over current detection
BD2202G,BD2206G
Technical Note
4/12
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© 2011 ROHM Co., Ltd. All rights reserved.
●Reference data
0.0
0.2
0.4
0.6
0.8
1.0
2 2.5 3 3.5 4
SUPPLY VOLTAGE : VIN [V]
OPERATING CURRENT :
ISTB[uA]
0
10
20
30
40
50
60
70
80
90
-50 0 50 100
AMBIENT TEMPERATURE : Ta [°C]
OPERATING CURRENT :
IDD [μA]
0
10
20
30
40
50
60
70
80
90
22.533.54
SUPPLY VOLTAGE : VIN [V]
OPERATING CURRENT :
IDD [μA]
Fig.6 Operating current
EN Disable
Fig.7 Operating current
EN Disable
Fig.4 Operating current
EN Enable
VIN=3.3V Ta=2 5° C
Fig.5 Operating current
EN Enable
0.0
0.5
1.0
1.5
2.0
22.533.54
SUPPLY VOLTAGE : VIN[V]
ENABLE INPUT VOLTAGE :
VEN, V/EN[V] 0
Low to Hi
g
h
High to Low
Ta=2 5° C
Fig.8 EN input voltage
0.0
0.5
1.0
1.5
2.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
ENABLE INPUT VOLTAGE :
VEN, V/EN[V]
VIN=3.3 V
High to Lo
w
Low to High
Fig.9 EN input voltage
Fig.10 ON resistance Fig.11 ON resistance Fig.12 Short circuit output current
(BD2202G)
0
50
100
150
200
250
-50 0 50 100
AMBIENT TEMPERATURE : Ta [℃]
ON RESISTANCE :
RON[mΩ]
VIN=3.3V
Fig.13 Short circuit output current
(BD2202G)
Ta=2 5° C
0.0
0.2
0.4
0.6
0.8
1.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta [℃]
OPERATING CURRENT :
ISTB[uA]
VIN=3.3V
0
50
100
150
200
250
22.533.54
SUPPLY VOLTAGE : VDD[V]
ON RESISTANCE :
RON[mΩ]
Ta=2 5° C
0.2
0.3
0.4
0.5
0.6
22.533.54
SUPPLY VOLTAGE : VIN[V]
SHORT CIRCUIT CURRENT :
ISC[A]
Ta=2 5° C
Fig.14 Short circuit output current
(BD2206G)
0.2
0.3
0.4
0.5
0.6
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
SHORT CIRCUIT CURRENT :
ISC[A]
VIN=3.3V
Fig.15 Short circuit output current
(BD2206G)
0.75
0.85
0.95
1.05
1.15
1.25
1.35
22.533.54
SUPPLY VOLTAGE : VIN[V]
SHORT CIRCUIT CURRENT : ISC[A]
Ta=2 5° C
0.75
0.85
0.95
1.05
1.15
1.25
1.35
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
SHORT CIRCUIT CURRENT : ISC[A]
VIN=3.3V
BD2202G,BD2206G
Technical Note
5/12
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Fig.21 Output turn on time
Fig.22 Output fall time
Fig.25 Output turn off time
0
500
1000
1500
2000
2500
2 2.5 3 3.5 4
SUPPLY VOLTAGE : VIN [V]
TURN ON TIME :
TON2 [ms]
Ta=2 5° C
50
100
150
200
2 2.5 3 3.5 4
SUPPLY VOLTAGE : VIN [V]
FALL TIME :
TOFF1[us]
Ta=2 5° C
Fig.23 Output fall time
50
100
150
200
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
FALL TIME :
TOFF1[us]
VIN=3.3V
Fig.24 Output turn off time
50
100
150
200
22.5 33.54
SUPPLY VOLTAGE : VIN [V]
TURN OFF TIME :
TOFF2[us]
Ta=2 5° C
50
100
150
200
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN OFF TIME :
TOFF2[us]
VIN=3.3V
Fig.26 UVLO threshold voltage
2
2.1
2.2
2.3
2.4
2.5
-50 0 50 100
AMBIENT TEM PERATURE : Ta[℃]
TURN OFF TIME :
TOFF2[us]
VUVLOH
VUVLOL
Fig.27 UVLO hysteresis voltage
0.00
0.04
0.08
0.12
0.16
0.20
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
UVLO HYSTERESIS VOLTAGE :
VHYS[V]
Fig.19 Output rise time
0
500
1000
1500
2000
2500
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
RISE TIME :
TON1 [us]
VIN=3.3V
Fig.20 Output turn on time
0
500
1000
1500
2000
2500
2 2.5 3 3.5 4
SUPPLY VOLTAGE : VIN [V]
RISE TIME :
TON1 [us]
Ta=2 5° C
Fig.16 Over current shutdown time
Fig.18 Output rise time
5
6
7
8
9
10
11
12
13
14
15
2 2.5 3 3.5 4
SUPPLY VOLTAGE : VIN [V]
OVER CURRENT SHUTDOWN TIME :
TBLANK1[ms]
Ta=2 5° C
Fig.17 Over current shutdown time
5
6
7
8
9
10
11
12
13
14
15
-50 0 50 100
SUPPLY VOLTAGE : Ta[℃]
OVER CURRENT SHUTDOWN TIME :
TBLANK1[ms]
VIN=3.3V
0
500
1000
1500
2000
2500
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN ON TIME :
TON2 [us]
VIN=3.3V
BD2202G,BD2206G
Technical Note
6/12
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●Waveform data
IOUT
(0.1A/div.)
VOUT
(1V/div.)
VEN
(1V/div.)
V/EN
(1/div.)
V/EN
(1/div.)
VIN=3.3V
RL=500Ω
CL=0.1uF
VIN=3.3V
RL=500
CL=0.1
VOUT
(1/div.)
VOUT
(1/div.)
VOUT
(1V/div.)
IOUT
(0.2A/div.)
TIME (0.5div.)
Fig.28 Output turn on response
TIME (0.5div.)
Fig.29 Output turn off response
TIME (2ms/div.)
Fig.32 Current limit response
Output shorted to GND
(BD2202G)
TIME (2ms/div.)
Fig.33 Current limit response
Output shorted to GND
(BD2206G)
TIME (5ms/div.)
Fig.34 Current limit response
Ramped load (1A/10ms)
(BD2202G)
VIN
(1V/div.)
VOUT
(1V/div.)
IOUT
(10mA/div.)
TIME (5ms/div.)
Fig.35 Current limit response
Ramped load (1A/10ms)
(BD2206G)
TIME (5ms/div.)
Fig.36 UVLO VIN rising
VIN
(1V/div.)
VOUT
(1V/div.)
IOUT
(10mA/div.)
TIME (500ms/div.)
Fig.37 UVLO VIN falling
VOUT
(1V/div.)
IOUT
(0.2A/div.)
TIME (2ms/div.)
Fig.30 Current limit response
Enable into short circuit
(BD2202G)
TIME (2ms/div.)
Fig.31 Current limit response
Enable into short circuit
(BD2206G)
IOUT
(0.2A/div.)
VOUT
(1V/div.)
VEN
(1V/div.)
IOUT
(0.1A/div.)
VOUT
(1V/div.)
IOUT
(0.2A/div.)
VOUT
(1V/div.)
RL=500Ω
CL=0.1uF
RL=500Ω
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
BD2202G,BD2206G
Technical Note
7/12
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●Block diagram
Control logic
Charge
pump
Thermal
shutdown
Current
limit
VIN
EN
VOUT
UVLO
GND
Fig.38 Block diagram Fig.39 Pin configuration
●Pin description
Pin Number Pin Name I / O Pin function
1 VIN I
Power supply input terminal.
Input terminal to the power switch and power supply input terminal of the internal
circuit.
2 GND I
Ground.
3 EN I
Power Switch enable input.
Active-High Switch on input. A logic high turns the switch on.
4 N.C -
No connection. Not internally connected.
5 VOUT O
Power switch output
●I/O circuit
Pin Name Pin Number Equivalent circuits
EN 3
VOUT 5
VIN
GND
EN
OUT
NC
BD2202G,BD2206G
Technical Note
8/12
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●Operation description
BD2202G and BD2206G are high side switch IC with over-current protection function. The operating voltage range is from
2.7V to 3.6V and the current limit value is set on 400mA, 1A.
When an over-current condition lasts longer than an over-current shutdown time, the switch turns OFF. The OFF switch is set
on latch mode. The switch set on latch mode returns (to normal) by toggling EN pin from High to Low to High.
1.Switch On/Off control
VIN and VOUT pins are connected to each switch MOSFET drain and source. Moreover, VIN pin is also used as a power
supply input for the internal control circuit.
When the switch is turned on from EN control input, VIN and VOUT is connected by a 150mΩ switch. In normal condition,
the switch shows bidirectional. Therefore, when the voltage of VOUT is higher than VIN the current flows from VOUT to
VIN.
In the switch MOSFET, there is a parasitic diode (body diode) between drain and source. So, even when the switch is off,
when voltage of VOUT is higher than VIN, the current flows through the body diode from VOUT to VIN.
2. Over current detection (OCD)
The over current detection circuit limits current when current flowing in switch MOSFET exceeds the current limit threshold.
There are three types of response against over current. The over current detection circuit is in operation when the power
switch is ON (when EN signal is active).
2-1 When the switch is turned on while the output is in short-circuit status
When the switch is turned on while the output is in short-circuit status, the switch become current limit mode soon.
2-2 When the output short-circuits while the switch is on
When the output short-circuits or heavy load is connected while the switch is on, very large current flows until the over
current limit circuit responds. When the current detection, limit circuit works, current limitation is carried out.
2-3 When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the over
current detection value. When it exceeds the detection value, current limitation is carried out.
3.Over current shutdown
When the over-current detection circuit detects an over-current, TBLANK timer starts working. When the over-current
condition disappears before TBLANK2 stage, TBLANK timer is reset. When the over-current condition progresses to more
than TBLANK1, the switch is shut off. The OFF switch is set on latch off mode. The latch is reset when EN terminal is
toggled or when UVLO is detected.
4.Under voltage lockout (UVLO)
UVLO keeps the power switch off until VIN voltage exceeds 2.3V (Typ.). Moreover, from a power switch ON situation, if
VIN voltage drops to 2.2V (Typ.), the power switch is set on OFF. UVLO has a 100mV hysteresis. The under voltage lock
out circuit is in operation when power switch is ON (when EN signal is active).
5.Thermal shutdown
When the chip temperature increases to 160°C (Typ.), the thermal shut down circuit works and the power switch is turned
OFF. When the chip temperature falls to 140°C (Typ.), the power switch output returns (to normal). This operation will
repeat itself until the causes of the chip temperature rise are removed or until the power switch output is turned off.
The thermal shutdown circuit is in operation when the power switch is ON (when EN signal is active).
BD2202G,BD2206G
Technical Note
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Fig.40 Over-current detection, shutdown operation (return with EN input)
Fig.41 Over-current detection, shutdown operation (return with UVLO operation)
●Typical application circuit
Fig.42 Typical application circuit
Control logic
Charge
pump
Thermal
shutdown
Current
limit
VIN
EN
VOU T
UVLO
GND
Cin
V
IN
OFF ON
Cout Rout
T
BLANK2
T
BLANK1
ONOFFON
Ou tp ut cu rren
t
S wi tch s ta tu s
EN voltage
S wi tch s ta tu s
VIN vo lta ge
T
BLANK2
T
BLANK1
ON OFF ON
Ou tp ut cu rren
t
V
TUVH
V
TUV
L
BD2202G,BD2206G
Technical Note
10/12
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© 2011 ROHM Co., Ltd. All rights reserved.
0
100
200
300
400
500
600
700
800
0255075100125150
AMBIENT TEMPERATURE : Ta [℃]
POWER DISSIPATION : Pd [mW]
●Application information
When an excessive current flows because of an output short circuit, a noise caused by the inductance of power supply to the
IC breaks out and it is possible that it influences negatively the IC operation. In order to avoid this problem, please connect
CIN bypass capacitor close to the IC VIN and GND pins of the IC. More than 1µF is recommended.
Due to the internal body diode in the switch, a CIN greater than COUT is highly recommended.
This system connection diagram does not guarantee operation as an application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
●Power dissipation characteristics
(SSOP5)
Fig.43 Power dissipation curve (Pd-Ta Curve)
●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
BD2202G,BD2206G
Technical Note
11/12
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(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
BD2202G,BD2206G
Technical Note
12/12
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© 2011 ROHM Co., Ltd. All rights reserved.
●Ordering part number
B D 2 2 0 2 G - E 2
Part No. Part No.
2202
2206
Package
G: SSOP5
Packaging and forming specification
TR: Embossed tape and reel
(SSOP5)
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
(Unit : mm)
SSOP5
2.9±0.2
0.13
4°+6°
−4°
1.6
2.8±0.2
1.1±0.05
0.05±0.05
+0.2
−0.1
+0.05
−0.03
0.42+0.05
−0.04
0.95
54
123
1.25Max.
0.2Min.
0.1 S
S
R1120
A
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Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-
controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.