ESD5V3U4UHDMIE6327XTSA1 - INFINEON TECHNOLOGIES AG

Industrial and Multi-Market

Data Sheet

Revision 1.0, 2011-06-30

Final

ESD5V3U4U-HDMI

Uni-directional Ultra-low Capacitance ESD / Transient Protection Array

ESD5V3U4U-HDMI

TVS Diode

Transient Voltage Suppressor Diode

Edition 2011-06-30

Published by

Infineon Technologies AG

81726 Munich, Germany

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any

information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties

and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights

of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the types in

question, please contact the nearest Infineon Technologies Office.

Infineon Technologies components may be used in life-support devices or systems only with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

be endangered.

ESD5V3U4U-HDMI

FinalData Sheet 3 Revision 1.0, 2011-06-30

Trademarks of Infineon Technologies AG

AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™,

CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,

EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™,

MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™,

PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™,

SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,

TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™.

Other Trademarks

Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,

PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR

development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,

FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.

FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of

Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data

Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of

MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics

Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™

of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,

OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.

RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.

SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden

Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.

UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™

of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of

Diodes Zetex Limited.

Last Trademarks Update 2010-10-26

Revision History

Page or Item Subjects (major changes since previous revision)

Revision 1.0, 2011-06-30

all data sheet conversion to Framemaker template

ESD5V3U4U-HDMI
Table of Contents
   
FinalData Sheet 4 Revision 1.0, 2011-06-30
  
Table of Contents  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  6
Predefined Names   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  7
1 Uni-directional Ultra-low Capacitance ESD / Transient Protection Array  . . . . . . . . . . . . . . . . . . .  8
1.1 Features  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
1.2 Application Examples  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
2 Product Description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
3 Characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9
3.1 Electrical Characteristics at TA = 25 °C, unless otherwise specified   . . . . . . . . . . . . . . . . . . . . . . . . . .  9
3.2 Typical Characteristics at TA = 25°C, unless otherwise specified   . . . . . . . . . . . . . . . . . . . . . . . . . . .  11
4 Application Information  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16
5 Ordering Information Scheme (Examples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
6 Package Information   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
6.1 PG-TSLP-9-1   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
References   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  20
Terminology   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  21
Table of Contents

ESD5V3U4U-HDMI
List of Figures
   
FinalData Sheet 5 Revision 1.0, 2011-06-30
  
Figure 2-1  Pin Configuration and Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
Figure 3-1 Definitions of Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9
Figure 3-2 Reverse current: IR = f(TA) , VR = 5.3 V, (I/O to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11
Figure 3-3 Diode capacitance: CL = f(VR), (I/O to GND)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11
Figure 3-4 Line capacitance: CL = f(TA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12
Figure 3-5 Line capacitance: CL = f(f), (I/O to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12
Figure 3-6 Forward clamping voltage: ITLP = f(VTLP), (GND to I/O) [1]. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13
Figure 3-7 Reverse clamping voltage: ITLP = f(VTLP), (I/O to GND) [1]  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13
Figure 3-8 IEC61000-4-2 VCL = f(t), 8 kV positive pulse, (I/O to GND)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14
Figure 3-9 IEC61000-4-2 VCL = f(t), 8 kV negative pulse, (I/O to GND). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14
Figure 3-10  IEC61000-4-2 VCL = f(t), 15 kV positive pulse, (I/O to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15
Figure 3-11  IEC61000-4-2 VCL = f(t), 15 kV negative pulse, (I/O to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15
Figure 4-1 4 lines, uni-directional ESD5V3U4U-HDMI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16
Figure 5-1 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
Figure 6-1 PG-TSLP-9-1: Package overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
Figure 6-2 PG-TSLP-9-1: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
Figure 6-3 PG-TSLP-9-1: Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  19
Figure 6-4 PG-TSLP-9-1: Marking (example)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  19
List of Figures

ESD5V3U4U-HDMI

List of Tables

FinalData Sheet 6 Revision 1.0, 2011-06-30

Table 2-1 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 3-1 Maximum Rating at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 3-2 DC Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 3-3 RF Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 3-4 ESD Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

List of Tables

ESD5V3U4U-HDMI

Predefined Names

FinalData Sheet 7 Revision 1.0, 2011-06-30

Predefined Names

-----------------------------------------------------------------------------

Definition of “Predefined Names”

Frequently used expressions, such as component names, file names, tools releases, version numbers, proprietary

variables and software links, can be used in a similar way as user variables. However, they must be listed in a

special table and not in the standard file “Variables”.

Correct Usage

Steps:

1. Insert all expressions into the left column of the above table.

2. Insert an initial Cross-Reference into the right column of the same row. The initial Cross-Reference is

necessary to ensure that a single ID is used in all your documents using the “Predefined_Names.fm” file

(Example: X-GOLD has the unique ID = CHDGHJGH).

3. Insert a Cross-Reference (Element “CrossReference”) into your document to the Element Identifier of the

“Predefined_Names.fm” file. Set the output format of the Cross-Reference to “Variable” (example: X-GOLD).

Notes

1. All documents in a project (such as XMM) and within a book should use the same file “Predefined Names”.

This allows copying content between different documents. For this reason, local versions of “Predefined

Names” must not be produced.

2. New definitions must be inserted in a new row. Never change existing definitions, as they might be used in

other documents.

3. This file does not need to be included in your book, but it must be in the fm sub-folder of your document.

4. You can sort the above table with FrameMaker only if the initial cross-reference in the right column has been

properly inserted. Otherwise, the table may only be sorted by hand, as the cross-references to your document

would get lost.

Name Initial Cross-Reference

X-GOLD X-GOLD

XMM XMM

ESD5V3U4U-HDMI

Uni-directional Ultra-low Capacitance ESD / Transient Protection Array

FinalData Sheet 8 Revision 1.0, 2011-06-30

1 Uni-directional Ultra-low Capacitance ESD / Transient Protection

Array

1.1 Features

• ESD / Transient protection of high speed data lines exceeding:

– IEC61000-4-2 (ESD): ±20 kV (air / contact)

– IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns)

– IEC61000-4-5 (surge): 3 A (8/20 μs)

• Maximum working voltage: VR = 5.3 V

• Very low reverse current: IR < 1 nA typ.

• Extremely low capacitance: 0.4 pF typ. (I/O to GND)

• Four-lines protection array with pad pitch = 0.5 mm

• Flow-through design for optimal PCB layout of differential lines

• Pb-free package (RoHS compliant) and halogen free package

1.2 Application Examples

• Protection of high speed digital interfaces like:

• HDMI 1.3, HDMI 1.4a, MHL, DisplayPort, S-ATA, DVI, MIPI, MDDI

• USB2.0, 10/100/1000 Ethernet, FireWire

2 Product Description

Figure 2-1 Pin Configuration and Schematic Diagram

Table 2-1 Ordering information

Type Package Configuration Marking code

ESD5V3U4U-HDMI PG-TSLP-9-1 4 lines, uni-directional Z1

b) Schematic diagrama) Pin configuration

Pin 1 Pin 2 Pin 4 Pin 5Pin 3

Pin 9 Pin 8 Pin 7 Pin 6

PG-TSLP-9-1_PinConf_and_SchematicDiag.vsd

Pin 1 Pin 2 Pin 4 Pin 5

Pin 3

I/O I/O I/O I/O

GND

ESD5V3U4U-HDMI

Characteristics

FinalData Sheet 9 Revision 1.0, 2011-06-30

3 Characteristics

3.1 Electrical Characteristics at TA = 25 °C, unless otherwise specified

Figure 3-1 Definitions of Electrical Characteristics

Table 3-1 Maximum Rating at TA = 25 °C, unless otherwise specified

Parameter Symbol Values Unit

Min. Typ. Max.

ESD (air / contact) discharge1)

1) VESD according to IEC61000-4-2

VESD ––20kV

Peak pulse current (tp = 8/20 μs)2)

2) IPP according to IEC61000-4-5

IPP ––3A

Operating temperature range TOP -40 – 125 °C

Storage temperature Tstg -65 – 150 °C

Table 3-2 DC Characteristics at TA = 25 °C, unless otherwise specified

Parameter Symbol Values Unit Note /

Test Condition

Min. Typ. Max.

Reverse working voltage VRWM ––5.3V

Breakdown voltage VBR 6––VIBR = 1 mA

(I/O to GND)

Reverse current IR–<150nAVR = 5.3 V

(I/O to GND)

Diode_Characteristic_Curve_Uni-directional.vsd

RDYN: Dynamic resistance

VBR

: Breakdown voltage

VRWM

: Maximum working voltage

VCL

: Clamping voltage

VFC: Forward clamping voltage

IPP

: Peak pulse current

VFC

VRWM

VBR

VCL

IPP

IRWM

RDYN

: Forward voltage

: Forward current

VR: Reverse voltage

IR: Reverse current

ESD5V3U4U-HDMI

Characteristics

FinalData Sheet 10 Revision 1.0, 2011-06-30

Table 3-3 RF Characteristics at TA = 25 °C, unless otherwise specified

Parameter Symbol Values Unit Note /

Test Condition

Min. Typ. Max.

Line capacitance1)

1) Total capacitance line to ground

CL–0.40.6pFVR = 0 V, f = 1 MHz

(I/O to GND)

Line capacitance1) CL–0.20.3pFVR = 0 V, f = 1 MHz

(I/O to I/O)

Table 3-4 ESD Characteristics at TA = 25 °C, unless otherwise specified

Parameter Symbol Values Unit Note /

Test Condition

Min. Typ. Max.

Clamping voltage1)

1) Please refer to Application Note AN210 [1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging window: t1 = 30 ns

to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP characteristic between IPP1 = 10 A and

IPP2 = 40 A.

VCL –19–VIPP = 16 A

(I/O to GND)

–28–V

IPP = 30 A

(I/O to GND)

Forward clamping

voltage1)

VFC –10–VIPP = 16 A

(GND to I/O)

–17–V

IPP = 30 A

(GND to I/O)

Dynamic resistance1) RDYN –0.6–ΩI/O to GND

– 0.5 – GND to I/O

ESD5V3U4U-HDMI

Characteristics

FinalData Sheet 11 Revision 1.0, 2011-06-30

3.2 Typical Characteristics at TA = 25°C, unless otherwise specified

Figure 3-2 Reverse current: IR = f(TA) , VR = 5.3 V, (I/O to GND)

Figure 3-3 Diode capacitance: CL = f(VR), (I/O to GND)

10-11

10-10

10-9

10-8

10-7

10-6

25 50 75 100 125 150

IR [A]

TA [°C]

0.2

0.4

0.6

0.8

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

CL [pF]

VR [V]

ESD5V3U4U-HDMI

Characteristics

FinalData Sheet 12 Revision 1.0, 2011-06-30

Figure 3-4 Line capacitance: CL = f(TA)

Figure 3-5 Line capacitance: CL = f(f), (I/O to GND)

0.1

0.2

0.3

0.4

0.5

0.6

0.7

-50 -25 0 25 50 75 100

CL [pF]

TA [°C]

5.3V

0.1

0.2

0.3

0.4

0.5

0.6

0 500 1000 1500 2000 2500 3000

CL [pF]

f [MHz]

5.3V

ESD5V3U4U-HDMI

Characteristics

FinalData Sheet 13 Revision 1.0, 2011-06-30

Figure 3-6 Forward clamping voltage: ITLP = f(VTLP), (GND to I/O) [1]

Figure 3-7 Reverse clamping voltage: ITLP = f(VTLP), (I/O to GND) [1]

0 5 10 15 20 25 30 35 40

ITLP [A]

Equivalent VIEC [kV]

VTLP [V]

ESD5V3U4U-HDMI

RDYN

RDYN=0.6Ω

0 5 10 15 20 25 30

ITLP [A]

Equivalent VIEC [kV]

VTLP [V]

ESD5V3U4U-HDMI

RDYN

RDYN=0.5Ω

ESD5V3U4U-HDMI

Characteristics

FinalData Sheet 14 Revision 1.0, 2011-06-30

Figure 3-8 IEC61000-4-2 VCL = f(t), 8 kV positive pulse, (I/O to GND)

Figure 3-9 IEC61000-4-2 VCL = f(t), 8 kV negative pulse, (I/O to GND)

-10

-100 0 100 200 300 400 500 600 700 800 900

VCL [V]

tp [ns]

VCL-max-peak = 82.2 [V]

VCL-30ns-peak = 17.3 [V]

-90

-80

-70

-60

-50

-40

-30

-20

-10

-100 0 100 200 300 400 500 600 700 800 900

VCL [V]

tp [ns]

VCL-max-peak = -76.1 [V]

VCL-30ns-peak = -8.9 [V]

ESD5V3U4U-HDMI

Characteristics

FinalData Sheet 15 Revision 1.0, 2011-06-30

Figure 3-10 IEC61000-4-2 VCL = f(t), 15 kV positive pulse, (I/O to GND)

Figure 3-11 IEC61000-4-2 VCL = f(t), 15 kV negative pulse, (I/O to GND)

-10

100

110

-100 0 100 200 300 400 500 600 700 800 900

VCL [V]

tp [ns]

VCL-max-peak = 104.8 [V]

VCL-30ns-peak = 24.1 [V]

-110

-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

-100 0 100 200 300 400 500 600 700 800 900

VCL [V]

tp [ns]

VCL-max-peak = -105.1 [V]

VCL-30ns-peak = -13.7 [V]

ESD5V3U4U-HDMI

Application Information

FinalData Sheet 16 Revision 1.0, 2011-06-30

4 Application Information

Figure 4-1 4 lines, uni-directional ESD5V3U4U-HDMI

For protection on the 5 V supply rail please refer to ESD5V3U1U- TVS diode data sheet.

ESD5V3U4U

ESD5V3U1U

+5V

HDMI Source/Sink

CEC

SCL

SDA

Hot Plug Detect

TMDS Data2

TMDS Data1

TMDS Data0

TMDS Clock

HDMI Type A

Connector

TMDS Channels

CEC Line

DDC (I²C Bus)

DDC/CEC GND

+5V

Hot Plug Detect

N.C.

ESD5V3U4U-HDMI

Ordering Information Scheme (Examples)

FinalData Sheet 17 Revision 1.0, 2011-06-30

5 Ordering Information Scheme (Examples)

Figure 5-1 Ordering information scheme

ESD 5V3 U- XX YY

Package or Application

XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)

YY = Package family:

LS = TSSLP

LRH = TSLP

S = SOT363

U = SC74

XX = Application family:

LC = Low Clamp

HDMI

Uni- / Bi-directional or Rail to Rail protection

Maximum working voltage VRWM in V: (i.e.: 5V3 = 5.3V)

ESD 0P1 RF - XX YY

Package

XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)

YY = Package family:

LS = TSSLP

LRH = TSLP

For Radio Frequency Applications

Line Capacitance CLin pF: (i.e.: 0P1 = 0.1pF)

n U

Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines)

Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF)

ESD5V3U4U-HDMI

Package Information

FinalData Sheet 18 Revision 1.0, 2011-06-30

6 Package Information

6.1 PG-TSLP-9-1

Figure 6-1 PG-TSLP-9-1: Package overview

Figure 6-2 PG-TSLP-9-1: Footprint

TSLP-9-1-PO V02

Top view

Pin 1 marking

0.59

±0.035

0.94±0.0251)

2.3

±0.035

0.31

0.05 MAX.

+0.01

-0.02

1) Dimension applies to plated terminals

8 x 0.2

±0.0251)

(0.03)

(0.05)

0.4

±0.0251)

±0.025

8 x 0.35 1)

0.5

4 x 0.5 = 2

0.05 BA

Bottom view

Stencil apertures

Copper Solder mask

TSLP-9-1-FP V01

0.38

0.24

2.3

0.2

0.3

0.2

0.3

0.2

0.3

0.2

0.38

0.24

2.3

0.2

0.3

0.2

0.3

ESD5V3U4U-HDMI

Package Information

FinalData Sheet 19 Revision 1.0, 2011-06-30

Figure 6-3 PG-TSLP-9-1: Packing

Figure 6-4 PG-TSLP-9-1: Marking (example)

1.6

2.3

0.5

Pin 1

marking

TSLP-9-1-TP V03

TSLP-9-1-MK V02

Pin 1 marking

1234567

Type code

Data code (YYWW)

ESD5V3U4U-HDMI

References

FinalData Sheet 20 Revision 1.0, 2011-06-30

References

[1] Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP

Characterization Methodology

ESD5V3U4U-HDMI

Terminology

FinalData Sheet 21 Revision 1.0, 2011-06-30

Terminology

CLLine capacitance

DVI Digital Visual Interface

EFT Electrical Fast Transient

ESD Electrostatic Discharge

HDMI High Definition Multimedia Interface

IPP Peak pulse current

IRReverse current

MDDI Mobile Display Digital Interface

MHL Mobile Display Digital Interface

MIPI Mobile Industrial Processor Interface

RoHS Restriction of Hazardous Substances Directive

S-ATA Serial Advanced Technology Attachment

TOP Operation temperature

tpPulse duration

Tstg Storage temperature

USB Universal Serial Bus

VBR Breakdown voltage

VCL Reverse clamping voltage

VESD Electrostatic discharge voltage

VFC Forward Clamping Voltage

VRReverse voltage

VRWM Maximum Reverse Working Voltage

Published by Infineon Technologies AG