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Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC3237TK LOW NOISE WIDE BAND SILICON GERMANIUM MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS DESCRIPTION The PC3237TK is a silicon germanium (SiGe) monolithic integrated circuit designed as low noise amplifier for the mobile digital TV etc. This device exhibits low noise figure and high power gain characteristics. This package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process. FEATURES * Supply voltage : VCC = 2.4 to 3.3 V (2.8 V TYP.) * Low current consumption : ICC = 5 mA TYP. @ VCC = 2.8 V * Low Noise : NF = 1.4 dB TYP. @ f = 470 MHz : NF = 1.5 dB TYP. @ f = 770 MHz * Power gain : GP = 15.3 dB TYP. @ f = 470 MHz : GP = 13.5 dB TYP. @ f = 770 MHz * High-density surface mounting : 6-pin lead-less minimold package (1.5 x 1.1 x 0.55 mm) APPLICATIONS * Low noise amplifier for the mobile digital TV etc. ORDERING INFORMATION Part Number PC3237TK-E2 Order Number Package PC3237TK-E2-A 6-pin lead-less minimold (1511 PKG) (Pb-Free) Marking 6N Supplying Form * Embossed tape 8 mm wide * Pin 1, 6 face the perforation side of the tape * Qty 5 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office Part number for sample order: PC3237TK Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PU10675EJ01V0DS (1st edition) Date Published July 2007 NS Printed in Japan 2007 PC3237TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 2 6N 1 3 (Top View) (Bottom View) 6 1 6 6 1 5 2 5 5 2 4 3 4 4 3 Pin No. Pin Name 1 NC 2 GND 3 INPUT 4 VCC 5 GND 6 OUTPUT ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25C 3.6 V Circuit Current ICC TA = +25C 10 mA Power Dissipation PD TA = +85C 203 mW Operating Ambient Temperature TA -40 to +85 C Storage Temperature Tstg -55 to +150 C Input Power Pin +8 dBm Note TA = +25C Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 2.4 2.8 3.3 V Operating Ambient Temperature TA -40 +25 +85 C 2 Data Sheet PU10675EJ01V0DS PC3237TK ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = 2.8 V, ZS = ZL = 50 , unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No input signal 3.5 5 7 mA Power Gain 1 GP1 f = 470 MHz, Pin = -30 dBm 13.0 15.3 17.5 dB Power Gain 2 GP2 f = 770 MHz, Pin = -30 dBm 11.0 13.5 16.0 dB Noise Figure 1 NF1 f = 470 MHz - 1.4 1.9 dB Noise Figure 2 NF2 f = 770 MHz - 1.5 2.0 dB Input Return Loss 1 RLin1 f = 470 MHz, Pin = -30 dBm 6.5 9.5 - dB Input Return Loss 2 RLin2 f = 770 MHz, Pin = -30 dBm 5.5 8.5 - dB Output Return Loss 1 RLout1 f = 470 MHz, Pin = -30 dBm 9 14 - dB Output Return Loss 2 RLout2 f = 770 MHz, Pin = -30 dBm 10 15 - dB Isolation 1 ISL1 f = 470 MHz, Pin = -30 dBm 17 22 - dB Isolation 2 ISL2 f = 770 MHz, Pin = -30 dBm 16 21 - dB Gain 1 dB Compression Output Power 1 PO (1 dB) 1 f = 470 MHz -8 -5.5 - dBm Gain 1 dB Compression Output Power 2 PO (1 dB) 2 f = 770 MHz -8 -5.5 - dBm STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25C, VCC = 2.8 V, ZS = ZL = 50 , unless otherwise specified) Parameter Symbol Test Conditions Reference Value Unit Saturated Output Power 1 PO (sat) 1 f = 470 MHz, Pin = +2 dBm +1.3 dBm Saturated Output Power 2 PO (sat) 2 f = 770 MHz, Pin = +2 dBm +1.3 dBm Input 3rd Order Distortion Intercept Point 1 IIP31 f1 = 470 MHz, f2 = 471 MHz -10.5 dBm Input 3rd Order Distortion Intercept Point 2 IIP32 f1 = 770 MHz, f2 = 771 MHz -9.5 dBm Output 3rd Order Distortion Intercept Point 1 OIP31 f1 = 470 MHz, f2 = 471 MHz +4.8 dBm Output 3rd Order Distortion Intercept Point 2 OIP32 f1 = 770 MHz, f2 = 771 MHz +4.0 dBm K factor 1 K1 f = 470 MHz 1.15 - K factor 2 K2 f = 770 MHz 1.20 - Data Sheet PU10675EJ01V0DS 3 PC3237TK TEST CIRCUIT 1 6 2 5 3 4 50 OUTPUT C2 50 INPUT C4 VCC C1 C3 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C1, C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF 4 Data Sheet PU10675EJ01V0DS PC3237TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 6N IN OUT C1 Mounting direction C2 C3 VCC C4 Notes 1. 30 x 30 x 0.4 mm double sided copper clad FR-4 board. 2. Back side: GND pattern 3. Au plated on pattern 4. : Through holes Data Sheet PU10675EJ01V0DS 5 PC3237TK TYPICAL CHARACTERISTICS (TA = +25C, VCC = 2.8 V, ZS = ZL = 50 , unless otherwise specified) CURCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 9 8 Circuit Current ICC (mA) Circuit Current ICC (mA) 9 10 No Input Signal TA = +85C 7 6 5 4 3 +25C 2 -40C 1 0 0 1 2 8 7 6 5 4 3 2 1 3 0 -50 4 Supply Voltage VCC (V) POWER GAIN vs. FREQUENCY 25 50 75 100 POWER GAIN vs. FREQUENCY 18 VCC = 3.3 V Power Gain GP (dB) Power Gain GP (dB) 0 20 18 16 14 2.8 V 2.4 V 12 10 TA = -40C +25C 16 14 12 +85C 10 8 8 6 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 6 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 Frequency f (MHz) Frequency f (MHz) NOISE FIGURE vs. FREQUENCY NOISE FIGURE vs. FREQUENCY 3.0 3.0 2.5 2.5 Noise Figure NF (dB) Noise Figure NF (dB) -25 Operating Ambient Temperature TA (C) 20 VCC = 2.4 V 2.0 1.5 1.0 2.8 V 3.3 V TA = +85C 2.0 +25C 1.5 1.0 -40C 0.5 0.5 0.0 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 0.0 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 Frequency f (MHz) Frequency f (MHz) Remark The graphs indicate nominal characteristics. 6 No Input Signal Data Sheet PU10675EJ01V0DS PC3237TK ISOLATION vs. FREQUENCY 0 -5 -5 -10 -10 -15 Isolation ISL (dB) 0 VCC = 2.4 V -20 -25 2.8 V 3.3 V -30 TA = -40C -20 -25 +85C -30 -35 -40 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 -40 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 Frequency f (MHz) Frequency f (MHz) INPUT RETURN LOSS vs. FREQUENCY INPUT RETURN LOSS vs. FREQUENCY 0 0 VCC = 2.4 V -5 -10 2.8 V -15 3.3 V -20 -25 -30 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 TA = +85C -5 -10 +25C -40C -15 -20 -25 -30 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 Frequency f (MHz) Frequency f (MHz) OUTPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY 0 Output Return Loss RLout (dB) 0 Output Return Loss RLout (dB) +25C -15 -35 Input Return Loss RLin (dB) Input Return Loss RLin (dB) Isolation ISL (dB) ISOLATION vs. FREQUENCY -5 VCC = 2.4 V -10 -15 -20 2.8 V 3.3 V -25 -30 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 -5 -10 TA = +85C -15 +25C -20 -40C -25 -30 70 170 270 370 470 570 670 770 870 970 1 070 1 170 1 270 Frequency f (MHz) Frequency f (MHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10675EJ01V0DS 7 OUTPUT POWER vs. INPUT POWER 10 VCC = 3.3 V 0 -5 2.8 V -10 2.4 V -15 -20 -25 -30 -50 f = 170 MHz -40 -30 -20 -10 0 10 0 OIP3 = +5.0 dBm -10 -30 -40 IM3 -50 -60 f1 = 170 MHz f2 = 171 MHz -70 -80 -50 IIP3 = -11.5 dBm -40 -30 -20 -10 0 10 VCC = 3.3 V 0 -5 2.8 V -10 2.4 V -15 -20 -30 -50 f = 470 MHz -40 -30 -20 -10 0 10 Output Power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) OUTPUT POWER, IM3 vs. INPUT POWER -25 10 0 OIP3 = +4.8 dBm -10 Pout -20 -30 -40 IM3 -50 -60 -70 -80 -50 IIP3 = -10.5 dBm -40 -30 -20 f1 = 470 MHz f2 = 471 MHz -10 0 10 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER OUTPUT POWER, IM3 vs. INPUT POWER 10 5 VCC = 3.3 V 0 -5 2.8 V -10 2.4 V -15 -20 -25 -30 -50 f = 770 MHz -40 -30 -20 -10 0 10 10 0 OIP3 = +4.0 dBm -10 Pout -20 -30 -40 -50 IM3 -60 f1 = 770 MHz f2 = 771 MHz -70 -80 -50 -40 IIP3 = -9.5 dBm -30 -20 -10 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 8 Pout -20 OUTPUT POWER vs. INPUT POWER 5 Output Power Pout (dBm) 10 Input Power Pin (dBm) 10 Output Power Pout (dBm) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) Output Power Pout (dBm) 5 Output Power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) PC3237TK Data Sheet PU10675EJ01V0DS 0 10 10 f = 470 MHz 5 VCC = 3.3 V 0 -5 -10 2.8 V 2.4 V -15 -20 -25 -30 -50 -25 0 25 50 75 100 PO (1 dB) (dB) PO (1 dB) vs. OPERATING AMBIENT TEMPERATURE Gain 1 dB Compression Output Power Gain 1 dB Compression Output Power PO (1 dB) (dB) PC3237TK PO (1 dB) vs. OPERATING AMBIENT TEMPERATURE 10 f = 770 MHz 5 VCC = 3.3 V 0 -5 -10 2.8 V 2.4 V -15 -20 -25 -30 -50 Operating Ambient Temperature TA (C) -25 0 25 50 75 100 Operating Ambient Temperature TA (C) K FACTOR vs. FREQUENCY 4.0 3.5 K Factor K 3.0 2.5 2.0 1.5 1.0 0.5 0 0 500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 Frequency f (MHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10675EJ01V0DS 9 PC3237TK S-PARAMETERS (TA = +25C, VCC = 2.8 V, monitored at connector on board) S11-FREQUENCY 1 : 470 MHz 2 : 770 MHz 2 START : 48.832 32.758 -35.260 -26.611 1 100.000 000 MHz STOP : 3 100.000 000 MHz S22-FREQUENCY 1 : 470 MHz 2 : 770 MHz 61.666 50.924 2 1 START : 10 100.000 000 MHz STOP : 3 100.000 000 MHz Data Sheet PU10675EJ01V0DS -18.627 -18.180 PC3237TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) (Bottom View) 0.160.05 0.480.05 0.480.05 1.10.1 0.20.1 0.90.1 0.11+0.1 -0.05 1.30.05 0.550.03 1.50.1 (Top View) Data Sheet PU10675EJ01V0DS 11 PC3237TK NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC line. (4) The DC cut capacitor should be attached to Input and Output pin. (5) Pin 1 (NC) should be connected to the ground pattern. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 12 Data Sheet PU10675EJ01V0DS HS350 PC3237TK * The information in this document is current as of July, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1