To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
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April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
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2007
DESCRIPTION
The
μ
PC3237TK is a silicon germanium (SiGe) monolithic integrated circuit designed as low noise amplifier for the
mobile digital TV etc. This device exhibits low noise figure and high power gain characteristics.
This package is 6-pin lead-less minimold, suitable for surface mount.
This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process.
FEATURES
• Supply voltage : VCC = 2.4 to 3.3 V (2.8 V TYP.)
• Low current consumption : ICC = 5 mA TYP. @ VCC = 2.8 V
• Low Noise : NF = 1.4 dB TYP. @ f = 470 MHz
: NF = 1.5 dB TYP. @ f = 770 MHz
• Power gain : GP = 15.3 dB TYP. @ f = 470 MHz
: GP = 13.5 dB TYP. @ f = 770 MHz
• High-density surface mounting : 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm)
APPLICATIONS
• Low noise amplifier for the mobile digital TV etc.
ORDERING INFORMATION
Part Number Order Number Package Marking Supplying Form
μ
PC3237TK-E2
μ
PC3237TK-E2-A 6-pin lead-less minimold
(1511 PKG) (Pb-Free)
6N • Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office
Part number for sample order:
μ
PC3237TK
DATA SHEET
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
BIPOLAR ANALOG INTEGRATED CIRCUIT
μ
PC3237TK
LOW NOISE WIDE BAND SILICON GERMANIUM MMIC
AMPLIFIER FOR MOBILE COMMUNICATIONS
Document No. PU10675EJ01V0DS (1st edition)
Date Published July 2007 NS
Printed in Japan
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No. Pin Name
1 NC
2 GND
3 INPUT
4 VCC
5 GND
(Top View)
1
2
34
5
6
6N
(Bottom View)
6
5
43
2
1
(Top View)
1
2
34
5
6
6 OUTPUT
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Conditions Ratings Unit
Supply Voltage VCC TA = +25°C 3.6 V
Circuit Current ICC TA = +25°C 10 mA
Power Dissipation PD TA = +85°C Note 203 mW
Operating Ambient Temperature TA −40 to +85 °C
Storage Temperature Tstg −55 to +150 °C
Input Power Pin TA = +25°C +8 dBm
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage VCC 2.4 2.8 3.3 V
Operating Ambient Temperature TA −40 +25 +85 °C
Data Sheet PU10675EJ01V0DS
2
μ
PC3237TK
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 2.8 V, ZS = ZL = 50 Ω, unless otherwise specified)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Circuit Current ICC No input signal 3.5 5 7 mA
Power Gain 1 GP1 f = 470 MHz, Pin = −30 dBm 13.0 15.3 17.5 dB
Power Gain 2 GP2 f = 770 MHz, Pin = −30 dBm 11.0 13.5 16.0 dB
Noise Figure 1 NF1 f = 470 MHz − 1.4 1.9 dB
Noise Figure 2 NF2 f = 770 MHz − 1.5 2.0 dB
Input Return Loss 1 RLin1 f = 470 MHz, Pin = −30 dBm 6.5 9.5 − dB
Input Return Loss 2 RLin2 f = 770 MHz, Pin = −30 dBm 5.5 8.5 − dB
Output Return Loss 1 RLout1 f = 470 MHz, Pin = −30 dBm 9 14 − dB
Output Return Loss 2 RLout2 f = 770 MHz, Pin = −30 dBm 10 15 − dB
Isolation 1 ISL1 f = 470 MHz, Pin = −30 dBm 17 22 − dB
Isolation 2 ISL2 f = 770 MHz, Pin = −30 dBm 16 21 − dB
Gain 1 dB Compression Output Power 1
PO (1 dB) 1 f = 470 MHz −8 −5.5 − dBm
Gain 1 dB Compression Output Power 2
PO (1 dB) 2 f = 770 MHz −8 −5.5 − dBm
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, VCC = 2.8 V, ZS = ZL = 50 Ω, unless otherwise specified)
Parameter Symbol Test Conditions
Reference Value
Unit
Saturated Output Power 1 PO (sat) 1 f = 470 MHz, Pin = +2 dBm +1.3 dBm
Saturated Output Power 2 PO (sat) 2 f = 770 MHz, Pin = +2 dBm +1.3 dBm
Input 3rd Order Distortion Intercept Point 1
IIP31 f1 = 470 MHz, f2 = 471 MHz −10.5 dBm
Input 3rd Order Distortion Intercept Point 2
IIP32 f1 = 770 MHz, f2 = 771 MHz −9.5 dBm
Output 3rd Order Distortion Intercept Point 1
OIP31 f1 = 470 MHz, f2 = 471 MHz +4.8 dBm
Output 3rd Order Distortion Intercept Point 2
OIP32 f1 = 770 MHz, f2 = 771 MHz +4.0 dBm
K factor 1 K1 f = 470 MHz 1.15 −
K factor 2 K2 f = 770 MHz 1.20 −
Data Sheet PU10675EJ01V0DS 3
μ
PC3237TK
TEST CIRCUIT
V
CC
INPUT
OUTPUT
4
5
6
3
2
1
C2
C1 C3
C4
50 Ω
50 Ω
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
Type Value
C1, C2 Chip Capacitor 100 pF
C3 Chip Capacitor 1 000 pF
C4 Feed-through Capacitor 1 000 pF
Data Sheet PU10675EJ01V0DS
4
μ
PC3237TK
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
IN OUT
V
CC
C1 C2
C3
C4
6N
Mounting direction
Notes
1. 30 × 30 × 0.4 mm double sided copper clad FR-4 board.
2. Back side: GND pattern
3. Au plated on pattern
4. : Through holes
Data Sheet PU10675EJ01V0DS 5
μ
PC3237TK
TYPICAL CHARACTERISTICS (TA = +25°C, VCC = 2.8 V, ZS = ZL = 50 Ω, unless otherwise specified)
10
9
8
7
6
5
4
3
2
1
00 12 3 4
+25°C
–40°C
T
A
= +85°C
10
9
8
7
6
5
4
3
2
1
0
–50 –25 0 25 50 75 100
20
18
16
14
12
10
8
6
70
170 270 370 470 570 670 770 870 970
1 070 1 170 1 270
2.4 V
V
CC
= 3.3 V
2.8 V
20
18
16
14
12
10
8
6
70
170 270 370 470 570 670 770 870 970
1 070 1 170 1 270
T
A
=
–
40°C
3.0
2.5
2.0
1.5
1.0
0.5
0.0
70
170 270 370 470 570 670 770 870 970
1 070 1 170 1 270
V
CC
= 2.4 V
3.3 V
2.8 V
3.0
2.5
2.0
1.5
1.0
0.5
0.0
70
170 270 370 470 570 670 770 870 970
1 070 1 170 1 270
+25°C
+85°C
T
A
=
+85°C
+25°C
–
40°C
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
Circuit Current I
CC
(mA)
Supply Voltage V
CC
(V)
No Input Signal No Input Signal
CURCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
Circuit Current I
CC
(mA)
Operating Ambient Temperature T
A
(°C)
Frequency f (MHz)
POWER GAIN vs. FREQUENCY
Power Gain G
P
(dB)
Frequency f (MHz)
POWER GAIN vs. FREQUENCY
Power Gain G
P
(dB)
NOISE FIGURE vs. FREQUENCY
Frequency f (MHz)
Noise Figure NF (dB)
NOISE FIGURE vs. FREQUENCY
Frequency f (MHz)
Noise Figure NF (dB)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10675EJ01V0DS
6
μ
PC3237TK
0
–5
–10
–15
–20
–25
–30
–35
–40
70
170 270 370 470 570 670 770 870 970
1 070 1 170 1 270
0
–5
–10
–15
–20
–25
–30
–35
–40
70
170 270 370 470 570 670 770 870 970
1 070 1 170 1 270
70
170 270 370 470 570 670 770 870 970
1 070 1 170 1 270
0
–5
–10
–15
–20
–25
–30
70
170 270 370 470 570 670 770 870 970
1 070 1 170 1 270
0
–5
–10
–15
–20
–25
–30
70
170 270 370 470 570 670 770 870 970
1 070 1 170 1 270
0
–5
–10
–15
–20
–25
–30
70
170 270 370 470 570 670 770 870 970
1 070 1 170 1 270
0
–5
–10
–15
–20
–25
–30
VCC = 2.4 V
3.3 V
2.8 V
TA =
–
40°C
+25°C
+85°C
VCC = 2.4 V
3.3 V
2.8 V
TA =
+85°C
–
40°C
+25°C
VCC = 2.4 V
3.3 V
2.8 V
TA =
+85°C
–
40°C
+25°C
Frequency f (MHz)
ISOLATION vs. FREQUENCY
Isolation ISL (dB)
Frequency f (MHz)
ISOLATION vs. FREQUENCY
Isolation ISL (dB)
INPUT RETURN LOSS vs. FREQUENCY
Frequency f (MHz)
Input Return Loss RL
in
(dB)
INPUT RETURN LOSS vs. FREQUENCY
Frequency f (MHz)
Input Return Loss RL
in
(dB)
Frequency f (MHz)
OUTPUT RETURN LOSS vs. FREQUENCY
Output Return Loss RL
out
(dB)
Frequency f (MHz)
OUTPUT RETURN LOSS vs. FREQUENCY
Output Return Loss RL
out
(dB)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10675EJ01V0DS 7
μ
PC3237TK
10
5
0
–5
–10
–15
–20
–25
–30 f = 170 MHz
10
5
0
–5
–10
–15
–20
–25
–30 f = 470 MHz
P
out
IM
3
f1 = 470 MHz
f2 = 471 MHz
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–50 –40 –30 –20 –10 0 10
–50 –40 –30 –20 –10 0 10
10
5
0
–5
–10
–15
–20
–25
–30 f = 770 MHz
P
out
IM
3
f1 = 770 MHz
f2 = 771 MHz
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–50 –40 –30 –20 –10 0 10
–50 –40 –30 –20 –10 0 10
P
out
IM
3
f1 = 170 MHz
f2 = 171 MHz
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–50 –40 –30 –20 –10 0 10
–50 –40 –30 –20 –10 0 10
2.4 V
VCC = 3.3 V
2.8 V
OIP3 = +5.0 dBm
IIP3 =
–
11.5 dBm
2.4 V
VCC = 3.3 V
2.8 V
OIP3 = +4.8 dBm
IIP3 =
–
10.5 dBm
2.4 V
VCC = 3.3 V
2.8 V
OIP3 = +4.0 dBm
IIP3 =
–
9.5 dBm
OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
Input Power Pin (dBm)
OUTPUT POWER, IM3 vs. INPUT POWER
Output Power Pout (dBm)
3rd Order Intermodulation Distortion IM3 (dBm)
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
Input Power Pin (dBm)
OUTPUT POWER, IM3 vs. INPUT POWER
Output Power Pout (dBm)
3rd Order Intermodulation Distortion IM3 (dBm)
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
Input Power Pin (dBm)
OUTPUT POWER, IM3 vs. INPUT POWER
Output Power Pout (dBm)
3rd Order Intermodulation Distortion IM3 (dBm)
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10675EJ01V0DS
8
μ
PC3237TK
f = 470 MHz f = 770 MHz
10
5
0
–5
–10
–15
–20
–25
–30
–50 –25 0 25 50 75 100
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
00
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000
10
5
0
–5
–10
–15
–20
–25
–30
–50 –25 0 25 50 75 100
V
CC
= 3.3 V
2.4 V
2.8 V
V
CC
= 3.3 V
2.4 V
2.8 V
PO (1 dB) vs.
OPERATING AMBIENT TEMPERATURE
Gain 1 dB Compression Output Power
PO (1 dB) (dB)
Operating Ambient Temperature TA (°C)
P
O (1 dB) vs.
OPERATING AMBIENT TEMPERATURE
Gain 1 dB Compression Output Power
PO (1 dB) (dB)
Operating Ambient Temperature TA (°C)
K FACTOR vs. FREQUENCY
Frequency f (MHz)
K Factor K
Remark The graphs indicate nominal characteristics.
Data Sheet PU10675EJ01V0DS 9
μ
PC3237TK
S-PARAMETERS (TA = +25°C, VCC = 2.8 V, monitored at connector on board)
S11−FREQUENCY
START : 100.000 000 MHz STOP : 3 100.000 000 MHz
1 : 470 MHz 48.832 Ω –35.260 Ω
2 : 770 MHz 32.758 Ω –26.611 Ω
21
S22−FREQUENCY
START : 100.000 000 MHz STOP : 3 100.000 000 MHz
1 : 470 MHz 61.666 Ω –18.627 Ω
2 : 770 MHz 50.924 Ω –18.180 Ω
21
Data Sheet PU10675EJ01V0DS
10
μ
PC3237TK
PACKAGE DIMENSIONS
6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm)
0.48±0.050.48±0.05
1.5±0.1
1.3±0.05
1.1±0.1
0.55±0.03
0.11+0.1
–0.05 0.16±0.05
0.9±0.10.2±0.1
(Bottom View)
(Top View)
Data Sheet PU10675EJ01V0DS 11
μ
PC3237TK
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC line.
(4) The DC cut capacitor should be attached to Input and Output pin.
(5) Pin 1 (NC) should be connected to the ground pattern.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Soldering Conditions Condition Symbol
Infrared Reflow Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220°C or higher : 60 seconds or less
Preheating time at 120 to 180°C : 120±30 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering Peak temperature (molten solder temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating Peak temperature (terminal temperature) : 350°C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10675EJ01V0DS
12
μ
PC3237TK
The information in this document is current as of July, 2007. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
•
•
•
•
•
•
M8E 02. 11-1
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
μ
PC3237TK
