RC Series Metal GlazeTM High Power Density TM 'LAze (IGH PowER $ENSITY Surface CE -OUNT PowERMount 2ESISTORPower Resistor MRC Series MRC Series -ETAL 'LAzeTM THIcK FILM ELEMENT FIRED AT # TO SOLID CErAMIC SUBSTrate wATT IN wATT PAckage TM * 1/2 watt in 1/8(IGH wattPowER package$ENSITY -ETAL 'LAze TT IN wATT PAcKAGE fOOTPrINT *SurfACE MRC1/2: 0.05 to 1.0 -OUNT PowER2ESISTOR C1/2: (contact TO factory for higher values) * s 150C maximum operating temperature ACT factorY fORwATT HIGHER IN vALUES wATT PAckage * s Superior surge handling capability wATT IN wATTTEMPErature PAcKAGE fOOTPrINT # MAXIMUM OPErATING * RoHS compliant Versions available s MRC1/2: TO ErIOR SURGE HANDLING CAPABILITY -ETAL 'LAzeTM THIcK FILM ELEMENT FIRED AT # TO SOLID CErAMIC SUBSTrate (IGH TEMPErature DIELECTrIC COATING CONTACT factorY fOR HIGHER vALUES s # MAXIMUM OPErATING TEMPErature s 3UPErIOR SURGE HANDLING CAPABILITY 3OLDER ovER NIckEL BARrIER (IGH TEMPErature DIELECTrIC COATING 3OLDER ovER NIckEL BARrIER TRICAL $ATA %LECTRICAL $ATA Industry IRC Max. Working Max. Resistance TCR Tolerance Size Industry IRC Max. Working Max. Resistance TCR Product Tolerance 2 3 3 3 FootprintCodeType Power Voltage (ohms) 1 2 3 Footprint TypeRating Power Rating VoltageVoltage Voltage Range Range (ohms) (ppm/C)3 (ppm/C) Catagory (%)3 (%) 6 C 6 MRC1/2 MRC1/2 7 7 C C TO TO 1,2, TO K 1,2, TO K TO K TO K 1,2, LoW 2ANGE LoW 2ANG 3TANDARD 1,2, Product Catagory 3TANDARD 4IGHT TolerANCE 4IGHT TolerAN MRC Applications: 4HE MRC1/2 WILL DISSIPATE 1/2 watt at # ON a fOOTPrINT 4HE MRC IS RECOMMENDED for APPLICATIONS WHERE BOARD real estate IS a MAJOR CONCErN $UE to HIGH Power DENSITY AND SUPErIOR surge HANDLING CAPABILITy, IT IS also pplications: RECOMMENDED as a DIRECT REPLACEMENT ON eXISTING BOARD DESIGNS WHERE STANDARD RESISTORS ARE MARGINAL OR fAILING C1/2 WILL DISSIPATE 1/2 watt at # ON a fOOTPrINT 4HE MRC IS RECOMMENDED for APPLICATIONS WHERE eal estateENVIRONMENTAL IS a MAJOR CONCErN$ATA $UE to HIGH Power DENSITY AND SUPErIOR surge HANDLING CAPABILITy, IT IS also ENDED as a DIRECT ON eXISTING BOARD CharREPLACEMENT acteristics Maximum ChangeDESIGNS WHERE STANDARD Test M ethod RESISTORS ARE MARGINAL OR fA Temperature Coefficient !S SPECIfieD -), 2 % PAR # # Thermal Shock -), 2 % PAR # C CYCLES RONMENTAL $ATA Operation Maxi CharactLow erisTemperature tics mum Ch ange Short Time Overload High Temperature Exposure Resistance to Bonding Exposure rature Coefficient al Shock !S SPECIfieD mperatureSolderability Operation Moisture Resistance ime Overload -), 2 % PAR #Tes worKING vOLTAGE t Meth od -), 2 % PAR X 2 fOR SECONDS -), % PAR # 0X2 # -), 2 % PAR # fOR HOURS -), 2 % PAR # -), 2 % PAR C CYCLES 2EfloW SOLDERED TO BOARD AT # fOR SECONDS -), 2 % PAR # worKING vOLTAGE MINIMUM Coverage -), 34$ -ETHOD # fOR SECONDS Life Test mperature Exposure Terminal Adhesion Strength -), % PAR -), 22% PAR CYCLEs TOTAL HOURS X % 0X2 PAR fOR SECONDS -), 2 HOURS # INTErMITTENT NO MECHANICAL DAMAGE 2 grAM PUSH FROM UNDERSIDE -), % PAR OF MOUNTED # CHIP fOR HOURS Resistance to Board Bending ance to Bonding Exposure NO MECHANICAL DAMAGE #HIP 2 MOUNTED IN CENTER MM LONG BOARD DEflECTED MM -), % PAROF SO AS TO eXerT PULL ON CHIP CONTACTS fOR SECONDS 2EfloW SOLDERED TO BOARD AT # fOR SECONDS ability MINIMUM Coverage -), 34$ -ETHOD # fOR SECONDS -), 2 % PAR CYCLEs TOTAL HOURS re Resistance General Note st fOR SECONDS TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics' own data and is considered accurate at time of going to print. (c) TT electronics plc al Adhesion Strength www.bitechnologies.com www.irctt.com www.welwyn-tt.com -), 2 % PAR HOURS # INTErMITTE grAM PUSH FROM UNDERSIDE OF MOUNTED09.CHIP 12 MRC Series Metal GlazeTM High Power Density TM Surface Mount Power Resistor Metal Glaze High Power Density Surface MRC SeriesMount Power Resistor Repetitive Surge Curve Power Derating Curve 1000 % Of Rated Power Peak Power (watts) 100 100 MRC 1/2 60 0 25 10 70 150 Ambient Temperature (C) 1 0.0001 0.001 0.01 0.1 1 Surge or Pulse Duration (seconds) Note: Use for repetitive pulses where the average power dissipation is not to exceed the component rating at 70C. Surge handling capacity for low-repetitive surges may be significantly greater than shown above. Contact factory for recommendations. Ordering Data Sample Part No. MRC1/2 100 1000 F 13 LF IRC Type (MRC 1/2) Temperature Coefficient 50 ppm, 100 ppm, 200 ppm Resistance Value (100 and greater - First 3 significant figures plus 4th digit multiplier) Example: 100 = 1000, 1000 = 1001, 150,000 = 1503 (Less than 100 - "R" is used to designate decimal) Example: 51 = 51R0, 1 = 1R00, 0.25 = R250 Tolerance (C = 0.25%, D = 0.5%, F = 1.0%, G = 2.0%, J = 5.0%) Packaging Code* (BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel) RoHS Compliance LF = RoHS compliant version (c) IRC Wirewound and Film Technologies Division s 3OUTH 3TAPLES 3TREET s #ORPUS #HRISTI TEXAS 53! TELEPHONE: s FACSIMILE: s WEBSITE: WWWIRCTTCOM -2# 3ERIES )SSUE !PRIL 3HEET OF General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics' own data and is considered accurate at time of going to print. www.bitechnologies.com www.irctt.com www.welwyn-tt.com (c) TT electronics plc 09. 12