Precautions when handling our products
Cautions regarding this document
DSGD.
KS TN YS CHKD.
KS TN YS
KS TN YS APPD. DOCUMENT No.
SYMB.
APPD.
CHKD.
DSGD.
( 1/14 )
DATE
K.SEJIMO
SBD GE-043
Y
.SUD
A
2017-06-23
2015-09-03
2016-03-04
T.NAKAMUR
A
2015-10-05
2015-09-03
DATASHEET
~ Revision 01-3 ~
1) For the export of products which are controlled items subject to foreign and domestic export laws
and regulations, you must obtain approval and/or follow the formalities of such laws and regulations.
2) Products must not be used for military and/or antisocial purposes such as terrorism, and shall not
be supplied to any party intending to use the products for such purposes.
3) Unless provided for otherwise, the products have been designed and manufactured for
application in equipment and devices which are sold to end users in the market, including audio-
visual (AV) equipment, electrical home appliances, office machines, information and communication
equipment, and amusement equipment. The products are not intended for use in, and must not be
used for, any application for nuclear equipment, driving equipment for aerospace or any other
unauthorized use.
With the exception of the abovementioned prohibited applications, please contact an Alps sales
representative and/or evaluate the total system regarding applicability for applications involving high
levels of safety and liability such as medical equipment, burglar alarm equipment, disaster
prevention equipment and undersea equipment. Please also incorporate fail-safe design, protection
and redundant circuitry, malfunction protection, and/or fire protection into the complete system to
ensure safety and reliability of the total system.
4) Before using products which were not specifically designed for use in automotive applications,
please contact an Alps sales representative.
1) The specifications herein are an overview of the specifications. Obtain official specifications
before use.
2) The external appearance, functions and other specifications herein may be discontinued without
prior notice.
DATASHEET
HGPRDT005A
ALPS P/N: HGPRDT005A
2015-09-03
ALPS ELECTRIC CO.
,
LTD
.
1
2
3
( 2/14 )
List of Contents
1Product Description
製品説明
3
1.1 Overview
概要
3
1.2 Target Appliations
ターゲットアプリケーション
3
2Functional Description
機能説明
4
2.1 Pin Configuration
ピン配置
4
2.2 Pin Description
ピン機能
4
2.3 Block Diagram
ブロックダイアグラム
4
3Specifications
仕様
5
3.1 Application Circuit
アプリケーション回路
5
3.2 Absolute Maximum Ratings
絶対最大定格
5
3.3 Recommended Operating Conditions
推奨動作条件
6
3.4 Basic Characteristics
基本特性
6
3.5 Magnetc Characteristics
磁気特性
7
4Packa
g
e Information
パッケージ情報
8
4.1 Package Outline
外形図 8
4.2 Footprint
フットプリント
8
4.3 Distance between Chip and Package
チップ/パーッケージ間距離
9
4.4 Package Marking
捺印
9
5Packin
g
Specifications
梱包仕様
10
5.1 Packing Information
梱包情報
10
6Precautions When Handlin
g
Ma
g
netic Sensor
製品お取り扱い時の注意
11
6.1 Storage Environment
保管環境
11
6.2 Long-term Storage
長期保管
11
6.3 ESD
静電気ESD
11
Appendix
A1 List of Figures
図のリスト
12
A2 List of Tables
表のリスト
12
A3 Revision History
改定履歴
13
DATASHEET
ALPS P/N: HGPRDT005A
SBD GE-043
( 3/14 )
1Product Description
製品説明
1.1 Overview
概要
ALPS Product No. HGPRDT005A
Characteristic Pitch Free Encoder
Package type SOT-23
Supply Voltage 3.0 to 30 V
Supply Current 3mA
Interface Open Drain Output
Temperature -40 to 140 deg.C
Figure 1-1 Image of HGPRDT005A in the SOT-23-5 Package
1.2 Target Appliations
ターゲットアプリケーション
Automotive
Industrial
Building Automation
Office Automation
Home Appliance
SBD GE-043
DATASHEET
ALPS P/N: HGPRDT005A
( 4/14)
2Functional Description
機能説明
2.1 Pin Configuration
ピン配置
Figure 2-1 Pin Configuration and Center of Sensitive Area
2.2 Pin Description
ピン機能
Table2-1 Pin Description
Output2
Ground
No Connection
Supply voltage
Output1
2.3 Block Diagram
ブロックダイアグラム
Figure 2-2 Functional Block Diagram
VDD
5OUT1
4
SBD GE-043
3
2
Pin No.
DATASHEET
ALPS P/N: HGPRDT005A
1
Symbol Function
OUT2
GND
NC
123
4
5
(0.125)
Center ofSensitivity
Sensor
Element
Array
Logic
Circuit
Regulator VDD
OUT1
OUT2
GND
( 5/14 )
3Specifications
仕様
3.1 Application Circuit
アプリケーション回路
Vpl
Rpl Rpl
OUT1 OUT1
VDD VDD
OUT2
OUT2
CDD=0.1uF GND CL CL
Figure 3-1 Application Circuit Example
3.2 Absolute Maximum Ratings
絶対最大定格
Table3-1 Absolute Maximum Rating Parameters
[note]
SBD GE-043
DATASHEET
ALPS P/N: HGPRDT005A
Operating Temperature
Note
Min. Typ. Max.
deg.C-40 - 150
-40 - 140
V
V
HGPRDT005A
Parameter Symbol Values Unit
Pull-up Voltage Vpl -0.3 - 40
Supply Voltage VDD -0.3 - 40
最大定格内の使用であっても高負荷（高温および高電圧印加／大電流駆動etc.での連続使用は製品の信頼性を低下させる恐れがあ
ります。
Output Current Isink - - 30 mA
-40 - 120 deg.C VDD =30V
Magnetic Field Hmax -
deg.C VDD =9V
The maximum rating is the value that must not be exceeded it even if it is momentary. There is a possibility of
the breakdown and/or destruction when this value is exceeded.
最大定格とは、たとえ瞬間的であっても超えてはならない値であり、この値を超えた場合、故障・破壊の可能性があります。
Even if it is use within the maximum rating, continuous use on a high stress (high temperature and high
superimposed voltage/large current drive, etc.) might spoil the product reliability.
- 200 mT
Storage Temperature Tst
Top
( 6/14 )
Figure 3-2 Operating Range about Supply Voltage and Temperature
3.3 Recommended Operating Conditions
推奨動作条件
Table3-2 Recommended Operating Conditions Parameters
3.4 Basic Characteristics
基本特性
Table3-3 General Electrical Characteristics
VOH
VOL
[note]
ALPS P/N: HGPRDT005A
VDD 3 12 30 VSupply Voltage
mA
Pull-up Resistance Rpl 3 3.3 30 kOhm
SBD GE-043
DATASHEET
Parameter Symbol Values Unit Note
Min. Typ. Max.
see Figure3-1
Pull-up Voltage Vpl 3 5 30 V
Output Current Isink - - 10
pF
Bypass capacitor CDD 0.1 --
μ
FRequired
Load Capacitance CL 10 30 1000
mT Horizontal field
Parameter Symbol Values Unit Note
Min. Typ. Max.
Magnetic Field Hop 5 -60
mA
Output Saturation
Voltage Vsat - - 0.4 V VDD=12V
Isink=10mA
Supply Current IDD - 3 5
V "Hi" Level
- - Vsat V "Lo" Level
Output Voltage Vout Vpl-0.1 - Vpl
Unless otherwise specified, measurement condition is as follows.
VDD=12V、Vpl=5V、Rpl=3.3kΩ、CL=30pF、T=25deg.C with application circuit described in Figure3-3.
A magnet with 2 poles shall be rotated ideally on the top of sensor package.
% see Fig.3-2
Phase Difference Pdiff 75 90 105 deg. see Fig.3-2
Duty Ratio D 40 50 60
0
5
10
15
20
25
30
35
-60 -40 -20 0 20 40 60 80 100 120 140 160
Suppluy Voltage [V]
Temperat ure [deg.C]
3
( 7/14 )
Figure 3-3 Duty and Phase Difference
3.5 Magnetc Characteristics
磁気特性
Figure 3-4 Definition of Sensitivity Direction
Table3-4 Operating Magnetic Field
[note]
In case of applying magnetic field only sensor sensitivity direction for each
SBD GE-043
Parameter Symbol Values Unit Note
Min. Typ. Max.
0.8 mT
Operating Magnetic Fiel
d
25deg.C
-
DATASHEET
ALPS P/N: HGPRDT005A
mT
mT-
Hon
Hoff
Hhys
-
(-1.6)
(1.6)
-
1.6
-0.8
T
OUT-2
t
Duty
D = t/T ×100 [%]
Pdiff
OUT-1
Ｖ Ｈｉ
ＶLo
w
-H Hoff 0 Hon +H
[OUT1,2]
VOH
VOL
+
+
Sensitivity
SensitivityDirectionforVout2
( 8/14 )
4Packa
g
e Information
パッケージ情報
4.1 Package Outline
外形図
Figure 4-1 Package Outline (All dimensions in mm)
4.2 Footprint
フットプリント
Figure 4-2 Footprint
DATASHEET
ALPS P/N: HGPRDT005A
SBD GE-043
( 9/14 )
4.3 Distance between Chip and Package
チップ/パーッケージ間距離
d: Distance chip to upper side of package, (0.65) mm
Figure 4-3 Distance between chip and package
4.4 Package Marking
捺印
①②: Wafer No.
③④: Product ID
”BN" for HGPRDT005A
Unit ： [mm]
Figure 4-4 Marking of HGPRDT005A
SBD GE-043
DATASHEET
ALPS P/N: HGPRDT005A
Combination of numbers, 1 to 9, and alphabets,
A to Z.
④① ② ③ (0.65)
(0.43)
(0.1)
( 10/14 )
4.5 Structure
構造
Figure 4-5 Internal Structure
Table 4-1 Components
Terminal Plating Outer Terminal Plating Sn-Bi
Wire Bonding Wire Au
Molding Mold Resin Epoxy Resin
SBD GE-043
Process Parts Name Materials
Die Mount
DATASHEET
ALPS P/N: HGARAP001A
Sensor Chip Si
Adhesive for Die Bonding Silver Paste
Lead Frame Cu, Ag-Plating
Sensor Chip
Wire
Lead Frame
Outer Terminal Plating
Adhesive for Die
Bonding
Mold Resin
( 11/14 )
5Packin
g
Specifications
梱包仕様
5.1 Packing Information
Figure 5-1 Packing of the HGPRDT005A in a tape
Figure 5-2 Reel Dimensions
SBD GE-043
DATASHEET
ALPS P/N: HGARAP001A
( 12/14 )
6Precautions When Handlin
g
Ma
g
netic Sensor
製品お取り扱い時の注意
6.1 Storage Environment
保管環境
6.2 Long-term Storage
長期保管
6.3 ESD
静電気ESD
Long-term storage may result in poor lead solder ability and degraded electrical performance even
under proper conditions. For those part that stored more than 1 year, solder ability should be
checked before use. For storage longer than 1 year, it is recommended to store in nitrogen
atmosphere. Oxygen in atmosphere oxidant leads of products and lead solder ability get worse.
適切な保管環境でも長期に保管した場合は、リ－ド端子の半田付け性が悪くなったり、電気特性が不良になる場合が
ありますので、長期保管した場合は、半田付け性や電気特性をご確認の上、ご使用下さい。保管が長期（1年以上）に
及ぶ場合は、窒素雰囲気中での保管をお勧めします。大気中で保管されますと、大気中の酸素により素子のリ－ド部
分が酸化され、リ－ド端子の半田付け性が悪くなります。
Every products has built in ESD protect circuit, however it may break if over ESD applied to this
circuit. Please take measure for ESD when handle the products. Conducted container is
recommended for product conveyance and packing instead of plastic container. Please connect
ground line and use non high voltage leakage, when using soldering iron or external measurement
circuit.
全ての端子に接続されたICについて静電気保護回路を内蔵していますが、その能力を超える静電気が加わった場合
には破壊されることがありますので、製品を取り扱う場合には充分な静電気対策を実施してください。包装・運搬容器
はプラスチック製を極力避け、導電容器をご使用ください。また製品のハンドリングについても充分に考慮してください。
（リストストラップの使用等）はんだごてや測定回路などは高電圧リークのないものを、必ずアースを取ってご使用くださ
い
DATASHEET
ALPS P/N: HGPRDT005A
SBD GE-043
Products should be stored at an appropriate temperature and humidity (Recommended storage
condition). Keep products away from chlorine and corrosive gas. There is a thing that influences
product features when keeping it in an improper environment.
適切な温度・湿度環境（推奨保管条件）で保管していただけるようお願いします。また、塩素や腐食性のあるガスも避け
るようお願いします。不適切な環境で保管した場合は、製品特性に影響する事があります。
( 13/14 )
Appendix
A1 List of Figures
図のリスト
Figure 1-1 Image of HGPRDT005A in the SOT-23-5 Package 3
Figure 2-1 Pin Configuration and Center of Sensitive Area 4
Figure 2-2 Functional Block Diagram 4
Figure 3-1 Application Circuit Example 5
Figure 3-2 Operating Range about Supply Voltage and Temperature 6
Figure 3-3 Duty and Phase Difference 7
Figure 3-4 Definition of Sensitivity Direction 7
Figure 4-1 Package Outline (All dimensions in mm) 8
Figure 4-2 Footprint 8
Figure 4-3 Distance between chip and package 9
Figure 4-4 Marking of HGPRDT005A 9
Figure 4-5 Internal Structure 10
Figure 5-1 Packing of the HGPRDT005A in a tape 11
Figure 5-2 Reel Dimensions 11
A2 List of Tables
表のリスト
Table2-1 Pin Description 4
Table3-1 Absolute Maximum Rating Parameters 5
Table3-2 Recommended Operating Conditions Parameters 6
Table3-3 General Electrical Characteristics 6
Table3-4 Operating Magnetic Field 7
Table 4-1 Components 10
DATASHEET
ALPS P/N: HGPRDT005A
SBD GE-043
( 14/14 )
Appendix
A3 Document Revision History
改定履歴
Description
First release
Changed to "Duty Ratio" from "Duty" in Table 3-3
Modified in Table3-1, Table3-2, Table3-3 and Figure 4-3.
Added Section3-5 and Section 4-5
Correction of errors in Table3-2
DATASHEET
ALPS P/N: HGPRDT005A
SBD GE-043
Revision Date
Sep.03, 201501
01-1 Oct.05, 2015
Mar.04, 201601-2
01-3 Jun.23, 2017
