NUMBER
GS-12-319
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
1 of 10 K
AUTHORIZED BY
DATE
PCI EXPRESS
TM
& Express Module press fit CONNECTOR Bill Lin 4/19/2010
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
TABLE OF CONTENTS
SECTION 1 INTRODUCTION
SECTION 2 GENERAL REQUIREMENTS
SECTION 3 MECHANICAL
3.1 EXAMINATION OF PRODUCT
3.2 INSERTION/WITHDRAWAL FORCES – ADD IN CARD
3.3 CONTACT RETENTION
3.4 BOARD INSERTION/RETENTION FORCE
SECTION 4 ELECTRICAL
4.1 LOW LEVEL CONTACT RESISTANCE
4.2 INSULATION RESISTANCE
4.3 DIELECTRIC WITHSTANDING
4.4 CONTACT CURRENT RATING
4.5 INSERTION LOSS
4.6 RETURN LOSS
4.7 CROSSTALK
SECTION 5 ENVIRONMENTAL
5.1 THERMAL SHOCK
5.2 CYCLIC TEMPERATURE AND HUMIDITY
5.3 TEMPERATURE LIFE (PRE-CONDITIONING)
5.4 TEMPERATURE LIFE
5.5 VIBRATION
5.6 DURABILITY (PRE-CONDITIONING)
5.7 DURABILITY
5.8 MIXED FLOWING GAS
5.9 RESEATING
5.10 RESISTANCE TO SOLDER HEAT
SECTION 6 TEST MATRIX
1.0 INTRODUCTION
PDM: Rev:K Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-319
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
2 of 10 K
AUTHORIZED BY
DATE
PCI EXPRESS
TM
& Express Module press fit CONNECTOR Bill Lin 4/19/2010
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
1.1 SCOPE
This document describes the functional and test requirements
for the PCI Express
TM
card-edge connector. The connector is
designed to meet the requirements of the PCI Express Press
Fit.
1.2 APPLICABLE DOCUMENTS
1.2.1 PCI Express Card Electromechanical Specification
1.2.2 EIA –90, EIA-364-
09,17,20,21,28,31,32,65,70,101,108,638
1.2.3 PCI Express Connector High Speed Electrical Test
Procedure.
1.2.4 FCI drawing, PCI Express connector, inspection &
customer copy.
1.2.5 FCI drawing, solder washer, 78523 : inspection copy.
1.3 DRAWING PRECEDENCE
In the event of conflict between this document and product
prints, the product prints shall take precedence.
2.0 GENERAL REQUIREMENTS
2.1 The connector has the following characteristics:
1.00m(0.040”) pitch, X1, X4, X8, X12, X16, 280P sizes,
Press Fit, rectangular outline, plastic peg requiring
TH holes on PCB.
2.2 Visual examination, unless otherwise specified, shall
be made at 7X.
2.3 Silicone compounds (mold releases, lubricants, etc.)
May not be used in the manufacturing processes.
2.4 Flammability to be rated UL 94V-0.
2.5 Unless otherwise specified, tests that require the use
of a pc edge card shall use the following
2.5.1 Card material: FR-4 glass epoxy.
2.5.2 Thickness: 1.57 +/- 0.13 (0.062 +/- 0.005 inch)
2.5.3 Trace material: 0.035 (0.0014 inches), copper.
2.5.4 Trace plating: 0.76 micrometers (30 micro inches)
minimum gold over 1.27 micrometers (50 micro inches)
minimum unbrushed nickel
2.5.5 Pad and trace design: pad and trace design shall
follow PCI Express standard as depicted in customer
drawing.
PDM: Rev:K Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-319
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
3 of 10 K
AUTHORIZED BY
DATE
PCI EXPRESS
TM
& Express Module press fit CONNECTOR Bill Lin 4/19/2010
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
3.0 MECHANICAL REQUIREMENTS
3.1 EXAMINATION OF PRODUCT
Samples must comply to applicable FCI product prints.
3.2 INSERTION / WITHDRAWAL FORCE- ADD IN CARD
PER EIA-364-13
Mating cycle is with maximum/minimum thickness gage at a rate of 25.4 mm/minute.
3.2.1 Maximum insertion force is 1.15 N max. per contact pair when measured with a 1.70
+0.00/- 0.01(0.067 +0.000/ -0.004 inches) thick hardened steel card made to the
dimensions shown for the PCI Express expansion board in the FCI customer drawing.
The card has a R0.05 min., R0.10 max.(sharpedge)and the surface roughness in
connector area to be 0.10 micrometers (4 microinches) maximum.
3.2.2 Withdrawal force is 0.15N minimum per contact pair when measured with a 1.44 +0.01/-
0.00 (0.067 +0.004/-0.000 inches) thick FR-4 PCB card made to the dimensions shown for
the PCI Express expansion board in the FCI customer drawing. The card has a R0.05
min., R0.10 max (sharp edge) and the surface roughness in the connector area to be 0.10
micrometers (4 microinches) maximum.
3.3 CONTACT RETENTION
Minimum retention force of terminals in the connector housing to be 3N each. Pull rate to
be 1.27 mm/min.
3.4 BOARD RETENTION / INSERTION FORCES
3.4.1 EON retention/insertion force should be checked on an 1.57
0.13(0.093
0.05 inch)
thick segment of FR-4 glass/epoxy circuit board segment with a hole of diameter 0.72
0.06 mm drilled through.
At a rate of 2.5
6 mm per minute:
Insert force no more than 4.54 Kgf(10Lbs) per pin.
Retention force no less than 0.67 Kgf(1.5Lbs) per pin.
3.4.2 PCB Hole Deformation Radius-Cross-section parallel to board surface. Photograph and
measure the hole deformation (deformation on board material) radius at a point 0.010”
from the surface, and at the center of the compliant pin section. Include 10 holes. The
average (of 10 holes) hole deformation radius shall be no greater than 0.0381 mm
(0.0015 in)when measured from the drilled hole. The absolute maximum deformation
radius shall not exceed 0.0508 mm (0.002 in). Reference MIL-STD-2166.
3.4.3 PCB Hole Wall Damage-Cross-section perpendicular to the board surface, and through
the compliant section wear track. Photograph and measure the copper thickness
remaining between the compliant pin and the printed wiring board laminate. Include 10
holes. The minimum average (of 10 holes) copper thickness remaining between the
compliant pin and the printed wiring board laminate shall not be less than 0.00762
mm(0.0003 in). In addition there shall be no copper cracks, separations between
conductive interfaces, or laminate-to-copper separations. Reference MIL-STD-2166.
PDM: Rev:K Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-319
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
4 of 10 K
AUTHORIZED BY
DATE
PCI EXPRESS
TM
& Express Module press fit CONNECTOR Bill Lin 4/19/2010
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
4.0 ELECTRICAL REQUIREMENTS
Unless otherwise specified, all measurements should be performed in the following ambients:
relative humidity: 50% or less
temperature: 25°C +/- 5°c
barometric pressure: 711 to 812 mm mercury (at sea level)
4.1 LOW LEVEL CONTACT RESISTANCE
EIA-364-23
4.1.1 Solder connector to pc board per section 2.6 and insert card per section 2.5
4.1.2 Resistance measurements should be made from the underside of the pc board to the PTH in the
add in card above the contact pad. The test current shall be 100 milliampere d.c. max. with a
maximum open circuit voltage of 20 millivolts D.C. See figure 1.0 for attachment of current and
voltage leads.
4.1.3 Requirement is 30 milliohms maximum initial, with change of 10 milliohms maximum after
exposure testing.
PDM: Rev:K Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-319
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
5 of 10 K
AUTHORIZED BY
DATE
PCI EXPRESS
TM
& Express Module press fit CONNECTOR Bill Lin 4/19/2010
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
CONTACT RESISTANCE TEST SET UP
THROUGH HOLE
FIGURE 1
4.2 INSULATION RESISTANCE
Requirement is 1000 megohm minimum at 100 + / - 10% vdc when tested to EIA-364-21 per spec. The
connector shall not be mated during insulation resistance measurement.
4.3 DIELECTRIC WITHSTANDING
Per EIA-364-20 method B per spec. Test potential to be 300 VAC RMS, 60 HZ, and applied for 1 minute.
No breakdown should occur. Test is performed with connector unmated.
4.4 CONTACT CURRENT RATING
PDM: Rev:K Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-319
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
6 of 10 K
AUTHORIZED BY
DATE
PCI EXPRESS
TM
& Express Module press fit CONNECTOR Bill Lin 4/19/2010
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
1.1 amp per contact minimum per EIA-364-70, method 2 and PCI Express Connector High Speed
Electrical Test Procedure. The temperature rise shall not exceed 30 degree C. Ambient condition is still
air at 25°C.
4.5 INSERTION LOSS
Per EIA-364-101 and PCI Express Connector High Speed Electrical Test Procedure.
Requirements:
Less than or equal to 1dB up to 1.25 GHz
Less than or equal to 1.6 x (F-1.25)+1) db between 1.25GHz and 3.75GHz.
Less than or equal to 5 dB at 3.75 GHz
4.6 RETURN LOSS
Per EIA-364-108 and PCI Express Connector High Speed Electrical Test Procedure.
Requirements:
Less than or equal to -12dB up to 1.3 GHz
Less than or equal to -7dB up to 2.0 GHz
Less than or equal to -4dB up to 3.75 GHz
4.7 CROSSTALK: NEXT
Per EIA-90 and PCI Express Connector High Speed Electrical Test Procedure.
Requirements:
Less than or equal to -32 dB max up to 1.25 GHz
Less than or equal to –(32 – 2.4 x (F-1.25)) db between 1.25 GHz and 3.75GHz.
Less than or equal to -26 dB max up to 3.75 GHz
5.0 ENVIRONMENTAL REQUIREMENTS (Per EIA-364-1000.01)
5.1 THERMAL SHOCK
Per EIA-364-32, test condition I, 10 cycles
5.2 CYCLIC TEMPERATURE AND HUMIDITY
Per EIA-364-31, 24 cycles
Per EIA-364-TS-1000.01 TEST GROUP 2
5.3 TEMPERATURE LIFE (Pre-conditioning)
Per EIA-364-17, method A, 92 hours at 105°C
5.4 TEMPERATURE LIFE
Per EIA-364-17, method A, 168 hours at 105°C
5.5 VIBRATION
Per EIA-364-28, test condition VII, test condition letter D.
(15 minutes in each of 3 mutually perpendicular directions.
PDM: Rev:K Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-319
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
7 of 10 K
AUTHORIZED BY
DATE
PCI EXPRESS
TM
& Express Module press fit CONNECTOR Bill Lin 4/19/2010
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
Both mating halves should be rigidly fixed so as not to contribute to the relative motion one contact
Against another. The method of fixturing should be detailed in the test report.) 2/2 (boards) 2 conn/board.
Supplier Certification Data.
Requirements: no evidence of physical damage and discontinuities of one microsecond or greater
duration are allowed.
5.6 DURABILITY (Pre-conditioning)
CYCLE RATE : 500 MATING / HOUR
Per EIA-364-09, 20 cycles
5.7 DURABILITY
CYCLE RATE : 500 MATING / HOUR
Per EIA-364-09, 50 cycles
5.8 MIXED FLOWING GAS
Per EIA-364-65, class IIA, 10 days exposure. Expose connectors
unmated for 2/3 of the total duration. Mate each connector to the same add-in card that it was mated to in
temperature life (preconditioning) and expose for the remainder of the test duration.
5.9 RESEATING
Manually plug/unplug the card and connector, 3 cycles.
5.10 RESISTANCE TO SOLDERING HEAT
Per EIA-364-56 procedure 3, test condition C.
260°
5°C 10
2 seconds
6.0 Test Matrix for 1X,4X,8X,16X & 280P
PDM: Rev:K Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-319
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
8 of 10 K
AUTHORIZED BY
DATE
PCI EXPRESS
TM
& Express Module press fit CONNECTOR Bill Lin 4/19/2010
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
TABLE 1 - QUALIFICATION TESTING MATRIX
TEST
GROUP
TEST
GROUP
TEST
GROUP
TEST
GROUP
TEST
GROUP
TEST
GROUP
TEST
GROUP
TEST
GROUP
TEST
GROUP
TEST
GROUP
1 2 3 4 5 6 7 8 9 10
TEST PARA
TEST
SEQUENCE
Examination of Product 3.1 1 1 1 1 1 1 1 1 1 1
Insertion/Withdrawal Force –
Add In Card 3.2 2
Contact Retention 3.3 3
Board Retention /Insertion
Forces 3.4 2
Low Level Contact Resistance
4.1 2,5,7
2,5,8,
10 2,5,7
2,5,7,9,11
3,5
Insulation Resistance 4.2 7
DWV 4.3 2,6
Contact Current Rating 4.4 2
Insertion Loss 4.5 2
Return Loss 4.6 3
Crosstalk 4.7 4
Thermal Shock 5.1 4 8
Cyclic Temp and Humidity 5.2 6
Temperature Life (pre-
conditioning) 5.3 4 4
Temperature Life 5.4 4
Vibration
5.5 6
Durability (pre-conditioning) 5.6 3 3 3 3
Durability 5.7 4
Mixed Flowing Gas 5.8 6
Reseating 5.9 6 9 10
Resistance to soldering heat 5.10
2
Sample Quantity / Group
16X-5
(1)
280-5
(1)
16X-5
16X-5
280-5
16X-10
(2)
16X-
10,8X-
10,
4X-
10,1X-
10
(3)
280-10
4X-3
16X-
10
(4)
280-
10
(1)
16X-4
(5)
16X-3
Plastic
peg
16X-3
board
lock
16X-3
Notes:
1. samples for test groups 1,2,3,6 & 8 have metal hold downs, phos bronze contacts and 0.38 micrometers (15 u”)
gold plate, and black housings.
2. samples for test group 4:
a. 5 each same as note 1
b. 5 each same as note except with 0.76 micrometers (30u”) gold plate.
PDM: Rev:K Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-319
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
9 of 10 K
AUTHORIZED BY
DATE
PCI EXPRESS
TM
& Express Module press fit CONNECTOR Bill Lin 4/19/2010
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
3. samples for test group 5:
a. 5 each same as note 1
b. 5 each same as note except with plastic locating pegs.
4. samples for test group 7:
a. 5 each same as note 1
b. 5 each same as note except with 0.76 micrometers (30U”) gold plate.
5. samples for test group 8:
a. 2 each same as note 1
b. 2 each same as note except with 0.76 micrometers (30U”) gold plate.
REVISION RECORD
PDM: Rev:K Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-319
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
10 of 10 K
AUTHORIZED BY
DATE
PCI EXPRESS
TM
& Express Module press fit CONNECTOR Bill Lin 4/19/2010
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
REV PAGE DESCRIPTION ECR # DATE
A ALL RELEASED T05-0056 03/15/05
B ALL ADD 3.4.2 & 3.4.3 T05-0064 03/23/05
C ALL MODIFY 5.6.5 T05-0090 04/25/05
D ALL ADD Express Module TYPE T05-0170 08/04/05
E ALL 5.2 ADD EIA-364-TS-1000.01 TEST GROUP 2 T05-0202 09/09/05
F ALL MODIFY 3.2.2 T06-0007 01/10/06
G ALL 1. Change new FCI format
2. Change 0.70+/-0.06 to 0.72+/-
0.06 in item 3.4.1
in order to correct type mistake
DG07-0205 05/28/07
H ALL Change 3.4.1
Retention force no less than 0.91 Kgf(2
Lbs) per
pin Change to Retention force no less than 0.67
Kgf(1.5Lbs) per pin
DG07-0251 06/20/07
J ALL 3.2.2 “Withdrawal force is 0.10N
minimum per
contact pair” is changed to “
Withdrawal force is
0.15N minimum per contact pair”
DG07-0507 12/25/07
K ALL Change the confidential form to unrestricted form DG10-0145 04/19/10
PDM: Rev:K Released .STATUS: Printed: Nov 28, 2010
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