NUMBER TYPE GS-12-319 PRODUCT SPECIFICATION TITLE PAGE TM PCI EXPRESS REVISION 1 of 10 & Express Module press fit CONNECTOR AUTHORIZED BY Bill Lin K DATE 4/19/2010 CLASSIFICATION UNRESTRICTED TABLE OF CONTENTS SECTION 1 INTRODUCTION SECTION 2 GENERAL REQUIREMENTS SECTION 3 MECHANICAL 3.1 3.2 3.3 3.4 SECTION 4 ELECTRICAL 4.1 4.2 4.3 4.4 4.5 4.6 4.7 SECTION 5 EXAMINATION OF PRODUCT INSERTION/WITHDRAWAL FORCES - ADD IN CARD CONTACT RETENTION BOARD INSERTION/RETENTION FORCE LOW LEVEL CONTACT RESISTANCE INSULATION RESISTANCE DIELECTRIC WITHSTANDING CONTACT CURRENT RATING INSERTION LOSS RETURN LOSS CROSSTALK ENVIRONMENTAL 5.1 THERMAL SHOCK 5.2 CYCLIC TEMPERATURE AND HUMIDITY 5.3 TEMPERATURE LIFE (PRE-CONDITIONING) 5.4 TEMPERATURE LIFE 5.5 VIBRATION 5.6 DURABILITY (PRE-CONDITIONING) 5.7 DURABILITY 5.8 MIXED FLOWING GAS 5.9 RESEATING 5.10 RESISTANCE TO SOLDER HEAT SECTION 6 TEST MATRIX 1.0 INTRODUCTION Copyright FCI Form E-3334 Rev F GS-01-001 PDM: Rev:K STATUS:Released Printed: Nov 28, 2010. NUMBER TYPE GS-12-319 PRODUCT SPECIFICATION TITLE PAGE TM PCI EXPRESS REVISION 2 of 10 & Express Module press fit CONNECTOR AUTHORIZED BY Bill Lin K DATE 4/19/2010 CLASSIFICATION UNRESTRICTED 1.1 SCOPE This document describes the functional and test requirements TM for the PCI Express card-edge connector. The connector is designed to meet the requirements of the PCI Express Press Fit. 1.2 APPLICABLE DOCUMENTS 1.2.1 1.2.2 1.2.3 1.2.4 1.2.5 PCI Express Card Electromechanical Specification EIA -90, EIA-36409,17,20,21,28,31,32,65,70,101,108,638 PCI Express Connector High Speed Electrical Test Procedure. FCI drawing, PCI Express connector, inspection & customer copy. FCI drawing, solder washer, 78523 : inspection copy. 1.3 DRAWING PRECEDENCE In the event of conflict between this document and product prints, the product prints shall take precedence. 2.0 GENERAL REQUIREMENTS 2.1 2.2 2.3 2.4 2.5 The connector has the following characteristics: 1.00m(0.040") pitch, X1, X4, X8, X12, X16, 280P sizes, Press Fit, rectangular outline, plastic peg requiring TH holes on PCB. Visual examination, unless otherwise specified, shall be made at 7X. Silicone compounds (mold releases, lubricants, etc.) May not be used in the manufacturing processes. Flammability to be rated UL 94V-0. Unless otherwise specified, tests that require the use of a pc edge card shall use the following 2.5.1 2.5.2 2.5.3 2.5.4 Card material: FR-4 glass epoxy. Thickness: 1.57 +/- 0.13 (0.062 +/- 0.005 inch) Trace material: 0.035 (0.0014 inches), copper. Trace plating: 0.76 micrometers (30 micro inches) minimum gold over 1.27 micrometers (50 micro inches) minimum unbrushed nickel 2.5.5 Pad and trace design: pad and trace design shall follow PCI Express standard as depicted in customer drawing. Copyright FCI Form E-3334 Rev F GS-01-001 PDM: Rev:K STATUS:Released Printed: Nov 28, 2010. NUMBER TYPE GS-12-319 PRODUCT SPECIFICATION TITLE PAGE TM PCI EXPRESS REVISION 3 of 10 & Express Module press fit CONNECTOR AUTHORIZED BY Bill Lin K DATE 4/19/2010 CLASSIFICATION UNRESTRICTED 3.0 MECHANICAL REQUIREMENTS 3.1 EXAMINATION OF PRODUCT Samples must comply to applicable FCI product prints. 3.2 INSERTION / WITHDRAWAL FORCE- ADD IN CARD PER EIA-364-13 Mating cycle is with maximum/minimum thickness gage at a rate of 25.4 mm/minute. 3.2.1 Maximum insertion force is 1.15 N max. per contact pair when measured with a 1.70 +0.00/- 0.01(0.067 +0.000/ -0.004 inches) thick hardened steel card made to the dimensions shown for the PCI Express expansion board in the FCI customer drawing. The card has a R0.05 min., R0.10 max.(sharpedge)and the surface roughness in connector area to be 0.10 micrometers (4 microinches) maximum. 3.2.2 Withdrawal force is 0.15N minimum per contact pair when measured with a 1.44 +0.01/0.00 (0.067 +0.004/-0.000 inches) thick FR-4 PCB card made to the dimensions shown for the PCI Express expansion board in the FCI customer drawing. The card has a R0.05 min., R0.10 max (sharp edge) and the surface roughness in the connector area to be 0.10 micrometers (4 microinches) maximum. 3.3 CONTACT RETENTION Minimum retention force of terminals in the connector housing to be 3N each. Pull rate to be 1.27 mm/min. 3.4 BOARD RETENTION / INSERTION FORCES 3.4.1 EON retention/insertion force should be checked on an 1.57 0.13(0.093 0.05 inch) thick segment of FR-4 glass/epoxy circuit board segment with a hole of diameter 0.72 0.06 mm drilled through. At a rate of 2.5 6 mm per minute: Insert force no more than 4.54 Kgf(10Lbs) per pin. Retention force no less than 0.67 Kgf(1.5Lbs) per pin. 3.4.2 PCB Hole Deformation Radius-Cross-section parallel to board surface. Photograph and measure the hole deformation (deformation on board material) radius at a point 0.010" from the surface, and at the center of the compliant pin section. Include 10 holes. The average (of 10 holes) hole deformation radius shall be no greater than 0.0381 mm (0.0015 in)when measured from the drilled hole. The absolute maximum deformation radius shall not exceed 0.0508 mm (0.002 in). Reference MIL-STD-2166. 3.4.3 PCB Hole Wall Damage-Cross-section perpendicular to the board surface, and through the compliant section wear track. Photograph and measure the copper thickness remaining between the compliant pin and the printed wiring board laminate. Include 10 holes. The minimum average (of 10 holes) copper thickness remaining between the compliant pin and the printed wiring board laminate shall not be less than 0.00762 mm(0.0003 in). In addition there shall be no copper cracks, separations between conductive interfaces, or laminate-to-copper separations. Reference MIL-STD-2166. Copyright FCI Form E-3334 Rev F GS-01-001 PDM: Rev:K STATUS:Released Printed: Nov 28, 2010. NUMBER TYPE GS-12-319 PRODUCT SPECIFICATION TITLE PAGE TM PCI EXPRESS REVISION 4 of 10 & Express Module press fit CONNECTOR AUTHORIZED BY Bill Lin K DATE 4/19/2010 CLASSIFICATION UNRESTRICTED 4.0 ELECTRICAL REQUIREMENTS Unless otherwise specified, all measurements should be performed in the following ambients: relative humidity: 50% or less temperature: 25C +/- 5c barometric pressure: 4.1 711 to 812 mm mercury (at sea level) LOW LEVEL CONTACT RESISTANCE EIA-364-23 4.1.1 Solder connector to pc board per section 2.6 and insert card per section 2.5 4.1.2 Resistance measurements should be made from the underside of the pc board to the PTH in the add in card above the contact pad. The test current shall be 100 milliampere d.c. max. with a maximum open circuit voltage of 20 millivolts D.C. See figure 1.0 for attachment of current and voltage leads. 4.1.3 Requirement is 30 milliohms maximum initial, with change of 10 milliohms maximum after exposure testing. Copyright FCI Form E-3334 Rev F GS-01-001 PDM: Rev:K STATUS:Released Printed: Nov 28, 2010. NUMBER TYPE GS-12-319 PRODUCT SPECIFICATION TITLE PAGE TM PCI EXPRESS REVISION 5 of 10 & Express Module press fit CONNECTOR AUTHORIZED BY Bill Lin K DATE 4/19/2010 CLASSIFICATION UNRESTRICTED CONTACT RESISTANCE TEST SET UP THROUGH HOLE FIGURE 1 4.2 INSULATION RESISTANCE Requirement is 1000 megohm minimum at 100 + / - 10% vdc when tested to EIA-364-21 per spec. The connector shall not be mated during insulation resistance measurement. 4.3 DIELECTRIC WITHSTANDING Per EIA-364-20 method B per spec. Test potential to be 300 VAC RMS, 60 HZ, and applied for 1 minute. No breakdown should occur. Test is performed with connector unmated. 4.4 CONTACT CURRENT RATING Copyright FCI Form E-3334 Rev F GS-01-001 PDM: Rev:K STATUS:Released Printed: Nov 28, 2010. NUMBER TYPE GS-12-319 PRODUCT SPECIFICATION TITLE PAGE TM PCI EXPRESS REVISION 6 of 10 & Express Module press fit CONNECTOR AUTHORIZED BY Bill Lin K DATE 4/19/2010 CLASSIFICATION UNRESTRICTED 1.1 amp per contact minimum per EIA-364-70, method 2 and PCI Express Connector High Speed Electrical Test Procedure. The temperature rise shall not exceed 30 degree C. Ambient condition is still air at 25C. 4.5 INSERTION LOSS Per EIA-364-101 and PCI Express Connector High Speed Electrical Test Procedure. Requirements: Less than or equal to 1dB up to 1.25 GHz Less than or equal to 1.6 x (F-1.25)+1) db between 1.25GHz and 3.75GHz. Less than or equal to 5 dB at 3.75 GHz 4.6 RETURN LOSS Per EIA-364-108 and PCI Express Connector High Speed Electrical Test Procedure. Requirements: Less than or equal to -12dB up to 1.3 GHz Less than or equal to -7dB up to 2.0 GHz Less than or equal to -4dB up to 3.75 GHz 4.7 CROSSTALK: NEXT Per EIA-90 and PCI Express Connector High Speed Electrical Test Procedure. Requirements: Less than or equal to -32 dB max up to 1.25 GHz Less than or equal to -(32 - 2.4 x (F-1.25)) db between 1.25 GHz and 3.75GHz. Less than or equal to -26 dB max up to 3.75 GHz 5.0 ENVIRONMENTAL REQUIREMENTS (Per EIA-364-1000.01) 5.1 THERMAL SHOCK Per EIA-364-32, test condition I, 10 cycles 5.2 CYCLIC TEMPERATURE AND HUMIDITY Per EIA-364-31, 24 cycles Per EIA-364-TS-1000.01 TEST GROUP 2 5.3 TEMPERATURE LIFE (Pre-conditioning) Per EIA-364-17, method A, 92 hours at 105C 5.4 TEMPERATURE LIFE Per EIA-364-17, method A, 168 hours at 105C 5.5 VIBRATION Per EIA-364-28, test condition VII, test condition letter D. (15 minutes in each of 3 mutually perpendicular directions. Copyright FCI Form E-3334 Rev F GS-01-001 PDM: Rev:K STATUS:Released Printed: Nov 28, 2010. NUMBER TYPE GS-12-319 PRODUCT SPECIFICATION TITLE PAGE TM PCI EXPRESS REVISION 7 of 10 & Express Module press fit CONNECTOR AUTHORIZED BY Bill Lin K DATE 4/19/2010 CLASSIFICATION UNRESTRICTED Both mating halves should be rigidly fixed so as not to contribute to the relative motion one contact Against another. The method of fixturing should be detailed in the test report.) 2/2 (boards) 2 conn/board. Supplier Certification Data. Requirements: no evidence of physical damage and discontinuities of one microsecond or greater duration are allowed. 5.6 DURABILITY (Pre-conditioning) CYCLE RATE : 500 MATING / HOUR Per EIA-364-09, 20 cycles 5.7 DURABILITY CYCLE RATE : 500 MATING / HOUR Per EIA-364-09, 50 cycles 5.8 MIXED FLOWING GAS Per EIA-364-65, class IIA, 10 days exposure. Expose connectors unmated for 2/3 of the total duration. Mate each connector to the same add-in card that it was mated to in temperature life (preconditioning) and expose for the remainder of the test duration. 5.9 RESEATING Manually plug/unplug the card and connector, 3 cycles. 5.10 RESISTANCE TO SOLDERING HEAT Per EIA-364-56 procedure 3, test condition C. 260 5C 10 2 seconds 6.0 Test Matrix for 1X,4X,8X,16X & 280P Copyright FCI Form E-3334 Rev F GS-01-001 PDM: Rev:K STATUS:Released Printed: Nov 28, 2010. NUMBER TYPE GS-12-319 PRODUCT SPECIFICATION TITLE PAGE TM PCI EXPRESS REVISION 8 of 10 & Express Module press fit CONNECTOR K AUTHORIZED BY DATE Bill Lin 4/19/2010 CLASSIFICATION UNRESTRICTED TABLE 1 - QUALIFICATION TESTING MATRIX TEST Examination of Product Insertion/Withdrawal Force - Add In Card Contact Retention Board Retention /Insertion Forces TEST TEST TEST TEST TEST TEST TEST TEST TEST TEST GROUP GROUP GROUP GROUP GROUP GROUP GROUP GROUP GROUP GROUP 9 10 1 2 3 4 5 6 7 8 TEST PARA SEQUENCE 1 3.1 1 1 1 1 1 1 1 1 1 3.2 3.3 2 3 3.4 Low Level Contact Resistance Insulation Resistance DWV Contact Current Rating Insertion Loss Return Loss Crosstalk Thermal Shock Cyclic Temp and Humidity Temperature Life (preconditioning) Temperature Life Vibration Durability (pre-conditioning) Durability Mixed Flowing Gas Reseating 4.1 4.2 4.3 4.4 4.5 4.6 4.7 5.1 5.2 Resistance to soldering heat 5.10 5.3 5.4 5.5 5.6 5.7 5.8 5.9 2,5,7 2,5,8, 10 7 2,5,7 2,5,7,9,11 3,5 2,6 2 2 3 4 4 6 8 4 4 6 3 3 4 3 3 4 6 9 (1) Sample Quantity / Group 2 16X-5 (1) 280-5 16X-5 6 10 16X-5 (2) 280-5 16X-10 16X10,8X10, 4X10,1X(3) 10 280-10 4X-3 16X(4) 10 280(1) 10 16X-4 (5) 2 16X-3 Plastic peg 16X-3 board lock 16X-3 Notes: 1. samples for test groups 1,2,3,6 & 8 have metal hold downs, phos bronze contacts and 0.38 micrometers (15 u") gold plate, and black housings. 2. samples for test group 4: a. 5 each same as note 1 b. 5 each same as note except with 0.76 micrometers (30u") gold plate. Copyright FCI Form E-3334 Rev F GS-01-001 PDM: Rev:K STATUS:Released Printed: Nov 28, 2010. NUMBER TYPE GS-12-319 PRODUCT SPECIFICATION TITLE PAGE TM PCI EXPRESS REVISION 9 of 10 & Express Module press fit CONNECTOR AUTHORIZED BY Bill Lin K DATE 4/19/2010 CLASSIFICATION UNRESTRICTED 3. samples for test group 5: a. 5 each same as note 1 b. 5 each same as note except with plastic locating pegs. 4. samples for test group 7: a. 5 each same as note 1 b. 5 each same as note except with 0.76 micrometers (30U") gold plate. 5. samples for test group 8: a. 2 each same as note 1 b. 2 each same as note except with 0.76 micrometers (30U") gold plate. REVISION RECORD Copyright FCI Form E-3334 Rev F GS-01-001 PDM: Rev:K STATUS:Released Printed: Nov 28, 2010. NUMBER TYPE GS-12-319 PRODUCT SPECIFICATION TITLE PAGE TM PCI EXPRESS REVISION 10 of 10 & Express Module press fit CONNECTOR AUTHORIZED BY Bill Lin K DATE 4/19/2010 CLASSIFICATION UNRESTRICTED REV A PAGE ALL ECR # T05-0056 DATE 03/15/05 B ALL ADD 3.4.2 & 3.4.3 T05-0064 03/23/05 C ALL MODIFY 5.6.5 T05-0090 04/25/05 D ALL ADD Express Module TYPE T05-0170 08/04/05 E ALL 5.2 ADD EIA-364-TS-1000.01 TEST GROUP 2 T05-0202 09/09/05 F ALL MODIFY 3.2.2 T06-0007 01/10/06 G ALL DG07-0205 05/28/07 H ALL DG07-0251 06/20/07 J ALL DG07-0507 12/25/07 K ALL 1. Change new FCI format 2. Change 0.70+/-0.06 to 0.72+/-0.06 in item 3.4.1 in order to correct type mistake Change 3.4.1 Retention force no less than 0.91 Kgf(2Lbs) per pin Change to Retention force no less than 0.67 Kgf(1.5Lbs) per pin 3.2.2 "Withdrawal force is 0.10N minimum per contact pair" is changed to "Withdrawal force is 0.15N minimum per contact pair" Change the confidential form to unrestricted form DG10-0145 04/19/10 RELEASED DESCRIPTION Copyright FCI Form E-3334 Rev F GS-01-001 PDM: Rev:K STATUS:Released Printed: Nov 28, 2010. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: FCI: 10039755-10103TLF 10039755-10000TLF 10039755-10001TLF 10039755-10002TLF 10039755-10003TLF 10039755-10100TLF 10039755-10101TLF 10039755-10102TLF 10044013-10000TLF 10044013-10100TLF 10055293-10000TLF 10055293-10010TLF 10055293-10310T 10055295-10000TLF