Alpha Industries, Inc. [781] 935-5150 •Fax [617] 824-4579 •Email sales@alphaind.com •www.alphaind.com 1
Specifications subject to change without notice. 2/00A
18–23 GHz Power Amplifier
Features
■15 dB Gain
■+24 dBm Output Power
■Hermetic Package with Solderable Leads
■Single Voltage Operation
■100% RF and DC Testing
AA022P1-65
Description
The AA022P1-65 is a broadband millimeterwave amplifier
in a hermetic package. The amplifier is designed for use
in millimeterwave communication and sensor systems as
the transmitter front-end, transmitter gain stage, or local
oscillator gain stage when high gain and high power are
required. The solder-sealed hermetic package provides
excellent electrical performance, excellent thermal
performance, and complete environmental protection for
long-term reliability. A single supply voltage simplifies bias
requirements. All amplifiers are screened at the operating
frequencies prior to shipment for guaranteed
performance. The amplifier is targeted for millimeterwave
point-to-point and point-to-multipoint wireless
communications systems.
Parameter Symbol Min. Typ. Max. Unit
Bandwidth BW 18 17–24 23 GHz
Small Signal Gain G1315 dB
Input Return Loss RLI9dB
Output Return Loss RLO9dB
Output Power at Saturation PSAT 25 dBm
Output Power at 1 dB Gain Compression P1 dB 22 24 dBm
Temperature Coefficient of Gain dG/dT -0.019 dB/C
Electrical Specifications at 25°C (VD= 5.5 V)
Parameter Symbol Min. Typ. Max. Unit
Drain Current (Small Signal) ID260 360 420 mA
Drain Current (At Saturation) ID-SAT 325 mA
DC
RF
Pin Out
RF In RF Out
VDD
YYWW
AA022P1-65
RF In RF Out
VD
N/CN/C
18–23 GHz Power Amplifier AA022P1-65
2Alpha Industries, Inc. [781] 935-5150 •Fax [617] 824-4579 •Email sales@alphaind.com •www.alphaind.com
Specifications subject to change without notice. 2/00A
Characteristic Value
Operating Temperature (TC) -55°C to +90°C
Storage Temperature (TST) -65°C to +150°C
Bias Voltage (VD)7 V
DC
Power In (PIN) 20 dBm
Absolute Maximum Ratings
0
5
10
15
20
Gain (dB)
Frequency (GHz)
Gain vs. Frequency
-55˚C
+85˚C
+25˚C
12 16 20 24
16
18
20
22
24
26
Output Power (dBm)
Input Power (dBm)
Output Power vs. Input Power
0 4 8 12 16
24 GHz P1 dB = 22.4 dBm
20 GHz P1 dB = 23.7 dBm
22 GHz P1 dB = 23.9 dBm
-20
-15
-10
-5
0
Return Loss (dB)
Frequency (GHz)
Return Loss vs. Frequency
S22
S11
12 16 20 24
Typical Performance Data
Outline
0.106 (2.69 mm)
0.053
(1.35 mm) 0.272
(6.91 mm)
± 0.002
0.194 (4.92 mm)
0.053
(1.35 mm)
0.445
(11.30 mm)
± 0.002
0.318
(8.08 mm)
± 0.002
CW-10
MATERIAL
0.164 (4.16 mm)
0.115 (2.92 mm)
± 0.002
0.388 (9.86 mm)
0.328 (8.33 mm)
0.075 (1.91 mm)
± 0.010 0.010 (0.25 mm)
± 0.001
0.378 (9.60 mm) ± 0.003
∅ 0.070 (1.78 mm)
KOVAR
0.065
(1.65 mm)
MAX.
0.005
(0.13 mm)
± 0.001
0.015
(0.38 mm)
0.010
(0.25 mm)
± 0.002
CERAMIC
18–23 GHz Power Amplifier AA022P1-65
Alpha Industries, Inc. [781] 935-5150 •Fax [617] 824-4579 •Email sales@alphaind.com •www.alphaind.com 3
Specifications subject to change without notice. 2/00A
Typical S-Parameters at 25°C (VD= 5.5 V)
Frequency S11 S21 S12 S22
(GHz) Mag. Ang. Mag. Ang. Mag. Ang. Mag. Ang.
5.0 -1.09 -74.68 -10.27 119.56 -52.69 -53.88 -0.02 9.33
7.0 -3.99 20.09 -22.66 -148.84 -51.25 111.93 -1.62 126.08
9.0 -4.24 88.86 -4.30 -62.19 -50.26 174.57 -6.40 -179.76
11.0 -11.05 -156.14 0.51 37.75 -54.44 -30.60 -8.73 -103.47
13.0 -11.92 137.17 4.81 139.77 -45.58 -153.34 -9.10 42.33
14.0 -12.67 56.24 7.65 15.62 -40.67 116.81 -14.46 -45.55
15.0 -14.93 12.78 10.55 -122.97 -45.10 54.49 -20.97 151.51
16.0 -17.37 77.71 12.93 92.53 -38.93 -44.52 -21.63 99.72
17.0 -7.28 -11.33 12.63 -49.25 -36.17 -126.49 -10.34 34.51
18.0 -10.07 -84.35 13.49 -179.48 -33.77 136.88 -9.47 -60.49
19.0 -11.94 -77.63 15.56 33.54 -33.81 18.17 -10.67 -75.12
20.0 -12.10 -128.79 14.74 -108.18 -37.71 -91.39 -7.69 -168.58
21.0 -8.97 -175.15 14.76 113.18 -47.71 127.29 -10.92 111.42
22.0 -9.80 127.70 15.88 -27.30 -42.87 -128.42 -14.53 59.76
23.0 -7.12 50.83 16.08 172.99 -37.02 129.56 -13.43 -22.85
24.0 -7.95 -67.08 13.97 6.27 -35.31 44.33 -11.04 -88.28
25.0 -10.21 163.03 8.48 -141.45 -34.85 -46.25 -11.68 73.18
26.0 -10.38 131.18 2.53 49.03 -26.43 -132.35 -6.22 39.36
28.0 -11.23 -84.36 -2.81 132.15 -28.98 31.32 -4.53 -140.76
29.0 -4.83 -161.74 -9.96 -38.18 -27.13 -74.60 -6.46 120.95
30.0 -3.14 100.08 -21.41 -175.00 -28.16 -175.36 -4.55 15.97
32.0 -5.27 -101.79 -21.92 -8.83 -28.98 -27.58 -0.83 -164.50
34.0 -1.69 79.93 -44.55 150.61 -41.07 153.00 -1.11 50.91
36.0 -3.82 -126.96 -41.01 -52.33 -38.75 -61.13 -3.09 -155.22
38.0 -1.95 -172.40 -43.58 172.24 -42.55 -143.03 -0.81 -2.02
40.0 -4.62 -63.91 -29.46 -87.77 -29.96 -84.18 -1.70 -147.57
18–23 GHz Power Amplifier AA022P1-65
4Alpha Industries, Inc. [781] 935-5150 •Fax [617] 824-4579 •Email sales@alphaind.com •www.alphaind.com
Specifications subject to change without notice. 2/00A
Leaded Millimeterwave Package Handling
and Mounting
The leaded millimeterwave package requires careful
mounting design to maintain optimal performance.
Handling
The leaded millimeterwave package is extremely rugged.
Care should be exercised when handling with metal tools.
Only personnel trained in both ESD precautions and
handling precautions should be allowed to handle these
packages.
Package Construction
The construction of the leaded millimeterwave package
consists of a metal base and ceramic walls. The
package is topped by a solder-sealed metal lid. All metal
parts are gold-plated.
Mounting Design
The leaded millimeterwave package is mounted by placing
it in a hole cut in a printed circuit board. The bottom of the
package leads should be in the same plane as the top
surface of the printed circuit board traces.The hole should
be cut as close as possible to the outer dimensions of the
package to minimize the gap between package and
printed circuit board. The gap should be no more than
0.005" (0.127 mm). The base of the package should be
mounted directly to a surface that provides a good ground
plane for the printed circuit board and provides a good
thermal ground.
Mounting the Package
The leaded millimeterwave package should be attached
to its mounting surface using a silver-filled conductive
paste epoxy or solder. Care should be taken to ensure that
there are no voids or gaps in the epoxy or solder underfill
so that a good ground contact is maintained.
Screw hardware attachment should be used in addition
to epoxy or solder in situations where additional
mechanical integrity is desired. Care should be exercised
when tightening screws because over-tightening could
deform the package base.
Connecting the Package
Connection of the package leads to the printed circuit
board traces is accomplished with solder. Attached leads
should lie flat upon the printed circuits board traces.
Package leads can be trimmed if desired.
Leaded Millimeterwave Package Mounting
Printed Circuit Board
Rogers 4003
0.008" (0.20 mm) Thick
Electrically & Thermally
Conductive Ground Plane
Minimize RF
Gap Widths
Soldered Leads
RF In
RF Out
DC Connection
0–80 Screw
