Notice
Contents in this technical document be changed without any notice due to the product modification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc.
GW6TGBJC50C
2 000K 3 000K
Mega Zenigata with Natural Toning
ZENIGATA LED
SPECIFICATIONS
Sep 1, 2016
sharp LDE-E10-1-14-B
http://www.sharp-world.com/products/device/
LIGHTING BUSINESS UNIT
ELECTRONIC COMPONENTS AND DEVICES BU
SHARP CORPORATION
Handle this document carefully for it contains material protected by international copyright law.
Any reproduction, full or in part, of this material is prohibited without the express written permission
of the company.
When using the products covered herein, please observe the conditions written herein and the
precautions outlined in the following paragraphs. In no event shall the company be liable for any damages
resulting form failure to strictly adhere to these conditions and precautions.
(1)Please do verify the validity of this part after assembling it in customerʼs products, when customer
wants to make catalogue and instruction manual based on the specification sheet of this part.
(2)The products covered herein are designed and manufactured for the following application areas.
When using the products covered herein for the equipment listed in paragraph (3), even for the following
application areas, be sure to observe the precautions given in Paragraph (3). Never use the products
for the equipment listed in Paragraph (4).
*Office electronics
*Instrumentation and measuring equipment
*Machine tools
*Audiovisual equipment
*Home appliances
*Communication equipment other than for trunk limes
(3)These contemplating using the products covered herein for the following equipment which demands
high reliability,should first contact a sales representative of the company and then accept responsibility
for incorporating into the design fail-safe operation, redundancy, and other appropriate measures for
ensuring reliability and safety of the equipment and the overall system.
*Control and safety devices for airplanes, trains, automobiles, and other transportation equipment
*Mainframe computers
*traffic control systems
*Gas leak detectors and automatic cutoff devices
*Rescue and security equipment
*Other safety devices and safety wquipment, etc.
(4)Do not use the products covered herein for the following equipment which demands extremely
high performance in terms of functionality, or accuracy.
*Aerospace equipment
*Communications equipment for trunk lines
*Control equipment for the nuclear power industry
*Medical equipment related to life support, etc.
(5)please direct all queries and comments regarding the interpretation of the above four Paragraphs to
a sales representative of the company.
Please direct all queries regarding the products covered herein to a sales representative of the company.
sharp LDE-E10-1-14-B
Model No. GW6TGBJC50C
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1. Application
These specifications apply to the light emitting diode module Model No. GW6
TGBJC50C
.
[ LED module (InGaN Blue LED chip + Phosphor) ]
Main application : Lighting
2. External dimensions and equivalent circuit Refer to Page 2.
3. Ratings and characteristics Refer to Page 3-6.
3-1. Absolute maximum ratings
3-2. Electro-optical characteristics
3-3. Derating curve
3-4. Characteristics diagram (TYP.)
4. Reliability Refer to Page 7.
4-1. Test items and test conditions
4-2. Failure criteria
5. Quality level Refer to Page 8.
5-1. Applied standard
5-2. Sampling inspection
5-3. Inspection items and defect criteria
6. Supplements Refer to Page 9-12.
6-1. Chromaticity rank table
6-2. Packing
6-3. Label
6-4. Indication printed on product
7. Precautions Refer to Page 13-16.
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Model No. GW6TGBJC50C
GW6TGBJC50C Specifications
2.External dimensions and equivalent circuit
High CCT block 12 series × 8 parallel = 96 pcs of LEDs
High CCT block
Low CCT block
Unit Material Drawing No.
52605044Substrate : Alumina Ceramicmm
(18.6)
24.0+0.50/-0.10
(12.5)
20.0
+0.50/-0.10
3.5±0.1
1.4±0.1
(1.6) 1.0
±0.1
(Φ17.2)
(Φ15.6)
Low CCT block 10 series × 2 parallel = 20 pcs of LEDs
(Unit︓mm)
Top view
Side view
(Note)Values inside parentheses are reference values.
External sizes of①、②are determined by maximum dimensions,
that include salient areas on the edges of respective sides.
Current control circuit
-connection
terminal
+connection
terminal
Equivalent circuit
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Model No. GW6TGBJC50C
3.Ratings and characteristics
  3-1.Absolute maximum ratings
Item Symbol Rating Unit
Power Dissipation(※1,4)
Forward Current(※1,4)
Reverse Voltage(※2,4)
Operating Temperature(※3)
Storage Temperature
Junction Temperature
P
IF
VR
Topr
Tstg
Tj
41.6
145
W
mA
V
1 050
-15
-30 +100
-40 +100
*1 Power dissipation and forward current are the values when the module temperature
is set lower than the rating by using an adequate heat sink.
*2 The maximum rating of reverse voltage is assumed, after considering the voltage that occur due to initial
connection error that may occur suddenly.
(Not dealing with the possibility of always-on reverse voltage.)
*3 Operating temperature is the Case temperature Tc
(Refer to measuring point for case temperature in the next page.)
Refer to "Derating curve" in the next page as for operating current.
*4 T
c
= 25℃
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Model No. GW6TGBJC50C
3-2.Electro-optical characteristics
2000K
VF
Φ
Ra 90
25.8 (30.4)
(0.5251)
lm
V
120 (155) -
-
-
-
x
y
-
-(0.4120)
(94) -
-
-
3000K
Φ
Ra 90
(0.4370)
lm2430 (2860) -
-
-
-
x
y
-
-(0.4030)
(92) -
-
-
CCT
(Tj=25℃)
I =80mA
VF30.5 (35.8) V
33.4
39.6
I =950mA
F
F
Item Symbol MIN.Condition TYP. MAX. Unit
Forward Voltage※5
Chromaticity
Coordinates※7
Luminous Flux※6
General Color Rendering Index※8
Forward Voltage※5
Chromaticity
Coordinates※7
Luminous Flux※6
General Color Rendering Index※8
(Note) Values inside parentheses are shown for reference purpose only.
*5 (After 5 ms drive, Measurement tolerance: ± 3 %)
*6 Monitored by Sharp's 1m integrating sphere and Otsuka electronics SR-2000A
(After 5 ms drive, Measurement tolerance: ± 10 %)
*7 Monitored by Sharp's 1m integrating sphere and Otsuka electronics SR-2000A
(After 5 ms drive, Measurement tolerance: ± 0.005)
*8 Monitored by Sharp's 1m integrating sphere and Otsuka electronics SR-2000A
(After 5 ms drive, Measurement tolerance: ± 2)
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Model No. GW6TGBJC50C
3-3.Derating curve
Case Temperature Tc[℃]
Thermal Resistance︓1.30℃/W(Typical value)
measuring point
Forward CurrentI [mA]
F
0
100
200
300
400
500
600
700
800
900
1000
1100
-30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110
Forward Current Derating Curve
(Note) To keep the case temperature lower than the rating, enough heat-radiation performance needs to
be secured by using an adequate heat sink.
(Measuring point for case temperature)
For soldering connection, please evaluate in your circumstance to make sure soldering reliability.
( Above derating curve is specified to LED device, not for soldering connection )
And please consider to avoid physical stress between wire and substrate,
and some protection like silicon bond on top of soldered wire is recommended.
Please ensure the maintenance of heat radiation not to exceed case temperature over the rating
in operation.
Please take note of the following, when measuring case temperature.
1 The LED device mounting surface should be flat/plain surface.
2 The substrate surface temperature should be uniform.
3 Do not solder this area when you measuring case temperature.
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Model No. GW6TGBJC50C
3-4.Characteristics diagram(TYP.)
0
500
1000
1500
2000
2500
3000
3500
0 200 400 600 800 1000
CCT(K)
20.0
22.0
24.0
26.0
28.0
30.0
32.0
34.0
36.0
38.0
0 20 40 60 80 100
(80mA)
(950mA)
0
500
1000
1500
2000
2500
3000
3500
0 20 40 60 80 100
Luminous Flux (lm)
(80mA)
0
500
1000
1500
2000
2500
3000
3500
0 20 40 60 80 100
(80mA)
(950mA)
0
0.2
0.4
0.6
0.8
1
1.2
300 500 700 900
Normalized Intensity(arb.)
Wavelength(nm)
Spectrum at Tj=25
(950mA)
(80mA)
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
0 200 400 600 800 1000 1200
Forward Current vs. Forward Voltage T =25℃
V (V)
F
I  (mA)
F
0
500
1000
1500
2000
2500
3000
3500
0 200 400 600 800 1000 1200
Luminous Flux (lm)
Forward Current vs. Luminous Flux T =25℃
I  (mA)
F
0.395
0.4
0.405
0.41
0.415
0.42
0.4 0.45 0.5 0.55
Y
xy Chromaticity profile
(80mA)
(100mA)
(200mA)
(950mA)
T =25℃
X
T =25℃
Forward Current I  vs. CCT
F
I  (mA)
F
Case Temperature Tc vs. Forward Voltage VF
V (V)
F
Case Temperature Tc(℃)
Case Temperature Tc vs. Luminous Flux
Case Temperature Tc(℃)
Case Temperature Tc vs. CCT
CCT(K)
Case Temperature Tc(℃)
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Model No. GW6TGBJC50C
4-2.Failure criteria
C(%)
n
2
2
11 0 201
2
3
4
5
6
7
11 0 20
11 0 20
11 0 20
11 0 20
5 0 50
5 0 50
V
F
V
F
No.
1
2
ΦΦ
F
4.Reliability
The reliability of products shall be satisfied with items listed below.
  4-1.Test items and test conditions
Confidence level︓90%
Test itemNo. Test conditions samples Defective LTPD
- 40 ℃(30 min) ~ + 100 ℃(30 min), 100 cycles
Tstg = + 60 ℃, RH = 90 %, Time = 1000 h
Tstg = + 100℃, Time = 1000 h
Tstg = - 40 ℃, Time = 1000 h
Tc = 80 ℃, I = 950 mA, Time = 1000 h
Acceleration: 15000 m/s , Pulse width: 0.5 ms
Direction: 3 directions (X, Y and Z)
3 trials in each direction
Frequency: 100 to 2000 Hz for 4 minutes per trial
Acceleration: 200 m/s
Direction: 3 directions (X, Y and Z)
4 trials in each direction
Parameter Symbol Failure criteria
Forward Voltage
Luminous Flux
>Initial value×1.1
<Initial value×0.7
Temperature Cycle
Temperature Humidity
Storage
High Temperature
Storage
Low Temperature
Storage
Steady State
Operaring Life
Shock
Vibration
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Model No. GW6TGBJC50C
5.Quality level
  5-1.Applied standard (ISO2859-1)
  5-2.Sampling inspection (A single normal sampling plan,level S-4)
  5-3.Inspection items and defect criteria
No.
1
2
3
4
0.4
0.1
Major
defect
Minor
defect
AQL
Item Defect criteria Classification
No radiation
Electro-optical
characteristics
External
dimensions
Appearance
No light emitting
Not conforming to the specification
(External dimensions of ①and②shown in Page2)
Nonconformity observed in product appearance is determined
as defective only when electro-optical characteristics is affected by.
<If any question arises regardless of above mentioned criterion>
■Foreign material,scratch, or bubble at emitting area:0.8mm
■Fiber generation at emitting area:0.2mm ib width and 2.5mm inlengh
■Foreign material at connection terminal:0.8mmΦ
■Substrate burr on edge:Over dimension tolerance
Not conforming to the specification
(Forward voltage, Luminous flux and Chromaticity values)
(Note) Products with removable foreign material attached on is not determined to be defective.
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Model No. GW6TGBJC50C
6.Supplements
  6-1.Chromaticity rank table
---- Black Body curve
2 000K
(I =80mA)
Point 4Point 3Point 2Point 1
0.4180
0.5097
0.4060
0.5311
0.4060
1
x
y
0.5404
0.4180
0.5190
Rank
Chromaticity coordinates
(Tj=25℃)
0.4080
0.4287
0.3980
0.4404
0.3980
x
y
0.4454
0.4080
0.4334
Chromaticity Diagram
F
0.320
0.340
0.360
0.380
0.400
0.420
0.440
0.460
0.400 0.420 0.440 0.460 0.480 0.500 0.520 0.540 0.560 0.580
y
x
2700K
3000K
2200K2000K
3 000K
(I =950mA)
F
(Tolerance︓x,y±0.005)
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Model No. GW6TGBJC50C
6-2.Packing
One tray composed of 40 pieces
5 trays(200 piecies)and one upper lid-tray in one moisture-proof bag
2 bags(400 pieces) in one carton
Dimensions of outer carton:235×220×90mm (Reference value)
 (Note 1)Thre are cases of one carton composed of one bag (200 pieces)
(Note 2) State of packing is dubject to change.
(225mm)
(210mm)
<Outer carton>
200 pieces×2bags=400 pieces
<One bag>
40 pieces×5 trays=200 pieces
<One tray>
5×8=40 pieces
Silica gel
Silica gel
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Model No. GW6TGBJC50C
SHIPMENT TABLE
PART No. GW6TGBJC50C
(GW6TGBJC50CX)
QUANTITY︓200   RANK   1
LOT No. XX20G01054A
SHARP CORPORATION
MADE IN *********** RC
SHARP LABEL
SHIPMENT TABLE
PART No. GW6TGBJC50C
(GW6TGBJC50CX)
LOT No. XX12B01
QUANTITY︓400
RANK 1
SHARP CORPORATION
MADE IN *********** RC
SHARP LABEL
Model No. &
Control No.
←Model number
(Model number+ suffix code)
←Quantity
←Lot No.
←Rank
←Production country
  MADE IN ****
  MADE IN ****
6-3.Label
1) Outer carton
Following label is attached on outer carton.
(Note 3) Label format is subjected to change.
Lot No.indication
 XX   11   B   25
①    ②   ③   ④
①Production plant code
②Shipping year(Year last 2 digits)
③Shipping month
(from january to Doccmber in ABC order)
④Shipping date(01 31)
  ※Notation may be different
Lot No.indication
 XX   1  9  G  11   123   A
①   ②  ③  ④  ⑤    ⑥   ⑦
①Production plant code
②Shipping year(Year last digit)
③Shipping month(1 9 or O,N,D)
④Fixed code G
⑤Shipping date (01 31)
⑥Serial No.
⑦Backup code A
  ※Notation may be different
6-4. Indication printed on product
  Model No. and control No. are indicated on substrate surface.
1) Model No. & Rank:
1st line:Abbreviated Model No 'GBJCC ' is indicated."
2nd line:Rank:
2) Control No.
Indicated as follows;
12 B  11
①  ②  ③
① Year of production (the last two figures of the year)
② Month of production
 (to be indicated alphabetically with January corresponding to A)
③ Date of production (01~31)
←Model number
(Model number+suffix code)
←Quantity
←Lot No.
←Production country
  MADE IN ****
  MADE IN ****
2)Moisture-Proof bag
Following label is attached on moisture-proof bags.
(Note 3) Label format is subjected to change.
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Model No. GW6TGBJC50C
7.Precautions
① Storage conditions
  Please follow the conditions below.
Before opend:Temperature 5 ~ 30℃, Relative humidity less than 60%.
(Before opened LED should be used within a year)
After opened:Temperature 5 30℃, Relative humidity less than 60%.
(Please apply soldering within 1 week)
Avoid exposing to air with corrosive gas.
If exposed, electrode surface would be damaged,which may affect soldering.
② Usage conditions
This product is not designed for use under any of the following conditionds.
Pleasecarefully check the performance and reliability well enough in case of using under
any of the following conditions;
・ In a please with a lot of moisture,dew condensation,briny air, and corrosive gas.
(CL,H2S,NH3,SO2,NOX,etc)
Under the direct sumlight,outdoor exposure,and in a dusty please.
In water, oil,medical finrd, and organic solvent.
Please do not use component parts like rujbberwhich may contain sulfur(gasket packing,
adhesive material,etc.)
Please note that any strong acidic or alcoholic elements could effect the silicon resin used
in the LED device.
The heat and light released from the LED device,could generate halogen gas from the surounding
materials,which may have adverse impact on the module.Before using please consider carefully
about this issue.
③ Heat radiation and Installation
If forward curent (I ) is applied to single-state module at any curent,there is a risk of damaging
LED or emitting smoke,due to increase in temperature.
Equip with specified heat radiator(heat sink),and avoid heart being stuffed inside the module.
Material of substrate is alumina ceramic.IF installed inappropriately,trouble of insufficient heat
radiation may occur,which may result in board cracks or lighting defects due to overheat.
Please take particular notice for installation.
Refer to the following cautions while installing the LED device on heat sink.
Apply thermolysis adhesive,adhesive sheet or peculiar connector when mounted on heat radiator.
In case of applying adhesive or adhesive sheet only,check the effectiveness and reliability before
fixing. If LED comes off from heat radiator,unusual temperature rise entails hazardous phenomena
including device deterioration,comming off of solder at leads,and emitting smoke,slong with LED
device deffects.
F
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Model No. GW6TGBJC50C
Current control circuit
Handling area
  When LED device is mechanically fixed or locked,Please take into consideration regarding the
method of attachment due to fail from stress.
Please apply appropriate stress and design carefully,when fixing the LED device using holder.
Any excessive or uneven stress could break LED deviceʼ s substrate.
Avoid convexly uneven boards. Convex board is subject to substrate cracking or debasement
of heat release.
It is recommented to apply adhesive or adhesive sheet with high thermal conductivity for
radiation of heat effectively.
Please take care about the influence of color change of adhesive or adhesive sheet in initial and
long termperiod,which may affect light output or color due to change of reflectance from backside.
Any excessive or uneven stress on the ceramic substrate could break the substrate.
Please design such that,proper/uniform stress is applied on the substrate,when fixing the LED
device using a holder.
When fixing the LED device with a holder,please take note if any excessive or uneven stress is
applied when pressing the substrate with holder.Due to this,the gap may arise between LED
device and adhesive material,which may affect the heat dissipation of the device.
Do not touch resin part including white resin part on the surface of LED.
No light emission may occur due to damage of resin or cutting wire of LEDs by outer force.
When using tweezers,please handle by side part of ceramic or the specified area shown below.
The outer edges of the substrate may be uneven in some cases. Please avoid choosing these
areas as fixing points,while designing for installation.
In case of using heat radiation sheet or heat radiation adhesive,light reflection or absorption of
these materials may influence the output of LED device. and hence careful consideration is required
while choosing the radiation sheet ro adhesive.
④ Connecting method
Use soldering for connections. Follow the conditioons mentioned below,to preserve the connection
strength.
Use soldering iron with thermo controller(tip temperature 380℃,within 5 seconds per one place.
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Model No. GW6TGBJC50C
Secure the solderwettability on whole solder pad and leads.
During the soldering process,put the ceramic board on materials whose conductivity is poor
enough not to radiate heat of soldering.
Warm up(with using a heated plate) the substrate is recommended before soldering.
(preheat condition:100℃~ 150℃,within 60sec)
Avoid touching any part of resin with soldering iron.
This product is not designed for reflow and flow soldering.
Avoid such lead arrangement as applying stress to solder-applied area.
Please do not detach solder and make re-solder.
Please solder evenly on each electrode.
Please prevent flux from touching to resin.
Do the soldering on stable stand.Avoid soldering on moving or vibrating objects.
Please avoid touching the soldering unit to resin.
⑤ Static electricity
This product is subject to static electricity,so take measures like wearing wrist band to cope with
it. Install circuit protection device to drive circuit, if necessary.
⑥ Drive method
Any reverse voltage cannot be applied to LEDs when they are in operation or not.
Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs
when they are out of operation.
Module is composed of LEDs connected in both series and parallel.
Constant voltage power supply runs off more than specified current amount due to lowered VF
caused by temperature rise.Constant current power supply is recommended to drive.
Be cautious while putting on/off the power supply,as excess current,excess voltage or reverse
voltage may get injucted to the device in some cases.
⑦ Cleaning
Avoid cleaning,since LED device may be effected in some cases by cleaning.
⑧ Color-tone variation
Chromaticity of this product is monitored by integrating sphere right after the operation.
Chromaticity varies depending on measuring method,light spread condition,or ambient temperature.
Please verify your actual conditions before use.
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Model No. GW6TGBJC50C
⑨ Safety
Looking directly at LEDs for a long time may result in hurting your eyes.
In case that excess curent(over ratings)is supplied to the device,hazardous phenomena
including abnormal heat generation,emitting smoke,or catching fire can caused.
Take appropriate measures to excess current and voltage.
In case of solder connecting method,there is a possibility of fatigue failure by heat.
Please fix the leads in such case to protect from short circuit or leakage of electricity
caused by contact.
Please confirm the safety standards or regulations of application devices.
Please be careful with substrate edges,that may injure your hands.
⑩ Other cautions
Guarantee covers the compliance to the quality standards mentioned in the specifications,
however it does not cover the compatibility with application of the end-use,including
assembly and usage environment.
In case any quality problems ocurred in the application of end-use,details will be separately
discussed and determined between the parties hereto.
  
sharp LDE-E10-1-14-B
15
“Contentsinthistechnicaldocumentbechangedwithoutanynoticeduetotheproductmodification.” http://www.sharp-world.com/products/device/
Model No. GW6TGBJC50C
http://www.sharp-world.com/products/device/