Data sheet acquired from Harris Semiconductor
SCHS294
This data sheet is applicable to the CD74AC562, CD74ACT651, and CD74ACT652. The CD54/74AC651, CD54AC652, CD54ACT651,
and CD54ACT652 were not acquired from Harris Semiconductor .
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
CD74AC652M ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74AC652M96 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74AC652M96E4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74AC652M96G4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74AC652ME4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74AC652MG4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74ACT652EN ACTIVE PDIP NT 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD74ACT652ENE4 ACTIVE PDIP NT 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD74ACT652M ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74ACT652M96 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74ACT652M96G4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74ACT652MG4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CD74AC652M96 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
CD74ACT652M96 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74AC652M96 SOIC DW 24 2000 346.0 346.0 41.0
CD74ACT652M96 SOIC DW 24 2000 346.0 346.0 41.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 2
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