A623308 Series
Preliminary 8K X 8 BIT CMOS SRAM
PRELIMINARY (December, 2002, Version 0.3) AMIC Technology, Corp.
Document Title
8K X 8 BIT CMOS SRAM
Revision History
Rev. No. History Issue Date Remark
0.0 Initial issue July 2, 1999 Preliminary
0.1 Erase 55ns part December 14, 2000
0.2 Add SI/SU part no. and change ICC1, Isb1 December 11, 2002
0.3 Erase 28-pin TSOP reverse type package December 23, 2002
A623308 Series
Preliminary 8K X 8 BIT CMOS SRAM
PRELIMINARY (December, 2002, Version 0.3) 1 AMIC Technology, Corp.
Features
n External Operating Voltage: 4.5V to 5.5V
n Access times: 70 ns (max.)
n Current:
A623308-S series: Operating: 35mA (max.)
Standby: 10µA (max.)
A623308-SI/SU series: Operating: 35mA (max.)
Standby: 15µA (max.)
n Extended operating temperature range: 0°C to 70°C
for -S series, -25°C to 85°C for -SI series, -40°C to
85°C for -SU series.
n Full static operation, no clock or refreshing required
n All inputs and outputs are directly TTL compatible
n Common I/O using three-state output
n Data retention voltage: 2.0V (min.)
n Available in 28-pin SOP and TSOP (forward type)
packages
General Description
The A623308 is a low operating current 65,536-bit static
random access memory organized as 8,192 words by 8
bits and operates on a single 5V power supply.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Minimum standby power is drawn by this device when
CE is at a high level, independent of the other input
levels.
Data retention is guaranteed at a power supply voltage
as low as 2.0V.
Pin Configurations
n SOP n TSOP
NC
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND I/O3
I/O4
I/O5
I/O6
I/O7
CE
OE
A11
A9
A8
NC
WE
VCC
A10
A623308M
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15
16
17
18
19
20
21
22
23
24
25
26
27
28
A623308V
1
9
28
20
A11 2
3
4
5
6
7
8
10
11
12
13
14
A9
A8
NC
NC
A12
A7
A6
A5
A4
A3
27
26
25
24
23
22
21
19
18
17
16
15
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
I/O0
A0
A1
A2
A10
VCC
I/O7
OE
WE
CE
~
~
~
~
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 2 AMIC Technology, Corp.
Block Diagram
ROW
DECODER
128 X 512
MEMORY ARRAY
COLUMN I/O
COLUMN DECODER
INPUT
DATA
CIRCUIT
CONTORL
CIRCUIT
VCC
GND
A10A4A0
CE
OE
WE
I/O
7
I/O
0
A12
A11
A9
A5
Pin Descriptions - SOP
Pin No. Symbol Description
1,26 NC No Connection
2-10, 21, 23-25 A0 - A12 Address Input
11-13, 15-19 I/O0 - I/O7 Data Inputs/Outputs
14 GND Ground
20 CE Chip Enable
22 OE Output Enable
27 WE Write Enable
28 VCC Power Supply
Pin Description-TSOP
Pin No. Symbol Description
5,8 NC No Connection
1 OE Output Enable
2-4, 9-17, 28 A0 - A12 Address Input
7 VCC Power Supply
6 WE Write Enable
18-20, 22-26 I/O0 - I/O7 Data Inputs/Outputs
21 GND Ground
27 CE Chip Enable
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 3 AMIC Technology, Corp.
Recommended DC Operating Conditions
(TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C)
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 4.5 5.0 5.5 V
GND Ground 0 0 0 V
VIH Input High Voltage 2.2 3.5 VCC + 0.3 V
VIL Input Low Voltage -0.3 0 +0.8 V
Absolute Maximum Ratings*
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . 0°C to +70°C or -40°C to +85°C
Storage Temperature, Tstg . . . . . . . . . -55°C to +125°C
Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . 0.7W
Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec
*Comments
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied and exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
DC Electrical Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C, VCC = 5.0V ± 10%, GND = 0V)
Symbol Parameter A623308-70S A623308-70SI/SU Unit Conditions
Min. Max. Min. Max.
ILI Input Leakage
Current - 1 - 1 µA VIN = GND to VCC
ILO Output Leakage
Current - 1 - 1 µA CE = VIH or OE = VIH or
WE = VIH
VI/O = GND to VCC
ICC Active Power
Supply Current - 5 - 5 mA CE = VIL, II/O = 0mA
ICC1 Dynamic
Operating Current - 35 - 35 mA Min. Cycle, Duty = 100%
CE = VIL, II/O = 0mA
ICC2 Dynamic
Operating Current
- 5
- 5
mA CE = VIL, VIH = VCC
VIL = 0V, f = 1 MHz
II/O = 0 mA
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 4 AMIC Technology, Corp.
DC Electrical Characteristics (continued)
Symbol Parameter A623308-70S A623308-70SI/SU Unit Conditions
Min. Max. Min. Max.
ISB Supply Current - 0.5 - 0.5 mA CE = VIH
ISB1 Standby Power - 10 - 15 µA CE VCC - 0.2V
VIN 0V
VOL Output Low
Voltage - 0.4 - 0.4 V IOL = 2.1mA
VOH Output High
Voltage 2.4 - 2.4 - V IOH = -1.0mA
Truth Table
Mode
CE
OE
WE
I/O Operation Supply Current
Standby H X X High Z ISB, ISB1
Output Disable L H H High Z ICC, ICC1, ICC2
Read L L H DOUT ICC, ICC1, ICC2
Write L X L DIN ICC, ICC1, ICC2
Note: X: H or L
Capacitance (TA = 25°C, f = 1.0 MHz)
Symbol Parameter Min. Max. Unit Conditions
CIN* Input Capacitance 6 pF VIN = 0V
CI/O* Input/Output Capacitance 8 pF VI/O = 0V
* These parameters are sampled and not 100% tested.
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 5 AMIC Technology, Corp.
AC Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C, VCC = 5.0V ± 10%)
Symbol Parameter A623308-70S/SI/SU Unit
Min. Max.
Read Cycle
tRC Read Cycle Time 70 - ns
tAA Address Access Time - 70 ns
tACE Chip Enable Access Time - 70 ns
tOE Output Enable to Output Valid - 35 ns
tCLZ Chip Enable to Output in Low Z 10 - ns
tOLZ Output Enable to Output in Low Z 5 - ns
tCHZ Chip Disable to Output in High Z - 25 ns
tOHZ Output Disable to Output in High Z - 25 ns
tOH Output Hold from Address Change 5 - ns
Write Cycle
tWC Write Cycle Time 70 - ns
tCW Chip Enable to End of Write 60 - ns
tAS Address Set up Time 0 - ns
tAW Address Valid to End of Write 60 - ns
tWP Write Pulse Width 50 - ns
tWR Write Recovery Time 0 - ns
tWHZ Write to Output in High Z - 30 ns
tDW Data to Write Time Overlap 30 - ns
tDH Data Hold from Write Time 0 - ns
tOW Output Active from End of Write 5 - ns
Notes: tCHZ, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are not
referred to output voltage levels.
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 6 AMIC Technology, Corp.
Timing Waveforms
Read Cycle 1 (1)
tRC
tAA
tOH
Address
DOUT
tOHZ5
tCHZ5
tACE
tCLZ5
tOLZ5
tOE
CE
OE
Read Cycle 2 (1, 2, 4)
tRC
tOH
tAA
tOH
Address
DOUT
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 7 AMIC Technology, Corp.
Timing Waveforms (continued)
Read Cycle 3 (1, 3, 4)
tCLZ 5
tACE
tCHZ 5
CE
DOUT
Notes: 1. WE is high for Read Cycle.
2. Device is continuously enabled, CE = VIL.
3. Address valid prior to or coincident with CE transition low.
4. OE = VIL.
5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
Write Cycle 1 (6)
(Write Enable Controlled)
tWC
Address
CE
DIN
tOW 7
tDHtDW
tWHZ 7
tWP2
tAS1
(4)
tCW5
tAW tWR3
WE
DOUT
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 8 AMIC Technology, Corp.
Timing Waveforms (continued)
Write Cycle 2 (6)
(Chip Enable Controlled)
tWC
Address
CE
DIN
tDH
tDW
(4)
tCW5
tAW tWR3
WE
DOUT
tWHZ7
tWP2
tAS1
Notes: 1. tAS is measured from the address valid to the beginning of Write.
2. A Write occurs during the overlap (tWP) of a low CE and a low WE.
3. tWR is measured from the earliest of CE or WE going high to the end of the Write cycle.
4. If the CE low transition occurs simultaneously with the WE low transition or after the WE transition, outputs
remain in a high impedance state.
5. tCW is measured from the later of CE going low to the end of Write.
6. OE level is high or low.
7. Transition is measured ±500mV from steady. This parameter is sampled and not 100% tested.
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 9 AMIC Technology, Corp.
AC Test Conditions
Input Pulse Levels 0V, 3.0V
Input Rise And Fall Time 5 ns
Input and Output Timing Reference Levels 1.5V
Output Load See Figure 1,2
30pF*
* Including scope and jig.
CL
* Including scope and jig.
I/O
+5V
990
1800
5pF*
CL
I/O
+5V
990
1800
Figure 1. Output Load Figure 2. Output Load for tCLZ
tOLZ , tCHZ, tOHZ, tWHZ, and tow
Data Retention Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C)
Symbol Parameter Min. Max. Unit Conditions
VDR VCC for Data Retention 2.0 5.5 V CE VCC - 0.2V
ICCDR
Data Retention Current
-
3
µA VCC = 2.0V,
CE VCC - 0.2V
VIN 0V
tCDR Chip Disable to Data Retention Time 0 - ns
tR Operation Recovery Time tRC - ns See Retention Waveform
Low VCC Data Retention Waveform
VCC
tCDR
VIH
4.5V
tR
VIH
4.5V
DATA RETENTION MODE
VDR 2.0V
CE VDR - 0.2V
CE
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 10 AMIC Technology, Corp.
Ordering Information
Part No. Access Time (ns) Operating Current
Max. (mA) Standby Current
Max. (µA) Package
A623308M-70S 35 10 28L SOP
A623308V-70S 35 10 28L TSOP (Forward)
A623308M-70SI 35 15 28L SOP
A623308V-70SI 35 15 28L TSOP (Forward)
A623308M-70SU 35 15 28L SOP
A623308V-70SU
70
35 15 28L TSOP (Forward)
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 11 AMIC Technology, Corp.
Package Information
SOP (W.B.) 28L Outline Dimensions unit: inches/mm
1
E
H
L
L1
c
14
See Detail F
Detail F
B
1528
A1A2
A
S
D
Seating Plane
D
y
e
y
θ
Dimensions in inches Dimensions in mm
Symbol Min Nom Max Min Nom Max
A - - 0.112 - - 2.85
A1 0.004 - - 0.10 - -
A2 0.093 0.098 0.103 2.36 2.49 2.62
B 0.014 0.016 0.020 0.36 0.41 0.51
C 0.008 0.010 0.012 0.20 0.25 0.30
D - 0.713 0.728 - 18.11 18.49
E 0.326 0.331 0.336 8.28 8.41 8.53
e 0.044 0.050 0.056 1.12 1.27 1.42
H 0.453 0.465 0.477 11.51 11.81 12.12
L 0.028 0.036 0.044 0.71 0.91 1.12
L1 0.059 0.067 0.075 1.50 1.70 1.91
S - - 0.047 - - 1.19
y - - 0.004 - - 0.10
θ - -
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
A623308 Series
PRELIMINARY (December, 2002, Version 0.3) 12 AMIC Technology, Corp.
D
1
E
e
D
L
A
A2
c
Detail "A"
D
y
Detail "A"
S
A1
b
28
15
1
14
θ
Package Information
TSOP 28L TYPE I (8 X 13.4mm) Outline Dimensions unit: inches/mm
Dimensions in inches
Dimensions in mm
Symbol Min Nom Max Min Nom Max
A - - 0.049 - - 1.25
A1 0.002 - - 0.05 - -
A2 0.037 0.039 0.041 0.95 1.00 1.05
b 0.007 0.009 0.011 0.17 0.22 0.27
c 0.005 - 0.008 0.12 - 0.21
E 0.311 0.315 0.319 7.90 8.00 8.10
L 0.012 0.020 0.028 0.30 0.50 0.70
D 0.520 0.528 0.536 13.20 13.40 13.60
D1 0.461 0.465 0.469 11.70 11.80 11.90
e 0.022 BSC 0.55 BSC
S 0.017 TYP 0.425 TYP
y - - 0.004 - - 0.10
θ 0° - 5° 0° - 5°
Notes:
1. The maximum value of dimension D1 includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.