FEATURES Input voltage range: 2.5 V to 5.5 V Small, 8-lead, 2 mm x 2 mm LFCSP package Initial accuracy: 1% High PSRR: 70 dB at 10 kHz, 60 dB at 100 kHz, 40 dB at 1 MHz Low noise: 27 V rms at VOUT = 1.2 V, 50 V rms at VOUT = 2.8 V Excellent transient response Low dropout voltage: 170 mV at 300 mA load 65 A typical ground current at no load, both LDOs enabled Fixed output voltage from 0.8 V to 3.3 V (ADP222/ADP224) Adjustable output voltage range from 0.5 V to 5.0 V (ADP223/ADP225) Quick output discharge (QOD)--ADP224/ADP225 Overcurrent and thermal protection APPLICATIONS Portable and battery-powered equipment Portable medical devices Post dc-to-dc regulation Point of sale terminals Credit card readers Automatic meter readers Wireless network equipment TYPICAL APPLICATION CIRCUITS VIN = 4.2V + C1 1F OFF OFF R2 ON R1 1 EN1 2 EN2 3 GND VIN 6 4 ADJ2 VOUT2 5 ON ADJ1 8 ADP223/ ADP225 VOUT2 = 2.0V VOUT1 7 + C2 1F VOUT1 = 2.8V R3 + C3 1F 09376-001 Data Sheet Dual, 300 mA Output, Low Noise, High PSRR Voltage Regulators ADP222/ADP223/ADP224/ADP225 R4 Figure 1. ADP223/ADP225 VIN = 4.2V + C1 1F OFF ON 1 OFF SENSE1 8 EN1 ADP222/ ADP224 ON VOUT1 = 1.5V 2 EN2 VOUT1 7 3 GND VIN 6 4 SENSE2 + C2 1F VOUT2 = 3.3V + C3 1F 09376-101 VOUT2 5 Figure 2. ADP222/ADP224 GENERAL DESCRIPTION The 300 mA, adjustable dual output ADP223/ADP225 and fixed dual output ADP222/ADP224 combine high PSRR, low noise, low quiescent current, and low dropout voltage in a voltage regulator that is ideally suited for wireless applications with demanding performance and board space requirements. 100 kHz while operating with a low headroom voltage. The ADP222/ADP223/ADP224/ADP225 offer much lower noise performance than competing LDOs without the need for a noise bypass capacitor. Overcurrent and thermal protection circuitry prevent damage in adverse conditions. The ADP222/ADP224 are available with fixed outputs voltages from 0.8V to 3.3V. The adjustable output ADP223/ADP225 may be set to output voltages from 0.5 V to 5.0 V. The low quiescent current, low dropout voltage, and wide input voltage range of the ADP222/ADP223/ADP224/ADP225 extend the battery life of portable devices. The ADP224 and ADP225 are identical to the ADP222 and ADP223, respectively, but with the addition of a quick output discharge (QOD) feature. The ADP222/ADP223/ADP224/ADP225 maintain power supply rejection greater than 60 dB for frequencies as high as The ADP222/ADP223/ADP224/ADP225 are available in a small 8-lead, 2 mm x 2 mm LFCSP package and are stable with tiny 1 F, 30% ceramic output capacitors, resulting in the smallest possible board area for a wide variety of portable power needs. Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2011-2012 Analog Devices, Inc. All rights reserved. ADP222/ADP223/ADP224/ADP225 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................7 Applications ....................................................................................... 1 Theory of Operation ...................................................................... 17 Typical Application Circuits............................................................ 1 Applications Information .............................................................. 18 General Description ......................................................................... 1 Capacitor Selection .................................................................... 18 Revision History ............................................................................... 2 Enable Feature ............................................................................ 19 Specifications..................................................................................... 3 Paralleling Outputs to Increase Output Current.................... 19 Input and Output Capacitor, Recommended Specifications .. 4 Quick Output Discharge (QOD) Function ............................ 19 Absolute Maximum Ratings............................................................ 5 Current Limit and Thermal Overload Protection ................. 20 Thermal Data ................................................................................ 5 Thermal Considerations............................................................ 20 Thermal Resistance ...................................................................... 5 Printed Circuit Board Layout Considerations ....................... 22 ESD Caution .................................................................................. 5 Outline Dimensions ....................................................................... 23 Pin Configuration and Function Descriptions ............................. 6 Ordering Guide .......................................................................... 23 REVISION HISTORY 8/12--Rev. B to Rev. C 7/11--Rev. 0 to Rev. A Changes to Ordering Guide .......................................................... 23 Added ADP222, ADP224, and ADP225 ......................... Universal Changes to Features Section, Applications Section, General Description Section, and Figure 2 ....................................1 Changes to Table 1.............................................................................3 Added Figure 4; Renumbered Sequentially ...................................6 Changes to Table 5.............................................................................6 Changes to Typical Performance Characteristics Section ...........7 Changes to Theory of Operation Section and Figure 62 .......... 17 Added Figure 63 ............................................................................. 17 Added Quick Output Discharge (QOD) Function Section Added Figure 70 ............................................................................. 20 8/11--Rev. A to Rev. B Changes to Features and General Descriptions Sections ............ 1 Added Figure 64; Renumbered Sequentially .............................. 17 Changes to Theory of Operation Section .................................... 17 Changes to Output Capacitor Section ......................................... 18 Changes to Paralleling Outputs to Increase Output Current Section ............................................................................... 19 Updated Outline Dimensions ....................................................... 23 2/11--Revision 0: Initial Version Rev. C | Page 2 of 24 Data Sheet ADP222/ADP223/ADP224/ADP225 SPECIFICATIONS VIN = (VOUT + 0.5 V) or 2.5 V (whichever is greater), EN1 = EN2 = VIN, IOUT1 = IOUT2 = 10 mA, CIN = COUT1 = COUT2 = 1 F, TA = 25C, unless otherwise noted. Table 1. Parameter INPUT VOLTAGE RANGE OPERATING SUPPLY CURRENT WITH BOTH REGULATORS ON SHUTDOWN CURRENT OUTPUT VOLTAGE ACCURACY 1 ADJUSTABLE-OUTPUT VOLTAGE ACCURACY1 LINE REGULATION LOAD REGULATION Symbol VIN IGND IGND-SD VOUT VADJ VOUT/VIN 2 DROPOUT VOLTAGE 3 VOUT/IOUT VDROPOUT SENSE INPUT BIAS CURRENT ADJx INPUT BIAS CURRENT START-UP TIME 4 SENSEI-BIAS ADJI-BIAS tSTART-UP CURRENT-LIMIT THRESHOLD 5 THERMAL SHUTDOWN Thermal Shutdown Threshold Thermal Shutdown Hysteresis EN INPUT EN Input Logic High EN Input Logic Low EN Input Leakage Current ILIMIT UNDERVOLTAGE LOCKOUT Input Voltage Rising Input Voltage Falling Hysteresis OUTPUT DISCHARGE TIME OUTPUT DISCHARGE RESISTANCE UVLO UVLORISE UVLOFALL UVLOHYS tDIS RQOD Test Conditions/Comments TJ = -40C to +125C IOUT = 0 A IOUT = 0 A, TJ = -40C to +125C IOUT = 10 mA IOUT = 10 mA, TJ = -40C to +125C IOUT = 300 mA IOUT = 300 mA, TJ = -40C to +125C EN1 = EN2 = GND TJ = -40C to +125C IOUT = 10 mA 0 A < IOUT < 300 mA, VIN = (VOUT + 0.5 V) to 5.5 V TJ = -40C to +125C IOUT = 10 mA 0 A < IOUT < 300 mA, VIN = (VOUT + 0.5 V) to 5.5 V VIN = (VOUT + 0.5 V) to 5.5 V VIN = (VOUT + 0.5 V) to 5.5 V, TJ = -40C to +125C IOUT = 1 mA to 300 mA IOUT = 1 mA to 300 mA, TJ = -40C to +125C VOUT = 3.3 V IOUT = 10 mA IOUT = 10 mA, TJ = -40C to +125C IOUT = 300 mA IOUT = 300 mA, TJ = -40C to +125C A 2.5 V VIN 5.5 V, SENSEx connected to VOUTx 2.5 V VIN 5.5 V, ADJx connected to VOUTx VOUT = 3.3 V VOUT = 0.8 V Min 2.5 TJ rising VIH VIL VI-LEAKAGE 2.5 V VIN 5.5 V 2.5 V VIN 5.5 V EN1 = EN2 = VIN or GND EN1 = EN2 = VIN or GND, TJ = -40C to +125C Max 5.5 Unit V A 150 450 2 A A A A A A +1 +2 % % 0.505 0.510 V V %/V %/V %/mA %/mA 65 100 200 300 0.2 -1 -2 0.495 0.490 0.500 0.01 -0.05 +0.05 0.001 0.002 6 10 10 240 100 400 mV mV mV mV nA nA s s mA 155 15 C C 9 170 260 340 TSSD TSSD-HYS Typ 1.2 0.4 0.1 1 2.45 2.2 VOUT = 2.8 V Rev. C | Page 3 of 24 120 1000 140 V V A A V V mV s ADP222/ADP223/ADP224/ADP225 Parameter OUTPUT NOISE Symbol OUTNOISE POWER SUPPLY REJECTION RATIO PSRR Data Sheet Test Conditions/Comments 10 Hz to 100 kHz, VIN = 5 V, VOUT = 3.3 V 10 Hz to 100 kHz, VIN = 5 V, VOUT = 2.8 V 10 Hz to 100 kHz, VIN = 3.6 V, VOUT = 2.5 V 10 Hz to 100 kHz, VIN = 3.6 V, VOUT = 1.2 V VIN = 2.5 V, VOUT = 0.8 V, IOUT = 100 mA 100 Hz 1 kHz 10 kHz 100 kHz 1 MHz VIN = 3.8 V, VOUT = 2.8 V, IOUT = 100 mA 100 Hz 1 kHz 10 kHz 100 kHz 1 MHz Min Typ 56 50 45 27 Max Unit V rms V rms V rms V rms 76 76 70 60 40 dB dB dB dB dB 68 68 68 60 40 dB dB dB dB dB Accuracy when VOUTx is connected directly to ADJx or SENSEx. When the VOUTx voltage is set by external feedback resistors, the absolute accuracy in adjust mode depends on the tolerances of resistors used. 2 Based on an end-point calculation using 1 mA and 300 mA loads. 3 Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output voltages above 2.5 V. 4 Start-up time is defined as the time between the rising edge of EN to VOUT being at 90% of its nominal value. 5 Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.0 V output voltage is defined as the current that causes the output voltage to drop to 90% of 3.0 V or 2.7 V. 1 INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS The minimum input and output capacitance should be greater than 0.70 F over the full range of the operating conditions. The full range of the operating conditions in the application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended for use with the LDOs, but Y5V and Z5U capacitors are not recommended for use with the LDOs. Table 2. Parameter MINIMUM INPUT AND OUTPUT CAPACITANCE CAPACITOR ESR Symbol CMIN RESR Conditions TA = -40C to +125C TA = -40C to +125C Rev. C | Page 4 of 24 Min 0.70 0.001 Typ Max 1 Unit F Data Sheet ADP222/ADP223/ADP224/ADP225 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter VIN to GND ADJ1, ADJ2, VOUT1, VOUT2 to GND EN1, EN2 to GND Storage Temperature Range Operating Junction Temperature Range Soldering Conditions Rating -0.3 V to +6 V -0.3 V to VIN -0.3 V to +6 V -65C to +150C -40C to +125C JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in combination. The ADP222/ADP223/ADP224/ADP225 can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may have to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction-to-ambient thermal resistance of the package (JA). Maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the formula Junction-to-ambient thermal resistance (JA) of the package is based on modeling and calculation using a 4-layer board. JA is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The value of JA may vary, depending on PCB material, layout, and environmental conditions. The specified value of JA is based on a 4-layer, 4 in x 3 in, 21/2 oz copper board, as per JEDEC standards. For more information, see the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). JB is the junction-to-board thermal characterization parameter with units of C/W. JB of the package is based on modeling and calculation using a 4-layer board. The JESD51-12, Guidelines for Reporting and Using Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. JB measures the component power flowing through multiple thermal paths rather than a single path as in thermal resistance, JB. Therefore, JB thermal paths include convection from the top of the package as well as radiation from the package, factors that make JB more useful in real-world applications. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the formula TJ = TB + (PD x JB) Refer to JESD51-8 and JESD51-12 for more detailed information about JB. THERMAL RESISTANCE JA and JB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type 8-Lead 2 mm x 2 mm LFCSP TJ = TA + (PD x JA) ESD CAUTION Rev. C | Page 5 of 24 JA 50.2 JC 31.7 JB 18.2 Unit C/W ADP222/ADP223/ADP224/ADP225 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADP222/ ADP224 EN1 SENSE1 8 1 EN1 ADJ1 8 2 EN2 VOUT1 7 2 EN2 VOUT1 7 3 GND VIN 6 3 GND VIN 6 4 SENSE2 VOUT2 5 4 ADJ2 VOUT2 5 NOTES 1. CONNECT EXPOSED PAD TO GND. 09376-102 1 NOTES 1. CONNECT EXPOSED PAD TO GND. Figure 3. ADP222/ADP224 Pin Configuration 09376-002 ADP223/ ADP225 Figure 4. ADP223/ADP225 Pin Configuration Table 5. Pin Function Descriptions Pin No. ADP222/ADP224 ADP223/ADP225 1 1 Mnemonic EN1 2 2 EN2 3 N/A 1 3 4 GND ADJ2 4 5 N/A1 5 SENSE2 VOUT2 6 7 6 7 VIN VOUT1 N/A1 8 ADJ1 8 N/A1 SENSE1 EPAD 1 Description Enable Input for the Second Regulator. Drive EN1 high to turn on Regulator 1 and drive EN1 low to turn off Regulator 1. For automatic startup, connect EN1 to VIN. Enable Input for the First Regulator. Drive EN2 high to turn on Regulator 2 and drive EN2 low to turn off Regulator 2. For automatic startup, connect EN2 to VIN. Ground Pin. Adjust Pin for VOUT2. A resistor divider from VOUT2 to ADJ2 sets the output voltage. Sense Pin for VOUT2. Regulated Output Voltage. Connect an 1 F or greater output capacitor between VOUT2 and GND. Regulator Input Supply. Bypass VIN to GND with a 1 F or greater capacitor. Regulated Output Voltage. Connect 1 F or greater output capacitor between VOUT1 and GND. Adjust Pin for VOUT1. A resistor divider from VOUT1 to ADJ1 sets the output voltage. Sense Pin for VOUT1. The exposed paddle must be connected to ground. N/A means not applicable. Rev. C | Page 6 of 24 Data Sheet ADP222/ADP223/ADP224/ADP225 TYPICAL PERFORMANCE CHARACTERISTICS VIN = 5 V, VOUT1 = 3.3 V, VOUT2 = 2.8 V, IOUT1 = IOUT2 = 1 mA, CIN = COUT = 1 F, TA = 25C, unless otherwise noted. 1.220 3.40 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 3.38 3.36 1.210 1.205 3.32 VOUT (V) 3.30 3.28 1.200 1.195 LOAD = 10A LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 3.26 1.190 3.24 1.185 3.22 -5 25 85 125 JUNCTION TEMPERATURE (C) 1.180 -40 125 3.40 LOAD = 10A LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 3.38 3.36 3.34 VOUT (V) 2.81 2.80 3.32 3.30 2.79 3.28 2.78 3.26 2.77 3.24 2.76 3.22 2.75 -40 -5 25 85 125 JUNCTION TEMPERATURE (C) 3.20 0.01 09376-106 VOUT (V) 2.82 85 Figure 8. Output Voltage vs. Junction Temperature, VOUTx = 1.2 V, ADP222/ADP224 2.85 2.83 25 JUNCTION TEMPERATURE (C) Figure 5. Output Voltage vs. Junction Temperature, VOUTx = 3.3 V, ADP222/ADP224 2.84 -5 09376-108 -40 09376-105 3.20 Figure 6. Output Voltage vs. Junction Temperature, VOUTx = 2.8 V, ADP222/ADP224 0.1 1 10 100 1000 ILOAD (mA) 09376-109 VOUT (V) 3.34 1.215 Figure 9. Output Voltage vs. Load Current, VOUTx = 3.3 V, ADP222/ADP224 2.85 1.820 2.84 1.815 2.83 1.810 2.82 VOUT (V) 1.800 2.81 2.80 2.79 1.795 LOAD = 10A LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 1.785 2.78 2.77 2.76 1.780 -40 -5 25 85 125 JUNCTION TEMPERATURE (C) Figure 7. Output Voltage vs. Junction Temperature, VOUTx = 1.8 V, ADP222/ADP224 2.75 0.01 09376-107 1.790 0.1 1 10 ILOAD (mA) 100 1000 09376-110 VOUT (V) 1.805 Figure 10. Output Voltage vs. Load Current, VOUTx = 2.8 V, ADP222/ADP224 Rev. C | Page 7 of 24 ADP222/ADP223/ADP224/ADP225 Data Sheet 1.820 2.85 2.84 1.815 2.83 1.810 2.82 VOUT (V) 1.800 2.81 2.80 2.79 2.78 1.790 2.77 1.785 2.76 0.1 1 10 100 1000 ILOAD (mA) Figure 11. Output Voltage vs. Load Current, VOUTx = 1.8 V, ADP222/ADP224 1.215 1.815 1.210 1.810 1.205 1.805 VOUT (V) 1.820 1.795 1.190 1.790 1.185 1.785 0.1 1 10 100 1000 ILOAD (mA) Figure 12. Output Voltage vs. Load Current, VOUTx = 1.2 V, ADP222/ADP224 4.3 4.5 4.7 4.9 5.1 5.3 5.5 1.800 1.195 1.180 0.01 4.1 Figure 14. Output Voltage vs. Input Voltage, VOUTx = 2.8 V, ADP222/ADP224 1.220 1.200 3.9 VIN (V) 1.780 2.30 09376-112 VOUT (V) 2.75 3.7 09376-111 1.780 0.01 LOAD = 10A LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 09376-114 1.795 LOAD = 10A LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50 VIN (V) 09376-115 VOUT (V) 1.805 Figure 15. Output Voltage vs. Input Voltage, VOUTx = 1.8 V, ADP222/ADP224 3.40 1.220 3.38 1.215 3.36 1.210 1.205 3.32 VOUT (V) 3.30 3.28 3.24 3.22 3.20 3.7 1.195 LOAD = 10A LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 3.9 4.1 4.3 1.190 1.185 4.5 4.7 VIN (V) 4.9 5.1 5.3 5.5 1.180 2.30 09376-113 3.26 1.200 Figure 13. Output Voltage vs. Input Voltage, VOUTx = 3.3 V, ADP222/ADP224 LOAD = 10A LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 2.70 3.10 3.50 3.90 VIN (V) 4.30 4.70 5.10 5.50 09376-116 VOUT (V) 3.34 Figure 16. Output Voltage vs. Input Voltage, VOUTx = 1.2 V, ADP222/ADP224 Rev. C | Page 8 of 24 Data Sheet ADP222/ADP223/ADP224/ADP225 140 250 120 GROUND CURRENT (A) 80 60 LOAD = 10A LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 20 -40 -5 25 85 50 0 0.01 09376-117 0 125 JUNCTION TEMPERATURE (C) 1 10 100 1000 Figure 20. Ground Current vs. Load Current, Dual Output, ADP222/ADP224 300 140 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 120 GROUND CURRENT (A) GROUND CURRENT (A) 0.1 ILOAD (mA) Figure 17. Ground Current vs. Junction Temperature, Single Output, ADP222/ADP224 250 100 09376-120 40 150 200 150 100 50 100 80 60 40 20 -40 -5 25 85 0 2.30 09376-118 0 125 JUNCTION TEMPERATURE (C) LOAD = 10A LOAD = 100A LOAD = 1mA 2.70 3.10 3.50 LOAD = 10mA LOAD = 100mA LOAD = 300mA 3.90 4.30 4.70 5.10 5.50 VIN (V) 09376-121 GROUND CURRENT (A) 200 100 Figure 21. Ground Current vs. Input Voltage, VOUTx = 1.2 V, ADP222/ADP224 Figure 18. Ground Current vs. Junction Temperature, Dual Output, ADP222/ADP224 140 250 120 GROUND CURRENT (A) GROUND CURRENT (A) 200 100 80 60 40 150 100 50 0.1 1 10 ILOAD (mA) 100 1000 0 2.30 09376-119 0 0.01 2.70 3.10 3.50 3.90 VIN (V) Figure 19. Ground Current vs. Load Current, Single Output, ADP222/ADP224 Rev. C | Page 9 of 24 LOAD = 10mA LOAD = 100mA LOAD = 300mA 4.30 4.70 5.10 5.50 09376-122 LOAD = 10A LOAD = 100A LOAD = 1mA 20 Figure 22. Ground Current vs. Input Voltage, VOUTx = 1.2 V and 1.8 V, ADP222/ADP224 ADP222/ADP223/ADP224/ADP225 Data Sheet 1.220 3.40 3.38 1.215 3.36 1.210 1.205 3.32 VOUT (V) VOUT (V) 3.34 3.30 3.28 1.200 1.195 3.26 1.185 1.180 -40 -5 25 85 09376-003 3.20 125 JUNCTION TEMPERATURE (C) -5 25 85 125 JUNCTION TEMPERATURE (C) Figure 26. Output Voltage vs. Junction Temperature, VOUTx = 1.2 V, ADP223/ADP225 Figure 23. Output Voltage vs. Junction Temperature, VOUTx = 3.3 V, ADP223/ADP225 2.85 3.40 2.84 3.38 2.83 3.36 2.82 3.34 2.81 3.32 VOUT (V) 2.80 3.30 3.28 2.79 3.26 2.78 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 2.76 2.75 -40 -5 25 85 125 JUNCTION TEMPERATURE (C) 3.24 3.22 3.20 0.1 09376-004 2.77 1 10 100 1000 ILOAD (mA) Figure 24. Output Voltage vs. Junction Temperature, VOUTx = 2.8 V, ADP223/ADP225 09376-007 VOUT (V) -40 09376-006 3.22 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 1.190 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 3.24 Figure 27. Output Voltage vs. Load Current, VOUTx = 3.3 V, ADP223/ADP225 1.820 2.85 1.815 2.84 2.83 1.810 2.82 VOUT (V) VOUT (V) 1.805 1.800 2.81 2.80 2.79 1.795 2.78 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 1.780 -40 -5 25 85 125 JUNCTION TEMPERATURE (C) Figure 25. Output Voltage vs. Junction Temperature, VOUTx = 1.8 V, ADP223/ADP225 2.77 2.76 2.75 0.01 09376-005 1.785 0.1 1 10 ILOAD (mA) 100 1000 09376-008 1.790 Figure 28. Output Voltage vs. Load Current, VOUTx = 2.8 V, ADP223/ADP225 Rev. C | Page 10 of 24 Data Sheet ADP222/ADP223/ADP224/ADP225 2.85 1.820 2.84 1.815 2.83 1.810 2.82 VOUT (V) VOUT (V) 1.805 1.800 1.795 2.81 2.80 2.79 2.78 1.790 1.785 2.76 10 100 1000 ILOAD (mA) Figure 29. Output Voltage vs. Load Current, VOUTx = 1.8 V, ADP223/ADP225 1.215 1.815 1.210 1.810 1.205 1.805 VOUT (V) 1.820 1.795 1.190 1.790 1.185 1.785 1 10 100 1000 ILOAD (mA) Figure 30. Output Voltage vs. Load Current, VOUTx = 1.2 V, ADP223/ADP225 4.10 4.30 4.70 4.90 5.10 5.30 5.50 1.800 1.195 1.180 0.1 3.90 Figure 32. Output Voltage vs. Input Voltage, VOUTx = 2.8 V, ADP223/ADP225 1.220 1.200 3.70 VIN (V) 1.780 2.30 09376-010 VOUT (V) 2.75 3.50 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50 VIN (V) 09376-013 1 09376-009 1.780 0.1 09376-012 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 200mA LOAD = 300mA 2.77 Figure 33. Output Voltage vs. Input Voltage, VOUTx = 1.8 V, ADP223/ADP225 1.220 3.40 3.38 1.215 3.36 1.210 1.205 3.32 VOUT (V) VOUT (V) 3.34 3.30 3.28 1.200 1.195 3.26 4.10 4.30 4.70 VIN (V) 4.90 5.10 5.30 5.50 1.180 2.30 Figure 31. Output Voltage vs. Input Voltage, VOUTx = 3.3 V, ADP223/ADP225 2.70 3.10 3.50 3.90 VIN (V) 4.30 4.70 5.10 5.50 09376-014 3.90 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 1.185 09376-011 3.22 3.20 3.70 1.190 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 3.24 Figure 34. Output Voltage vs. Input Voltage, VOUTx = 1.2 V, ADP223/ADP225 Rev. C | Page 11 of 24 ADP222/ADP223/ADP224/ADP225 Data Sheet 300 500 450 GROUND CURRENT (A) 400 200 150 100 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 0 -40 -5 25 85 125 JUNCTION TEMPERATURE (C) 350 300 250 200 150 100 50 0 0.01 0.1 1 10 100 1000 ILOAD (mA) Figure 35. Ground Current vs. Junction Temperature, Single Output, Includes 100 A for Output Divider, ADP223/ADP225 09376-018 50 09376-015 GROUND CURRENT (uA) 250 Figure 38. Ground Current vs. Load Current, Dual Output, Includes 200 A for Output Dividers, ADP223/ADP225 500 250 450 300 250 200 150 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 100 50 0 -40 -5 25 85 125 JUNCTION TEMPERATURE (C) 150 100 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 50 0 2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VIN (V) Figure 36. Ground Current vs. Junction Temperature, Dual Output, Includes 200 A for Output Dividers, ADP223/ADP225 09376-019 GROUND CURRENT (A) 200 350 09376-016 GROUND CURRENT (A) 400 Figure 39. Ground Current vs. Input Voltage, VOUTx = 1.2 V, Single Output, Includes 100 A for Output Divider, ADP223/ADP225 250 450 400 150 100 300 250 200 150 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 200mA LOAD = 300mA 100 50 50 0 0.01 0.1 1 10 100 1000 ILOAD (mA) Figure 37. Ground Current vs. Load Current, Single Output, Includes 100 A for Output Divider, ADP223/ADP225 0 2.3 2.7 3.1 3.5 3.9 VIN (V) 4.3 4.7 5.1 5.5 09376-020 GROUND CURRENT (A) 350 09376-017 GROUND CURRENT (A) 200 Figure 40. Ground Current vs. Input Voltage, VOUTx = 1.2 V and 1.8 V, Dual Output, Includes 200 A for Output Dividers, ADP223/ADP225 Rev. C | Page 12 of 24 Data Sheet ADP222/ADP223/ADP224/ADP225 140 2.90 2.85 120 100 2.75 VOUT (V) 80 60 2.70 2.65 2.60 2.55 LOAD = 1mA LOAD = 5mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 2.50 20 2.45 1 10 100 1000 ILOAD (mA) 2.40 2.6 09376-021 0 2.8 2.9 3.0 3.1 VIN (V) Figure 44. Output Voltage vs. Input Voltage in Dropout, VOUTx = 2.8 V Figure 41. Dropout Voltage vs. Load Current, VOUT = 3.3 V 450 160 400 140 350 120 GROUND CURRENT (A) DROPOUT VOLTAGE (mV) 2.7 09376-024 40 100 80 60 40 300 250 200 150 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 100 20 50 1 10 100 1000 ILOAD (mA) 0 3.1 09376-022 0 3.2 3.4 3.3 3.5 3.6 VIN (V) 09376-025 DROPOUT VOLTAGE (mV) 2.80 Figure 45. Ground Current vs. Input Voltage in Dropout, VOUTx = 3.3 V Figure 42. Dropout Voltage vs. Load Current, VOUT = 2.8 V 3.40 400 3.35 350 VOUT (V) 3.25 3.20 3.15 3.10 3.05 LOAD = 1mA LOAD = 5mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 2.95 2.90 3.1 3.2 3.3 3.4 VIN (V) 3.5 250 200 150 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 50mA LOAD = 100mA LOAD = 300mA 100 50 3.6 0 2.6 09376-023 3.00 300 Figure 43. Output Voltage vs. Input Voltage in Dropout, VOUTx = 3.3 V 2.7 2.9 2.8 VIN (V) 3.0 3.1 09376-026 GROUND CURRENT (uA) 3.30 Figure 46. Ground Current vs. Input Voltage in Dropout, VOUTx = 2.8 V Rev. C | Page 13 of 24 ADP222/ADP223/ADP224/ADP225 -30 -40 -40 -50 -60 -50 -60 -70 -70 -80 -80 -90 -90 -100 -100 10 10 100 1k 10k 100k 1M 10M FREQUENCY (Hz) 0 -40 PSRR (dB) -30 -40 -50 -60 -70 -80 -90 -90 10k 100k 1M 10M FREQUENCY (Hz) -100 10 -40 -40 PSRR (dB) -30 -50 -60 -70 -80 -90 -90 10k 100k 1M FREQUENCY (Hz) 100k 1M 10M 10M Figure 49. Power Supply Rejection Ratio vs. Frequency, VIN = 2.8 V, VOUTx = 1.8 V LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA -60 -80 1k 10k -50 -70 100 1k 0 VRIPPLE = 50mV -10 VIN = 3.3V VOUT = 2.8V COUT = 1F -20 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA -30 -100 10 100 Figure 51. Power Supply Rejection Ratio vs. Frequency, VIN = 3.8 V, VOUTx = 3.3 V 09376-029 PSRR (dB) VRIPPLE = 50mV -10 VIN = 2.8V VOUT = 1.8V COUT = 1F -20 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA FREQUENCY (Hz) Figure 48. Power Supply Rejection Ratio vs. Frequency, VIN = 3.8 V, VOUTx = 2.8 V 0 10M -60 -80 1k 1M -50 -70 100 100k VRIPPLE = 50mV -10 VIN = 3.8V VOUT = 3.3V COUT = 1F -20 -30 -100 10 10k 0 09376-028 PSRR (dB) -20 1k Figure 50. Power Supply Rejection Ratio vs. Frequency, VIN = 2.5 V, VOUTx = 1.2 V LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA VRIPPLE = 50mV VIN = 3.8V VOUT = 2.8V COUT = 1F 100 FREQUENCY (Hz) Figure 47. Power Supply Rejection Ratio vs. Frequency, VIN = 4.3, V VOUTx = 3.3 V -10 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 09376-030 PSRR (dB) -30 09376-027 PSRR (dB) -20 VRIPPLE = 50mV -10 VIN = 2.5V VOUT = 1.2V COUT = 1F -20 09376-031 -10 0 LOAD = 100A LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA VRIPPLE = 50mV VIN = 4.3V VOUT = 3.3V COUT = 1F -100 10 100 1k 10k 100k 1M FREQUENCY (Hz) Figure 52. Power Supply Rejection Ratio vs. Frequency, VIN = 3.3 V, VOUTx = 2.8 V Rev. C | Page 14 of 24 10M 09376-032 0 Data Sheet Data Sheet ADP222/ADP223/ADP224/ADP225 0 -10 -20 VRIPPLE = 50mV VIN = 2.5V VOUT = 1.8V COUT = 1F VIN PSRR (dB) -30 -40 VOUT1 2 -50 -60 VOUT2 -70 3 -80 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 100 1k 10k 100k 1M 10M FREQUENCY (Hz) CH1 1V CH3 10mV B W VIN VOUT2 1 B W B W M1s A CH4 T 10.40% 200mV 09376-034 1 CH2 10mV 200mV VOUT2 3 W M1s A CH4 T 9.8% VOUT1 2 3 B W VIN VOUT1 CH1 1V CH3 10mV B W Figure 56. Transient Line Response, VOUTx = 3.3 V and 2.8 V, VIN = 4 V to 5 V, ILOAD = 300 mA Figure 53. Power Supply Rejection Ratio vs. Frequency, VIN = 2.5 V, VOUTx = 1.8 V 2 CH2 10mV B 09376-036 10 CH1 1V CH3 10mV Figure 54. Transient Line Response, VOUTx = 3.3 V and 2.8 V, VIN = 4 V to 5 V, ILOAD = 10 mA B W CH2 10mV B W B W M1s A CH4 T 10.00% 200mV 09376-037 -100 1 09376-033 -90 Figure 57. Transient Line Response, VOUTx = 1.2 V and 1.8 V, VIN = 4 V to 5 V, ILOAD = 300 mA LOAD CURRENT ON VOUT1 VIN 1 VOUT1 2 2 VOUT1 VOUT2 3 VOUT2 1 B W B W CH2 10mV B W M4s A CH4 T 9.8% 200mV CH1 200mA CH3 10mV Figure 55. Transient Line Response, VOUTx = 1.2 V and 1.8 V, VIN = 4 V to 5 V, ILOAD = 10 mA B W B W CH2 50mV B W M10s A CH1 T 10.20% 200mA 09376-038 CH1 1V CH3 10mV 09376-035 3 Figure 58. Transient Load Response, VOUTx = 3.3 V, ILOAD = 1 mA to 300 mA; VOUTx = 2.8 V, ILOAD = 1 mA Rev. C | Page 15 of 24 ADP222/ADP223/ADP224/ADP225 Data Sheet 10 1 2 VOUT1 VOUT2 3 B W CH2 50mV B W B W M10s A CH1 T 10.20% 200mA 60 40 30 20 1.2V 1.8V 2.8V 3.3V 0.1 1 10 100 1000 ILOAD (mA) 09376-040 NOISE (V rms) 50 0.01 100 1k 10k 100k Figure 61. Output Noise Spectral Density, VIN = 5 V, ILOAD = 10 mA, COUT = 1 F 70 0 0.001 0.1 FREQUENCY (Hz) Figure 59. Transient Load Response, VOUTx = 1.2 V, ILOAD = 1 mA to 300 mA; VOUTx = 1.8 V, ILOAD = 1 mA 10 1 0.01 10 09376-039 CH1 200mA CH3 10.0mV 1.2V 1.8V 2.8V 3.3V 09376-041 NOISE SPECTRAL DENSITY (V/Hz) LOAD CURRENT ON VOUT1 Figure 60. RMS Output Noise vs. Load Current and Output Voltage, VIN = 5 V, COUT = 1 F Rev. C | Page 16 of 24 Data Sheet ADP222/ADP223/ADP224/ADP225 THEORY OF OPERATION controlled by the error amplifier. The error amplifier compares the reference voltage with the feedback voltage from the output and amplifies the difference. If the feedback voltage is lower than the reference voltage, the gate of the PMOS device is pulled lower, allowing more current to flow and increasing the output voltage. If the feedback voltage is higher than the reference voltage, the gate of the PMOS device is pulled higher, allowing less current to flow and decreasing the output voltage. The ADP222/ADP223/ADP224/ADP225 are low quiescent current, fixed and adjustable dual output, low dropout linear regulators that operate from 2.5 V to 5.5 V and provide up to 300 mA of current from each output. Drawing a low 300 A quiescent current (typical) at full load make the ADP222/ ADP223/ADP224/ADP225 ideal for battery-operated portable equipment. Shutdown current consumption is typically 200 nA. Optimized for use with small 1 F ceramic capacitors, the ADP222/ADP223/ADP224/ADP225 provide excellent transient performance. VIN = 4.2V + C1 1F OFF ADP223/ADP225 R1 1 EN1 VIN VOUT1 THERMAL SHUTDOWN R2 ON OFF 2 EN2 140 CURRENT LIMIT ON EN2 VOUT2 = 2.0V VOUT1 7 3 GND 4 ADJ2 EN1 ADJ1 8 ADP223/ ADP225 + C2 1F VIN 6 VOUT2 5 VOUT1 = 2.8V R3 CONTROL LOGIC AND ENABLE REFERENCE ADP225 ONLY R4 + C3 1F 09376-064 ADJ1 Figure 64. Typical Application Circuit for Setting Output Voltages, ADP223/ADP225 CURRENT LIMIT 140 GND 09376-062 VOUT2 ADJ2 The ADP223/ADP225 are exactly the same as the ADP222/ ADP224 except that the output voltage dividers are internally disconnected and the feedback input of the error amplifiers is brought out for each output. The output voltages can be set according to the following equations: VOUT1 = 0.50 V(1 + R1/R2) Figure 62. Internal Block Diagram, ADP223/ADP225 SENSE1 VOUT2 = 0.50 V(1 + R3/R4) ADP222/ADP224 VIN THERMAL SHUTDOWN EN1 EN2 The value of R1 and R3 should be less than 200 k to minimize errors in the output voltage caused by the ADJx pin input current. For example, when R1 and R2 each equal 200 k, the output voltage is 1.0 V. The output voltage error introduced by the ADJx pin input current is 2 mV or 0.20%, assuming a typical ADJx pin input current of 10 nA at 25C. VOUT1 CONTROL LOGIC AND ENABLE 140 CURRENT LIMIT REFERENCE The output voltage of the ADP223/ADP225 may be set from 0.5 V to 5.0 V. ADP224 ONLY The ADP222/ADP224 are available in multiple output voltage options ranging from 0.8 V to 3.3 V. CURRENT LIMIT The ADP224/ADP225 are identical to the ADP222/ADP223 with the addition of a quick output discharge (QOD) feature. This allows the output voltage to start up from a known state. 140 GND 09376-063 VOUT2 SENSE2 Figure 63. Internal Block Diagram, ADP222/ADP224 Internally, the ADP222/ADP223/ADP224/ADP225 consist of a reference, two error amplifiers, and two PMOS pass transistors. Output current is delivered via the PMOS pass device, which is The ADP222/ADP223/ADP224/ADP225 use the EN1/EN2 pins to enable and disable the VOUT1/VOUT2 pins under normal operating conditions. When EN1/EN2 are high, VOUT1/VOUT2 turn on; when EN1/EN2 are low, VOUT1/VOUT2 turn off. For automatic startup, EN1/EN2 can be tied to VIN. Rev. C | Page 17 of 24 ADP222/ADP223/ADP224/ADP225 Data Sheet APPLICATIONS INFORMATION Output Capacitor The ADP222/ADP223/ADP224/ADP225 are designed for operation with small, space-saving ceramic capacitors but function with most commonly used capacitors as long as care is taken with regard to the effective series resistance (ESR) value. The ESR of the output capacitor affects the stability of the LDO control loop. A minimum of 0.7 F capacitance with an ESR of 1 or less is recommended to ensure the stability of the ADP222/ ADP223/ADP224/ADP225. Transient response to changes in load current is also affected by output capacitance. Using a larger value of output capacitance improves the transient response of the ADP222/ADP223/ADP224/ADP225 to large changes in load current. Figure 65 shows the transient responses for an output capacitance value of 1 F. Figure 66 depicts the capacitance vs. voltage bias characteristic of an 0402, 1 F, 10 V, X5R capacitor. The voltage stability of a capacitor is strongly influenced by the capacitor size and voltage rating. In general, a capacitor in a larger package or higher voltage rating exhibits better stability. The temperature variation of the X5R dielectric is ~15% over the -40C to +85C temperature range and is not a function of package or voltage rating. 1.2 1.0 CAPACITANCE (F) CAPACITOR SELECTION LOAD CURRENT ON VOUT1 0.8 0.6 0.4 0.2 0 0 2 4 6 8 VOLTAGE (V) 2 Figure 66. Capacitance vs. Voltage Bias Characteristic VOUT1 Use Equation 1 to determine the worst-case capacitance accounting for capacitor variation over temperature, component tolerance, and voltage. VOUT2 CEFF = CBIAS x (1 - TEMPCO) x (1 - TOL) 3 B W M10s A CH1 T 10.20% 200mA (1) where: CBIAS is the effective capacitance at the operating voltage. TEMPCO is the worst-case capacitor temperature coefficient. TOL is the worst-case component tolerance. 09376-043 CH1 200mA BW CH2 50mV B CH3 10mV W 10 09376-044 1 Figure 65. Output Transient Response, COUT = 1 F Input Bypass Capacitor Connecting a 1 F capacitor from VIN to GND reduces the circuit sensitivity to the printed circuit board (PCB) layout, especially when long input traces or high source impedance are encountered. If greater than 1 F of output capacitance is required, the input capacitor should be increased to match it. In this example, the worst-case temperature coefficient (TEMPCO) over -40C to +85C is assumed to be 15% for an X5R dielectric. The tolerance of the capacitor (TOL) is assumed to be 10%, and CBIAS is 0.94 F at 1.8 V, as shown in Figure 66. Substituting these values in Equation 1 yields CEFF = 0.94 F x (1 - 0.15) x (1 - 0.1) = 0.719 F Input and Output Capacitor Properties Any good quality ceramic capacitors can be used with the ADP222/ADP223/ADP224/ADP225, as long as they meet the minimum capacitance and maximum ESR requirements. Ceramic capacitors are manufactured with a variety of dielectrics, each with different behavior over temperature and applied voltage. Capacitors must have a dielectric adequate to ensure the minimum capacitance over the necessary temperature range and dc bias conditions. X5R or X7R dielectrics with a voltage rating of 6.3 V or 10 V are recommended, but Y5V and Z5U dielectrics are not recommended, due to their poor temperature and dc bias characteristics. Therefore, the capacitor chosen in this example meets the minimum capacitance requirement of the LDO over temperature and tolerance at the chosen output voltage. To guarantee the performance of the ADP222/ADP223/ ADP224/ADP225, it is imperative that the effects of dc bias, temperature, and tolerances on the behavior of the capacitors be evaluated for each application. Rev. C | Page 18 of 24 Data Sheet ADP222/ADP223/ADP224/ADP225 3.5 1.4 VIN = 5.5V OUTPUT VOLTAGE (V) 1.2 3.0 OUTPUT VOLTAGE (V) The ADP222/ADP223/ADP224/ADP225 use the ENx pins to enable and disable the VOUTx pins under normal operating conditions. Figure 67 shows a rising voltage on ENx crossing the active threshold, where VOUTx turns on. When a falling voltage on ENx crosses the inactive threshold, VOUTx turns off. ENx 3.3V 2.8V 1.8V 1.2V 2.5 2.0 1.5 1.0 1.0 0.5 0.8 0 0 100 200 300 400 500 600 800 900 1000 Figure 69. Typical Start-Up Time 0.4 PARALLELING OUTPUTS TO INCREASE OUTPUT CURRENT 0 0.5 0.6 0.7 0.8 0.9 1.0 1.1 09376-045 0.2 1.2 ENABLE VOLTAGE (V) Figure 67. Typical ENx Pin Operation, VIN = 5.5 V As shown in Figure 67, the ENx pins have built-in hysteresis. This prevents on/off oscillations that can occur due to noise on the ENx pins as it passes through the threshold points. The active/inactive thresholds of the ENx pins are derived from the VIN voltage. Therefore, these thresholds vary with changing input voltage. Figure 68 shows typical ENx active/inactive thresholds when the input voltage varies from 2.5 V to 5.5 V. 1.2 The ADP223/ADP225 use a single band gap to generate the reference voltage for each LDO. The reference voltages are trimmed to plus or minus a couple of millivolts of each other. This allows paralleling of the LDOs to increase the output current to 600 mA. The adjust pins of each LDO are tied together and a single output voltage divider sets the output voltage. Even though the output voltage of each LDO is slightly different, at high load currents, the resistance of the package and the board layout absorbs the difference. Figure 70 shows the schematic of a typical application where the LDO outputs are paralleled. VIN = 3.3V ENx FALL ENx RISE + C1 1F R2 1.0 R1 1 EN1 ADJ1 8 2 EN2 VOUT1 7 3 GND VIN 6 4 ADJ2 VOUT2 5 0.8 OFF ON 0.6 + C2 1F 0.4 VOUT2 = 2.8V 09376-053 ENABLE THRESHOLDS (V) 700 TIME (s) 0.6 09376-047 ENABLE FEATURE 0.2 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VIN (V) Figure 70. Paralleling Outputs for Higher Output Current 09376-046 0 2.3 QUICK OUTPUT DISCHARGE (QOD) FUNCTION Figure 68. Typical Enable Thresholds vs. Input Voltage The ADP222/ADP223/ADP224/ADP225 use an internal soft start to limit the inrush current when the output is enabled. The start-up time for the 2.8 V option is approximately 240 s from the time the ENx active threshold is crossed to when the output reaches 90% of its final value. The start-up time is somewhat dependent on the output voltage setting and increases slightly as the output voltage increases. The ADP224/ADP225 include an output discharge resistor to force the voltage on each output to zero when the respective LDO is disabled. This ensures that the outputs of the LDOs are always in a well-defined state, regardless if it is enabled or not. The ADP222/ADP223 do not include the output discharge function. Figure 71 compares the turn-off time of a 3.3 V output LDO with and without the QOD function. Both LDOs have a 1 k resistor connected to each output. The LDO with the QOD function discharges the output to 0 V in less than 1 ms, whereas the 1 k load takes over 5 ms to do the same. Rev. C | Page 19 of 24 ADP222/ADP223/ADP224/ADP225 Data Sheet THERMAL CONSIDERATIONS 4.0 In most applications, the ADP222/ADP223/ADP224/ADP225 do not dissipate much heat due to its high efficiency. However, in applications with high ambient temperature, and high supply voltage to output voltage differential, the heat dissipated in the package is large enough that it can cause the junction temperature of the die to exceed the maximum junction temperature of 125C. 3.5 ENABLE VOUT, NO QOD VOUT, WITH QOD VOLTS (V) 3.0 2.5 2.0 1.5 1.0 0 0 2000 4000 6000 8000 10000 TIME (s) 09376-169 0.5 Figure 71. Typical Turn-Off Time with and Without QOD Function CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION The ADP222/ADP223/ADP224/ADP225 are protected against damage due to excessive power dissipation by current and thermal overload protection circuits. The ADP222/ADP223/ ADP224/ADP225 are designed to current limit when the output load reaches 300 mA (typical). When the output load exceeds 300 mA, the output voltage is reduced to maintain a constant current limit. Thermal overload protection is included, which limits the junction temperature to a maximum of 155C (typical). Under extreme conditions (that is, high ambient temperature and power dissipation) when the junction temperature starts to rise above 155C, the output is turned off, reducing the output current to 0. When the junction temperature drops below 140C, the output is turned on again, and output current is restored to its nominal value. Consider the case where a hard short from VOUTx to ground occurs. At first, the ADP222/ADP223/ADP224/ADP225 current limits, so that only 300 mA is conducted into the short. If self-heating of the junction is great enough to cause its temperature to rise above 155C, thermal shutdown activates, turning off the output and reducing the output current to 0 mA. As the junction temperature cools and drops below 135C, the output turns on and conducts 300 mA into the short, again causing the junction temperature to rise above 155C. This thermal oscillation between 140C and 155C causes a current oscillation between 300 mA and 0 mA that continues as long as the short remains at the output. When the junction temperature exceeds 155C, the converter enters thermal shutdown. It recovers only after the junction temperature has decreased below 140C to prevent any permanent damage. Therefore, thermal analysis for the chosen application is very important to guarantee reliable performance over all conditions. The junction temperature of the die is the sum of the ambient temperature of the environment and the temperature rise of the package due to the power dissipation, as shown in Equation 2. To guarantee reliable operation, the junction temperature of the ADP222/ADP223/ADP224/ADP225 must not exceed 125C. To ensure that the junction temperature stays below this maximum value, the user must be aware of the parameters that contribute to junction temperature changes. These parameters include ambient temperature, power dissipation in the power device, and thermal resistances between the junction and ambient air (JA). The JA number is dependent on the package assembly compounds that are used and the amount of copper used to solder the package GND pin to the PCB. Table 6 shows typical JA values of the 8-lead LFCSP package for various PCB copper sizes, and Table 7 shows the typical JB value of the 8-lead LFCSP. Table 6. Typical JA Values Copper Size (mm2) 251 100 500 1000 6400 1 JA (C/W) 175.1 135.6 77.3 65.2 51 Device soldered to minimum size pin traces. Table 7. Typical JB Value Model 8-Lead LFCSP Current and thermal limit protections are intended to protect the device against accidental overload conditions. For reliable operation, device power dissipation must be externally limited so that junction temperatures do not exceed 125C. Rev. C | Page 20 of 24 JB (C/W) 18.2 Data Sheet ADP222/ADP223/ADP224/ADP225 where: TA is the ambient temperature. PD is the power dissipation in the die, given by PD = [(VIN - VOUT) x ILOAD] + (VIN x IGND) where: ILOAD is the load current. IGND is the ground current. VIN and VOUT are input and output voltages, respectively. 80 60 6400mm 2 1000mm 2 500mm 2 100mm 2 25mm 2 JEDEC TJ MAX 40 20 0 Power dissipation due to ground current is quite small and can be ignored. Therefore, the junction temperature equation simplifies to the following: As shown in the simplified equation, for a given ambient temperature, input- to-output voltage differential, and continuous load current, there exists a minimum copper size requirement for the PCB to ensure that the junction temperature does not rise above 125C. Figure 72 to Figure 75 show junction temperature calculations for different ambient temperatures, power dissipation, and areas of PCB copper. 140 0 0.2 0.4 0.6 0.8 1.0 1.2 TOTAL POWER DISSIPATION (W) Figure 73. 8-Lead LFCSP, TA = 50C 140 JUNCTION TEMPERATURE TJ (C) TJ = TA + {[(VIN - VOUT) x ILOAD] x JA} 120 100 80 60 6400mm 2 1000mm 2 500mm 2 100mm 2 25mm 2 JEDEC TJ MAX 40 20 120 0 0 0.2 0.4 0.6 0.8 1.0 1.2 TOTAL POWER DISSIPATION (W) 100 Figure 74. 8-Lead LFCSP, TA = 85C 80 140 20 0 0 0.2 0.4 0.6 0.8 TOTAL POWER DISSIPATION (W) Figure 72. 8-Lead LFCSP, TA = 25C 1.0 1.2 120 100 80 60 40 TB = 25C TB = 50C TB = 85C TJ MAX 20 0 0 1 2 3 4 5 TOTAL POWER DISSIPATION (W) 6 7 09376-051 6400mm 2 1000mm 2 500mm 2 100mm 2 25mm 2 JEDEC TJ MAX 40 JUNCTION TEMPERATURE TJ (C) 60 09376-048 JUNCTION TEMPERATURE TJ (C) 100 09376-049 (2) 120 09376-050 TJ = TA + (PD x JA) JUNCTION TEMPERATURE TJ (C) 140 The junction temperature of the ADP222/ADP223/ADP224/ ADP225 can be calculated by Figure 75. 8-Lead LFCSP, TA = 85C In the case where the board temperature is known, use the thermal characterization parameter, JB, to estimate the junction temperature rise (see Figure 75). Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the following formula: TJ = TB + (PD x JB) (3) The typical value of JB is 18.2C/W for the 8-lead LFCSP package. Rev. C | Page 21 of 24 ADP222/ADP223/ADP224/ADP225 Data Sheet PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS GND Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP222/ADP223/ADP224/ADP225. However, as listed in Table 6, a point of diminishing returns is eventually reached beyond which an increase in the copper size does not yield significant heat dissipation benefits. TB5 J1 R1 R2 EN1 TB2 VOUT1 TB1 VIN R4 TB4 TB6 VOUT2 C1 J2 C3 R3 ADP223 - ________ - EVALZ ANALOG DEVICES TB7 GND Figure 76. Example 8-Lead LFCSP PCB Layout Rev. C | Page 22 of 24 09376-052 EN2 Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitor as close as possible to the VOUTx and GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where area is limited. C2 U1 TB3 Data Sheet ADP222/ADP223/ADP224/ADP225 OUTLINE DIMENSIONS 1.70 1.60 1.50 2.00 BSC SQ 0.50 BSC 8 5 PIN 1 INDEX AREA 1.10 1.00 0.90 EXPOSED PAD 0.425 0.350 0.275 4 TOP VIEW 07-11-2011-B 0.30 0.25 0.20 PIN 1 INDICATOR (R 0.15) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.05 MAX 0.02 NOM SEATING PLANE 1 BOTTOM VIEW 0.60 0.55 0.50 0.175 REF 0.20 REF Figure 77. 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 2.00 mm x 2.00 mm Body, Ultra Thin, Dual Lead (CP-8-10) Dimensions shown in millimeters ORDERING GUIDE Model1 ADP222ACPZ-1218-R7 Temperature Range -40C to +125C Output Voltage (V) VOUT1 VOUT2 1.2 1.8 ADP222ACPZ-1228-R7 -40C to +125C 1.2 2.8 ADP222ACPZ-1233-R7 -40C to +125C 1.2 3.3 ADP222ACPZ-1528-R7 -40C to +125C 1.5 2.8 ADP222ACPZ-1533-R7 -40C to +125C 1.5 3.3 ADP222ACPZ-1815-R7 -40C to +125C 1.8 1.5 ADP222ACPZ-1825-R7 -40C to +125C 1.8 2.5 ADP222ACPZ-1827-R7 -40C to +125C 1.8 2.7 ADP222ACPZ-1833-R7 -40C to +125C 1.8 3.3 ADP222ACPZ-2725-R7 -40C to +125C 2.7 2.5 ADP222ACPZ-2818-R7 -40C to +125C 2.8 1.8 ADP222ACPZ-2827-R7 -40C to +125C 2.8 2.7 ADP222ACPZ-3325-R7 -40C to +125C 3.3 2.5 ADP222ACPZ-3328-R7 -40C to +125C 3.3 2.8 ADP222ACPZ-3330-R7 -40C to +125C 3.3 3.0 ADP224ACPZ-2818-R7 -40C to +125C 2.8 1.8 Package Description 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] Rev. C | Page 23 of 24 Package Option CP-8-10 Branding L16 CP-8-10 L17 CP-8-10 L18 CP-8-10 LKR CP-8-10 LKS CP-8-10 LL0 CP-8-10 LL1 CP-8-10 L3A CP-8-10 LL2 CP-8-10 LN8 CP-8-10 LL3 CP-8-10 LJE CP-8-10 LKV CP-8-10 LKW CP-8-10 LKX CP-8-10 LKP ADP222/ADP223/ADP224/ADP225 Data Sheet Model1 ADP225ACPZ-R7 Temperature Range -40C to +125C Output Voltage (V) VOUT1 VOUT2 Adjustable Adjustable ADP223ACPZ-R7 -40C to +125C Adjustable Adjustable Adjustable Adjustable Adjustable Adjustable ADP223CP-EVALZ ADP225CP-EVALZ 1 Package Description 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] 8-Lead Lead Frame Chip Scale Package [LFCSP_UD] Evaluation Board Evaluation Board Z = RoHS Compliant Part. (c)2011-2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09376-0-8/12(C) Rev. C | Page 24 of 24 Package Option CP-8-10 Branding LKQ CP-8-10 LJQ