ADP222ACPZ-1827-R7 - Analog Devices

Dual, 300 mA Output, Low Noise,

High PSRR Voltage Regulators

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781.329.4700 www.analog.com

FEATURES

Input voltage range: 2.5 V to 5.5 V

Small, 8-lead, 2 mm × 2 mm LFCSP package

Initial accuracy: ±1%

High PSRR: 70 dB at 10 kHz, 60 dB at 100 kHz, 40 dB at 1 MHz

Low noise: 27 μV rms at VOUT = 1.2 V, 50 μV rms at VOUT = 2.8 V

Excellent transient response

Low dropout voltage: 170 mV at 300 mA load

65 μA typical ground current at no load, both LDOs enabled

Fixed output voltage from 0.8 V to 3.3 V (ADP222/ADP224)

Adjustable output voltage range from 0.5 V to 5.0 V

(ADP223/ADP225)

Quick output discharge (QOD)—ADP224/ADP225

Overcurrent and thermal protection

APPLICATIONS

Portable and battery-powered equipment

Portable medical devices

Post dc-to-dc regulation

Point of sale terminals

Credit card readers

Automatic meter readers

Wireless network equipment

TYPICAL APPLICATION CIRCUITS

EN1

VOUT1

VIN

EN2

GND

ADJ2 VOUT2

1 8

ADJ1

ADP223/

ADP225

OFF

= 4.2V

+C1

1µF

+C3

1µF

+C2

1µF

VOUT1 = 2.8V

VOUT2 = 2.0V

09376-001

Figure 1. ADP223/ADP225

EN1

VOUT1

VIN

EN2

GND

SENSE2 VOUT2

1 8

SENSE1

ADP222/

ADP224

OFF

= 4.2

+C1

1µF

+C3

1µF

+C2

1µF

VOUT2 = 3. 3V

VO UT1 = 1. 5 V

09376-101

Figure 2. ADP222/ADP224

GENERAL DESCRIPTION

The 300 mA, adjustable dual output ADP223/ADP225 and

fixed dual output ADP222/ADP224 combine high PSRR, low

noise, low quiescent current, and low dropout voltage in a

voltage regulator that is ideally suited for wireless applications

with demanding performance and board space requirements.

The ADP222/ADP224 are available with fixed outputs voltages

from 0.8V to 3.3V. The adjustable output ADP223/ADP225 may

be set to output voltages from 0.5 V to 5.0 V. The low quiescent

current, low dropout voltage, and wide input voltage range of

the ADP222/ADP223/ADP224/ADP225 extend the battery life

of portable devices.

The ADP222/ADP223/ADP224/ADP225 maintain power

supply rejection greater than 60 dB for frequencies as high as

100 kHz while operating with a low headroom voltage. The

ADP222/ADP223/ADP224/ADP225 offer much lower noise

performance than competing LDOs without the need for a

noise bypass capacitor. Overcurrent and thermal protection

circuitry prevent damage in adverse conditions.

The ADP224 and ADP225 are identical to the ADP222 and

ADP223, respectively, but with the addition of a quick output

discharge (QOD) feature.

The ADP222/ADP223/ADP224/ADP225 are available in a

small 8-lead, 2 mm × 2 mm LFCSP package and are stable with

tiny 1 μF, ±30% ceramic output capacitors, resulting in the smallest

possible board area for a wide variety of portable power needs.

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 2 of 24

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

Typical Application Circuits ............................................................ 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Input and Output Capacitor, Recommended Specifications .. 4

Absolute Maximum Ratings ............................................................ 5

Thermal Data ................................................................................ 5

Thermal Resistance ...................................................................... 5

ESD Caution .................................................................................. 5

Pin Configuration and Function Descriptions ............................. 6

Typical Performance Characteristics ..............................................7

Theory of Operation ...................................................................... 17

Applications Information .............................................................. 18

Capacitor Selection .................................................................... 18

Enable Feature ............................................................................ 19

Paralleling Outputs to Increase Output Current .................... 19

Quick Output Discharge (QOD) Function ............................ 19

Current Limit and Thermal Overload Protection ................. 20

Thermal Considerations ............................................................ 20

Printed Circuit Board Layout Considerations ....................... 22

Outline Dimensions ....................................................................... 23

Ordering Guide .......................................................................... 23

REVISION HISTORY

8/12—Rev. B to Rev. C

Changes to Ordering Guide .......................................................... 23

8/11—Rev. A to Rev. B

Changes to Features and General Descriptions Sections ............ 1

Added Figure 64; Renumbered Sequentially .............................. 17

Changes to Theory of Operation Section .................................... 17

Changes to Output Capacitor Section ......................................... 18

Changes to Paralleling Outputs to Increase Output

Current Section ............................................................................... 19

Updated Outline Dimensions ....................................................... 23

7/11—Rev. 0 to Rev. A

Added ADP222, ADP224, and ADP225 ......................... Universal

Changes to Features Section, Applications Section,

General Description Section, and Figure 2 .................................... 1

Changes to Table 1 ............................................................................. 3

Added Figure 4; Renumbered Sequentially ................................... 6

Changes to Table 5 ............................................................................. 6

Changes to Typical Performance Characteristics Section ........... 7

Changes to Theory of Operation Section and Figure 62 .......... 17

Added Figure 63 ............................................................................. 17

Added Quick Output Discharge (QOD) Function Section

Added Figure 70 ............................................................................. 20

2/11—Revision 0: Initial Version

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 3 of 24

SPECIFICATIONS

VIN = (VOUT + 0.5 V) or 2.5 V (whichever is greater), EN1 = EN2 = VIN, IOUT1 = IOUT2 = 10 mA, CIN = COUT1 = COUT2 = 1 µF, TA = 25°C,

unless otherwise noted.

Table 1.

Parameter Symbol Test Conditions/Comments Min Typ Max Unit

INPUT VOLTAGE RANGE

= −40°C to +125°C

2.5

5.5

OPERATING SUPPLY CURRENT

WITH BOTH REGULATORS ON

IGND IOUT = 0 µA 65 µA

IOUT = 0 µA, TJ = −40°C to +125°C 150 µA

IOUT = 10 mA 100 µA

IOUT = 10 mA, TJ = −40°C to +125°C 200 µA

IOUT = 300 mA 300 µA

IOUT = 300 mA, TJ = −40°C to +125°C 450 µA

SHUTDOWN CURRENT IGND-SD EN1 = EN2 = GND 0.2 2 µA

OUTPUT VOLTAGE ACCURACY1 VOUT TJ = −40°C to +125°C

IOUT = 10 mA −1 +1 %

0 µA < IOUT < 300 mA, VIN = (VOUT + 0.5 V) to 5.5 V −2 +2 %

ADJUSTABLE-OUTPUT VOLTAGE

ACCURACY1

VADJ TJ = −40°C to +125°C

IOUT = 10 mA 0.495 0.500 0.505 V

0 µA < IOUT < 300 mA, VIN = (VOUT + 0.5 V) to 5.5 V 0.490 0.510 V

LINE REGULATION ΔVOUT/ΔVIN VIN = (VOUT + 0.5 V) to 5.5 V 0.01 %/V

VIN = (VOUT + 0.5 V) to 5.5 V, TJ = −40°C to +125°C −0.05 +0.05 %/V

LOAD REGULATION2 ΔVOUT/ΔIOUT IOUT = 1 mA to 300 mA 0.001 %/mA

IOUT = 1 mA to 300 mA, TJ = −40°C to +125°C 0.002 %/mA

DROPOUT VOLTAGE3 VDROPOUT VOUT = 3.3 V

IOUT = 10 mA 6 mV

IOUT = 10 mA, TJ = −40°C to +125°C 9 mV

IOUT = 300 mA 170 mV

IOUT = 300 mA, TJ = −40°C to +125°C A 260 mV

SENSE INPUT BIAS CURRENT SENSEI-BIAS 2.5 V ≤ VIN ≤ 5.5 V, SENSEx connected to VOUTx 10 nA

ADJx INPUT BIAS CURRENT ADJI-BIAS 2.5 V ≤ VIN ≤ 5.5 V, ADJx connected to VOUTx 10 nA

START-UP TIME4 tSTART-UP VOUT = 3.3 V 240 µs

OUT

= 0.8 V

100

µs

CURRENT-LIMIT THRESHOLD5 ILIMIT 340 400 mA

THERMAL SHUTDOWN

Thermal Shutdown Threshold TSSD TJ rising 155 °C

Thermal Shutdown Hysteresis TSSD-HYS 15 °C

EN INPUT

EN Input Logic High VIH 2.5 V ≤ VIN ≤ 5.5 V 1.2 V

EN Input Logic Low VIL 2.5 V ≤ VIN ≤ 5.5 V 0.4 V

EN Input Leakage Current

I-LEAKAGE

EN1 = EN2 = V

or GND

0.1

µA

EN1 = EN2 = VIN or GND, TJ = −40°C to +125°C 1 µA

UNDERVOLTAGE LOCKOUT

UVLO

Input Voltage Rising

UVLO

RISE

2.45

Input Voltage Falling UVLOFALL 2.2 V

Hysteresis UVLOHYS 120 mV

OUTPUT DISCHARGE TIME tDIS VOUT = 2.8 V 1000 µs

OUTPUT DISCHARGE RESISTANCE RQOD 140 Ω

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 4 of 24

Parameter Symbol Test Conditions/Comments Min Typ Max Unit

OUTPUT NOISE OUTNOISE 10 Hz to 100 kHz, VIN = 5 V, VOUT = 3.3 V 56 µV rms

10 Hz to 100 kHz, VIN = 5 V, VOUT = 2.8 V 50 µV rms

10 Hz to 100 kHz, VIN = 3.6 V, VOUT = 2.5 V 45 µV rms

10 Hz to 100 kHz, VIN = 3.6 V, VOUT = 1.2 V 27 µV rms

POWER SUPPLY REJECTION RATIO PSRR VIN = 2.5 V, VOUT = 0.8 V, IOUT = 100 mA

100 Hz 76 dB

1 kHz 76 dB

10 kHz 70 dB

100 kHz 60 dB

1 MHz 40 dB

VIN = 3.8 V, VOUT = 2.8 V, IOUT = 100 mA

100 Hz 68 dB

1 kHz 68 dB

10 kHz

100 kHz 60 dB

1 MHz 40 dB

1 Accuracy when VOUTx is connected directly to ADJx or SENSEx. When the VOUTx voltage is set by external feedback resistors, the absolute accuracy in adjust mode

depends on the tolerances of resistors used.

2 Based on an end-point calculation using 1 mA and 300 mA loads.

3 Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output

voltages above 2.5 V.

4 Start-up time is defined as the time between the rising edge of EN to VOUT being at 90% of its nominal value.

5 Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.0 V

output voltage is defined as the current that causes the output voltage to drop to 90% of 3.0 V or 2.7 V.

INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS

The minimum input and output capacitance should be greater than 0.70 µF over the full range of the operating conditions. The full range of the

operating conditions in the application must be considered during device selection to ensure that the minimum capacitance specification

is met. X7R and X5R type capacitors are recommended for use with the LDOs, but Y5V and Z5U capacitors are not recommended for use

with the LDOs.

Table 2.

Parameter Symbol Conditions Min Typ Max Unit

MINIMUM INPUT AND OUTPUT CAPACITANCE CMIN TA = −40°C to +125°C 0.70 µF

CAPACITOR ESR RESR TA = −40°C to +125°C 0.001 1 Ω

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter Rating

VIN to GND −0.3 V to +6 V

ADJ1, ADJ2, VOUT1, VOUT2 to GND −0.3 V to VIN

EN1, EN2 to GND −0.3 V to +6 V

Storage Temperature Range −65°C to +150°C

Operating Junction Temperature Range −40°C to +125°C

Soldering Conditions JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination.

The ADP222/ADP223/ADP224/ADP225 can be damaged when

the junction temperature limits are exceeded. Monitoring

ambient temperature does not guarantee that TJ is within the

specified temperature limits. In applications with high power

dissipation and poor thermal resistance, the maximum ambient

temperature may have to be derated. In applications with

moderate power dissipation and low PCB thermal resistance, the

maximum ambient temperature can exceed the maximum limit as

long as the junction temperature is within specification limits.

The junction temperature (TJ) of the device is dependent on the

ambient temperature (TA), the power dissipation of the device

(PD), and the junction-to-ambient thermal resistance of the

package (θJA). Maximum junction temperature (TJ) is calculated

from the ambient temperature (TA) and power dissipation (PD)

using the formula

TJ = TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. θJA

is highly dependent on the application and board layout. In

applications where high maximum power dissipation exists,

close attention to thermal board design is required. The value

of θJA may vary, depending on PCB material, layout, and

environmental conditions. The specified value of θJA is based

on a 4-layer, 4 in × 3 in, 2½ oz copper board, as per JEDEC

standards. For more information, see the AN-772 Application

Note, A Design and Manufacturing Guide for the Lead Frame

Chip Scale Package (LFCSP).

ΨJB is the junction-to-board thermal characterization parameter

with units of °C / W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. The JESD51-12, Guidelines for

Reporting and Using Package Thermal Information, states that

thermal characterization parameters are not the same as thermal

resistances. ΨJB measures the component power flowing

through multiple thermal paths rather than a single path as in

thermal resistance, θJB. Therefore, ΨJB thermal paths include

convection from the top of the package as well as radiation from

the package, factors that make ΨJB more useful in real-world

applications. Maximum junction temperature (TJ) is calculated

from the board temperature (TB) and power dissipation (PD)

using the formula

TJ = TB + (PD × ΨJB)

Refer to JESD51-8 and JESD51-12 for more detailed

information about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type θJA θJC ΨJB Unit

8-Lead 2 mm × 2 mm LFCSP 50.2 31.7 18.2 °C/W

ESD CAUTION

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 6 of 24

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

EN1

VOUT1

VIN

EN2

GND

SENSE2 VOUT2

SENSE1

NOTES

1. CONNECT EXPO SED PAD TO GND.

09376-102

ADP222/

ADP224

Figure 3. ADP222/ADP224 Pin Configuration

EN1

VOUT1

VIN

EN2

ADP223/

ADP225

GND

ADJ2 VOUT2

1 8

ADJ1

NOTES

1. CONNECT EXPO SED PAD TO GND.

09376-002

Figure 4. ADP223/ADP225 Pin Configuration

Table 5. Pin Function Descriptions

Pin No.

ADP222/ADP224 ADP223/ADP225 Mnemonic Description

1 1 EN1 Enable Input for the Second Regulator. Drive EN1 high to turn on Regulator 1 and

drive EN1 low to turn off Regulator 1. For automatic startup, connect EN1 to VIN.

2 2 EN2 Enable Input for the First Regulator. Drive EN2 high to turn on Regulator 2 and drive

EN2 low to turn off Regulator 2. For automatic startup, connect EN2 to VIN.

3 3 GND Ground Pin.

N/A1 4 ADJ2 Adjust Pin for VOUT2. A resistor divider from VOUT2 to ADJ2 sets the output

voltage.

4 N/A1 SENSE2 Sense Pin for VOUT2.

5 5 VOUT2 Regulated Output Voltage. Connect an 1 µF or greater output capacitor between

VOUT2 and GND.

6 6 VIN Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.

7 7 VOUT1 Regulated Output Voltage. Connect 1 µF or greater output capacitor between

VOUT1 and GND.

N/A1 8 ADJ1 Adjust Pin for VOUT1. A resistor divider from VOUT1 to ADJ1 sets the output

voltage.

8 N/A1 SENSE1 Sense Pin for VOUT1.

EPAD The exposed paddle must be connected to ground.

1 N/A means not applicable.

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 7 of 24

TYPICAL PERFORMANCE CHARACTERISTICS

VIN = 5 V, V OUT1 = 3.3 V, VOUT2 = 2.8 V, IOUT1 = IOUT2 = 1 mA, CIN = COUT = 1 µF, T A = 25°C, unless otherwise noted.

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

–40 –5 25 85 125

OUT

(V)

JUNCTION TEM P E R AT URE ( °C)

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100m A

LOAD = 300m A

09376-105

Figure 5. Output Voltage vs. Junction Temperature, VOUTx = 3.3 V,

ADP222/ADP224

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

–40 –5 25 85 125

VOUT (V)

JUNCTION TEM P E R AT URE ( °C)

09376-106

LOAD = 10µA

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 100m A

LOAD = 300m A

Figure 6. Output Voltage vs. Junction Temperature, VOUTx = 2.8 V,

ADP222/ADP224

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

–40 –5 25 85 125

OUT

(V)

JUNCTION TEM P E R AT URE ( °C)

LOAD = 10µA

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 100m A

LOAD = 300m A

09376-107

Figure 7. Output Voltage vs. Junction Temperature, VOUTx = 1.8 V,

ADP222/ADP224

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

–40 –5 25 85 125

JUNCTION TEM P E R AT URE ( °C)

LOAD = 10µA

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 100m A

LOAD = 300m A

09376-108

OUT

(V)

Figure 8. Output Voltage vs. Junction Temperature, VOUTx = 1.2 V,

ADP222/ADP224

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

0.01 0.1 110 100 1000

VOUT (V)

ILOAD (mA)

09376-109

Figure 9. Output Voltage vs. Load Current, VOUTx = 3.3 V, ADP222/ADP224

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

0.01 0.1 110 100 1000

LOAD

(mA)

09376-110

OUT

(V)

Figure 10. Output Voltage vs. Load Current, VOUTx = 2.8 V, ADP222/ADP224

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 8 of 24

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

0.01 0.1 110 100 1000

ILOAD (mA)

09376-111

VOUT (V)

Figure 11. Output Voltage vs. Load Current, VOUTx = 1.8 V, ADP222/ADP224

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

0.01 0.1 110 100 1000

ILOAD (mA)

09376-112

VOUT (V)

Figure 12. Output Voltage vs. Load Current, VOUTx = 1.2 V, ADP222/ADP224

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5

VOUT (V)

VIN (V)

LOAD = 10µA

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 100m A

LOAD = 300m A

09376-113

Figure 13. Output Voltage vs. Input Voltage, VOUTx = 3.3 V, ADP222/ADP224

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5

VOUT (V)

VIN (V)

LOAD = 10µA

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 100m A

LOAD = 300m A

09376-114

Figure 14. Output Voltage vs. Input Voltage, VOUTx = 2.8 V, ADP222/ADP224

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

OUT

(V)

LOAD = 10µA

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 100m A

LOAD = 300m A

09376-115

Figure 15. Output Voltage vs. Input Voltage, VOUTx = 1.8 V, ADP222/ADP224

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

OUT

(V)

LOAD = 10µA

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 100m A

LOAD = 300m A

09376-116

Figure 16. Output Voltage vs. Input Voltage, VOUTx = 1.2 V, ADP222/ADP224

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 9 of 24

100

120

140

–40 –5 25 85 125

GROUND CURRENT ( µA)

JUNCTION TEM P E R AT URE ( °C)

LOAD = 10µA

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 100m A

LOAD = 300m A

09376-117

Figure 17. Ground Current vs. Junction Temperature, Single Output,

ADP222/ADP224

100

150

200

250

300

GROUND CURRENT ( µA)

–40 –5 25 85 125

JUNCTION TEM P E R AT URE ( °C)

LOAD = 100µ A

LOAD = 1m

LOAD = 10mA

LOAD = 50mA

LOAD = 100m A

LOAD = 300m A

09376-118

Figure 18. Ground Current vs. Junction Temperature, Dual Output,

ADP222/ADP224

100

120

140

0.01 0.1 110 100 1000

GROUND CURRENT ( µA)

LOAD

(mA)

09376-119

Figure 19. Ground Current vs. Load Current, Single Output, ADP222/ADP224

100

150

200

250

0.01 0.1 110 100 1000

GROUND CURRENT ( µA)

LOAD

(mA)

09376-120

Figure 20. Ground Current vs. Load Current, Dual Output, ADP222/ADP224

100

120

140

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

GROUND CURRENT ( µA)

(V)

LOAD = 10µA

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 100m A

LOAD = 300m A

09376-121

Figure 21. Ground Current vs. Input Voltage, VOUTx = 1.2 V, ADP222/ADP224

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

GROUND CURRENT ( µA)

(V)

LOAD = 10µA

LOAD = 100µ A

LOAD = 1mA

LOAD = 10mA

LOAD = 100m A

LOAD = 300m A

09376-122

100

150

200

250

Figure 22. Ground Current vs. Input Voltage, VOUTx = 1.2 V and 1.8 V,

ADP222/ADP224

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 10 of 24

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

–40 –5 25 85 125

OUT

(V)

JUNCTION TEM P E RATURE (°C)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-003

Figure 23. Output Voltage vs. Junction Temperature, VOUTx = 3.3 V,

ADP223/ADP225

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

–40 –5 25 85 125

VOUT (V)

JUNCTION TEM P E RATURE (°C)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-004

Figure 24. Output Voltage vs. Junction Temperature, VOUTx = 2.8 V,

ADP223/ADP225

–40 –5 25 85 125

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

VOUT (V)

JUNCTION TEM P E RATURE (°C)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-005

Figure 25. Output Voltage vs. Junction Temperature, VOUTx = 1.8 V,

ADP223/ADP225

–40 –5 25 85 125

JUNCTION TEM P E RATURE (°C)

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

VOUT (V)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-006

Figure 26. Output Voltage vs. Junction Temperature, VOUTx = 1.2 V,

ADP223/ADP225

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

0.1 110 100 1000

OUT

(V)

LOAD

(mA)

09376-007

Figure 27. Output Voltage vs. Load Current, VOUTx = 3.3 V, ADP223/ADP225

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

0.01 0.1 110 100 1000

VOUT (V)

ILOAD (mA)

09376-008

Figure 28. Output Voltage vs. Load Current, VOUTx = 2.8 V, ADP223/ADP225

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 11 of 24

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

0.1 110 100 1000

OUT

(V)

LOAD

(mA)

09376-009

Figure 29. Output Voltage vs. Load Current, VOUTx = 1.8 V, ADP223/ADP225

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

0.1 110 100 1000

OUT

(V)

LOAD

(mA)

09376-010

Figure 30. Output Voltage vs. Load Current, VOUTx = 1.2 V, ADP223/ADP225

3.70 3.90 4.10 4.30 4.70 4.90 5.10 5.30 5.50

VIN (V)

3.20

3.26

3.24

3.22

3.28

3.30

3.32

3.34

3.36

3.38

3.40

VOUT (V)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-011

Figure 31. Output Voltage vs. Input Voltage, VOUTx = 3.3 V, ADP223/ADP225

3.50 3.70 3.90 4.10 4.30 4.70 4.90 5.10 5.30 5.50

VIN (V)

2.75

2.78

2.77

2.76

2.79

2.80

2.81

2.82

2.83

2.84

2.85

VOUT (V)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 200mA

LOAD = 300mA

09376-012

Figure 32. Output Voltage vs. Input Voltage, VOUTx = 2.8 V, ADP223/ADP225

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

VOUT (V)

VIN (V)

09376-013

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

Figure 33. Output Voltage vs. Input Voltage, VOUTx = 1.8 V, ADP223/ADP225

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

(V)

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

OUT

(V)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-014

Figure 34. Output Voltage vs. Input Voltage, VOUTx = 1.2 V, ADP223/ADP225

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 12 of 24

–40 –5 25 85 125

JUNCTION TEM P E RATURE (°C)

100

150

200

250

300

GROUND CURRENT ( uA)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-015

Figure 35. Ground Current vs. Junction Temperature, Single Output,

Includes 100 µA for Output Divider, ADP223/ADP225

100

150

200

250

300

350

400

450

500

GROUND CURRENT (µA)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

–40 –5 25 85 125

JUNCTION TEM P E RATURE (°C)

09376-016

Figure 36. Ground Current vs. Junction Temperature, Dual Output, Includes

200 µA for Output Dividers, ADP223/ADP225

100

150

200

250

0.01 0.1 110 100 1000

GROUND CURRENT (µA)

ILOAD (mA)

09376-017

Figure 37. Ground Current vs. Load Current, Single Output,

Includes 100 µA for Output Divider, ADP223/ADP225

100

200

300

400

500

150

250

350

450

0.01 0.1 110 100 1000

GROUND CURRENT (µA)

LOAD

(mA)

09376-018

Figure 38. Ground Current vs. Load Current, Dual Output, Includes 200 µA for

Output Dividers, ADP223/ADP225

100

150

200

250

2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

GROUND CURRENT (µA)

VIN (V)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-019

Figure 39. Ground Current vs. Input Voltage, VOUTx = 1.2 V, Single Output,

Includes 100 µA for Output Divider, ADP223/ADP225

100

150

200

250

300

350

400

450

2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

GROUND CURRENT (µA)

VIN (V)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 200mA

LOAD = 300mA

09376-020

Figure 40. Ground Current vs. Input Voltage, VOUTx = 1.2 V and 1.8 V,

Dual Output, Includes 200 µA for Output Dividers, ADP223/ADP225

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 13 of 24

100

120

140

110 100 1000

DROP OUT V OLTAGE (mV)

LOAD

(mA)

09376-021

Figure 41. Dropout Voltage vs. Load Current, VOUT = 3.3 V

100

120

140

160

110 100 1000

DROP OUT V OLTAGE (mV)

LOAD

(mA)

09376-022

Figure 42. Dropout Voltage vs. Load Current, VOUT = 2.8 V

2.90

2.95

3.00

3.05

3.10

3.15

3.20

3.25

3.30

3.35

3.40

3.1 3.2 3.3 3.4 3.5 3.6

VOUT (V)

VIN (V)

LOAD = 1mA

LOAD = 5mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-023

Figure 43. Output Voltage vs. Input Voltage in Dropout, VOUTx = 3.3 V

2.40

2.45

2.50

2.55

2.60

2.65

2.70

2.75

2.80

2.85

2.90

2.6 2.7 2.8 2.9 3.0 3.1

OUT

(V)

09376-024

LOAD = 1mA

LOAD = 5mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

Figure 44. Output Voltage vs. Input Voltage in Dropout, VOUTx = 2.8 V

100

150

200

250

300

350

400

450

3.1 3.2 3.3 3.4 3.5 3.6

GROUND CURRENT (µA)

VIN

(V)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-025

Figure 45. Ground Current vs. Input Voltage in Dropout, VOUTx = 3.3 V

(V)

100

150

200

250

300

350

400

2.6 2.7 2.8 2.9 3.0 3.1

GROUND CURRENT ( uA)

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 50mA

LOAD = 100mA

LOAD = 300mA

09376-026

Figure 46. Ground Current vs. Input Voltage in Dropout, VOUTx = 2.8 V

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 14 of 24

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

10 100 1k 10k 100k 1M 10M

PSRR ( dB)

FREQUENCY (Hz)

VRIPPLE = 50mV

VIN = 4.3V

VOUT = 3. 3V

COUT = 1µF

LOAD = 100µA

LOAD = 1mA

LOAD = 10mA

LOAD = 100mA

LOAD = 300mA

09376-027

Figure 47. Power Supply Rejection Ratio vs. Frequency,

VIN = 4.3, V VOUTx = 3.3 V

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

10 100 1k 10k 100k 1M 10M

PSRR ( dB)

FREQUENCY (Hz)

LOAD = 100

LOAD = 1mA

LOAD = 10mA

LOAD = 100mA

LOAD = 300mA

VRIPPLE = 50mV

VIN = 3.8V

VOUT = 2. 8V

COUT = 1µF

09376-028

Figure 48. Power Supply Rejection Ratio vs. Frequency,

VIN = 3.8 V, VOUTx = 2.8 V

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

10 100 1k 10k 100k 1M 10M

PSRR ( dB)

FREQUENCY (Hz)

LOAD = 1mA

LOAD = 10mA

LOAD = 100mA

LOAD = 300mA

RIPPLE

= 50mV

= 2.8V

OUT

= 1.8V

OUT

= 1µF

09376-029

Figure 49. Power Supply Rejection Ratio vs. Frequency,

VIN = 2.8 V, VOUTx = 1.8 V

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

10 100 1k 10k 100k 1M 10M

PSRR ( dB)

FREQUENCY (Hz)

LOAD = 1mA

LOAD = 10mA

LOAD = 100mA

LOAD = 300mA

VRIPPLE = 50mV

VIN = 2.5V

VOUT = 1. 2V

COUT = 1µF

09376-030

Figure 50. Power Supply Rejection Ratio vs. Frequency,

VIN = 2.5 V, VOUTx = 1.2 V

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

10 100 1k 10k 100k 1M 10M

PSRR ( dB)

FREQUENCY (Hz)

LOAD = 1mA

LOAD = 10mA

LOAD = 100mA

LOAD = 300mA

VRIPPLE = 50mV

VIN = 3.8V

VOUT = 3. 3V

COUT = 1µF

09376-031

Figure 51. Power Supply Rejection Ratio vs. Frequency,

VIN = 3.8 V, VOUTx = 3.3 V

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

10 100 1k 10k 100k 1M 10M

PSRR ( dB)

FREQUENCY (Hz)

LOAD = 1mA

LOAD = 10mA

LOAD = 100mA

LOAD = 300mA

VRIPPLE = 50mV

VIN = 3.3V

VOUT = 2. 8V

COUT = 1µF

09376-032

Figure 52. Power Supply Rejection Ratio vs. Frequency,

VIN = 3.3 V, VOUTx = 2.8 V

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 15 of 24

10 100 1k 10k 100k 1M 10M

PSRR ( dB)

FREQUENCY (Hz)

RIPPLE

= 50mV

= 2.5V

OUT

= 1.8V

OUT

= 1µF

09376-033

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

LOAD = 1mA

LOAD = 10mA

LOAD = 100mA

LOAD = 300mA

Figure 53. Power Supply Rejection Ratio vs. Frequency,

VIN = 2.5 V, VOUTx = 1.8 V

CH2 10mVCH1 1V

CH3 10mV

M1µs A CH4 200mV

T 10.40%

OUT2

OUT1

09376-034

Figure 54. Transient Line Response, VOUTx = 3.3 V and 2.8 V, VIN = 4 V to 5 V,

ILOAD = 10 mA

CH2 10mVCH1 1V

CH3 10mV

M4µs A CH4 200mV

T 9.8%

09376-035

OUT2

OUT1

Figure 55. Transient Line Response, VOUTx = 1.2 V and 1.8 V, VIN = 4 V to 5 V,

ILOAD = 10 mA

CH2 10mVCH1 1V

CH3 10mV

M1µs A CH4 200mV

T 9.8%

09376-036

OUT2

OUT1

Figure 56. Transient Line Response, VOUTx = 3.3 V and 2.8 V, VIN = 4 V to 5 V,

ILOAD = 300 mA

CH2 10mVCH1 1V

CH3 10mV

M1µs A CH4 200mV

T 10.00%

09376-037

OUT2

OUT1

Figure 57. Transient Line Response, VOUTx = 1.2 V and 1.8 V, VIN = 4 V to 5 V,

ILOAD = 300 mA

CH2 50mVCH1 200mAΩ

CH3 10mV

M10µs A CH1 200mA

T 10.20%

09376-038

OUT2

OUT1

LOAD CURRENT

ON V

OUT1

Figure 58. Transient Load Response, VOUTx = 3.3 V, ILOAD = 1 mA to 300 mA;

VOUTx = 2.8 V, ILOAD = 1 mA

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 16 of 24

CH2 50mVCH1 200mAΩ

CH3 10.0mV

M10µs A CH1 200mA

T 10.20%

09376-039

LOAD CURRENT

ON VOUT1

VOUT2

VOUT1

Figure 59. Transient Load Response, VOUTx = 1.2 V, ILOAD = 1 mA to 300 mA;

VOUTx = 1.8 V, ILOAD = 1 mA

0.001 0.01 0.1 110 100 1000

NOISE ( µV rms)

LOAD

(mA)

1.2V

1.8V

2.8V

3.3V

09376-040

Figure 60. RMS Output Noise vs. Load Current and Output Voltage,

VIN = 5 V, COUT = 1 µF

0.01

0.1

10 100 1k 10k 100k

NOISE SPECTRAL DENSITY (µV/√Hz)

FREQUENCY (Hz)

1.2V

1.8V

2.8V

3.3V

09376-041

Figure 61. Output Noise Spectral Density, VIN = 5 V, ILOAD = 10 mA, COUT = 1 μF

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 17 of 24

THEORY OF OPERATION

The ADP222/ADP223/ADP224/ADP225 are low quiescent

current, fixed and adjustable dual output, low dropout linear

regulators that operate from 2.5 V to 5.5 V and provide up to

300 mA of current from each output. Drawing a low 300 μA

quiescent current (typical) at full load make the ADP222/

ADP223/ADP224/ADP225 ideal for battery-operated portable

equipment. Shutdown current consumption is typically 200 nA.

Optimized for use with small 1 μF ceramic capacitors, the

ADP222/ADP223/ADP224/ADP225 provide excellent

transient performance.

THERMAL

SHUTDOWN

EN1

EN2

GND

CURRENT

LIMIT

CURRENT

LIMIT

REFERENCE ADP225 ONLY

CONTROL

LOGIC

AND

ENABLE

VIN VOUT1

140Ω

VOUT2

ADP223/ADP225

ADJ1

ADJ2

09376-062

140Ω

Figure 62. Internal Block Diagram, ADP223/ADP225

THERMAL

SHUTDOWN

EN1

EN2

GND

CURRENT

LIMIT

CURRENT

LIMIT

REFERENCE ADP224

ONLY

CONTROL

LOGIC

AND

ENABLE

VIN VOUT1

140Ω

VOUT2

ADP222/ADP224

SENSE1

SENSE2

09376-063

140Ω

Figure 63. Internal Block Diagram, ADP222/ADP224

Internally, the ADP222/ADP223/ADP224/ADP225 consist of a

reference, two error amplifiers, and two PMOS pass transistors.

Output current is delivered via the PMOS pass device, which is

controlled by the error amplifier. The error amplifier compares

the reference voltage with the feedback voltage from the output

and amplifies the difference. If the feedback voltage is lower

than the reference voltage, the gate of the PMOS device is

pulled lower, allowing more current to flow and increasing the

output voltage. If the feedback voltage is higher than the

reference voltage, the gate of the PMOS device is pulled higher,

allowing less current to flow and decreasing the output voltage.

EN1

VOUT1

VIN

EN2

GND

ADJ2 VOUT2

1 8

ADJ1

ADP223/

ADP225

OFF

= 4.2V

+C1

1µF

+C3

1µF

+C2

1µF

VOUT1 = 2.8V

VOUT2 = 2.0V

09376-064

Figure 64. Typical Application Circuit for Setting Output Voltages,

ADP223/ADP225

The ADP223/ADP225 are exactly the same as the ADP222/

ADP224 except that the output voltage dividers are internally

disconnected and the feedback input of the error amplifiers is

brought out for each output. The output voltages can be set

according to the following equations:

VOUT1 = 0.50 V(1 + R1/R2)

VOUT2 = 0.50 V(1 + R3/R4)

The value of R1 and R3 should be less than 200 kΩ to minimize

errors in the output voltage caused by the ADJx pin input current.

For example, when R1 and R2 each equal 200 kΩ, the output

voltage is 1.0 V. The output voltage error introduced by the ADJx

pin input current is 2 mV or 0.20%, assuming a typical ADJx pin

input current of 10 nA at 25°C.

The output voltage of the ADP223/ADP225 may be set from

0.5 V to 5.0 V.

The ADP222/ADP224 are available in multiple output voltage

options ranging from 0.8 V to 3.3 V.

The ADP224/ADP225 are identical to the ADP222/ADP223

with the addition of a quick output discharge (QOD) feature.

This allows the output voltage to start up from a known state.

The ADP222/ADP223/ADP224/ADP225 use the EN1/EN2 pins

to enable and disable the VOUT1/VOUT2 pins under normal

operating conditions. When EN1/EN2 are high, VOUT1/VOUT2

turn on; when EN1/EN2 are low, VOUT1/VOUT2 turn off. For

automatic startup, EN1/EN2 can be tied to VIN.

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 18 of 24

APPLICATIONS INFORMATION

CAPACITOR SELECTION

Output Capacitor

The ADP222/ADP223/ADP224/ADP225 are designed for

operation with small, space-saving ceramic capacitors but

function with most commonly used capacitors as long as care is

taken with regard to the effective series resistance (ESR) value.

The ESR of the output capacitor affects the stability of the LDO

control loop. A minimum of 0.7 µF capacitance with an ESR of

1 Ω or less is recommended to ensure the stability of the ADP222/

ADP223/ADP224/ADP225. Transient response to changes in

load current is also affected by output capacitance. Using a

larger value of output capacitance improves the transient response

of the ADP222/ADP223/ADP224/ADP225 to large changes in

load current. Figure 65 shows the transient responses for an

output capacitance value of 1 µF.

A CH1 200mA

M10µs

T 10.20%

CH1 200mA

CH3 10mV CH2 50mV

BWBW

Ω

09376-043

OUT2

OUT1

LOAD CURRENT

ON V

OUT1

Figure 65. Output Transient Response, COUT = 1 µF

Input Bypass Capacitor

Connecting a 1 µF capacitor from VIN to GND reduces the

circuit sensitivity to the printed circuit board (PCB) layout,

especially when long input traces or high source impedance

are encountered. If greater than 1 µF of output capacitance is

required, the input capacitor should be increased to match it.

Input and Output Capacitor Properties

Any good quality ceramic capacitors can be used with the

ADP222/ADP223/ADP224/ADP225, as long as they meet the

minimum capacitance and maximum ESR requirements.

Ceramic capacitors are manufactured with a variety of

dielectrics, each with different behavior over temperature and

applied voltage. Capacitors must have a dielectric adequate to

ensure the minimum capacitance over the necessary temperature

range and dc bias conditions. X5R or X7R dielectrics with a

voltage rating of 6.3 V or 10 V are recommended, but Y5V and

Z5U dielectrics are not recommended, due to their poor

temperature and dc bias characteristics.

Figure 66 depicts the capacitance vs. voltage bias characteristic

of an 0402, 1 µF, 10 V, X5R capacitor. The voltage stability of a

capacitor is strongly influenced by the capacitor size and voltage

rating. In general, a capacitor in a larger package or higher voltage

rating exhibits better stability. The temperature variation of the

X5R dielectric is ~±15% over the −40°C to +85°C temperature

range and is not a function of package or voltage rating.

1.2

1.0

0.8

0.6

0.4

0.2

00 2 4 6 8 10

CAPACI TANCE (µF)

VOLTAGE (V)

09376-044

Figure 66. Capacitance vs. Voltage Bias Characteristic

Use Equation 1 to determine the worst-case capacitance accounting

for capacitor variation over temperature, component tolerance,

and voltage.

CEFF = CBIAS × (1 − TEMPCO) × (1 − TOL) (1)

where:

CBIAS is the effective capacitance at the operating voltage.

TEMPCO is the worst-case capacitor temperature coefficient.

TOL is the worst-case component tolerance.

In this example, the worst-case temperature coefficient (TEMPCO)

over −40°C to +85°C is assumed to be 15% for an X5R dielectric.

The tolerance of the capacitor (TOL) is assumed to be 10%, and

CBIAS is 0.94 µF at 1.8 V, as shown in Figure 66.

Substituting these values in Equation 1 yields

CEFF = 0.94 µF × (1 − 0.15) × (1 − 0.1) = 0.719 µF

Therefore, the capacitor chosen in this example meets the

minimum capacitance requirement of the LDO over temperature

and tolerance at the chosen output voltage.

To guarantee the performance of the ADP222/ADP223/

ADP224/ADP225, it is imperative that the effects of dc bias,

temperature, and tolerances on the behavior of the capacitors

be evaluated for each application.

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 19 of 24

ENABLE FEATURE

The ADP222/ADP223/ADP224/ADP225 use the ENx pins to

enable and disable the VOUTx pins under normal operating

conditions. Figure 67 shows a rising voltage on ENx crossing

the active threshold, where VOUTx turns on. When a falling

voltage on ENx crosses the inactive threshold, VOUTx turns off.

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

OUTPUT VOLTAGE (V)

ENABL E V OLTAGE (V)

= 5.5V

09376-045

Figure 67. Typical ENx Pin Operation, VIN = 5.5 V

As shown in Figure 67, the ENx pins have built-in hysteresis.

This prevents on/off oscillations that can occur due to noise on

the ENx pins as it passes through the threshold points.

The active/inactive thresholds of the ENx pins are derived from

the VIN voltage. Therefore, these thresholds vary with changing

input voltage. Figure 68 shows typical ENx active/inactive thresholds

when the input voltage varies from 2.5 V to 5.5 V.

0.2

0.4

0.6

0.8

1.0

1.2

2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

ENABL E THRESHOL DS ( V )

VIN (V)

ENx F ALL

ENx RI S E

09376-046

Figure 68. Typical Enable Thresholds vs. Input Voltage

The ADP222/ADP223/ADP224/ADP225 use an internal soft

start to limit the inrush current when the output is enabled. The

start-up time for the 2.8 V option is approximately 240 µs from

the time the ENx active threshold is crossed to when the output

reaches 90% of its final value. The start-up time is somewhat

dependent on the output voltage setting and increases slightly as

the output voltage increases.

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0100 200 300 400 500 600 700 800 900 1000

OUTPUT VOLTAGE (V)

TIME (µs)

ENx

3.3V

2.8V

1.8V

1.2V

09376-047

Figure 69. Typical Start-Up Time

PARALLELING OUTPUTS TO INCREASE OUTPUT

CURRENT

The ADP223/ADP225 use a single band gap to generate the

reference voltage for each LDO. The reference voltages are

trimmed to plus or minus a couple of millivolts of each other.

This allows paralleling of the LDOs to increase the output

current to 600 mA. The adjust pins of each LDO are tied

together and a single output voltage divider sets the output

voltage. Even though the output voltage of each LDO is slightly

different, at high load currents, the resistance of the package

and the board layout absorbs the difference. Figure 70 shows

the schematic of a typical application where the LDO outputs

are paralleled.

EN1

VOUT1

VIN

EN2

GND

ADJ2 VOUT2

1 8

ADJ1 R1

OFF

= 3.3V

+C1

1µF

+C2

1µF

VO UT2 = 2. 8V

09376-053

Figure 70. Paralleling Outputs for Higher Output Current

QUICK OUTPUT DISCHARGE (QOD) FUNCTION

The ADP224/ADP225 include an output discharge resistor to

force the voltage on each output to zero when the respective

LDO is disabled. This ensures that the outputs of the LDOs are

always in a well-defined state, regardless if it is enabled or not.

The ADP222/ADP223 do not include the output discharge

function. Figure 71 compares the turn-off time of a 3.3 V output

LDO with and without the QOD function. Both LDOs have a

1 kΩ resistor connected to each output. The LDO with the

QOD function discharges the output to 0 V in less than 1 ms,

whereas the 1 kΩ load takes over 5 ms to do the same.

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 20 of 24

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

02000 4000 6000 8000 10000

VOLT S (V)

TIME (µs)

ENABLE

VOUT, NO QOD

VOUT, WITH QOD

09376-169

Figure 71. Typical Turn-Off Time with and Without QOD Function

CURRENT LIMIT AND THERMAL OVERLOAD

PROTECTION

The ADP222/ADP223/ADP224/ADP225 are protected against

damage due to excessive power dissipation by current and

thermal overload protection circuits. The ADP222/ADP223/

ADP224/ADP225 are designed to current limit when the output

load reaches 300 mA (typical). When the output load exceeds

300 mA, the output voltage is reduced to maintain a constant

current limit.

Thermal overload protection is included, which limits the

junction temperature to a maximum of 155°C (typical). Under

extreme conditions (that is, high ambient temperature and

power dissipation) when the junction temperature starts to rise

above 155°C, the output is turned off, reducing the output current

to 0. When the junction temperature drops below 140°C, the

output is turned on again, and output current is restored to its

nominal value.

Consider the case where a hard short from VOUTx to ground

occurs. At first, the ADP222/ADP223/ADP224/ADP225 cur-

rent limits, so that only 300 mA is conducted into the short. If

self-heating of the junction is great enough to cause its tempera-

ture to rise above 155°C, thermal shutdown activates, turning

off the output and reducing the output current to 0 mA. As the

junction temperature cools and drops below 135°C, the output

turns on and conducts 300 mA into the short, again causing the

junction temperature to rise above 155°C. This thermal oscilla-

tion between 140°C and 155°C causes a current oscillation

between 300 mA and 0 mA that continues as long as the short

remains at the output.

Current and thermal limit protections are intended to protect

the device against accidental overload conditions. For reliable

operation, device power dissipation must be externally limited

so that junction temperatures do not exceed 125°C.

THERMAL CONSIDERATIONS

In most applications, the ADP222/ADP223/ADP224/ADP225

do not dissipate much heat due to its high efficiency. However,

in applications with high ambient temperature, and high supply

voltage to output voltage differential, the heat dissipated in

the package is large enough that it can cause the junction

temperature of the die to exceed the maximum junction

temperature of 125°C.

When the junction temperature exceeds 155°C, the converter

enters thermal shutdown. It recovers only after the junction

temperature has decreased below 140°C to prevent any permanent

damage. Therefore, thermal analysis for the chosen application

is very important to guarantee reliable performance over all

conditions. The junction temperature of the die is the sum of

the ambient temperature of the environment and the temperature

rise of the package due to the power dissipation, as shown in

Equation 2.

To guarantee reliable operation, the junction temperature of

the ADP222/ADP223/ADP224/ADP225 must not exceed

125°C. To ensure that the junction temperature stays below this

maximum value, the user must be aware of the parameters that

contribute to junction temperature changes. These parameters

include ambient temperature, power dissipation in the power

device, and thermal resistances between the junction and ambient

air (θJA). The θJA number is dependent on the package assembly

compounds that are used and the amount of copper used to

solder the package GND pin to the PCB.

Table 6 shows typical θJA values of the 8-lead LFCSP package for

various PCB copper sizes, and Table 7 shows the typical ΨJB value

of the 8-lead LFCSP.

Table 6. Typical θJA Values

Copper Size (mm2) θJA (°C/W)

251 175.1

100 135.6

500 77.3

1000 65.2

6400

1 Device soldered to minimum size pin traces.

Table 7. Typical ΨJB Value

Model ΨJB (°C/W)

8-Lead LFCSP 18.2

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 21 of 24

The junction temperature of the ADP222/ADP223/ADP224/

ADP225 can be calculated by

TJ = TA + (PD × θJA) (2)

where:

TA is the ambient temperature.

PD is the power dissipation in the die, given by

PD = [(VIN − VOUT) × ILOAD] + (VIN × IGND)

where:

ILOAD is the load current.

IGND is the ground current.

VIN and VOUT are input and output voltages, respectively.

Power dissipation due to ground current is quite small and can

be ignored. Therefore, the junction temperature equation

simplifies to the following:

TJ = TA + {[(VIN − VOUT) × ILOAD] × θJA}

As shown in the simplified equation, for a given ambient

temperature, input- to-output voltage differential, and continuous

load current, there exists a minimum copper size requirement

for the PCB to ensure that the junction temperature does not rise

above 125°C. Figure 72 to Figure 75 show junction temperature

calculations for different ambient temperatures, power dissipation,

and areas of PCB copper.

140

120

100

JUNCTION TEM P E R AT URE T

(° C)

TOTAL POWER DISSIPATION (W)

00.2 0.4 0.6 0.8 1.0 1.2

6400mm

1000mm

500mm

100mm

25mm

JEDEC

MAX

09376-048

Figure 72. 8-Lead LFCSP, TA = 25°C

140

120

100

JUNCTION TEM P E R AT URE T

(° C)

TOTAL POWER DISSIPATION (W)

00.2 0.4 0.6 0.8 1.0 1.2

6400mm

1000mm

500mm

100mm

25mm

JEDEC

MAX

09376-049

Figure 73. 8-Lead LFCSP, TA = 50°C

140

120

100

JUNCTION TEM P E R AT URE T J ( °C)

TOTAL POWER DISSIPATION (W)

00.2 0.4 0.6 0.8 1.0 1.2

6400mm2

1000mm2

500mm2

100mm2

25mm2

JEDEC

TJ MAX

09376-050

Figure 74. 8-Lead LFCSP, TA = 85°C

140

120

100

JUNCTION TEM P E R AT URE T

(° C)

TOTAL POWER DISSIPATION (W)

0 21 3 4 5 6 7

= 25° C

= 50° C

= 85°C

MAX

09376-051

Figure 75. 8-Lead LFCSP, TA = 85°C

In the case where the board temperature is known, use the

thermal characterization parameter, ΨJB, to estimate the

junction temperature rise (see Figure 75). Maximum junction

temperature (TJ) is calculated from the board temperature (TB)

and power dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB) (3)

The typical value of ΨJB is 18.2°C/W for the 8-lead LFCSP package.

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 22 of 24

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Heat dissipation from the package can be improved by

increasing the amount of copper attached to the pins of the

ADP222/ADP223/ADP224/ADP225. However, as listed in

Table 6, a point of diminishing returns is eventually reached

beyond which an increase in the copper size does not yield

significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUTx and GND pins. Use of 0402 or 0603 size capacitors and

resistors achieves the smallest possible footprint solution on

boards where area is limited.

09376-052

TB2

TB5

EN1

R1 R2

VOUT1

TB6

ADP223 - ________- EVALZ

VOUT2

TB7

GND

ANALOG

DEVICES

TB1

GND

TB4

VIN

TB3

EN2

Figure 76. Example 8-Lead LFCSP PCB Layout

Data Sheet ADP222/ADP223/ADP224/ADP225

Rev. C | Page 23 of 24

OUTLINE DIMENSIONS

1.70

1.60

1.50

0.425

0.350

0.275

TOP VIEW

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

2.00

BSC SQ

SEATING

PLANE

0.60

0.55

0.50

1.10

1.00

0.90

0.20 RE F

0.175 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CO NF IG URATI O N AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

07-11-2011-B

Figure 77. 8-Lead Lead Frame Chip Scale Package [LFCSP_UD]

2.00 mm × 2.00 mm Body, Ultra Thin, Dual Lead

(CP-8-10)

Dimensions shown in millimeters

ORDERING GUIDE

Output Voltage (V)

Model1 Temperature Range VOUT1 VOUT2 Package Description Package Option Branding

ADP222ACPZ-1218-R7 −40°C to +125°C 1.2 1.8 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 L16

ADP222ACPZ-1228-R7 −40°C to +125°C 1.2 2.8 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 L17

ADP222ACPZ-1233-R7 −40°C to +125°C 1.2 3.3 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 L18

ADP222ACPZ-1528-R7 −40°C to +125°C 1.5 2.8 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LKR

ADP222ACPZ-1533-R7 −40°C to +125°C 1.5 3.3 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LKS

ADP222ACPZ-1815-R7 −40°C to +125°C 1.8 1.5 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LL0

ADP222ACPZ-1825-R7 −40°C to +125°C 1.8 2.5 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LL1

ADP222ACPZ-1827-R7 −40°C to +125°C 1.8 2.7 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 L3A

ADP222ACPZ-1833-R7 −40°C to +125°C 1.8 3.3 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LL2

ADP222ACPZ-2725-R7 −40°C to +125°C 2.7 2.5 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LN8

ADP222ACPZ-2818-R7 −40°C to +125°C 2.8 1.8 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LL3

ADP222ACPZ-2827-R7 −40°C to +125°C 2.8 2.7 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LJE

ADP222ACPZ-3325-R7 −40°C to +125°C 3.3 2.5 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LKV

ADP222ACPZ-3328-R7 −40°C to +125°C 3.3 2.8 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LKW

ADP222ACPZ-3330-R7 −40°C to +125°C 3.3 3.0 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LKX

ADP224ACPZ-2818-R7 −40°C to +125°C 2.8 1.8 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LKP

ADP222/ADP223/ADP224/ADP225 Data Sheet

Rev. C | Page 24 of 24

Output Voltage (V)

Model1 Temperature Range VOUT1 VOUT2 Package Description Package Option Branding

ADP225ACPZ-R7 −40°C to +125°C Adjustable Adjustable 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LKQ

ADP223ACPZ-R7 −40°C to +125°C Adjustable Adjustable 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]

CP-8-10 LJQ

ADP223CP-EVALZ Adjustable Adjustable Evaluation Board

ADP225CP-EVALZ Adjustable Adjustable Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D09376-0-8/12(C)