July 2008 Rev 3 1/19
19
VNQ860-E
VNQ860SP-E
Quad channel high side driver
Features
■CMOS compatible I/Os
■Undervoltage and overvoltage shut-down
■Shorted load protection
■Thermal shut-down
■Very low stand-by current
■Protection against loss of ground
Description
The VNQ860-E, VNQ860SP-E are monolithic
devices made using STMicroelectronics VIPower
M0-3 technology, intended for driving any kind
load with one side connected to ground. Active
current limitation combined with thermal
shut-down and automatic restart protect the
device against overload. Device automatically
turns OFF in case of ground pin disconnection.
This device is especially suitable for industrial
applications in norms conformity with IEC 61131,
(Programmable controllers international
standard).
Type RDS(on)(1)
1. Per each channel.
Iout VCC
VNQ860-E
VNQ860SP-E 270 mΩ0.25 A 36 V
SO- 20 PowerSO-10TM
Figure 1. Block diagram
www.st.com
Contents VNQ860-E, VNQ860SP-E
2/19
Contents
1 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Truth table and switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . 7
5 Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7 PowerSO-10™ thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8 Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
10 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
VNQ860-E, VNQ860SP-E Maximum rating
3/19
1 Maximum rating
Table 1. Absolute maximum rating
Symbol Parameter
Value
Unit
SO-20 PowerSO-10
VCC DC supply voltage 41 V
-VCC Reverse DC supply voltage -0.3 V
-IGND DC reverse ground pin -200 mA
IOUT DC output current Internally limited A
-IOUT Reverse DC output current -2 A
IIN DC input current ± 10 mA
VIN Input voltage range -3/+VCC V
ISTAT DC status voltage + VCC V
VESD Electrostatic discharge (R = 1.5 kW; C = 100 pF) 2000 V
Ptot Power dissipation at Tc <= 25 °C 16 90 W
TJJunction operating temperature Internally limited °C
TcCase operating temperature -40 to 150 °C
Tstg Storage temperature -55 to 150 °C
Table 2. Thermal data
Symbol Parameter
Value
Unit
SO-20 PowerSO-10
RthJP Thermal resistance junction-pins Max 8 - °C/W
RthJA Thermal resistance junction-ambient Max 58 52 (1)
1. When mounted on FR4 printed circuit board with 0.5 cm2 of copper area ( at least 35µ thick ) connected to
all VCC pins.
°C/W
37 (2)
2. When mounted on FR4 printed circuit board with 6 cm2 of copper area ( at least 35µ thick ) connected to all
VCC pins.
RthJC Thermal resistance junction-case Max - 1.4 °C/W
Pin connection VNQ860-E, VNQ860SP-E
4/19
2 Pin connection
Figure 2. Configuration diagram (top view) and suggested connections for unused
and n.c. pins
Figure 3. Current and voltage conventions
Table 3. Pin connection
Connection / pin Status N.C. Output Input
Floating X X X X
To ground X Through 10 kΩ resistor
VNQ860-E, VNQ860SP-E Electrical characteristics
5/19
3 Electrical characteristics
(8 V < VCC < 36 V; -40 °C < TJ < 150 °C; unless otherwise specified)
Table 4. Power section
Symbol Parameter Test conditions Min Typ Max Unit
VCC
Operating supply
voltage 5.5 36 V
VUSD
Undervoltage shut-
down 345.5V
VOV Overvoltage shut-down 36 42 48 V
RON
On state resistance
(per channel)
IOUT = 0.25 A; TJ = 25 °C;
IOUT = 0.25 A;
270
540 mΩ
ISSupply current
OFF state; VCC = 24 V;
TC = 25 °C
ON state ( all channels ON )
70
5
120
10
µΑ
mA
ILGND Output current
VCC - VSTAT = VIN =
VGND = 24 V;
VOUT = 0 V
1mA
IL(OFF) OFF state output
current VIN = VOUT = 0 V 0 10 µΑ
IOUTleak
OFF state output
leakage current
VIN = VGND = 0 V;
VCC = VOUT = 24 V; TA = 25 °C 240 µΑ
IOUTleak
OFF state output
leakage current
VIN = VGND = 0 V; VCC = 24 V;
VOUT = 10 V; TA = 25 °C 100 µΑ
Table 5. Switching ( VCC = 24 V)
Symbol Parameter Test conditions Min Typ Max Unit
t(ON)
Turn-on delay time of
Output current
RL = 96 from VIN rising edge to
VOUT = 2.4 V 10 µs
t(OFF)
Turn-off delay time of
Output current
RL = 96 from VIN rising edge to
VOUT = 21.6 V 40 µs
(dVOUT/dt)on Turn-on voltage slope RL = 96 from VOUT = 2.4 V to
19.2 V 0.75 V/µs
(dVOUT/dt)off Turn-off voltage slope RL = 96 from VOUT = 21.6 V to
2.4 V 0.25 V/µs
Electrical characteristics VNQ860-E, VNQ860SP-E
6/19
Table 6. Protections (per channel)
Symbol Parameter Test conditions Min Typ Max Unit
Ilim Current limitation 0.35 0.7 1.1 A
T(hyst) Thermal hysteresis 7 15 °C
TTSD
Thermal shut-down
temperature 150 175 200 °C
TRReset temperature 135 °C
Vdemag
Turn-off output clamp
voltage IOUT = 0.25 A, VCC = 24 V VCC-
59
VCC-
52
VCC-
47 V
Table 7. Logical input (per channel)
Symbol Parameter Test conditions Min Typ Max Unit
VIL Low level input voltage 1.25 V
IIL Low level input current VIN = 1.25 V 1 µΑ
VIH
High level input
voltage 3.25 V
IIH
High level input
current VIN = 3.25 V 10 µΑ
VI(HYST)
Input hysteresis
voltage 0.5 V
IIN Input current VIN = VCC = 36 V 200 µΑ
VOL I/O output votage IIN = 5 mA ( Fault condition ) 1 V
Table 8. Status pin
Symbol Parameter Test conditions Min Typ Max Unit
VSTAT
Status low output
voltage ISTAT = 5 mA ( Fault condition ) 1 V
ILSTAT
Status leakage
current
Normal operation;
VSTAT = VCC = 36 V
10 µΑ
CSTAT
Status pin input
capacitance
Normal operation;
VSTAT = 5 V 100 pF
Table 9. VCC - output diode
Symbol Parameter Test conditions Min Typ Max Unit
VFForwardon voltage -IOUT = 0.3 A; TJ = 150 °C 1 V
VNQ860-E, VNQ860SP-E Truth table and switching characteristics
7/19
4 Truth table and switching characteristics
Figure 4. Switching characteristics
Table 10. Truth table
Conditions MCOUTn I/On OUTPUTn STATUS
Normal operation L
H
L
H
L
H
H
H
Current limitation L
H
L
H
L
X
H
H
Overtemperature L
H
L
Driven low
L
L
X
X
Undervoltage L
H
L
H
L
L
X
X
Overvoltage L
H
L
H
L
L
H
H
Typical application schematic VNQ860-E, VNQ860SP-E
8/19
5 Typical application schematic
Figure 5. Typical application schematic
VNQ860-E, VNQ860SP-E Waveforms
9/19
6 Waveforms
Figure 6. Waveforms
PowerSO-10™ thermal data VNQ860-E, VNQ860SP-E
10/19
7 PowerSO-10™ thermal data
Figure 7. PowerSO-10™ PC board
Figure 8. RthJA vs PBC copper area in open box free air condition
VNQ860-E, VNQ860SP-E Reverse polarity protection
11/19
8 Reverse polarity protection
A schematic solution to protect the IC against a reverse polarity condition is proposed.
This schematic is effective with any type of load connected to the outputs of the IC.
The RGND resistor value can be selected according to the following conditions to be met:
1. RGND ≤ 600 mV / (IS in ON state max).
2. RGND ≥ (-VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
The power dissipation associated to RGNG during reverse polarity condition is:
PD = (-VCC)2/RGND
This resistor can be shared by several different ICs. In such case IS value on formula (1) is
the sum of the maximum ON-state currents of the different devices.
Please note that if the microprocessor ground and the device ground are separated then the
voltage drop across the RGND (given by IS in ON state max * RGND) produce a difference
between the generated input level and the IC input signal level. This voltage drop will vary
depending on how many devices are ON in the case of several high side switches sharing
the same RGND.
Figure 9. Reverse polarity protection
Statusi
Inputi
GND
Outputi
+ Vcc
RGND
(Optional)
Load
Statusi
Inputi
GND
Outputi
+ Vcc
RGND
(Optional)
Load
Package mechanical data VNQ860-E, VNQ860SP-E
12/19
9 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 11. PowerSO-10™ mechanical data
Dim.
mm inch
Min Typ Max Min Typ Max
A 3.35 3.65 0.132 0.144
A1 0.00 0.10 0.000 0.004
B 0.40 0.60 0.016 0.024
c 0.35 0.55 0.013 0.022
D 9.40 9.60 0.370 0.378
D1 7.40 7.60 0.291 0.300
E 9.30 9.50 0.366 0.374
E1 7.20 7.40 0.283 0.291
E2 7.20 7.60 0.283 0.300
E3 6.10 6.35 0.240 0.250
E4 5.90 6.10 0.232 0.240
e 1.27 0.050
F 1.25 1.35 0.049 0.053
H 13.80 14.40 0.543 0.567
h 0.50 0.002
L 1.20 1.80 0.047 0.071
q 1.70 0.067
a 0° 8°
VNQ860-E, VNQ860SP-E Package mechanical data
13/19
Figure 10. PowerSO-10™ package dimensions
Figure 11. PowerSO-10™ suggested pad and tube shipment (no suffix)
Package mechanical data VNQ860-E, VNQ860SP-E
14/19
Figure 12. Tape and reel shipment (suffix “TR“)
VNQ860-E, VNQ860SP-E Package mechanical data
15/19
Figure 13. PowerSO-20 mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
e
a2 A
E
a1
PSO20MEC
DETAIL A
T
D
110
1120
E1
E2
h x 45˚
DETAIL A
lead
slug
a3
S
Gage Plane
0.35
L
DETAIL B
R
DETAIL B
(COPLANARITY)
GC
- C -
SEATING PLANE
e3
b
c
NN
H
BOTTOM VIEW
E3
D1
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A3.60.142
a1 0.1 0.3 0.004 0.012
a2 3.3 0.130
a3 0 0.1 0.000 0.004
b 0.4 0.53 0.016 0.021
c 0.23 0.32 0.009 0.013
D (1) 15.8 16 0.622 0.630
D1 (2
) 9.4 9.8 0.370 0.386
E 13.9 14.5 0.547 0.570
e 1.27 0.050
e3 11.43 0.450
E1 (1) 10.9 11.1 0.429 0.437
E2 2.9 0.114
E3 5.8 6.2 0.228 0.244
G 0 0.1 0.000 0.004
H 15.5 15.9 0.610 0.626
h 1.1 0.043
L 0.8 1.1 0.031 0.043
N 8˚(typ.)
S 8˚(max. )
T 10 0.394
(1) “D and E1” do not include mold flash or protusions.
- Mold flash or protusions shall not exceed 0.15mm (0.006”)
- Critical dimensions: “E”, “G” and “a3”.
(2)
For subcontractors, the limit is the one quoted in jedec MO-166
PowerSO-20
0056635 I
JEDEC MO-166
Weight: 1.9gr
Package mechanical data VNQ860-E, VNQ860SP-E
16/19
Figure 14. SO-20 tube shipment ( no suffix )
Figure 15. Tape and reel shipment ( suffix “13TR“)
VNQ860-E, VNQ860SP-E Order codes
17/19
10 Order codes
Table 12. Order codes
Order codes Package Packaging
VNQ860 SO-20 Tu b e
VNQ860SP PowerSO-10™
VNQ86013TR-E SO-20 Tape and reel
VNQ860SP13TR-E PowerSO-10™
VNQ860-E, VNQ860SP-E
19/19
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2008 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
