LM45
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SNIS117C –AUGUST 1999–REVISED FEBRUARY 2013
LM45 SOT-23 Precision Centigrade Temperature Sensors
Check for Samples: LM45
1FEATURES DESCRIPTION
The LM45 series are precision integrated-circuit
2• Calibrated Directly in ° Celsius (Centigrade) temperature sensors, whose output voltage is linearly
• Linear + 10.0 mV/°C Scale Factor proportional to the Celsius (Centigrade) temperature.
• ±3°C Accuracy Guaranteed The LM45 does not require any external calibration or
trimming to provide accuracies of ±2°C at room
• Rated for Full −20° to +100°C Range temperature and ±3°C over a full −20 to +100°C
• Suitable for Remote Applications temperature range. Low cost is assured by trimming
• Low Cost Due to Wafer-Llevel Trimming and calibration at the wafer level. The LM45's low
output impedance, linear output, and precise inherent
• Operates from 4.0V to 10V calibration make interfacing to readout or control
• Less than 120 μA Current Drain circuitry especially easy. It can be used with a single
• Low Self-Heating, 0.20°C in Still Air power supply, or with plus and minus supplies. As it
draws only 120 μA from its supply, it has very low
• Nonlinearity Only ±0.8°C Max Over Temp self-heating, less than 0.2°C in still air. The LM45 is
• Low Impedance Output, 20Ωfor 1 mA Load rated to operate over a −20° to +100°C temperature
range.
APPLICATIONS
• Battery Management Connection Diagram
• FAX Machines
• Printers
• Portable Medical Instruments
• HVAC
• Power Supply Modules Figure 1. SOT-23
• Disk Drives Top View
• Computers Package Number DBZ0003A
• Automotive
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM45
SNIS117C –AUGUST 1999–REVISED FEBRUARY 2013
www.ti.com
Typical Applications
Figure 2. Basic Centigrade Temperature Sensor (+2.5°C to +100°C)
Choose R1=−VS/50 μA
VOUT = (10 mV/°C × Temp °C)
VOUT = +1,000 mV at +100°C
= +250 mV at +25°C
=−200 mV at −20°C
Figure 3. Full-Range Centigrade Temperature Sensor (−20°C to +100°C)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
Supply Voltage +12V to −0.2V
Output Voltage +V S+ 0.6V to −1.0V
Output Current 10 mA
Storage Temperature −65°C to +150°C
ESD Susceptibility(2) Human Body Model 2000V
Machine Model 250V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
(2) Human body model, 100 pF discharged through a 1.5 kΩresistor. Machine model, 200 pF discharged directly into each pin.
Operating Ratings(1)(2)(3)
Specified Temperature Range(4) TMIN to TMAX
LM45B, LM45C −20°C to +100°C
Operating Temperature Range
LM45B, LM45C −40°C to +125°C
Supply Voltage Range (+VS) +4.0V to +10V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
(2) Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.
(3) Reflow temperature profiles are different for lead-free and non-lead-free packages.
(4) Thermal resistance of the SOT-23 package is 260°C/W, junction to ambient when attached to a printed circuit board with 2 oz. foil as
shown in Figure 15.
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Electrical Characteristics
Unless otherwise noted, these specifications apply for +VS= +5Vdc and ILOAD = +50 μA, in the circuit of Figure 3. These
specifications also apply from +2.5°C to TMAX in the circuit of Figure 2 for +VS= +5Vdc. Boldface limits apply for TA= T J=
TMIN to TMAX ; all other limits TA= TJ= +25°C, unless otherwise noted.
Parameter Conditions LM45B LM45C Units
(Limit)
Typical Limit(1) Typical Limit(1)
Accuracy(2) TA=+25°C ±2.0 ±3.0
TA=TMAX ±3.0 ±4.0 °C (max)
TA=TMIN ±3.0 ±4.0
Nonlinearity(3) TMIN≤TA≤TMAX ±0.8 ±0.8 °C (max)
Sensor Gain (Average Slope) T MIN≤TA≤TMAX +9.7 +9.7 mV/°C (min)
+10.3 +10.3 mV/°C (max)
Load Regulation(4) 0≤IL≤+1 mA ±35 ±35 mV/mA (max)
Line Regulation(4) +4.0V≤+V S≤+10V ±0.80 ±0.80 mV/V (max)
±1.2 ±1.2
Quiescent Current(5) +4.0V≤+V S≤+10V, +25°C 120 120 μA (max)
+4.0V≤+V S≤+10V 160 160
Change of Quiescent Current(5) 4.0V≤+V S≤10V 2.0 2.0 μA (max)
Temperature Coefficient of +2.0 +2.0 μA/°C
Quiescent Current
Minimum Temperature for Rated In circuit of Figure 2, IL=0 +2.5 +2.5 °C (min)
Accuracy
Long Term Stability(6) TJ=TMAX, for 1000 hours ±0.12 ±0.12 °C
(1) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
(2) Accuracy is defined as the error between the output voltage and 10 mv/°C times the device's case temperature, at specified conditions
of voltage, current, and temperature (expressed in °C).
(3) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's
rated temperature range.
(4) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
(5) Quiescent current is measured using the circuit of Figure 2.
(6) For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature
cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered;
allow time for stress relaxation to occur.
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Typical Performance Characteristics
To generate these curves the LM45 was mounted to a printed circuit board as shown in Figure 15.
Thermal Resistance
Junction to Air Thermal Time Constant
Figure 4. Figure 5.
Thermal Response
Thermal Response in Still Air in Stirred Oil Bath
with Heat Sink (Figure 15) with Heat Sink
Figure 6. Figure 7.
Quiescent Current
Start-Up Voltage vs Temperature
vs Temperature (In Circuit of Figure 2)
Figure 8. Figure 9.
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Typical Performance Characteristics (continued)
To generate these curves the LM45 was mounted to a printed circuit board as shown in Figure 15.
Accuracy
Quiescent Current vs
vs Temperature Temperature
(In Circuit of Figure 3) (Guaranteed)
Figure 10. Figure 11.
Supply Voltage
Noise Voltage vs Supply Current
Figure 12. Figure 13.
Start-Up Response
Figure 14.
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PRINTED CIRCUIT BOARD
Printed Circuit Board Used for Heat Sink to Generate All Curves.
Figure 15. ½″Square Printed Circuit Board with 2 oz. Foil or Similar
APPLICATIONS
The LM45 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued
or cemented to a surface and its temperature will be within about 0.2°C of the surface temperature.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature of the LM45 die
would be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the LM45 die is directly attached to the GND pin. The lands
and traces to the LM45 will, of course, be part of the printed circuit board, which is the object whose temperature
is being measured. These printed circuit board lands and traces will not cause the LM45s temperature to deviate
from the desired temperature.
Alternatively, the LM45 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LM45 and accompanying wiring and circuits must be
kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy
paints or dips are often used to insure that moisture cannot corrode the LM45 or its connections.
Temperature Rise of LM45 Due to Self-Heating (Thermal Resistance)
SOT-23 SOT-23
no heat sink* small heat fin**
Still air 450°C/W 260°C/W
Moving air 180°C/W
Typical Applications
CAPACITIVE LOADS
Like most micropower circuits, the LM45 has a limited ability to drive heavy capacitive loads. The LM45 by itself
is able to drive 500 pF without special precautions. If heavier loads are anticipated, it is easy to isolate or
decouple the load with a resistor; see Figure 16. Or you can improve the tolerance of capacitance with a series
R-C damper from output to ground; see Figure 17.
Any linear circuit connected to wires in a hostile environment can have its performance affected adversely by
intense electromagnetic sources such as relays, radio transmitters, motors with arcing brushes, SCR transients,
etc, as its wiring can act as a receiving antenna and its internal junctions can act as rectifiers. For best results in
such cases, a bypass capacitor from VIN to ground and a series R-C damper such as 75Ωin series with 0.2 or 1
μF from output to ground, as shown in Figure 17, are often useful.
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SNIS117C –AUGUST 1999–REVISED FEBRUARY 2013
Figure 16. LM45 with Decoupling from Capacitive Load
Figure 17. LM45 with R-C Damper
Figure 18. Temperature Sensor, Single Supply, −20°C to +100°C
Figure 19. 4-to-20 mA Current Source (0°C to +100°C)
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Figure 20. Fahrenheit Thermometer
Figure 21. Centigrade Thermometer (Analog Meter)
Figure 22. Expanded Scale Thermometer (50° to 80° Fahrenheit, for Example Shown)
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Figure 23. Temperature To Digital Converter (Serial Output) (+128°C Full Scale)
Figure 24. Temperature To Digital Converter (Parallel Outputs for Standard Data Bus to μP Interface)
(128°C Full Scale)
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SNIS117C –AUGUST 1999–REVISED FEBRUARY 2013
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* =1% or 2% film resistor
-Trim RBfor VB=3.075V
-Trim RCfor VC=1.955V
-Trim RAfor VA=0.075V + 100mV/°C × Tambient
-Example, VA=2.275V at 22°C
Figure 25. Bar-Graph Temperature Display (Dot Mode)
Figure 26. LM45 With Voltage-To-Frequency Converter And Isolated Output
(2.5°C to +100°C; 25 Hz to 1000 Hz)
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REVISION HISTORY
Changes from Revision B (February 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 11
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PACKAGE OPTION ADDENDUM
www.ti.com 4-Aug-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM45BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -20 to 100 T4B
LM45BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 100 T4B
LM45BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 100 T4B
LM45CIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -20 to 100 T4C
LM45CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 100 T4C
LM45CIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -20 to 100 T4C
LM45CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 100 T4C
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Aug-2015
Addendum-Page 2
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM45BIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM45BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM45BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM45CIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM45CIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM45CIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM45CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2014
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM45BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM45BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM45BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM45CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM45CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM45CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM45CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2014
Pack Materials-Page 2
4203227/C
www.ti.com
PACKAGE OUTLINE
C
TYP
0.20
0.08
0.25
2.64
2.10 1.12 MAX
TYP
0.10
0.01
3X 0.5
0.3
TYP
0.6
0.2
1.9
0.95
TYP-80
A
3.04
2.80
B
1.4
1.2
(0.95)
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
0.2 C A B
1
3
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
3X (1.3)
3X (0.6)
(2.1)
2X (0.95)
(R0.05) TYP
4214838/C 04/2017
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
SCALE:15X
PKG
1
3
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
www.ti.com
EXAMPLE STENCIL DESIGN
(2.1)
2X(0.95)
3X (1.3)
3X (0.6)
(R0.05) TYP
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
SYMM
PKG
1
3
2
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