September 2009 Doc ID 10950 Rev 4 1/8
8
EMIF02-USB01F2
2-line IPAD™, EMI filter including ESD protection
Features
■2-line low-pass filter + ESD protection
■High efficiency in EMI filtering
■Lead-free package
■Very low PCB space occupation: < 2.5 mm2
■Very thin package: 0.65 mm
■High efficiency in ESD suppression
(IEC 61000-4-2 level 4)
■High reliability offered by monolithic integration
■High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■IEC 61000-4-2 level 4
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
Application
■ESD protection and EMI filtering for USB port
Description
The EMIF02-USB01F2 is a highly integrated array
designed to suppress EMI / RFI noise for USB
port filtering. The EMIF02-USB01F2 Flip-Chip
packaging means the package size is equal to the
die size.
Additionally, this filter includes ESD protection
circuitry which prevents damage to the protected
device when subjected to ESD surges up to
15 kV.
Figure 1. Pin configuration (bump side
view)
Figure 2. Schematic
TM: IPAD is a trademark of STMicroelectronics.
Flip Chip
(8 bumps)
32 1
A
Pup Vbus
DZ
GND
D+
in
D-
in
D+
out
D-
out
B
C
D
E
GND
R3
R1
R2
Vbus
DZ
1.3K
D+ out
D- out D- in
D+ in
Pup
33
33
www.st.com
Characteristics EMIF02-USB01F2
2/8 Doc ID 10950 Rev 4
1 Characteristics
Figure 3. Electrical characteristics - definitions
Table 1. Absolute ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
TjJunction temperature 125 °C
Top Operating temperature range -40 to +85 °C
Tstg Storage temperature range -55 to 150 °C
Table 2. Electrical characteristics - values (Tamb = 25 °C)
Symbol Test conditions Min. Typ. Max. Unit
VBR IR = 1 mA 6 - - V
IRM VRM = 3 V - - 0.5 µA
Cline @ 0 V - 40 45 pF
R1, R2Tolerance ± 5 % - 33 - Ω
R3Tolerance ± 5 % - 1.30 - kΩ
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
RM
I
R
I
PP
V
RM
V
BR
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
RM
I
R
I
PP
V
RM
V
BR
Symbol Parameter
V Stand-off voltage
V Breakdown voltage
I Leakage current @ V
I
C
P
Input capacitance per line
eak pulse current
RM
BR
RM RM
PP
line
EMIF02-USB01F2 Characteristics
Doc ID 10950 Rev 4 3/8
Figure 8. Capacitance versus reverse applied voltage (typical)
Figure 4. S21 (dB) attenuation measurement Figure 5. Analog crosstalk measurements
1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
-50.00
-45.00
-40.00
-35.00
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
EMIF02-USB01: filtering response of lines C1/C3 and E1/E3
dB
Frequency/Hz
0.00
C1_C3
E1_E3
1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
-100.0
-90.00
-80.00
-70.00
-60.00
-50.00
-40.00
-30.00
-20.00
-10.00
0.00
dB
f/Hz
Figure 6. ESD response to IEC 61000-4-2
(+15 kV air discharge) on one input
(Vin) and one output (Vout)
Figure 7. ESD response to IEC 61000-4-2
(-15 kV air discharge) on one input
(Vin) and on one output (Vout)
50 ns/d
Vin: 10 V/d
Vin: 5 V/d
100 ns/d
Vin: 10 V/d
Vin: 5 V/d
10
15
20
25
30
35
40
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VR(V)
C(pF)
Application information EMIF02-USB01F2
4/8 Doc ID 10950 Rev 4
2 Application information
Figure 9. Aplac model (resistors, diodes and bumps and ground connections)
Figure 10. Aplac model parameters
0.15nH
bulk
rsub_1k3
Csub Csub
bulk
R_33R
cap_33R
C3
rsub_33R
cap_33RCsub Csub
E1
0.23nH
C1 A3
R_1k3
Csub Csub
3.8nH
rsub_1k3
rsub_33R
0.3nH
bulk
R_33R
cap_33R
E3
rsub_33R
cap_33RCsub Csub
0.7nH
rsub_33R
D2 bulk
A1, A3, B2, C1, C3, E1, E3
0.15nH
Lgnd_D Rsub_D
D02_usb
D02_Nw
D02_usb
D2
Lbump
Rbump
Lhole
Rhole
caphole
bulk
Cbump Rsubump
I/O
bulk
100m
D2
R_33R 33.9
cap_33R 1.2pF
R_1k3 1.3k
Cz29pF
Rsub_D 100
Csub0.3pF
Rsub_33R 15
Rsub_1k3 50
lhole10pH
Rhole400m
Caphole0.4pF
Lgnd_D 150pH
Lbump50pH
Rbump50m
Cbump1.5pF
Rsubump150
R_33R 33.9
cap_33R 1.2pF
R_1k3 1.3k
Model D02_usb
BV=16
IBV=1m
CJO=Cz
M=0.3333
RS=2
VJ=0.6
TT=100n
Model D02_Nw
BV=100
IBV=1m
CJO=6.8p
M=0.3333
RS=2
VJ=0.6
TT=100n
EMIF02-USB01F2 Ordering information scheme
Doc ID 10950 Rev 4 5/8
3 Ordering information scheme
Figure 11. Ordering information scheme
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 12. Package dimensions
EMIF
yy - xxx zz
F
x
EMI filter
Number of lines
Information
Package
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
F = Flip Chip
X = 2: lead-free, pitch = 500 µm, bump = 315 µm
495µm ± 50
495µm ± 50
1.27mm ± 50µm
1.97mm ± 50µm
315 ± 50700 ± 50 650µm ± 65
285 µm
285µm
Ordering information EMIF02-USB01F2
6/8 Doc ID 10950 Rev 4
Figure 15. Flip Chip tape and reel specification
5 Ordering information
Table 3. Ordering information
Note: More information is available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
Figure 13. Footprint Figure 14. Marking
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 315 µm copper pad diameter
E
Dot, ST logo
xx = marking
yww = datecode
(y = year
ww = week)
z = manufacturing location
xxz
yww
Dot identifying Pin A1 location
User direction of unreeling
All dimensions in mm
4 ± 0.1
4 ± 0.1
1.75 ± 0.1 3.5 ± 0.1
Ø 1.5 ± 0.1
xxz
yww
ST
E
xxz
yww
ST
E
xxz
yww
ST
E
8 ± 0.3
0.73 ± 0.05
1.37
2.07
Order code Marking Package Weight Base qty Delivery mode
EMIF02-USB01F2 FF Flip Chip 3.35 mg 5000 Tape and reel 7”
EMIF02-USB01F2 Revision history
Doc ID 10950 Rev 4 7/8
6 Revision history
Table 4. Document revision history
Date Revision Changes
26-Oct-2004 1 Initial release.
16-Apr-2007 2 Updated ECOPACK statement. Updated Figure 11, Figure 12 and
Figure 15. Reformatted to current standards.
29-Apr-2008 3 Typographical errors corrected.
18-Sep-2009 4 Updated ESD graphic in Figure 6 and Figure 7.
EMIF02-USB01F2
8/8 Doc ID 10950 Rev 4
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