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LP2951JAN Series of Adjustable Micropower Voltage Regulators
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1FEATURES DESCRIPTION
The LP2951 is a micropower voltage regulator with
2 High Accuracy Output Voltage very low quiescent current (75μA typ.) and very low
Ensured 100mA Output Current dropout voltage (typ. 40mV at light loads and 380mV
Extremely Low Quiescent Current at 100mA). It is ideally suited for use in battery-
powered systems. Furthermore, the quiescent current
Low Dropout Voltage increases only slightly in dropout, prolonging battery
Extremely Tight Load and Line Regulation life.
Very Low Temperature Coefficient An additional feature is an error flag output which
Use as Regulator or Reference warns of a low output voltage, often due to falling
Needs Minimum Capacitance for Stability batteries on the input. It may be used for a power-on
reset. A second feature is the logic-compatible
Current and Thermal Limiting shutdown input which enables the regulator to be
Stable with Low-ESR Output Capacitors (10mswitched on and off. Also, the part may be pin-
to 6)strapped for a 5V, 3V, or 3.3V output (depending on
Error Flag Warns of Output Dropout the version), or programmed from 1.24V to 29V with
an external pair of resistors.
Logic-Controlled Electronic Shutdown
Output Programmable from 1.24 to 29V Careful design of the LP2951 has minimized all
contributions to the error budget. This includes a tight
initial tolerance (0.5% typ.), extremely good load and
line regulation (0.05% typ.) and a very low output
voltage temperature coefficient, making the part
useful as a low-power voltage reference.
Connection Diagram
Top View
Figure 1. CDIP Package
See Package Number NAB0008A
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2010–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Block Diagram
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Schematic Diagram
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
Input Supply Voltage 0.3 to +30V
Shutdown Input Voltage(2) 0.3 to +30V
Error Comparator Output Voltage(2) 0.3 to +30V
Feedback Input Voltage(2)(3) 1.5 to +30V
Power Dissipation(4) CDIP 1.0 W at 25°C
Junction Temperature (TJ) +160°C
Ambient Storage Temperature Range 65°C TA+150°C
Ambient Operating Temperature Range 55°C TA+125°C
Lead Temperature (Soldering 10 Seconds) 260°C
CDIP (Still Air at 0.5W) 131°C/W
θJA
Thermal Resistance CDIP (500LF/Min Air flow at 0.5W) 75°C/W
θJC CDIP 21°C/W
ESD Rating(5) 500V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) May exceed input supply voltage.
(3) When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be
diode-clamped to ground.
(4) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
(5) Human body model, 1.5 kΩin series with 100 pF.
Table 1. Quality Conformance Inspection Mil-Std-883, Method 5005 - Group A
SUBGROUP DESCRIPTION TEMP (°C)
1 Static tests at +25
2 Static tests at +125
3 Static tests at –55
4 Dynamic tests at +25
5 Dynamic tests at +125
6 Dynamic tests at –55
7 Functional tests at +25
8A Functional tests at +125
8B Functional tests at –55
9 Switching tests at +25
10 Switching tests at +125
11 Switching tests at –55
12 Settling time at +25
13 Settling time at +125
14 Settling time at –55
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JL2951 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified. VIN = 6V, IL=100µA, CL= 3.3µF, VO= 5V (Nominal), VSD = 0.6V
PARAMETER TEST CONDITIONS NOTES MIN MAX UNIT SUBGROUPS
4.975 5.025 V 1
VOOutput Voltage 4.94 5.06 V 2, 3
–5.0 5.0 mV 1
6V VIN 30V,
VO Line Line Regulation IL= –1mA –25 25 mV 2, 3
–5.0 5.0 mV 1
VO Load Load Regulation –100µA IL–100mA –25 25 mV 2, 3
450 mV 1
IL= –100mA 600 mV 2, 3
VDDropout Voltage 80 mV 1
150 mV 2, 3
12 mA 1
IL= –100mA, 14 mA 2, 3
120 µA 1
140 µA 2, 3
IGGround Current 120 µA 1
VO= 15V, VIN = 30V 140 µA 2, 3
15 mA 1
VIN = 30V, VO= 15V 20 mA 2, 3
–30 30 µA 1
IG Diff Ground Current Change 6V VIN 30V –50 50 µA 2, 3
170 µA 1
IGDO Dropout Ground Current VIN = 4.5V 200 µA 2, 3
Error Comparator Lower
VTh L 0.0 0.8 mV 1, 2, 3
Threshold Voltage
Error Comparator Upper
VTh U 2.0 30 mV 1, 2, 3
Threshold Voltage VIN = 30V, IL= –50mA,
θRThermal Regulation –12.5 12.5 mV 1
2ms T10ms 200 mA 1
ISC Current Limit VO= 0V 220 mA 2, 3
20 mA 1
Ground Current At Current
IGSC VO= 0V
Limit 25 mA 2, 3
1.22 1.25 V 1
VRef Reference Voltage 1.20 1.26 V 2, 3
–1.9 1.9 mV 1
Reference Voltage Line
VR Line 2.3V VIN 30V
Regulation –10 10 mV 2, 3
–1.2 1.2 mV 1
Reference Voltage Output 1.2V VO29V,
VR Load Regulation VIN = 30V –5.0 5.0 mV 2, 3
40 nA 1
Feedback Pin Bias
IFB Current 60 nA 2, 3
1.0 µA 1
Error Comparator Output
IOH VO= 30V
Leakage Current 2.0 µA 2, 3
250 mV 1
Error Comparator Output
VOL VIN = 4.5V, VSD = 2V
Low Voltage 400 mV 2, 3
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JL2951 Electrical Characteristics DC Parameters (continued)
The following conditions apply, unless otherwise specified. VIN = 6V, IL=100µA, CL= 3.3µF, VO= 5V (Nominal), VSD = 0.6V
PARAMETER TEST CONDITIONS NOTES MIN MAX UNIT SUBGROUPS
50 µA 1
VSD = 2.4V 100 µA 2, 3
Shutdown Pin Input
ISD Current 600 µA 1
VSD = 30V 750 µA 2, 3
VSDL Shutdown Input Logic Low See(1) 0.6 V 1, 2, 3
Voltage
VSDH Shutdown Input Logic High See(1) 2.0 V 1, 2, 3
Voltage –10 10 µA 1
Regular Output Bias VSD = 2V, VIN = 30V,
ILKG Current In Shutdown IL= 0mA –20 20 µA 2, 3
(1) Parameter tested go-no-go only.
JL2951 Electrical Characteristics AC Parameters
The following conditions apply, unless otherwise specified. VIN = 6V, CL= 3.3µF, VSD = 0.6V
PARAMETER TEST CONDITIONS NOTES MIN MAX UNIT SUBGROUP
RR Ripple Rejection ƒ = 120Hz, VIN = 0.1VRMS 50 dB 4
CL= 1µF 600 µVRMS 7
VNoise Output Noise CL= 3.3µF 250 µVRMS 7
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Typical Performance Characteristics
Quiescent Current Dropout Characteristics
Figure 2. Figure 3.
Input Current Input Current
Figure 4. Figure 5.
Output Voltage vs.
Temperature of 3
Representative Units Quiescent Current
Figure 6. Figure 7.
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Typical Performance Characteristics (continued)
Quiescent Current Quiescent Current
Figure 8. Figure 9.
Quiescent Current Short Circuit Current
Figure 10. Figure 11.
Dropout Voltage Dropout Voltage
Figure 12. Figure 13.
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Typical Performance Characteristics (continued)
Minimum Operating Voltage Feedback Bias Current
Figure 14. Figure 15.
Feedback Pin Current Error Comparator Output
Figure 16. Figure 17.
Comparator Sink Current Line Transient Response
Figure 18. Figure 19.
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Typical Performance Characteristics (continued)
Load Transient Response Load Transient Response
Figure 20. Figure 21.
Enable Transient Output Impedance
Figure 22. Figure 23.
Ripple Rejection Ripple Rejection
Figure 24. Figure 25.
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Typical Performance Characteristics (continued)
Ripple Rejection Output Noise
Figure 26. Figure 27.
Divider Resistance Shutdown Threshold Voltage
Figure 28. Figure 29.
Line Regulation Maximum Rated Output Current
Figure 30. Figure 31.
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Typical Performance Characteristics (continued)
Thermal Response Output Capacitor ESR Range
Figure 32. Figure 33.
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APPLICATION HINTS
External Capacitors
A 1.0μF (or greater) capacitor is required between the output and ground for stability at output voltages of 5V or
more. At lower output voltages, more capacitance is required (2.2μF or more is recommended for 3V and 3.3V
versions). Without this capacitor the part will oscillate. Most types of tantalum or aluminum electrolytics work fine
here; even film types work but are not recommended for reasons of cost. Many aluminum electrolytics have
electrolytes that freeze at about 30°C, so solid tantalums are recommended for operation below 25°C. The
important parameters of the capacitor are an ESR of about 5Ωor less and a resonant frequency above 500kHz.
The value of this capacitor may be increased without limit.
Ceramic capacitors whose value is greater than 1000pF should not be connected directly from the LP2951
output to ground. Ceramic capacitors typically have ESR values in the range of 5 to 10m, a value below the
lower limit for stable operation (see Figure 33).
The reason for the lower ESR limit is that the loop compensation of the part relies on the ESR of the output
capacitor to provide the zero that gives added phase lead. The ESR of ceramic capacitors is so low that this
phase lead does not occur, significantly reducing phase margin. A ceramic output capacitor can be used if a
series resistance is added (recommended value of resistance is about 0.1to 2).
At lower values of output current, less output capacitance is required for stability. The capacitor can be reduced
to 0.33μF for currents below 10mA or 0.1μF for currents below 1mA. Using the adjustable versions at voltages
below 5V runs the error amplifier at lower gains so that more output capacitance is needed. For the worst-case
situation of a 100mA load at 1.23V output (Output shorted to Feedback) a 3.3μF (or greater) capacitor should be
used.
When setting the output voltage of the LP2951 with external resistors, a minimum load of 1μA is recommended.
A 1μF tantalum, ceramic or aluminum electrolytic capacitor should be placed from the LP2951 input to ground if
there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the
input.
Stray capacitance to the LP2951 Feedback terminal can cause instability. This may especially be a problem
when using high value external resistors to set the output voltage. Adding a 100pF capacitor between Output and
Feedback and increasing the output capacitor to at least 3.3μF will fix this problem.
Error Detection Comparator Output
The comparator produces a logic low output whenever the LP2951 output falls out of regulation by more than
approximately 5%. This figure is the comparator's built-in offset of about 60mV divided by the 1.235 reference
voltage. (Refer to the Block Diagram) This trip level remains 5% below normal regardless of the programmed
output voltage of the 2951. For example, the error flag trip level is typically 4.75V for a 5V output or 11.4V for a
12V output. The out of regulation condition may be due either to low input voltage, current limiting, or thermal
limiting.
Figure 34 below gives a timing diagram depicting the ERROR signal and the regulated output voltage as the
LP2951 input is ramped up and down. For 5V versions, the ERROR signal becomes valid (low) at about 1.3V
input. It goes high at about 5V input (the input voltage at which VOUT = 4.75V). Because the LP2951's dropout
voltage is load-dependent (see Figure 12), the input voltage trip point (about 5V) will vary with the load current.
The output voltage trip point (approx. 4.75V) does not vary with load.
The error comparator has an open-collector output which requires an external pullup resistor. This resistor may
be returned to the output or some other supply voltage depending on system requirements. In determining a
value for this resistor, note that while the output is rated to sink 400μA, this sink current adds to battery drain in a
low battery condition. Suggested values range from 100kΩto 1 MΩ. The resistor is not required if this output is
unused.
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*When VIN 1.3V, the error flag pin becomes a high impedance, and the error flag voltage rises to its pull-up voltage.
Using VOUT as the pull-up voltage (see Figure 35), rather than an external 5V source, will keep the error flag voltage
under 1.2V (typ.) in this condition. The user may wish to divide down the error flag voltage using equal-value resistors
(10ksuggested), to ensure a low-level logic signal during any fault condition, while still allowing a valid high logic
level during normal operation.
Figure 34. ERROR Output Timing
Programming The Output Voltage (LP2951)
The LP2951 may be pin-strapped for the nominal fixed output voltage using its internal voltage divider by tying
the output and sense pins together, and also tying the feedback and VTAP pins together. Alternatively, it may be
programmed for any output voltage between its 1.235V reference and its 30V maximum rating. As seen in
Figure 35, an external pair of resistors is required.
The complete equation for the output voltage is
(1)
where VREF is the nominal 1.235 reference voltage and IFB is the feedback pin bias current, nominally 20nA.
The minimum recommended load current of 1μA forces an upper limit of 1.2 MΩon the value of R2, if the
regulator must work with no load (a condition often found in CMOS in standby). IFB will produce a 2% typical
error in VOUT which may be eliminated at room temperature by trimming R1. For better accuracy, choosing R2=
100kΩreduces this error to 0.17% while increasing the resistor program current to 12μA. Since the LP2951
typically draws 60μA at no load with Pin 2 open-circuited, this is a small price to pay.
*See Application Hints
**Drive with TTL-high to shut down. Ground or leave open if shutdown feature is not to be used.
Note: Pins 2 and 6 are left open.
Figure 35. Adjustable Regulator
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Reducing Output Noise
In reference applications it may be advantageous to reduce the AC noise present at the output. One method is to
reduce the regulator bandwidth by increasing the size of the output capacitor.
Noise can be reduced fourfold by a bypass capacitor across R1, since it reduces the high frequency gain from 4
to unity. Pick
(2)
or about 0.01μF. When doing this, the output capacitor must be increased to 3.3μF to maintain stability. These
changes reduce the output noise from 430μV to 100μV rms for a 100kHz bandwidth at 5V output. With the
bypass capacitor added, noise no longer scales with output voltage so that improvements are more dramatic at
higher output voltages.
Typical Applications
Figure 36. 1A Regulator with 1.2V Dropout
Figure 37. 300mA Regulator with 0.75V Dropout
*Minimum input-output voltage ranges from 40mV to 400mV, depending on load current. Current limit is typically
160mA.
Figure 38. Wide Input Voltage Range Current Limiter
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Figure 39. Low Drift Current Source
Early warning flag on low input voltage
Main output latches off at lower input voltages
Battery backup on auxiliary output
Operation: Reg. #1's Vout is programmed one diode drop above 5V. Its error flag becomes active when Vin 5.7V.
When Vin drops below 5.3V, the error flag of Reg. #2 becomes active and via Q1 latches the main output off. When
Vin again exceeds 5.7V Reg. #1 is back in regulation and the early warning signal rises, unlatching Reg. #2 via D3.
Figure 40. Regulator with Early Warning and Auxiliary Output
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Figure 41. Latch Off When Error Flag Occurs
For 5Vout, use internal resistors. Wire pin 6 to 7, & wire pin 2 to +Vout Bus.
Figure 42. 2 Ampere Low Dropout Regulator
*High input lowers Vout to 2.5V
Figure 43. 5V Regulator with 2.5V Sleep Function
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Figure 44. Open Circuit Detector for 4 to 20mA Current Loop
*Optional Latch off when drop out occurs. Adjust R3 for C2 Switching when Vin is 6.0V.
**Outputs go low when Vin drops below designated thresholds.
Figure 45. Regulator with State-of-Charge Indicator
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For values shown, Regulator shuts down when Vin < 5.5V and turns on again at 6.0V. Current drain in disconnected
mode is 150μA.
*Sets disconnect Voltage
**Sets disconnect Hysteresis
Figure 46. Low Battery Disconnect
LM34 for 125°F Shutdown
LM35 for 125°C Shutdown
Figure 47. System Overtemperature Protection Circuit
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REVISION HISTORY
Released Revision Section Changes
1 MDS data sheet converted into one Corp. data
11/30/2010 A New Release, Corporate format sheet format. MJLP2951-X Rev 1B1 will be archived.
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REVISION HISTORY
Changes from Original (April 2013) to Revision A Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 15
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-3870501BPA ACTIVE CDIP NAB 8 40 TBD Call TI Call TI -55 to 125 JL2951BPA
5962-38705
01BPA Q ACO
01BPA Q >T
JL2951BPA ACTIVE CDIP NAB 8 40 TBD Call TI Call TI -55 to 125 JL2951BPA
5962-38705
01BPA Q ACO
01BPA Q >T
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
NAB0008A
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J08A (Rev M)
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non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
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Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
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